KR20140066636A - Multi-channel optical module and manufacturing method of the same - Google Patents

Multi-channel optical module and manufacturing method of the same Download PDF

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Publication number
KR20140066636A
KR20140066636A KR1020130071408A KR20130071408A KR20140066636A KR 20140066636 A KR20140066636 A KR 20140066636A KR 1020130071408 A KR1020130071408 A KR 1020130071408A KR 20130071408 A KR20130071408 A KR 20130071408A KR 20140066636 A KR20140066636 A KR 20140066636A
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KR
South Korea
Prior art keywords
array block
platform
transmission lines
optical
optical element
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Application number
KR1020130071408A
Other languages
Korean (ko)
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KR102037896B1 (en
Inventor
임권섭
Original Assignee
한국전자통신연구원
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Priority to US14/066,034 priority Critical patent/US9250404B2/en
Publication of KR20140066636A publication Critical patent/KR20140066636A/en
Application granted granted Critical
Publication of KR102037896B1 publication Critical patent/KR102037896B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail

Abstract

Disclosed are a multi-channel optical module and a manufacturing method for the same. The optical module comprises a base block having a cavity at the edge of one side; a printed circuit board arranged on the other side of the base block, facing the cavity; an integrated circuit chip mounted on the printed circuit board; transmission lines connected to the integrated circuit chip; a platform arranged inside the cavity; an optical element array block arranged inside the platform and connected to the transmission lines; multiple optical fiber cores arranged on the optical element array block; and an optical fiber array block which fixates the multiple optical fiber cores and which is bonded to the platform and the optical element array block to be fixed inside the cavity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a multi-channel optical module,

The present invention relates to an optical communication system and a manufacturing method thereof, and more particularly, to a multi-channel optical module capable of multi-channel optical transmission and reception of light for data transmission and a method of manufacturing the same.

Recently, in the case of active optical cable (AOC) such as High-Definition Multimedia Interface (HDMI), DisplayPort and DVI (Digital Visual Interface) More than four channels are required to focus more than one wavelength.

 In addition, the electrical connection has already been limited in connection systems such as general chip and chip (Chip-to-Chip), board and board (B? O?), Board and system, system and system. The demand for multi-channel optical modules for transmission is continuously increasing.

A typical multi-channel optical module may include a fiber block with many precise extrusions and guide pins having a particular shape. In the case of injection molds, it takes a lot of time and cost to control precise tolerances. In particular, when using a single-mode fiber with a core size of about 8 μm, the final tolerance between the fiber and the optical device must be controlled to a few μm I have a problem.

The other multi-channel optical module has a structure for optically coupling between an optical element array block having a lens module including a mirror which is converted to the same 90 degree optical path, and an optical fiber array. A process of aligning between the optical fiber and the mirror, between the mirror and the lens, or between the lens and the optical element is indispensably required. Therefore, a general multi-channel optical module has a disadvantage in that the optical coupling efficiency between the final optical fiber and the optical device is not good, and many parts such as a mirror, a lens, a support mechanism, and a spacer for securing a space for optical coupling are used.

Another multi-channel optical module may include a fiber array block having guide holes and guide pins on a silicon wafer. When the optical element and the optical fiber are connected by a manual alignment method, the through hole must be formed at a precise position in the silicon wafer. In the multi-channel optical module, it is very difficult to fabricate the guide pin and the fiber array block including the guide pin, and the silicon mount may be cracked due to contact with the guide pin. Also, in the case of a multi-channel optical module, there is a problem that electrical performance is deteriorated due to electrical crosstalk between transmission lines between adjacent channels, which is more serious as the transmission speed increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a multi-channel module that is simple in structure and easy to process and a method of manufacturing the same.

Another object of the present invention is to provide a multi-channel optical module and a method of manufacturing the same that can easily perform a packaging process and a manual alignment method.

It is another object of the present invention to provide a multi-channel optical module capable of improving productivity and a manufacturing method thereof.

