KR20140070582A - Pattern drawing device and pattern drawing method - Google Patents

Abstract

In a patterning technique for forming a patterning pattern on a substrate by irradiating light from a head, it is possible to form a patterning pattern with less deformation due to the head side.
A first control part for forming a test pattern on the dummy substrate by emitting light toward the head toward the dummy substrate supported by the substrate supporting part; A deformation information acquiring unit that acquires deformation information indicating deformation of a test pattern formed on the dummy substrate; a data correcting unit that corrects the drawing data representing the drawing pattern based on the pattern deformation information to generate correction drawing data; And a second control unit for forming the imaging pattern on the substrate supported by the substrate supporting unit by injecting light onto the head based on the correction drawing data.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pattern drawing apparatus,

The present invention relates to a patterning technique for forming a pattern on a substrate by light emitted from a head.

In the pattern writing apparatus disclosed in Patent Document 1, an exposure apparatus is disposed in opposition to a stage for supporting a substrate, and a drawing pattern is formed on the substrate by light emitted by the exposure apparatus in accordance with the drawing data. In addition, in order to form a drawing pattern with little deformation without deformation of the substrate, control using an alignment mark is executed. In this control, the positions of the plurality of alignment marks mounted on the substrate are detected before formation of the imaging pattern, and a deformation index indicating deformation of the substrate is obtained. By emitting light to the exposure apparatus on the basis of the drawing data corrected based on the deformation index, a drawing pattern with less deformation can be formed without deformation of the substrate.

Japanese Patent Application Laid-Open No. 2010-204421

However, the deformation of the imaging pattern formed on the substrate can also be caused by a cause other than deformation of the substrate. That is, the formation of the imaging pattern on the substrate is carried out by irradiating the head with light. For this reason, for example, if the light is tilted and ejected from the head, or if the head itself is inclined, light is not appropriately irradiated to the substrate, and the imaging pattern formed on the substrate is deformed. The deformation of the imaging pattern caused by the head side can not be detected even if the position of the alignment mark of the substrate is detected. Therefore, with the control by the alignment mark, the deformation of the drawing pattern due to the head side can not be appropriately corrected.

 SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and has as its object to provide a pattern writing apparatus and a pattern writing method for forming a writing pattern on a substrate by irradiating light from a head, .

In order to achieve the above object, a pattern writing apparatus according to the present invention includes a substrate support, a head for emitting light, a head supporter for supporting the head and opposing the substrate supporter, A deformation information acquiring section that acquires deformation information indicating a deformation of a test pattern formed on the dummy substrate; a deformation information acquiring section that acquires deformation data representing the drawing pattern from pattern deformation information And a second control section for forming the imaging pattern on the substrate supported by the substrate supporting section by emitting light to the head based on the correction drawing data.

In order to achieve the above object, a patterning method according to the present invention includes the steps of forming a test pattern on a dummy substrate supported on a substrate support by injecting light onto a head supported by the head support member so as to face the substrate support, A step of acquiring pattern deformation information indicating a deformation of a test pattern formed on a substrate; a step of generating correction drawing data by correcting the drawing data representing the drawing pattern on the basis of the pattern deformation information; And a step of forming the imaging pattern on the substrate supported by the substrate support by injecting light.

In the thus constituted invention (patterning apparatus and patterning method), light is emitted from a head to form a test pattern on a dummy substrate, and pattern deformation information indicating deformation of the test pattern is acquired. When forming the imaging pattern on the substrate, this pattern deformation information is utilized. More specifically, the imaging data representing the imaging pattern is corrected based on the pattern deformation information to generate the correction imaging data, and the head irradiates the light based on the correction imaging data to form the imaging pattern on the substrate.

In the present invention, since the test pattern is actually formed by emitting light from the head, the pattern deformation information indicating the deformation of the test pattern reflects the deformation caused by the head side. Therefore, the correction drawing data obtained by correcting the drawing data based on the pattern deformation information helps to correct the deformation caused by the head side. Therefore, by emitting light from the head on the basis of the correction drawing data and forming the imaging pattern on the substrate, it is possible to form the imaging pattern with less deformation resulting from the head side.

The deformation information obtaining unit may configure the pattern drawing apparatus to obtain the pattern deformation information from the position of the component of the test pattern. That is, the deformation of the test pattern can be appropriately grasped from the position of the component of the test pattern, and the pattern deformation information with high accuracy can be acquired. As a result, it is possible to form the imaging pattern in which the deformation caused by the head side is effectively suppressed.

At this time, the first control unit may form a test pattern by arranging a plurality of dots, and the deformation information obtaining unit may configure the pattern drawing apparatus to recognize the dots as constituent elements and acquire the pattern deformation information. That is, by forming the test pattern by the dot which is relatively easy to recognize, it is possible to accurately grasp the position of the dot, which is a component, and acquire the pattern deformation information with higher precision. As a result, it is possible to form the imaging pattern in which the deformation caused by the head side is suppressed more effectively.

The first control unit may constitute a patterning device so as to form a test pattern by arranging a plurality of dots in a lattice point shape. That is, by configuring a test pattern from a plurality of dots arranged in a lattice point shape, it is possible to grasp the distortion of each part of the entire test pattern without smudges. As a result, it is possible to acquire pattern deformation information advantageous in suppressing deformation due to the head side.

The first control unit forms a test pattern by emitting light to the head based on the test data representing the test pattern. The deformation information obtaining unit obtains the deformation information from the test pattern formed on the dummy substrate, The patterning device may be configured to obtain the patterning device. As described above, by comparing the test data representing the test pattern with the actually formed test pattern, the deformation of the test pattern can be accurately grasped, and the pattern deformation information with high accuracy can be obtained. As a result, it is possible to form the imaging pattern in which the deformation caused by the head side is effectively suppressed.

