KR20140026566A - Mems 앵커 및 스페이서 구조 - Google Patents
Mems 앵커 및 스페이서 구조 Download PDFInfo
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- KR20140026566A KR20140026566A KR1020137034030A KR20137034030A KR20140026566A KR 20140026566 A KR20140026566 A KR 20140026566A KR 1020137034030 A KR1020137034030 A KR 1020137034030A KR 20137034030 A KR20137034030 A KR 20137034030A KR 20140026566 A KR20140026566 A KR 20140026566A
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- layer
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- polymer layer
- structural material
- mems
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- G—PHYSICS
- G02—OPTICS
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- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B7/0032—Packages or encapsulation
- B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
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- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24149—Honeycomb-like
- Y10T428/24157—Filled honeycomb cells [e.g., solid substance in cavities, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24744—Longitudinal or transverse tubular cavity or cell
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Micromachines (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161488574P | 2011-05-20 | 2011-05-20 | |
| US61/488,574 | 2011-05-20 | ||
| US13/474,532 | 2012-05-17 | ||
| US13/474,532 US9213181B2 (en) | 2011-05-20 | 2012-05-17 | MEMS anchor and spacer structure |
| PCT/US2012/038611 WO2012162155A1 (en) | 2011-05-20 | 2012-05-18 | Mems anchor and spacer structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| KR1020167022231A Division KR101843948B1 (ko) | 2011-05-20 | 2012-05-18 | Mems 앵커 및 스페이서 구조 |
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| KR20140026566A true KR20140026566A (ko) | 2014-03-05 |
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| KR1020137034030A Ceased KR20140026566A (ko) | 2011-05-20 | 2012-05-18 | Mems 앵커 및 스페이서 구조 |
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| KR1020167022231A Expired - Fee Related KR101843948B1 (ko) | 2011-05-20 | 2012-05-18 | Mems 앵커 및 스페이서 구조 |
Country Status (8)
| Country | Link |
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| US (1) | US9213181B2 (enExample) |
| EP (1) | EP2712428A1 (enExample) |
| JP (1) | JP6051422B2 (enExample) |
| KR (2) | KR101843948B1 (enExample) |
| CN (1) | CN103547957B (enExample) |
| IN (1) | IN2013CN08433A (enExample) |
| TW (1) | TWI491958B (enExample) |
| WO (1) | WO2012162155A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101597210B1 (ko) * | 2015-03-23 | 2016-02-24 | 가천대학교 산학협력단 | 비 포토리소그래피 기반의 랩온어칩용 마이크로채널 형성방법 |
| KR20210005454A (ko) * | 2019-07-05 | 2021-01-14 | 삼성전자주식회사 | 발광소자 패키지 제조방법 및 이를 이용한 디스플레이 패널 제조방법 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140175909A1 (en) * | 2012-12-21 | 2014-06-26 | Pixtronix, Inc. | Systems and Methods for Supporting a Movable Element of an Electromechanical Device |
| US20140268274A1 (en) * | 2013-03-15 | 2014-09-18 | Pixtronix, Inc. | Display Apparatus Incorporating an Elevated Aperture Layer and Methods of Manufacturing the Same |
| US20140268273A1 (en) * | 2013-03-15 | 2014-09-18 | Pixtronix, Inc. | Integrated elevated aperture layer and display apparatus |
| US20140375538A1 (en) * | 2013-06-19 | 2014-12-25 | Pixtronix, Inc. | Display apparatus incorporating constrained light absorbing layers |
| US9202821B2 (en) | 2013-10-23 | 2015-12-01 | Pixtronix, Inc. | Thin-film transistors incorporated into three dimensional MEMS structures |
| US9547167B1 (en) * | 2014-12-17 | 2017-01-17 | Amazon Technologies, Inc. | Fabrication method for top plate and spacers for an electrowetting display |