A multi-channel optical module according to an embodiment of the present invention includes: a base block having a cavity at one edge; A printed circuit board disposed on the other side of the base block opposite to the cavity; An integrated circuit chip mounted on the printed circuit board; A platform disposed within the cavity; Transmission lines connected to the integrated circuit chip and formed in the platform; An optical element array block disposed in the platform and connected to the transmission lines; A plurality of optical fiber cores arranged in the optical element array block; And an optical fiber array block fixed to the plurality of optical fiber cores, and fixed to the platform and the optical element array block and fixed in the cavity.

According to an embodiment of the present invention, the platform includes: a bottom surface contacting a side wall of the cavity; An upper surface from the bottom surface to the optical fiber array block; A first inclined surface inclined between the upper surface and the bottom surface to minimize a step between the printed circuit board and the optical fiber array block; An upper floor on which the optical element array block is mounted on the other side of the upper surface opposed to the first inclined surface; And a second inclined surface between the upper floor and the upper surface.

According to another embodiment of the present invention, bonding pads on which the transmission lines are bonded may further include bonding pads.

According to an embodiment of the present invention, the bonding pads include: first bonding pads disposed on the first inclined surface of the platform; And second bonding pads disposed on the upper surface of the platform.

According to another embodiment of the present invention, the transmission lines include first bonding wires between the integrated circuit chip and the first bonding pads; Wiring transmission lines between the first bonding pads and the second bonding pads; And second bonding wires between the second bonding pads and the optical element array block.

According to an embodiment of the present invention, the transmission lines include first bonding wires connected to the integrated circuit chip; Pad transmission lines connected to the first bonding wires at the first inclined surface and extending from the first inclined surface to an upper bottom surface of the platform; And second bonding wires connecting the pad transmission lines and the optical element array block.

According to another embodiment of the present invention, the pad transmission lines may be in contact with the surfaces of the first inclined surface and the second inclined surface of the platform.

According to an embodiment of the present invention, the base block may have a third inclined surface adjacent to the cavity and extending from the first inclined surface.

According to another embodiment of the present invention, the printed circuit board may be disposed on the third inclined surface of the base block.

According to one embodiment of the present invention, the optical element array block is in contact with a cavity side wall of the base block, and may be disposed between the printed circuit board and the optical fiber array block without the platform.

According to another embodiment of the present invention, the optical element array block includes optical elements aligned with the optical fiber cores, and includes an inclined surface inclined from the printed circuit board on the base block to the optical elements in the cavity Lt; / RTI >

According to an embodiment of the present invention, the optical element array block may further include the element pads connected to the optical elements.

According to another embodiment of the present invention, the optical elements may comprise a vertical surface emitting laser or a laser diode.

According to one embodiment of the present invention, the base block may have stop bars that align the printed circuit board on both sides of the cavity.

According to another embodiment of the present invention, the optical fiber array block may have alignment holes formed in the edges of the optical fibers.

According to an embodiment of the present invention, the apparatus may further include guide pins that are engaged with the alignment holes.

According to another aspect of the present invention, there is provided a method of fabricating a multi-channel optical module, comprising: forming transmission lines in a flat; Mounting an optical element array block on a platform; Coupling first bonding wires between the optical element array block and transmission lines on the platform; Aligning the optical element array block and the optical fiber cores to bond the platform and the fiber array block; Mounting the platform and the fiber block on a base block; Fixing a printed circuit board on which the integrated circuit chip is mounted on the base block; And connecting wiring transmission paths between the transmission line pad and the integrated circuit chip.

According to an embodiment of the present invention, the platform and the optical fiber array block may be bonded by a elliptic bonding method.

According to another embodiment of the present invention, the transmission lines may include pad transmission lines.

The transmission lines include first pads connected to the first bonding wires; Second pads connected to the second bonding wires; And a wiring transmission line connected between the first pads and the second pads.

