KR20140060043A - Chip collecting apparatus for welding-tip dressing machine - Google Patents

Abstract

The technical objective of the present invention is to provide a chip collecting device for a welding-tip dressing machine that can collect tips scattered from a welding-tip dressing machine. For the purpose, the chip collecting device for a welding-tip dressing machine according to the present invention collects chips scattered in two directions if a first and a second welding-tip is cut by the first and second cutters of the cutter part of the welding-tip dressing machine respectively. The chip collecting device for a welding-tip dressing machine comprises: a scattering preventing part for accommodating the cutter part and preventing the bidirectional scattering of the chips; a gathering part for gathering the chips by intercommunicating with the scattering preventing part; and a pump part for flowing air from the scattering preventing part to the gathering part to move the chips from the scattering preventing part to the gathering part.

Description

Technical Field [0001] The present invention relates to a chip picking apparatus for a dressing machine,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip collecting apparatus used in a tip dressing machine, which is a machine for cutting a welding tip such as a spot welder.

Generally, in a spot welding machine, a welding tip formed on the upper and lower sides of a welding gun presses the base material on the upper and lower sides of the base material to conduct electricity, thereby performing electric resistance welding.

Specifically, as shown in Fig. 1, the spot welder is provided with a base material 8 (a state in which the plate members are superimposed on each other) to be welded to each other between the first and second welding tips 2 And the upper and lower surfaces of the base material 8 are pressed, instantaneous strong sparks are generated and the base material 8 is joined by the electric resistance welding.

Such electric resistance welding is given as an initial input condition such as current, resistance, energization time and the like. In particular, the electrical resistance is greatly affected by the contact sectional areas of the first and second welding tips 2, 4. Further, the first and second welding tips 2 and 4 are slightly worn each time welding is performed.

Thus, in order to keep the respective contact surfaces of the first and second welding tips 2, 4 at a desired size, Korean Patent Laid-Open No. 10-2010-0025092 discloses a spot welder W A welding tip dressing machine D is installed on one side of the first and second welding tips 2 and 4 to secure a contact surface of a desired standard.

2, the welding tip dressing machine D disclosed in Korean Patent Laid-Open No. 10-2010-0025092 comprises a motor 21 mounted on a fixing bracket 20, a motor 21, And a cutter unit 60 having first and second cutters for receiving the rotational force from the first and second welding tips 2 and 4 and cutting the first and second welding tips 2 and 4, respectively. In particular, the cutter portion 60 has a shape protruding outward so as not to interfere with the fixing bracket 20 when the first and second welding tips 2, 4 are positioned there.

However, since the conventional welding tip dressing machine does not have a separate chip collecting device, a problem is that a chip cut out from the first and second welding tips 2 and 4 is scattered to the outside as it is .

Particularly, the chips of the first and second welding tips 2 and 4 made of expensive copper material are discarded as they are, resulting in waste of specifications. In addition, there is a problem that the chip is scattered and is put into the equipment, causing a failure of the equipment and causing malfunction of the electric device.

A technical object of the present invention is to provide a chip collection apparatus for a welding tip dresser capable of collecting chips scattered from a welding tip dresser.

In order to accomplish the above object, according to an embodiment of the present invention, when the first and second welding tips are respectively cut by the first and second cutters of the cutter portion of the welding tip dresser, A scattering prevention part for receiving the cutter part and preventing bi-directional scattering of the chip; A collecting portion communicating with the scattering prevention portion to collect the chips; And a pump unit for applying a flow of air from the scattering prevention unit to the collecting unit such that the chips are moved from the scattering prevention unit to the collecting unit.

The shatterproofing portion may include a hollow shatterproofing barrel which forms an exterior of the shatterproofing portion. A storage chamber partitioned by the first and second partition walls to receive the cutter portion; A first shatterproof chamber partitioned between the first partition and a first opposing surface of the shatterproofing barrel facing the first partition; And a second shudder prevention chamber partitioned between the second partition and a second opposing surface of the shatterproofing barrel facing the second partition.

Wherein the scattering prevention portion includes first and second inlet and outlet holes formed in the first opposing face and the first partition to guide the first welding tip into and out of the first cutter; And third and fourth inlet / outlet holes formed in the second opposing surface and the second partition to guide the inlet / outlet of the second welding tip into / from the second cutter.

The shatterproof portion may further include a reinforcing plate provided on each surface of the shatterproof preventing bar that faces the first and second welding tips.

The shatterproof portion may further include a hard film provided on the inner surfaces of the first and second shatterproof chambers.

