KR20130113778A - Black polyimide film - Google Patents

Black polyimide film Download PDF

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Publication number
KR20130113778A
KR20130113778A KR1020120036253A KR20120036253A KR20130113778A KR 20130113778 A KR20130113778 A KR 20130113778A KR 1020120036253 A KR1020120036253 A KR 1020120036253A KR 20120036253 A KR20120036253 A KR 20120036253A KR 20130113778 A KR20130113778 A KR 20130113778A
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South Korea
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polyimide film
black
less
shielding agent
carbon black
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KR1020120036253A
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Korean (ko)
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이길남
김성원
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에스케이씨코오롱피아이 주식회사
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Priority to KR1020120036253A priority Critical patent/KR20130113778A/en
Priority to JP2014560840A priority patent/JP6082761B2/en
Priority to CN201280066713.7A priority patent/CN104169330B/en
Priority to PCT/KR2012/007228 priority patent/WO2013151215A1/en
Priority to TW101135981A priority patent/TWI454513B/en
Publication of KR20130113778A publication Critical patent/KR20130113778A/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046Polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

PURPOSE: A black polyimide film has excellent light-shielding performance and electric insulation and has excellent mechanical properties. CONSTITUTION: A black polyimide film is a polyimide film which is obtained by imidizing a polyamic acid obtained from diamines and dianhydrides. The black polyimide film comprises 3.0-7.5 wt% of carbon black which has 1.5 wt% or less of a high temperature volatile component and the surface of which is not oxidation-treated; and 0.5-1.5 wt% of a shielding agent. The visibly ray transmittance of the black polyimide film is 1.0% or less, the glossiness is 60% or less, the elongation is 80% or less, the surface resistance is 10^15 Ω greater, and the pinhole generation is 1 or less.

Description

블랙 폴리이미드 필름{BLACK POLYIMIDE FILM} Black polyimide film {BLACK POLYIMIDE FILM}

본 발명은 차폐용으로 사용되는 블랙 폴리이미드 필름에 관한 것이다.
The present invention relates to a black polyimide film used for shielding.

일반적으로 폴리이미드(PI) 수지라 함은 방향족 디안하이드라이드와 방향족 디아민 또는 방향족 디이소시아네이트를 용액중합하여 폴리아믹산 유도체를 제조한 후, 고온에서 폐환탈수시켜 이미드화하여 제조되는 고내열수지를 일컫는다. 폴리이미드 수지를 제조하기 위하여 방향족 디안하이드라이드 성분으로서 피로멜리트산이무수물(PMDA) 또는 비페닐테트라카르복실산이무수물(BPDA) 등을 사용하고 있고, 방향족 디아민 성분으로서는 옥시디아닐린(ODA), p-페닐렌 디아민(p-PDA), m-페닐렌 디아민(m-PDA), 메틸렌디아닐린(MDA), 비스아미노페닐헥사플루오로프로판(HFDA) 등을 사용하고 있다.In general, the polyimide (PI) resin refers to a high heat-resistant resin prepared by solution polymerization of an aromatic dianhydride and an aromatic diamine or an aromatic diisocyanate to prepare a polyamic acid derivative, and then imidization by cyclization of the ring at a high temperature. In order to prepare a polyimide resin, pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic dianhydride (BPDA) or the like is used as an aromatic dianhydride component, and oxydianiline (ODA), p is used as an aromatic diamine component. -Phenylene diamine (p-PDA), m-phenylene diamine (m-PDA), methylenedianiline (MDA), bisaminophenylhexafluoropropane (HFDA) and the like are used.

폴리이미드 수지는 불용, 불융의 초고내열성 수지로서 내열산화성, 내열특성, 내방사선성, 저온특성, 내약품성 등에 우수한 특성을 가지고 있어, 자동차 재료, 항공소재, 우주선 소재 등의 내열 첨단소재 및 절연코팅제, 절연막, 반도체, TFT-LCD의 전극 보호막 등 전자재료에 광범위한 분야에 사용되고 있다. Polyimide resin is an insoluble and non-fusible ultra-high temperature resistant resin. It has excellent heat resistant oxidizing property, heat resistance property, radiation resistance property, low temperature property, chemical resistance and so on. It is a high heat resistant material such as automobile material, , Insulating films, semiconductors, and electrode protective films for TFT-LCDs.

특히, 최근에는 휴대용 전자기기 및 통신기기에 커버레이(coverlay)로서 많이 사용되고 있으며, 보안 목적 및 시각적인 효과를 위해 차광기능과 절연 기능을 가지면서 기계적 물성이 우수한 차폐용 폴리이미드 필름에 대한 관심이 높아지고 있다.
In particular, in recent years, as a coverlay (coverlay) is widely used in portable electronic devices and communication devices, interest in shielding polyimide film having a light shielding function and an insulating function and excellent mechanical properties for security purposes and visual effects. It is rising.

본 발명의 목적은 차광기능 및 전기 절연기능이 우수하고, 기계적 물성이 우수한 차폐용 블랙 폴리이미드 필름 및 그 제조방법을 제공하는 것이다. An object of the present invention is to provide a black polyimide film for shielding excellent in light shielding function and electrical insulation function, excellent mechanical properties and a method of manufacturing the same.

이에 본 발명은 바람직한 제1 구현예로서, 이무수물과 디아민류로부터 얻어진 폴리아믹산을 이미드화하여 얻어지는 폴리이미드 필름으로서, Accordingly, the present invention is a polyimide film obtained by imidizing a polyamic acid obtained from dianhydride and diamines as a first preferred embodiment,

(A) 1.5 중량% 이하의 고온 휘발성 성분을 포함하고 표면 산화처리가 되지 않은 카본블랙 3.0 내지 7.5 중량% 및 (B) 차폐제 0.5 내지 1.5 중량%를 포함하고, (A) less than or equal to 1.5% by weight of high temperature volatile components, and 3.0 to 7.5% by weight of carbon black, which is not subjected to surface oxidation, and (B) 0.5 to 1.5% by weight of a shielding agent,

가시광선 영역의 광투과도가 1.0% 이하, 광택도가 60% 이하, 신율이 80% 이상이고, 표면저항이 1015 Ω 이상이며, 핀홀 발생률(개/100 ㎡)이 1 이하인 것을 특징으로 하는 블랙 폴리이미드 필름을 제공한다.Black having a light transmittance of 1.0% or less, a glossiness of 60% or less, an elongation of 80% or more, a surface resistance of 10 15 Ω or more, and a pinhole generation rate (piece / 100 m 2) of 1 or less It provides a polyimide film.

