KR20130099194A - Target and target production method - Google Patents

Abstract

The target C has backing plates 104 and 214 having first major surfaces 104a and 214a and second major surfaces 104b and 214b positioned opposite to the first major surfaces 104a and 214a. ); A first base material 105 disposed on the first main surfaces 104a and 214a; And a second base material 106 disposed on the second main surfaces 104b and 214b.

Description

Target and target production method

The present invention relates to a target used for film formation by the sputtering method and a method for producing the target.

This application claims priority based on Japanese Patent Application No. 2011-088275 for which it applied on April 12, 2011, and uses the content here.

Sputtering apparatuses are used as devices for forming various thin films in the field of semiconductor devices or flat panel displays (FPD).

In a general sputtering apparatus, a sputtering cathode is provided in a chamber, and an object to be processed is disposed so as to face a target mounted on the cathode at a predetermined interval in the chamber under reduced pressure.

Next, an inert gas (for example, argon gas) is introduced into the chamber, a negative voltage is applied to the target to discharge it, and the inert gas ionized by the discharge is collided with the target.

And the film-forming process is performed by adhering the particle which protrudes from a target to a to-be-processed object.

4A illustrates an example of a conventional film forming apparatus 600 using the sputtering method (see Patent Document 1).

FIG. 4B is an enlarged view showing the member C disposed in the vicinity of the target in each of the plurality of chambers 601 of FIG. 4A (see Patent Document 2).

As shown in FIG. 4B, the target is composed of a backing plate 604 and a base material 605 disposed on the surface of the backing plate 604. The cathode body 610 that applies the sputtering voltage to the target is mounted to the target using a plurality of bolt members.

And the cathode main body 610 is attached to the cathode mounting flange 611 arrange | positioned in the chamber 601 using the some bolt member through the insulating plate 612. As shown in FIG.

Inside the backing plate 604, a magnetic field generating unit H for generating leakage magnetic flux on the surface of the base material 605 is provided.

Moreover, inside the backing plate 604, the circulation flow path comprised from the flow path 608a which coolant is introduce | transduced in order to cool a target, and the flow path 608b which coolant is led out is provided.

The backing plate 604 and the cathode body 610 are covered by the ground shield 601a. The ground shield 601a is formed with an opening for exposing the target to a space in the chamber (film formation space).

The ground shield 601a suppresses discharge generated by members other than the target among members facing the film formation space, and is usually attached to the chamber (wall portion) 601 using a plurality of bolt members.

By the way, since the base material used for sputtering is consumed according to the throughput of sputtering (for example, the number of substrates to be processed), it is necessary to regularly exchange the used base material and the base material before use.

The work of exchanging the base material is carried out together with the backing plate, and the work of separating and mounting is performed for each target.

Therefore, when replacing a base material, it is necessary to make atmospheric pressure inside a chamber.

Thereby, the operation | movement which returns the pressure in a chamber to the pressure (vacuum) which can perform a film-forming process again by exhausting the gas in a chamber after replacing a target is made. The film forming process cannot be performed until the operation is completed.

Patent Document 1: Japanese Patent Application Laid-Open No. 2009-280834 Patent Document 2: Japanese Patent Application Laid-Open No. 2003-328119

The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a target capable of reducing the number of times of exchanging the base metal and the base material before use according to the sputtering process and increasing the service life of the target.

In addition, the present invention provides a method for producing a target capable of joining a base material to the backing plate such that the surface of the base material is flat on each of the two main surfaces of the backing plate individually using an adhesive member. do.

A target of a first aspect of the present invention includes a backing plate having a first main surface and a second main surface positioned opposite to the first main surface; A first base material disposed on the first main surface; And a second base material disposed on the second main surface.

In the target of the 1st aspect of this invention, it is provided in the inside of the said backing plate, is formed in the position close to the said 1st main surface or the said 2nd main surface, and includes the circulation flow path which coolant flows, The said backing plate is a It is preferable that it is formed from a single plate.

In the target of the 1st aspect of this invention, it is provided in the inside of the said backing plate, is formed in the position close to the 1st main surface which is the outermost surface of the said backing plate, and the circulation flow path which coolant flows, and inside the said backing plate. It is preferable that the backing plate is formed at a position close to the second main surface, which is the outermost surface of the backing plate, and includes a circulation passage through which the coolant flows, and the backing plate is formed of a plywood in which a plurality of plate bodies are joined.

