KR20130098715A - Supporter manufacturing method of jig for semiconductor - Google Patents

Supporter manufacturing method of jig for semiconductor Download PDF

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Publication number
KR20130098715A
KR20130098715A KR1020120020449A KR20120020449A KR20130098715A KR 20130098715 A KR20130098715 A KR 20130098715A KR 1020120020449 A KR1020120020449 A KR 1020120020449A KR 20120020449 A KR20120020449 A KR 20120020449A KR 20130098715 A KR20130098715 A KR 20130098715A
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KR
South Korea
Prior art keywords
supporter
manufacturing
fixing jig
molding
powder metallurgy
Prior art date
Application number
KR1020120020449A
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Korean (ko)
Inventor
송영호
이용호
Original Assignee
선진분말야금 주식회사
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Application filed by 선진분말야금 주식회사 filed Critical 선진분말야금 주식회사
Priority to KR1020120020449A priority Critical patent/KR20130098715A/en
Publication of KR20130098715A publication Critical patent/KR20130098715A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/12—Forming parts of complementary shape, e.g. punch-and-die
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H2200/00—Specific machining processes or workpieces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Powder Metallurgy (AREA)

Abstract

PURPOSE: A manufacturing method of a supporter for a semiconductor device fixing jig is provided to enable a mass production from being possible by processing a part in which a precision degree of a size is required with a wire cut electric spark process after a molded object including the shape of the supporter is manufactured. CONSTITUTION: A manufacturing method of a supporter for a semiconductor device fixing jig comprises as follows. A molded object (100) is manufactured with powder metallurgy corresponding to the shape of the supporter (S100). A part in which a precision degree of a size is required is processed in wire cut electric processing on the molded object manufactured through a powder metallurgy molding process (S200). [Reference numerals] (AA) Start; (BB) End; (S110) Mixing step; (S120) Compressing step; (S130) Sintering step; (S140) Correcting step; (S200) Wire cut electric discharge processing step

Description

SUPPORTER MANUFACTURING METHOD OF JIG FOR SEMICONDUCTOR}

The present invention relates to a method for manufacturing a supporter for a semiconductor device fixing jig, and more particularly, to manufacture a molded article having the shape of a supporter from powder metallurgy, and to perform wire cut electric discharge machining only on the part where the dimensional precision is required for the manufactured molded article. The present invention relates to a supporter manufacturing method of a semiconductor device fixing jig that lowers manufacturing costs and enables mass production.

In general, a semiconductor device is implemented by depositing and patterning various materials on a wafer, which is a substrate, in a thin film form. For this purpose, different processes in various stages such as a deposition process, an etching process, a cleaning process, and a drying process are required.

The semiconductor devices manufactured through the above-described steps may be individually transported for the next process, but this may lead to a decrease in production efficiency and an increase in manufacturing costs due to the individual transportation of the semiconductor devices, and thus a large number of jigs having a certain frame. It is common for the semiconductor device to be transported in a placed state.

1 is a perspective view showing a semiconductor device fixing jig. Referring to the drawings, the semiconductor device fixing jig 10 is formed of a thin plate having a substantially rectangular shape. In addition, a plurality of settling grooves 12 are arranged on an upper surface of the fixing jig 10 so that a semiconductor device is placed in the settling groove 12.

At this time, the supporter 20 for preventing the semiconductor device enclosed in the settled groove 12 is separated from the side surface is provided on all sides of the settling groove 12. At this time, the projection 14 is formed around the settle groove 12 so that the supporter 20 can be stably fixed to all four sides of the settling groove 12, the coupling groove (fitting to the projection 14 ( 22 is formed in the supporter 20.

In this way, the supporter 20 installed in the semiconductor element fixing jig 10 requires high dimensional accuracy, so that it is produced by wire cut discharge processing. In particular, one side surface on which the coupling groove 22 of the supporter 20 is formed must be precisely processed because it is in surface contact with the semiconductor device.

In other words, wire cut electric discharge machining is a process in which a wire having an diameter of 0.05 to 0.33 mm made of copper and brass, which are nonferrous metals, is cut into a desired shape by causing an electrical discharge between workpieces.

In order to manufacture the supporter 20 by the wire cut electric discharge machining, as shown in FIGS. 2 and 3, the plate P having a predetermined thickness is fixed to a work table (not shown) of the wire cut electric discharge machining apparatus. The wire W is moved to one side of P to cause discharge. In this case, the wire W moves along the shape of the supporter 20 in the form of a line drawing and cuts the plate P to manufacture the supporter 20.

However, when the supporter 20 is manufactured by the wire cut discharge process as described above, the processing time takes longer because the wire W moves to the same trajectory as the dotted line shown in the drawing and the plate P needs to be cut. However, since the burden of the processing cost according to the wire cut discharge processing is higher than other processing, the manufacturing cost of the supporter 20 is eventually increased.