| US9611135B1 (en) * | 2015-10-30 | 2017-04-04 | Infineon Technologies Ag | System and method for a differential comb drive MEMS |
| US11377345B2 (en) * | 2020-07-08 | 2022-07-05 | Wisconsin Alumni Research Foundation | Tunable photonic device with liquid crystal elastomer microactuators and method of fabricating the same |
| US11796789B2 (en) | 2020-09-01 | 2023-10-24 | Wisconsin Alumni Research Foundation | Pinned aperture light modulator and method |
| IT202100030269A1 (it) * | 2021-11-30 | 2023-05-30 | St Microelectronics Srl | Otturatore ottico microelettromeccanico con strutture schermanti rotanti e relativo procedimento di fabbricazione |
| JP2025057990A (ja) * | 2023-09-28 | 2025-04-09 | オムロン株式会社 | 表示装置およびこれを備えた展示装置 |
| JP2025057942A (ja) | 2023-09-28 | 2025-04-09 | オムロン株式会社 | 表示装置およびこれを備えた展示装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6969635B2 (en) * | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US6741377B2 (en) | 2002-07-02 | 2004-05-25 | Iridigm Display Corporation | Device having a light-absorbing mask and a method for fabricating same |
| US7999994B2 (en) | 2005-02-23 | 2011-08-16 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
| KR100991044B1 (ko) | 2005-02-23 | 2010-10-29 | 픽스트로닉스 인코포레이티드 | 디스플레이 장치들 및 그의 제조 방법들 |
| US7675665B2 (en) | 2005-02-23 | 2010-03-09 | Pixtronix, Incorporated | Methods and apparatus for actuating displays |
| US7746529B2 (en) | 2005-02-23 | 2010-06-29 | Pixtronix, Inc. | MEMS display apparatus |
| US9158106B2 (en) | 2005-02-23 | 2015-10-13 | Pixtronix, Inc. | Display methods and apparatus |
| US8526096B2 (en) * | 2006-02-23 | 2013-09-03 | Pixtronix, Inc. | Mechanical light modulators with stressed beams |
| DE102007001518B4 (de) | 2007-01-10 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zum Häusen eines mikromechanischen oder mikrooptoelektronischen Systems |
| KR101597348B1 (ko) * | 2007-07-25 | 2016-03-07 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | Mems 표시장치 및 그의 제조방법 |
| US7570415B2 (en) * | 2007-08-07 | 2009-08-04 | Qualcomm Mems Technologies, Inc. | MEMS device and interconnects for same |
-
2012
- 2012-05-17 US US13/474,532 patent/US9213181B2/en not_active Expired - Fee Related
- 2012-05-18 CN CN201280023418.3A patent/CN103547957B/zh not_active Expired - Fee Related
- 2012-05-18 KR KR1020167022231A patent/KR101843948B1/ko not_active Expired - Fee Related
- 2012-05-18 WO PCT/US2012/038611 patent/WO2012162155A1/en not_active Ceased
- 2012-05-18 JP JP2014511587A patent/JP6051422B2/ja not_active Expired - Fee Related
- 2012-05-18 TW TW101117915A patent/TWI491958B/zh not_active IP Right Cessation
- 2012-05-18 KR KR1020137034030A patent/KR20140026566A/ko not_active Ceased
- 2012-05-18 IN IN8433CHN2013 patent/IN2013CN08433A/en unknown
- 2012-05-18 EP EP12724490.3A patent/EP2712428A1/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101597210B1 (ko) * | 2015-03-23 | 2016-02-24 | 가천대학교 산학협력단 | 비 포토리소그래피 기반의 랩온어칩용 마이크로채널 형성방법 |
| KR20210005454A (ko) * | 2019-07-05 | 2021-01-14 | 삼성전자주식회사 | 발광소자 패키지 제조방법 및 이를 이용한 디스플레이 패널 제조방법 |
| US12336346B2 (en) | 2019-07-05 | 2025-06-17 | Samsung Electronics Co., Ltd. | Method of manufacturing light emitting device package and method of manufacturing display panel using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160101208A (ko) | 2016-08-24 |
| IN2013CN08433A (enExample) | 2015-08-21 |
| US9213181B2 (en) | 2015-12-15 |
| WO2012162155A1 (en) | 2012-11-29 |
| TW201314309A (zh) | 2013-04-01 |
| JP2014522502A (ja) | 2014-09-04 |
| CN103547957A (zh) | 2014-01-29 |
| CN103547957B (zh) | 2017-11-14 |
| US20120295058A1 (en) | 2012-11-22 |
| EP2712428A1 (en) | 2014-04-02 |
| JP6051422B2 (ja) | 2016-12-27 |
| TWI491958B (zh) | 2015-07-11 |
| KR101843948B1 (ko) | 2018-05-14 |
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