In the target of the first aspect of the present invention, the backing plate has a first side surface, a second side surface positioned opposite to the first main surface, and the backing plate facing the second side surface from the first side surface. It is preferable that a power supply line having a rotating shaft penetrating therein is provided inside the rotating shaft for supplying electric power used for sputtering.

In the target of the 1st aspect of this invention, it is preferable that the said backing plate has the 3rd side surface different from the said 1st side surface and the said 2nd side surface, and the said anti-corrosion plate is arrange | positioned through an insulating member in the said 3rd side surface. .

In the target of the 1st aspect of this invention, it is preferable that the said 1st main surface and the said 1st base material of the said backing plate are joined through the adhesive member. It is preferable that the said 2nd main surface and the said 2nd base material of the said backing plate are joined through the adhesive member. It is preferable that the said 1st main surface of the said backing plate and said 1st base material are joined through an adhesive member, and the said 2nd main surface of the said backing plate and said 2nd base material are bonded through an adhesive member. Do.

In the target of the 1st aspect of this invention, it is preferable that the said 1st main surface and the said 1st base material of the said backing plate are fixed by the clamp. It is preferable that the said 2nd main surface and the said 2nd base material of the said backing plate are fixed by the clamp. It is preferable that the first main surface and the first base material of the backing plate are fixed by a clamp, and the second main surface and the second base material of the backing plate are fixed by a clamp.

The manufacturing method of the target of the 2nd aspect of this invention joined the 1st base material to the 1st main surface of a backing plate via the 1st adhesive member, and was bent when the said 1st base material and said 1st main surface were joined. The surface of the backing plate is shaped to have a flat shape, and the second base material is joined to the second main surface of the backing plate via a second adhesive member, and the second base material and the second main surface are bent when joined. The backing plate is shaped to have a flat surface.

In the target which concerns on this invention, the base material used for sputtering is arrange | positioned on each of the two main surfaces of a backing plate.

Therefore, after performing a sputtering process using the 1st base material arrange | positioned on a 1st main surface in a chamber, a target can be reversed and a sputtering process can be performed using the 2nd base material arrange | positioned on a 2nd main surface.

Therefore, when the second base material is made of the same material as the first base material, the use period per target can be increased as compared with the case of using the base material disposed on only one main surface of the backing plate as in the prior art.

Thereby, the frequency | count of replacement of a base material can be reduced, and the operation | work or cost which arises by exchange can be reduced.

Moreover, when each of a 1st base material and a 2nd base material is comprised from the material which forms the lower layer and the upper layer of the laminated film formed on a to-be-processed substrate, two film-forming processes can be performed continuously using only one target.

The gas in the chamber that is performed between the film forming step (first film forming step) using the first base material and the film forming step (second film forming step) using the second base material by performing two successive film forming processes in the same chamber. The work (process), such as the process of evacuating and conveyance of a to-be-processed board | substrate, becomes unnecessary, and the time required for such a work (process) can be shortened.

Moreover, in the manufacturing method of the target which concerns on this invention, after joining a base material to the 1st main surface or the 2nd main surface of a backing plate, the backing plate which bend | folded by joining is shape | molded so that it may become a flat shape.

Therefore, it is possible to produce a target in which a base material having a flat surface shape is bonded to each of the two main surfaces of the backing plate.

1: A is sectional drawing which shows the film-forming apparatus provided with the target of 1st Embodiment of this invention.
1B is a perspective view showing a target of the first embodiment of the present invention connected to a control unit.
1C is a diagram showing a target of the first embodiment of the present invention, which is a cross-sectional view corresponding to a plane perpendicular to the rotation axis.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
It is process drawing which shows the manufacturing method of the target of 1st Embodiment of this invention.
FIG. 3 is a diagram showing a target of the second embodiment of the present invention, which is a cross-sectional view corresponding to a plane perpendicular to the rotation axis.
4A is a cross-sectional view showing a film forming apparatus having a target according to the prior art.
4B is a cross-sectional view corresponding to a plane perpendicular to the longitudinal direction of the target according to the prior art.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings based on suitable embodiment. In addition, in each figure, each component is made into the magnitude which can be recognized on drawing, and the dimension and ratio of each component are suitably different from an actual thing.

