KR20130102999A - Radio frequency identification tag - Google Patents

Radio frequency identification tag Download PDF

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Publication number
KR20130102999A
KR20130102999A KR1020120024268A KR20120024268A KR20130102999A KR 20130102999 A KR20130102999 A KR 20130102999A KR 1020120024268 A KR1020120024268 A KR 1020120024268A KR 20120024268 A KR20120024268 A KR 20120024268A KR 20130102999 A KR20130102999 A KR 20130102999A
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KR
South Korea
Prior art keywords
conductive material
base
conductive
silver
loop
Prior art date
Application number
KR1020120024268A
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Korean (ko)
Inventor
허순영
한승준
이현미
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(주)이그잭스
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Priority to KR1020120024268A priority Critical patent/KR20130102999A/en
Publication of KR20130102999A publication Critical patent/KR20130102999A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07767—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

PURPOSE: A radio frequency identification (RFID) tag is provided to include a loop unit and a dipole unit formed of conductive materials different from each other, thereby implementing a sufficient recognition distance by using a non-precious metal. CONSTITUTION: A dipole unit (130) is arranged on the first surface of a base (110), and is formed of a first conductive material. A loop unit (150) is arranged on the first surface, has a mount area (151) in which a chip (105) is mounted and a closed loop shape with connected with the mount area, and is formed of a second conductive material different from the first conductive material. The dipole unit and the loop unit have the overlapped areas that are mutually overlapped on a plane. The second conductive material includes a conductive material with silver and the first conductive material includes a non-precious metal material.

Description

RFID tag {RADIO FREQUENCY IDENTIFICATION TAG}

The present invention relates to an RFID tag. More specifically, the present invention relates to an RFID tag that can be applied to a radio frequency identification (RFID) technology, which is an identification technology for managing information of various objects such as food, animals, and objects using IC chips and radio waves. It is about.

In general, the RFID tag includes an antenna formed on an insulating sheet and a chip coupled with the antenna. The antenna includes a dipole portion for transmitting and receiving radio waves and generating electromotive force, and a loop portion for mounting the chip to form a closed loop.

The antenna is formed on the insulating sheet through a photolithography process using a noble metal having a relatively high conductivity similar to a general printed circuit board manufacturing method. Thereafter, a chip may be mounted on the loop portion of the antenna. The antenna using the photolithography technique may be formed through a process of forming a photoresist pattern and an etching process using an etchant. Therefore, the process of forming the antenna is complicated, and the economic efficiency is deteriorated by using precious metals, and further, various problems occur by using the etchant.

One object of the present invention is to provide an RFID tag having a relatively simple structure.

Another object of the present invention is to provide an RFID manufacturing process capable of producing an RFID tag through a relatively simple process.

In order to achieve the object of the present invention, the RFID tag according to the embodiments of the present invention is disposed on the base, the upper surface of the first surface, the dipole portion made of the first conductive material, the upper surface of the first surface And a chip mounted on the mounting region, the mounting region in which the chip is mounted, a loop portion connected to the mounting region, a closed loop and made of a second conductive material different from the first conductive material. Here, the dipole portion and the loop portion may have overlapping regions overlapping each other on a plane.

In an embodiment of the present invention, the dipole portion and the loop portion may be formed of different sheets and sequentially stacked on the base.

In an embodiment of the present invention, the second conductive material may include a silver-containing conductive material, and the first conductive material may include a non-noble metal material. Here, the first conductive material may include copper, silver coated copper, aluminum, or conductive carbon.

In an embodiment of the present invention, the second conductive material may include copper, and the first conductive material may include silver, silver coated copper, aluminum, or conductive carbon.

In an embodiment of the present invention, the second conductive material may include silver coated copper, and the first conductive material may include silver, copper, aluminum, or conductive carbon.

In order to achieve another object of the present invention, in the manufacturing method of the RF Adip tag according to the embodiments of the present invention, after forming a dipole portion made of the first conductive material on the first surface of the base, the first A chip is mounted on an upper surface of the surface, and a loop portion connected to the mounting area and closed loops and formed of a second conductive material different from the first conductive material is formed. Subsequently, a chip mounted in the mounting area is mounted. Here, the dipole portion and the loop portion may be formed to have overlapping regions overlapping each other on the same plane of the first surface.

In an embodiment of the present invention, the dipole portion is formed by attaching a first sheet having a first conductive pattern formed thereon to a first surface of the base, and the loop portion having a second conductive pattern formed thereon on the first sheet. It can be formed by attaching a sheet.

