KR102037896B1 - Multi-channel optical module and manufacturing method of the same - Google Patents

Multi-channel optical module and manufacturing method of the same Download PDF

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Publication number
KR102037896B1
KR102037896B1 KR1020130071408A KR20130071408A KR102037896B1 KR 102037896 B1 KR102037896 B1 KR 102037896B1 KR 1020130071408 A KR1020130071408 A KR 1020130071408A KR 20130071408 A KR20130071408 A KR 20130071408A KR 102037896 B1 KR102037896 B1 KR 102037896B1
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KR
South Korea
Prior art keywords
array block
optical
platform
optical fiber
cavity
Prior art date
Application number
KR1020130071408A
Other languages
Korean (ko)
Other versions
KR20140066636A (en
Inventor
임권섭
Original Assignee
한국전자통신연구원
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Application filed by 한국전자통신연구원 filed Critical 한국전자통신연구원
Priority to US14/066,034 priority Critical patent/US9250404B2/en
Publication of KR20140066636A publication Critical patent/KR20140066636A/en
Application granted granted Critical
Publication of KR102037896B1 publication Critical patent/KR102037896B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail

Abstract

The present invention discloses a multichannel optical module and a method of manufacturing the same. The optical module includes a base block having a cavity at one edge, a printed circuit board disposed on the other side of the base block opposite to the cavity, an integrated circuit chip mounted on the printed circuit board, Transmission lines connected to an integrated circuit chip, a platform disposed in the cavity, an optical element array block disposed in the platform and connected to the transmission lines, and a plurality of optical fiber cores aligned with the optical element array block. And an optical fiber array block fixing the plurality of optical fiber cores and bonded to the platform and the optical element array block and fixed in the cavity.

Description

MULTI-CHANNEL OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME

The present invention relates to an optical communication system and a method for manufacturing the same, and more particularly, to a multi-channel optical module capable of transmitting and receiving light for data transmission and a method for manufacturing the same.

Recently, active optical cables (AOCs) such as high-definition multimedia interface (HDMI), DisplayPort, and digital visual interface (DVI), which have increased in demand, have a single optical fiber for A / V data transmission. At least four channels are required that can focus more than one wavelength.

 In addition, electrical connections are already limited in common chips and chips (Chip-to-Chip), boards and boards (B? OB?), Boards and systems, and systems and systems. The demand for multichannel optical modules for transmission continues to increase.

A typical multichannel optical module may include a fiber block with many precision injection moldings and guide pins with special shapes. In the case of injection molding, it is a time-consuming and costly process for accurate tolerance control, especially when using a single mode fiber with a core size of about 8um and controlling the final tolerance between the fiber and the optical element within a fewum. I have a problem.

Another multichannel optical module has a structure for optically coupling an optical element array block having a lens module including a mirror that is converted into the same 90 degree optical path, and an optical fiber array. The process of aligning between the optical fiber and the mirror, between the mirror and the lens, or between the lens and the optical element is indispensable. Therefore, the general multi-channel optical module has a disadvantage in that the optical coupling efficiency between the final optical fiber and the optical device is not good, and many parts such as a mirror, a lens and a support mechanism, and a spacer for securing a space for optical coupling are used.

Another multichannel optical module may include a fiber array block having guide holes and guide pins in a silicon wafer. In the case where the optical element and the optical fiber are connected by the manual alignment method, the through hole must be formed in a precise position in the silicon wafer. In the multi-channel optical module, it is very difficult to manufacture the guide pin and the fiber array block including the same, and there is a problem in that cracks may occur in the silicon mount due to contact with the guide pin. In addition, in the case of a multi-channel optical module, there is a problem in that electrical performance is deteriorated due to electrical crosstalk between transmission lines between adjacent channels.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a multichannel module having a simple structure and easy processing, and a method of manufacturing the same.

In addition, another technical problem of the present invention is to provide a multi-channel optical module and a method for manufacturing the same, which is easy to packaging process and manual alignment method.

In addition, another technical problem of the present invention is to provide a multi-channel optical module and a manufacturing method thereof that can improve the productivity.