상기 구현예에 의한 카본블랙은 부피평균입경이 2 ㎛ 이하이고, 최대 입경이 10 ㎛ 이하일 수 있으며, 1차 입자 입경이 70 내지 150 nm 인 것일 수 있다.Carbon black according to the embodiment has a volume average particle diameter of 2 ㎛ or less, the maximum particle size may be 10 ㎛ or less, the primary particle size may be 70 to 150 nm.

상기 구현예에 의한 차폐제는 부피평균입경이 0.1 내지 1.0 ㎛인 것일 수 있다.The shielding agent according to the embodiment may have a volume average particle diameter of 0.1 to 1.0 μm.

상기 구현예에 의한 차폐제는 TiO2 일 수 있다.Shielding agent according to the embodiment TiO 2 Lt; / RTI >

상기 구현예에 의한 디아민류는 페닐렌디아민, 디아미노디페닐에테르 또는 이들의 유도체일 수 있다. Diamines according to the embodiment may be phenylenediamine, diaminodiphenyl ether or derivatives thereof.

본 발명의 블랙 폴리이미드 필름은 차광기능 및 전기 절연기능이 우수하면서도, 기계적 물성이 우수하여 차폐용 블랙 폴리이미드 필름으로서 유용하게 사용될 수 있는 효과가 있다.
The black polyimide film of the present invention has an excellent light shielding function and an electric insulation function, and has an effect that can be usefully used as a black polyimide film for shielding due to its excellent mechanical properties.

본 발명은 이무수물과 디아민류로부터 얻어진 폴리아믹산을 이미드화하여 얻어지는 폴리이미드 필름으로서, 필름 총 중량을 기준으로, (A) 1.5 중량% 이하의 고온 휘발성 성분을 포함하고 표면 산화처리가 되지 않은 카본블랙 3.0 내지 7.5 중량% 및 (B) 차폐제 0.5 내지 1.5 중량%를 포함하고, 가시광선 영역의 광투과도가 1.0 % 이하, 광택도가 60 % 이하, 신율이 80 % 이상이고, 표면저항이 1015 Ω 이상이며, 핀홀 발생률(개/100㎡)이 1 이하인 것을 특징으로 하는 블랙 폴리이미드 필름에 관한 것이다.The present invention relates to a polyimide film obtained by imidizing a polyamic acid obtained from an dianhydride and diamines, the carbon comprising (A) 1.5% by weight or less of a high-temperature volatile component based on the total weight of the film and not subjected to surface oxidation treatment. Black 3.0 to 7.5% by weight and (B) 0.5 to 1.5% by weight of the shielding agent, the light transmittance in the visible region is 1.0% or less, glossiness is 60% or less, elongation is 80% or more, surface resistance is 10 15 It is ohms or more, and it is related with the black polyimide film characterized by the pinhole generation rate (piece / 100m <2>) being 1 or less.

본 발명의 블랙 폴리이미드 필름은 차광 기능을 제공하기 위하여 가시광선 영역의 광투과도가 1.0 % 이하, 바람직하게는 0.1 내지 1.0 %이고, 광택도가 60 % 이하, 바람직하게는 40 내지 60 %인 것을 특징으로 한다. 이로 인해 적용되는 제품의 외형에서 미적 특성이 강화되며 내부의 형상이 차단됨으로 보안성이 보장된다.The black polyimide film of the present invention has a light transmittance of 1.0% or less, preferably 0.1 to 1.0%, and glossiness of 60% or less, preferably 40 to 60% in order to provide a light shielding function. It features. This enhances aesthetics in the appearance of the applied product and ensures security by blocking the inside shape.

또한, 본 발명의 블랙 폴리이미드 필름은 커버레이로서 전기 절연기능을 제공하기 위하여 표면저항이 1015 Ω 이상인 것을 특징으로 하고, 표면저항은 그 수치가 높을수록 바람직하다. 상기 블랙 폴리이미드 표면저항이 1015 Ω 이상을 만족함으로써, 주로 사용되는 용도가 연성회로의 보호필름인 커버레이로서 제품의 전기 안정성을 향상시킬 수 있다. 이와 관련하여, 본 발명의 블랙 폴리이미드 필름은 80 kV/mm 이상, 바람직하게는 90 kV/mm 이상의 절연파괴전압을 갖는 것이 바람직하다.In addition, the black polyimide film of the present invention is characterized by having a surface resistance of 10 15 Ω or more in order to provide an electrical insulation function as a coverlay, and the higher the surface resistance is, the more preferable. Since the black polyimide surface resistance satisfies 10 15 Ω or more, it is possible to improve the electrical stability of the product as a coverlay which is mainly used as a protective film of a flexible circuit. In this regard, the black polyimide film of the present invention preferably has an insulation breakdown voltage of 80 kV / mm or more, preferably 90 kV / mm or more.

또한, 본 발명의 블랙 폴리이미드 필름은 상술한 차광 기능 및 전기 절연기능을 제공하면서 동시에 기계적 물성을 확보하기 위하여 신율이 80 % 이상, 바람직하게는 80 내지 110 %이고, 핀홀 발생률(개/100㎡)이 1 이하인 것을 특징으로 함으로써, 제품 생산 및 가공 시 공정 안정성이 향상되며 최종 제품의 기계적 신뢰성이 향상될 수 있다. In addition, the black polyimide film of the present invention has an elongation of 80% or more, preferably 80 to 110%, in order to provide the above-described light shielding function and electrical insulation function, and to secure mechanical properties, and a pinhole generation rate (piece / 100 m 2). ) Is less than or equal to 1, the process stability during production and processing of the product can be improved and the mechanical reliability of the final product can be improved.