The lithographic apparatus may further include an alignment information acquisition unit that acquires alignment information indicating a position of an alignment mark of the substrate supported by the substrate support unit, and the data correction unit corrects the imaging data based on the pattern deformation information and the alignment information, The patterning device may be configured to generate the patterning device. Thus, by correcting the drawing data on the basis of the alignment information indicating the position of the alignment mark on the substrate as well as the pattern deformation information, it is possible to correct the drawing data in which both the deformation caused by the head side and the deformation due to deformation of the substrate are effectively suppressed Can be formed.

At this time, the deformation information acquiring section acquires pattern deformation information by capturing a test pattern, and the alignment information acquiring section acquires the alignment information by acquiring the alignment mark, and the deformation information acquiring section and the alignment information acquiring section acquire the deformation information by using a common camera The patterning device may be configured to perform imaging. In this manner, by sharing the camera in the imaging of the test pattern and the imaging of the alignment mark, it is not necessary to install a camera for each, and the device configuration can be simplified.

According to the present invention, in the pattern writing apparatus and the pattern writing method for forming a writing pattern on a substrate by irradiating light from a head, it is possible to form a writing pattern with less distortion caused by the head side.

1 is a side view schematically showing an example of a pattern writing apparatus to which the present invention is applicable.
Fig. 2 is a partial plan view schematically showing the patterning device of Fig. 1. Fig.
3 is a perspective view schematically showing a schematic configuration of an optical head.
4 is a side view schematically showing a schematic configuration of a light source panel.
5 is a plan view schematically showing a schematic configuration of a light source panel.
6 is a perspective view schematically showing a schematic configuration of a light source panel.
Fig. 7 is a diagram showing a light ray of light incident on the rod integrator. Fig.
8 is a plan view schematically showing an example of an image of a light emitting element irradiated to the rod integrator.
Fig. 9 is a block diagram schematically illustrating an electrical configuration of a controller having a function for correcting deformation of a drawing pattern.
Fig. 10 is a flowchart showing an example of processing for acquiring pattern deformation information executed by the controller in Fig. 9. Fig.
11 is a diagram schematically showing an example of the operation of acquiring pattern deformation information in the flowchart of FIG.
12 is a flowchart showing an example of rendering processing executed by the controller in Fig.
13 is a schematic diagram for explaining contents of the correction table.

1 is a side view schematically showing an example of a pattern writing apparatus to which the present invention is applicable. Fig. 2 is a partial plan view schematically showing the pattern writing apparatus of Fig. 1; Fig. In order to show the positional relationship of the respective parts of the pattern writing apparatus 1, these figures appropriately show the XYZ orthogonal coordinate axes in which the Z axis direction is the vertical direction. Also, if necessary, the arrow side of each coordinate axis will be referred to as both sides, and the opposite side of the arrows in each coordinate axis will be referred to as a negative side.

The patterning device 1 performs patterning by exposure on the substrate S that has been brought into the apparatus from the inlet port 11 on the negative side in the Y-axis direction, and performs pattern drawing on both sides in the Y- The patterning completed substrate S is taken out from the pattern forming substrate S. The substrate S can be formed on a surface of a semiconductor substrate or FPC (Flexible Printed Circuit) substrate coated with a photosensitive material such as a resist solution or the like, a plasma display device or an organic EL (Electro-Luminescence) A glass substrate for a display device, or a printed wiring board. The patterning device 1 includes a supporting portion 3 for supporting a substrate S which has been brought in, an exposure portion 5 for exposing the substrate S supported by the supporting portion 3, An image pickup section 9 for picking up an image of the surface of the substrate S supported on the support section 3 and a controller 100 for controlling the sections 3, 5 and 9.

The support portion 3 is provided with a support stage 31 for holding and supporting the substrate S placed on the upper surface thereof and a pair of peeling rollers 32 provided on both sides in the Y axis direction of the support stage 31 have. That is, the support stage 31 has a plurality of suction holes on the horizontally formed upper surface, and a suction mechanism (not shown) sucks up the suction holes, whereby the substrate S placed on the upper surface of the support stage 31 And is adsorbed on the support stage. As a result, the loaded substrate S can be firmly supported by the supporting stage 31, and patterning on the substrate S can be performed stably. When the substrate S on which the pattern drawing is completed is taken out, the attraction of the suction holes is stopped and the pair of peeling rollers 32 are lifted up to push up the substrate S, And is peeled from the stage 31.

In the support portion 3, the support stage 31 is connected to the movable element 37a of the linear motor 37 via the elevation table 33, the rotary table 34, and the support plate 35. [ Therefore, the support stage 31 can be elevated and lowered by the elevating table 33, and is also rotatable by the rotary table 34. The mover 37a is driven along the stator 37b of the linear motor 37 extending in the Y axis direction to move the support stage 31 in the range from the inlet 11 to the exit 12, Can be driven in the Y-axis direction. Further, along with the support stage 31, the pair of peeling rollers 32 are also configured to move.

Further, an optical sensor SC is disposed on the (+ Y) side of the support stage 31. The optical sensor SC detects the illuminance distribution of the light irradiated by the optical head 6 described later at a position corresponding to the surface of the substrate S supported by the support stage 31. That is, the light intensity distribution of the optical head 6 is appropriately detected by emitting light from the optical head 6 while the optical head 6 is opposed to the optical sensor SC. The illuminance distribution of the optical head 6 can be adjusted based on the detection result.