In particular, the dimensional accuracy of the supporter 20 is sufficient on one side where the coupling groove 22 of the supporter 20 is formed, but as described above, when the wire P is cut in the form of a line drawing when the plate P is cut. Since the plate P is moved and is cut, processing is performed to have dimensional accuracy more than necessary throughout the supporter 20 except for one side on which the coupling groove 22 is formed, thereby increasing the processing time and making it difficult to mass produce the supporter 20. There is this.

The present invention is to solve the above problems, to provide a supporter manufacturing method of a semiconductor device fixing jig to enable the mass production and to lower the manufacturing cost in manufacturing a supporter installed in the fixing jig in which the semiconductor device is placed. The purpose is.

In the technical idea of the present invention for achieving the above object, in the manufacture of the supporter is installed in the fixed jig in which the semiconductor device is placed, powder metallurgy forming step of manufacturing a molding with powder metallurgy in accordance with the shape of the supporter And a wire cut electric discharge machining step of processing a part requiring dimensional precision with respect to a molded product manufactured through the powder metallurgy forming step by wire cut electric discharge machining. .

Here, the powder metallurgy forming step is a mixing step of uniformly mixing the metal powder according to the customer's desired composition, and a compression step of injecting the powder is completed in the mold and pressing the press to produce a molding, and the compressed It is preferable to include a sintering step in which the molding is introduced into a furnace at a temperature below the melting point and heated, and a calibration step of satisfying the dimensional accuracy throughout the molding after the sintering step or pressing with a press to increase the density of the molding.

In addition, the molded article produced through the powder metallurgy forming step, the body forming a rectangular shape having an area covering a pair of protrusions provided around the settle groove formed in the fixing jig, and formed on the body, the long side of the body It is preferable that a part of the arc is made of a coupling groove fitted to the protrusion provided on the fixing jig and a gushing portion formed integrally with the long side on the opposite side of the coupling groove.

In the wire-cut discharge machining step, it is preferable to cut the extremity formed in the molded product manufactured from the powder metallurgy molding step in the long side direction.

The supporter manufacturing method of the semiconductor device fixing jig according to the present invention is to produce a molded article having a shape corresponding to the shape of the supporter by powder metallurgy, and then only the parts requiring dimensional precision are processed by wire cut discharge processing, thereby cutting the wire cut discharge. The processing time required for the process can be reduced, and the manufacturing cost is lower than that of wire cut electric discharge machining throughout the supporter due to less wasted material.

In addition, after the molded part having the shape of the supporter is manufactured by powder metallurgy, only the part requiring the dimensional precision is processed by wire cut discharge processing. This enables mass production of supporters.

1 is a perspective view showing a semiconductor device fixing jig.
2 and 3 are schematic diagrams showing a state in which the supporter is manufactured by wire cut discharge processing.
4 is a flowchart illustrating a supporter manufacturing method of a semiconductor device fixing jig according to the present invention.
5 is a front view showing a molded article manufactured by powder metallurgy in the method for manufacturing a supporter for a semiconductor device fixing jig according to the present invention.
Fig. 6 is a schematic diagram showing wire cut electric discharge machining of an additional tooth in a supporter manufacturing method of a semiconductor device fixing jig according to the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor may properly define the concept of the term to describe its invention in the best possible way And should be construed in accordance with the principles and meanings and concepts consistent with the technical idea of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a flowchart illustrating a supporter manufacturing method of a semiconductor device fixing jig according to the present invention.

Referring to the drawings, the supporter manufacturing method of the semiconductor device fixing jig according to the present invention is a powder metallurgy forming step (S100) and the powder metallurgy forming step (S100) for manufacturing a preform largely corresponding to the shape of the supporter by powder metallurgy (S100) Wire cut discharge processing step (S200) for processing the part requiring the dimensional precision for the molded article manufactured by sintering by wire cut discharge processing.

In other words, the powder metallurgy forming step (S100) is hardened by pressing and forming a metal powder suitable for the supporter 20 installed in the fixing jig 10 in which the semiconductor element is placed, and then sintering by heating to a high temperature. The powder metallurgy forming step (S100) is to produce the supporter 20 by (iii) is composed of a mixing step (S110), a compression step (S120), a sintering step (S130) and a calibration step (S140).

That is, the mixing step (S110) is to mix the metal powder uniformly according to the composition desired by the customer to put the metal powder suitable for the supporter 20 installed in the fixed jig 10 into the stirrer and to mix uniformly.

In addition, the compression step (S120) is to inject a uniformly mixed metal powder obtained from the mixing step (S110) into a mold in which the shape of the supporter 20 is formed and press by a press to produce a preform having a suitable hardness. .

The preform obtained from the compression step (S120) as described above is subjected to the sintering step (S130), the sintering step (S130) is to put the compressed preform into a furnace at a temperature below the melting point to heat, to form a preform The preform is heated and sintered at a temperature below the melting point of the metal powder.

In this case, when the metal powder constituting the preform is an alloy, the metal powder is sintered by heating to a temperature lower than the melting point of the metal having the highest melting point among the metals that make the alloy.

Then, the molding 100 that passed through the sintering step (S130) as described above is subjected to a calibration step (S140) to satisfy the dimensional precision throughout the molding 100 or pressurized by a press to increase the density of the molding (100) Done.