전술한 바와 같은 블랙 폴리이미드 필름의 물성을 달성할 수 있도록, 블랙 폴리이미드 필름은 고온 휘발분의 함량이 1.5 % 이하이고 표면 산화처리가 되지 않은 카본블랙 3.0 내지 7.5 중량%, 바람직하게는 5.0 내지 7.0 중량% 및 차폐제 0.5 내지 1.5 중량%, 바람직하게는 0.7 내지 1.3 중량%, 더욱 바람직하게는 0.8 내지 1.2 중량%를 포함하는 것을 특징으로 한다.In order to achieve the properties of the black polyimide film as described above, the black polyimide film has a high temperature volatile content of 1.5% or less and is not subjected to surface oxidation 3.0 to 7.5% by weight, preferably 5.0 to 7.0 It is characterized in that it comprises a weight percent and 0.5 to 1.5% by weight, preferably 0.7 to 1.3% by weight, more preferably 0.8 to 1.2% by weight.

상기 카본블랙은 열처리시 안정성을 높이기 위하여 표면 산화처리가 되지 않은 것일 수 있으며, 고온 휘발성 성분 함량이 낮은 것이 바람직하고, 상기 고온 휘발성 성분의 함량은 카본블랙 총 중량을 기준으로 1.5 중량% 이하, 바람직하게는 0.8 내지 1.5 중량%일 수 있다. The carbon black may be one that is not surface-oxidized to increase stability during heat treatment, and a high temperature volatile component is preferably low, and the content of the high temperature volatile component is 1.5 wt% or less based on the total weight of the carbon black. Preferably from 0.8 to 1.5% by weight.

상기 카본블랙은 블랙 폴리이미드 필름의 블랙 색상 구현과 광택성 부여를 위해 사용되며, 그 함량은 블랙 폴리이미드 필름 총 중량을 기준으로 3.0 내지 8.0 중량%일 수 있다. 상기 카본블랙의 함량이 3.0 중량% 미만이면 박막 필름에서의 블랙 색상의 구현이 어렵고, 7.5 중량%를 초과하게 되면 차광 기능 및 블랙 색상의 구현은 향상될 수 있으나, 절연성 및 내코로나성이 저하되는 문제점이 있을 수 있다. The carbon black is used to impart black color and glossiness of the black polyimide film, and the content thereof may be 3.0 to 8.0 wt% based on the total weight of the black polyimide film. When the content of the carbon black is less than 3.0 wt%, it is difficult to realize the black color in the thin film, and when the content of the carbon black exceeds 7.5 wt%, the shading function and the implementation of the black color may be improved, but the insulation and corona resistance may be reduced. There may be a problem.

상기 카본블랙은 부피평균입경이 2 ㎛ 이하, 바람직하게는 0.5 내지 2 ㎛, 더욱 바람직하게는 0.6 내지 1.6 ㎛일 수 있고, 카본블랙을 용매 등에 분산시켰을 때 입자의 최대 입경이 10 ㎛ 이하일 수 있다. 또한, 카본블랙의 1차 입자의 입경은 70 nm 이상, 바람직하게는 70 내지 150 nm일 수 있다. 상기 카본블랙의 1차 입자 입경이 70 nm 미만인 경우 블랙 폴리이미드 필름의 광택이 증가 되어 필름에 소광특성을 부여하기 어렵다. 따라서, 본 발명의 블랙 폴리이미드 필름은 상기 크기 범위의 카본블랙을 포함함으로써 필름에 소광특성을 부여하고, 또한 균일한 색상 및 물성을 구현할 수 있다.The carbon black may have a volume average particle diameter of 2 μm or less, preferably 0.5 to 2 μm, more preferably 0.6 to 1.6 μm, and when the carbon black is dispersed in a solvent or the like, the maximum particle diameter of the particle may be 10 μm or less. . In addition, the particle diameter of the primary particles of carbon black may be 70 nm or more, preferably 70 to 150 nm. When the primary particle size of the carbon black is less than 70 nm, the glossiness of the black polyimide film is increased, and thus it is difficult to impart matting properties to the film. Therefore, the black polyimide film of the present invention can provide matting properties to the film by including carbon black in the above size range, and can realize uniform color and physical properties.

또한, 상기 카본블랙은 입경분산도(=부피평균입경/수평균입경)가 5 이하이거나, 더욱 바람직하게는 3 이하인 것이 좋은데, 입경분산도가 낮은 카본블랙 입자들이 사용 시 입경균일도가 높아져서, 수지의 내부에서 균일한 분산이 이루어져, 수지와의 혼합 시 균일하게 혼합될 수 있다. 그에 따라 필름의 기계적 물성 저하가 최소화되고, 전반적인 물성의 균일화, 즉 위치별 색상편차의 최소화 등을 도모할 수 있고, 특히, 필름의 신율을 크게 향상시킬 수 있다. 그리고, 카본블랙의 입경분산도는 밀링처리와 분산제 적용을 통하여 향상시킬 수 있다. 이 때, 밀링처리는 카본블랙 및 차폐제 모두에 대해서 각각 밀링처리를 함으로써, 카본블랙 및 차폐제 모두의 입자 분산도를 향상시키는 것이 바람직하다. In addition, the carbon black has a particle size dispersion (= volume average particle diameter / number average particle diameter) of 5 or less, or more preferably 3 or less, it is preferable that the carbon black particles having a low particle size dispersion when the particle size uniformity is high, the resin The uniform dispersion is made in the interior of, can be mixed evenly when mixed with the resin. Accordingly, degradation of mechanical properties of the film can be minimized, and uniformity of overall physical properties, that is, minimization of color deviation for each position can be achieved, and in particular, the elongation of the film can be greatly improved. In addition, the particle size dispersion of the carbon black can be improved through milling and dispersant application. At this time, the milling treatment is preferably milled for both the carbon black and the shielding agent, thereby improving the particle dispersity of both the carbon black and the shielding agent.