The exposure section 5 has a plurality of optical heads 6 arranged on the upper side with respect to the movable region of the support stage 31. Each of the optical heads 6 emits light toward the surface of the substrate S supported by the support stage 31 under the optical head 6 to expose the surface of the substrate S. [ Further, the plurality of optical heads 6 are arranged in line in the X-axis direction and are responsible for exposure of different areas in the X-axis direction. The support table 51 for supporting the plurality of optical heads 6 is movable along a pair of linear guides 52 extending in the X-axis direction. Therefore, by driving the support table along the linear guide 52 by a linear motor (not shown), it is possible to collectively move the plurality of optical heads 6 in the X-axis direction.

The imaging section 9 has two CCD (Charge Coupled Device) cameras 91 that are spaced apart in the X-axis direction. These CCD cameras 91 are configured so as to be movable in the X-axis direction by a drive mechanism (not shown), and move upward above the alignment marks or test patterns formed on the surface of the substrate S and pick up these images .

The operation of the mechanical structure described above is controlled by the controller 100 constituted by a CPU (Central Processing Unit) or a memory. The controller 100 mainly performs the operation of scanning the surface of the substrate S supported by the support stage 31 with irradiation light from the optical head 6 to form a pattern on the surface of the substrate S . Specifically, the controller 100 converts the image data generated by a CAD (computer aided design) or the like into drawing data representing a drawing pattern. The controller 100 controls the light emission of the optical head 6 while controlling the movement of the support stage 31 and the optical head 6 on the basis of the drawing data. Thus, a drawing pattern is formed on the substrate S. More specifically, the pattern drawing operation is performed as follows.

The controller 100 adjusts the positional relationship between the support stage 31 and the optical head 6 to adjust the positional relationship between the support stage 31 and the optical head 6 at the position where the exposure to the substrate S on the support stage 31 is started Thereby positioning the plurality of optical heads 6. When the positioning is completed, the support stage 31 starts moving to one side in the Y-axis direction (for example, the Y-axis negative side). Each of the plurality of optical heads 6 irradiates light of a pattern corresponding to the imaging data with respect to the surface of the substrate S moving with the support stage 31. [ Each of the plurality of optical heads 6 scans the surface of the substrate S in the Y-axis direction (main scanning direction) with respect to the surface of the substrate S to form a pattern (line pattern) . In this way, a plurality of line patterns corresponding to the number of the optical heads 6 are formed so as to be line-spaced in the X-axis direction.

When formation of the plurality of line patterns is completed, the controller 100 moves the optical head 6 in the X-axis direction (sub-scan direction). Thereby, each of the plurality of optical heads 6 faces between a plurality of line patterns formed in advance. When the support stage 31 starts to move to the other side in the Y-axis direction (for example, both sides of the Y-axis) opposite to the previous stage, the surface of the substrate S moving with the support stage 31 Each of the plurality of optical heads 6 irradiates light of a pattern corresponding to the imaging data.

In this way, the irradiation light of the optical head 6 is scanned between the angles of the plurality of line patterns formed first, and a new line pattern is formed. In this manner, a pattern is drawn with respect to the entire surface of the substrate S by sequentially forming a plurality of line patterns while intermittently moving the optical head 6 in the X-axis direction. In this embodiment, the actual drawing pattern is formed based on the correction drawing data obtained by correcting the drawing data, which will be described in detail later.

The above is the outline of the pattern writing apparatus 1. Next, the details of the optical head 6 will be described. In addition, since the plurality of optical heads 6 have the same configuration as each other, only one optical head 6 will be described here. 3 is a perspective view schematically showing a schematic configuration of an optical head.

The optical head 6 receives the light emitted from the light source array 60 through a rod integrator 70 which is a rod-shaped integrator into a spatial light modulator 80 as an optical modulator, And irradiates the beam S which is spatially modulated by the beam S to the irradiation region Re on the surface of the substrate S. As shown in Fig. 4, in the optical head 6, two light source arrays 60 are provided, and the lens arrays 61 are opposed to the light source arrays 60, respectively. The light source array 60 and the lens array 61, which are opposed to each other, are integrated as the light source panel 62.

4 is a side view schematically showing a schematic configuration of a light source panel. 5 is a plan view schematically showing a schematic configuration of a light source panel. 6 is a perspective view schematically showing a schematic configuration of a light source panel. In these drawings, reference character Aoa indicates the optical axis direction of the optical head 6. [ Further, the two light source panels 62 differ only in the wavelength of the light emitted from the light emitting element, and the other structures are the same. Therefore, the following description is basically performed by starting one light source panel 62. [ 4 to 6, the light source array 60 of the light source panel 62 is constituted by arranging twelve light emitting elements 601 in two rows in three rows and four columns on a plate-shaped electrode substrate 602 . At this time, the spacing between the adjacent light emitting elements 601 is the same in both the row direction and the column direction, and the plurality of light emitting elements 601 are uniformly arranged. Here, a group consisting of three light emitting elements 601 which are arranged in the column direction is referred to as a light emitting element column 601C in particular.

Each light emitting element 601 emits light at a luminance corresponding to the driving current, and specifically, it is composed of a bare chip of an LED (Light Emitting Diode) that emits ultraviolet light. That is, in the light source panel 62, a plurality of LEDs are used in a lined fashion. More specifically, the light emitting element 601 is constituted by a ceramic package in which an LED chip having an angular light emitting region is placed. On the front surface of each ceramic package, a cover glass for internal protection is provided.

