KR20130098134A - Die and method for manufacturing same - Google Patents

Abstract

A lip part composed of a HIP layer which is directly diffused and bonded to the base material of the die body by HIP (hot isotropic pressure pressurization) treatment, which is densified, has excellent bending strength and toughness, and the surface roughness is finished with high precision, and the edge part has high precision. A die finished with sharp edges and having a lip with good wear and corrosion resistance.
The lip part 8 is provided in the front-end | tip side of the die flow path 5 formed in the die main body 4, and discharges the coating liquid supplied to the die flow path 5 from the lip part 8, At least the lip part 8 An alloy powder 19 having good corrosion resistance and abrasion resistance is formed by a HIP layer 20 in which diffusion is directly bonded to the base material of the die main body 4 by HIP treatment.

Description

Die and the manufacturing method {DIE AND METHOD FOR MANUFACTURING SAME}

The present invention is a die (coating die or T-die) in which a gel or liquid coating liquid is applied to a traveling flexible strip-like support, or a molten resin for forming a resin film is discharged from the lip portion. ) And a method for producing the same.

As a conventional die, for example, a coating die, specific well-known documents such as patent publications cannot be cited, but conventionally used coating dies have a cemented carbide lip member attached to the front end side of a die flow path formed in a die body. By the cemented carbide of this lip member, high rigidity, abrasion resistance and corrosion resistance can be obtained, and the tip shape accuracy can be improved.

Moreover, the resin film manufactured by the extruder using T-die is especially required to be free from the variation of thickness and the stripe shape defect about what is used for optical use. As a result, the inner flow of the die flow path, which is the flow path of the molten resin, becomes smooth, and in particular, the edge portion of the lip discharged from the molten material is formed with sharp edges, and furthermore, no scratches or wear occur. It is preferable to be formed of a material having high hardness, strength and wear resistance.

Conventionally, hard chromium plating is applied to the inner wall of the die flow path to reduce friction with the molten resin, while the lip portion has been proposed to be coated with, for example, a cemented carbide powder with high hardness and high wear resistance. . However, when hard chromium plating is applied to the inner wall of the die flow path and the cemented carbide powder is coated on the lip, the adhesion of hard chromium plating at the tip of the lip is poor. It can cause a wound. Therefore, if the thermal spraying is performed after the plating layer of the thermal sprayed portion is peeled off by grinding or the like after the plating treatment, cracks may occur in the joints of the plating portion and the thermal sprayed portion, resulting in poor connection, and impede the flow of the resin. There is concern. In the case of coating the cemented carbide powder by thermal spraying, the cemented carbide powder containing WC as a main component is melted and blown out. Therefore, when the edge part is finished by grinding and polishing after thermal spraying, the particles of the powder material are peeled off or cracked. It is easy to occur.

Thus, a die has been conventionally proposed in which a lip portion is formed of a cemented carbide and is attached to a die body. Thus, according to the die in which the lip part made of cemented carbide is attached to the die main body, high wear resistance, corrosion resistance and strength can be obtained without causing peeling or cracking as described above.

By the way, in the die which attached the above-mentioned lip member made from cemented carbide to the die main body, fine pores remain in the sintered body, and there are problems in terms of surface roughness in that many pinholes are visible when the crystals are ground. It cannot be used for the manufacturing process of a liquid crystal display panel like application | coating required. In addition, since the lip member made of cemented carbide is joined to the die body, which is the base material, by soldering or welding, the wear and deformation of the joint are large due to the effects of welding defects, solder defects, and a decrease in the joint strength in the joint. Similarly, it is impossible to use in a manufacturing process of a liquid crystal display panel requiring high precision. In addition, when the molten resin is discharged from the lip portion to form a resin film, there is a fear that an extremely thin and precise resin film cannot be produced.

In view of the above circumstances, the present invention provides a lip made of a HIP layer which is directly diffusion-bonded to the base material of the die body by HIP (Hot Isostatic Pressing, or Hot Isostatic Pressing) treatment instead of the lip member made of cemented carbide. By making the portion, the structure of the lip portion can be densified, the surface roughness can be finished with high precision, and there is no decrease in strength of the joint portion or occurrence of bonding defects, and the edge portion is finished with high-precision sharp edges, and wear resistance and corrosion resistance It is an object of the present invention to provide a die (coating die and T-die) having a lip portion which becomes favorable and a method of manufacturing the same.

When the means for solving the above problems are described with reference numerals of embodiments to be described later, the invention according to claim 1 is provided with a coating liquid provided on the front end side of the die flow path formed in the die body and supplied to the die flow path, or A die for discharging molten resin from a lip portion, wherein at least the lip portion is formed by a HIP layer in which an alloy powder having good corrosion resistance and abrasion resistance is directly diffusion-bonded to the base material of the die body by HIP (hot isostatic pressure) treatment. It is done.