Wherein the collecting part includes: a collecting part communicating with the first and second shake-prevention chambers to gather chips of the first and second shake-prevention chambers; And a collecting container communicating with the collecting portion and collecting the chips finally.

Wherein the collecting portion includes a hollow collecting container communicating with the first and second shake preventing chambers; And a connection pipe connected between the collecting passage and the collecting cistern.

And the flange may be provided at each of the opposite ends of the shatterproofing passageway collecting cylinder so that the shatterproofing passageway collecting cylinder is flanged to each other.

For example, the pump unit may be an air injection type, and may include a distributor communicating with the first and second shatterproof chambers; And a pump for injecting air into the distributor.

The distributor includes first and second branch tubes provided on one surface of the first branch tube and the second branch tube, respectively, so as to communicate with the first and second non- And one docking tube provided on the other surface.

The pump unit may further include a connection hose connected between the distributor and the pump.

The water collecting part may further include an air outlet formed in the collection container.

As another example, the pump unit may be an air suction type pump connected to the water collection tank and sucking air. And a filter provided between the collection tube and the pump to prevent the chip from being moved to the pump.

The scattering prevention unit may further include first and second air intake openings formed in the first and second scattering prevention chambers, respectively.

As described above, the chip collecting apparatus for a welding tip dresser according to the embodiment of the present invention can have the following effects.

According to the embodiment of the present invention, the chips scattered in both directions from the first and second cutters of the cutter portion of the welding tip dresser can be collected by including the scattering prevention portion, the collecting portion, and the pump portion, The chip can be reused and the chip can not be scattered by the equipment or the electric device, so that the fixing cause can be prevented in advance.

1 is a schematic view showing a state where a base material is welded by first and second welding tips of a general spot welding machine.
2 is a perspective view schematically showing a state in which a spot welder is placed on a conventional welding tip dressing machine.
3 is a perspective view schematically showing a chip collecting apparatus for a welding tip dresser according to an embodiment of the present invention.
4 is a cross-sectional view taken on line IV-IV of the chip collecting device for a welding tip dresser of FIG.
5 is an exploded perspective view showing a state in which the chip collection device for the welding tip dresser of FIG. 3 is mounted on the welding tip dresser.
6 is an assembled perspective view showing a state where the chip collection device for the welding tip dresser of FIG. 3 is mounted on the welding tip dresser.
7 is a schematic view illustrating a process of collecting chips by the chip collecting apparatus for a welding tip dresser according to an embodiment of the present invention.
8 is a cross-sectional view schematically showing a chip collecting apparatus for a welding tip dresser according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

FIG. 3 is a perspective view schematically showing a chip collecting apparatus for a welding tip dresser according to an embodiment of the present invention, and FIG. 4 is a sectional view taken along the line IV-IV of the chip collecting apparatus for a welding tip dresser of FIG.

7) of the cutter portion (60 in FIG. 5) of the welding tip dresser D (FIG. 5) of the welding tip dressing machine 100 according to an embodiment of the present invention (Fig. 7, C) scattered in both directions when the first and second welding tips (2 in Fig. 7) (Fig. 7, As shown in FIG. 4, includes a scatter preventing portion 110, a collecting portion 120, and a pump portion 130.

First, referring to Figs. 3 and 4, the scattering prevention portion 110 will be described in detail.

The scattering prevention portion 110 receives the cutter portion (60 in Fig. 5) to prevent bi-directional scattering of chips (C in Fig. 7) generated in the cutter portion (60 in Fig. 7). Specifically, the scattering prevention portion 110 may include a scattering prevention barrel 111, a storage chamber 112, a first scattering prevention chamber 113, and a second scatter prevention chamber 114. [

The shatterproofing barrel 111 forms the entire exterior of the shatterproofing portion 110 and may be made of plastic or metal. Further, the scattering prevention cylinder 111 can have a rectangular parallelepiped shape. Of course, the scattering prevention tube 111 is not limited to this rectangular parallelepiped shape.

The storage chamber 112 may be partitioned by the first and second partition walls 112a and 112b in the scattering prevention tube 111 to receive the cutter portion 60 of FIG. The shape of the accommodating chamber 112 may have a shape corresponding to the protruding shape of the cutter portion 60. For example, when the projecting shape of the cutter portion 60 is substantially a rectangular parallelepiped, the accommodating chamber 112 may also have a substantially rectangular parallelepiped shape. Further, the opening 112c may be formed on one side surface of the accommodating chamber 112 so that the cutter portion 60 can be drawn into and out of the accommodating chamber 112.