One of the reasons why a plurality of LEDs are used in a lined manner is as follows. Conventionally, it has been common to use an ultra-high pressure mercury lamp as a light source. On the other hand, for such ultra high-pressure mercury lamps, LEDs have advantages such as high efficiency, long life, monochromatic light emission and space saving. Therefore, attention is paid to this advantage, and an LED is used as a light source. However, with a single LED, the amount of light required for exposure may become insufficient. Thus, a sufficient amount of light is secured by lining a plurality of LEDs. In addition, LEDs are significantly smaller than ultra-high-pressure mercury lamps, so even if a plurality of LEDs are lined up, the advantage of saving space is not compromised. In this manner, by using a plurality of LEDs in a lined fashion, the advantages of LEDs are effectively obtained while securing a sufficient amount of light.

On the other hand, the lens array 61 of the light source panel 62 corresponds to twelve light emitting elements 601 in a one-to-one correspondence, and the lens groups forming the image of the light emitting region of each LED chip correspond to the arrangement of the LED chips Two convex-concave first lenses 611 and two convex-concave second lenses 612 (two convex-concave convex lenses) 612 are formed by arranging twelve 3.times.4 elements in both longitudinal and lateral dimensions in the light emitting element 601. [ And has a lens group composed of a plurality of lenses. That is, in the lens array 61, the twelve first lenses 611 and the twelve second lenses 612 are arranged in three rows and four columns in the same manner as the arrangement of the light emitting elements 601 in the light source array 60 . In this way, two lenses 611 and 612 are opposed to each of the twelve light emitting elements 601, and light from each light emitting element 601 passes through the first lens 611, the second lens 612, And is emitted to the outside of the light source panel 62. In addition, as described above, the optical head 6 is provided with two light source panels 62. Among them, the light emitting element 601 of the light source panel 62a emits light of a center wavelength of 385 nm, and the light emitting element 601 of the light source panel 62b emits light of a center wavelength of 365 nm Light is emitted. That is, the light source panels 62a and 62b emit light having different center wavelengths.

Returning to Fig. 3, the description of the optical head 6 is continued. Light emitted from each of the two light source panels 62 is incident on the dichroic mirror 63. The dichroic mirror 63 faces one side (transmission side) of the light source panel 62a and the other side (reflection side) of the dichroic mirror 63 faces the light source panel 62b. The light (12 lights) from each light emitting element 601 of the light source panel 62a is transmitted from one side of the dichroic mirror 63 to the other side of the light source panel 62a, The light (12 lights) from the element 601 is reflected on the other side of the dichroic mirror 63. In this way, light having a different center wavelength is synthesized by the dichroic mirror 63. [

For reference, since the difference in the center wavelength of light synthesized by the dichroic mirror 63 is about 20 [nm], the spectral reflectance (spectral transmittance) characteristic having a relatively steeper edge is required for the dichroic mirror 63 Do. On the other hand, when the angle of incidence to the dichroic mirror 63 becomes 45 degrees or more, separation occurs in the optical characteristics of the PS polarized light component, and steep characteristics can not be obtained. Therefore, the incident angle at which the light emitted from each of the light source panels 62a and 62b is incident on the dichroic mirror 63 is set to be smaller than 40 degrees.

The twelve lights emitted from the dichroic mirror 63 are incident on the lens array 64. This lens array 64 has a configuration in which twelve lenses 641 are arranged in a one-to-one correspondence with twelve light emitting devices 601, like the lens array 61. [ That is, the lens array 64 is provided with 12 lenses 641 corresponding to 12 lights emitted from the dichroic mirror 63 in a one-to-one correspondence. An enlarged projection image of each corresponding light emitting element 601 is formed on each lens 641. Each light emitting element 601 and each corresponding lens 641 are optically conjugate with each other, (641) functions as a field lens. Therefore, each light emitted from the dichroic mirror 63 passes through the lens 641, and then the principal ray travels in parallel to the optical axis direction. In this way, twelve light bundles parallel to the optical axis of the principal ray are emitted from the lens array 64. [

The light emitted from the lens array 64 is incident on an optical system 65 composed of three lenses 65a, 65b and 65c. This optical system 65 is an optics system of both sides telecentric and projects the image of the lens array 64 to the incident end 70a of the rod integrator 70 in a reduced scale, The light emitted from the light guide 65 is incident on the rod integrator 70.

7 is an optical path diagram of light incident on the rod integrator 70. Fig. In the figure, Aoa indicates the optical axis direction of the optical head 6. As shown in the figure, the light emitted from the light source array 60 is imaged on the lens array 64 by the lens array 61. The image forming magnification at this time is set such that the image of the light emitting element 601 of the light source array 60 is larger than the outer shape of the lens 641 of the lens array 64. [ The shape of the lens array 64 is similar to the shape of the incident end 70a of the rod integrator 70. [ The light transmitted through the lens array 64 is incident on the optical system 65 which is telecentric on both sides as parallel light whose principal ray is parallel to the optical axis direction Aoa. The light emitted from the optical system 65 is projected to the incident end 70a of the rod integrator 70 as the light whose principal ray is parallel to the optical axis direction Aoa.

Returning to Fig. 3, the description will be continued. The rod integrator 70 emits the light incident on the incidence end 70a from the incidence end 70b by uniformizing the light intensity distribution of the light. As the rod integrator 70, various types such as a hollow rod type and a solid rod type can be used. Although the incident end 70a and the emitting end 70b of the rod integrator 70 are similar in shape to each other, they do not have to be the same in size, but are formed in a tapered shape over the incident ends 70a to 70b A load integrator 70 may be used.