In an embodiment of the present invention, the second conductive material may be formed of a silver-containing conductive material, and the first conductive material may be formed of a non-noble metal material.

According to the present invention, a sufficient recognition distance can be realized with a non-noble metal by forming an RFID tag having a loop portion and a dipole portion with different conductive materials. Furthermore, by forming an antenna using a non-noble metal material, it is possible to secure the economics of the RFID tag. In addition, the manufacturing process can be simplified by forming each of the loop portion and the dipole portion by a direct printing process. In addition, when the roof portion and the dipole portion are formed by etching using different metals, the roof portion and the dipole portion should be formed on different bases, respectively, whereas the direct printing process using the different metals as in the present invention. When the roof portion and the dipole portion are formed, the roof portion and the dipole portion may be formed on one base.

1 is a plan view for explaining an RFID tag according to an embodiment of the present invention.
2A and 2B are plan views illustrating the loop part and the dipole part of FIG. 1.
3 is a cross-sectional view for describing an overlapping region of FIG. 1.
4 and 5 are graphs measuring the recognition distances for the RFID tags manufactured in Examples 1 to 6;

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, the embodiments of the present invention are not to be construed as being limited to the specific shapes of the areas described by way of illustration, but rather to include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Are not intended to illustrate the exact shape of the regions and are not intended to limit the scope of the invention.

1 is a plan view for explaining an RFID tag according to an embodiment of the present invention. 2A and 2B are plan views illustrating the loop part and the dipole part of FIG. 1. 3 is a cross-sectional view for describing an overlapping region of FIG. 1.

1 to 3, the RFID tag 100 according to the embodiments of the present invention includes a base 110, a dipole portion 130, a roof portion 150, and a chip 105.

The base 110 may include a heat resistant polymer resin. For example, the base 110 may include an ethylene resin or a polyimide resin.

The dipole portion 130 is disposed on the first surface of the base 110. The length of the dipole portion 130 is determined in proportion to the wavelength of the radio wave provided from the transponder. The smaller the wavelength of the radio wave, the shorter the length of the dipole portion 130. The longer the wavelength of the radio wave, the longer the length of the dipole portion 130. The dipole portion 130 may have a meend shape in order to reduce the area occupied by the first surface of the base 110. Thus, the dipole portion 130 may have a relatively high inductive reactance.

The dipole portion 130 may be made of a first conductive material. For example, the dipole portion 130 may be made of silver, copper, silver coated copper, or conductive carbon.

The roof part 150 is disposed above the first surface of the base 110. The roof part 150 has a mounting area 151 on which the chip 105 is mounted. In addition, the roof part 150 has a closed loop shape connected to the mounting area 151. The loop unit 150 may adjust the inductive reactance of the antenna including the dipole unit 110. For example, the loop unit 150 may change the inductive reactance of the antenna as its size and shape are changed.

The roof part 150 may be formed of a second conductive material different from the first conductive material. For example, when the first conductive material includes silver, the second conductive material may include at least one of copper, silver coated copper, aluminum, and conductive carbon. Alternatively, when the first conductive material includes copper, the second conductive material may include at least one of silver, silver coated copper, aluminum, and conductive carbon.

The chip 105 is mounted in the mounting region 151. The chip 105 may include a power supply circuit for rectifying the radio wave applied through the dipole part 130 and the loop part 150 to use as a driving power source. The power supply circuit may include a schottky series diode and a capacitor. There is a capacitive reactance in the power supply circuit.

In order to transfer the electric wave fed from the antenna including the dipole portion 130 and the loop portion 150 to the power feeding circuit, it is necessary to match the impedance of the antenna with the impedance of the power feeding circuit. When the impedance of the antenna and the power supply circuit are the same, a radio wave received from the antenna may transmit a maximum value to the chip.

In one embodiment of the present invention, the dipole portion 130 and the loop portion 150 may have an overlapping region 155 overlapping each other on the first surface. Radio waves may be more effectively transmitted between the dipole portion 130 and the loop portion 150 through the overlap region 155.

In one embodiment of the present invention, the dipole portion 130 may be printed on the first sheet, while the loop portion 150 may be printed on the second sheet. In this case, the first and second sheets may be sequentially stacked on the first surface. In this case, an adhesive (not shown) may be interposed between the first and second sheets to bond the first and second sheets to each other.

Hereinafter, a process for manufacturing the RFID tag will be described.