As such, after the powder metallurgy forming step S100 is completed through the mixing step S110, the compression step S120, the sintering step S130, and the straightening step S140, the wire cut discharge machining step S200 is performed. .

That is, by processing the portion requiring the dimensional accuracy of the molded article 100 sintered through the powder metallurgy forming step (S100) by wire cut discharge processing, the supporter installed in the fixing jig 10 in which the semiconductor element is placed ( 20) can be manufactured.

In other words, when the powder metallurgy forming step S100 is completed, a molding having a shape as shown in FIG. 5 is manufactured. That is, the molded article 100 manufactured through the powder metallurgy forming step S100 has a rectangular shape having a large area covering the pair of protrusions 14 formed around the settling groove 12 formed in the fixing jig 10. Body 110 forming a shape, and the coupling groove 120 is formed in the body 110, the long side (L) of the body 110 and a part of the arc abuts and fitted to the projection 14 provided in the fixing jig (10). And the opposite side of the coupling groove 120 has a form consisting of a gland 130 formed integrally with the long side (L).

The molding 100 manufactured by the powder metallurgical molding step S100 having such a shape is to process a portion requiring dimensional precision by wire cut discharge machining, and as shown in FIG. By cutting the 130 in the long side L direction, the supporter 20 having a desired shape can be manufactured.

According to the supporter manufacturing method of the semiconductor device fixing jig according to the present invention as described above, after manufacturing the molding 100 having a shape corresponding to the shape of the supporter 20 with powder metallurgy, only the portion requiring the dimensional precision of the wire cut discharge processing As a result, the processing time required for the wire cut electric discharge machining can be reduced, and the manufacturing cost is lowered compared to performing the wire cut electric discharge machining throughout the supporter 20 due to less wasteful materials.

In addition, since the molded part having the shape of the supporter 20 is manufactured by powder metallurgy, only the part requiring the dimensional precision is processed by wire cut discharge processing, so that only the part requiring the dimensional precision after manufacturing a large amount of the molded part at one time is cut. The discharge machining enables mass production of supporters.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. .

10: fixed jig 12: settle groove
14: projection 20: supporter
22: coupling groove 100: molding
110: body 120: coupling groove
130: sieve L: long side
P: Plate W: Wire

Claims (4)

In manufacturing a supporter installed in a fixed jig in which a semiconductor element is placed,
A powder metallurgical molding step (S100) of manufacturing the molding 100 from powder metallurgy according to the shape of the supporter; And
And a wire cut discharge machining step (S200) of processing a portion requiring dimensional precision with respect to the molded product 100 manufactured through the powder metallurgy forming step (S100) by wire cut discharge machining. Jig supporter manufacturing method.
The method according to claim 1,
The powder metallurgy forming step (S100),
Mixing step (S110) of uniformly mixing the metal powder according to the composition desired by the customer;
A compression step (S120) of preparing the preform by injecting the mixed powder into the mold and pressing the powder;
A sintering step (S130) in which the compressed preform is put into a furnace at a melting point or lower and heated; And
After the sintering step (S130) to satisfy the dimensional accuracy throughout the molding or pressurizing step by pressing for increasing the density of the molding (100) (S140); and a supporter of a semiconductor device fixing jig Manufacturing method.
The method according to claim 1,
The molding 100 manufactured through the powder metallurgy molding step (S100),
A body (110) having a rectangular shape having an area covering a pair of protrusions (14) provided around the settling groove (12) formed in the fixing jig (10);
A coupling groove (120) formed in the body (110), the long side (L) of the body (110) contacting a part of the arc and fitted into a protrusion (14) provided in the fixing jig (10); And
The supporter manufacturing method of a semiconductor device fixing jig, characterized in that consisting of; a gushing 130 formed integrally with the long side (L) on the opposite side of the coupling groove (120).
The method according to claim 1 or 3,
The wire cut discharge processing step (S200),
The method of manufacturing a supporter for a semiconductor device fixing jig, characterized in that to cut in the long side (L) direction of the grate 130 formed in the molded product 100 produced from the powder metallurgy forming step (S100).
KR1020120020449A 2012-02-28 2012-02-28 Supporter manufacturing method of jig for semiconductor KR20130098715A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120020449A KR20130098715A (en) 2012-02-28 2012-02-28 Supporter manufacturing method of jig for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120020449A KR20130098715A (en) 2012-02-28 2012-02-28 Supporter manufacturing method of jig for semiconductor

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KR20130098715A true KR20130098715A (en) 2013-09-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114211208A (en) * 2021-12-27 2022-03-22 安徽金寨将军磁业有限公司 Processing method for arc surface of permanent magnetic ferrite magnetic shoe alloy die

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114211208A (en) * 2021-12-27 2022-03-22 安徽金寨将军磁业有限公司 Processing method for arc surface of permanent magnetic ferrite magnetic shoe alloy die
CN114211208B (en) * 2021-12-27 2024-02-27 安徽金寨将军磁业有限公司 Method for processing arc surface of permanent ferrite magnetic shoe alloy die

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