First Embodiment

1A is a film forming apparatus 100 used for sputtering with a target according to the first embodiment of the present invention, a control unit E, a grounding unit G, a magnetic field generating unit H, and an exhaust unit It is a figure explaining the structure of P).

The film forming apparatus 100 has a chamber 101, a target C disposed inside the chamber 101, and a support 103 disposed at a position opposite to the target C. As shown in FIG. The support 103 supports the substrate to be processed 102.

1B is a perspective view of a target of the first embodiment of the present invention.

FIG. 1C is a diagram showing a target of the first embodiment of the present invention shown in FIG. 1B, which is a cross-sectional view corresponding to a plane perpendicular to the longitudinal direction L. FIG.

The target C is comprised by the backing plate 104, the 1st base material 105, the 2nd base material 106, and the adhesion plate 109. As shown in FIG. The backing plate 104 is formed in a flat shape and has a first main surface 104a (one main surface) and a second main surface 104b (the other main surface). The 1st base material 105 is arrange | positioned at the 1st main surface 104a. The 2nd base material 106 is arrange | positioned at the 2nd main surface 104b. The adhesion plate 109 is arrange | positioned at the side surface 113 (3rd side surface) parallel to the longitudinal direction L of a backing plate.

The backing plate 104 is a rotating shaft 107 penetrating the backing plate 104 from the first side 111 (one side) of the backing plate 104 to the second side 112 (the other side). )

In the backing plate 104, a circulation flow path 108a which is formed at a position (nearby) near the first main surface 104a or the second main surface 104b of the backing plate 104 and flows cooling water (refrigerant) and 108b) (the 1st circulation flow path and the 2nd circulation flow path) are provided.

As a material which comprises the backing plate 104, the material which has high electroconductivity, thermal conductivity, and low gas release property is preferable, and copper or stainless is mainly used.

As the 1st base material 105 and the 2nd base material 106, the material of the film | membrane formed in a to-be-processed substrate, such as a metal or an insulator, is used. Moreover, the 1st base material 105 and the 2nd base material 106 may be comprised from the same material, and may be comprised from different materials.

Cooling water (refrigerant) flowing through the circulation flow paths 108a and 108b cools the first base material 105 and the second base material 106 during the sputtering process.

Cooling water is introduced from one of the circulation flow paths 108a and 108b and derived from the other.

The rotating shaft 107 is connected to the control unit E provided outside the target C, and rotates using the control unit E. FIG.

Then, the target C is rotated in conjunction with the rotation of the rotation shaft 107.

In order to realize stable rotation, it is preferable that the rotating shaft penetrates to coincide with the center of the backing plate 104.

Further, inside the rotating shaft 107, a power supply line for applying a sputtering voltage to the backing plate 104, and a line for supplying and discharging cooling water flowing through the circulation flow paths 108a and 108b are provided.

The adhesion plate 109 provided in the 3rd side surface 113 parallel to the longitudinal direction L of the backing plate 104 prevents the particle which generate | occur | produced during the sputtering process from returning to the side surface of a backing plate.

In addition, an insulation member 109a is disposed between the barrier plate 109 and the backing plate 104, and the insulation member 109a is responsible for damage to the barrier plate 109 depending on the voltage supplied at the time of sputtering. Prevent.

In the target of 1st Embodiment of this invention, the base material used for sputtering is arrange | positioned at each of two main surfaces of a backing plate.

Therefore, after performing sputtering process using the 1st base material 105 arrange | positioned at the 1st main surface 104a in a chamber, the target is reversed and the 2nd base material 106 arrange | positioned at the 2nd main surface 104b is performed. ) Can be used for sputtering.

Therefore, when the second base material 106 is made of the same material as the first base material 105, it is possible to increase the service life per target compared to the case of using a base material disposed only on one main surface of the backing plate as in the prior art. .

Thereby, the frequency | count of replacement of a base material can be reduced, and the operation | work or cost which arises by exchange can be reduced.

In addition, when each of the 1st base material 105 and the 2nd base material 106 is comprised from the material which forms the lower layer and the upper layer of the laminated film formed on the to-be-processed substrate 102, two film-forming is formed using only one target. The process can be performed continuously.