A multi-channel optical module according to an embodiment of the present invention may include a base block, an optical fiber array block, optical fibers, a printed circuit board, an integrated circuit chip, bonding wires, a platform, and an optical element array block. The optical fiber array block can fix the optical fibers. The platform can secure the optical element array block. The optical fibers and optical element array blocks can be manually aligned by flip chip bonding or die bonding devices. The optical fiber array block and the platform may be bonded. The bonding wires can connect the optical element array block and the integrated circuit chip. Bonding pads can be placed on the platform. Bonding pads can be connected with bonding wires. If the mutual distance, spacing, line width, or size of the bonding pads and the bonding wires are appropriately adjusted, low pass filter characteristics can be realized without addition of additional optical elements, thereby reducing electrical crosstalk.

Therefore, the multi-channel optical module according to the embodiment of the present invention can be mass-produced using the passive light alignment method and the surface mounting technique. In addition, it does not use high-cost optical parts such as a microlens array, so that the structure is simple and the number of parts can be reduced and the cost can be reduced.

1 is a perspective view illustrating a multi-channel optical module according to an embodiment of the present invention.
Fig. 2 is a perspective view showing the base block of Fig. 1. Fig.
FIG. 3 is a view showing the optical fiber array block and the platform of FIG. 1 separately.
4 is a perspective view showing the optical fibers and the optical element array block of FIG. 3 in more detail.
5 is an exploded perspective view showing the optical fiber array block and the optical element array block of FIG. 3 according to the first application example of the present invention.
6 shows a transmission line between the optical element array block and the integrated circuit chip of Figs. 3 and 4. Fig.
FIG. 7 is a plan view showing bonding wires and bonding pads between the optical element array block and the integrated circuit chip of FIGS. 3 and 4. FIG.
FIG. 8 is a graph illustrating a comparison between a platform structure according to an embodiment of the present invention and high frequency removal characteristics in a general platform structure.
9 is a perspective view illustrating a multi-channel optical module according to a second application example of the present invention.
10 is a perspective view illustrating a multi-channel optical module according to a third application example of the present invention.
11 is a perspective view illustrating a multi-channel optical module according to a fourth application example of the present invention.
12 is a perspective view illustrating a multi-channel optical module according to a fifth application example of the present invention.
13 is a flow chart for explaining a method of manufacturing a multi-channel optical module according to an embodiment of the present invention.

The foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed invention. Therefore, the present invention is not limited to the embodiments described herein but may be embodied in other forms. The embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In this specification, when it is mentioned that a certain element includes an element, it means that it may further include other elements. In addition, each embodiment described and illustrated herein includes its complementary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a multi-channel optical module according to an embodiment of the present invention. 2 is a perspective view showing the base block 10 of Fig.

1 and 2, a multi-channel optical module 100 according to an embodiment of the present invention includes a base block 10, an optical fiber array block 20, optical fibers 30, a printed circuit board 40, an integrated circuit chip 50, transmission lines 60, and a platform 70.

The base block 10 can support the optical fiber array block 20 and the printed circuit board 40. Both side edges of the base block 10 may have different heights. According to one embodiment, the optical fiber array block 20 is disposed at one side edge of the base block 10. The printed circuit board 40 is disposed on the other side edge of the base block 10.

The optical fiber array block 20 may be disposed on the base block 10 lower than the printed circuit board 40. The base block 10 may have a cavity 12. The optical fiber array block 20 can be inserted into the cavity 12. The platform 70 can also be mounted in the cavity 12. [ The cavity 12 may fix the optical fiber array block 20. The platform 70 may have a first beveled surface 72. The base block 10 may be provided with stop bars 14 on both upper ends of the cavity 12. The stop bars 14 can align the printed circuit board 40. The printed circuit board (40) may be disposed adjacent the cavity (12). The optical fiber array block 20 and the printed circuit board 40 on the base block 10 may be parallel to each other on the base block 10.