Multichannel optical module according to an embodiment of the present invention, the base block having a cavity on one side edge; A printed circuit board disposed on the other side of the base block opposite to the cavity; An integrated circuit chip mounted on the printed circuit board; A platform disposed within the cavity; Transmission lines connected to the integrated circuit chip and formed on the platform; An optical element array block disposed in the platform and connected to the transmission lines; A plurality of optical fiber cores arranged in the optical element array block; And an optical fiber array block fixed to the plurality of optical fiber cores and bonded to the platform and the optical element array block and fixed in the cavity.

According to one embodiment of the invention, the platform, the bottom surface in contact with the side wall of the cavity; An upper surface from the bottom surface to the optical fiber array block; A first inclined surface inclined between the upper surface and the bottom surface to minimize the step between the printed circuit board and the optical fiber array block; An upper bottom surface on which the optical element array block is mounted on the other side of the upper surface opposite to the first inclined surface; And a second sloped surface between the upper bottom surface and the upper surface.

According to another embodiment of the present invention, the transmission lines may further include bonding pads bonded to the platform.

According to an embodiment of the present disclosure, the bonding pads may include first bonding pads disposed on the first inclined surface of the platform; And second bonding pads disposed on the upper bottom surface of the platform.

According to another exemplary embodiment of the present disclosure, the transmission lines may include: first bonding wires between the integrated circuit chip and the first bonding pads; Wiring transmission lines between the first bonding pads and the second bonding pads; And second bonding wires between the second bonding pads and the optical device array block.

According to an embodiment of the present disclosure, the transmission lines may include: first bonding wires connected to the integrated circuit chip; Pad transmission lines connected to the first bonding wires on the first inclined surface and extending from the first inclined surface to the upper bottom surface of the platform; And second bonding wires connecting the pad transmission lines and the optical element array block.

According to another embodiment of the present disclosure, the pad transmission lines may be in contact with surfaces of the first inclined surface and the second inclined surface of the platform.

According to an embodiment of the present disclosure, the base block may have a third inclined surface adjacent to the cavity and extending from the first inclined surface.

According to another embodiment of the present invention, the printed circuit board may be disposed on the third inclined surface of the base block.

According to an embodiment of the present disclosure, the optical element array block may contact the cavity sidewall of the base block and may be disposed between the printed circuit board and the optical fiber array block without the platform.

According to another embodiment of the present invention, the optical element array block includes optical elements aligned with the optical fiber cores, and the inclined surface inclined from the printed circuit board on the base block to the photons in the cavity. Can have

According to an embodiment of the present disclosure, the optical device array block may further include the device pads connected to the optical devices.

According to another embodiment of the present invention, the optical devices may include a vertical surface emitting laser or a laser diode.

According to an embodiment of the present disclosure, the base block may have stop bars that align the printed circuit board at both sides of the cavity.

According to another embodiment of the present disclosure, the optical fiber array block may have alignment holes formed at edges of the optical fibers.

According to an embodiment of the present disclosure, the guide pins may be further included in the alignment holes.

According to another aspect of the present invention, there is provided a method of manufacturing a multichannel optical module, including: forming transmission lines on a flat; Mounting an optical element array block on the platform; Connecting first bonding wires between the optical element array block and the transmission lines on the platform; Aligning the optical element array block and the optical fiber cores to bond the platform and the fiber array block; Mounting the platform and the fiber block on a base block; Fixing a printed circuit board to mount an integrated circuit chip on the base block; And connecting wire transmission paths between the transmission line pad and the integrated circuit chip.

According to an embodiment of the present disclosure, the platform and the optical fiber array block may be bonded by a eutectic bonding method.

According to another embodiment of the present invention, the transmission lines may include pad transmission lines.

The transmission lines may include first pads connected to the first bonding wires; Second pads connected to the second bonding wires; And wire transmission lines connected between the first pads and the second pads.

The multi-channel optical module according to an embodiment of the present invention may include a base block, an optical fiber array block, optical fibers, a printed circuit board, an integrated circuit chip, bonding wires, a platform, and an optical element array block. The optical fiber array block can fix the optical fibers. The platform may secure the optical element array block. The optical fibers and the optical element array block may be manually aligned by flip chip bonding or die bonding apparatus. The optical fiber array block and the platform may be bonded. Bonding wires may connect an optical element array block and an integrated circuit chip. Bonding pads may be disposed on the platform. Bonding pads may be connected to bonding wires. When the mutual distance, spacing, line width, or size of each of the bonding pads and the bonding wires is properly adjusted, low pass filter characteristics can be realized without the addition of a separate optical device, thereby reducing electrical crosstalk.

