KR20130104179A - Method for preparing a solder resist dry film - Google Patents
Method for preparing a solder resist dry film Download PDFInfo
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- KR20130104179A KR20130104179A KR1020120025455A KR20120025455A KR20130104179A KR 20130104179 A KR20130104179 A KR 20130104179A KR 1020120025455 A KR1020120025455 A KR 1020120025455A KR 20120025455 A KR20120025455 A KR 20120025455A KR 20130104179 A KR20130104179 A KR 20130104179A
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- South Korea
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- solder resist
- film
- dry film
- resist composition
- bisphenol
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a solder resist dry film useful as an electrical insulating film for a printed wiring board, and more particularly, to a support film, a cover film, and a solder resist layer provided between the support film and the cover film, wherein the coating The present invention relates to a method for manufacturing a solder resist dry film having excellent properties, thickness uniformity, coating appearance, heat resistance and storage stability.
Description
BACKGROUND OF THE
In semiconductor packages, miniaturization, high performance, and multifunction of electronic devices are required. According to this trend, the weight, thickness and miniaturization of electronic component materials are being made.
When bonding a semiconductor chip to a solder resist applied on a substrate, a separate die adhesive for bonding the semiconductor chip is generally used. If a liquid solder resist is used, complete curing of the liquid solder resist is necessary because the semiconductor chip is mounted by curing the solder resist and then applying a die adhesive thereon and adhering the semiconductor chip onto the applied die adhesive.
For example, the solder resist dry film as disclosed in Korean Patent Laid-Open Publication No. 2009-0130852 is coated in a film form unlike a liquid solder resist composed of a main material and a curing agent, and thus can be directly applied without printing and drying processes and thickness deviations. There is almost no advantage. However, the storage conditions, coating and manufacturing process is difficult, not only should there be a problem of coating property, thickness uniformity, appearance defects, but also storage stability.
The present invention is to solve the problems of the prior art as described above, to provide a method for manufacturing a solder resist dry film excellent in coating properties, thickness uniformity, coating appearance, heat resistance and storage stability, and the like. Shall be.
The present invention to solve the above technical problem, the step of applying a liquid solder resist composition on the support film; Drying the applied solder resist composition layer; And laminating a cover film on the dried solder resist composition layer, wherein the liquid solder resist composition comprises a crystalline epoxy compound, a phenol compound having a bisphenol S structure, a polymerization initiator, and a solvent, wherein the solder resist composition layer Drying is performed at 90 to 120 ° C., and the thickness of the dried solder resist composition layer is 20 to 40 μm, to provide a method for producing a solder resist dry film.
The solder resist dry film prepared according to the present invention is excellent in coating property, thickness uniformity, coating appearance, heat resistance and storage stability, and can be compatible with alkali developability and photocurability, and water resistance, electric insulation, cold cycle resistance, etc. It is possible to provide a cured product which is excellent in dimensional stability due to temperature change and does not exhibit brittleness, and can be particularly suitably used as an electric insulating film for a printed wiring board.
1 is a schematic view showing the layer configuration of a solder resist dry film prepared according to one embodiment of the present invention.
Hereinafter, the present invention will be described in detail.
In the present invention, the liquid solder resist composition includes a crystalline epoxy compound, a phenol compound having a bisphenol S structure, a polymerization initiator, and a solvent.
The crystalline epoxy compound may preferably be a crystalline epoxy resin having a melting point of 90 ° C. or higher (eg, 90 ° C. to 150 ° C.), more preferably 95 ° C. or higher, even more preferably 100 ° C. or higher. The crystalline epoxy compound may also preferably have a biphenyl structure.