The optical fiber array block 20 can fix a plurality of optical fibers 30. The optical fiber array block 20 may have an alignment hole 22 formed in a direction parallel to the optical fibers 30. The optical fiber array block 20 may be connected to an external optical element or an optical device.

The printed circuit board 40 can mount the integrated circuit chip 50. The integrated circuit chip 50 may include an amplifier, a modulator, or an optical element driver circuit. The integrated circuit chip 50 is disposed on the platform 70 and the printed circuit board 40 of the base block 10. The printed circuit board 40 may include a flexible printed circuit board or a flat printed circuit board.

One end of the transmission line 60 is connected to the integrated circuit chip 50. The other end of the transmission line 60 is connected to the electrode pad 84 of the optical element array block 80 mounted on the platform 70. The platform 70 and the optical fiber array block 20 can be fixed to each other have.

The multi-channel optical module according to the embodiment of the present invention changes the electrical path to the vertical (90 deg.) Without changing the optical path to the vertical (90 deg.), Minimizing the use of optical components such as lenses, And the optical fiber 30 can be manually aligned.

FIG. 3 is a view showing the optical fiber array block 20 and the platform 70 of FIG. 1 separately. 4 is a perspective view showing the optical fibers 30 and the optical element array block 80 of FIG. 3 in more detail.

Referring to FIGS. 1, 3 and 4, an optical element array block 80 may be disposed between the optical fiber array block 20 and the platform 70. The platform 70 may fix the optical element array block 80. [ The platform 70 may have a bottom surface 71, an upper surface 76, a first ramp surface 72, an upper floor surface 78, and a second ramp surface 74. The bottom surface 71 may contact the side wall of the cavity. The top surface 76 may have a height from the bottom surface 71 to the optical fiber array block 20. [ The first inclined surface 72 is the inclined surface between the upper surface 76 and the bottom surface 71. The first inclined surface 72 can minimize the step between the printed circuit board 40 and the optical fiber array block 20. [ The upper floor surface 78 is a surface on which the optical element array block 80 is mounted on the other side of the upper surface 76 opposed to the first inclined surface 72. The second inclined surface 74 is the inclined surface between the upper bottom surface 78 and the upper surface 76.

The optical element array block 80 may include a plurality of optical elements 82 and device bonding pads 84. The device bonding pads 84 are electrically connected to the optical devices 82. The device bonding pads 84 may be connected to the transmission line 60. The optical elements 82 may include a resin surface emitting laser (VCSEL) or a laser diode (LD). The optical fibers 30 may include a core 34 and a cladding 36. The core 34 may have a diameter of about 8 占 퐉 to 100 占 퐉. The optical element array block 80 can be aligned with the core 34 of the optical fibers 30. Thus, the optical element array block 80 and the optical fibers 30 can be fixed by the joining of the platform 70 and the optical fiber array block 20. [ 5 is an exploded perspective view showing the optical fiber array block 20 and the optical element array block 80 of FIG. 3 according to the first application example of the present invention. The first application example is that the platform 70 in the first embodiment is replaced with the optical element array block 80. [

Referring to FIG. 5, the optical element array block 80 according to the first application example of the present invention may have a first inclined surface 72. The transmission line 60 may extend along the first inclined surface 72. In addition, the transmission line 60 can be directly coupled to the electrode pads 84 on the optical element array block 80. The optical element array block 80 and the optical fiber array block 20 can be connected. The optical fiber 30 and the optical element 82 can be aligned. The use of the platform 70 is advantageous in the case of using the optical element array block 80 in which the first inclined plane 72 and the transmission line on the first inclined plane 72 are formed.