Light emitted from the emitting end 70b of the rod integrator 70 is incident on the spatial light modulator 80 through the two lenses 66, the plane mirror 67a and the concave mirror 67b . The injection end 70b of the rod integrator 70 and the spatial light modulator 80 are optically conjugate with each other. The spatial light modulator 80 is composed of a DMD in which a plurality of micromirrors are arranged in a lattice form. The micromirror of the spatial light modulator 80 is controlled by a control signal (correction drawing data Dc to be described later) from the controller 100 to take a corresponding posture in either the on state or the off state. The micromirror in the posture corresponding to the ON state reflects the light from the rod integrator 70 toward the first projection lens 68. On the other hand, the micro lens in the posture corresponding to the OFF state reflects the light from the rod integrator 70 in the direction deviated from the first projection lens 68. Therefore, the light from the rod integrator 70 is reflected by the micromirrors in the ON state of the spatial light modulator 80, and is incident on the first projection lens 68.

The first projection lens 68 and the second projection lens 69 have a function as a projection lens in a pair. After the magnification is adjusted by changing the interval between the first projection lens 68 and the second projection lens 69, Is projected onto the irradiation region (Re) of the surface of the substrate (S). In addition, the micromirror of the spatial light modulator 80 and the irradiation region Re of the surface of the substrate S are optically conjugated. The optical head 6 shown in Fig. 3 is provided with an autofocus mechanism 95 for automatically adjusting the focus. The autofocus mechanism 95 is composed of an irradiating section 96 for irradiating light to the irradiation region Re and a light receiving section 97 for receiving the reflected light from the irradiation region Re, By driving the second projection lens 69 in the vertical direction on the basis of the result, the focus is automatically adjusted.

8 is a plan view schematically showing an image of the light emitting element 601 irradiated to the rod integrator 70. Fig. In the figure, the unit image IM is an image obtained by irradiating the light from the one light emitting element 601 to the rod integrator 70. As shown in the same figure, in the rod integrator 70, in correspondence to the arrangement of three rows and four columns of the twelve light emitting devices 601 in the light source array 60, It is lined with four rows. As a result, the three unit images IM irradiated by the three light emitting devices 601 belonging to the same light emitting element array 601C are linearly arrayed in the direction corresponding to the Y axis direction of the substrate S, (IMC). That is, the three unit images IM belonging to the same unit-image column IMC are lined up in the direction corresponding to the Y-axis direction of the substrate S, which is the scanning direction of light to the substrate S.

8, the illuminance of the unit image IM can be individually changed in order to adjust the illuminance distribution of the light to be irradiated to the rod integrator 70. As shown in Fig. More specifically, the controller 100 individually controls the magnitude of the driving current for each light emitting element 601 based on the result of detecting the illuminance distribution by the optical sensor SC. As a result, the luminance is individually controlled for each light emitting element 601, the illuminance of the unit image IM is individually controlled, and the illuminance distribution in the illuminated region Re is adjusted.

In this embodiment, the imaging pattern is formed on the substrate S by opposing the optical head 6 to the substrate S and irradiating the substrate S with light from the optical head 6. [ In this configuration, when light is tilted and emitted from the optical head 6 or the optical head 6 itself is inclined, light is not appropriately irradiated to the substrate S, and the imaging pattern There has been a possibility of such deformation. Thus, in this embodiment, prior to the formation of the imaging pattern, information about the deformation caused by the optical head side is obtained. Based on this information, the formation of the rendering pattern is controlled. The formation of the imaging pattern is also controlled based on the detection result of the alignment mark mounted on the substrate S so that the deformation of the imaging pattern due to the deformation such as the warp of the substrate S can be suppressed. Next, these operations will be described in detail.

Fig. 9 is a block diagram schematically illustrating an electrical configuration of a controller having a function for correcting deformation of a drawing pattern. The controller 100 rasterizes the image data Di externally applied to the drawing data Dw which is raster data and stores it in the built-in memory 110. [ The drawing data Dw may be stored in the memory 110 in the form of run length data subjected to compression. The memory 110 stores test data Dt, alignment position data Da, pattern deformation information Pp, alignment information Pa, and the like in addition to the rendering data Dw. The controller 100 includes a plurality of functional blocks 120, 130, 140, and 150 for correcting the drawing data Dw to form a drawing pattern with less distortion.

The image acquisition block 120 acquires an image captured by the camera 91 of the imaging section 9. Specifically, the image acquisition block 120 acquires an image of a test pattern It to be described later from the camera 91 and outputs it to the test information acquisition block 130, or outputs the image of the alignment mark Ia to the camera 91 and outputs it to the alignment information acquisition block 140. [

The test information acquisition block 130 extracts information indicating deformation of the test pattern from the image of the received test pattern It as pattern deformation information Pp. The alignment information acquisition block 140 extracts information indicating the position of the alignment mark Ia from the image of the received alignment mark Ia as the alignment information Pa. The pattern deformation information Pp and the alignment information Pa thus extracted are stored in the memory 110. [ The correction block 150 then corrects the drawing data Dw based on the pattern deformation information Pp and the alignment information Pa to generate the correction drawing data Dc.

10 is a flowchart showing an example of a process of acquiring pattern deformation information executed by the controller in Fig. 11 is a diagram schematically showing an example of the operation of the pattern deformation information acquisition processing in the flowchart of FIG. In addition, the circles in Fig. 11 indicate dots appearing in the data or formed on the substrate. On the other hand, the broken line in Fig. 11 is a ruled line supplementarily described, and does not actually appear in the data or on the substrate.