First, the base 110 is prepared. The base 110 may be formed of a heat-resistant polymer resin. For example, the base 110 may be formed using an ethylene resin or a polyimide resin. Subsequently, a dipole portion 130 made of the first conductive material is formed on the first surface of the base 110. The dipole portion 130 may be formed of silver, copper, silver coated copper, aluminum, or conductive carbon. When the dipole portion 130 is made of copper, a process of additionally removing the oxide film may be performed due to the tendency of copper to form an oxide film on the surface thereof. In the step of removing the oxide film, a dilute strong acid solution in which a strong acid such as sulfuric acid, nitric acid or hydrochloric acid is diluted with pure water may be used.

Meanwhile, the process for forming the dipole portion 130 may include a direct printing process. Examples of the direct printing process include screen printing, flexo printing, rotary printing, gravure printing, and offset printing. Since the conductive paste used in the direct printing process includes an organic substance, a heat treatment process for removing the organic substance may be performed subsequently.

Subsequently, a roof region 150 is formed on an upper portion of the first surface and a roof region 150 connected to the mounting region and connected to the mounting region to form a closed loop and made of a second conductive material different from the first conductive material. Examples of the second conductive material may be formed of silver, copper, silver coated copper, aluminum, or conductive carbon. For example, when the first conductive material includes silver, the second conductive material may include at least one of copper, silver coated copper, aluminum, and conductive carbon. Alternatively, when the first conductive material includes copper, the second conductive material may include at least one of silver, silver coated copper, aluminum, and conductive carbon.

The chip 105 mounted in the mounting region 135 is mounted. In order to mount the chip 105, an anisotropic conductive paste may be used.

In one embodiment of the present invention, in order to form the dipole portion 130, a first sheet having a first conductive pattern is attached to the first surface of the base 110, and the loop portion 150 In order to form, a second sheet having a second conductive pattern may be attached onto the first sheet. Alternatively, in order to form the loop part 150, a second sheet having a second conductive pattern is first attached to the first surface of the base, and then on the second sheet to form the dipole part 130. An antenna may be formed by attaching a first sheet on which a first conductive pattern is formed.

Example 1

The first preliminary conductive pattern is printed on the base using a flat screen printer using a copper paste as the first conductive material based on a 50 μm thick PET sheet. The first preliminary conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a first conductive pattern on the base. Subsequently, the base on which the first conductive pattern is formed is immersed in a 5% sulfuric acid solution for 1 minute to form a dipole portion. Subsequently, the second conductive pattern is printed onto the base using a flat screen printer using silver paste as the second conductive material. The second conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the silver paste to form a loop part having a closed loop on the base. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Example 2

The first conductive pattern is printed on the base using a flat screen printer using a silver coated copper paste as a first conductive material based on a 50 μm thick PET sheet. The organic material inside the silver-coated copper paste is removed by heat-treating the first conductive pattern including the base at 150 ° C. for 20 minutes to form a dipole portion on the base. Subsequently, the second conductive pattern is printed onto the base using a flat screen printer using silver paste as the second conductive material. The second conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the silver paste to form a loop part having a closed loop on the base. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Example 3

The first conductive pattern is printed on the base using a flat screen printer using a silver paste as a first conductive material based on a 50 μm thick PET sheet. The first conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic material in the silver paste to form a dipole portion on the base. Subsequently, a second preliminary conductive pattern is printed on the base using a flat screen printer using copper paste as the second conductive material. The second conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a second conductive pattern on the base. Subsequently, the base on which the second conductive pattern is formed is immersed in a 5% sulfuric acid solution for 1 minute to form a loop part having a closed loop. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Example 4

The first conductive pattern is printed on the base using a flat screen printer using a silver coated copper paste as a first conductive material based on a 50 μm thick PET sheet. The organic material inside the silver-coated copper paste is removed by heat-treating the first conductive pattern including the base at 150 ° C. for 20 minutes to form a dipole portion on the base. Subsequently, a second preliminary conductive pattern is printed on the base using a flat screen printer using copper paste as the second conductive material. The second conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a second conductive pattern on the base. Subsequently, the base on which the second conductive pattern is formed is immersed in a 5% sulfuric acid solution for 1 minute to form a loop part having a closed loop. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Example 5

The first conductive pattern is printed on the base using a flat screen printer using a conductive carbon paste as a first conductive material based on a 50 μm thick PET sheet. The first conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the conductive carbon paste to form a dipole portion on the base. Subsequently, the second conductive pattern is printed onto the base using a flat screen printer using silver paste as the second conductive material. The second conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic material in the copper paste to form a loop part on the base. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Example 6