6 shows the transmission lines 60 between the chips 50 between the optical element array block 80 and the integrated circuit chip 50 of Figs. 3 and 4 represent the first transmission lines 60. Fig. The optical element array block 80 and the integrated circuit bonding wires 62, the pad transmission lines 94 and the second bonding wires 66. The first bonding wires 62 may be connected between the chip bonding pads 52 and the pad transmission lines 94. The second bonding wires 66 may be connected between the device bonding pads 84 and the pad transmission lines 94. The pad transmission lines 94 may be disposed on the platform 70.

 The pad transmission lines 94 may extend from the first inclined surface 72 of the platform 70 to the upper floor surface 78. The pad transmission lines 94 may be in contact with the surface of the optical element array block 80. [ As the area of the pad transmission lines 94 is increased, their parasitic capacitance can be increased. The pad transmission lines 94 may have the function and role of the bonding pads 90 to be described later. Although not shown, when the line width of the pad transmission lines 94 is small, the bonding pads 90 may be connected to both ends of the pad loss lines 94.

7 is a plan view showing transmission lines 60 and bonding pads 90 between the optical element array block 80 and the integrated circuit chip 50 of Figs.

Referring to FIG. 7, bonding pads 90 may be disposed on the platform 70. The bonding pads 90 may include first bonding pads 92 and second bonding pads 94. The first bonding pads 92 may be disposed on the first sloped surface 72 of the platform 70. The second bonding pads 94 may be disposed on the upper bottom surface 78 of the platform 70. The transmission lines 60 may include first bonding wires 62, wire transmission lines 64, and second bonding wires 66. The first bonding wires 62 may be connected between the integrated circuit chip 50 and the first bonding paddle 92. The wiring transmission lines 64 may be connected between the first bonding pads 92 and the second bonding pads 94. The second bonding wires 66 may be connected between the second bonding pads 94 and the optical element array block 80. The integrated circuit chip 50 and the optical element array block 80 may include chip bonding pads 52 and device bonding pads 84, respectively. Chip bonding pads 52 and device bonding pads 84 may be connected to the first bonding wires 62 and the second bonding wires 66. Hereinafter, a detailed description of the chip bonding pads 52 and the element bonding pads 84 will be omitted. On the other hand, a modulation signal can be transmitted between the optical element array block 80 and the integrated circuit chip 50. The modulated signal can cause cross talk between the adjacent wiring transmission lines 64. [ The crosstalk can be increased or decreased according to the mutual relationship between the capacitance and the inductance of the wiring transmission lines 64. Can be closely related to the area of the line width of the wiring transmission lines (64). As the line width of the wiring transmission lines 64 is increased, the capacitance can be increased and the inductance can be reduced. On the other hand, if the line width of the wiring transmission lines 64 is reduced, the inductance can be increased and the capacitance can be reduced. In order to minimize the crosstalk, if the mutual distance, spacing, size, or linewidth of the bonding wires 60 and the bonding pads 90, respectively, as shown in Fig. 7 are appropriately adjusted, The multi-channel optical module can realize a low-pass filter characteristic having an arbitrary cutoff frequency without adding an electronic element such as a separate capacitor and an inductor. The low pass filter characteristics can be determined according to the layout structure of the bonding pads 90 wiring transmission lines 64 on the platform 70.

FIG. 8 shows the high frequency transmission characteristics for the transmission lines 60 of FIG. 6 and transmission lines 60 having the low-pass filter characteristic of FIG. 7, respectively. In the case of the transmission line 100 having the low-pass filter characteristic, the signal in the high-frequency region is removed, thereby effectively reducing the electric crosstalk between the adjacent transmission lines. The platform structure 100 according to an embodiment of the present invention can remove high frequency components from a modulated signal of 10 GHz or more. The general platform structure 200 can not remove high frequency components that appear periodically in modulated signals below about 100 GHz. The graphs of FIG. 8 are the intensity of the spectrum detected as an output by applying a 10 Gbps modulated signal to the input of the platform structure.

9 is a perspective view illustrating a multi-channel optical module according to a second application example of the present invention. The second application example has a plurality of guide pins 24 in the optical fiber array block 20 in the embodiment.