The liquid solder resist composition may further include an epoxy acrylate having 2 to 4 functional groups (preferably a carboxyl group) as an epoxy component, and may further contain other known epoxy compounds. Examples of such known epoxy compounds include bisphenol type epoxy resins such as bisphenol S type, tetrabromobisphenol A type, bisphenol F type and bisphenol A type; Alicyclic epoxy resins such as hydrogenated (hydrogenated) bisphenol A; Diglycidyl ester type epoxy resin; Alkylene oxide is added to the diglycidyl ether type epoxy resin of polyhydric alcohol, especially the polyalkylene glycols, such as polyethyleneglycol, polypropylene glycol, polytetramethylene glycol, or the bisphenol compound which is a precursor of the said bisphenol type epoxy resin Diglycidyl ether type epoxy resins obtained by reacting dihydric alcohols and epichlorohydrin. Bifunctional epoxy compounds such as diglycidyl amine type epoxy resins, and polyfunctional glycidylamine resins such as tetraglycidylaminodiphenylmethane; Polyfunctional glycidyl ether resins such as tetraphenylglycidyl ether ethane; Phenol novolac type epoxy resins and cresol novolac type epoxy resins; Reactant of the polyphenol compound obtained by condensation reaction of phenol compounds, such as phenol, o-cresol, m-cresol, and naphthol, with the aromatic aldehyde which has a phenolic hydroxyl group, and epichlorohydrin; Reactant of the polyphenol compound obtained by addition reaction of a phenol compound with diolefin compounds, such as divinylbenzene and dicyclopentadiene, and epichlorohydrin; Epoxidation of the ring-opening polymer of 4-vinyl cyclohexene-1-oxide with peracid; Trifunctional or more than trifunctional epoxy compounds, such as epoxy resin which has heterocycles, such as triglycidyl isocyanurate, are mentioned.
Examples of the phenol compound having a bisphenol S structure include bisphenol S, tetrabromobisphenol S, tetramethylbisphenol S, and the like, and these may be used alone or in combination of two or more thereof. Preferably bisphenol S can be used.
The liquid solder resist composition may further include a known bifunctional phenol compound having no bisphenol S structure as the phenol compound. Examples of such phenolic compounds include bisphenol A, bisphenol F, 9,9-bis (4-hydroxyphenyl) fluorene, bis (4-hydroxyphenyl) sulfide and the like, and known bisphenols and biphenols except bisphenol S. Etc. can be mentioned. Moreover, you may use together a trifunctional or more than trifunctional phenol compound together. Examples of these include novolak resins, 1,1,1-tris (4-hydroxyphenyl) ethane, and the like.
In the liquid solder resist composition, the amount of the phenol compound having a bisphenol S structure is preferably 10 to 50 parts by weight, more preferably 20 to 30 parts by weight based on 100 parts by weight of the crystalline epoxy compound. If the amount of the phenol compound having a bisphenol S structure is less than 10 parts by weight per 100 parts by weight of the crystalline epoxy compound, there may be a problem that the resin residue remains due to a decrease in the degree of curing. There may be a problem losing.
As a polymerization initiator, a well-known thermal polymerization initiator or a photoinitiator can be used, and it is preferable to photocure a composition using a photoinitiator for the microprocessing or image formation by photolithography. As an example of a photoinitiator, Benzoin, such as benzoin, benzoin methyl ether, and benzoin ethyl ether, and its alkyl ether; Acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone and 4- (1-t-butyldioxy-1-methylethyl) acetophenone; Anthraquinones such as 2-methyl anthraquinone, 2-amylanthraquinone, 2-t-butyl anthraquinone and 1-chloro anthraquinone; Thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone and 2-chlorothioxanthone; Ketal such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzophenones such as benzophenone, 4- (1-t-butyldioxy-1-methylethyl) benzophenone, 3,3 ', 4,4'-tetrakis (t-butyldioxycarbonyl) benzophenone Etc. can be mentioned. In addition, 1-hydroxy-cyclohexyl-phenyl ketone, α, α-dimethoxy-α-hydroxyacetophenone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone -1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4 -(4-morpholinyl) phenyl] -1-butanone, N, N-dimethylaminoacetophenone (as a commercially available product, Irucure (registered trademark) of Chiba Specialty Chemical Co., Ltd. (Chiba Japan Corporation) 907, Α-aminoacetophenones such as Irgacure 369 and Irgacure 379), 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide , Bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide (as a commercially available product, Lucillin® TPO manufactured by BASF Corporation, Irugacure 819 manufactured by Chivas Specialty Chemicals Co., Ltd.) Acyl phosphine oxides, etc.) can be used as a photoinitiator. .
In the liquid solder resist composition, the amount of the polymerization initiator used is preferably 0.1 to 2 parts by weight, more preferably 0.5 to 1 part by weight based on 100 parts by weight of the crystalline epoxy compound. If the amount of the polymerization initiator is less than 0.1 parts by weight per 100 parts by weight of the crystalline epoxy compound, there may be a problem that the curing does not occur due to the photopolymerization does not occur, if there is more than 2 parts by weight may have a problem that the curing speed is too fast.
