KR20130105189A - A laser device using marking and cutting contained a supplementary beam adjuster device - Google Patents

A laser device using marking and cutting contained a supplementary beam adjuster device Download PDF

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Publication number
KR20130105189A
KR20130105189A KR1020120027412A KR20120027412A KR20130105189A KR 20130105189 A KR20130105189 A KR 20130105189A KR 1020120027412 A KR1020120027412 A KR 1020120027412A KR 20120027412 A KR20120027412 A KR 20120027412A KR 20130105189 A KR20130105189 A KR 20130105189A
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South Korea
Prior art keywords
laser
marking
mirror
cutting
laser beam
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KR1020120027412A
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Korean (ko)
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황영옥
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(주)레이저픽스코리아
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Priority to KR1020120027412A priority Critical patent/KR20130105189A/en
Publication of KR20130105189A publication Critical patent/KR20130105189A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE: A laser processing apparatus with a laser secondary beam device for the marking and cutting is provided to cause the path of a laser beam and a secondary beam to be accurately and rapidly arranged and matched, and to selectively mark and cut a subject. CONSTITUTION: A laser processing apparatus with a laser secondary beam device for the marking and cutting includes a body (24), a laser generation unit (11), a first mirror (14), a second mirror (16), a third mirror, a fourth mirror, a first laser head (18), a second laser head, and a secondary beam device (15). The body protects the internal component in the laser process apparatus. The laser generation unit outputs a laser beam to substantially perform marking and cutting inside the body. The first mirror is attached to the one side of a laser generation unit. The second mirror reflects the laser beam at the predetermined angle. The third mirror is installed parallel to the extension line of the second mirror. The fourth mirror is installed parallel to the extension line of the second mirror. The first laser head substantially performs the marking process on the surface of subject by using a laser beam. The second laser head substantially performs the cutting process on the surface of subject by using a laser beam. The secondary beam device is fixedly attached to the one side of the second mirror.

Description

A laser device using marking and cutting contained a supplementary beam adjuster device}

The present invention relates to a laser processing apparatus for marking and cutting with a laser auxiliary beam apparatus, and more particularly, to a vertical or horizontal position of an auxiliary beam output from a laser having a plurality of laser heads to enable marking or cutting. Precisely adjust the vertical, horizontal angle, etc., to quickly and accurately match and align the path of the laser beam and the auxiliary beam, and to provide a marking and cutting of the workpiece. And a laser processing apparatus for cutting.

Generally, laser is widely applied to holography, processing, medicine, communication and the like. In particular, laser processing is a work tool for processing fine workpieces using a large energy density, and fine work by various methods such as welding, cutting, hole drilling, and marking of the workpiece. By performing the object quickly and accurately, it is widely used in these industries.

Laser marking is a field of thermal material processing that converts energy of a laser beam into heat, and refers to recording symbols, characters, shapes, etc. by marking or discoloring the surface of an object using a high energy density of a laser. Laser marking can be applied continuously for a long time because no ink is required, and it is an environmentally friendly method in that solvent is unnecessary.

Laser marking devices and systems are classified into scanning type (scan type), mask type and mixed type according to the construction method and purpose of use. Among them, the scanning type irradiates the laser light collected at high density on the workpiece, Turn the light into the scanning mirror to scan the laser spot light on the surface of the workpiece, and instantly modify (melt, evaporate, transform, etc.) the laser spot light on the surface of the workpiece with the beam spot split (melting, evaporation, transformation, etc.). It is a technique of drawing and marking (marking or printing) a desired pattern such as a figure. In other words, the scanning method scans the oscillated laser at an arbitrary point by the XY scanning scanning device to imprint the shape of desired symbol, character, figure, etc. by using an input device such as an image scanner, autocad, etc. The advantage is that the desired information can be precisely marked on the surface of the workpiece.

Scanning laser marking was formerly regarded as a laser marking method suitable for small quantity production, but recently, with the development of a digital signal processor (DSP) capable of ultra-fast processing, it can be used for high-speed mass production. It is also used for mass production of materials, plastics and wood.

1 is a block diagram showing a general laser marking system. When the laser beam for imprinting at the laser head reaches the critical energy, the laser beam is output through the Q-switch signal toward the scan head, and the scan head is driven precisely by receiving a drive signal about the exact coordinates from the main controller. The laser beam is reflected and irradiated onto the placed workpiece. The power of the laser is also controlled by the main controller. The high-performance main controller is generally a computer capable of high-speed processing, and can quickly grasp the status of the laser system, and the user can easily input data according to the situation.