Referring to FIG. 9, the multichannel optical module according to the second embodiment of the present invention may include guide pins 24 coupled to alignment holes 22 of the optical fiber array block 20. The guide pins 24 may align the multi-channel optical module in a separate module coupled with the optical fiber array block 20. [

10 is a perspective view illustrating a multi-channel optical module according to a third application example of the present invention. In the third application example, the transmission chip 54 and the reception chip 56 are mounted on the printed circuit board 40 of the first application example for bidirectional transmission / reception.

10, a multi-channel optical module according to a third application example of the present invention may include a transmission chip 54 and a reception chip 56 mounted on a printed circuit board 40. [ For example, the transmitting chip 54 and the receiving chip 56 may be configured with four channels, respectively. The present invention is not limited to this, and the transmitting chip 54 and the receiving chip 56 may be composed of at least one channel. The transmitting chip 54 may be a laser diode driver. The receiving chip 56 may be an amplifying circuit.

11 is a perspective view illustrating a multi-channel optical module according to a fourth application example of the present invention. A fourth application example is that optical fibers 30 in the embodiment are replaced by optical fiber bundles 32 coupled in pigtail type.

Referring to FIG. 11, the multichannel optical module according to the fourth application example of the present invention may include a pigtail type optical fiber bundle 32. The optical fiber bundle 32 is a bundle of the optical fibers 30 in the embodiment. The optical fibers 30 may be combined in the optical fiber array block 20. [

12 is a perspective view illustrating a multi-channel optical module according to a fifth application example of the present invention. In the fifth application example, the third inclined plane 16 is formed on the base block 10 in the fourth application example.

12, a multi-channel optical module according to a fifth application example of the present invention may include a base block 10 having a third inclined plane 16 formed adjacent to a platform 70. [ The third inclined surface 16 may extend from the first inclined surface 72 of the platform 70 at the same inclination angle. The printed circuit board 40 and the integrated circuit chip 50 may be disposed on the third inclined plane 16. [ The third inclined plane 16 can minimize the length of the transmission line between the printed circuit board 40 and the optical element array block 80. [

A method of manufacturing the multi-channel optical module according to the embodiments of the present invention and the first to fifth application examples constructed as described above will now be described.

13 is a flow chart for explaining a method of manufacturing a multi-channel optical module according to an embodiment of the present invention.

Referring to FIGS. 1, 3, 7, and 13, bonding pads 90 and wiring transmission lines 64 are formed on a platform 70 (S10). The bonding pads 90 may include first bonding pads 92 on the first sloped surface 72 and second bonding pads 94 on the top surface 78. The wiring transmission lines 64 may be connected between the first bonding pads 92 and the second bonding pads 94 by a flip chip bonding device.

Next, the optical element array block 80 is mounted on the platform 70 (S20). The optical element array block 80 may be mounted on the upper bottom surface 78 of the platform 70. [ Although not shown, the optical element array blocks 80 may be aligned along an alignment mark on the top bottom surface 78 of the platform 70.

Next, the second bonding wires 66 are connected between the optical element array block 80 and the second bonding pads 94 (S30). The wiring lines 64 and the second bonding wires 66 may be connected to the optical element array block 80 and the second bonding pads 94 by wire bonding devices, respectively.

Next, the optical element array block 80 and the cores 34 of the optical fibers 30 are aligned, and the platform 70 and the optical fiber array block 20 are bonded (S40). The optical element array block 80 and the core 34 may be manually aligned by a flip chip bonding or die bonding apparatus. The core 34 may be aligned with the active area 82 of the optical element array block 80. The platform 70 and the optical fiber array block 20 may be bonded by an eutectic bonding method. The eutectic bonding method may be a metal deposition or a solder. In addition, the platform 70 and the optical fiber array block 20 can be bonded by an adhesive.