A liquid solder resist composition contains a solvent from a viewpoint of workability, etc. at the time of apply | coating a composition to a base material. Examples of suitable solvents include hydrocarbons such as toluene and xylene; Cellosolves such as cellosolve and butyl cellosolve; Carbitols such as carbitol and butyl carbitol; Esters such as cellosolve acetate, carbitol acetate, (di) propylene glycol monomethyl ether acetate, glutaric acid (di) methyl, succinic acid (di) methyl, adipic acid (di) methyl; Ketones such as methyl isobutyl ketone and methyl ethyl ketone; Ethers, such as (di) ethylene glycol dimethyl ether, etc. are mentioned, These solvent can be used 1 type or in mixture of 2 or more types.
In the liquid solder resist composition, the amount of the solvent used is not particularly limited, and may be selected within a range capable of imparting proper coating properties and workability to the composition, for example, preferably based on 100 parts by weight of the crystalline epoxy compound. Is 5-50 weight part, More preferably, it is 10-20 weight part. If the amount of the solvent is too small, there may be a problem in the coating performance by increasing the viscosity, on the contrary, if the amount is too large, there is a problem in that the viscosity is low to form a desired coating film thickness.
The liquid solder resist composition may further include a compound having two or more functional groups in one molecule capable of reacting with a carboxyl group, whereby a stronger cured coating film can be obtained and used in a printed wiring board. By heat treatment after light irradiation and alkali image development, a crosslinking degree can be raised, consuming a carboxyl group in a cured coating film, and the physical properties, such as durability, can be improved further. Examples of the compound having two or more functional groups capable of reacting with a carboxyl group in one molecule include epoxy compounds (eg, novolak type epoxy resins, bisphenol type epoxy resins, alicyclic epoxy resins, triglycidyl isocyanurates), oxa A sleepy compound (for example, 1, 3- phenylene bisoxazoline), an oxetane compound, etc. are mentioned. Such a compound is preferably one having a biphenyl structure.
The liquid solder resist composition may further include, in an appropriate amount, any components conventionally added to the solder resist composition, such as a silane coupling agent, an inorganic filler, a dispersant, and the like, within the range capable of achieving the object of the present invention. Can be.
The support film contained in the soldering resist dry film manufactured by this invention is a film of resin with heat resistance, Preferably it has a thickness in the range of 10-50 micrometers. As a preferable heat resistant resin, polyester resins, such as polyethylene terephthalate (PET) and polyethylene naphthalate, are mentioned, for example.
The cover film contained in the soldering resist dry film manufactured by this invention, Preferably it is a release film containing a base film and a release layer. The base film may be polyethylene terephthalate (PET), uniaxial to biaxially stretched polypropylene, or the like, and preferably has a thickness in the range of 10 to 50 μm. The release film is classified into a light peeling release film and a heavy peeling release film according to the size of the peeling force, and the peeling force of the light peeling release film is smaller than that of the peeling release film. In the present invention, the cover film is preferably a light peeling release film.
Although the mold release agent which forms the said release layer is not specifically limited, It is preferable that the silicone type mold release agent excellent in the peeling characteristic is used. In particular, in consideration of the heat resistance of the base film, it is preferable to use an addition-reaction type silicone release agent. When apply | coating and hardening an addition reaction type | system | group silicone mold release agent, it is preferable to dry and harden at the temperature of 115 degrees C or less. At temperatures exceeding 115 ° C, lateral wrinkles and longitudinal wrinkles may occur due to thermal shrinkage of the base film. Formation of the release layer may be carried out by applying the release agent to the base film by various methods such as gravure coating, air knife coating, and then drying and curing by heat treatment, ultraviolet irradiation or the like. The amount of release agent applied is preferably 0.17 to 0.15 to 1.0 g /
In one embodiment in which the solder resist dry film prepared according to the present invention is applied to a printed wiring board, the cover film is first removed, and one surface of the exposed solder resist layer is attached to the printed wiring board using a laminator or the like. After the exposure and development process, the support film is removed.
The solder resist dry film manufacturing method of the present invention comprises the steps of applying the liquid solder resist composition on the support film; Drying the applied solder resist composition layer; And laminating the cover film on the dried solder resist composition layer, wherein drying of the solder resist composition layer is performed at 90-120 ° C., preferably 100-120 ° C., and the dried solder resist composition layer Is characterized in that the thickness of 20 ~ 40㎛, preferably 25 ~ 35㎛.