Then, by performing two successive film forming processes in the same chamber, a step of evacuating the gas in the chamber performed between the film forming process by the first base material 105 and the film forming process by the second base material 106 and avoiding The work (process), such as conveyance of a process board | substrate, becomes unnecessary, and the time required for such a job (process) can be shortened.

In addition, by performing two kinds of film forming steps in the same chamber, the space for installing the chambers required for the film forming step can be reduced as compared with the conventional art using a different chamber for each film forming step.

<1st embodiment of the manufacturing method of a target>

The manufacturing method of the target provided with the structure of said 1st Embodiment is demonstrated using process drawing shown in FIG. 2A-FIG. 2F.

First, in the first process shown in FIG. 2A, the first base material 105 is disposed to face the first main surface 104a of the backing plate 104, and the second base material 106 is placed on the backing plate 104. Disposed so as to face the second main surface 104b.

Next, in the second step shown in FIG. 2B, the first base member 105 is bonded to the first main surface 104a of the backing plate 104 using a first adhesive member (not shown).

More specifically, the first adhesive member is applied to the first main surface 104a of the backing plate 104 forming the joining surface, and the backing plate 104 and the first adhesive member are heated to a temperature higher than the melting point to melt. Let's do it.

And the 1st base material 105 is arrange | positioned on the melted 1st adhesion member, and it cools to room temperature in the state which the fusion | melting 1st adhesion member inserted between the 1st base material 105 and the backing plate 104.

As a 1st adhesive member used at this process, it is preferable that it is a low melting metal, and indium is used, for example.

In the 2nd process, the backing plate 104 and the 1st base material 105 are cooled to room temperature in the state joined and joined by the high temperature state.

And the backing plate 104 is compressed with cooling.

At this time, since the first base material 105 is bonded only to the first main surface 104a, the compressibility of the backing plate 104 on the first main surface 104a and the backing on the second main surface 104b are used. The compression rate of the plate 104 is different.

Accordingly, the backing plate 104 has a shape in which the backing plate 104 is bent in a convex shape on the first main surface 104a or the second main surface 104b.

In FIG. 2B, an example is shown in which the backing plate 104 has a convex curvature on the first main surface 104a. However, depending on the combination of the materials constituting the backing plate 104 and the first base material 105, the second main surface is shown. Convex curvature may arise in the surface 104b.

Next, in the third process shown in FIG. 2C, the bent backing plate 104 formed by joining the first base material 105 and the backing plate 104 is shaped to have a flat shape.

The method of shaping the backing plate 104 is not limited to a specific method, but in the present embodiment, pressure is applied to the second main surface 104b of the backing plate 104 in a direction opposite to the direction in which bending occurs to mechanically. Use the method of calibration.

Next, in the fourth step shown in FIG. 2D, the second base member 106 is bonded to the second main surface 104b of the backing plate 104 using a second adhesive member (not shown).

More specifically, a second adhesive member is applied to the second main surface 104b of the backing plate 104 forming the joining surface, and the backing plate 104 and the second adhesive member are heated to a temperature above the melting point to be melted. Let's do it.

And the 2nd base material 106 is arrange | positioned on the melted 2nd adhesive member, and it cools to room temperature in the state which the melted 2nd adhesive member sandwiched between the 2nd base material 106 and the backing plate 104.

It is preferable that it is a low melting metal as a 2nd adhesive member used at this process, For example, indium is used.

In the 4th process, the backing plate 104 and the 2nd base material 106 are joined by high temperature state, and are cooled to room temperature in the joined state.

And the backing plate 104 is compressed with cooling.

At this time, since the first base material 105 is bonded to the first main surface 104a, and the second base material 106 is bonded to the second main surface 104b, the first main surface 104a is bonded to the first main surface 104a. The compression rate of the backing plate 104 and the compression rate of the backing plate 104 at the second main surface 104b are different.

Accordingly, the backing plate 104 has a shape in which the backing plate 104 is bent in a convex shape on the first main surface 104a or the second main surface 104b.

Therefore, in the fifth process shown in FIG. 2E, the bent backing plate 104 is formed to have a flat shape by joining the second base material 106 and the backing plate 104.

Although the method of shaping the backing plate 104 is not limited to a specific method, in this embodiment, the method of applying mechanical pressure by applying pressure in the direction opposite to the direction in which curvature arises with respect to the backing plate 104 is used.