Then, the platform 70 and the optical fiber array block 20 are mounted in the cavity 12 of the base block 10 (S50). The platform 70 and the optical fiber array block 20 may be bonded in the cavity 12 by an adhesive.

Then, the printed circuit board 40 is fixed on the other side of the base block 10 (S60). The printed circuit board 40 and the base block 10 can be fixed by an adhesive.

Finally, the first bonding wires 62 are connected between the integrated circuit chip 50 and the first bonding pads 92 on the platform 70 (S70). The first bonding wires 62 may be connected to the integrated circuit chip 50 and the first bonding pads 92 by a wire bonding device.

It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is defined by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

10: base block 12: cavity
14: stop bars 16: third inclined surface
20: Optical fiber array block 22: Alignment hole
24: guide pins 30: optical fibers
32: optical fiber bundle 34: core
36: cladding 40: printed circuit board
50: integrated circuit chip 52: chip bonding pads
54: transmitting chip 56: receiving chip
60: bonding wires 62: first bonding wires
64: wiring transmission lines 66: second bonding wires
70: platform 71: bottom surface
72: first inclined surface 74: second inclined surface
76: upper surface 78: upper floor surface
80: optical element array block 82: optical element
84: Device bonding pads 90: Bonding pads
92: first bonding pads 94: second bonding pads
100: a platform structure according to an embodiment of the present invention (embodiment of the present invention, in which case electrical crosstalk can be reduced)
200: Another platform structure according to an embodiment of the present invention (the embodiment of the present invention is correct).

Claims (20)

A base block having a cavity at an edge of one side;
A printed circuit board disposed on the other side of the base block opposite to the cavity;
An integrated circuit chip mounted on the printed circuit board;
A platform disposed within the cavity;
Transmission lines connected to the integrated circuit chip and formed on the platform;
An optical element array block disposed in the platform and connected to the transmission lines;
A plurality of optical fiber cores arranged in the optical element array block; And
And an optical fiber array block fixed to the plurality of optical fiber cores and fixed to the platform and the optical element array block and fixed in the cavity. The method according to claim 1,
The platform comprises:
A bottom surface contacting a side wall of the cavity;
An upper surface from the bottom surface to the optical fiber array block;
A first inclined surface inclined between the upper surface and the bottom surface to minimize a step between the printed circuit board and the optical fiber array block;
An upper floor on which the optical element array block is mounted on the other side of the upper surface opposed to the first inclined surface; And
And a second inclined surface between the upper floor and the upper surface. 3. The method of claim 2,
And bonding pads on which the transmission lines are bonded on the platform. The method of claim 3,
The bonding pads,
First bonding pads disposed on the first inclined surface of the platform; And
And second bonding pads disposed on the top floor of the platform. 5. The method of claim 4,
The transmission lines include:
First bonding wires between the integrated circuit chip and the first bonding pads;
Wiring transmission lines between the first bonding pads and the second bonding pads; And
And second bonding wires between the second bonding pads and the optical element array block. 3. The method of claim 2,
The transmission lines include:
First bonding wires connected to the integrated circuit chip;
Pad transmission lines connected to the first bonding wires at the first inclined surface and extending from the first inclined surface to an upper bottom surface of the platform; And
And second bonding wires connecting the pad transmission lines and the optical element array block. The method according to claim 6,
Wherein the pad transmission lines contact the surfaces of the first inclined surface and the second inclined surface of the platform. 3. The method of claim 2,
And the base block has a third inclined surface adjacent to the cavity and extending from the first inclined surface. 9. The method of claim 8,
Wherein the printed circuit board is disposed on a third inclined surface of the base block. The method according to claim 1,
Wherein the optical element array block is in contact with a cavity sidewall of the base block and is disposed between the printed circuit board and the optical fiber array block without the platform. 11. The method of claim 10,
Wherein the optical element array block includes optical elements aligned with the optical fiber cores and has an inclined surface inclined from the printed circuit board on the base block to the optical elements in the cavity. 12. The method of claim 11,
Wherein the optical element array block further comprises the element pads connected to the optical elements. The method according to claim 1,
Wherein the optical elements comprise vertical surface emitting lasers or laser diodes. The method according to claim 1,
Wherein the base block has stop bars for aligning the printed circuit board on both sides of the cavity. The method according to claim 1,
Wherein the optical fiber array block has alignment holes formed in the edges of the optical fibers. 16. The method of claim 15,
And a plurality of guide pins coupled to the alignment holes. Forming transmission lines in the flat;
Mounting an optical element array block on a platform;
Coupling first bonding wires between the optical element array block and transmission lines on the platform;
Aligning the optical element array block and the optical fiber cores to bond the platform and the fiber array block;
Mounting the platform and the fiber block on a base block;
Fixing a printed circuit board on which the integrated circuit chip is mounted on the base block; And
And connecting second bonding wires between the transmission lines and the integrated circuit chip. 18. The method of claim 17,
Wherein the platform and the optical fiber array block are bonded by a elliptic bonding method. 18. The method of claim 17,
Wherein the transmission lines include pad transmission lines. 18. The method of claim 17,
The transmission lines include:
First pads connected to the first bonding wires;
Second pads connected to the second bonding wires; And
And wiring transmission lines connected between the first pads and the second pads.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9759878B2 (en) 2015-01-15 2017-09-12 Electronics And Telecommunications Research Institute Optical module
US10018791B2 (en) 2016-09-19 2018-07-10 Electronics And Telecommunications Research Institute Multi-channel optical subassembly and method of manufacturing the same
WO2019132076A1 (en) * 2017-12-28 2019-07-04 주식회사 옵텔라 Optical module having excellent thermal characteristics
WO2019132075A1 (en) * 2017-12-28 2019-07-04 주식회사 옵텔라 Optical module having enhanced luminance efficiency
CN112859238A (en) * 2021-02-09 2021-05-28 西安理工大学 Method and device for coupling optical fiber array and optical waveguide passive end face