The first scattering prevention chamber 113 may be partitioned between the first partition 112a and the first opposing face 111a of the anti-scattering barrel 111 facing the first partition 112a. 7) generated in the first cutter (61 in Fig. 7) of the cutter portion (60 in Fig. 7) accommodated in the accommodating chamber 112 can be prevented from scattering.

The second scattering prevention chamber 114 may be partitioned between the second partition 112b and the second opposing face 111b of the scattering prevention barrel 111 facing the second partition wall 112b. 7) generated in the second cutter (62 in Fig. 7) of the cutter portion (60 in Fig. 7) accommodated in the accommodating chamber 112 can be prevented from scattering.

In addition, the above-described scattering prevention portion 110 may further include first, second, third, and fourth inlet / outlet holes 115, 116, 117, and 118.

The first and second drawing-in and-out holes 115 and 116 are formed in the above-described splash prevention barrel 111 to guide the first welding tip (2 in FIG. 7) into and out of the first cutter And may be formed on the first opposing face 111a and the first bank 112a, respectively. 7) formed in the first cutter (61 of FIG. 7) to the first shatterproof chamber 113 (see FIG. 7), and the second penetration hole 116 is formed to be larger than the first penetration hole 115 It serves as a guide.

The third and fourth draw-in holes 117 and 118 are formed in the above-described splash prevention barrel 111 in order to guide the entrance and exit of the second welding tip (4 in Fig. 7) to the second cutter And may be formed on the second opposing face 111b and the second bank 112b, respectively. 7) formed in the second cutter (62 in Fig. 7) is formed to be larger than the third draw-in / out hole 117 in the second shake-prevention chamber 114 It serves as a guide.

In addition, the above-described scattering prevention portion 110 is provided on the side opposite to the first and second welding tips (4 in Fig. 7) of the scattering prevention barrel 111, ). ≪ / RTI >

Particularly, the reinforcing plate 119 protects the scattering prevention tube 111 when the scattering prevention tube 111 is made of a plastic material or the like. For example, in the control unit (not shown), a recognition error is generated with respect to the position of the scattering prevention cylinder 111 and the positions of the first and second welding tips (2 in Fig. 7) Even if the second welding tip (2 in Fig. 7) (4 in Fig. 7) costs the scattering prevention cylinder 111, it is possible to prevent the scattering prevention cylinder 111 from being broken. For example, as the reinforcing plate 119, an iron plate or the like may be used.

In addition, the above-described scattering prevention unit 110 may further include a hard film (not shown) provided on the inner surfaces of the first and second scattering prevention chambers 113 and 114.

The reason for further including the hard film (not shown) is to minimize the abrasion phenomenon such as scratching the inner surfaces of the first and second shatterproof chambers 113 and 114 by the scattered chip (C in Fig. 7) . For example, as the hard film (not shown), a reinforcing film, a composite film made of high strength iron or fiber, or the like can be used.

Hereinafter, the collecting unit 120 will be described in detail with reference to FIGS. 3 and 4. FIG.

The collecting section 120 communicates with the scattering preventing section 110 to collect the chips (C in FIG. 7) of the first and second scattering preventing chambers 113 and 114. Specifically, the collecting unit 120 may include a collecting unit 121 and a collecting container 122.

The collecting portion 121 is a place where the chips (C in FIG. 7) of the first and second shatterproof chambers 113 and 114 are communicated with the first and second shatterproof chambers 113 and 114, The water collecting container 122 communicates with the collecting portion 121 and is a place where the chip (C in FIG. 7) is finally collected.

Particularly, the collecting portion 121 includes a hollow collecting container 121a communicating with the first and second scattering preventing chambers 113 and 114, and a connecting portion 121a connecting between the collecting container 121a and the collecting container 122 And a connection pipe 121b. Of course, any one of the coupling tube 121b and the collecting tube 121a may be omitted as needed.

In addition, the collecting cylinder 121a can be flanged to each other by the flange coupling method to the above-described scattering prevention cylinder 111. [ That is, a first flange 141 is provided at a first facing end of the collecting cylinder 121a opposite to the scattering prevention cylinder 111, and a second flange 141 is provided at a second opposite end to the collecting cylinder 121a of the scattering- And the second flange 142 is provided at the far end so that the first and second flanges 141 and 142 can be fastened by bolts 143 or the like.

Hereinafter, the pump unit 130 will be described in detail with reference to FIGS. 3 and 4. FIG.

The pump unit 130 applies the flow of air from the scattering prevention unit 110 to the collection unit 120 so that the chip (C in FIG. 7) is moved from the scattering prevention unit 110 to the collection unit 120. For example, the pump unit 130 may be an air injection type for injecting air from the scattering prevention unit 110 to the collection unit 120, and may include a distributor 131 and a pump 132.