And in the 6th process shown in FIG. 2F, the adhesion board 109 is used for the side surface 113 parallel to the longitudinal direction L of the backing plate 104 using an insulating adhesive member (insulating member) 109a. The target of 1st Embodiment is formed by joining.

Here, although the example which joined the backing plate 104 in the order of the 1st base material 105 and the 2nd base material 106 was shown, you may reverse the order of joining, or it may be made on both sides of the backing plate 104. The method of mechanically calibrating after bonding together the 1st base material 105 and the 2nd base material 106 may be sufficient.

2A to 2F are also applicable to the second embodiment described later.

According to the manufacturing method of the target of 1st Embodiment of the said invention, it is not necessary to provide a fixed area | region in a base material like the case where a base material is fixed to a backing plate using fixing members, such as a bolt or a clamp.

Therefore, the whole area | region of the 1st base material 105 and the 2nd base material 106 arrange | positioned at each main surface of the backing plate 104 can be used for sputtering.

Moreover, in the manufacturing method of the target of 1st Embodiment of this invention, after joining a base material to the 1st main surface 104a or the 2nd main surface 104b of a backing plate, the backing plate bent by joining is flat shape. Form to be.

Therefore, it is possible to produce a target in which a base material having a shape having a flat surface is bonded to each of the two main surfaces of the backing plate.

Thereby, since a base material and a to-be-processed board | substrate are arrange | positioned in parallel, sputtering particles which protrude from a base material can be uniformly adhere | attached in the process surface of a to-be-processed substrate, and can form into a film.

In addition, in FIG.2A-2F, the method of joining the 1st base material 105 and the 2nd base material 106 to each main surface of the backing plate 104 using the adhesive member was shown as an example. As another example, there is also a method of fixing the first base material 105 and the second base material 106 to the respective main surfaces of the backing plate 104 using fixing members such as bolts or clamps.

In the case of using a fixing member such as a bolt or a clamp, warping due to the difference in thermal expansion rate between the first base material 105 and the backing plate or the difference in thermal expansion rate between the second base material 106 and the backing plate does not occur.

Therefore, the process corresponding to the said 2nd process and the 4th process is unnecessary, and a target can be manufactured by a more simplified process.

&Lt; Second Embodiment >

FIG. 3 is a diagram showing a target of the second embodiment of the present invention, which is a cross-sectional view corresponding to a plane perpendicular to the rotation axis.

While the backing plate 104 of the first embodiment was formed of a single plate, the backing plate 214 of the second embodiment is a plywood in which two plates (backing plates) 204 and 211 are stacked. It consists of.

Inside the backing plate 214, the circulation flow paths 208a and 208b are formed at positions close to the first main surface 214a, which is the outermost surface of the backing plate, and the coolant flows, and the second main, which is the outermost surface of the backing plate. The circulation flow paths 213a and 213b which are formed at a position close to the surface 214b and flow the cooling water are provided.

In 2nd Embodiment, the other structure in a target is the same as that of 1st Embodiment. In FIG. 3, the same code | symbol is attached | subjected to the same member as 1st Embodiment, and the description is abbreviate | omitted or simplified.

In the structure of 1st Embodiment, the circulation flow paths 108a and 108b of cooling water are formed in the backing plate 104 in the position near one of the 1st main surface 104a and the 2nd main surface 104b. .

On the other hand, in the structure of 2nd Embodiment, the circulation flow paths 208a and 208b of cooling water are formed in the backing plate 214 at the position near both the 1st main surface 214a and the 2nd main surface 214b. have.

Therefore, according to the structure of 2nd Embodiment, the target which has a high cooling function which cools both the 1st base material 205 and the 2nd base material 212 can be obtained.

In the target of 2nd Embodiment of this invention, the base material used for sputtering is arrange | positioned at each of the two main surfaces which are outermost surfaces of a backing plate.

Therefore, after performing sputtering process using the 1st base material 205 arrange | positioned at the 1st main surface 214a in a chamber, the target is reversed and the 2nd base material 212 arrange | positioned at the 2nd main surface 214b is carried out. ) Can be used for sputtering.