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102219316B1 (en) * 2020-06-16 2021-02-24 주)일선 Optical transceiver apparatus having improved aligning function and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116960A (en) * 1999-10-14 2001-04-27 Sumitomo Electric Ind Ltd Substrate for optical module, light emitting module and light receiving module using it
KR20070023420A (en) * 2005-08-24 2007-02-28 (주) 파이오닉스 Optical transceiver module using silicon optical bench
KR100888080B1 (en) * 2008-04-22 2009-03-11 이화여자대학교 산학협력단 A method for manufacturing a micro-mirror array

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116960A (en) * 1999-10-14 2001-04-27 Sumitomo Electric Ind Ltd Substrate for optical module, light emitting module and light receiving module using it
KR20070023420A (en) * 2005-08-24 2007-02-28 (주) 파이오닉스 Optical transceiver module using silicon optical bench
KR100888080B1 (en) * 2008-04-22 2009-03-11 이화여자대학교 산학협력단 A method for manufacturing a micro-mirror array

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9759878B2 (en) 2015-01-15 2017-09-12 Electronics And Telecommunications Research Institute Optical module
US10018791B2 (en) 2016-09-19 2018-07-10 Electronics And Telecommunications Research Institute Multi-channel optical subassembly and method of manufacturing the same
WO2019132076A1 (en) * 2017-12-28 2019-07-04 주식회사 옵텔라 Optical module having excellent thermal characteristics
WO2019132075A1 (en) * 2017-12-28 2019-07-04 주식회사 옵텔라 Optical module having enhanced luminance efficiency
CN112859238A (en) * 2021-02-09 2021-05-28 西安理工大学 Method and device for coupling optical fiber array and optical waveguide passive end face
CN112859238B (en) * 2021-02-09 2022-11-29 西安理工大学 Method and device for coupling optical fiber array and optical waveguide passive end face

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