In step S101, the dummy substrate S is carried into the patterning device 1 and positioned below the optical head 6 by the support stage 31. [ The dummy substrate S has a surface finished in a planar shape free from deformation such as warping and is carried in a state in which a photosensitive material such as a resist solution is already widened on the surface

In step S102, a test pattern It is formed on the dummy substrate S by using one of the four optical heads 6 selected. Specifically, a test pattern It is formed on the surface of the substrate S by irradiating the optical head 6 as an object with light in accordance with the test data Dt stored in the memory 110. [ As shown in the column of " test data " in Fig. 11, the test data Dt is obtained by arranging a plurality of dots dt1 in a lattice point shape in which lattice points are equally spaced in the X- Pattern. 11, a ruled line is stipulated so that the intersection of the ruled lines coincides with the position of the dot dt1 indicated by the test data Dt (i.e., the target position to be formed).

Therefore, as shown in the column of " test pattern " in Fig. 11, on the surface of the dummy substrate S, a test consisting of a plurality of dots dt2 formed in the vicinity of the dot dt1 The pattern It is drawn. The dot dt1 constituting the test data Dt is also listed in the transfer field in addition to the dot dt2 constituting the test pattern It. This is because the dot dt1 is used for indicating the positional relationship of the dots dt1 and dt2 And does not show that the dot dt1 appears on the surface of the dummy substrate S. In the example described here, a deformation caused by the head side is generated in the test pattern, and the position of the dot dt2 as a component of the test pattern is set to the deviation (target position) of the dot dt1 dt. In addition, the deviation DELTA dt is given as a vector extending from the dot dt1 (formation target position) to the dot dt2.

In step S103, pattern deformation information Pp indicating the deformation of the test pattern It formed on the dummy substrate S is obtained. More specifically, the acquisition of the pattern deformation information Pp is executed by the cooperation of the image sensing unit 9, the image acquisition block 120, and the test information acquisition block 130. That is, the camera 91 of the imaging section 9 picks up a test pattern It formed on the surface of the dummy substrate S and outputs it to the image acquisition block 120. The image acquisition block 120 outputs an image of the received test pattern It to the test information acquisition block 130. [ Then, as shown in the column of " Test Pattern (It) " in Fig. 11, the test information acquisition block 130 acquires the test data Dt and the test pattern It, To obtain a deviation DELTA dt for each dot dt2 constituting the test pattern. In this manner, the pattern deformation information Pp indicating the deviation DELTA dt of each dot dt2 is obtained.

In step S104, the pattern deformation information Pp is stored in the memory 110 in association with the optical head 6 selected in step S102. In step S105, it is determined whether or not the acquisition of the pattern deformation information Pp for the entire optical head 6 is completed. If it is determined that the optical head 6 is not completed (NO) in step S105, the target optical head 6 is changed (step S106), and steps S102 to S105 are performed on the optical head 6 after the change. If it is determined in step S105 that the process is complete (YES), the pattern deformation information obtaining process is terminated.

In this embodiment, after acquiring the pattern deformation information Pp in advance as described above, the imaging pattern is formed on the substrate S (a production substrate other than the dummy substrate). Further, in the rendering process for forming the rendering pattern, the control based on the alignment mark is executed in parallel. Next, this drawing process will be described.

Fig. 12 is a flowchart showing an example of rendering processing executed by the controller of Fig. 9; Fig. In step S201, rendering data Dw to be subjected to the rendering process is prepared in the memory 110, and alignment position data indicating the position of the alignment mark Ia mounted on the substrate S to be subjected to the rendering process (Da) is prepared in the memory 110. In the following step S202, the substrate S is carried into the patterning apparatus 1 and positioned below the optical head 6 by the support stage 31. [

In step S203, alignment information Pa indicating an actual position of the alignment mark Ia mounted on the substrate S supported by the support stage 31 is obtained. More specifically, the acquisition of the alignment information Pa is performed by the cooperation of the imaging unit 9, the image acquisition block 120, and the alignment information acquisition block 140. That is, the camera 91 of the imaging section 9 picks up the alignment mark Ia mounted on the surface of the substrate S and outputs it to the image acquisition block 120. [ The image acquisition block 120 outputs the image of the received alignment mark Ia to the alignment information acquisition block 140. [ The alignment information acquiring block 140 acquires the deviation Δa between the position (actual position) of the alignment mark Ia indicated by the received image and the position (reference position) of the alignment mark indicated by the alignment position data Da ). In this way, the alignment information Pa indicating the deviation DELTA a of each alignment mark Ia is obtained. The deviation? A is given as a vector from the reference position to the actual position of the alignment mark Ia.

In step S204, the correction block 150 creates a correction table Tc for correcting the painting data Dw based on the pattern deformation information Pp and the alignment information Pa. 13 is a schematic diagram for explaining contents of the correction table. In addition, the circles in Fig. 13 indicate dots appearing in the data or formed on the substrate. On the other hand, the broken line in Fig. 13 is an auxiliary ruled line and does not actually appear on the data or on the substrate. Also in Fig. 13, a ruled line is stitched so that the intersection of the ruled lines coincides with the position of the dot dt1 indicated by the test data Dt (i.e., the target position to be formed).

In step S204, the correction table Tc is a composite deviation? C1 (=? C1) obtained by adding the deviation? Dt given by the pattern deformation information Pp and the deviation? A given by the alignment information Pa, DELTA dt + DELTA a) for each dot dt1. However, the alignment marks Ia are provided at intervals much wider than the adjacent intervals of the dots dt1, and are not provided for each dot dt1. Therefore, as the deviation DELTA a corresponding to each dot dt1, the deviation DELTA a of the alignment mark Ia closest to the target dot dt1 and the deviation DELTA a of the alignment mark Ia close to the target dot dt1 A value obtained by interpolation (for example, linear interpolation) with a deviation? A of a plurality of alignment marks Ia of the projection optical system 10 is used.