2 is a schematic view showing an example of a laser marking apparatus. The laser beam 1 is oscillated when the light source 4 hits the rod in the load chamber 3, and the laser overlaps the medium between the front mirror 2 and the rear mirror 5 so that light having the same wavelength overlaps. As it is, energy is amplified. When the energy to be amplified is exceeded, the Q-switch 8 is turned on / off by the Q-switch control signal, and the laser beam 1 is oscillated to the scan head portion 6. The Q-switch is turned on / off by the main controller or scanner control processor (DSP). The scan head unit 6 has a built-in scanner (galvanometer) to adjust the laser reflection angle by the main controller and the scanner control processor.

The laser device 10 and other accessory devices are controlled by the main controller. The software in the main controller is set with marking coordinates according to the symbols, characters and shapes that the user wishes to imprint. The marking coordinates are also stored in the position control board, and the position control board generates a marking start signal when it is determined that the system meets a predetermined condition so that the marking can be started. Under the laser scan head portion 6 there is a workpiece 9 which receives laser engraving and a conveying device or conveyor belt for transferring the workpiece. For example, the position control board outputs a marking start signal to the scanner control processor (DSP) when the marking coordinate and the marking position on the irradiated position coincide. The processor precisely controls the DAC board and scanner driver in the scanhead part 6 according to the marking parameters for driving the scanner calculated by considering the marking coordinates, the position and speed of the workpiece, the inertia, and the reaction speed of the system. The laser is reflected below the scan head portion 6 and output.

By the way, in the conventional laser marking system, when the area of the material to be laser-marked (hereinafter referred to as the workpiece), such as an LCD panel, is large, the laser-driving scanner is simultaneously applied to the entire surface of such a large workpiece. Could not be processed.

In order to avoid such a problem, a method of cutting a workpiece and performing laser marking individually, and a method of performing laser marking by moving the feeder (stage) to the X axis or the Y axis without cutting the workpiece It is.

However, there are many cases in which the workpieces should not be cut, as well as a lot of equipment and time required for the individual marking when cutting and individually laser marking. In addition, a considerable time is required even when the transfer device is moved to the X axis and the Y axis without cutting the work piece.

The laser device configured as described above has to adjust the auxiliary beam output from the laser to be exactly the same as the laser beam by adjusting the vertical, horizontal position, vertical, horizontal angle, etc., but it is difficult to control the exact position and angle with the conventional auxiliary beam device. In addition, there is a problem that a long time is required, and by marking the laser oscillated from one laser head toward the plurality of heads, laser marking cannot be performed at a plurality of marking positions, and only one operation of marking or cutting is provided. The reality is that there is a lot of cost when purchasing the device and space constraints when installing the device is divided into a laser device for cutting or cutting.

Therefore, the present inventors have devised the present invention to provide a laser device capable of marking and cutting to accurately adjust the vertical, horizontal position, vertical, and horizontal angles of the laser output beam.

[Related Technical Literature]

1. Laser processing unit and processing apparatus equipped with the laser processing unit (Patent Application No. 10-2003-0005407)

2. Virtual laser marking system and method (Patent Application No. 10-2006-7016920)

3. Laser micromachining apparatus using transparent glass (Patent Application No. 10-2007-0007308)

The present invention is to solve the above problems, and has a plurality of laser heads to enable marking or cutting to accurately control the vertical, horizontal position, vertical, horizontal angle, etc. of the auxiliary beam output from the laser path of the laser beam The present invention provides a laser processing apparatus for marking and cutting with a laser auxiliary beam apparatus capable of quickly and accurately matching and aligning a path of an auxiliary beam and selectively providing marking and cutting of a workpiece.

In addition, the present invention provides a laser assisted beam apparatus capable of simultaneously performing different laser marking or cutting for a plurality of marking or cutting positions by dividing the laser oscillated in a single laser head by time division and totally reflecting the plurality of scan heads. It is to provide a laser processing apparatus for marking and cutting provided.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the laser processing apparatus for marking and cutting provided with an auxiliary beam apparatus according to an embodiment of the present invention is used to weld and cut a workpiece to process a fine workpiece using a large energy density. In the laser processing apparatus for quickly and accurately processing a minute object by various methods such as cutting, hole drilling, marking, etc., a body for protecting the internal components of the laser processing apparatus, the inside of the body A laser generating unit for outputting a laser beam to perform the actual marking and cutting processing, and a first mirror, which is attached to one side of the laser generating unit for reflecting the output laser beam at a predetermined angle, spaced apart from the first mirror The second mirror and the second mirror for reflecting the laser beam at a predetermined angle in parallel to the extension line of the second mirror A third mirror that receives the laser beam emitted from the laser generator for marking during laser processing and transmits the laser beam to the laser head for marking, which is installed in parallel with an extension line of the second mirror and is emitted from the laser generator for cutting during laser processing. A fourth mirror for receiving the laser beam and transmitting the laser beam to a cutting laser head, and a first laser head for performing the actual marking process on the surface of the workpiece at the lower end of the third mirror. A second laser head configured to perform an actual cutting process on the surface of the workpiece on the lower surface of the fourth mirror, and a laser beam output from the laser generator; On one side of the second mirror to align the incident to the laser head and mark the origin at the basic machining position to mark the path. It is characterized in that it comprises a; auxiliary beam device fixedly laid.