Therefore, the multi-channel optical module according to an embodiment of the present invention can be mass-produced using a manual optical alignment method and a surface mounting technique. In addition, it does not use expensive optical components such as micro lens array, the structure is simple, and the number of parts can be reduced and the cost can be reduced.

1 is a perspective view showing a multi-channel optical module according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating the base block of FIG. 1. FIG.
3 is a view showing the optical fiber array block and platform of FIG. 1 separately.
4 is a perspective view illustrating the optical fibers and the optical element array block of FIG. 3 in more detail.
5 is an exploded perspective view illustrating an optical fiber array block and an optical device array block of FIG. 3 according to a first application example of the present invention.
6 illustrates a transmission line between the optical element array block and the integrated circuit chip of FIGS. 3 and 4.
7 is a plan view illustrating bonding wires and bonding pads between the optical device array block and the integrated circuit chip of FIGS. 3 and 4.
8 is a graph illustrating a comparison between a platform structure according to an embodiment of the present invention and a high frequency elimination characteristic in a general platform structure.
9 is a perspective view illustrating a multichannel optical module according to a second application example of the present invention.
10 is a perspective view illustrating a multichannel optical module according to a third application example of the present invention.
11 is a perspective view illustrating a multi-channel optical module according to a fourth application example of the present invention.
12 is a perspective view illustrating a multichannel optical module according to a fifth application example of the present invention.
13 is a flowchart illustrating a method of manufacturing a multichannel optical module according to an exemplary embodiment of the present invention.

Both the foregoing general description and the following detailed description are exemplary in order to provide further explanation of the claimed invention. Therefore, the present invention is not limited to the embodiments described herein and may be embodied in other forms. The embodiments introduced herein are provided to ensure that the disclosed contents are thorough and complete, and that the spirit of the present invention can be sufficiently delivered to those skilled in the art.

In the present specification, when a part is mentioned to include a certain component, it means that it may further include other components. In addition, each embodiment described and illustrated herein also includes a complementary embodiment thereof. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a multi-channel optical module according to an embodiment of the present invention. 2 is a perspective view illustrating the base block 10 of FIG. 1.

1 and 2, the multi-channel optical module 100 according to the embodiment of the present invention includes a base block 10, an optical fiber array block 20, optical fibers 30, and a printed circuit board ( 40, the integrated circuit chip 50, the transmission lines 60, and the platform 70.

The base block 10 may support the optical fiber array block 20 and the printed circuit board 40. Both edges of the base block 10 may have different heights. According to an embodiment, the optical fiber array block 20 is disposed at one edge of the base block 10. The printed circuit board 40 is disposed on the other edge of the base block 10.

The optical fiber array block 20 may be lower than the printed circuit board 40 on the base block 10. Base block 10 may have a cavity 12. The optical fiber array block 20 may be inserted into the cavity 12. In addition, the platform 70 may be mounted in the cavity 12. The cavity 12 may fix the optical fiber array block 20. The platform 70 may have a first inclined surface 72. The base block 10 may be provided with stop bars 14 at both upper ends of the cavity 12. The stop bars 14 may align the printed circuit board 40. The printed circuit board 40 may be disposed adjacent to the cavity 12. The optical fiber array block 20 and the printed circuit board 40 on the base block 10 may be parallel to each other on the base block 10.

The optical fiber array block 20 may fix the plurality of optical fibers 30. The optical fiber array block 20 may have an alignment hole 22 formed in parallel with the optical fibers 30. The optical fiber array block 20 may be connected to an external optical element or optical device.

The printed circuit board 40 may mount the integrated circuit chip 50. The integrated circuit chip 50 may include an amplifier, a modulator, or an optical device driving circuit. The integrated circuit chip 50 may be disposed on the printed circuit board 40 of the platform 70 and the base block 10. The printed circuit board 40 may include a flexible printed circuit board or a flat printed circuit board.