Thus, a composite deviation? C1 is obtained for each dot dt1 (in other words, a lattice point). The composite deviation DELTA c1 indicates a drawing pattern based on the drawing data Dw which is uncorrected. That is, when the drawing pattern is formed based on the drawing data Dw which is not corrected, the deformation combination pattern composed of the dots dt3 shifted by the composite deviation? C1 from each lattice point dt1 is formed Quot; modified synthetic pattern " in Fig. 13). Conversely, in the rendering operation, the pixels formed in the vicinity of each lattice point dt1 are set such that the inverse vector Δc2 (= - Δc1) of the composite deviation Δc1 corresponding to the corresponding lattice point dt1, It is possible to form a drawing pattern with less distortion. Therefore, in this embodiment, the correction deviation? C2 (inverse vector of? C1) is obtained for each lattice point dt1 (see "correction table" in FIG. 13) do.

In step S204, the correction deviation? C2 is obtained for all the lattice points dt1. When the generation of the correction table Tc is completed, the controller 100 reads the drawing data Dw ) On the basis of the correction drawing data Dc, and forms a drawing pattern. At this time, as described in, for example, Japanese Patent Application Laid-Open No. 2010-204421, a technique of dividing the surface of the substrate S into a plurality of mesh regions may be applied. That is, a mesh area centered on the lattice point dt1 is set for each lattice point dt1 in the virtual plane in which the drawing data Dw is arranged in the bitmap shape, and each mesh area is set to the corresponding lattice point dt1 The corrected image data Dc is rearranged so as to be shifted by the correction deviation? C2 of the corrected image data Dc.

As described above, in this embodiment, light is emitted from the optical head 6 to form a test pattern It on the dummy substrate S, and pattern deformation information (" Pp). When forming a patterning pattern on a substrate, this pattern deformation information Pp is utilized. More specifically, the imaging data Dw indicating the imaging pattern is corrected based on the pattern deformation information Pp to generate the correction drawing data Dc, and the optical head 6 is set on the basis of the correction drawing data Dc, So as to form an imaging pattern on the substrate S.

In this embodiment, since the test pattern It is actually formed by emitting light from the optical head 6, the pattern deformation information Pp indicative of the deformation of the test pattern It is transmitted to the optical head 6 side In the case of the present invention. Therefore, the correction drawing data Dc obtained by correcting the drawing data Dw on the basis of the pattern deformation information Pp helps correct the deformation caused by the optical head 6 side. Therefore, the imaging pattern is formed on the substrate S by emitting the light from the optical head 6 on the basis of the correction drawing data Dc, thereby forming the imaging pattern having little deformation due to the optical head 6 side .

In this embodiment, the pattern deformation information Pp is acquired from the position of the constituent element (dot dt2) of the test pattern It, which is appropriate. That is, the deformation of the test pattern It can be appropriately grasped from the position of the component (dot dt2) of the test pattern It, and the pattern deformation information Pp with high accuracy can be acquired. As a result, it is possible to form the imaging pattern in which the deformation caused by the optical head 6 side is effectively suppressed.

It is also appropriate that a test pattern It is formed by arranging a plurality of dots dt2 and the pattern dt2 is recognized as a constituent element and pattern deformation information is acquired. That is, by forming the test pattern It with the relatively easy-to-recognize dot dt2, the position of the dot dt2 as a constituent element can be grasped accurately and the pattern deformation information Pp with high accuracy can be obtained . As a result, it is possible to form the imaging pattern in which the deformation caused by the optical head 6 side is more effectively suppressed.

It is also appropriate that the test pattern It is formed by arranging a plurality of dots d2 in a grid point shape. That is, by configuring the test pattern It from the plurality of dots dt2 arranged in the lattice point shape, it is possible to grasp the distortion of each part of the entire test pattern It without smudge. As a result, it is possible to obtain the pattern deformation information Pp which is advantageous when suppressing deformation due to the optical head 6 side.

It is also appropriate that the pattern deformation information Pp is acquired based on a comparison between the test pattern It formed on the dummy substrate S and the test data Dt. By comparing the test data Dt representing the test pattern It with the actually formed test pattern It in this manner, the deformation of the test pattern It can be accurately grasped and the pattern deformation information Pp of high accuracy can be obtained . As a result, it is possible to form the imaging pattern in which the deformation caused by the optical head 6 side is effectively suppressed.

In this embodiment, the drawing data Dw is corrected based on the pattern deformation information Pp and the alignment information Pa to generate the correction drawing data Dc. In this way, not only the pattern deformation information Pp but also the alignment information Pa indicating the position of the alignment mark Ia of the substrate S corrects the imaging data Dw, It is possible to form the imaging pattern in which both the deformation caused by the deformation of the substrate S and the deformation due to the deformation of the substrate S are effectively suppressed.

At this time, the image of the test pattern It and the image of the alignment mark Ia are executed by the common camera 91. Therefore, it is not necessary to separately install a camera for each image pickup, and the patterning device 1 can be simplified.

