KR20140000071A - Heating assembly for vacuum deposition and vacuum deposition apparatus having the same - Google Patents

Abstract

Disclosed is a heating assembly for vacuum deposition, wherein the heating assembly heats a carrier on which a deposition material is deposited. The heating assembly is formed by spirally bending or winding a line-shaped or a plate-shaped heating element at least once to have one side open so that the carrier is inserted and mounted. The heating assembly for vacuum deposition stably mounts the carrier on which a deposition material is deposited and makes the deposition material to be evenly and efficiently deposited with a small amount of the carrier by evaporating the deposition material in the particular direction in the vacuum deposition apparatus.

Description

Heating assembly for vacuum deposition and vacuum deposition apparatus having the same {HEATING ASSEMBLY FOR VACUUM DEPOSITION AND VACUUM DEPOSITION APPARATUS HAVING THE SAME}

The present invention relates to a vacuum evaporation assembly, and more particularly, to a vacuum evaporation assembly and a vacuum evaporation apparatus having the same, which deposit a subject by heating a carrier on which a deposition material is supported.

Recently, anti-reflection, optical filtering, control of reflectance and absorptivity, using vacuum deposition processes for various optical lenses and filters including eyeglass lenses, portable electronics and display products such as mobile phones, MP3 players, PMPs, notebooks, Various attempts have been made through deposition coloring. The base material on which vacuum deposition is performed is made of oxides such as silicon oxide, titanium oxide, zirconium oxide, fluoride such as magnesium fluoride, chromium, nickel, aluminum, SUS, etc. on the surface of substrates made of glass, plastic, and metal materials. Attempts have been made to form a thin film deposition layer using inorganic powders such as metals and granular materials to exhibit various properties.

The deposition layer is composed of the metal and metal oxides as described above, which is easily corroded or contaminated by the external environment, resulting in side effects of film deposition. In order to protect this, an organic material is coated to attempt to form a hydrophobic or water repellent film. . Among the methods for depositing these organic substances, a carrier for impregnating organic deposition materials to be used in a vacuum is used.

Such deposition is performed by a vacuum deposition method, that is, a deposition method using an electron beam and a resistive heating method that is a thermal method. In general, the deposition method using an electron beam is advantageous in terms of convenience and automation of the process, but resistance heating method is mainly performed due to the characteristics of the organic deposition material used in vacuum deposition and a carrier that can impregnate it.

However, in the related art, since the deposition material supported on the carrier is heated and scattered in all directions when evaporating, there is a large amount of deposition material and should be as close as possible to the adherend jig. It is disadvantageous that a large number of carriers should be mounted since the deposition performance can be maintained only when secured.

The present invention has been made in order to solve the above problems, to provide a heating assembly for vacuum deposition that can be stably mounted on the carrier on which the deposition material is supported.

In addition, the present invention is to provide a vacuum deposition heating assembly that can increase the deposition efficiency by minimizing the loss of the deposition material supported on the carrier.

In addition, the present invention is to provide a heating assembly for vacuum deposition that can be deposited homogeneously and efficiently while minimizing the number of mounting of the carrier.

In addition, the present invention is to provide a vacuum deposition apparatus having a heating assembly for vacuum deposition as described above.

The present invention provides a heating assembly for heating a carrier on which a deposition material is supported in a vacuum deposition process, wherein the wire or plate-shaped heating element is wound or wound at least one or more times in one spiral so as to be open in one direction so that the carrier can be fitted. Disclosed is a heating assembly for vacuum deposition, characterized in that the molding.

In addition, the heating assembly for vacuum deposition, the carrier mounting portion is inserted into the opening of the carrier toward the adherend; And it discloses a heating assembly for vacuum deposition comprising an electrode connection portion extending to both sides of the carrier mounting portion.

In addition, the carrier mounting portion discloses a vacuum deposition heating assembly, characterized in that one side is opened so that the carrier is fitted, the other side is closed or wound or bent to heat the side and rear of the carrier.

In addition, the vacuum evaporation heat assembly is disclosed a vacuum evaporation heat assembly comprising a material of any one of tungsten, molybdenum, nichrome, carbon, carbon fiber.

In addition, the present invention is a deposition chamber in which a vacuum deposition process is performed; An electrode unit installed in the deposition chamber; And a vacuum deposition apparatus installed in the electrode unit and including the above-described vacuum deposition heating assembly for heating the carrier on which the deposition material is supported.

The heating assembly for vacuum deposition and the vacuum deposition apparatus having the same according to the present invention has the following effects.

(1) The present invention mounts the evaporation type vacuum evaporation assembly or the sputtering evaporation apparatus on the evaporation type vacuum evaporation apparatus or the sputtering type vacuum evaporation apparatus so that the opening direction is directed toward the jig of the adherend, and the carrier on which the deposition material is supported is opened on the front part of the evaporation assembly. Alternatively, the deposition material may be concentrated only on the deposit during vacuum deposition by inserting from the side part, thereby maximizing the deposition efficiency.

(2) In the present invention, even if the position of the carrier is located at the center of the vacuum deposition apparatus, the deposition material can reach the deposit intensively in one direction only at an angle of 30 to 160 degrees, thereby minimizing the loss of the deposition material. Therefore, the deposition performance can be maintained even with the minimum carrier quantity, thereby reducing the cost of the deposition material.

(3) The present invention can reduce the amount of mounting to less than half of the mounting of a large number of carriers can reduce the effort for workers to change the carrier, thereby reducing the work execution time can improve the overall work efficiency have.

1 is a perspective view of a heating assembly for vacuum deposition according to a preferred embodiment of the present invention.
Figure 2 is a side view of the heating assembly for vacuum deposition according to a preferred embodiment of the present invention.
3 is a plan view of a heating assembly for vacuum deposition according to a preferred embodiment of the present invention.
Figure 4 is a plan view showing a state in which the carrier is mounted on the heating assembly for vacuum deposition of the present invention.
FIG. 5 is a rear view illustrating a state in which a carrier is mounted on the heating assembly for vacuum deposition of the present invention.
6 is a left side view showing a state in which a carrier is mounted on the heating assembly for vacuum deposition of the present invention.
7 is a right side view showing a state in which a carrier is mounted on the heating assembly for vacuum deposition of the present invention.
8 is a perspective view of a vacuum deposition apparatus having a heating assembly for vacuum deposition according to a preferred embodiment of the present invention.
9 is a perspective view showing a state in which the heating assembly for vacuum deposition of the present invention is mounted on an electrode portion of a vacuum deposition apparatus.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1, 2 and 3 are a perspective view, a side view and a plan view of a vacuum deposition heating assembly according to a preferred embodiment of the present invention, Figures 4, 5, 6 and 7 is a vacuum deposition heating assembly of the present invention Top, back, left and right side views showing a state in which a carrier is mounted on the support.

As shown in Figures 1 to 7, the vacuum evaporation heating assembly 10 of the present invention is a wire rod or plate-shaped heating element having a thickness of 0.1mm to 3mm one time in a spiral so as to open in one direction (11a) Cylindrical carrier (see Republic of Korea Patent Application Publication No. 10-2009-0011432) (1) open in one direction having a diameter of 2 mm to 50 mm and a thickness of 1 mm to 20 mm by winding up and bending to form a shape that can be mounted upright, 5 mm to 60 mm in diameter and 5 mm to width 20 mm to 80 mm to 250 mm in total length. In the case of producing the heating assembly 10 in the form of a wire, it is preferable to twist the two strands of the wire to each other to form an appropriate length.

More preferably, the wire-shaped or plate-shaped heating element having a thickness of 0.5 mm to 1.5 mm is spirally wound or bent two to five times so that one direction is opened (11a), and in one direction having a diameter of 10 mm to 25 mm and a thickness of 5 mm to 10 mm. The cylindrical carrier (1) opened (1a) is molded so that it can be fitted upright, 10mm to 20mm in diameter, 5mm to 10mm in thickness to form a total length of 100mm to 180mm. At this time, if the size or length of the heat generating assembly 10 is too small or short, it is difficult to mold and it is not easy to mount the carrier 1. In addition, if the size or length of the heat generating assembly 10 is too large or long, the carrier 1 may easily fall out, and heat resistance of the heat generating assembly 10 may occur when resistance heat occurs, thereby making it difficult to transfer heat to the support 1. Therefore, in consideration of this, it is preferable to appropriately form the size or length of the heat generating assembly 10.

In addition, a material such as tungsten, molybdenum, nichrome, carbon, or carbon fiber may be used as the material of the heat generating assembly 10. Most preferably, tungsten, which is relatively inexpensive, has a long service life, and can be used at high temperatures, may be used as the material of the heating assembly 10. In addition, the heat generating assembly 10 is a resistance heating element that uses resistance heat when applying current.

The exothermic assembly 10 includes a carrier mounting portion 11 and an electrode connection portion 13.

The carrier mounting portion 11 is located at the center of the heat generating assembly 10, and one side (front portion) of the carrier 11 is opened (11a) so that the opening 1a of the carrier 1 can be fitted and mounted toward the adherend (not shown). The other side (side and back) is spirally wound or bent at least once so as to heat the side and the back of the carrier 1. In addition, the carrier mounting portion 11 may form an open side surface of the carrier mounting portion 11 by providing a distance between the upper and lower sides of the heating element wound on the side of the carrier mounting portion 11 so that the carrier 1 may be inserted from the side. Can be.

The electrode connection part 13 is positioned at both sides of the heating assembly 10 and extends symmetrically with respect to both sides of the carrier mounting part 11. The electrode connection portion 13 is connected to the electrode portion 23 (see FIG. 8) installed in the vacuum deposition apparatus 20 (see FIG. 8) to supply a current for resistance heating.

The heating assembly 10 for vacuum deposition according to the present invention configured as described above includes an electrode unit installed in an electron beam and a resistance heating vacuum deposition apparatus, a vertical and horizontal eaporator, a resistance heating vacuum deposition apparatus for vertical and horizontal sputters, etc. The electrode rod 23b (see FIG. 9) of 23) is used by mounting one to thirty in series or in parallel so that the open direction is directed in one to four directions.

Hereinafter, a vacuum deposition apparatus provided with a heating assembly for vacuum deposition of the present invention will be described with reference to FIGS. 8 and 9.

8 is a perspective view of a vacuum deposition apparatus having a heating assembly for vacuum deposition according to a preferred embodiment of the present invention, Figure 9 is a state in which the vacuum deposition heating assembly of the present invention mounted on the electrode portion of the vacuum deposition apparatus; It is a perspective view.

8 and 9, the vacuum deposition apparatus 20 of the present invention includes a deposition chamber 21, an electrode unit 23, and a heat generating assembly 10.

The deposition chamber 21 is a place where a vacuum deposition process is performed. Since the deposition chamber 21 can be understood by a known technique, a detailed description thereof will be omitted.

The electrode part 23 is installed inside the deposition chamber 21 to apply a current to the heat generating assembly 10 mounted to the electrode part 23. The electrode portions 23 are provided in the vertical direction in the inner center of the deposition chamber 21 and a plurality of electrode support portions 23a are provided in the one side direction and the other side direction of the electrode support portion 23a, respectively, in a pair. It consists of an electrode bar 23b. The electrode connecting portion 13 of the heating assembly 10 may be fastened to the end of the electrode bar 23b by a screw 23c or the like.

The heating assembly 10 is installed so that one to thirty openings are directed in one direction to four directions in series or in parallel with the electrode unit 23 to heat the carrier 1 on which the deposition material is supported. Since the configuration of the heating assembly 10 has been described above with reference to FIGS. 1 to 7, a description thereof will be omitted.

As described above, the heating evaporation assembly 10 of the present invention is mounted on the electrode portion 23 of the evaporation type or sputtering type vacuum deposition apparatus 20 such that the opening 11a is directed toward the jig (not shown) of the adherend. In addition, by inserting the carrier (1) carrying the deposition material in the open front or side portion of the heating assembly (10) so that the deposition material can be concentrated only on the deposit during vacuum deposition, it is possible to maximize the deposition efficiency. .

In addition, even when the position of the carrier 1 is located at the center of the vacuum deposition apparatus 20, the deposition material can reach the deposit intensively in one direction only at an angle of 30 to 160 degrees, thereby minimizing the loss of the deposition material. Since the deposition performance can be maintained even with the minimum number of carriers (1), the cost of the deposition material can be reduced, and the mounting quantity can be lowered to less than half when the large number of carriers (1) were installed. They can reduce the effort to replace the carrier (1), thereby reducing the work execution time can improve the overall work efficiency.

Here, the deposit used for the deposition is a metal used in portable electronic display products such as mobile phones, smart phones, MP3 players, portable multimedia players (PMP), digital multimedia broadcasting (DMB) receivers, navigation, tablet PCs, notebooks, Panels on sheets of glass and acrylic, polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), acrylic resin (Acrylonitrile butadiene styrene copolymer) and mixed resins thereof Cases, windows, keypads, function key parts, and various accessories made of shapes and various injection moldings are targeted.

According to the present invention, by attaching the adherend to the vacuum deposition apparatus 20 provided with the heating assembly 10 for vacuum deposition, the contaminants contaminated with scratches, fingerprints and contamination prevention, fingerprints, etc. on the surface of the adherend are easily removed. The water contact angle of the surface of the adherend may be 70 degrees to 130 degrees, the contact angle of oil (CH ₂ I ₂ ) may be 80 degrees to 100 degrees, or the surface of the adherend may be 60 degrees to 110 degrees, and the oil (CH ₂ I ₂ ). Forming a contact angle of 30 degrees to 80 degrees makes the fingerprint less visible on the surface of the adherend and the remaining fingerprint can be easily removed.

Hereinafter, the manufacturing method of the vacuum deposition heating assembly of the present invention and the vacuum deposition method using the same will be described.

≪ Example 1 >

Twist two strands of wire rod of 1mm tungsten diameter to 250mm and cut them so that they are wound twice so that the center is 18mm outside and 12mm wide. After winding the outer diameter to 10mm to be heated from the side as well as the rear side of the wire is molded so as to be symmetrical to both sides of the circular one direction is open, the opposite direction is a vacuum evaporation heating assembly (10) To prepare.

≪ Example 2 >

The opening 11a has two upper, middle, and lower portions between the two electrode rods 23b installed in the sputtering vacuum deposition apparatus 20 having a diameter of 1600 mm. After mounting so as to face in opposite directions to each other, the carrier 1 is inserted into the carrier mounting portion 11 of the heating assembly 10 so that the opening 1a faces the adherend.

Subsequently, the glass material was mounted on a jig, and when the inside of the vacuum deposition apparatus 20 became a high vacuum state of 1.5 x 10 ^-5 torr, argon gas was injected to activate the plasma at a power of 0.3 kW to 2.2 x. Activate the adherend surface for 600 seconds by applying 10 ^-2 torr and apply oxygen and argon gas at 4.5kW using Si target to make 1.5 x 10 ^-3 torr and apply 180 seconds to form SiO ₂ layer. Let's do it.

Subsequently, 3.5V and 288A are applied to the exothermic assembly 10 of the present invention, in which the carrier 1 on which the fingerprint and the antifouling coating agent are loaded is applied, thereby preventing the surface modification material from being heated for 240 seconds on the heated carrier 1. It was allowed to deposit on the complex.

Table 1 shows the contact angle and durability results of the deposits with the fingerprint and antifouling coatings deposited thereon.

Sample classification Initial angle
(H ₂ O) Initial angle
(CH ₂ I ₂ ) Abrasion Chemical resistance Brine Prize 115.7 97.0 113.0 114.6 115.3 medium 116.1 96.5 111.6 114.9 115.8 Ha 116.2 96.5 114.3 115.5 115.2

≪ Example 3 >

In the same manner as in Example 2, 3.5V and 288A were applied to the exothermic assembly 10 of the present invention, to which the carrier 1 having the coating agent having excellent fingerprint visibility was inserted, for 240 seconds in the heated carrier 1. The surface modification material was allowed to deposit on the deposit. Table 2 shows the contact angles and durability results of the deposits with the coating coating having excellent fingerprint visibility.

Sample classification Initial angle
(H ₂ O) Initial angle
(CH ₂ I ₂ ) Abrasion Chemical resistance Brine Prize 80.1 39.6 73.5 72.8 72.5 medium 81.1 39.8 74.2 70.3 70.4 Ha 81.9 43.5 74.4 70.3 77.2

While the present invention has been described in connection with certain exemplary embodiments, it will be understood by those skilled in the art that various changes may be made without departing from the scope of the present invention. In addition, the description in parentheses in the description of the claims is intended to prevent obscuration of the description, and the scope of the claims of the claims should be construed to include all the items in parentheses.

10: heating assembly
11: carrier mounting portion
13: electrode connection
20: vacuum deposition apparatus
21: deposition chamber
23: electrode portion

Claims (5)

In the exothermic assembly for heating the carrier on which the deposition material is supported in a vacuum deposition process,
Heat-generating assembly for vacuum deposition, characterized in that the wire-shaped or plate-shaped heating element is formed by winding or bending at least one or more times in a spiral so that one side direction is open so that the carrier can be fitted. The method of claim 1, wherein the vacuum deposition heating assembly,
A carrier mounting portion in which an opening of the carrier is fitted toward the adherend; And
Heating assembly for vacuum deposition comprising an electrode connection portion extending to both sides of the carrier mounting portion. 3. The method of claim 2,
The carrier mounting portion is one side is open so that the carrier is fitted, the other side is wound or bent to heat the side of the carrier to heat the vacuum assembly, characterized in that the finishing assembly. The method of claim 1, wherein the vacuum deposition heating assembly,
A heating evaporation assembly for vacuum deposition, comprising any one of tungsten, molybdenum, nichrome, carbon, and carbon fiber. A deposition chamber in which a vacuum deposition process is performed;
An electrode unit installed in the deposition chamber; And
The vacuum deposition apparatus installed in the electrode unit, comprising a heating assembly of claim 1 for heating the carrier on which the deposition material is supported.

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