One end of the transmission line 60 is connected to the integrated circuit chip 50. The other end of the transmission line 60 is connected to the electrode pad 84 of the optical element array block 80 mounted on the platform 70. The platform 70 and the optical fiber array block 20 can be fixed to each other by bonding. have.

In the multi-channel optical module according to an embodiment of the present invention, the optical path is minimized by using an optical component such as a lens by changing the electrical path vertically (90 °) without changing the optical path vertically (90 °). ) And the optical fiber 30 can be manually aligned.

3 is a view showing the optical fiber array block 20 and platform 70 of FIG. 1 separately. 4 is a perspective view illustrating the optical fibers 30 and the optical element array block 80 of FIG. 3 in more detail.

1, 3, and 4, an optical device array block 80 may be disposed between the optical fiber array block 20 and the platform 70. The platform 70 may fix the optical element array block 80. The platform 70 may have a bottom surface 71, an upper surface 76, a first inclined surface 72, an upper bottom surface 78, and a second inclined surface 74. The bottom surface 71 may contact the side walls of the cavity. The upper surface 76 may have a height from the bottom surface 71 to the optical fiber array block 20. The first inclined surface 72 is a surface inclined between the top surface 76 and the bottom surface 71. The first inclined surface 72 may minimize the step between the printed circuit board 40 and the optical fiber array block 20. The upper bottom surface 78 is a surface on which the optical element array block 80 is mounted on the other side of the upper surface 76 opposite to the first inclined surface 72. The second inclined surface 74 is a surface inclined between the upper bottom surface 78 and the upper surface 76.

The optical device array block 80 may include a plurality of photons 82 and device bonding pads 84. The device bonding pads 84 are electrically connected to the optical devices 82. The device bonding pads 84 may be connected to the transmission line 60. The photons 82 may include a resin surface emitting laser (VCSEL) or a laser diode (LD). The optical fibers 30 may include a core 34 and a cladding 36. The core 34 may have a diameter of about 8 μm to 100 μm. The optical element array block 80 may be aligned to the core 34 of the optical fibers 30. Therefore, the optical device array block 80 and the optical fibers 30 may be fixed by the bonding of the platform 70 and the optical fiber array block 20. 5 is an exploded perspective view illustrating the optical fiber array block 20 and the optical device array block 80 of FIG. 3 according to the first application example of the present invention. In the first application example, the platform 70 in the first embodiment is replaced with the optical element array block 80.

Referring to FIG. 5, the optical device array block 80 according to the first application example of the present invention may have a first inclined surface 72. The transmission line 60 may extend along the first inclined surface 72. In addition, the transmission line 60 may be directly connected to the electrode pad 84 on the optical element array block 80. The optical element array block 80 and the optical fiber array block 20 may be connected. The optical fiber 30 and the optical element 82 may be aligned. When the optical element array block 80 having the first inclined surface 72 and the transmission line formed on the first inclined surface 72 is used, the platform 70 may not be used.

FIG. 6 shows transmission lines 60 between the photonic device array block 80 of FIG. 3 and FIG. 4 and the chip 50 between the integrated circuit chip 50. The first transmission lines 60 are shown in FIG. The optical device array block 80, integrated circuit bonding wires 62, pad transmission lines 94, and second bonding wires 66 may be included. The first bonding wires 62 may be connected between the chip bonding pads 52 and the pad transmission lines 94. The second bonding wires 66 may be connected between the device bonding pads 84 and the pad transmission lines 94. Pad transmission lines 94 may be disposed on platform 70.

 The pad transmission lines 94 may extend from the first inclined surface 72 of the platform 70 to the upper bottom surface 78. The pad transmission lines 94 may be in contact with the surface of the optical element array block 80. If the area of the pad transmission lines 94 is increased, their parasitic capacitance may be increased. The pad transmission lines 94 may have a function and role of the bonding pads 90 to be described later. Although not shown, when the line widths of the pad transmission lines 94 are small, bonding pads 90 may be connected to both ends of the pad loss lines 94.

FIG. 7 is a plan view illustrating the transmission lines 60 and the bonding pads 90 between the optical element array block 80 and the integrated circuit chip 50 of FIGS. 3 and 4.

Referring to FIG. 7, bonding pads 90 may be disposed on the platform 70. The bonding pads 90 may include first bonding pads 92 and second bonding pads 94. The first bonding pads 92 may be disposed on the first inclined surface 72 of the platform 70. The second bonding pads 94 may be disposed on the upper bottom surface 78 of the platform 70. The transmission lines 60 may include first bonding wires 62, wire transmission lines 64, and second bonding wires 66. The first bonding wires 62 may be connected between the integrated circuit chip 50 and the first bonding paddle 92. The wire transmission lines 64 may be connected between the first bonding pads 92 and the second bonding pads 94. The second bonding wires 66 may be connected between the second bonding pads 94 and the optical device array block 80. The integrated circuit chip 50 and the optical device array block 80 may include chip bonding pads 52 and device bonding pads 84, respectively. The chip bonding pads 52 and the device bonding pads 84 may be connected to the first bonding wires 62 and the second bonding wires 66. Hereinafter, detailed descriptions of the chip bonding pads 52 and the device bonding pads 84 will be omitted. Meanwhile, a modulation signal may be transmitted between the optical element array block 80 and the integrated circuit chip 50. The modulated signal may cause cross talk between adjacent wire transmission lines 64. Crosstalk may be increased or decreased depending on the mutual relationship between the capacitance of the wire transmission lines 64 and the inductance. It may have a close relationship with the area of the line width of the wire transmission lines 64. If the line width of the wire transmission lines 64 is increased, the capacitance may be increased and the inductance may be reduced. On the other hand, if the line width of the wire transmission lines 64 is reduced, the inductance may be increased and the capacitance may be reduced. In order to minimize crosstalk, when the mutual distance, spacing, size, or line width of each of the bonding wires 60 and the bonding pads 90 is properly adjusted, as shown in FIG. 7, according to an embodiment of the present invention, The multi-channel optical module can realize a low pass filter having an arbitrary cutoff frequency without additional electronic components such as a capacitor and an inductor. The low pass filter characteristic may be determined according to the arrangement of the bonding pads 90 wire transmission lines 64 on the platform 70.

FIG. 8 illustrates high frequency transmission characteristics of each of the transmission lines 60 of FIG. 6 and transmission lines 60 having the low pass filter of FIG. 7. The transmission line 100 having the low pass filter has an advantage of effectively reducing electrical crosstalk between adjacent transmission lines by removing signals in a high frequency region. The platform structure 100 according to an embodiment of the present invention may remove high frequency components from a modulated signal of 10 GHz or more. The general platform structure 200 cannot remove high frequency components that appear periodically in modulated signals of about 100 GHz or less. The graphs of FIG. 8 show the intensity of the spectrum detected at the output by applying a 10 Gbps modulated signal to the input of the platform structure.

9 is a perspective view illustrating a multichannel optical module according to a second application example of the present invention. The second application is provided with a plurality of guide pins 24 in the optical fiber array block 20 in the embodiment.

Referring to FIG. 9, the multichannel optical module according to the second application example may include guide pins 24 coupled to alignment holes 22 of the optical fiber array block 20. The guide pins 24 may align the multichannel optical module to a separate module coupled to the optical fiber array block 20.

10 is a perspective view illustrating a multichannel optical module according to a third application example of the present invention. In a third application example, a transmission chip 54 and a reception chip 56 are mounted on a printed circuit board 40 of the first application for bidirectional transmission and reception.

Referring to FIG. 10, a multi-channel optical module according to a third application example of the present invention may include a transmission chip 54 and a reception chip 56 mounted on a printed circuit board 40. For example, the transmission chip 54 and the reception chip 56 may be configured as four channels, respectively. The present invention is not limited thereto, and the transmitting chip 54 and the receiving chip 56 may include at least one channel. The transmission chip 54 may be a laser diode driver. The receiving chip 56 may be an amplifying circuit.

11 is a perspective view illustrating a multi-channel optical module according to a fourth application example of the present invention. The fourth application is that the optical fibers 30 in the embodiment have been replaced with an optical fiber bundle 32 coupled in a pigtail type.

Referring to FIG. 11, the multi-channel optical module according to the fourth application of the present invention may include a pigtail type optical fiber bundle 32. The optical fiber bundle 32 is a combination of optical fibers 30 in one embodiment. The optical fibers 30 may be combined in the optical fiber array block 20.

