KR20140001574A - The power supply device - Google Patents

Abstract

The present invention provides a power supply including at least one transformer, wherein the transformer includes a plurality of inductors and a case housing the inductor, and includes a heat dissipation structure on the case surface. Therefore, by applying a heat dissipation structure to the enclosure of a high heat generation transformer, the heat dissipation efficiency can be increased to prevent saturation of the device, thereby reducing malfunction.

Description

Power supply device

The present invention relates to a power supply.

Power supply devices for large electronic devices include an inductor and a transformer including the inductor to supply high power.

In the case of including the transformer, high power is possible, but the heat generated from the inductor causes saturation and a fatal malfunction in the whole system.

Embodiments provide a power supply including a transformer that can reduce heat generation.

An embodiment is a power supply comprising at least one transformer, the transformer comprising a plurality of inductors and a case housing the inductor, the heat dissipation structure on the surface of the case.

The case may have a heat dissipation structure attached to a lower surface of the case.

The heat dissipation structure may have a concave-convex structure on the lower surface.

The case may have a concave-convex structure on the lower surface.

The lower surface of the case may be formed thicker than the upper surface.

The upper surface of the case may further include a concave-convex structure.

The cross-section of the uneven structure may be rectangular.

The cross-section of the uneven structure may have a trapezoid.

It may include a protrusion on the surface of the uneven structure.

The protrusion may be formed of a material different from the uneven structure.

According to the present invention, by applying a heat dissipation structure to the enclosure of a high heat generation transformer can increase the heat dissipation efficiency to prevent the saturation of the device to reduce the malfunction.

1 is a configuration diagram of a power supply apparatus according to the present invention.
2 is a circuit diagram of the transformer of FIG. 1.
3 is a first configuration diagram of the transformer of FIG. 1.
4 is a second configuration diagram of the transformer of FIG. 1.
FIG. 5 is a third configuration diagram of the transformer of FIG. 1.
6 is a fourth configuration diagram of the transformer of FIG. 1.
7 is a fifth configuration diagram of the transformer of FIG. 1.
8 is a sixth configuration diagram of the transformer of FIG. 1.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

The present invention provides a power supply with improved heat dissipation efficiency.

Hereinafter, a power supply apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8.

1 is a configuration diagram of a power supply device according to the present invention, FIG. 2 is a circuit diagram of the transformer 110 of FIG. 1, and FIG. 3 is a first configuration diagram of the transformer 110 of FIG. 1.

Referring to FIG. 1, the power supply device 100 includes a plurality of circuit modules 110, 120, and 130 on the board 150.

The plurality of circuit modules 110, 120, 130 include a control module 130, a plurality of transformers 110, 120, and other components.

The control module 130 may provide a control signal to each transformer 110 and 120, and may be an integrated circuit that generates a pulse signal when the power supply device 100 is a primary side regulation (PSR) method.

The transformers 110 and 120 may include an inductor, and may include one transformer 110 and 120 in the PSR mode and two transformers 110 and 120 in the interleaved mode.

The transformers 110 and 120 have an equivalent circuit as shown in FIG. 2.

That is, the two inductors 115 are formed to have different windings NP and NS, and the transformation is performed by the induction current flowing in the secondary coil by the magnetic field caused by the current flowing in the primary coil.

The magnitude of the induced current is determined by the winding ratio according to the windings NP and NS of the primary and secondary coils.

The transformers 110 and 120 are housed in an enclosure 111A to prevent the magnetic field from being exposed to the outside and to protect the inductor 115.

The enclosure 111A may be formed of a metal such as tin to prevent leakage of the magnetic field.

At this time, the enclosure 111A has a heat dissipation structure as shown in FIG. 3.

That is, in the case of the transformer 110A of FIG. 3, an enclosure 111A surrounding the outside of the transformer 110A is formed, and the heat dissipation structure 113 is formed at an area that is coupled to the board 150 at the lower portion of the enclosure 111A. It includes.

The heat dissipation structure 113 couples the lower portion of the enclosure 111A and the board 150, and transfers heat generated from the transformer 110A to the board 150.

The heat dissipation structure 113 may be formed of a metal having high heat transfer efficiency, preferably a metal alloy such as aluminum, copper, or silver, and may have unevenness as a heat dissipation structure 114 on the lower surface to increase the surface area.

A cross section of the uneven structure 114 may have a rectangular shape as shown in FIG. 3.

Hereinafter, various embodiments will be described with reference to FIGS. 4 to 8.