Therefore, when the second base material 212 is made of the same material as the first base material 205, it is possible to increase the service life per target compared to the case of using a base material disposed only on one main surface of the backing plate as in the prior art. .

Thereby, the frequency | count of replacement of a base material can be reduced, and the operation | work or cost which arises by exchange can be reduced.

In addition, when each of the 1st base material 205 and the 2nd base material 212 is comprised from the material which forms the lower layer and the upper layer of the laminated film formed on a to-be-processed board | substrate, two film-forming processes are continued using only one target. This can be done.

Then, by performing two successive film forming processes in the same chamber, a step of evacuating the chamber and the substrate to be processed between the film forming process by the first base material 205 and the film forming process by the second base material 212. The work (process), such as conveyance, is unnecessary, and the time required for such work (process) can be shortened.

In addition, by performing two kinds of film forming steps in the same chamber, the space for installing the chambers required for the film forming step can be reduced as compared with the conventional art using a different chamber for each film forming step.

<2nd embodiment of the manufacturing method of a target>

The manufacturing method of the target provided with the structure of said 2nd Embodiment is demonstrated.

First, a manufacturing method is demonstrated.

First, in a 1st process, the 1st base material 205 is bonded to the 1st main surface 204a of the backing plate 204 using a 1st adhesive member.

More specifically, the first adhesive member is applied to the first main surface 204a of the backing plate 204 forming the joining surface, and the backing plate 204 and the first adhesive member are heated to a temperature equal to or higher than the melting point to be melted. Let's do it.

And the 1st base material 205 is arrange | positioned on the melted 1st adhesion member, and it cools to room temperature in the state which the fusion | melting 1st adhesion member inserted between the 1st base material 205 and the backing plate 204.

As a 1st adhesive member used at this process, it is preferable that it is a low melting metal, and indium is used, for example.

In the 1st process, the backing plate 204 and the 1st base material 205 are joined by high temperature state, and are cooled to room temperature in the joined state.

And the backing plate 204 is compressed with cooling.

At this time, since the first base material 205 is bonded only to the first main surface 204a, the compressibility of the backing plate 204 on the first main surface 204a and the backing on the second main surface 204b are maintained. The compression rate of the plate 204 is different.

Accordingly, the backing plate 204 has a shape in which a warp occurs in a convex shape on the first main surface 204a or the second main surface 204b.

Next, in the second step, the backing plate 204 that is bent by joining the first base material 205 and the backing plate 204 is shaped to have a flat shape.

Although the method of shaping the backing plate 204 is not limited to a specific method, in this embodiment, the method of applying mechanical pressure by applying pressure in the direction opposite to the direction in which curvature arises with respect to the backing plate 204 is used.

Next, in the third step, the second base member 212 is bonded to the first main surface 211a of the backing plate 211 using the second adhesive member.

More specifically, a second adhesive member is applied to the first main surface 211a of the backing plate 211 forming the bonding surface, and the backing plate 211 and the second adhesive member are heated to a temperature equal to or higher than the melting point to be melted. Let's do it.

And the 2nd base material 212 is arrange | positioned on the melted 2nd adhesive member, and it cools to room temperature in the state which the melted 2nd adhesive member sandwiched between the 2nd base material 212 and the backing plate 211.

It is preferable that it is a low melting metal as a 2nd adhesive member used at this process, For example, indium is used.

Next, in the fourth step, the backing plate 211 bent by bonding the backing plate 211 and the second base material 212 is shaped to have a flat shape.

Although the method of shaping the backing plate 211 is not limited to a specific method, in this embodiment, a method of applying mechanical pressure by applying pressure in a direction opposite to the direction in which warping occurs in the backing plate 211 is used.

Next, in the fifth process, the backing plate 204 and the backing plate 211 so that the second main surface 204b of the backing plate 204 and the second main surface 211b of the backing plate 211 face each other. Integrate.

As a method of integrating two backing plates, the method of arrange | positioning an adhesive member between the main surface 204b and the main surface 211b, for example, and joining two plates is mentioned. Alternatively, there is a method of fixing the two plates by bolts or clamps in a state where the main surface 204b and the main surface 211b overlap with each other.

Next, in the sixth step, the adhesion plate 209 is bonded to the side surface 113 (third side surface) parallel to the longitudinal direction of the backing plate 214 using an insulating adhesive member (insulating member) 209a. The target of 2nd Embodiment is formed by this.