If the temperature of the solder resist composition layer is lower than 90 ° C., when the cover film is removed to apply the solder resist dry film to the printed wiring board, there is a fear that the solder resist layer is transferred to the cover film, which is higher than 120 ° C. If you do, the resolution will be reduced. There is no particular limitation on the drying time conditions, but may be preferably dried for 100 to 500 seconds, more preferably 200 to 400 seconds in consideration of workability and productivity.
In one preferred embodiment of the present invention, the coating is performed by applying the cleanness in the coating head portion and the drying chamber at a level of 100 to 1,000 class, using the environment of the solder resist dry film coating equipment in a dust-free room. The mixing of dust and foreign matter (impurity) in the film is blocked, and the foreign matter of 100 μm or more per square meter (M 2 ) should be 2 or less, thereby preventing the appearance defect of the solder resist dry film due to the mixing of foreign matter. Will be. In addition, the coater head of the coater is coated using a comma coater, a lip coater, or a slot die coater while maintaining the viscosity of the solder resist solution at 1,000 to 6,000 cps (25 ° C). The thickness should be within ± 3㎛ of the thickness. The coater head of the release agent coater is coated using a microgravure coater or gravure coater, and the amount of release agent applied is 0.17 to 0.15 to 1.0 g /
The soldering resist layer of the soldering resist dry film manufactured as mentioned above is hardened by active energy ray irradiation and / or heat.
Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples. However, the scope of the present invention is not limited thereto.
Example One
Biphenyl type epoxy resin (trade name: YX4000K, manufacturer: Mitsubishi Chemical, epoxy equivalent: 187.00 g / eq, melting point: 107 ° C) 100 parts by weight, bisphenol S 23 parts by weight, inorganic filler (trade name: ASA, manufacturer: Solvay, Particle size: 1 μm) 25 parts by weight, photopolymerization initiator (Irugacure 907, Chivas Specialty Chemicals) 0.9 part by weight, dispersant (product name: BYK-110, manufacturer: BYK, solid content: 52%) 0.03 parts by weight, A uniform liquid solder resist composition was prepared by mixing 0.06 parts by weight of a silane coupling agent (3-Glycidoxypropyl trimethoxy silane, product name: KBM-403, manufacturer: Shin-Etsu), and 10 parts by weight of methyl ethyl ketone as a solvent. Subsequently, the prepared solder resist composition was uniformly applied to a support film (thickness: 25 μm), and dried in a hot air circulation oven at 90 ° C. for 300 seconds to form a dry solder resist layer (dry thickness: 30 μm).
Example 2
It was the same as that of Example 1 except having formed the dry soldering resist layer (dry thickness: 30 micrometers) by setting the temperature of a drying oven to 110 degreeC.
Example 3
It was the same as that of Example 1 except having formed the dry soldering resist layer (dry thickness: 30 micrometers) by setting the temperature of a drying oven to 120 degreeC.
Comparative example One
It was the same as that of Example 1 except having formed the dry soldering resist layer (dry thickness: 30 micrometers) by setting the temperature of a drying oven to 70 degreeC.
Comparative example 2
It was the same as that of Example 1 except having formed the dry soldering resist layer (dry thickness: 30 micrometers) by setting the temperature of a drying oven to 80 degreeC.
Comparative example 3
It was the same as that of Example 1 except having formed the dry soldering resist layer (dry thickness: 30 micrometers) by making temperature of a drying oven 130 degreeC.
The manufactured soldering resist dry film was evaluated by the following method, and the results are shown in Table 1.
- Probe Tag ( Probe Tack ) Measure
An evaluation sample was prepared by cutting the prepared solder resist dry film to a constant size. For the evaluation samples, the force applied to the probe was measured under conditions of a probe diameter of 20 mm, a Compress Force of 5N, a Compress Speed of 2 mm per minute, and a Holding Time of 5 seconds. Evaluation criteria were as follows.
○: when measured value is less than 7gf
Δ: when the measured value is 7 to 15 gf
X: When measured value is more than 15gf
- Developability
The prepared solder resist dry film was immersed in 30% of 1% sodium carbonate (Na 2 CO 3 ) aqueous solution for 150 seconds, and the degree of remaining of the coating film was observed to evaluate photocurability. Evaluation criteria were as follows.
