KR20140011864A - Precursors for deposition of gst thin film - Google Patents

Precursors for deposition of gst thin film Download PDF

Info

Publication number
KR20140011864A
KR20140011864A KR1020120079458A KR20120079458A KR20140011864A KR 20140011864 A KR20140011864 A KR 20140011864A KR 1020120079458 A KR1020120079458 A KR 1020120079458A KR 20120079458 A KR20120079458 A KR 20120079458A KR 20140011864 A KR20140011864 A KR 20140011864A
Authority
KR
South Korea
Prior art keywords
deposition
precursor
thin film
alkyl
gst thin
Prior art date
Application number
KR1020120079458A
Other languages
Korean (ko)
Inventor
박용주
정충화
김대현
이상경
정재선
Original Assignee
솔브레인씨그마알드리치 유한회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 솔브레인씨그마알드리치 유한회사 filed Critical 솔브레인씨그마알드리치 유한회사
Priority to KR1020120079458A priority Critical patent/KR20140011864A/en
Publication of KR20140011864A publication Critical patent/KR20140011864A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/90Antimony compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/305Sulfides, selenides, or tellurides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Semiconductor Memories (AREA)

Abstract

The present invention relates to a precursor for GST thin film deposition. The precursor is indicated as chemical formula 1. In the chemical formula 1, R1 is alkyl of C1-C6; R2 is alkyl of C1-C6; R3 is alkyl of C1-C6; and M is either Se or Te. The precursor can simplify a deposition process and can enhance deposition efficiency.

Description

Precursors for deposition of GST thin film

The present invention relates to a precursor for depositing a GST thin film.

Semiconductor memory devices are classified into dynamic random access memory (DRAM), which is a volatile memory device, and non-volatile random access memory (NVRAM), a nonvolatile memory device. DRAM is a large market, but because the stored information is volatile, it consumes a lot of power because the same information must be stored again in a very short period. In addition, faced with technical limitations due to the miniaturization process, non-volatile memory has emerged as a next-generation low-cost memory that has a DRAM storage density and an operating speed of static RAM (SRAM). Currently, research on next-generation nonvolatile memory is being actively conducted at home and abroad. Among them, PRAM (phase change random access memory) is attracting the most attention.

A phase change memory (PRAM) is a chalcogenide material that exhibits optical and electrical switching phenomena between amorphous and crystalline states, and is a memory in which information is recorded / erased / reproduced due to a difference in electrical resistance. Phase change memory is very excellent in terms of performance such as fast operation speed and high integration, and can be manufactured at low process cost because of simple device structure and manufacturing process. Currently, Ge / Sb / Te is widely used as a material for phase change memory devices, and a precursor for depositing each thin film is required. However, the Te precursor has a problem in that the consumption of the precursor is high due to low deposition efficiency.

An object of the present invention is to provide a precursor for GST thin film deposition that can simplify the deposition process and increase the deposition efficiency.

GST thin film deposition precursor according to an embodiment of the present invention is represented by the following formula (1).

[Formula 1]

Figure pat00001

(In Formula 1, R1 is C1 ~ C6 alkyl, R2 is C1 ~ C6 alkyl, R3 is C1 ~ C6 alkyl, M is Se or Te)

Currently, each precursor is used for the deposition of GST thin film, but the antimony and tellurium single precursor combined in the present invention can be used to deposit the antimony and tellurium at once, thus simplifying the deposition process and antimony deposition. At the same time, it is possible to deposit tellurium, thereby increasing the deposition efficiency of tellurium. In addition, the structure of the material shown in the present invention is not only limited to antimony and tellurium, but also applicable to the antimony and selenium bonding structure, and will exhibit similar characteristics.

1 shows a memory device structure using GST.

The present invention is a precursor of a novel structure containing antimony and tellurium, forms a single precursor that is directly bonded to antimony and tellurium, contains an amine bond, high stability, easy structure for ALD deposition to be. The structure of the present invention can be equally applied to selenium in addition to tellurium.

The precursor is applicable to the deposition of GST thin film for PRAM, but the application range is not limited thereto.

GST thin film deposition precursor according to an embodiment of the present invention is represented by the following formula (1).

[Formula 1]

Figure pat00002

(In Formula 1, R1 is C1 ~ C6 alkyl, R2 is C1 ~ C6 alkyl, R3 is C1 ~ C6 alkyl, M is Se or Te)

The precursor for depositing a GST thin film represented by Chemical Formula 1 may be prepared as in Scheme 1 below.

[Reaction Scheme 1]

Figure pat00003

The solvent may be Ether, THF, or Hexane.

The precursor is a novel precursor comprising Sb-Te or Sb-Se bonds. In particular, it contains an amine and an alkyl group simultaneously. Thus, it has moderate volatility.