The distributor 131 communicates with the first and second shudder prevention chambers 113 and 114 and is connected to the first and second shudder prevention chambers 113 and 114, A second branch tube 131a and a docking pipe 131c provided on the other side thereof. For example, as shown in FIG. 4, the first and second branch tubes 131a and 131b may be formed in the form of a flow path on the inner side of the distributor 131 or may be formed to be exposed to the outside of the distributor have.

The pump 132 may be docked to the docking tube 131c of the distributor 131 to inject air into the distributor 131. [

In addition, the above-described pump unit 130 may further include a connection hose 133 connected between the distributor 131 and the pump 132 for the degree of freedom of placement.

When the pump unit 130 is of the air injection type, the water outlet 122 of the water collecting unit 120, which corresponds to the end of the air flow, 123 may be formed.

Hereinafter, a process of assembling the chip collecting apparatus 100 for a welding tip dresser according to an embodiment of the present invention to the welding tip dresser D will be described with reference to FIGS. 5 and 6. FIG.

FIG. 5 is an exploded perspective view showing a state in which the chip collection device for the welding tip dresser of FIG. 3 is mounted on the welding tip dresser, and FIG. 6 is an exploded perspective view of the chip collection device for the welding tip dresser of FIG. Fig.

First, a chip collecting apparatus 100 for a welding tip dresser according to an embodiment of the present invention is prepared.

5, after the above-described chip collecting apparatus 100 is brought close to the welding tip dresser D, the opening portion 112c (see FIG. 5) of the storage chamber 112 of the scattering prevention portion 110, The dissipation prevention part 110 is inserted into the cutter part 60 so that the cutter part 60 of the welding tip dresser D is inserted.

As shown in FIG. 6, when the scatter preventing portion 110 is fitted in the cutter portion 60, the assembling is completed.

Hereinafter, the process of collecting the chips C will be described with reference to FIGS. 6 and 7. FIG.

7 is a schematic view illustrating a process of collecting chips by the chip collecting apparatus for a welding tip dresser according to an embodiment of the present invention.

6, a chip collecting apparatus 100 for a welding tip dresser according to an embodiment of the present invention is fitted to a cutter portion 60 of a welding tip dresser D, and a controller (not shown) The positions of the first and second welding tips 2 and 4 of the spot welder and the positions of the first and second cutters 61 and 62 of the cutter portion 60 correspond to each other.

Then, as shown in Fig. 7, the first welding tip 2 is moved in the direction of engaging with the first and second welding tips 2, 4, The second welding tip 4 is sandwiched between the first scattering preventing chamber 113 and the second receiving hole 116 and the receiving chamber 112 through the first cutter 61 and the third welding inlet 4 117, the second shatterproof chamber 114, the fourth suction hole 118, and the containing chamber 112 in this order.

When the first and second welding tips 2 and 4 are fitted to the first and second cutters 61 and 62, when the first and second cutters 61 and 62 are rotated, 2 welding tips (2) and (4), respectively.

At this time, the chip C generated while being cut by the first cutter 61 flows into the first shatterproof chamber 113 via the second inlet / outlet hole 116 as shown in Fig. 7, The chip C generated while being cut by the second cutter 62 flows into the second shatterproof chamber 114 via the fourth suction hole 118. [

The chips C flowing into the first and second shatterproof chambers 113 and 114 are gathered in the collecting case 121a by the flow of the internal air by the pump 132 and passed through the connecting pipe 121b, (122).

The chip C collected in the collection container 122 remains in the collection container 122 and the air injected by the pump 132 is discharged to the outside through the air outlet 123 formed in the collection container 122 The flow of the internal air is maintained.

Hereinafter, a chip collecting apparatus 200 for a welding tip dresser according to another embodiment of the present invention will be described in detail with reference to FIG.

8 is a cross-sectional view schematically showing a chip collecting apparatus for a welding tip dresser according to another embodiment of the present invention.

8, the chip collecting apparatus 200 for a welding tip dresser according to another embodiment of the present invention is the same as that of the embodiment of the present invention except for the pump unit 230, Only the pump unit 230 will be described. The same constituent elements as those of the embodiment of the present invention described above are denoted by the same reference numerals.

The pump unit 230 may include an air suction type pump 231 and a filter 232 for sucking air from the collecting unit 120 to the scattering prevention unit 110.

The pump 231 communicates with the water collection tube 122 through a communication tube 233 to suck air in the water collection part 120.