The laser processing apparatus for marking and cutting provided with the auxiliary beam apparatus according to another embodiment of the present invention is configured to reflect the laser beam to the marking or cutting laser head to perform laser marking or cutting at a plurality of irradiated positions. Setting marking coordinates for the plurality of irradiated positions, controlling a laser power supply signal and a Q-switch signal, and driving a scanner in the scan head in accordance with respective marking coordinates for the plurality of irradiated positions; With a controller; A first mirror supplied with laser power by a laser power supply signal of the main controller and transmitting a laser beam by the Q-switch signal; A second mirror for selectively reflecting the laser beam transmitted from the first mirror toward the marking or cutting laser head; And a mirror controller configured to selectively adjust an angle of the second mirror in response to the marking or cutting coordinates and the Q-switch signal.

In the laser processing apparatus for marking and cutting provided with an auxiliary beam device according to another embodiment of the present invention, the auxiliary beam device is fixed to one end of a body of the laser device from which the laser beam is output, and the other end has a predetermined size of through hole. A bracket having a fastener formed therein, the bracket being installed such that the path of the auxiliary beam output to the outside through the through hole is the same as the path of the laser beam; A movable ring having a long hole having a long axis in a vertical direction and coupled to the horizontal direction in the through hole of the fixture so as to be adjustable in a horizontal direction; A diode laser unit configured to be coupled to a predetermined position and an angle in a vertical direction inside the hole of the moving ring and to output an auxiliary beam to match the position and angle of the laser beam; A plurality of horizontal position and angle adjusting means penetrating and coupled inwardly from the outside of the through hole of the fixture to perform horizontal position and angle adjustment of the movable ring; And a plurality of vertical position and angle adjusting means that penetrates the inner side from the outside of the through hole of the fixture, and penetrates and couples from the outer side of the long hole of the moving ring to the inner side to perform vertical position and angle adjustment of the diode laser unit. Characterized in that the configuration.

In the laser processing apparatus for marking and cutting provided with the auxiliary beam apparatus according to another embodiment of the present invention, the bracket has a fixed width such that the vertical position and the angle adjusting means are movable at a predetermined distance in the horizontal direction. A plurality of incision grooves are formed, and a plurality of communication holes are formed from the outside of the through hole, and the plurality of fixing bolts are further coupled to the communication hole so as to completely fix the moving ring. .

In the laser processing apparatus for marking and cutting provided with an auxiliary beam apparatus according to another embodiment of the present invention, the horizontal position and angle adjusting means and the vertical position and angle adjusting means may be any one of a ball plunger or a spring plunger or a mixture thereof. It is characterized in that the formed.

In the laser processing apparatus for marking and cutting equipped with the laser auxiliary beam apparatus according to the embodiment of the present invention, a plurality of marking or cutting may be performed by reflecting the laser beam transmitted from one laser head toward the marking or cutting laser head. In addition, the marking or cutting operation can be selectively performed in the same space, thereby reducing the cost of equipment purchase, and providing an effect of overcoming space limitations when installing the device.

In addition, the laser processing apparatus for marking and cutting provided with the laser auxiliary beam apparatus according to an embodiment of the present invention includes a plurality of laser heads to enable marking or cutting, and the vertical, horizontal position, and vertical position of the auxiliary beam output from the laser. By precisely adjusting the horizontal angle and the like, the path of the laser beam and the path of the auxiliary beam can be quickly and accurately matched and aligned, and the marking or cutting of the workpiece can be selectively provided.

In addition, the marking and cutting laser processing apparatus having a laser assisted beam apparatus according to an embodiment of the present invention is a plurality of marking or by splitting the laser oscillated from a single laser head by time-division total reflection toward a plurality of scan heads Different laser markings or cuts can be carried out simultaneously for the cutting position, which greatly increases the yield per unit time.

In addition, the laser processing apparatus for marking and cutting provided with a laser auxiliary beam apparatus according to an embodiment of the present invention is provided to fasten the auxiliary beam apparatus with the laser apparatus, the horizontal and vertical of the auxiliary beam output from the laser unit by the same adjustment The position and angle can be easily matched with the position and angle of the laser beam to perform the actual processing, so that the low-cost auxiliary beam having the same path as the laser beam can be used without using a high-power laser beam directly. In addition to preventing damage to the process, it is possible to check and correct the machining path in advance.