상기 차폐제는 블랙 폴리이미드 필름의 주행성, 방열 특성, 차폐성을 위하여 사용되며, 차폐제의 함량은 블랙 폴리이미드 필름 총 중량을 기준으로 0.5 내지 1.5 중량%일 수 있다. 상기 차폐제의 함량이 0.5 중량% 미만이면 차폐율이 저하되고, 1.5 중량%를 초과하면 필름의 기계적 물성, 특히 신율이 저하하고, 필름 제조시 핀홀 발생율이 높아져 제품의 수율이 저하되고 외관 품질이 저하되는 문제점이 있다. The shielding agent is used for running, heat dissipation, and shielding properties of the black polyimide film, and the content of the shielding agent may be 0.5 to 1.5 wt% based on the total weight of the black polyimide film. When the content of the shielding agent is less than 0.5% by weight, the shielding rate is lowered. When the content of the shielding agent is more than 1.5% by weight, the mechanical properties of the film, in particular, the elongation is lowered, the pinhole generation rate is increased during film production, and the yield of the product is lowered and the appearance quality is lowered. There is a problem.

상기 차폐제의 예로서는 티타늄다이옥사이드(TiO2), 나이트라이드계 입자, 기타 무기입자를 들 수 있다. Examples of the shielding agent include titanium dioxide (TiO 2 ), nitride particles, and other inorganic particles.

상기 구현예에 의한 차폐제는 입자 형태일 수 있으며, 상기 차폐제는 부피평균입경이 0.1 내지 1.0 ㎛, 바람직하게는 0.15 내지 0.7 ㎛, 더욱 바람직하게는 0.2 내지 0.6 ㎛일 수 있다. 특히, 차폐제 입자의 부피평균입경이 0.1 내지 1.0 ㎛인 경우 차폐율을 향상시키면서 필름의 기계적 물성의 저하를 방지할 수 있다. The shielding agent according to the embodiment may be in the form of particles, the shielding agent may have a volume average particle diameter of 0.1 to 1.0 ㎛, preferably 0.15 to 0.7 ㎛, more preferably 0.2 to 0.6 ㎛. In particular, when the volume average particle diameter of the shielding agent particles is 0.1 to 1.0 μm, it is possible to prevent a decrease in the mechanical properties of the film while improving the shielding rate.

본 발명의 블랙 폴리이미드 필름을 제조하는 방법으로는 일반적으로 폴리이미드 필름의 제막법을 이용할 수 있으나, 특히 이무수물과 디아민류로부터 폴리아믹산 용액을 중합하는 단계와 상기 폴리아믹산 용액을 제막하는 단계를 거쳐 블랙폴리이미드 필름을 제조하는 공정 중에 있어서, 상기 제막하는 단계에서 폴리아믹산 용액과, 카본블랙, 차폐제 및 촉매를 혼합하여 제막함으로써, 폴리아믹산 용액과, 카본블랙, 차폐제 및 촉매를 보다 균일하게 혼합하는 것을 특징으로 하는 제막법을 이용할 수 있다. 이에 따라 제조된 블랙 폴리이미드 필름은 균일한 기계적, 광학적, 전기적 특성을 가질 수 있다. In general, the method for producing the black polyimide film of the present invention may be a film forming method of a polyimide film, but in particular, polymerizing the polyamic acid solution from dianhydrides and diamines and forming the polyamic acid solution In the process of producing a black polyimide film, the polyamic acid solution, the carbon black, the shielding agent and the catalyst are mixed and formed into a film in the film forming step, so that the polyamic acid solution, the carbon black, the shielding agent and the catalyst are mixed more uniformly. The film forming method can be used. The black polyimide film thus prepared may have uniform mechanical, optical and electrical properties.

이때, 제막하는 단계에서의 혼합은 라인믹서를 이용하여 혼합할 수 있으며, 폴리아믹산 용액, 카본블랙, 차폐제 및 촉매를 라인믹서에 각각 투입하여 혼합함으로서, 하나의 투입구에 동시 투입에 의해 발생할 수 있는 응집 현상을 방지하여 더욱 균일하게 혼합할 수 있다. 한편, 폴리아믹산 용액을 중합하는 단계에서 카본블랙 및 차폐제를 혼합하게 되면 중합 공정에서 사용하는 대용량의 교반기의 혼합 능력이 상대적으로 떨어져 필름의 균일한 물성 구현이 어려운 문제점이 있다. At this time, the mixing in the film forming step may be mixed by using a line mixer, by mixing each of the polyamic acid solution, carbon black, shielding agent and catalyst into the line mixer, which may occur by simultaneous input to one inlet The aggregation phenomenon can be prevented and mixed more uniformly. On the other hand, when the carbon black and the shielding agent is mixed in the step of polymerizing the polyamic acid solution, the mixing ability of the large-capacity agitator used in the polymerization process is relatively low, there is a problem that it is difficult to achieve uniform physical properties of the film.

상기 폴리아믹산 용액은 상기 이무수물과 상기 디아민류를 유기 용매 중에서 반응시켜 얻어진다. 이때, 용매는 일반적으로 아미드계 용매로 비양성자성 극성 용매(Aprotic solvent)를 사용하는 것이 바람직하며, 그 예로는 N,N'-디메틸포름아미드, N,N'-디메틸아세트아미드, N-메틸-피롤리돈 등을 들 수 있으며 필요에 따라 2종을 조합해서 사용할 수도 있다.The polyamic acid solution is obtained by reacting the dianhydride and the diamines in an organic solvent. At this time, the solvent is generally preferably an aprotic polar solvent (Aprotic solvent) as the amide solvent, for example, N, N'- dimethylformamide, N, N'- dimethylacetamide, N-methyl -Pyrrolidone, and the like, and may be used in combination.