○: fully developed
△: undeveloped deposit remains
- Resolution
After attaching the prepared solder resist dry film to the substrate on which the pattern was drawn, the film on which the solder resist pattern was printed was placed on the surface of the substrate and subjected to 1000 mJ /
○: When 90% or more of the solder resist pattern size is resolved
X: Less than 90% of solder resist pattern size is resolved
-Compassion resistance ( Hot water resistance )
After exposing 1000 mJ / cm <2> of the manufactured soldering resist dry film using the ultraviolet-ray exposure apparatus, it heated at 150 degreeC for 30 minutes, and was immersed in boiling ion-exchange water for 60 second after that. The state of the coating film after immersion was visually evaluated. Evaluation criteria were as follows.
(Circle): There is no abnormality in the external appearance of a coating film.
X: Swelling and peeling in a part of coating film
Solder Heat Resistance
After attaching a soldering resist dry film to the board | substrate with which the pattern was drawn, the film on which the soldering resist pattern was printed was mounted on the surface of the board | substrate, it exposed, and the soldering resist layer was photocured. After exposure, the support film was peeled off, immersed in 30% 1% sodium carbonate (Na 2 CO 3 ) aqueous solution for 150 seconds and washed with water for 60 seconds to form a pattern. Thereafter, the film was thermoset at 150 ° C. for 60 minutes to obtain a cured solder resist coating film adhered to the substrate. The rosin-based flux was apply | coated to this hardened soldering resist coating film, and it immersed in 260 degreeC solder tank three times for 10 second every 20 second, and the coating film state was evaluated based on the following reference | standard.
○: no swelling, peeling or discoloration
X: swelling, peeling or discoloration
- PCT tolerance
An evaluation substrate having a cured solder resist layer was produced in the same manner as in the solder heat resistance evaluation. After placing the substrate in a high temperature / high pressure / high humidity tank at 120 ° C., 2 atmospheres, and a humidity of 100% for 72 hours or 144 hours, the state change of the cured coating film was evaluated based on the following criteria.
◎: no peeling, discoloration and dissolution even after 144 hours
○: There is one of peeling, discoloration and elution after 72 hours.
X: Many peeling, discoloration, and dissolution after 72 hours
Coating thickness uniformity
The thickness of each of left, middle and right spots of the manufactured solder resist dry film was measured using a thickness gauge (model name ID-C112 Mitutoyo) and evaluated according to the following criteria.
(Circle): When the difference between the upper limit value and the lower limit value of left / middle / right measurement thickness is less than 1 micrometer
(Triangle | delta): When the difference of the upper limit value and the lower limit value of left / middle / right measurement thickness is 1-2 micrometers
X: When the difference between the upper limit value and the lower limit value of the left / middle / right measurement thickness is more than 2 μm
- Solder Resist Coating appearance evaluation
The surface appearance of the manufactured solder resist dry film was visually evaluated by the following criteria.
(Circle): When external appearance color is uniform and the state of a coating surface is favorable
(Triangle | delta): When there is any one which an external appearance color is not uniform or an application surface state is not good
X: When external appearance color is not uniform and the state of an applied surface is also not good.
[Table 1]
1: support film
2: solder resist layer
3: release layer
4: base film
5: cover film
Claims (6)
Drying the applied solder resist composition layer; And
Laminating a cover film over the dried solder resist composition layer,
The liquid solder resist composition comprises a crystalline epoxy compound, a phenol compound having a bisphenol S structure, a polymerization initiator, and a solvent,
Drying of the solder resist composition layer is carried out at 90 ~ 120 ℃,
The thickness of the dried solder resist composition layer is 20-40 μm,
Method for producing a solder resist dry film.
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| KR1020120025455A KR20130104179A (en) | 2012-03-13 | 2012-03-13 | Method for preparing a solder resist dry film |
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| KR1020120025455A KR20130104179A (en) | 2012-03-13 | 2012-03-13 | Method for preparing a solder resist dry film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170099831A (en) * | 2016-01-22 | 2017-09-01 | 고오 가가쿠고교 가부시키가이샤 | Dry film layered product |
-
2012
- 2012-03-13 KR KR1020120025455A patent/KR20130104179A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170099831A (en) * | 2016-01-22 | 2017-09-01 | 고오 가가쿠고교 가부시키가이샤 | Dry film layered product |
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