1 is a block diagram showing a general laser marking system.
2 is a schematic view showing an example of a laser marking apparatus.
3 is a perspective view of a laser device for marking and cutting according to the present invention;
4 shows the structure of a laser device according to the invention;
5 is a conceptual diagram of a laser device using a laser head for marking and cutting according to the present invention.
6 is a block diagram showing an example of a marking and cutting laser apparatus according to the present invention.
7 is a block diagram showing an internal configuration as an embodiment of the marking and cutting laser device according to the present invention;
8 is a view illustrating an auxiliary beam apparatus installed in a laser apparatus according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Figure 3 is a perspective view showing the configuration of the laser device for marking and cutting according to the present invention, Figure 4 is a view showing the structure of the laser device according to Figure 3, the detailed configuration with reference to Figures 3 and 4 Looking first, the laser device of the present invention is composed of two laser heads for marking the workpiece and the laser head for cutting the workpiece to receive the laser generated from the laser generator to operate the laser head for marking or cutting To apply the mirror variably, lasers can be received to perform marking or cutting operations.

The structure of the laser device of the present invention for laser processing is provided with a body 24 for protecting the internal components of the laser device, as shown in Figure 3 attached, the inside of the body 24 performs the actual processing In order to do this, the laser generating unit 11 for outputting the laser beam 12 is provided. One side of the laser generating unit 11 is provided with a first mirror 14 for reflecting the output laser beam 12 at a predetermined angle, and at a position spaced apart from the first mirror 14 by a predetermined distance. Again, a second mirror 17 for reflecting the laser beam 12 at an angle is provided.

In addition, the third mirror 17 and the fourth mirror 23 are installed in parallel to the extension line of the second mirror 17, the third mirror 17 is a laser generating unit for marking during laser processing ( 11) receives the laser beam 12 emitted from the laser beam 12 and transmits it to the marking laser head 18, which will be described later. The fourth mirror 24 is a laser beam emitted from the laser generator 11 for cutting. (12) is received and sent to the cutting laser head 22 to be described below to mark or cut the workpiece.

In addition, at the lower ends of the third mirror 17 and the fourth mirror 23, a first laser head which allows the laser beam 12 reflected therefrom to perform the actual marking process on the surface of the workpiece 21. (18) The laser head for cutting and the laser head for cutting the second laser head 22 which perform the cutting process are provided. In this way, the work of marking or cutting can be selectively performed on the workpiece from one laser source.

The first and second laser heads 18 and 22 have the same structure, and a motor 19 or the like for operating the mirror 20 at a high speed is installed inside the first and second laser heads 18 and 22.

That is, the cutting laser head 22 is irradiated directly to the workpiece to be emitted laser beam deeply to drive a constant drive speed of the motor 19 for precise machining, the marking laser head 18 Equipped with an additional drive motor (not shown) in order to perform the marking process by varying the moving speed of the laser head 18 in response to the rotation of the fast motor in order for the emitted laser ice to move quickly for marking the workpiece. do.

That is, machining or the like is performed on the surface of the workpiece 21 by the high speed operation of the mirror 20 and the motor 19.

In addition, the auxiliary beam device 16 is fixed to one side of the second mirror 17. That is, the low-power diode laser 25 is fixed to the body 24 by the bracket 26, and the auxiliary beam 15 output from the diode laser furnace 25 from the laser generator 11 It is installed to have the same path as the laser beam 12 is emitted, the bracket 26 is fixed to the body 24 by a plurality of fixing bolts 27 and the like.

The detailed configuration and operation of the auxiliary beam device 15 will be described below.

On the other hand, the beam used for the actual processing is the laser beam 12 output from the laser generating unit 11, but when the initial position of the various new materials to set the laser beam 12 in order to protect expensive materials directly The auxiliary beam device 16 is used to check and adjust the machining position without using it.

The alignment process of such an auxiliary beam is first performed by aligning the laser beam 12 output from the laser generator 11 to the first and second scanning heads 18 and 22 and then displaying the path. Mark the origin at the location.

5 is a conceptual diagram of a laser apparatus using a marking and cutting laser head according to the present invention, wherein the laser generator 11 receives a Q-switch on signal from a main controller or a processor for controlling a scanner and outputs a laser beam. do.

The laser beam transmitted from the laser generating unit 11 is reflected by the first mirror 14 toward the second mirror 17. At this time, the second mirror 17 is opposed by a main processor to a path toward either of the scan heads 17 and 24. The laser beam is selectively reflected by the second mirror 17 and is incident toward the corresponding scanhead 6 via the upper third mirror 17 and the lower fourth mirror 23.