본 발명에서 사용할 수 있는 이무수물은 비페닐카르복실산 이무수물 또는 그 유도체와 피로멜리트산 이무수물 또는 그 유도체를 포함할 수 있다. 구체적으로, 이무수물은 3,3',4,4'-비페닐테트라카르복실산 이무수물, 피로멜리트산 이무수물, 3,3'4,4'-벤조페논테트라카르복실산 무수물, p-페닐렌-비스 트리멜리트산 이무수물 등을 사용할 수 있으나, 3,3',4,4'-비페닐테트라카르복실산 이무수물, 피로멜리트산 이무수물을 사용하는 것이 바람직하다. 특히, 본 발명에서는 이무수물 중에서도 피로멜리트산이무수물 및 3,3',4,4'-비페닐테트라카르복실산 이무수물을 사용하면, 상술한 광투과도, 광택도, 체적저항 등의 물성을 향상시키기 위하여 투입되는 카본블랙 및 차폐제에 의한 기계적 물성 하락을 적게 할 수 있다.The dianhydrides usable in the present invention may include biphenylcarboxylic dianhydrides or derivatives thereof and pyromellitic dianhydrides or derivatives thereof. Specifically, the dianhydride is 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, 3,3'4,4'-benzophenonetetracarboxylic anhydride, p- Although phenylene bis trimellitic dianhydride etc. can be used, it is preferable to use 3,3 ', 4,4'-biphenyl tetracarboxylic dianhydride and a pyromellitic dianhydride. Particularly, in the present invention, when pyromellitic dianhydride and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride are used among the dianhydrides, physical properties such as light transmittance, glossiness, volume resistance and the like described above It is possible to reduce the decrease in mechanical properties by the carbon black and the shielding agent added to improve.

본 발명에서 사용할 수 있는 디아민류는 페닐렌디아민, 디아미노디페닐에테르 또는 이들의 유도체를 포함할 수 있다. 구체적으로, 디아민류는 p-페닐렌디아민, o-페닐렌디아민, m-페닐렌디아민, 4,4'-디아미노디페닐에테르, 3,4-디아미노디페닐에테르, 2,4-디아미노디페닐에테르 등을 들 수 있다. 일반적으로는 기계적 특성 향상을 위해 p-페닐렌디아민과 4,4'-디아미노페닐에테르를 사용한다.Diamines usable in the present invention may include phenylenediamine, diaminodiphenyl ether or derivatives thereof. Specifically, diamines are p-phenylenediamine, o-phenylenediamine, m-phenylenediamine, 4,4'-diaminodiphenyl ether, 3,4-diaminodiphenyl ether, 2,4-dia Minodiphenyl ether etc. are mentioned. Generally, p-phenylenediamine and 4,4'-diaminophenyl ether are used to improve mechanical properties.

전체 디아민류 1몰에 대하여 열팽창계수 및 모듈러스를 향상시키기 위해 p-페닐렌디아민의 비율을 0.8 내지 0.1 몰비가 되도록 사용할 수도 있다. p-페닐렌 디아민은 디아미노페닐에테르와 비교하여 직선성을 가진 단량체로 필름의 열팽창계수(Coefficient of thermal expansion)값을 떨어뜨리는 역할을 한다. 그러나 p-페닐렌디아민의 함량이 높으면 필름의 가요성이 떨어지고 필름 형성능력을 상실할 수도 있다.In order to improve the coefficient of thermal expansion and modulus with respect to 1 mol of all diamines, the ratio of p-phenylenediamine may be used so that it may become 0.8-0.1 mol ratio. p-phenylene diamine is a monomer having a linearity compared to diamino phenyl ether serves to lower the coefficient of thermal expansion of the film (Coefficient of thermal expansion). However, a high content of p-phenylenediamine may reduce the flexibility of the film and may result in loss of film forming ability.

상기 카본 블랙과, 차폐제는 입자 형태로 혼합될 수 있지만, 각각 상기 비양성자성 극성 용매에 분산시킨 용액 형태로 투입되어 혼합되는 것이 보다 균일하게 혼합되므로 바람직하다.Although the carbon black and the shielding agent may be mixed in the form of particles, the carbon black and the shielding agent may be mixed and added in the form of a solution dispersed in the aprotic polar solvent.

상기 폴리아믹산 용액은 혼합된 촉매와 함께 지지체에 도포되며, 사용되는 촉매는 무수산으로 이루어진 탈수 촉매 또는 3차 아민류를 사용하는 것이 바람직하다. 무수산의 예로는 아세트산 무수물을 들 수 있으며 3차 아민류의 예로는 이소퀴놀린, β-피콜린, 피리딘 등을 들 수 있다.
The polyamic acid solution is applied to the support together with the mixed catalyst, the catalyst used is preferably used a dehydration catalyst or tertiary amines consisting of anhydrous acid. Examples of anhydrous acids include acetic anhydride and examples of tertiary amines include isoquinoline, β-picolin, pyridine and the like.

이하에서, 본 발명을 실시예 및 비교예를 통하여 상세히 설명한다.
Hereinafter, the present invention will be described in detail through Examples and Comparative Examples.

실시예 1Example 1

표 1에 기재된 카본블랙의 함량, 차폐제의 종류 및 함량에 따라 아래와 같은 방법으로 블랙 폴리이미드 필름을 제조하였다.
According to the content of the carbon black, the type and content of the shielding agent described in Table 1, a black polyimide film was prepared by the following method.