In addition, a 1st process-a 2nd process, and a 3rd process-a 4th process may be reversed, and may be performed simultaneously.

In addition, the target of 2nd Embodiment forms the backing plate 214 previously by overlapping two board | plate 204 and 211, and after that, it mentioned above like the backing plate 104 in 1st Embodiment. It also forms by using 1st Embodiment of the manufacturing method of a target.

According to the manufacturing method of the target of 2nd Embodiment of the said invention, it is not necessary to provide a fixed area | region in a base material like the case where a base material is fixed to a backing plate using fixing members, such as a bolt or a clamp.

Therefore, the whole area | region of the 1st base material 205 and the 2nd base material 212 arrange | positioned at each main surface of the backing plate 214 can be used for sputtering.

Moreover, in the manufacturing method of the target of 2nd Embodiment of this invention, after joining a base material to the 1st main surface 214a or the 2nd main surface 214b of a backing plate, the backing plate bent by joining is flat shape. Form to be.

Therefore, it is possible to produce a target in which a base material having a shape having a flat surface is bonded to each of the two main surfaces of the backing plate.

Thereby, since a base material and a to-be-processed board | substrate are arrange | positioned in parallel, sputtering particles which protrude from a base material can be uniformly adhere | attached in the process surface of a to-be-processed substrate, and can form into a film.

INDUSTRIAL APPLICABILITY The present invention can be widely applied to a case where a film forming step by a sputtering method is performed on a workpiece.

104... Backing plate, 104a, 104b, 214a, 214b... Main plane, 105... First substrate, 106. Second base material, 107, 207... Rotation axis 108a, 108b... Circulating flow path, 109... Barrier plate, 109a... Insulation member, C... target.

Claims (12)

As a target,
A backing plate having a first main surface and a second main surface positioned opposite to the first main surface;
A first base material disposed on the first main surface;
And a second base material disposed on the second main surface. The method according to claim 1,
It is installed in the backing plate, and formed in a position close to the first main surface or the second main surface and includes a circulation flow path for the cooling water flow,
The backing plate is a target, characterized in that formed of a single plate. The method according to claim 1,
A circulation flow path installed inside the backing plate and formed at a position close to the first main surface, which is the outermost surface of the backing plate, to allow cooling water to flow;
A circulation flow path installed inside the backing plate and formed at a position close to the second main surface, which is the outermost surface of the backing plate, to allow the coolant to flow;
The backing plate is a target, characterized in that formed of plywood bonded to a plurality of plate bodies. 4. The method according to any one of claims 1 to 3,
The backing plate has a first side surface, a second side surface positioned opposite to the first main surface, and a rotation axis passing through the backing plate from the first side toward the second side surface,
And a power supply line for supplying power for sputtering is provided inside the rotating shaft. 5. The method according to any one of claims 1 to 4,
The backing plate has a third side surface different from the first side surface and the second side surface, and a target plate is disposed on the third side surface via an insulating member. 6. The method according to any one of claims 1 to 5,
The first main surface of the backing plate and the first base material are bonded to each other via an adhesive member. 6. The method according to any one of claims 1 to 5,
The second main surface of the backing plate and the second base material are bonded to each other via an adhesive member. 6. The method according to any one of claims 1 to 5,
The first main surface of the backing plate and the first base material are joined via an adhesive member, and the second main surface of the backing plate and the second base material are joined via an adhesive member. Target to be. 6. The method according to any one of claims 1 to 5,
The first main surface and the first base material of the backing plate are fixed by a clamp. 6. The method according to any one of claims 1 to 5,
The second main surface and the second base material of the backing plate are fixed by a clamp. 6. The method according to any one of claims 1 to 5,
The first main surface and the first base material of the backing plate are fixed by a clamp, and the second main surface and the second base material of the backing plate are fixed by a clamp. As a manufacturing method of a target,
Joining the first base material to the first main surface of the backing plate through the first adhesive member,
When the first base material and the first main surface are joined to each other, the curved backing plate is shaped to have a flat shape.
Joining the second base material to the second main surface of the backing plate via the second adhesive member,
A method for producing a target, wherein the backing plate is curved to have a flat shape when the second base material and the second main surface are joined to each other.

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