That is, it is reflected by the first mirror 14 and is incident by the second mirror 17 to drive the marking head 18 or the cutting head 22 for marking or cutting. The third mirror 17 The laser beam incident through the laser beam is incident on the marking head 18 through the third mirror 17, and the laser beam incident on the fourth mirror 23 is incident on the cutting head 22, respectively, to be processed. Will be marked or cut.

At this time, the marking process is performed by processing a motor (not shown) additionally installed to provide a fast driving speed of the head when the marking laser head 18 is driven.

At this time, an alignment target 15 is arranged before and after the beam expander telescope BET 45 as shown in FIG. 6 to achieve accurate alignment. By the alignment target 5 and the BET 45, the laser beam has a desired diameter and characteristic and is incident into the scanhead 40.

The scan head 40 drives the scanner driving DAC board and the driver according to the marking or cutting parameters from the main processor to perform laser engraving.

In order to perform an accurate and easy control procedure, uniformity must be provided to the diameter and other characteristics of the laser incident to the two scan heads 40. For this purpose, from the second mirror 17 to the third mirror 13, The system must be designed so that the laser path of the laser path and the length of the laser path from the third mirror 13 to the lower fourth mirror 23 are the same. In addition, the length of the laser path for the marking laser head 18 and the length of the laser path for the cutting laser head 22 are both the same.

Figure 7 is a block diagram showing an example of a marking and cutting laser device according to the present invention with reference to the detailed configuration and operation with reference to Figures 3 to 7, the main controller controls the entire system, the position control board marking or cutting The coordinates are stored and the marking or cutting start signal is transmitted to the main controller when the workpiece to be imprinted for marking or cutting reaches the irradiated position and other conditions are satisfied.

The main controller or processor (DSP) receives the marking or cutting start signal from the position control board to drive the scanner in the marking head or the cutting head according to the marking or cutting parameters, and drives the second mirror 17. In order to prevent the laser from being emitted while the second mirror 17 is being driven, the Q-switch off signal is transmitted before the driving and the Q-switch on signal is supplied to the laser generator 11 after the rotation is completed. Send it out.

8 is a view illustrating an auxiliary beam device attached to a laser device according to another embodiment of the present invention. In the auxiliary beam device 15 of FIG. Although the laser beam 12 is output, the auxiliary beam device 16 which checks and adjusts a machining position without directly using the laser beam 12 in order to protect expensive materials at the time of initial setting of various new materials. ).

The alignment process of such an auxiliary beam is first performed by aligning the laser beam 12 output from the laser generator 11 to the first and second scanning heads 18 and 22 and then displaying the path. Mark the origin at the location.

By appropriately adjusting the position and angle of the diode laser 27 so that the auxiliary beam 15 outputted from the diode laser 25 is equal to the processing reference point generated by the laser beam 12, the auxiliary beam 15 and the The two points by the laser beam 12 coincide.

At this time, the two laser beams are identified at the same position only when the diode laser 25 exactly matches the path of the laser beam 12, and the diode laser 25 is turned off even when the laser generator 11 is turned off. Only the auxiliary beam 15 can be confirmed safely the machining position.

At this time, in order to adjust the position and angle of the auxiliary beam 15 by the diode laser 25, for example, to adjust the position of the bracket 26 surrounding the diode laser 25, the bracket (usually It is configured to adjust the angle and position of the diode laser 25 by appropriately adjusting some fixing bolts 27 for fixing 26 to the body 24.

The auxiliary beam device 15 is configured inside the laser device for marking and cutting according to the present invention. As another embodiment of the present invention, the auxiliary beam alignment device constituting the auxiliary beam alignment device interworking with the laser device marks the laser head 18 and The cutting laser head 22 can be driven. Hereinafter, looking at the detailed configuration of the auxiliary beam device, the marking or cutting is provided with a bracket 62 is fixed to one end of the body of the laser device is output laser beam processing.

The bracket 62 is formed with a plurality of fasteners 54 having a through hole 60 of a predetermined size. The through hole 60 of the fixture 54 has a substantially rectangular shape with each corner rounded. In addition, the upper and lower portions of the fastener 4 is formed with a plurality of cutting grooves 6 having a predetermined width. Two cutting grooves 6 are formed at the top and two at the bottom. In addition, two fastening holes 8b are formed in the upper and lower portions of the fasteners 4 between the incision grooves 6, respectively, and one each of the left and right sides of the fasteners 4, respectively. The communication hole 8a is formed.