폴리아믹산 용액 중합 공정으로서, 300 L 반응기에 질소분위기하에서 용매로 N,N'-디메틸포름아미드(DMF)를 181.2 kg 투입하였다. 온도를 30 ℃로 하고 디아민으로 4,4'-디아미노페닐렌에테르(ODA) 20.64 kg을 넣었다. 30분 가량 교반하여 단량체가 용해된 것을 확인한 뒤에 피로멜리트산 이무수물(PMDA)을 21.81 kg을 투입하였다. 투입이 끝나면 온도를 유지하면서 1시간 동안 교반하여, 1차 반응을 완료하였다. 1차 반응이 완료되면 반응기의 온도를 40 ℃로 승온하여 8 % PMDA용액을 0.67 kg 투입하고 온도를 유지하며 2시간 동안 교반하였다. 교반 중에 반응기 내부를 1 토르(torr) 정도로 감압해 반응 중에 생성되었던 폴리아믹산 용액 내의 기포를 제거하여, 폴리아믹산 용액 중합 공정을 완료하였다.As a polyamic acid solution polymerization process, 181.2 kg of N, N'-dimethylformamide (DMF) was added to a 300 L reactor under a nitrogen atmosphere as a solvent. The temperature was 30 degreeC, and 20.64 kg of 4,4'- diamino phenylene ether (ODA) was added as diamine. After stirring for about 30 minutes to confirm that the monomer was dissolved, 21.81 kg of pyromellitic dianhydride (PMDA) was added thereto. After the addition, the mixture was stirred for 1 hour while maintaining the temperature to complete the first reaction. After completion of the first reaction, the temperature of the reactor was increased to 40 ° C., 0.67 kg of 8% PMDA solution was added thereto, and the temperature was maintained for 2 hours. During stirring, the inside of the reactor was depressurized to about 1 Torr to remove bubbles in the polyamic acid solution generated during the reaction to complete the polyamic acid solution polymerization process.

반응이 완료된 폴리아믹산 용액은 고형분 함량이 18.5 중량%이며 점도는 상온에서 2,500 poise이다. Completed polyamic acid solution has a solid content of 18.5% by weight and a viscosity of 2,500 poise at room temperature.

밀링 처리된 카본블랙과, 차폐제는 제막 공정에서 폴리아믹산 용액과 촉매를 혼합하는 혼합공정에서 투입되어 혼합되며, 이때 균일하게 혼합하기 위하여, 폴리아믹산 용액, 촉매 용액, 카본블랙 용액과, 차폐제의 분산 용액을 라인믹서에 각각 투입하여 혼합하였다.The milled carbon black and the shielding agent are added and mixed in a mixing step of mixing the polyamic acid solution and the catalyst in the film forming process, in which case the polyamic acid solution, the catalyst solution, the carbon black solution and the shielding agent are dispersed. The solution was added to each line mixer and mixed.

또한, 투입된 카본블랙과 TiO2의 함량은 폴리이미드 필름 총 중량에 대하여 카본블랙 6.0 중량%, 차폐제(TiO2) 1.2 중량%였다.In addition, the content of the charged carbon black and TiO 2 was 6.0% by weight of carbon black and 1.2% by weight of the shielding agent (TiO 2 ) based on the total weight of the polyimide film.

1차 입자 입경이 95 nm인 카본블랙의 부피평균 입경은 0.89 ㎛이고, 차폐제의 부피평균입경은 0.53 ㎛였다.The volume average particle diameter of the carbon black having a primary particle diameter of 95 nm was 0.89 µm, and the volume average particle diameter of the shielding agent was 0.53 µm.

폴리아믹산 용액과, 상기 폴리아믹산 용액 이외의 촉매 용액, 카본블랙 용액 및 차폐제의 분산용액의 비율을 2:1이 되도록 균일하게 혼합하여 엔드리스(Endless) 벨트에 100 ㎛로 캐스팅하고 100 내지 200 ℃의 온도범위에서 건조한 후 필름을 엔드리스 벨트에서 박리하여 고온 텐터에 이송하였다. 이때 상기 촉매 용액, 카본블랙 용액 및 차폐제의 분산 용액은 그 성분의 합계량이 이소퀴놀린 14.4 중량%, 무수초산 44.8 중량%, DMF 37.4 중량%, 카본블랙 1.09 중량% 및 차폐제 0.22 중량%가 되도록 하였다. The ratio of the polyamic acid solution and the dispersion solution of the catalyst solution other than the polyamic acid solution, the carbon black solution and the shielding agent to be 2: 1 was uniformly mixed to cast 100 μm on the endless belt and 100 to 200 ° C. After drying in the temperature range, the film was peeled off the endless belt and transferred to a high temperature tenter. In this case, the total amount of the components of the catalyst solution, the carbon black solution and the shielding agent was 14.4% by weight of isoquinoline, 44.8% by weight of acetic anhydride, 37.4% by weight of DMF, 1.09% by weight of carbon black, and 0.22% by weight of the shielding agent.

필름을 고온 텐터에서 200 ℃부터 600 ℃까지 가열한 후 냉각해 필름을 핀에서 분리하여 12 ㎛ 두께의 필름을 얻었다.The film was heated from 200 ° C. to 600 ° C. in a high temperature tenter and then cooled to separate the film from the pins to obtain a 12 μm thick film.

위 방법으로 얻은 블랙 폴리이미드 필름의 신율, 광투과도, 내코로나성, 광택도, 절연파괴전압(breakdown voltage)을 측정하였고, 그 결과를 다음 표 2에 나타내었다.
The elongation, light transmittance, corona resistance, glossiness, and breakdown voltage of the black polyimide film obtained by the above method were measured, and the results are shown in Table 2 below.

실시예 2Example 2

필름 내 카본블랙을 5.5 중량%, 차폐제를 1.2 중량%로 한 것 외에는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was produced in the same manner as in Example 1, except that 5.5 wt% of carbon black in the film and 1.2 wt% of the shielding agent were used.

실시예 3Example 3

필름 내 카본블랙을 6.5 중량%, 차폐제를 0.8 중량%로 한 것 외에는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was produced in the same manner as in Example 1 except that the carbon black in the film was 6.5% by weight and the shielding agent was 0.8% by weight.

비교예 1 Comparative Example 1

필름 내 차폐제를 사용하지 않은 것을 제외하고는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was prepared in the same manner as in Example 1, except that no shielding agent in the film was used.

비교예 2Comparative Example 2

카본블랙을 8.0 중량%로 한 것 외에는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was produced in the same manner as in Example 1 except that the carbon black was 8.0% by weight.