The first conductive pattern is printed on the base using a flat screen printer using a conductive carbon paste as a first conductive material based on a 50 μm thick PET sheet. The first conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the conductive carbon paste to form a dipole portion on the base. Subsequently, a second preliminary conductive pattern is printed on the base using a flat screen printer using copper paste as the second conductive material. The second preliminary conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a second conductive pattern on the base. Subsequently, the base on which the second conductive pattern is formed is immersed in a 5% sulfuric acid solution for 1 minute to form a loop part having a closed loop. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Comparative example

The first preliminary conductive pattern is printed on the base using a flat screen printer using a copper paste as the first conductive material based on a 50 μm thick PET sheet. The first preliminary conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a first conductive pattern on the base. Subsequently, the base on which the first conductive pattern is formed is immersed in a 5% sulfuric acid solution for 1 minute to form a dipole portion. Subsequently, a second preliminary conductive pattern is printed on the base using a flat screen printer using copper paste as the second conductive material. The second preliminary conductive pattern including the base is heat-treated in an oven at 150 ° C. for 20 minutes to remove organic materials in the copper paste to form a second conductive pattern on the base. Subsequently, the base on which the first conductive pattern is formed is immersed in 5% sulfuric acid solution for 1 minute to form a loop part. Thereafter, the chip is mounted using an anisotropic conductive paste (ACP) containing nickel powder.

Table 1 shows the recognition distance and total resistance at the frequency of 910Mhz for Examples 1 to 6 and Comparative Examples.

division Roof section Dipole Recognition distance
(@ 910 MHz) Electrical resistance
(Ω) Example 1 silver Copper 6.52 51.2 Example 2 silver Silver coated copper 5.31 110 Example 3 Copper silver 4.50 10.49 Example 4 Copper Silver coated copper 5.31 120 Example 5 silver Conductive carbon 1.17 128 Example 6 Copper Conductive carbon 1.17 130 Comparative example Copper Copper 3.75 47.35

As shown in Table 1, when the dipole portion and the loop portion were formed of the same copper paste according to the comparative example, the recognition distance had a low value of 3.75 m.

Evaluation - Recognition distance measurement -

Recognition distance was measured using the TEMCELL equipment for the RFID tags produced in Examples 1 to 6. The change of the recognition distance according to the change of tag's frequency (including 870Mhz (European Telecommunication Standards Association), 910Mhz (US Federal Communications Commission) and 920Mhz) was also measured.

4 and 5 are graphs of the recognition distance of the RFID tags manufactured in Examples 1 to 6 by using the TEMCELL apparatus.

4 and 5, in Examples 1 to 4, all of the frequency bands of 860 to 960 MHz have a recognition distance of 4.5 m or more, and thus have good characteristics.

Claims (11)

Base;
A dipole portion disposed on the first surface of the base and formed of the first conductive material;
A roof portion disposed on the first surface and connected to the mounting region in which the chip is mounted and connected to the mounting region to form a closed loop and made of a second conductive material different from the first conductive material; And
The RFID tag comprising a chip mounted in the mounting area. The RFID tag of claim 1, wherein the dipole portion and the loop portion have overlapping regions overlapping each other on a plane. The RFID tag of claim 1, wherein the dipole portion and the loop portion are formed of different sheets and sequentially stacked on the base. The RFID tag of claim 1, wherein the second conductive material comprises a silver-containing conductive material, and the first conductive material comprises a non-noble metal material. 5. The RFID tag of claim 4, wherein the first conductive material comprises copper, silver coated copper, aluminum, or conductive carbon. The RFID tag of claim 1, wherein the second conductive material comprises copper and the first conductive material comprises silver, silver coated copper, aluminum, or conductive carbon. The RFID tag of claim 1, wherein the second conductive material comprises silver coated copper and the first conductive material comprises silver, copper, aluminum, or conductive carbon. Forming a dipole portion made of the first conductive material on the first surface of the base;
Forming a roof region on which the chip is mounted and a loop portion which is connected to the mounting region and forms a closed loop and is formed of a second conductive material different from the first conductive material;
And manufacturing a chip mounted in the mounting area. The method of claim 8, wherein the dipole portion and the loop portion are formed to have overlapping regions overlapping each other on the same plane of the first surface. The method of claim 8, wherein the forming of the dipole portion includes attaching a first sheet having a first conductive pattern to the first surface of the base.
The forming of the loop part may include attaching a second sheet on which the second conductive pattern is formed on the first sheet. The method of claim 8, wherein the second conductive material is formed of a silver-containing conductive material, and the first conductive material is formed of a non-noble metal material.
KR1020120024268A 2012-03-09 2012-03-09 Radio frequency identification tag KR20130102999A (en)

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