Inside the through hole 60 of the fixture 54, the outer shape is substantially hexahedral, and the center of the long ring 64 is formed a moving ring 62 is coupled. The long hole 64 has a long axis in the vertical direction and a short axis in the horizontal direction.

In addition, the movable ring 62 is coupled to the predetermined position and angle adjustment or movement in the horizontal direction in the through hole 60 of the fixture 54. That is, the upper and lower surfaces of the movable ring 62 are in contact with the through hole 60 of the fixture 54, but the left and right sides are not directly contacted with the through hole 60 of the fixture 54. It is possible to adjust a certain position or angle in the right direction (horizontal direction).

Inside the long hole 64 of the movable ring 62 is combined with a laser diode 66 for outputting an auxiliary beam to match the position and angle of the laser beam for processing, the diode laser 66 is a cylindrical shape The left and right sides are always coupled to the long hole 64 of the movable ring 62 in contact with each other.

In addition, the diode laser unit 66 is movable up and down in the long hole 64 of the moving ring 62.

Therefore, the diode laser unit 66 may adjust or move a predetermined position and angle in the up and down direction (vertical direction) inside the long hole 64 of the moving ring 62.

Through and coupled from the outside of the through hole 60 of the fixture 54 to the inside, a plurality of horizontal position and angle adjusting means 68 is coupled to perform the horizontal position and angle adjustment of the movable ring 62 It is.

That is, two horizontal position and angle adjusting means 68 are coupled to the left and right directions of the fastener 54, and the ends thereof are in contact with the surface of the movable ring 62. That is, by appropriately adjusting the plurality of horizontal position and angle adjusting means 68, the moving ring 62 is adjusted to a predetermined horizontal position and angle inside the through hole 60 of the fixture (5).

While penetrating inward from the outside of the through hole 60 of the fastener 54 (that is, located inside the cutting groove 56 of the fastener 54), outside the long hole 64 of the movable ring 62. A plurality of vertical position and angle adjusting means are provided in the fixture 54 and the moving ring 62 so as to penetrate and couple inward to adjust the vertical position and angle of the diode laser portion 66. Is combined.

That is, two vertical position and angle adjusting means are respectively coupled to the upper and lower directions of the fixture 54, and the ends thereof are in contact with the surface of the diode laser portion 66. More specifically, by appropriately adjusting the plurality of vertical position and angle adjusting means, the diode laser portion 66 is adjusted to a predetermined vertical position and angle inside the long hole 64 of the moving ring 62.

Therefore, the horizontal position and angle adjustment of the movable ring 62 are performed by the horizontal position and angle adjusting means 68, and the vertical position of the diode laser portion 66 by the vertical position and angle adjusting means. And by adjusting the angle, both the horizontal, vertical position and angle of the auxiliary beam output from the diode laser unit 66 can be adjusted.

On the other hand, when adjusting the horizontal direction and the like of the movable ring 62 with the horizontal position and angle adjusting means 68, the vertical position and angle adjusting means fixed to the movable ring 62 by the fastener (54) The movement may be limited, but since the fastener 54 is formed with a cutting groove 56 having a predetermined width, the vertical position and angle adjusting means is horizontal in a predetermined width range of the cutting groove 56. It can be moved freely.

In addition, after the horizontal or vertical position and angle adjustment is completed as described above, by coupling the fixing bolts (58c, 58d) to the plurality of communication holes (58a, 58b) formed in the fixture 54, the moving ring 62 It can be fixed completely so that it does not move. That is, by coupling the fixing bolt to each of the communication holes (58a, 58b) formed in the upper, lower, left, and right of the fastener 54, the movable ring 62 in the through hole 60 of the fastener (54) Fix it.

Looking at the operation of the auxiliary beam device of the laser device according to an embodiment configured as described above, that is, the alignment method, first, after aligning the laser beam output from the laser generator is incident on the scanning head, to display the path Mark the origin at the basic machining position of the hazard.

Then, the horizontal or vertical position and angle of the auxiliary beam output from the diode laser unit 66 are adjusted so that the auxiliary beam by the diode laser unit 66 coincides with the origin of the position.

For example, the horizontal position and angle adjustment of the movable ring 62 is performed by using a plurality of horizontal position and angle adjusting means 18 coupled to the fixing tool 54 of the bracket. Of course, since the diode laser unit 16 is coupled to the inside of the long hole 64 of the moving ring 62, the horizontal position and angle adjustment of the diode laser unit 66 or the auxiliary beam output therefrom is performed.

In addition, the vertical position and angle adjustment of the diode laser unit 66 is performed by using a plurality of vertical position and angle adjusting means coupled to the fixture 44 of the bracket. Of course, the horizontal position and angle of the movable ring 62 does not change at this time.

