KR20140027829A - Clamp for plating - Google Patents
Clamp for plating Download PDFInfo
- Publication number
- KR20140027829A KR20140027829A KR1020120093928A KR20120093928A KR20140027829A KR 20140027829 A KR20140027829 A KR 20140027829A KR 1020120093928 A KR1020120093928 A KR 1020120093928A KR 20120093928 A KR20120093928 A KR 20120093928A KR 20140027829 A KR20140027829 A KR 20140027829A
- Authority
- KR
- South Korea
- Prior art keywords
- elastic
- clamping
- substrate
- plating
- clamp
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000008878 coupling Effects 0.000 claims description 30
- 238000010168 coupling process Methods 0.000 claims description 30
- 238000005859 coupling reaction Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims 6
- 238000009713 electroplating Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
- F16B2/06—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
- F16B2/10—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action using pivoting jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
The present invention relates to a clamp for plating.
In general, circuit patterns formed on a thin film circuit board such as a printed circuit board (PCB) are composed of a metal thin film such as gold (Au) or silver (Ag). These thin films are formed by electroplating (electrolytic plating) during the PCB manufacturing process, and the electroplating operation, as is well known, connects a PCB manufacturing substrate, that is, a thin film-like plated body with a negative electrode, and the plating solution of the electroplating bath. (Electrolyte) is connected to the positive electrode (+), and the thin film-like plated body is immersed in the plating solution. According to such an electroplating operation, it is very important to carry out the plating operation in a state where the thin film type plated body is stably held to enable electroplating, and as a device for holding the thin plate type plated body, electroplating operated in the form of tongs Clamps are well known. The electroplating clamp is connected to the jaws (Jaw) having a tip for the conduction is connected to the hinge coupling so that the two jaw pressurization portion is narrowed or opened around the hinge coupling point to energize the edge of the thin film type plated body (通電) It is formed to be able to hold.
As the thickness of the substrate becomes thinner and the thickness and type of the substrate vary, a plating clamp for each substrate thickness is required.
Background art of the present invention is disclosed in Korean Unexamined Patent Publication No. 2012-0001383 (published Jan. 04, 2012, electroplating clamp).
The present invention provides a clamp for plating that can correspond to various thicknesses of the substrate with one clamp.
According to an aspect of the present invention, a main part, a clamping part which is rotatably coupled to face the main part, and can clamp the substrate between one end portion and one end portion of the main portion, the other end of the main portion and the clamping It is provided between the other end portion is provided with a clamp for plating comprising an elastic portion for providing an elastic force for clamping the substrate, and an elastic adjustment portion for adjusting the elastic force of the elastic portion.
One end of the elastic control unit is connected to the elastic unit may be coupled to the main unit.
The elastic control unit may include a pressure plate connected to the elastic unit, and a moving unit capable of advancing or retracting the pressure plate.
The moving part may be formed of a screw, and the moving part may be screwed to the main part.
The elastic portion may be formed of a spring.
The clamping part may include a support part for clamping the substrate, a handle part for coupling with the elastic part, and a coupling part for rotatably coupling with the main part.
An end of the handle portion is bent to form a first hinge coupling portion for hinge coupling with the coupling portion, one end of the support portion is coupled to the substrate, and the other end of the second hinge coupling for hinge coupling with the handle portion An addition can be formed.
By using the plating clamp according to the present invention, it is possible to cope with the thickness of various substrates with one clamp, so that the equipment restrictions can be released and the cost can be saved.
1 is a side view showing a clamp for plating according to an embodiment of the present invention.
Figure 2 is a side view showing the movement of the elastic adjustment of the clamp for plating according to an embodiment of the present invention moved.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.
In addition, the term " coupled " is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also means that other constituent elements are interposed between the constituent elements, Use them as a concept to cover each contact.
DETAILED DESCRIPTION A plating clamp according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals, and duplicate description thereof will be given. It will be omitted.
1 and 2, the clamp for plating according to an embodiment of the present invention includes a
A central portion of the
In general, rinsing and connecting the substrate with a clamp to apply the current of the substrate, and as the thickness of the substrate has recently become thinner or various kinds of substrates, it has become necessary to correspond to each substrate thickness.
However, in general, since the clamp is integrated with the rinsers, it is inconvenient to replace the clamps and rinsers according to the thickness of the substrate.
In addition, the more the clamp is used, the more the spring tension is lost, and the clamp used for a long time cannot be applied to the thin plate because the elasticity is applied, and there is a disadvantage that it can only be used for the thick plate.
By using an
The
The
One end of the
As shown in FIG. 1 or 2, one end of the
The
At this time, the
As the
As the
In the case of a thin plate, the moving
In addition, even when the elastic force of the
As shown in FIG. 1 or 2, the
The
In addition, the
At the end of the
When the
On the contrary, when the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.