Transformer 110B according to the present invention includes an enclosure 111B outside the transformer 110B as shown in FIG. 4.

In this case, the lower surface of the enclosure 111B may include a heat dissipation structure 114.

That is, in the case of the transformer 110B of FIG. 4, since the concave-convex structure 114 is directly connected to the enclosure 111B without attaching a separate heat dissipation structure, heat dissipation may be improved and cost may be reduced.

When the concave-convex structure 114 is provided on the lower surface of the enclosure 111B, the lower surface of the enclosure 111B may be formed thicker than the upper surface.

Meanwhile, in the case of the transformer 110C of FIG. 5, an enclosure 111C surrounding the outside of the transformer 110C is formed, and the heat dissipation structure 113 is formed at an area that is coupled to the board 150 at the lower portion of the enclosure 111C. It includes.

The heat dissipation structure 113 couples the lower portion of the enclosure 111C and the board 150, and transfers heat generated from the transformer 110C to the board 150.

The heat dissipation structure 113 may be formed of a metal having high heat transfer efficiency, and may have unevenness as a heat dissipation structure 114 on the lower surface to increase the surface area.

The heat dissipation structure 116 is also formed on the upper surface of the enclosure 111C of the transformer 110C.

When the heat dissipation structure 116 of the unevenness is formed on the upper surface of the enclosure 111C, the upper surface of the enclosure 111C may be formed thicker than the lower surface.

In FIG. 5, the unevenness is formed only on the upper surface of the enclosure 111C. Alternatively, the uneven structure may be formed on the front surface except for the lower surface.

Meanwhile, in the case of the transformer 110D of FIG. 6, the heat dissipation structure 116 has a concave-convex structure on the upper and lower surfaces of the enclosure 111D without joining a separate heat dissipation structure.

At this time, since the heat dissipation structure on the surface of the enclosure (111D), the upper and lower surfaces may be formed thicker than the side.

On the other hand, in the case of the transformer 110E of FIG. 7, the heat dissipation structures 114 and 116 have uneven structures on the upper and lower surfaces of the enclosure 111D without joining a separate heat dissipation structure.

At this time, since the heat dissipation structure (114, 116) on the surface of the enclosure (111D), the upper and lower surfaces may be formed thicker than the side. Unlike in FIG. 3, the heat dissipation structures 114 and 116 may have a trapezoidal cross-section, which has a larger width of the recessed portion toward the outside.

In the case of the transformer 110E of FIG. 8, the heat dissipation structures 114 and 116 are provided on the upper and lower surfaces of the enclosure 111E without the joining of a separate heat dissipation structure as shown in FIG. 6.

At this time, since the heat dissipation structure on the surface of the enclosure 111E, the upper and lower surfaces may be formed thicker than the side surfaces.

The heat dissipation structures 114 and 116 may have protrusion structures on the surfaces thereof. That is, protrusions having a smaller size than the concave-convex structure are formed along the concave-convex, thereby further increasing the surface area.

The protrusion may be formed by etching the enclosure 111E to give roughness. Alternatively, the protrusion may be formed by plating. When the protrusions are formed by plating, the protrusions and the enclosure 111E may be formed of different materials, preferably, the enclosure 111E is formed of copper, and the protrusions may be formed of tin or silver.

The heat dissipation structures 114 and 116 may have a rectangular cross section as shown in FIG. 6, but unlike this, the cross section may have a trapezoidal shape to have a larger width of the recess.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

Power supply 100
Transformer 110
Enclosure 111

Claims (10)

A power supply comprising at least one transformer,
The transformer
A plurality of inductors, and
A case housing the inductor,
And a heat dissipation structure on the surface of the case. The method of claim 1,
The case
And a heat dissipation structure attached to the bottom surface of the case. 3. The method of claim 2,
The heat dissipation structure
Power supply having an uneven structure on the lower surface. The method of claim 1,
The case has a power supply device having a concave-convex structure on the lower surface. 5. The method of claim 4,
And a lower surface of the case is formed thicker than the upper surface. 5. The method of claim 4,
The power supply device further comprises a concave-convex structure on the upper surface of the case. The method according to claim 5 or 6,
A power supply device having a rectangular cross section of the uneven structure. The method according to claim 5 or 6,
A power supply device having a cross section of the uneven structure having a trapezoid. The method according to claim 5 or 6,
Power supply comprising a projection on the surface of the uneven structure. 10. The method of claim 9,
The protrusion is formed of a material different from the uneven structure.

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