By properly adjusting the horizontal or vertical position and angle adjusting means as described above, when the diode laser portion 66, i.e., the auxiliary beam outputted therefrom, coincides with the origin of the above-described laser beam, the communication hole of the fixture 54 By fully tightening the plurality of fixing bolts (58c, 58d) coupled to (58a, 58b), the moving ring 62, etc. so as to no longer move inside the through hole 60 of the fixture (54).

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

1: laser generating unit
12: laser beam
14: first mirror
15: auxiliary beam device
16: second mirror
17: third mirror
18: marking laser head
22: laser head for cutting
24: fourth mirror

Claims (5)

Laser processing for fast and accurate treatment of fine workpieces by various methods such as welding, cutting, hole drilling, marking, etc. to process fine workpieces with high energy density. In the device,
Body to protect the internal components of the laser processing machine,
Inside the body and the laser generating unit for outputting a laser beam to perform the actual marking, cutting processing,
A first mirror attached to one side of the laser generator to reflect the output laser beam at a predetermined angle;
A second mirror for reflecting the laser beam at a predetermined distance apart from the first mirror at a predetermined distance;
A third mirror installed in parallel with an extension line of the second mirror and receiving a laser beam emitted from a laser generator for marking during laser processing and transmitting the laser beam to a marking laser head;
A fourth mirror installed in parallel with an extension line of the second mirror and receiving a laser beam emitted from the laser generator for cutting during laser processing and transmitting the laser beam to a cutting laser head;
A lower end portion of the third mirror having a first laser head for performing an actual marking process on the surface of the workpiece with the laser beam reflected from the second mirror;
A second laser head configured to perform an actual cutting process on the surface of the workpiece with the laser beam reflected from the second mirror at the lower end of the fourth mirror;
An auxiliary beam device fixed to one side of the second mirror to align the laser beams output from the laser generator to be incident on the first and second laser heads, and to display an origin at a basic machining position for indicating a path; Laser processing device for marking and cutting with an auxiliary beam device characterized in that it comprises a.
The method of claim 1,
In order to perform laser marking or cutting at a plurality of irradiated positions by reflecting a laser beam to the marking or cutting laser head, a marking coordinate for the plurality of irradiated positions is set, and a laser power supply signal and a Q-switch signal. A main controller configured to control a control unit and to drive a scanner in the scan head according to respective marking coordinates of the plurality of irradiated positions;
A first mirror supplied with laser power by a laser power supply signal of the main controller and transmitting a laser beam by the Q-switch signal;
A second mirror for selectively reflecting the laser beam transmitted from the first mirror toward the marking or cutting laser head;
And a mirror control unit for selectively adjusting the angle of the second mirror in response to the marking or cutting coordinates and the Q-switch signal.
The method of claim 1,
The auxiliary beam device
One end is fixed to the body of the laser device that the laser beam is output, and the other end is formed with a fixture having a certain size of the through hole, the path of the auxiliary beam output to the outside through the through hole is the same as the path of the laser beam Mounting brackets;
A movable ring having a long hole having a long axis in a vertical direction and coupled to the horizontal direction in the through hole of the fixture so as to be adjustable in a horizontal direction;
A diode laser unit configured to be coupled to a predetermined position and an angle in a vertical direction inside the hole of the moving ring and to output an auxiliary beam to match the position and angle of the laser beam;
A plurality of horizontal position and angle adjusting means penetrating and coupled inwardly from the outside of the through hole of the fixture to perform horizontal position and angle adjustment of the movable ring; And
It includes a plurality of vertical position and angle adjusting means that penetrates the inner side from the outside of the through hole of the fixture, and penetrates and is coupled from the outer side of the long hole of the movable ring to perform the vertical position and angle adjustment of the diode laser unit. Marking and cutting laser processing device having an auxiliary beam device, characterized in that.
The method of claim 3, wherein
In the fastener of the bracket,
The vertical position and the angle adjusting means to move a predetermined distance in the horizontal direction, a plurality of cutting grooves having a predetermined width is formed, a plurality of communication holes are formed from the outside of the through hole, the communication hole in the moving ring Marking and cutting laser processing device with an auxiliary beam device, characterized in that the plurality of fixing bolts are further coupled to completely fix the.
The method of claim 3, wherein
The horizontal position and angle adjusting means and the vertical position and angle adjusting means are any one of a ball plunger or a spring plunger or a laser processing apparatus for marking and cutting with an auxiliary beam device, characterized in that installed.
KR1020120027412A 2012-03-16 2012-03-16 A laser device using marking and cutting contained a supplementary beam adjuster device KR20130105189A (en)