Thus, in this embodiment, the patterning apparatus 1 corresponds to an example of the "patterning apparatus" of the present invention, the support stage 31 corresponds to an example of the "substrate supporting unit" of the present invention, Head controller " of the present invention corresponds to an example of the " head " of the present invention, the support table 51 corresponds to an example of the & And the correction block 150 corresponds to an example of the " data correction section " of the present invention, and the test information acquisition block 130 corresponds to an example of the " The test pattern It corresponds to an example of the " test pattern " of the present invention, and the pattern deformation information Pp corresponds to an example of the present invention , And the drawing data Dw corresponds to an example of the " pattern deformation information " of the present invention The dot dt2 corresponds to an example of the " dot " of the present invention, the alignment information Dc corresponds to an example of the " drawing data ", the correction drawing data Dc corresponds to an example of " correction drawing data " The acquisition block 140 corresponds to an example of the "alignment information acquisition section" of the present invention and the alignment mark Ia corresponds to an example of the "alignment mark" of the present invention, and the alignment information Pa corresponds to " Alignment information ".

The present invention is not limited to the above-described embodiments, and various changes can be made in addition to those described above as long as they do not depart from the spirit of the present invention. For example, a dummy substrate S having a surface finished in a planar shape has been used. However, the substrate usable as the dummy substrate S is not limited to a flat surface. That is, even if the surface is curved, if the shape of the surface is an existing substrate, it can be used to obtain the pattern deformation information indicating deformation caused by the optical head 6 side. Specifically, a value obtained by dividing the positional difference caused by the shape of the surface of the substrate S from the position of the dot dt2 and the actual distance of the target position of formation may be handled as the deviation Δdt described above.

In the above embodiment, the drawing data Dw is corrected based on the alignment information Pa. However, when the deformation of the production board S can be ignored, the drawing data Dw may be corrected only based on the pattern deformation information Pp without being based on the alignment information Pa. In this case, the process of obtaining the alignment information Pa may be omitted.

In the above embodiment, the interval between adjacent dots d1 is set to be wider than the interval between adjacent alignment marks Ia. However, the interval between adjacent dots d1 may be set to be equal to or smaller than the interval between adjacent alignment marks Ia.

The specific configuration of the test pattern It is not limited to the arrangement in which a plurality of dots dt2 are arranged in a lattice point shape as described above. Therefore, for example, the test pattern It may be formed by forming the pattern on the line in a grid pattern in the vertical and horizontal directions.

The specific configuration of the optical head 6 is not limited to the above configuration. Thus, for example, the spatial light modulator 80 may be composed of a modulating element other than the DMD. Alternatively, a light emitting element other than an LED may be used as the light emitting element 601.

In the above embodiment, the substrate S and the optical head 6 are moved relative to each other by moving the substrate S in the Y-axis direction. However, by moving the optical head 6 in the Y-axis direction, the substrate S and the optical head 6 may be moved relative to each other.

Industrial availability

The present invention can be used in the first half of the pattern drawing technique for forming a pattern on the substrate S by the light emitted from the optical head 6. [

One… Patterning device
6 ... Optical head
31 ... Support stage
51 ... Support table
91 ... camera
100 ... controller
110 ... Memory
120 ... The image-
130 ... Test information acquisition block
140 ... Alignment information acquisition block
150 ... Correction block
Da ... Alignment position data
Dc ... Correction drawing data
Di ... Image data
Dt ... Test data
Dw ... Drawing data
I ... Alignment mark
It ... Test pattern
Pa ... Alignment information
Pp ... About pattern variations
S ... Substrate (dummy substrate, production substrate)
Tc ... Correction table
dt1 ... Dot (grid point)
dt2 ... dot
dt3 ... dot
? C1 ... Composite deviation
? C2 ... Compensation deviation
△ dt ... Deviation

Claims (8)

A substrate support,
A head for emitting light,
A head supporter for supporting the head and facing the substrate supporter,
A first control unit for forming a test pattern on the dummy substrate by emitting light to the head toward the dummy substrate supported by the substrate supporting unit,
A deformation information obtaining unit that obtains deformation information indicating deformation of the test pattern formed on the dummy substrate;
A data correcting section for correcting drawing data representing a drawing pattern based on the pattern deformation information to generate correction drawing data,
And a second control section for forming the imaging pattern on a substrate supported by the substrate support section by injecting light onto the head based on the correction drawing data. The method according to claim 1,
And the deformation information obtaining unit obtains the deformation information from the position of the component of the test pattern. The method of claim 2,
The first control unit arranges a plurality of dots to form the test pattern,
Wherein the deformation information acquisition unit recognizes the dot as the component and acquires the pattern deformation information. The method of claim 3,
Wherein the first control unit forms the test pattern by arranging the plurality of dots in a lattice point shape. The method according to any one of claims 1 to 4,
Wherein the first control section forms the test pattern by emitting light to the head based on test data representing the test pattern,
Wherein the deformation information obtaining unit obtains the deformation information on the basis of a comparison between the test substrate formed on the dummy substrate and the test data. The method according to any one of claims 1 to 5,
Further comprising an alignment information acquiring section for acquiring alignment information indicating a position of an alignment mark of the substrate supported by the substrate supporting section,
Wherein the data correction section corrects the drawing data based on the pattern deformation information and the alignment information to generate the correction drawing data. The method of claim 6,
Wherein the deformation information acquiring unit acquires the pattern deformation information by capturing the test pattern, the alignment information acquiring unit acquires the alignment information by capturing the alignment mark, and the deformation information acquiring unit and the alignment information acquiring unit And the image is captured using a common camera. Forming a test pattern on a dummy substrate supported on the substrate support by injecting light into a head supported by the head support member so as to face the substrate support,
Acquiring pattern deformation information indicating deformation of the test pattern formed on the dummy substrate;
A step of correcting drawing data representing a drawing pattern based on the pattern deformation information to generate correction drawing data;
And forming the imaging pattern on a substrate supported by the substrate support portion by injecting light onto the head based on the correction drawing data.

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