비교예 3 Comparative Example 3

카본블랙으로서 MA220(미쯔비시사제, 1차 입자 입경 55 nm, 부피평균입경 520 nm)을 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was produced in the same manner as in Example 1 except that MA220 (manufactured by Mitsubishi Corporation, primary particle diameter of 55 nm and volume average particle diameter of 520 nm) was used as the carbon black.

비교예 4Comparative Example 4

필름 내 차폐제를 4 중량%로 하는 것 외에는, 실시예 1과 동일한 방법으로 블랙 폴리이미드 필름을 제조하였다.
A black polyimide film was produced in the same manner as in Example 1 except that the shielding agent in the film was 4 wt%.

카본블랙
(종류)
Carbon black
(Kinds)
1차 입자 입경 (nm)Primary particle size (nm) 카본블랙
(중량%)
Carbon black
(weight%)
차폐제
(종류)
Shielding agent
(Kinds)
차폐제
(중량%)
Shielding agent
(weight%)
실시예 1Example 1 램프블랙Lamp black 9595 6.06.0 TiO2 TiO 2 1.21.2 실시예 2Example 2 램프블랙Lamp black 9595 5.55.5 TiO2 TiO 2 1.21.2 실시예 3Example 3 램프블랙Lamp black 9595 6.56.5 TiO2 TiO 2 0.80.8 비교예 1Comparative Example 1 램프블랙Lamp black 9595 6.06.0 -- -- 비교예 2Comparative Example 2 램프블랙Lamp black 9595 8.08.0 -- -- 비교예 3Comparative Example 3 MA220MA220 5555 6.06.0 TiO2 TiO 2 1.21.2 비교예 4Comparative Example 4 램프블랙Lamp black 9595 6.06.0 TiO2 TiO 2 44

위와 같이 제조된 본 발명의 실시예 1 내지 3 및 비교예 1 내지 4에서 제조된 블랙 폴리이미드 필름에 대하여 다음과 같이 물성을 측정하였으며, 그 결과는 표 2와 같다.
The physical properties of the black polyimide films prepared in Examples 1 to 3 and Comparative Examples 1 to 4 of the present invention as described above were measured as follows, and the results are shown in Table 2 below.

신율Elongation

ASTM D 882 측정방법에 따라 인스트론(Instron 3365SER) 장비를 이용하여 측정하였다.It was measured using an Instron 3365SER instrument according to the ASTM D 882 measurement method.

폭 및 그립(grip) 간격 :15 mm × 50 mmWidth and Grip Spacing: 15 mm × 50 mm

Cross Head Speed : 200 mm/min
Cross Head Speed: 200 mm / min

가시광선 영역의 광투과도 Light transmittance in the visible region

Hunter Lab(모델명 : CQX3391)을 이용하여 투과모드로 측정하였다.
Hunter Lab (model name: CQX3391) was measured in transmission mode.

광택도Glossiness

광택도 측정장비를 이용하여 60° 각도로 측정하였다.Glossiness was measured at an angle of 60 ° using a measuring instrument.

장비명 : Gloss meter Equipment: Gloss meter

모델명 : E406L Model Name: E406L

제조사 : Elcometer
Manufacturer: Elcometer

코로나 처리 전후의 강도 및 신율 측정Strength and elongation measurement before and after corona treatment

코로나 방전 처리 장치(모델명 CT1234 , 오사카 가슈라 사 제조)를 이용하여 상기 실시예 1 내지 3 및 비교에 1 내지 4에서 제조된 블랙 폴리이미드 필름에 대하여 코로나 Density 250조건하에 필름을 표면처리한 후, 신율을 평가하여 표면처리 전 필름의 신율과 아래의 식으로 변화율을 계산하였다.After the film was surface-treated under the conditions of Corona Density 250 with respect to the black polyimide film prepared in Examples 1 to 3 and 1 to 4 using a corona discharge treatment apparatus (model CT1234, manufactured by Osaka Gasura Co., Ltd.), The elongation was evaluated and the elongation of the film before the surface treatment and the change rate were calculated by the following equation.

내코로나성Corona resistance = ( = ( 처리후After processing 신율Elongation )/() / ( 처리전Before processing 신율Elongation )×100) × 100

핀홀 발생률Pinhole incidence

결점검출기(윈트리스사)가 설치 와인더에서 필름 폭 0.6 m 제품 길이 1,000 m를 주행시켜 100 ㎡당 핀홀 빈도 수를 계산하였다.
A defect detector (Wintryless Co., Ltd.) ran a 0.6 m film width of 1,000 m product length in an installation winder to calculate the number of pinhole frequencies per 100 m 2.

표면저항Surface resistance

고저항측정기(4339B, Agilent Technologies사)를 이용하여 500 V 하에서 저항을 측정하였다.
The resistance was measured under 500 V using a high resistance measuring instrument (4339B, Agilent Technologies).

절연파괴전압Dielectric breakdown voltage

코로나 처리된 완제품을 ASTM D 149 시험규격에 따라 절연파괴시험장비(6CC250-5/D149, Phenix Technologies사)를 이용하여 측정하였다.
Corona treated finished products were measured using an insulation breakdown test equipment (6CC250-5 / D149, Phenix Technologies) according to ASTM D 149 test standard.