The filter 232 is provided in the communicating tube 233 between the water collection tube 122 and the pump 231 to prevent the chip C from being moved to the pump 231. [

When the pump unit 230 is of the air suction type, the first and second shudder prevention chambers 113 (of the shudder prevention cylinders 111) corresponding to the start end of the air flow 114 may further include first and second air inlets 211a and 211b through which air is sucked, respectively. That is, the first and second air intake ports 211a and 211b prevent the first and second shudder prevention chambers 113 and 114 from being in a vacuum state and maintain the flow of the entire internal air.

As described above, the chip collecting apparatus for a welding tip dresser according to the embodiments of the present invention can have the following effects.

According to the embodiments of the present invention, since the scattering prevention part 110, the water collecting part 120, and the pump parts 130 and 230 are included, the first part of the cutter part 60 of the welding tip dresser D It is possible to collect the chip C scattered in both directions from the first cutter 61 and the second cutter 62 so that the collected chip C of the expensive material can be reused and the chip C It is not scattered so that the fixing cause can be prevented in advance.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Of the right.

D: Welding tip dressing machine 2: First welding tip
4: second welding tip 60: cutter part
61: first cutter 62: second cutter
100: chip collecting device 110: scattering prevention part
111: Shatterproofing tank 112: Storage room
113: first scattering prevention chamber 114: second scatter prevention chamber
115: First entry and exit 116: Second entry and exit
117: Third entrance entrance entrance 118: Fourth entrance entrance entrance
119: reinforcing plate 120:
121: collecting unit 121a:
121b: Connector 122:
130, 230: pump unit 131: distributor
132, 231: Pump 133: Connection hose
232: filter

Claims (14)

A chip collecting device for a welding tip dressing machine for collecting chips scattered in both directions when the first and second welding tips are respectively cut by the first and second cutters of the cutter part of the welding tip dresser,
A scattering prevention portion accommodating the cutter portion and preventing bidirectional scattering of the chip;
A collecting portion communicating with the scattering prevention portion to collect the chips; And
And a pump part for applying a flow of air from the scattering prevention part to the collecting part so that the chip is moved from the scattering prevention part to the collecting part,
And a chip picker for picking up chips. The method of claim 1,
The scattering-
A hollow shatterproofing barrel which forms an outer surface of the shatterproofing portion;
A storage chamber partitioned by the first and second partition walls to receive the cutter portion;
A first shatterproof chamber partitioned between the first partition and a first opposing surface of the shatterproofing barrel facing the first partition; And
And a second anti-scattering chamber partitioned between the second bank and a second opposing face of the anti-scattering barrel facing the second bank. 3. The method of claim 2,
The scattering-
First and second inlet and outlet holes formed in the first opposing face and the first separating wall, respectively, for guiding the pull-out of the first welding tip to the first cutter; And
Further comprising third and fourth pull-in openings formed in the second opposing face and the second partition to guide the entry and exit of the second welding tip into and out of the second cutter. 3. The method of claim 2,
The scattering-
And a reinforcing plate provided on each of the surfaces of the shatterproofing barrel opposite to the first and second welding tips. 3. The method of claim 2,
The scattering-
And a hard film provided on the inner surfaces of the first and second shake-prevention chambers. 3. The method of claim 2,
The water collecting part
A collecting part communicating with the first and second shroud prevention chambers to gather chips of the first and second shroud prevention chambers; And
And a collecting container communicating with the collecting portion to collect the chips finally. The method of claim 6,
The collecting portion
A hollow collecting cylinder communicating with the first and second shroud prevention chambers; And
And a connection pipe connected between the collecting passage and the collecting cistern. 8. The method of claim 7,
And the flange is provided at each of the opposite ends of the shatterproofing counterflow collecting case so that the shatterproofing counterflow collecting case is flanged to each other. The method of claim 6,
The pump unit
A distributor communicating with the first and second shroud prevention chambers; And
And a pump for injecting air into the dispenser. The method of claim 9,
The distributor
First and second branch tubes provided on one surface of the first and second shatterproof chambers so as to communicate with the first and second shatterproof chambers, respectively; And
And a docking tube provided on the other surface. The method of claim 9,
The pump unit
And a connection hose connected between the distributor and the pump. The method of claim 9,
The water collecting part
Further comprising an air discharge port formed in the water collection tube. The method of claim 6,
The pump unit
A pump communicating with the water storage tank and sucking air; And
And a filter provided between the water collection tube and the pump to prevent the chip from being moved to the pump. The method of claim 13,
The scattering-
Further comprising first and second air inlets formed in the first and second shatterproof chambers, respectively.

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