The precursor may deposit a binary film at a time during ALD deposition. Therefore, it can be used for Ge / Sb / Te (GST) thin film and application thin film deposition.

The precursor may improve the deposition efficiency of Te and Se as a single source.

Claims (1)

A precursor for GST thin film deposition represented by Formula 1 below.
[Chemical Formula 1]
Figure pat00004

(In Formula 1, R1 is C1 ~ C6 alkyl, R2 is C1 ~ C6 alkyl, R3 is C1 ~ C6 alkyl, M is Se or Te)
KR1020120079458A 2012-07-20 2012-07-20 Precursors for deposition of gst thin film KR20140011864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120079458A KR20140011864A (en) 2012-07-20 2012-07-20 Precursors for deposition of gst thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120079458A KR20140011864A (en) 2012-07-20 2012-07-20 Precursors for deposition of gst thin film

Publications (1)

Publication Number Publication Date
KR20140011864A true KR20140011864A (en) 2014-01-29

Family

ID=50143941

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120079458A KR20140011864A (en) 2012-07-20 2012-07-20 Precursors for deposition of gst thin film

Country Status (1)

Country Link
KR (1) KR20140011864A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157716A (en) 2020-06-22 2021-12-29 한상관 By storing a large amount of river water to create an artificial fish farm and at the same time to reduce the generation of fine dust, it improves the polluted air in the atmosphere, and at the same time, preferentially discharges clean water molecules with a heavy specific gravity so that the polluted river water is converted into clean river water. A nature-friendly water purification eco-friendly method that naturally purifies the water quality of reservoirs, lakes, dams, lagoons, rivers, and rivers while producing a large amount of electricity using a nature-friendly eco-friendly water storage system configured to purify

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157716A (en) 2020-06-22 2021-12-29 한상관 By storing a large amount of river water to create an artificial fish farm and at the same time to reduce the generation of fine dust, it improves the polluted air in the atmosphere, and at the same time, preferentially discharges clean water molecules with a heavy specific gravity so that the polluted river water is converted into clean river water. A nature-friendly water purification eco-friendly method that naturally purifies the water quality of reservoirs, lakes, dams, lagoons, rivers, and rivers while producing a large amount of electricity using a nature-friendly eco-friendly water storage system configured to purify

Similar Documents

Publication Publication Date Title
CN102117884B (en) What do not need special selector transistor selects phase change memory device certainly
CN101488558B (en) M-Sb-Se phase changing thin-film material used for phase changing memory
KR100652378B1 (en) Sb Precursor and Manufacturing Method of Phase-Change Memory Device using the Same
US20070170881A1 (en) Phase change materials, phase change random access memories having the same and methods of operating phase change random access memories
CN102227015B (en) Phase transition storage material and preparation method thereof
CN108598256B (en) Preparation method of Ge/Sb superlattice phase-change thin film material for phase-change memory
US8320170B2 (en) Multi-bit phase change memory devices
US8920684B2 (en) Al-Sb-Te phase change material used for phase change memory and fabrication method thereof
CN101488557B (en) Si-Sb-Se phase changing thin-film material used for phase changing memory
Yoo et al. Atomic Layer Deposition of Ge x Se1–x Thin Films for Endurable Ovonic Threshold Selectors with a Low Threshold Voltage
CN110544742A (en) Ferroelectric phase change hybrid storage unit, memory and operation method
US20120281468A1 (en) Semiconductor device and semiconductor memory device
KR100857466B1 (en) Phase change nonvolatile memory device using sb-zn alloy and method for preparing the same
KR20140011864A (en) Precursors for deposition of gst thin film
Das et al. Studies on electrical switching behavior and optical band gap of amorphous Ge–Te–Sn thin films
CN102142518B (en) Phase-change storage material and preparation method thereof
CN101924180A (en) Antimony-rich Si-Sb-Te sulfur group compound phase-change material for phase change memory
Lee et al. Oxide Passivation of Halide Perovskite Resistive Memory Device: A Strategy for Overcoming Endurance Problem
Liu et al. A self-compliant one-diode-one-resistor bipolar resistive random access memory for low power application
US7763886B2 (en) Doped phase change material and pram including the same
CN104485417A (en) Technology for improving GeSbTe phase change property and thin film preparation method thereof
CN102610745A (en) Si-Sb-Te based sulfur group compound phase-change material for phase change memory
CN101414481A (en) Phase-change memory cell based on SiSb composite material
KR101603505B1 (en) Phase change material and phase change random access memory including layer of the phase change material
CN110828664B (en) Phase change material, preparation method of phase change material and phase change memory

Legal Events

Date Code Title Description
N231 Notification of change of applicant
WITB Written withdrawal of application