카본블랙
(중량%)
Carbon black
(weight%)
차폐제
(중량%)
Shielding agent
(weight%)
신율
(%)
Elongation
(%)
투과도
(%)
Permeability
(%)
내코로나성Corona resistance 광택도Glossiness 핀홀
발생률
(개/100m2)
Pinhole
Incidence
(100/100 m 2 )
표면저항
(Ω)
Surface resistance
(Ω)
절연
파괴전압
(kV/mm)
Isolation
Breakdown voltage
(kV / mm)
실시예 1Example 1 6.06.0 1.21.2 102102 0.40.4 100100 5050 0.20.2 1.98×1016 1.98 × 10 16 100100 실시예 2Example 2 5.55.5 1.21.2 106106 0.60.6 100100 5252 0.170.17 1.11×1016 1.11 × 10 16 110110 실시예 3Example 3 6.56.5 0.80.8 9595 0.30.3 9898 4848 0.20.2 1.87×1016 1.87 × 10 16 9595 비교예 1Comparative Example 1 6.06.0 -- 110110 1.51.5 8080 5050 0.170.17 1.1×1016 1.1 × 10 16 9090 비교예 2Comparative Example 2 8.08.0 -- 9696 0.40.4 4747 3030 1.51.5 1.12×1014 1.12 × 10 14 6060 비교예 3Comparative Example 3 6.06.0 1.21.2 9898 0.50.5 9595 9898 0.50.5 3.61×1015 3.61 × 10 15 100100 비교예 4Comparative Example 4 6.06.0 44 7070 00 9898 4949 33 6.12×1015 6.12 × 10 15 100100

표 2로부터도 확인할 수 있는 바와 같이, 본 발명에 따른 실시예 1 내지 3의 블랙 폴리이미드 필름은 광택도가 낮고, 투과도가 낮아 차폐율이 높으면서도, 표면저항 및 전열파괴저항이 높아 절연 특성이 우수함을 알 수 있다. 또한, 신율이 높고, 핀홀 발생율이 낮으며, 내코로나 성이 좋은 등 기계적 물성 또한 우수함을 알 수 있다. As can be seen from Table 2, the black polyimide films of Examples 1 to 3 according to the present invention have low gloss, low permeability, high shielding rate, high surface resistance and high thermal breakdown resistance, and have high insulation properties. It can be seen that excellent. In addition, it can be seen that the mechanical properties are also excellent, such as high elongation, low pinhole generation rate, and good corona resistance.

반면, 비교예 1은 차폐제를 포함하지 않아 목적하는 광투과도를 얻을 수 없고, 비교예 2는 차폐제를 포함하지 않는 대신 카본블랙의 함량을 높여 목적하는 광투과도를 얻을 수 있지만, 카본블랙의 함량이 높으므로 절연성이 부족하고 내코로나성이 좋지 않음을 확인할 수 있었다. 또한, 비교예 3은 카본블랙 1차 입자의 입경이 작아 광택도가 높고, 비교예 4는 차폐제의 함량이 높아 신율이 작고, 핀홀 발생율이 높음을 확인할 수 있었다. On the other hand, Comparative Example 1 does not contain a shielding agent to obtain the desired light transmittance, Comparative Example 2 does not contain a shielding agent, but instead of increasing the content of carbon black to obtain the desired light transmittance, but the content of carbon black As a result, it was confirmed that the insulation was insufficient and the corona resistance was not good. In addition, Comparative Example 3 was confirmed that the particle size of the carbon black primary particles is small, high gloss, Comparative Example 4 has a high content of the shielding agent, small elongation, high pinhole generation rate.

Claims (5)

이무수물과 디아민류로부터 얻어진 폴리아믹산을 이미드화하여 얻어지는 폴리이미드 필름으로서,
(A) 1.5 중량% 이하의 고온 휘발성 성분을 포함하고 표면 산화처리가 되지 않은 카본블랙 3.0 내지 7.5 중량% 및 (B) 차폐제 0.5 내지 1.5 중량%를 포함하고,
가시광선 영역의 광투과도가 1.0 % 이하, 광택도가 60 % 이하, 신율이 80 % 이상이고, 표면저항이 1015 Ω 이상이며, 핀홀 발생률(개/100 ㎡)이 1 이하인 것을 특징으로 하는 블랙 폴리이미드 필름.
As a polyimide film obtained by imidating the polyamic acid obtained from dianhydride and diamines,
(A) less than or equal to 1.5% by weight of high temperature volatile components, and 3.0 to 7.5% by weight of carbon black, which is not subjected to surface oxidation, and (B) 0.5 to 1.5% by weight of a shielding agent,
Black having a light transmittance of 1.0% or less, a glossiness of 60% or less, an elongation of 80% or more, a surface resistance of 10 15 Ω or more, and a pinhole generation rate (piece / 100 m 2) of 1 or less Polyimide film.
제 1 항에 있어서,
상기 카본블랙은 부피평균입경이 2 ㎛ 이하이고, 최대 입경이 10 ㎛ 이하이며, 1차 입자 입경이 70 내지 150 nm인 것을 특징으로 하는 블랙 폴리이미드 필름.
The method of claim 1,
The carbon black has a volume average particle diameter of 2 μm or less, a maximum particle size of 10 μm or less, and a black polyimide film having a primary particle size of 70 to 150 nm.
제 1 항에 있어서,
상기 차폐제는 부피평균입경이 0.1 내지 1.0 ㎛인 것을 특징으로 하는 블랙 폴리이미드 필름.
The method of claim 1,
The shielding agent is a black polyimide film, characterized in that the volume average particle diameter of 0.1 to 1.0 ㎛.
제 1 항에 있어서,
상기 차폐제는 TiO2인 것을 특징으로 하는 블랙 폴리이미드 필름.
The method of claim 1,
The shielding agent is a black polyimide film, characterized in that TiO 2 .
제 1 항에 있어서,
상기 디아민류는 페닐렌디아민, 디아미노디페닐에테르 또는 이들의 유도체인 것을 특징으로 하는 블랙 폴리이미드 필름.
The method of claim 1,
The diamine is a black polyimide film, characterized in that phenylenediamine, diaminodiphenyl ether or derivatives thereof.
KR1020120036253A 2012-04-06 2012-04-06 Black polyimide film KR20130113778A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020120036253A KR20130113778A (en) 2012-04-06 2012-04-06 Black polyimide film
JP2014560840A JP6082761B2 (en) 2012-04-06 2012-09-07 Black polyimide film
CN201280066713.7A CN104169330B (en) 2012-04-06 2012-09-07 Black polyamide film
PCT/KR2012/007228 WO2013151215A1 (en) 2012-04-06 2012-09-07 Black polyimide film
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