12 is a perspective view illustrating a multichannel optical module according to a fifth application example of the present invention. In the fifth application example, the third inclined surface 16 is formed on the base block 10 in the fourth application example.

Referring to FIG. 12, the multichannel optical module according to the fifth application example may include a base block 10 having a third inclined surface 16 formed adjacent to the platform 70. The third inclined surface 16 may extend from the first inclined surface 72 of the platform 70 at the same inclined angle. The printed circuit board 40 and the integrated circuit chip 50 may be disposed on the third inclined surface 16. The third inclined surface 16 may minimize the length of the transmission line between the printed circuit board 40 and the optical element array block 80.

Referring to the embodiment of the present invention configured as described above, the manufacturing method of the multi-channel optical module according to the first to fifth applications.

13 is a flowchart illustrating a method of manufacturing a multichannel optical module according to an exemplary embodiment of the present invention.

1, 3, 7, and 13, bonding pads 90 and wire transmission lines 64 are formed on the platform 70 (S10). The bonding pads 90 may include first bonding pads 92 on the first inclined surface 72 and second bonding pads 94 on the upper bottom surface 78. The wire transmission lines 64 may be connected between the first bonding pads 92 and the second bonding pads 94 by a flip chip bonding device.

Next, the optical device array block 80 is mounted on the platform 70 (S20). The optical device array block 80 may be mounted on the upper bottom surface 78 of the platform 70. Although not shown, the photonic array blocks 80 may be aligned along an alignment mark on the upper bottom surface 78 of the platform 70.

Next, second bonding wires 66 are connected between the optical device array block 80 and the second bonding pads 94 (S30). The second bonding wires 66 may be connected to the optical element array block 80 and the second bonding pads 94 by wire bonding devices.

Next, the optical element array block 80 and the cores 34 of the optical fibers 30 are aligned, and the platform 70 and the optical fiber array block 20 are bonded (S40). The optical element array block 80 and the core 34 may be manually aligned by flip chip bonding or die bonding apparatus. The core 34 may be aligned with the active region 82 of the optical element array block 80. The platform 70 and the optical fiber array block 20 may be bonded by an eutectic bonding method. Eutectic bonding methods may use metal deposits or solder. In addition, the platform 70 and the optical fiber array block 20 may be bonded by an adhesive.

Thereafter, the platform 70 and the optical fiber array block 20 are mounted in the cavity 12 of the base block 10 (S50). The platform 70 and the optical fiber array block 20 may be bonded in the cavity 12 by an adhesive.

Then, the printed circuit board 40 is fixed on the other side of the base block 10 (S60). The printed circuit board 40 and the base block 10 may be fixed by an adhesive.

Finally, the first bonding wires 62 are connected between the integrated circuit chip 50 and the first bonding pads 92 on the platform 70 (S70). The first bonding wires 62 may be connected to the integrated circuit chip 50 and the first bonding pads 92 by a wire bonding device.

Those skilled in the art will understand that the present invention can be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

10: base block 12: cavity
14: stop bars 16: third slope
20: optical fiber array block 22: alignment hole
24: guide pins 30: optical fibers
32: optical fiber bundle 34: core
36: cladding 40: printed circuit board
50: integrated circuit chip 52: chip bonding pads
54: transmit chip 56: receive chip
60: bonding wires 62: first bonding wires
64: wiring transmission lines 66: second bonding wires
70: platform 71: bottom
72: first inclined plane 74: second inclined plane
76: top surface 78: top bottom surface
80: optical element array block 82: optical element
84: device bonding pads 90: bonding pads
92: first bonding pads 94: second bonding pads
100: platform structure according to an embodiment of the present invention (an embodiment of the present invention, in this case can reduce electrical crosstalk)
200: Another platform structure according to an embodiment of the present invention (an embodiment of the present invention is correct).