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105665924A (en) * 2016-04-15 2016-06-15 上海普睿玛智能科技有限公司 Automatic optical-path switching device based on two sets of laser processing systems and switching method of device
CN106425512A (en) * 2016-10-14 2017-02-22 铜陵有色金属集团铜冠矿山建设股份有限公司 Automatic production line used for expandable bolt production
US9673185B2 (en) 2014-04-28 2017-06-06 Samsung Electronics Co., Ltd. Method of manufacturing stacked semiconductor package
CN109623169A (en) * 2019-01-02 2019-04-16 西京学院 A kind of farm machinery parts cutting device for processing and cutting method
CN113562966A (en) * 2021-08-18 2021-10-29 浙江愚工智能设备有限公司 Full-automatic double-beam glass laser marking and cutting equipment and working method thereof
CN114227025A (en) * 2022-02-28 2022-03-25 铭镭激光智能装备（河源）有限公司 Self-adaptive adjustment laser cutting device
CN114644252A (en) * 2020-12-17 2022-06-21 昊佰电子科技（上海）有限公司 Auxiliary laminating device
CN115016096A (en) * 2022-07-06 2022-09-06 中国航空制造技术研究院 Automatic alignment device and method for multi-stage reflection light path
CN115197785A (en) * 2022-07-14 2022-10-18 昆山市曙光照明器材有限公司 Device for improving fixing efficiency of lamp wick
IT202200009869A1 (en) * 2022-05-12 2023-11-12 Cy Laser S R L DEVICE FOR GALVANOMETRICAL MARKING FOR MACHINE TOOLS
CN117047315A (en) * 2023-09-27 2023-11-14 武汉科贝尔激光科技有限公司 Laser cutting machine and use method thereof
CN117228945A (en) * 2023-11-15 2023-12-15 成都新世佳特种玻璃技术开发有限公司 Cutting device and cutting process for special glass production
CN117506162A (en) * 2023-11-27 2024-02-06 安徽华创鸿度光电科技有限公司 Ultrafast solid laser
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9673185B2 (en) 2014-04-28 2017-06-06 Samsung Electronics Co., Ltd. Method of manufacturing stacked semiconductor package
CN105665924A (en) * 2016-04-15 2016-06-15 上海普睿玛智能科技有限公司 Automatic optical-path switching device based on two sets of laser processing systems and switching method of device
CN105665924B (en) * 2016-04-15 2017-04-05 上海普睿玛智能科技有限公司 Optical path auto-switch device and its changing method based on two sets of laser-processing systems
CN106425512A (en) * 2016-10-14 2017-02-22 铜陵有色金属集团铜冠矿山建设股份有限公司 Automatic production line used for expandable bolt production
CN109623169A (en) * 2019-01-02 2019-04-16 西京学院 A kind of farm machinery parts cutting device for processing and cutting method
CN109623169B (en) * 2019-01-02 2021-07-02 西京学院 Cutting device and cutting method for machining of agricultural machine accessories
CN114644252A (en) * 2020-12-17 2022-06-21 昊佰电子科技（上海）有限公司 Auxiliary laminating device
CN113562966A (en) * 2021-08-18 2021-10-29 浙江愚工智能设备有限公司 Full-automatic double-beam glass laser marking and cutting equipment and working method thereof
CN114227025A (en) * 2022-02-28 2022-03-25 铭镭激光智能装备（河源）有限公司 Self-adaptive adjustment laser cutting device
IT202200009869A1 (en) * 2022-05-12 2023-11-12 Cy Laser S R L DEVICE FOR GALVANOMETRICAL MARKING FOR MACHINE TOOLS
CN115016096A (en) * 2022-07-06 2022-09-06 中国航空制造技术研究院 Automatic alignment device and method for multi-stage reflection light path
CN115197785A (en) * 2022-07-14 2022-10-18 昆山市曙光照明器材有限公司 Device for improving fixing efficiency of lamp wick
CN115197785B (en) * 2022-07-14 2024-02-02 昆山市曙光照明器材有限公司 Device for improving lamp wick fixing efficiency
CN117047315A (en) * 2023-09-27 2023-11-14 武汉科贝尔激光科技有限公司 Laser cutting machine and use method thereof
CN117228945A (en) * 2023-11-15 2023-12-15 成都新世佳特种玻璃技术开发有限公司 Cutting device and cutting process for special glass production
CN117228945B (en) * 2023-11-15 2024-01-23 成都新世佳特种玻璃技术开发有限公司 Cutting device and cutting process for special glass production
CN117506162A (en) * 2023-11-27 2024-02-06 安徽华创鸿度光电科技有限公司 Ultrafast solid laser
CN117506162B (en) * 2023-11-27 2024-05-10 安徽华创鸿度光电科技有限公司 Ultrafast solid laser

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