The invention according to claim 2 is characterized in that in the die according to claim 1, the alloy powder to be HIP-treated consists of a nickel-based alloy or a cobalt-based alloy.

The invention according to claim 3 is characterized in that the base material of the die body is made of austenite / ferrite two-phase stainless steel in the die according to claim 1.

The invention according to claim 4 is characterized in that, in the die according to claim 1, a hard chromium plating layer or an electroless nickel plating layer is formed on the inner wall of the die body forming the die flow paths other than the lip portion.

The invention according to claim 5 is a manufacturing method of a die in which a lip portion is provided at a front end side of a die flow path formed in a die body, and discharges a coating liquid or molten resin supplied from the die flow path to the HIP process. It is characterized in that the alloy powder having good corrosion resistance and wear resistance is formed by a HIP layer bonded directly to the base material of the die body.

In the invention according to claim 6, in the method for producing a die according to claim 5, a capsule made of a die material having a recess for alloy powder is formed, and the capsule has a corrosion resistance in the recess for alloy powder of the die material. And filling the alloy powder with good abrasion resistance into the processing chamber of the HIP apparatus and performing HIP treatment at high temperature and high pressure to form a HIP layer in which the alloy powder is directly diffusion-bonded to the die material. The die body is formed by machining the layer, and a die flow path is formed in the die body.

The invention according to claim 7, in the method for producing a die according to claim 6, wherein the upper die and the lower die are formed by cutting off unnecessary portions of the upper die material and the lower die material, respectively, in which the HIP layer is formed by HIP processing. In addition, the abutment surfaces of both the upper and lower dies are cut, and the die body is formed by abutting the abutment surfaces of the upper die and the lower die thus formed, and the upper and lower dies are integrated in a state where a liner is sandwiched between the abutment surfaces. It is characterized in that the die flow path is formed in the die body by fastening.

The invention according to claim 8 is the die manufacturing method according to claim 6, wherein the recess for the alloy powder is formed in a shape that is three-dimensionally curved or bent, and is formed in the die body by three-dimensionally bent or bent. It is characterized by forming a die flow path.

According to a ninth aspect of the present invention, in the method for manufacturing a die according to claim 5, a hard chromium plating layer or an electroless nickel plating layer is formed on an inner wall surface of the die body forming a die flow path other than the lip portion.

In the invention according to claim 10, in the die manufacturing method according to claim 9, in order to perform hard chromium plating treatment or electroless nickel plating treatment on the inner surface side surface of the die material other than the HIP layer serving as the lip portion, the required cut amount is under A cut process is performed and a hard chromium plating layer or an electroless nickel plating layer is formed in this undercut portion.

The invention according to claim 11, wherein in the die manufacturing method according to claim 5, the undercut portion includes a part of the HIP layer, and the hard chromium plating layer over the entire inner surface side of the die material subjected to the undercut process and a part of the HIP layer. Or an electroless nickel plating layer is formed.

According to the invention according to claim 12, in the die manufacturing method according to claim 11, after forming the hard chromium plating layer or the electroless nickel plating layer over a part of the HIP layer forming the entire inner surface side of the die material and the lip portion, the inner surface of the die material The hard chrome plating layer or the electroless nickel plating layer on the side, and the HIP layer forming the lip portion are cut to one surface.

When explaining the effect of the invention by the above-mentioned solution means with reference numerals of the embodiments described below, according to the die of the invention according to claim 1, at least the lip portion 8 is a die by the HIP treatment of the alloy powder having good corrosion resistance and wear resistance Since it is formed by the HIP layer which directly diffused-bonded with the base material of a main body, the structure of a lip part is densified by HIP treatment of an alloy powder, and pores do not remain inside like a sintered compact made of cemented carbide, and at the time of grinding and lapping No pinholes are generated, there is no decrease in strength or joint defects in the joints, and the surface roughness of the lip is greatly improved, and the fluidity of the coating solution is very good, and the edges are finished with high-precision sharp edges. It is possible to use, and it can be used for the manufacturing process of a liquid crystal display panel in which high-precision application | coating is calculated | required.

According to the die according to the invention according to claim 2, when the alloy powder to be HIP is made of a nickel-based alloy or a cobalt-based alloy, the corrosion resistance is further improved.

According to the die according to the invention according to claim 3, when the base material of the die main body is made of austenitic / ferritic two-phase stainless steel, the thermal expansion coefficient of the alloy powder which is diffusion-bonded to the base material of the die main body by HIP treatment is close. There is less bending strain due to the difference.

According to the die according to the invention according to claim 4, in the case where all the die flow paths are to be formed by the HIP layer, the manufacturing cost of the die is very high, but the HIP is formed on the inner wall surface of the die body forming the die flow paths other than the lip portion. Since the hard chromium plating layer or the electroless nickel plating layer, which is much cheaper than the treatment, is coated, the friction with the coating liquid or the molten resin can be reduced, and the die manufacturing cost can be reduced.

According to the method for producing a die of the invention according to claims 5 to 7, the alloy powder having at least a lip portion having a good corrosion resistance and abrasion resistance is formed by a HIP layer which is directly diffusion-bonded to the base material of the die main body. By the HIP treatment, the structure of the lip is densified, and pores do not remain inside like the cemented carbide sintered body, and pinholes are not generated during grinding or lapping, and the strength of the joint and the occurrence of bonding defects are also reduced. In addition, the surface roughness of the lip is greatly improved, so that the fluidity of the coating liquid and the molten resin becomes very good, and the edge portion can be finished with sharp edges of high precision. It becomes possible to use for a manufacturing process.

According to the method for manufacturing a die of the invention according to claim 8, the die body reaches from the manifold portion of the shape such as bent or bent three-dimensional to the lip by forming a HIP layer that is bent or bent in three dimensions. The die | dye which formed the whole liquid contact part of a complicated shape inside by a HIP layer can be manufactured.

According to the method for manufacturing a die of the invention according to claim 9, in the case where all die flow paths are to be formed by the HIP layer, the manufacturing cost of the die is very high, but the inner wall surface of the die body forming the die flow path other than the lip portion Since the hard chromium plating layer or the electroless nickel plating layer, which is much cheaper than the HIP treatment, is coated, the friction with the coating liquid or the molten resin can be reduced, and the manufacturing cost of the die can be reduced.

According to the method for producing a die according to claim 10, in order to perform hard chromium plating treatment or electroless nickel plating treatment on the inner surface side surfaces of the die material other than the HIP layer serving as the lip portion, an undercut treatment of the required amount of cut is performed. Since a hard chromium plating layer or an electroless nickel plating layer is formed in this undercut part, a hard chromium plating layer or an electroless nickel plating layer of a required thickness can be easily formed.

According to the manufacturing method of the die of the invention of Claim 11 and 12, the said undercut part contains a part of HIP layer, The hard chromium plating layer or over the whole inner surface side of the die material which performed the undercut process, and a part of HIP layer. An electroless nickel plating layer is formed, and the hard chromium plating layer or the electroless nickel plating layer on the inner side of the die material and the HIP layer forming the lip are cut to one side, so the hard chromium plating layer or the electroless nickel on the inner side of the die material The plating layer and the HIP layer forming the lip portion are smoothly finished and can be used stably for a long time without causing a gap or peeling phenomenon between them.

(A) is a side view which shows the coating die which concerns on one Embodiment of this invention, (b) is a front view, (c) is AA sectional drawing of (a), (d) is BB sectional drawing of (a) to be.
(A) is sectional drawing of the CC line of FIG. 1 (b), (b) is sectional drawing of the DD line of FIG.
FIG.3 (a) is sectional drawing similar to FIG.2 (a) which shows the coating die which concerns on other embodiment, (b) is sectional drawing which shows the coating die which concerns on still another embodiment.
(A-1) is sectional drawing of an upper die raw material, (b-1) is sectional drawing of a lower die raw material, (b-1) is a front view which looked at the upper die raw material from the facing surface side, (b-2) (C-1) is a sectional view of the middle die embedded in the upper die material, (c-2) is a sectional view of the middle die embedded in the upper die material, (d ) Is a cross-sectional view of a capsule produced by overlapping upper and lower die materials.
Fig. 5 (a) is a cross sectional view showing the alloy powder filled in the recess of the capsule, (b) is an explanatory view showing a state in which the capsule is placed in the processing chamber of the HIP apparatus and HIP processing, and (c) is a die material of both dies of the capsule. It is explanatory drawing of the state which removed.
Fig. 6 (a-1) is a cross-sectional view showing a cut line for cutting and removing an unnecessary portion of a HIP-treated upper die material, and (a-2) is a cut line for cutting and removing an unnecessary portion of a HIP-treated lower die material. Sectional drawing (b-1) is a front view which shows the cutting line which cuts and removes the unnecessary part of the HIP-treated upper die material, (b-2) shows the cutting line which cuts and removes the unnecessary part of the HIP-processed lower die material. (C-1) is sectional drawing of the formed upper die which removed the unnecessary part, (c-2) is sectional drawing of the formed lower die which removed the unnecessary part, (d) is sectional drawing of the coating die which consists of both upper and lower dies. .
Fig. 7 (a-1) is a front view of one pair of die materials in which a manifold is formed, as seen from the abutting surface side, (a-2) is a sectional view taken along the line EE of (a-1), (b- 1) is a front view of the other die material, (b-2) is a sectional view taken along the line FF of (b-1), (c) is a cross sectional view of both die materials facing each other, and (d) is made of both die materials. Sectional drawing of a capsule (e) is sectional drawing of the die main body which consists of a pair of die member which disassembled the capsule after a HIP process, and was formed by machining.
Fig. 8 shows a T die according to an embodiment of the present invention, (a) is a front view of one die of a die body composed of a pair of dies seen from abutting side, (b) is AA of (a) Line sectional drawing (c) is sectional drawing of the T die | dye formed by forming a die main body by opposing a pair of die | dye.
9A is a cross-sectional view showing a coating die according to an embodiment of the present invention, (b) is a cross-sectional view taken along the line BB of (a), and (c) is a cross-sectional view taken along the line CC of (a).
10 (a) to 10 (d) are explanatory views for explaining the HIP process.
Fig. 11 shows a method for manufacturing a coating die according to one embodiment of the present invention, (a-1) is a front view of a die material on one side having a lip formed by a HIP layer at an inner wall front end thereof, as seen from the side of abutting, ( a-2) is a sectional view of the same die material, (b-1) is a front view of the undercut die material, (a-2) is a sectional view, and (c-1) is almost the entire area of the inner wall surface of the die material. (C-2) is sectional drawing in the front view of the state which coat | covered the hard chrome plating layer.
Fig. 12A is a cross-sectional explanatory diagram of a die material showing a grinding line for grinding in order to make the HIP layer and the hard chromium plating layer one surface, and (b-1) is a front view of the die member after grinding, (b). -2) is its sectional drawing, and (c) is sectional drawing of the coating die which consists of the die main body 4 which formed the pair of die members against each other.

EMBODIMENT OF THE INVENTION When one suitable embodiment of this invention is described below based on drawing, as shown in FIG. 1, the coating die 1 has the die main body 4 which consists of the upper die 2 and the lower die 3. As shown in FIG. The die flow path 5 is provided between the upper and lower dies 2 and 3. As shown to (a) and (d) of FIG. 1, in the lower die 3, the coating liquid supply path 6 by which the coating liquid is supplied by the supply pipe K as arrow a, and this supply path ( After collecting the coating liquid from 6), the manifold 7 which spreads in the die width direction is provided. These supply paths 6 and the manifold 7 form part of the die flow path 5, and lip portions 8, 8 are provided on the front end side of the die flow path 5.

In addition, on the abutment surfaces 2o and 3o of the upper die 2 and the lower die 3, the base 9a and the both side portions 9b and 9b are positioned opposite to the rear side of the manifold 7 and at both ends in the width direction. The upper surface 3o and the upper surface of the lower die 3 are attached to each other, except that the liner 9 having a thickness t formed in a substantially c-shape as viewed in the plane of the furnace is blocked by the c-shaped liner 9. A lip flow path portion 10 (see (a) to (c) of FIG. 1) having a thickness t and a width W1 is formed between the lower surface 2o of the die 2, and the lip flow path portion 10 is formed. The coating liquid is discharged from the lip inlet 11 of the lip 8 located at the tip of the head.

This coating die 1 is characterized in that at least the lip 8 of the die main body 4 is directly diffusion-bonded to the base material of the die main body 4 by HIP (hot isotropic pressure-pressure) treatment of an alloy powder having good corrosion resistance and abrasion resistance. It is a point formed by one HIP layer 20, and this HIP layer 20 is shown in the figure in each figure. In the coating die 1 of the embodiment shown to FIG. 1 and FIG. 2, the upper and lower dies 2 and 3 which form the neutral flow path part 10 of the die flow path 5 formed in the die main body 4 are shown. The inner surface side is formed of the HIP layer 20. In the coating die 1 shown to Fig.3 (a), the HIP layer 20 is formed in the whole contact surface 2o, 3o of the upper and lower dies 2, 3 which comprise the die main body 4, and In the coating die 1 shown to (b) of this figure, only the lip | rip part 8 formed in the front end side of the die flow path 5 is formed of the HIP layer 20. As shown in FIG.

The method of manufacturing the said coating die 1 is demonstrated below, referring FIGS. 4-6. In addition, here, the coating die 1 when the HIP layer 20 is formed so that it may apply to the coating die 1 shown in FIG.3 (a), ie, the whole contact surface 2o, 3o of the upper and lower dies 2, 3, is formed. The manufacturing method of (1) is demonstrated.

4A is a cross-sectional view of the upper die material 12, (a-2) is a cross-sectional view of the lower die material 13, and (b-1) is a lower die material 12. (B-2) is the front view which looked at the lower die raw material 13 from the abutment surface side with the upper die raw material 12, and (b-2). The upper die material 12 and the lower die material 13 are made of SUS329J1 to 4 (austenitic / ferrite two-phase systems having a thermal expansion coefficient close to that of nickel-based alloy powder or cobalt-based alloy powder used in the alloy powder of the HIP layer 20). Stainless) is preferred. On each side of the die material 12, 13, a rectangular alloy recessed portion 14 is formed on the abutting side of the die material 12, 13, and a middle-shaped fitting step portion 15 is formed at the periphery of the recessed portion 14; ), And an alloy powder supply port 16 is formed in the upper portion of the recess 14 with respect to FIG.

First, as shown in (c-1) and (c-2) of FIG. 4, the plate-shaped middle type | mold 17 which carried out the mold release process to the middle type | middle fitting step part 15 of the upper and lower die raw materials 12 and 13, respectively. , The upper and lower die materials 12 and 13 are superimposed on each other, and the dividing line portions shown on the outer periphery of both die materials 12 and 13 are welded to form a capsule as shown in (d) of the figure. 18). The capsule 18 is filled with an alloy powder 19 having good corrosion resistance and abrasion resistance as shown in Fig. 5A from the supply port 16 to the recesses 14 in the die materials 12 and 13. The supply port 16 side is blocked by the blocking plate 17A and deaerated sealed.

Nickel-based alloy powder or cobalt-based alloy powder is used as the alloy powder 19 having good corrosion resistance and abrasion resistance. The constituent element ratios of the preferred nickel-based alloy powder are 69.75 wt% nickel, 16.5 wt% chromium, 3.3 wt% boron, 4.0 wt% silicon, 0.65 wt% carbon, 3.5 wt% iron, 3.0 wt% molybdenum and 2.3 wt% copper. It is made of. Other preferred nickel-based alloy powders are 58.2 wt% nickel, 18.0 wt% chromium, 3.3 wt% boron, 3.7 wt% silicon, 0.8 wt% carbon, 1.5 wt% iron, 2.5 wt% molybdenum and 12.0 wt% tungsten. Another preferred nickel-based alloy powder is 50.05 wt% nickel, 19.0 wt% chromium, 3.0 wt% boron, 3.1 wt% silicon, 0.85 wt% carbon, 1.5 wt% iron, 2.5 wt% molybdenum and 20.0 wt% tungsten. . On the other hand, the cobalt-based alloy powder is preferably composed of 45.7 wt% of cobalt, 19.0 wt% of chromium, 15.0 wt% of tungsten, 1.3 wt% of copper, 13.0 wt% of nickel, 3.0 wt% of boron, and 3.0 wt% of silicon. will be.

Then, this capsule 18 is accommodated in the processing chamber 21 of a HIP (hot isostatic pressure) apparatus, as shown to FIG. 5 (b), for example, under high temperature, high pressure of 1300 degreeC and 1300 Kgf / cm <^2> . By performing the HIP process, the HIP layer 20 in which the alloy powder 19 is directly diffusion-bonded is formed on the inner surface side of each die material 12 and 13. The HIP layer 20 is a hard layer having a hardness of HRC55 to 68 by HIP treatment of nickel-based alloy powder or cobalt-based alloy powder. In this way, the capsule 18 which formed the HIP layer 20 in each inner surface side of both die raw materials 12 and 13 by HIP process is disassembled, and both die raw materials 12 and 13 are disassembled in FIG. As shown in the figure, the cores 17 of the die materials 12 and 13 are separated from each other.

6 (a-1) and 6 (a-2) respectively cut unnecessary portions of the upper die material 12 and the lower die material 13 in which the HIP layer 20 is formed by the above-described HIP process. It is sectional drawing which shows the state to cut | disconnect by cutting and cutting along the line 22, and shows the front view which looked at the same state from the abutment surface of the upper and lower die materials 12 and 13, respectively (b-1), (b- 2). (c-1) and (c-2) show the upper die 2 and the lower die 3 formed by cutting off unnecessary parts along the cutting line 22, respectively. In the upper die 2, the coating liquid supply path 6 and the lip flow path part 10 of the die flow path 5 are formed by drilling, milling, or the like.

Thereafter, the butt surfaces of the upper die 2 and the lower die 3 are mirror-machined by mirror grinding, and the lip inlet 11, which is the leading edge of the lip 8, is finished to 1 mu m, and the surface thereof is finished. Roughness (surface roughness) is precisely finished with Ry (maximum height) 0.1μm. In addition, when lapping is performed, the surface roughness of the butt surface can be finished up to Ry 0.0 alpha unit.

6 (d) forms the die body 4 by abutting the upper die 2 and the lower die 3 formed as described above with each other, and the manifold 7 between the abutting surfaces. (A) of FIG. 3 formed by integrally fastening both the upper and lower dies 2 and 3 by bolts or the like while the substantially c-shaped liner 9 is fitted in a planar view at both the positions opposite to the rear side and the width direction both ends thereof. The coating die 1 as shown to is shown.

In the coating die 1 manufactured as described above, as shown in FIG. 3A, the inside of the die main body 4 extending from the manifold 7 to the lip 8 on the tip side of the lip flow path 10 has a corrosion resistance. And the HIP layer 20 diffusion-bonded directly to the base material of the die main body 4 by HIP treatment of the alloy powder 19 having good wear resistance, thereby ensuring good wear resistance and corrosion resistance, as well as alloy powder 19 By the densification of the structure of the lip portion 8 by HIP treatment of), the bending strength is greatly improved, and since no pores remain inside like the sintered product of cemented carbide, pinholes are not generated during grinding or lapping. There is no decrease in the strength of the joining portion or the occurrence of joining defects, and the surface roughness of the lip portion 8 is greatly improved, so that the fluidity of the coating liquid is very good, and the lip inlet 11 of the lip portion 8, which is the edge portion, is 1 μm unit. I finish it with high precision sharp edge It is possible, and it is possible to use such a high precision coating process of manufacturing the liquid crystal display panel as required.

Although not shown, the die flow path 5 extending from the coating liquid supply path 6 of the die main body 4 to the manifold 7, the lip flow path part 10, and the lip part 8 by the HIP process is not shown. By forming the HIP layer 20 so as to cover the entire area, and forming a hard layer having a hardness of HRC55 to 68, even when a highly abrasive coating solution is used, no damage or abrasion occurs in the contact portion of the die flow path 5. Can be used effectively permanently.

Moreover, depending on the coating liquid, like the coating die 1 shown to FIG. 3 (b), even if only the lip | rip part 8 formed in the front end side of the die flow path 5 was formed by the HIP layer 20 at all, No problem.

The method of manufacturing the coating die 1 described with reference to FIGS. 4 to 6 applies the alloy powder 19 to the recesses 14 for alloy powder of the pair of die materials 12 and 13 forming the capsule 18. Although HIP processing is performed by filling, it is embodiment when the HIP layer 20 of linear shape, ie, a rectangular parallelepiped shape, is formed in the required part of the die raw materials 12 and 13, but die raw materials 12 and 13 are shown in FIG. The embodiment in the case of forming the required shape HIP layer 20 which bends or bends three-dimensionally in the required part of is shown. By forming the HIP layer 20 having a three-dimensional curved or bent shape as described above, the entire liquid contact portion from the manifold 7 portion having the shape of three-dimensional curved or curved to the lip portion 8 is HIP layer. It can form by (20), and this is also a characteristic of the method of this invention.

(A-1) is a front view which looked at the one die | dye material 12 in which the manifold is formed among the pair of die raw materials 12 and 13 from the abutting surface side with the other die raw material 13, (a (2-1) is a sectional view taken along line EE of (a-1), (b-1) is a front view of the die material 13 viewed from the side of the die material 12 facing the die material 12, and (b-2) is (b-1). FF line cross section. First, as shown to (a-1) and (a-2), the upper edge part forms a mountain shape on the abutting surface side of one die | dye material 12, and gradually becomes shallower from the mountain upper part to the lower edge part gradually. For forming the alloy powder recesses 24 having the same three-dimensional curved and bent shape, and for the alloy powder whose upper edge portion is formed in a mountain shape at abutting surface side of the other die material 13, but with a constant depth. The recessed part 25 is formed. Although not shown, alloy powder supply holes are formed in the center portions of the recesses 24 and 25 for the alloy powder of the die materials 12 and 13.

Subsequently, as shown in Fig. 7 (c), in a state where the butt faces of the pair of die materials 12 and 13 are opposed to each other, and the plate-shaped middle type 27 subjected to release treatment is interposed therebetween. The upper and lower die materials 12 and 13 are superimposed on each other, and the dividing line portions shown on the outer periphery of both die materials 12 and 13 are welded to form a capsule 18 as shown in (d) of the same figure. The capsule 18 is filled with concave portions 24 and 25 in the die materials 12 and 13 from the alloy powder supply port, and the alloy powder 19 as in the above-described embodiment is put into a deaerated seal state.

Thereafter, the capsules 18 are housed in the processing chamber 21 of the HIP (hot isostatic pressure) apparatus shown in Fig. 5B, and HIP processing is performed under high temperature and high pressure, thereby providing the die materials 12 and 13. On the inner surface side of the alloy powder 19 to form a three-dimensional curved and curved HIP layer 20 is directly diffusion bonded. In this way, after disassembling the capsule 18 which formed the HIP layer 20 in the inner surface side of both die materials 12 and 13 by HIP process, both die materials 12 and 13 are isolate | separated from each other, Remove (27). In this manner, as shown in FIG. 7E, one die material 12 is appropriately shaped and the inner surface side of the HIP layer 20 is machined to thereby form the manifold 7 and the lip flow path part ( 10, and the coating liquid supply path 6 which communicates with the manifold 7 is formed, and the front end side of the lip flow path part 10 is set to the lip part 8. As shown in FIG. The other die raw material 13 is also appropriately shaped, and the inner surface of the HIP layer 20 is also machined as necessary. Thereby, although not shown, the coating die which has the die main body 4 which consists of a pair of die 2 and 3 which formed the three-dimensionally curved and bent die flow path 5 can be manufactured.

As described above, by forming the HIP layer 20 having a shape that bends or bends in three dimensions, the die body extending from the portion of the manifold 7 that is shaped to be bent or bent in three dimensions to the lip portion 6. (4) The coating die in which the whole liquid contact part of the complicated shape inside was formed by the HIP layer 20 can be manufactured.

8 and below also show another suitable embodiment of the present invention. Referring to the drawings, FIG. 8 (c) shows the T die 31, which is an embodiment of the die according to the present invention. This T-die 31 has a die main body 34 composed of a pair of die members 32 and 33, a die flow path 35 is formed between both die members 32 and 33, and a die flow path ( Lip parts 36 and 36 are provided at the front end side of 35, a manifold 37 is provided at the rear end side of die flow path 35, and a molten resin inlet 38 is provided at the center of manifold 37. have. Accordingly, in this T-die 31, the molten resin introduced from the inlet 38 flows into the lip passage part 39 once gathered in the manifold 37 and spread in the die width direction. 36 is passed through the lip inlet 47 to be extruded in the form of a film.

The T die 31 is characterized by a HIP layer in which each lip portion 36 is diffusion-bonded with the die members 32 and 33 serving as the base materials by HIP (hot isostatic pressure) treatment of an alloy powder having good corrosion resistance and abrasion resistance ( The hard chrome plating layer 50 is formed on the inner wall surfaces of the die members 32 and 33 which are formed by the 40 and form the die flow passages 35 other than the lip portion 36, and this HIP layer 40 ) Is shown in each figure in an uneven shape.

Fig. 9 shows a coating die 41 which is another embodiment of the die according to the present invention, which has a die body 34 composed of a pair of upper and lower die members 32 and 33, A die flow path 35 is provided between both die members 32 and 33, and a coating liquid supply passage 44 through which the coating liquid is supplied from the outside to the lower die member 33, and from the supply passage 44. After the coating liquid is collected once, a manifold 37 that extends in the die width direction is provided. These coating liquid supply paths 44 and the manifold 37 form a part of die flow path 35, and lip parts 36 and 36 are provided in the front end side of die flow path 35. As shown in FIG.

On the abutment surfaces of both die members 32 and 33, the bases 45a and both side portions 45b and 45b are formed in a substantially c-shape in plan view at positions opposite to the rear side of the manifold 37 and at both ends in the width direction. A top line 33o of the lower die member 33 and a bottom surface 32o of the upper die member 32 are attached to the liner 45 having a thickness t, except for the portion blocked by the c-shaped liner 45. ), The rib portion 36 is formed at the tip end of the rib flow path portion 39 with a thickness t and a width W1 forming a lip flow passage portion 39 (see FIGS. 9A to 9C). The coating liquid is discharged from the lip inlet 47 of the lip.

The coating die 41 also has an HIP layer 40 in which each lip portion 6 is diffusion-bonded with an alloy powder having good corrosion resistance and abrasion resistance to die members 32 and 33, which are the base materials, by HIP (hot isostatic pressure) treatment. It is characterized by the fact that the hard chromium plating layer 50 is coated on the inner wall surface of the die main body 34, which is formed by the die body 35 other than the lip portion 36. This HIP layer 40 is shown by the dot shape in FIG.9 (a)-(c).

Next, the manufacturing method of the coating die 41 (FIG. 9 (a)) among the T die 1 and coating die mentioned above is demonstrated, referring FIGS.

(A)-(d) is explanatory drawing explaining HIP process, FIG. 11 (a-1) is a die by the one side which has the HIP layer 40 formed by HIP-processing alloy powder in the inner-wall front-end | tip. (A-2) is sectional drawing of the die raw material 42, (b-1) is a front view of the undercut die raw material 42, (a-2) Is sectional drawing, (c-1) is a front view of the state in which the hard chromium plating layer 50 was coat | covered about the whole inner wall surface of the die raw material 42, (c-2) is sectional drawing.

The die materials 42 and 43 are preferably SUS329J1 to 4 (austenitic / ferritic two-phase stainless steel) having a thermal expansion coefficient close to that of the nickel-based alloy powder or the cobalt-based alloy powder used for the alloy powder of the HIP layer 40.

In addition, in order to manufacture a die which is cheaper in terms of material, the cost can be further reduced by using a material of the SCM440 system as the material of the die materials 42 and 43 which are the base materials. Moreover, hard chromium plating treatment can be effectively utilized by using SCM435 and 440 type structural alloy steel as a base material.