Claims (20)

A base block having a cavity at one edge thereof;
A printed circuit board disposed on the other side of the base block opposite to the cavity;
An integrated circuit chip mounted on the printed circuit board;
A platform disposed within the cavity;
Transmission lines connected to the integrated circuit chip and formed on the platform;
An optical element array block disposed in the platform and connected to the transmission lines;
A plurality of optical fiber cores arranged in the optical element array block; And
An optical fiber array block fixing the plurality of optical fiber cores and bonded to the platform and the optical element array block and fixed in the cavity,
The platform is:
A bottom surface in contact with the sidewall of the cavity;
An upper surface from the bottom surface to the optical fiber array block;
A first inclined surface inclined between the upper surface and the bottom surface to minimize the step between the printed circuit board and the optical fiber array block;
An upper bottom surface on which the optical element array block is mounted on the other side of the upper surface opposite to the first inclined surface; And
And a second sloped surface between the top bottom surface and the top surface. delete The method of claim 1,
And a bonding pad to which the transmission lines are bonded on the platform. The method of claim 3, wherein
The bonding pads,
First bonding pads disposed on the first inclined surface of the platform; And
And a second bonding pads disposed on the upper bottom surface of the platform. The method of claim 4, wherein
The transmission line,
First bonding wires between the integrated circuit chip and the first bonding pads;
Wiring transmission lines between the first bonding pads and the second bonding pads; And
And a second bonding wire between the second bonding pads and the optical element array block. The method of claim 1,
The transmission line,
First bonding wires connected to the integrated circuit chip;
Pad transmission lines connected to the first bonding wires on the first inclined surface and extending from the first inclined surface to the upper bottom surface of the platform; And
And a second bonding wire connecting the pad transmission lines and the optical element array block. The method of claim 6,
And the pad transmission lines are in contact with surfaces of the first and second inclined surfaces of the platform. The method of claim 1,
And the base block has a third inclined surface adjacent to the cavity and extending from the first inclined surface. The method of claim 8,
The printed circuit board is a multi-channel optical module disposed on the third inclined surface of the base block. The method of claim 1,
And the optical element array block is in contact with the cavity sidewall of the base block and is disposed between the printed circuit board and the optical fiber array block without the platform. The method of claim 10,
And the optical element array block includes optical elements aligned with the optical fiber cores, the optical element array block having an inclined surface inclined from the printed circuit board on the base block to the photons in the cavity. The method of claim 11,
The optical device array block further comprises device pads connected to the optical devices. The method of claim 1,
The optical devices comprise a multi-channel optical module comprising a vertical surface emitting laser or a laser diode. The method of claim 1,
The base block has a multi-channel optical module having stop bars to align the printed circuit board on both sides of the cavity. The method of claim 1,
And the optical fiber array block has alignment holes formed at edges of the optical fibers. The method of claim 15,
And a guide pin coupled to the alignment hole. delete delete delete delete
KR1020130071408A 2012-11-23 2013-06-21 Multi-channel optical module and manufacturing method of the same KR102037896B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021256752A1 (en) * 2020-06-16 2021-12-23 주식회사 일선 Optical transceiver with improved optical alignment function and manufacturing method therefor

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102328312B1 (en) 2015-01-15 2021-11-19 한국전자통신연구원 Optical module
KR102015132B1 (en) 2016-09-19 2019-08-27 한국전자통신연구원 Multi-channel optical sub assembly and manufacturing method of the same
WO2019132075A1 (en) * 2017-12-28 2019-07-04 주식회사 옵텔라 Optical module having enhanced luminance efficiency
KR102031651B1 (en) * 2017-12-28 2019-10-14 주식회사 옵텔라 Optical Module
CN112859238B (en) * 2021-02-09 2022-11-29 西安理工大学 Method and device for coupling optical fiber array and optical waveguide passive end face

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116960A (en) * 1999-10-14 2001-04-27 Sumitomo Electric Ind Ltd Substrate for optical module, light emitting module and light receiving module using it
KR100888080B1 (en) * 2008-04-22 2009-03-11 이화여자대학교 산학협력단 A method for manufacturing a micro-mirror array

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070023420A (en) * 2005-08-24 2007-02-28 (주) 파이오닉스 Optical transceiver module using silicon optical bench

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116960A (en) * 1999-10-14 2001-04-27 Sumitomo Electric Ind Ltd Substrate for optical module, light emitting module and light receiving module using it
KR100888080B1 (en) * 2008-04-22 2009-03-11 이화여자대학교 산학협력단 A method for manufacturing a micro-mirror array

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021256752A1 (en) * 2020-06-16 2021-12-23 주식회사 일선 Optical transceiver with improved optical alignment function and manufacturing method therefor

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