100: main part
200: clamping part
210: handle portion
220: support
221: second hinge coupling portion
222: first hinge coupling portion
223: coupling part
300: elastic part
400: elastic adjustment unit
410: pressure plate
420: moving part
Claims (7)
A clamping part that is rotatably coupled to the main part and capable of clamping a substrate between one end part and one end part of the main part;
An elastic part formed between the other end of the main part and the other end of the clamping part to provide an elastic force for clamping the substrate; And
Plating clamp, characterized in that it comprises an elastic control unit for adjusting the elastic force of the elastic unit.
One end of the elastic adjustment portion is connected to the elastic portion, the clamp for plating, characterized in that coupled to the main portion.
The elastic control unit,
A pressure plate connected to the elastic portion; And
Plating clamps comprising a moving part capable of advancing or retracting the pressure plate.
The moving part is formed of a screw, the moving part is clamping for plating characterized in that the screwed to the main part.
The elastic clamping plate is characterized in that the spring is formed.
The clamping portion
A support for clamping the substrate;
A handle part coupled to the elastic part; And
And a coupling part rotatably coupled to the main part.
The end of the handle portion is bent to form a first hinge coupling portion for hinge coupling with the coupling portion,
The substrate is coupled to one end of the support portion, and the other end is a plating clamp, characterized in that the second hinge coupling portion for hinge coupling with the handle portion is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120093928A KR20140027829A (en) | 2012-08-27 | 2012-08-27 | Clamp for plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120093928A KR20140027829A (en) | 2012-08-27 | 2012-08-27 | Clamp for plating |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20140027829A true KR20140027829A (en) | 2014-03-07 |
Family
ID=50641587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120093928A KR20140027829A (en) | 2012-08-27 | 2012-08-27 | Clamp for plating |
Country Status (1)
Country | Link |
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KR (1) | KR20140027829A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105568352A (en) * | 2016-03-11 | 2016-05-11 | 昆山东威电镀设备技术有限公司 | Electroplating clamp |
CN109436053A (en) * | 2018-12-30 | 2019-03-08 | 重庆佰鸿机械设备有限公司 | A kind of transport vehicle of plate plated item |
CN109440173A (en) * | 2018-12-29 | 2019-03-08 | 重庆佰鸿机械设备有限公司 | It is a kind of for clamping the electroplating clamp of plate |
CN109652849A (en) * | 2019-01-22 | 2019-04-19 | 重庆方正高密电子有限公司 | Fixture and electroplating assembly line |
CN110318087A (en) * | 2019-06-17 | 2019-10-11 | 安徽启明表面技术有限公司 | A kind of Treatment of Metal Surface Electropolating hangers easy to disassemble |
KR200492019Y1 (en) * | 2020-03-03 | 2020-07-20 | 라이프안전유리(주) | Glass bonding clamp |
CN111564030A (en) * | 2019-02-14 | 2020-08-21 | 海湾安全技术有限公司 | Calibration device and fire detector with same |
KR102371478B1 (en) * | 2021-01-21 | 2022-03-08 | (주)에스와이이엔씨 | Clamp for plating |
KR102380978B1 (en) * | 2021-01-21 | 2022-04-01 | (주)에스와이이엔씨 | Hanger for plating |
KR102560828B1 (en) * | 2022-06-17 | 2023-07-27 | 김창현 | system for gripping of printed circuit board through selectively control tension |
-
2012
- 2012-08-27 KR KR1020120093928A patent/KR20140027829A/en not_active Application Discontinuation
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105568352A (en) * | 2016-03-11 | 2016-05-11 | 昆山东威电镀设备技术有限公司 | Electroplating clamp |
CN109440173A (en) * | 2018-12-29 | 2019-03-08 | 重庆佰鸿机械设备有限公司 | It is a kind of for clamping the electroplating clamp of plate |
CN109436053A (en) * | 2018-12-30 | 2019-03-08 | 重庆佰鸿机械设备有限公司 | A kind of transport vehicle of plate plated item |
CN109652849A (en) * | 2019-01-22 | 2019-04-19 | 重庆方正高密电子有限公司 | Fixture and electroplating assembly line |
CN109652849B (en) * | 2019-01-22 | 2020-09-04 | 重庆方正高密电子有限公司 | Clamp and electroplating production line |
CN111564030A (en) * | 2019-02-14 | 2020-08-21 | 海湾安全技术有限公司 | Calibration device and fire detector with same |
CN110318087A (en) * | 2019-06-17 | 2019-10-11 | 安徽启明表面技术有限公司 | A kind of Treatment of Metal Surface Electropolating hangers easy to disassemble |
CN110318087B (en) * | 2019-06-17 | 2021-05-25 | 安徽启明表面技术有限公司 | Electroplating hanger convenient for disassembling metal surface treatment |
KR200492019Y1 (en) * | 2020-03-03 | 2020-07-20 | 라이프안전유리(주) | Glass bonding clamp |
KR102371478B1 (en) * | 2021-01-21 | 2022-03-08 | (주)에스와이이엔씨 | Clamp for plating |
KR102380978B1 (en) * | 2021-01-21 | 2022-04-01 | (주)에스와이이엔씨 | Hanger for plating |
KR102560828B1 (en) * | 2022-06-17 | 2023-07-27 | 김창현 | system for gripping of printed circuit board through selectively control tension |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |