KR20130133226A - Process for production of laminate - Google Patents

Abstract

This invention is a manufacturing method of the laminated body which has a process which processes the laminated body block which has a board | substrate and the reinforcement board which reinforces the said board | substrate, and obtains a laminated body, The said reinforcement board is a resin layer couple | bonded so that peeling is possible to the said board | substrate. And a support plate for supporting the substrate via the resin layer, wherein the laminate block is formed such that the external shape of the support plate and the external shape of the resin layer are larger than the external shape of the substrate, respectively, and the processing step is the laminate block. Among them, the present invention relates to a method for producing a laminate having a cutting step of cutting each outer peripheral portion of the support plate and the resin layer to align the entire circumference or part of each outer peripheral edge of the support plate, the resin layer and the substrate. .

Description

Manufacturing method of laminated body {PROCESS FOR PRODUCTION OF LAMINATE}

The present invention relates to a method for producing a laminate.

Electronic devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic EL displays (OLEDs), display panels, solar cells, thin film secondary batteries, and the like are desired to be thinner and lighter, and to be used in these electronic devices. The thinning of the substrate to be processed is in progress. If the rigidity of the substrate is lowered by thinning, the handling property of the substrate is deteriorated. In addition, when thickness of a board | substrate changes by thinning, manufacture of the electronic device using an existing installation becomes difficult.

Therefore, a reinforcement plate is affixed to a board | substrate, and it is set as a laminated block, and a predetermined | prescribed functional layer (for example, conductive layer) is formed on the board | substrate of a laminated block, and then a reinforcement board from the board | substrate of a laminated block. The method of peeling off is proposed (for example, refer patent document 1). According to the said method, the handleability of a board | substrate can be ensured and a thin electronic device using the existing installation can be manufactured.

The reinforcement plate has a resin layer which is detachably bonded to the substrate, and a support plate for supporting the substrate via the resin layer. The resin layer is formed by applying and curing a resin composition having fluidity on a support plate. The resin composition is, for example, a silicone resin composition, and includes a linear polyorganosiloxane having a vinyl group and methylhydrogenpolysiloxane having a hydrosilyl group and is cured by heating in the presence of a platinum catalyst. The resin layer which this resin composition contains hardened | cured material is excellent in heat resistance and peelability.

Japanese Patent Laid-Open No. 2007-326358

9 is a side view of a conventional laminate block. The laminate block 1 has a substrate 2 and a reinforcing plate 3 for reinforcing the substrate 2. The reinforcing plate 3 has a resin layer 4 that is detachably bonded to the substrate 2, and a supporting plate 5 that supports the substrate 2 via the resin layer 4.

The laminated body block 1 has the thickness nonuniformity 6 of the resin layer 4 resulting from the application nonuniformity of the resin composition. This thickness nonuniformity 6 was prominent in the vicinity of the outer periphery of the resin layer 4, and might distort the board | substrate 2 bonded to the resin layer 4 in some cases.

In addition, in the laminated body block 1, the board | substrate 2 and the support plate 5 are chamfered from an impact resistance viewpoint, and since the external shape of the resin layer 4 is formed smaller than the external shape of the board | substrate 2, It has the recessed part 7 in the side surface.

The laminated body block 1 is provided in the manufacturing process of an electronic device, and the functional layer, such as a conductive layer, is pattern-formed on the board | substrate 2. Coating liquid, such as a resist liquid, is used for pattern formation of a functional layer in many cases.

When the coating liquid is drawn into the recess 7 on the side face of the laminate block 1 by capillary phenomenon, it is difficult to remove the coating liquid, and it is easy to remain as foreign matter after drying. This foreign matter, when heated in a subsequent step, becomes a pollution source that contaminates the functional layer or the like, thereby lowering the yield of the electronic device.

Therefore, the laminated body block 1 may be processed beforehand for the purpose of removing the recessed part 7 and improving impact resistance. Examples of the processing include cutting (including cutting and cutting), chamfering and polishing, but before chamfering, cutting is performed from the viewpoint of processing efficiency, and each of the supporting plate 5, the resin layer 4, and the substrate 2 is cut. It is desirable to align the entire circumference or part of the outer circumference.

However, if the support plate 5, the resin layer 4, and the board | substrate 2 are to be cut | disconnected all, there exists a problem in workability.

In particular, when both of the support plate 5 and the substrate 2 are made of brittle material, groove-shaped cut lines are formed on both surfaces of the support plate 5 and the substrate 2, and the laminate block is opened so that each cut line is opened. Since bending stress is applied to (1) and the laminated body block 1 is cut | disconnected from both sides, there exists a problem in workability.

This invention is made | formed in view of the said subject, and an object of this invention is to provide the manufacturing method of a laminated body which can manufacture the laminated body suitable for manufacture of an electrical device efficiently.

MEANS TO SOLVE THE PROBLEM In order to solve the said objective, this invention is a manufacturing method of the laminated body which has a process which obtains a laminated body by processing the laminated body block which has a board | substrate and the reinforcement board which reinforces the said board | substrate,

The reinforcement plate is composed of a resin layer that is detachably bonded to the substrate and a support plate for supporting the substrate via the resin layer,

The said laminated body block is formed so that the external shape of a support plate and the external shape of a resin layer may become larger than the external shape of a board | substrate, respectively,

The said processing process cuts out the outer periphery of each of the said support plate and the said resin layer among the said laminated body blocks, and arrange | positions the whole periphery or a part of each outer periphery of the said support plate, the said resin layer, and the said board | substrate. The manufacturing method of the laminated body which has is provided.

In the present invention, in at least a part of the cutting step, the main surface of the substrate of the laminate block is supported by a stage, and the positioning of the outer periphery of the substrate of the laminate block is provided on the stage. It is preferable to contact the block.

In the present invention, the support plate is made of a brittle material, and in the cutting step, after forming a cut line on the surface of the support plate of the laminate block, the support plate of the laminate block along the cut line and It is preferable to cut each outer peripheral part of the said resin layer.

In the present invention, the processing step preferably further includes a chamfering step of chamfering the outer peripheral portion of the laminate obtained by cutting the laminate block.

In this invention, it is preferable that the said process process further has the grinding | polishing process of surface-polishing the board | substrate of the said laminated body obtained by chamfering.

According to this invention, the manufacturing method of the laminated body which can manufacture the laminated body suitable for manufacture of an electrical device efficiently can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view of the laminated body block used by the manufacturing method of the laminated body which concerns on one Embodiment of this invention.
FIG. 2 is a side view of the laminate obtained by cutting the outer peripheral portion of the laminate block of FIG. 1. FIG.
3 is a side view of the laminate obtained by chamfering the outer peripheral portion of the laminate of FIG. 2.
4 is a side view of the laminate obtained by surface polishing the substrate of the laminate of FIG. 3.
FIG. 5: is a top view which shows through and partially shows the laminated body block mounted on the stage. FIG.
FIG. 6 is a side view showing a part of the laminate block and the processing head stacked on the stage. FIG.
7 is a side view illustrating a laminate block and a fitting jig loaded on another stage.
FIG. 8 is a side view illustrating a modification of the laminate block of FIG. 1. FIG.
9 is a side view of a conventional laminate block.

EMBODIMENT OF THE INVENTION Hereinafter, although the form for implementing this invention is demonstrated with reference to drawings, in the figure, the same code | symbol is attached | subjected to the same structure.

(Laminate)

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view of the laminated body block used by the manufacturing method of the laminated body which concerns on one Embodiment of this invention.

As shown in FIG. 1, the laminated body block 10 has the board | substrate 20 and the reinforcement board 30 which reinforces the board | substrate 20. As shown in FIG. The reinforcement board 30 is comprised from the resin layer 32 couple | bonded with the board | substrate 20 so that exfoliation is possible, and the support plate 34 which supports the board | substrate 20 via the resin layer 32. As shown in FIG.

After the laminate block 10 is processed, it is used for the manufacture of a product having the substrate 20 as part of the product structure. The reinforcement board 30 peels from the board | substrate 20 during the manufacturing process of a product, and does not become a part of a product structure. Examples of products include electronic devices such as display panels, solar cells, and thin film secondary batteries.

Since the laminated body block 10 manufactures an electronic device using the processing apparatus which processes the conventional board | substrate (the board | substrate not reinforced by a reinforcing board), it may have a thickness substantially the same as a conventional board | substrate. Hereinafter, each structure is demonstrated based on FIG.

(Board)

The substrate 20 is a substrate for an electronic device. On the surface of the board | substrate 20, a predetermined | prescribed functional layer (for example, conductive layer) is formed in the manufacturing process of an electronic device. The kind of functional layer is selected according to the kind of electronic device, and several functional layers may be laminated | stacked on the board | substrate 20 one by one.

Although the kind of substrate 20 is not specifically limited, For example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, etc. are mentioned. Among these, a glass substrate is preferable. It is because a glass substrate is excellent in chemical resistance and moisture permeability, and its line expansion coefficient is small. If the coefficient of linear expansion is large, the manufacturing process of the electronic device often involves a heat treatment, and therefore various problems are likely to occur. For example, when the substrate 20 on which the TFT (thin film transistor) is formed is cooled under heating, there is a fear that the positional shift of the TFT may be excessive due to heat shrinkage of the substrate 20.

Although it does not specifically limit as glass of a glass substrate, For example, the alkali type glass which contains a alkali free glass, borosilicate glass, soda-lime glass, high silica glass, and other silicon oxide as a main component is mentioned. As oxide type glass, glass with a content of 40-90 mass% of the silicon oxide by oxide conversion is preferable.

As glass of a glass substrate, the glass suitable for the kind of electronic device and its manufacturing process is employ | adopted. For example, the glass substrate for liquid crystal panels consists of glass (alkali free glass) which does not contain an alkali metal component substantially. Thus, the glass of a glass substrate is suitably selected based on the kind of electronic device applied and its manufacturing process.

When flexibility is required as a characteristic of the electronic device, a resin substrate is used as the substrate 20. The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

As said crystalline resin, polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, syndiotactic polystyrene, etc. which are thermoplastic resins are mentioned, for example, Polyphenyl is mentioned. Len sulfide, a polyether ether ketone, a liquid crystal polymer, a fluororesin, a polyether nitrile, etc. are mentioned.

As said amorphous resin, polycarbonate, modified polyphenylene ether, polycyclohexene, or polynorbornene-type resin etc. which are thermoplastic resins are mentioned, for example, As a thermosetting resin, polysulfone, polyether sulfone , Polyarylate, polyamideimide, polyetherimide, or thermoplastic polyimide.

As resin of a resin substrate, resin which is amorphous and thermoplastic is especially preferable.

The thickness of the substrate 20 is set according to the type of the substrate 20. For example, in the case of a glass substrate, for light weight and thinning of an electronic device, Preferably it is 0.7 mm or less, More preferably, it is 0.3 mm or less, More preferably, it is 0.1 mm or less.

As shown in FIG. 1, the outer peripheral surface of the substrate 20 is a surface perpendicular to the main surface of the substrate 20. Thereby, a gap can be prevented from being formed between the board | substrate 20 and the resin layer 32, and it can suppress that the periphery of a gap falls out in the chamfering process mentioned later.

(Resin layer)

When the resin layer 32 is in close contact with the substrate 20, the position shift of the substrate 20 is prevented until the peeling operation is performed. The resin layer 32 peels easily from the board | substrate 20 by a peeling operation. By peeling easily, the damage of the board | substrate 20 can be prevented and peeling in an unintentional position can be prevented.

The resin layer 32 is formed so that the bonding force with the support plate 34 may become relatively higher than the bonding force with the board | substrate 20 (the formation method is mentioned later). Thereby, when peeling operation is performed, peeling of the laminated body block 10 in the position which it does not intend can be prevented.

The initial peel strength between the resin layer 32 and the board | substrate 20 depends on the manufacturing process of an electronic device. For example, when the board | substrate 20 uses the polyimide film (made by Toray Dupont, Kapton 200HV) of 0.05 mm in thickness, in the following peeling test, the lower limit of initial stage peeling strength is 0.3 N / 25mm, Preferably 0.5 N / 25 mm, more preferably 1 N / 25 mm. Moreover, the upper limit of initial stage peeling strength is 10N / 25mm, Preferably it is 5N / 25mm. Here, "initial peel strength" means the peel strength just after manufacture of the laminated body block 10, and means the peel strength measured at room temperature.

If the initial peel strength is 0.3 N / 25 mm or more, unintended separation can be sufficiently limited. On the other hand, when the initial peeling strength is 10 N / 25 mm or less, when the positional relationship between the resin layer 32 and the substrate 20 is corrected, the peeling of the resin layer 32 from the substrate 20 becomes easy.

In addition, a peeling test is shown by the following measuring method.

The resin layer 32 is formed in the whole surface on the support plate 34 of length 25mm x width 75mm, and the longitudinal surface of one of the support plate 34 and the board | substrate 20 aligns the board | substrate 20 of length 25mm x width 50mm. The laminated material is regarded as an evaluation sample. Then, the surface facing the surface of the resin layer side of the substrate 20 of this sample is fixed to the end of the inspection table with double-sided tape, and then the center portion of the supporting plate (25 × 25 mm) that is pushed out is perpendicular to each other by using a digital force gauge. It peels up and measures peeling strength.

The peeling strength after heating between the resin layer 32 and the board | substrate 20 is based on the manufacturing process of an electronic device, In the said peeling test, it is preferable that it is 8.5 N / 25 mm or less, for example, 7.8 N / 25 mm or less Is more preferable, and it is more preferable that it is 4.5N / 25mm or less. Here, "peel strength after heating" means the peel strength measured at room temperature after the resin layer 32 is heated to 350 degreeC (equivalent to the formation temperature of the amorphous silicon layer which comprises a thin film transistor).

Unintentional separation can fully be limited if the peeling strength after heating is 0.3 N / 25 mm or more. On the other hand, when the peeling strength after heating is 10 N / 25 mm or less, peeling of the resin layer 32 from the board | substrate 20 will become easy.

Resin of the resin layer 32 is not specifically limited. For example, as resin of the resin layer 32, an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin, a polyimide silicone resin, etc. are mentioned. Several types of resin can also be mixed and used. Especially, a silicone resin and polyimide silicone resin are preferable from a heat resistant or peelable viewpoint.

Although the thickness of the resin layer 32 is not specifically limited, Preferably it is 1-50 micrometers, More preferably, it is 5-30 micrometers, More preferably, it is 7-20 micrometers. By setting the thickness of the resin layer 32 to 1 µm or more, deformation of the substrate 20 can be suppressed when bubbles or foreign matter are mixed between the resin layer 32 and the substrate 20. Moreover, when the thickness of the resin layer 32 is 5 micrometers, the foreign material (foreign material generate | occur | produced by the hardening unevenness of a fiber and resin) of several micrometers units which are easy to generate | occur | produce in a clean room is easy to be embedded in the resin layer 32. Preferred at On the other hand, when the thickness of the resin layer 32 is 50 micrometers or less, the formation time of the resin layer 32 can be shortened and it is economical because resin of the resin layer 32 is not used more than necessary.

The outer shape of the resin layer 32 is formed larger than the outer shape of the board | substrate 20. FIG. Thereby, the board | substrate 20 can be attached to the flat part of the resin layer 32, and the distortion of the board | substrate 20 can be reduced. In order to sufficiently reduce the distortion of the substrate 20, the substrate 20 may not be attached to an area within 15 mm (more preferably within 20 mm, most preferably within 25 mm) of the outer periphery of the resin layer 32. desirable. It is because the thickness nonuniformity 12 which originates in the application nonuniformity of a resin composition is remarkable in the area within 15 mm from the outer periphery of the resin layer 32.

(Support plate)

The support plate 34 supports and reinforces the substrate 20 via the resin layer 32. The support plate 34 prevents deformation, scratches, damage, and the like of the substrate 20 in the manufacturing process of the electronic device.

Although the kind of support plate 34 is not specifically limited, For example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, a glass / resin composite plate, etc. are used. The kind of support plate 34 is selected according to the kind of electronic device, the kind of board | substrate 20, etc., and if it is the same type as the board | substrate 20, since the thermal expansion difference of the support plate 34 and the board | substrate 20 is small, the curvature by heating Can be suppressed.

Although the difference (absolute value) of the average linear expansion coefficient of the support plate 34 and the board | substrate 20 is set suitably according to the external shape etc. of the board | substrate 20, it is preferable that it is ^{35x10 <-7>} / degreeC or less, for example. Here, an "average linear expansion coefficient" means the average linear expansion coefficient (JIS R 3102: 1995) in the temperature range of 50-300 degreeC.

The thickness of the support plate 34 is not specifically limited, In order to make the laminated body block 10 suitable for an existing processing installation, it is preferable that it is 0.7 mm or less. In addition, the thickness of the support plate 34 is preferably 0.4 mm or more in order to reinforce the substrate 20. The support plate 34 may be thicker or thinner than the substrate 20.

The outer shape of the support plate 34 is formed larger than the outer shape of the substrate 20, and is equivalent to the outer shape of the resin layer 32 or larger than the outer shape of the resin layer 32.

(Method of Manufacturing Laminate Block)

As a method of manufacturing the laminated body block 10, (1) after apply | coating and hardening the resin composition which has fluidity | liquidity on the support plate 34, after forming the resin layer 32, the board | substrate ( 20) The method of crimping | bonding (2) after apply | coating the resin composition which has fluidity | liquidity on a predetermined base material, and hardening | curing to form the resin layer 32, the resin layer 32 is peeled from a predetermined base material, and a film In the form, the method is sandwiched between the substrate 20 and the support plate 34 and pressed. (3) The resin composition is sandwiched and cured between the substrate 20 and the support plate 34 to form the resin layer 32. Etc.

In the method of said (1), when a resin composition hardens, since a resin composition interacts with the support plate 34, the bonding force of the support plate 34 and the resin layer 32 is the resin layer 32 and the board | substrate 20 It is easy to be higher than the binding force of).

The method of said (2) is effective when the bonding force after the crimping | bonding of the resin layer 32 is low with respect to the board | substrate 20, and high with respect to the support plate 34. FIG. Before contact with the resin layer 32, the surface of the board | substrate 20 or the support plate 34 may be surface-treated, and a difference may be produced in the bonding force after crimping with the resin layer 32. FIG.

The method of said (3) is effective when the bonding force after hardening of a resin composition is low with respect to the board | substrate 20, and high with respect to the support plate 34. The surface of the board | substrate 20 or the support plate 34 may be surface-treated before contact with a resin composition, and difference may be produced in the bonding force after hardening of a resin composition.

In the method of said (1)-(3), the kind of resin composition is not specifically limited. For example, although a resin composition is classified into a condensation reaction type, an addition reaction type, an ultraviolet curing type, and an electron beam curing type according to a hardening mechanism, all can be used. Among these, addition reaction type is preferable. This is because the degree of peelability is good and the heat resistance is high when the curing reaction is easy and the resin layer 32 is formed.

In addition, although a resin composition is classified into a solvent type, an emulsion type, and a non-solvent type according to the form, all can be used. Of these, no-solvent formulations are preferred. This is because the productivity and the environmental characteristics are excellent. The reason for this is that bubbles are not contained in the resin layer 32 because they do not include a solvent that generates foaming when the resin layer 32 is formed, that is, heat curing, ultraviolet curing or electron beam curing. This is because it is difficult to remain.

As a silicone resin composition which is addition reaction type and is a solventless type | mold, the linear polyorganosiloxane which has a vinyl group, and the methylhydrogen polysiloxane which has a hydrosilyl group may be included. This silicone resin composition is heat-hardened in presence of a platinum catalyst, and becomes a silicone resin layer.

Examples of the coating method of the resin composition include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. These coating methods are suitably selected according to the kind of resin composition.

The coating amount of a resin composition is suitably selected according to the kind of resin composition, etc. For example, in the case of the silicone resin composition, it is preferably 1 to 100 g / m ² , more preferably 5 to 20 g / m ² .

Curing conditions of a resin composition are suitably selected according to the kind etc. of resin composition. For example, when 2 mass parts of platinum-type catalysts are mix | blended with the said silicone resin composition and 100 mass parts of linear polyorganosiloxane and methylhydrogen polysiloxane, the temperature heated in air | atmosphere is 50 degreeC-250 ° C, preferably 100 ° C to 200 ° C. In addition, the reaction time in this case is 5 to 60 minutes, Preferably it is 10 to 30 minutes. When the curing conditions of the resin composition are in the range of the reaction time and in the reaction temperature range, oxidative decomposition of the silicone resin does not occur at the same time, a low molecular weight silicone component is not produced, and silicone transferability does not increase.

In the above methods (1) and (2), the crimping is preferably performed in an environment with high cleanliness. As a crimping | bonding system, there exist a roll type | mold, a press type | mold, etc. Although the atmosphere which performs crimping | compression-bonding may be atmospheric pressure atmosphere, in order to suppress mixing of a bubble, it is preferable that it is a reduced pressure atmosphere. Although the temperature which crimps | compresses may be higher than room temperature, in order to prevent deterioration of the resin layer 32, it is preferable that it is room temperature.

(Manufacturing method of laminated body)

The manufacturing method of a laminated body has the processing process of processing the laminated body block 10, and obtaining a laminated body.

FIG. 2 is a side view of the laminate obtained by cutting the outer peripheral portion of the laminate block of FIG. 1. FIG. In FIG. 2, the shape of the part removed by processing a laminated body block is shown with the dashed-dotted line. 3 is a side view of the laminate obtained by chamfering the outer peripheral portion of the laminate of FIG. 2. In FIG. 3, the state before chamfering is shown by the dashed-two dotted line. 4 is a side view of the laminate obtained by surface polishing the substrate of the laminate of FIG. 3. In FIG. 4, the state before surface grinding | polishing is shown by the dashed-dotted line.

The machining step includes a cutting step (see FIG. 2) of cutting the outer peripheral part of the laminate block 10 to obtain a laminate 10A, and a chamfering step of chamfering the outer peripheral part of the laminate 10A to obtain a laminate 10B. (Refer FIG. 3) and the grinding | polishing process (refer FIG. 4) which obtains the laminated body 10C by surface-polishing the board | substrate of the laminated body 10B. The laminated body 10C obtained after a grinding | polishing process is wash | cleaned and dried as needed, and is provided to the manufacturing process of an electronic device.

In order to improve the processing efficiency in a chamfering process, a cutting process is a process of cutting the outer peripheral part of the laminated body block 10, and aligning the whole periphery or a part of the outer periphery of each of the support plate, the resin layer, and the board | substrate. Here, "aligning the whole periphery or a part of the outer periphery of each of the support plate, the resin layer, and the board | substrate" means that the whole periphery or a part of the outer periphery of each of the support plate, the resin layer, and the board | substrate overlaps. Means that.

In the cutting process of this embodiment, the outer peripheral part is cut | disconnected, respectively, in the laminated body block 10, and becomes the support plate 34A and the resin layer 32A. Thereby, as shown in FIG. 2, the perimeter or one part of the outer periphery of each of the support plate 34A, the resin layer 32A, and the board | substrate 20 is aligned. Therefore, since the outer peripheral part of the board | substrate 20 is not cut | disconnected, workability in a cutting process improves. In addition, the detail of a cutting process is mentioned later.

The laminated body 10A obtained by cutting has the board | substrate 20 and 30A of reinforcement boards which reinforce the board | substrate 20. FIG. 30 A of reinforcement boards consist of 32 A of resin layers couple | bonded with the board | substrate 20 so that peeling is possible, and 34 A of support plates which support the board | substrate 20 via 32 A of resin layers.

A chamfering process is a process of chamfering the outer peripheral part of 10 A of laminated bodies in order to improve impact resistance. In this step, the outer periphery of the substrate 20, the resin layer 32A, and the support plate 34A are ground to form the substrate 20B, the support plate 34B, and the resin layer 32B, respectively.

The chamfer rotates the grindstone around the center axis of the grindstone, for example, while moving the grindstone along the outer periphery of the laminate 10A while the outer peripheral surface of the discoid grindstone is in contact with the outer periphery of the laminate 10A. Is done. The chamfer may be an R chamfer or a C chamfer, and the type of the chamfer is not limited. The part which chamfers among the outer peripheral parts of 10 A of laminated bodies may include the part by which the outer periphery is aligned, and may include the part in which the outer periphery is not aligned.

By chamfering, it is also possible to reduce the damage to the board | substrate 20B and a polishing pad in a grinding | polishing process. In order to prevent damage to the substrate 20B and the polishing pad, and to increase the impact resistance, it is preferable to chamfer the entire circumference of the outer peripheral portion of the laminate 10A. In this case, in the cutting step, the support plate ( It is preferable to align the outer circumferences of the 34A), the resin layer 32A, and the substrate 20 over the entire circumference.

The laminated body 10B obtained by chamfering has the board | substrate 20B and the reinforcement board 30B which reinforces the board | substrate 20B. The reinforcement board 30B is comprised from the resin layer 32B couple | bonded with the board | substrate 20B so that peeling is possible, and the support plate 34B which supports the board | substrate 20B via the resin layer 32B.

In order to raise the flatness of a board | substrate surface, a grinding | polishing process is a process of surface-polishing the board | substrate 20B of the laminated body 10B obtained by chamfering. In this step, the substrate 20B is surface polished to become the substrate 20C.

In the polishing step, since the reinforcing plate 30B is attached to the substrate 20B, the deformation of the substrate 20B is suppressed. The method of surface-polishing the board | substrate 20B is selected according to the kind of board | substrate 20B. For example, in the case of a glass substrate, polishing using ceria abrasive grains is performed.

The laminated body 10C obtained by grinding | polishing has 20 C of board | substrates, and the reinforcement board 30B which reinforces 20 C of board | substrates. The reinforcement board 30B is comprised from the resin layer 32B couple | bonded with the board | substrate 20B so that exfoliation is possible, and the support plate 34B which supports the board | substrate 20C via the resin layer 32B.

In addition, in this embodiment, although the processing process has the cutting process, the chamfering process, and the grinding | polishing process, this invention is not limited to this. That is, the processing step should just have a cutting process at least, and does not need to have a chamfering process or a grinding | polishing process.

Next, the detail of a cutting process is demonstrated based on FIG. FIG. 5 is a plan view partially illustrating a laminated block stacked on a stage, FIG. 6 is a side view illustrating a partially broken laminate block and a processing head loaded on a stage, and FIG. 7 is on another stage. It is a side view which shows the stacked laminated block and the fitting support jig | tool.

As shown in FIG. 5, in the cutting process, the main surface of the substrate 20 of the laminate block 10 is supported by the stage 50, and the outer circumferential edge of the substrate 20 of the laminate block 10 is provided. The positioning blocks 51 to 53 provided on the stage 50 are in contact with each other.

For example, while the lower surface of the substrate 20 is supported on the upper surface of the stage 50, the two sides 21 and 22 perpendicular to each other of the rectangular substrate 20 are placed on the positioning blocks 51 to 53. Contact. Thereafter, the moving blocks 54 and 55 approach and contact each of the remaining sides 23 and 24 of the substrate 20 from the direction of the arrow.

In this manner, in at least a part of the cutting step (for example, the step of forming the cut line 36 to be described later), when the outer periphery of the substrate 20 contacts the positioning blocks 51 to 53, the substrate 20 ) And the alignment accuracy of the stage 50 is improved. Therefore, the outer periphery of the board | substrate 20 and the outer periphery of 34 A of support plates and 32 A of resin layers are aligned with high precision.

Subsequently, the inside of the suction hole provided in the upper surface of the stage 50 in multiple numbers is decompressed by a vacuum pump, etc., and the board | substrate 20 is adsorb | sucked on the upper surface of the stage 50. In order to protect the board | substrate 20, the resin film etc. may be provided in the upper surface of the stage 50. FIG.

Subsequently, the imaging device picks up the stacked body block 10 on the stage 50. The captured image is transmitted to a computer. The computer image-processes the received image, and detects the outer circumference of the substrate 20 and the positional relationship of the stage 50.

Subsequently, the computer relatively moves the processing head 60 for processing the laminated body block 10 with respect to the stage 50 based on the image processing result. The movement trajectory of the processing head 60 is controlled to overlap the outer periphery of the substrate 20 in plan view.

In addition, in this embodiment, although the computer used the image processing result in order to control the movement trajectory of the processing head 60, the shape of the board | substrate 20 previously recorded on recording media, such as a hard disk, etc. instead. Information about the dimensions may be used. In that case, the imaging device becomes unnecessary.

The processing head 60 is comprised according to the kind, thickness, etc. of the support plate 34. FIG. For example, when the support plate 34 is made of brittle material such as glass, ceramics or semiconductor, the processing head 60 forms cut lines 36 on the surface of the support plate 34 as shown in FIG. 6. And the cutter 62 or the like.

The cutter 62 is, for example, in the shape of a disk, and its outer circumferential portion is formed of diamond, a super alloy, or the like, and is rotatably supported by the holder 64. When the holder 64 is moved relatively in the in-plane direction of the support plate 34 while the outer peripheral portion of the cutter 62 is pressed against the surface of the support plate 34, the surface of the support plate 34 is rotated while the cutter 62 rotates. A cutting line 36 is formed in the. Four cutting lines 36 are provided corresponding to the four sides 21 to 24 of the rectangular substrate 20, and the substrates 20 are formed to overlap with the corresponding sides in plan view, respectively. Each cutting line 36 extends from one side to the other side of the supporting plate 34 so as to divide the surface of the supporting plate 34.

In addition, although the processing head 60 of this embodiment is comprised with the cutter 62 etc., you may be comprised with the laser light source etc. The laser light source irradiates spot light onto the surface of the support plate 34. Spot light is scanned on the surface of the support plate 34, and forms the cutting line 36 by thermal stress.

In addition, although the processing head 60 of this embodiment supposes that the cutting line 36 is formed in the surface of the support plate 34, this invention is not limited to this. For example, when the support plate 34 is comprised with resin, the processing head 60 should just divide the support plate 34 and the resin layer 32, In this case, it consists of a knife etc. On the other hand, when the support plate 34 is made of a material having a relatively low melting point such as glass, resin, or metal, the processing head 60 melts the support plate 34 and the resin layer 32. In this case, the heat source (For example, a laser light source) and the like.

After the cutting line 36 is formed by the processing head 60, the vacuum pump is stopped and the suction hole is opened to the atmosphere to release the suction. Subsequently, the moving blocks 54 and 55 are spaced apart from the substrate 20, and the substrate 20 is spaced apart from the positioning blocks 51 to 53. Thereafter, the laminate block 10 can be lifted upward from the stage 50, and is transferred above the other stage 70. Subsequently, the laminated body block 10 is lowered and is mounted on the stage 70.

Subsequently, as shown in FIG. 7, the inside of the suction hole provided in the plurality of upper surfaces of the stage 70 is decompressed by a vacuum pump or the like, and the substrate 20 is adsorbed onto the upper surface of the stage 70. In this state, one cut line 36 is pushed out of the stage 70.

Subsequently, the part outside the one cutting line 36 is clamped by the clamping jig 72 in the plate | board thickness direction. In this state, when the fitting support jig 72 is rotated downward, the bending stress overlaps with the support plate 34 and the resin layer 32, and thus cracks are formed in the plate thickness direction starting from one cut line 36. 37 is extended, and the support plate 34 and the resin layer 32 are cut | disconnected at once.

Subsequently, the adsorption of the substrate 20 on the stage 50 is released, and the laminate block 10 is adsorbed again after the parallel movement or 90 ° rotation. Thereafter, the support plate 34 and the resin layer 32 are cut along the other cut line 36. This is repeated, and the support plate 34 and the resin layer 32 are cut along the four cutting lines 36.

In addition, in this embodiment, in order to cut | disconnect, the laminated body block 10 is supposed to be conveyed from the stage 50 to another stage 70, but it is parallel movement or 90 degree rotation on the same stage 50. After the cutting, the cutting may be performed.

(Manufacturing method of an electronic device)

The manufacturing method of an electronic device peels a reinforcement board from the formation process which forms a predetermined | prescribed functional layer (for example, conductive layer) on the board | substrate of 10 C of laminated bodies, and the board | substrate which provided the predetermined | prescribed functional layer. It has a peeling process. Instead of the stack 10C, the stack 10A or the stack 10B may be used.

In the formation process, as a method of forming a predetermined | prescribed functional film, the photolithographic method, the etching method, the vapor deposition method, etc. are used, for example. In addition, in order to pattern-form a functional layer, coating liquids, such as a resist liquid, are used.

In the peeling process, as a method of peeling a reinforcement board from a board | substrate, the method of separating a board | substrate side and a support plate side after inserting a razor etc. between the resin layer and board | substrate which comprise a reinforcement board, and making a clearance gap is used, for example. .

The method of manufacturing the electronic device may further have a step of laminating another functional layer on the substrate or the functional layer after the peeling step.

Moreover, in the method of manufacturing an electronic device, an electronic device is assembled using the two sets of laminated bodies 10C in which the predetermined | prescribed functional layer was formed, and a reinforcement board is respectively respectively from the board | substrate of two sets of laminated bodies 10C. The method of peeling off may be sufficient.

Next, the specific example of the manufacturing method of an electronic device is demonstrated.

The manufacturing method of a liquid crystal display (LCD), for example, forms a TFT substrate on a substrate of a laminate to produce a TFT substrate, and forms a CF on a substrate of another laminate, It has a CF board | substrate manufacturing process which manufactures a board | substrate. Moreover, the manufacturing method of a liquid crystal panel has the granulation process which seals a liquid crystal material between a TFT board | substrate and a CF board | substrate, and the peeling process which peels a reinforcement board from the board | substrate of each laminated body.

In the TFT substrate fabrication process or the CF substrate fabrication process, as a method of forming a TFT (thin film transistor) or CF (color filter), for example, a photolithography method, an etching method, or the like is used. In addition, in order to pattern-form TFT, CF, etc., a resist liquid is used as a coating liquid.

In addition, the substrate surface of a laminated body may be wash | cleaned before a TFT board | substrate manufacturing process and a CF board | substrate manufacturing process. As a washing method, well-known dry washing and wet washing are used.

In the assembling process, a liquid crystal material is injected between the TFT substrate and the CF substrate. As a method of inject | pouring a liquid crystal material, there exist a pressure reduction injection method and the dropping injection method.

In the reduced pressure injection method, for example, first, a TFT substrate and a CF substrate are bonded through a sealing material and a spacer material, and a large panel is produced. At this time, a large panel is produced and cut | disconnected into several cell so that TFT or CF may be arrange | positioned inside. Subsequently, the inside of each cell is made into a pressure-reduced atmosphere, and after a liquid crystal material is injected into each cell from an injection hole, an injection hole is sealed. Subsequently, a polarizing plate is attached to each cell, and a backlight etc. are attached and a liquid crystal display is manufactured.

In the drop injection method, for example, first, a liquid crystal material is added dropwise to any one of the TFT substrate and the CF substrate, and then the TFT substrate and the CF substrate are bonded to each other via the sealing material and the spacer material, thereby producing a large panel. At this time, a large panel is produced so that TFT and CF may be arrange | positioned inside. Thereafter, the large panel is cut into a plurality of cells. Subsequently, a liquid crystal display is manufactured by attaching a polarizing plate to a cell and attaching a backlight or the like.

A peeling process may be performed after a TFT board | substrate preparation process and a CF board | substrate preparation process, and may be performed before an assembly process, and may be performed in the middle of an assembly process. When a peeling process is performed in the middle of the granulation process by a pressure reduction injection method, after manufacturing a large sized panel, it may be performed before cutting a large sized panel into several cell, and after sealing a liquid crystal material to each cell, It may be performed before attaching the polarizing plate. In addition, when a peeling process is performed in the middle of the granulation process by a dropping injection method, after manufacturing a large sized panel, it may be performed before cutting a large sized panel into a some cell, and after cutting a large sized panel into a some cell, each It may be done before attaching the polarizing plate to the cell.

The manufacturing method of an organic electroluminescent display (OLED) is the organic electroluminescent element formation process of forming an organic electroluminescent element on the board | substrate of a laminated body, the joining process of joining the board | substrate with which the organic electroluminescent element was formed, and an opposing board | substrate, for example, It has a peeling process of peeling a reinforcement board from the board | substrate of a laminated body.

In the organic EL element formation process, as a method of forming an organic EL element, the photolithography method, the vapor deposition method, etc. are used, for example. In addition, in order to pattern-form an organic electroluminescent element, a resist liquid is used as a coating liquid. An organic EL element consists of a transparent electrode layer, a hole transport layer, a light emitting layer, an electron carrying layer, etc., for example.

In addition, before the organic EL element formation step, the substrate surface of the laminate may be washed as necessary. As a washing method, well-known dry washing and wet washing are used.

In the bonding process, the board | substrate with which the organic electroluminescent element was formed is cut | disconnected into several cell, the opposing board | substrate is affixed to each cell, and an organic electroluminescent display is produced.

The peeling process is after an organic EL element formation process, for example, and may be performed before a bonding process, and may be performed in the middle of a bonding process, or later.

The manufacturing method of a solar cell has a solar cell element formation process which forms a solar cell element on the board | substrate of a laminated body, for example, and the peeling process which peels a reinforcement board from a laminated body substrate.

In the solar cell element forming step, as a method of forming the solar cell element, for example, a photolithography method, a vapor deposition method, or the like is used. In addition, in order to pattern-form a solar cell element, a resist liquid is used as a coating liquid. A solar cell element consists of a transparent electrode layer, a semiconductor layer, etc., for example.

A peeling process is performed after a solar cell element formation process, for example.

As mentioned above, although the form for implementing this invention was demonstrated, this invention is not limited to the said embodiment, A various deformation | transformation and substitution can be added to the said embodiment, without deviating from the range of this invention.

For example, in the laminated body block 10 shown in FIG. 1, although the side surface of the board | substrate 20 is a surface perpendicular | vertical with respect to the main surface of the board | substrate 20, this invention is not limited to this. For example, the side surface of the board | substrate 120 may be rounded like the laminated block 110 shown in FIG. In the laminated body block 110 shown in FIG. 8, since the recessed part 112 in the side surface of the laminated block 110 remains to some extent after a cutting process, the recessed part 112 is removed in a chamfering process.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various correction and changes can be added without deviating from the range and mind of this invention.

This application is based on the JP Patent application 2010-293248 of an application on December 28, 2010, The content is taken in here as a reference.

10: laminate block
10A, 10B, 10C: laminate
20: substrate
21 to 24: outer circumference of the substrate (four sides of the substrate)
30, 30A: gusset
32, 32A: resin layer
34, 34A: support plate
50: stage
51 to 53: positioning block
70: stage
72: fitting support jig

Claims (5)

It is a manufacturing method of the laminated body which has a process which obtains a laminated body by processing the laminated body block which has a board | substrate and the reinforcement board which reinforces the said board | substrate,
The reinforcing plate is composed of a resin layer that is detachably bonded to the substrate and a support plate for supporting the substrate via the resin layer,
The laminate block is formed such that the outer shape of the support plate and the outer shape of the resin layer are respectively larger than the outer shape of the substrate,
The said processing process has a cutting process which cut | disconnects each outer peripheral part of the said support plate and the said resin layer among the said laminated body blocks, and aligns the whole periphery or a part of each outer peripheral edge of the said support plate, the said resin layer, and the said board | substrate. The manufacturing method of a laminated body. The position according to claim 1, wherein in at least a part of the cutting step, the main surface of the substrate of the laminate block is supported by a stage, and the outer periphery of the substrate of the laminate block is provided on the stage. The manufacturing method of the laminated body made to contact a crystal block. The said support plate is comprised from the brittle material,
In the said cutting process, after forming a cutting line in the surface of the said support plate of the said laminated body block, the manufacturing method of the laminated body which cuts each outer peripheral part of the said support plate and the said resin layer of the said laminated body block along the said cutting line. . The said manufacturing process is a manufacturing method of the laminated body of any one of Claims 1-3 which further has a chamfering process of chamfering the outer peripheral part of the said laminated body obtained by cut | disconnecting the said laminated body block. The said manufacturing process is a manufacturing method of the laminated body of Claim 4 which further has the grinding | polishing process of surface-polishing the board | substrate of the said laminated body obtained by chamfering.

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