As shown in FIGS. 11A and 11A, a method of forming the HIP layer 40 by HIP treatment of alloy powder on the inner wall front end portions of the die materials 42 and 43 is shown. Referring to Figs. 10A to 10D, first, as shown in Fig. 10A, the alloy powders formed on the tip portions of the die materials 42 and 43 on the side of the abutment surface of each other, respectively. Both die materials 42 and 43 are faced to each other in a state in which the middle portions 62 and 62 having heat-resistant release materials applied to the recesses 61 and 61 are stored, respectively. By temporarily fixing to form a capsule (63), and from the powder supply port (64) of the capsule (63) to the recesses (61, 61) for alloy powder of each die material (42, 43), good corrosion resistance and abrasion resistance are obtained. The alloy powder 65 is filled, the powder supply port 64 is blocked by the blocking plate 66, deaerated sealed, and placed in the state shown in FIG.

Nickel-based alloy powders or cobalt-based alloy powders are used as alloy powders having good corrosion resistance and abrasion resistance. Preferred nickel-based alloy powders have a constituent element ratio of 69.75 wt% nickel, 16.5 wt% chromium, 3.3 wt% boron, 4.0 wt% silicon, 0.65 wt% carbon, 3.5 wt% iron, 3.0 wt% molybdenum and 2.3 wt% copper. It is made up of%. Other preferred nickel-based alloy powders are 58.2 wt% nickel, 18.0 wt% chromium, 3.3 wt% boron, 3.7 wt% silicon, 0.8 wt% carbon, 1.5 wt% iron, 2.5 wt% molybdenum and 12.0 wt% tungsten. Another preferred nickel-based alloy powder is 50.05 wt% nickel, 19.0 wt% chromium, 3.0 wt% boron, 3.1 wt% silicon, 0.85 wt% carbon, 1.5 wt% iron, 2.5 wt% molybdenum and 20.0 wt% tungsten. . On the other hand, the cobalt-based alloy powder is preferably composed of 45.7 wt% of cobalt, 19.0 wt% of chromium, 15.0 wt% of tungsten, 1.3 wt% of copper, 13.0 wt% of nickel, 3.0 wt% of boron, and 3.0 wt% of silicon. will be.

Then, the capsule 63 is placed in the processing chamber 67 of the HIP (hot isostatic pressure) apparatus as shown in FIG. 10 (b), for example, HIP treatment at high temperature and high pressure of 1300 ° C. and 1300 Kgf / cm ² . As shown in FIG. 10 (c), the HIP layer 40 in which the alloy powder is diffusion-bonded is formed at the front end portions of the inner wall surfaces of the die materials 42 and 43, respectively. This HIP layer is a hard layer of hardness HRC57-72 which consists of a nickel-type alloy or a cobalt-type alloy of the above-mentioned constituent element ratio.

As described above, the capsule 63 in which the HIP layer 10 is formed on the inner wall front end portions of both die materials 42 and 43 by HIP treatment is disassembled as shown in FIG. After separating the core 62 of the raw materials 42 and 43, cutting and cutting are performed suitably so as to have a desired shape, and it will be in the state shown in FIG.10 (d). The portion of the HIP layer 40 of the die materials 42 and 43 becomes the lip portion 36 of the die members 32 and 33. Moreover, in the die raw materials 42 and 43 shown to FIG. 10 (d), and the die raw materials 42 and 43 shown to FIG. 11 (a-1) and (a-2), the HIP layer 40 formed of The positional relationship is reversed up and down.

As shown in FIGS. 11A and 11A, the die materials 42 and 43 in which the HIP layer 40 is formed at the inner end of the inner surface are other than the HIP layer 40 serving as the lip portion 36. The undercut treatment of the required cut amount w as shown in Fig. 11B-2 for performing hard chromium plating treatment on the inner surface side of the die raw materials 42 and 43 is performed by cutting. . In FIG. 11 (b-2), the undercut portion is represented by 46. In addition, this undercut process also performs the part of the HIP layer 40 which contacts the die raw material 42 and 43, and the undercut part 46 also includes a part of HIP layer 40 as shown. I shall do it. The amount of undercuts in the undercut treatment can be appropriately set in consideration of the thickness of the plating layer 50 of hard chromium plating to be performed later.

As described above, hard chromium plating is performed such that the hard chromium plating layer 50 is coated over the entire inner surface side of the die materials 42 and 43 subjected to the undercut treatment and a part of the HIP layer 40, and FIG. -1) and (c-2). Since the thickness of the plating layer 50 is performed after grinding, it becomes about 100 micrometers thick enough than final thickness, for example. In this case, plating prevention means can be suitably applied to the plating unnecessary parts of the die materials 42 and 43 and the HIP layer 40. Further, the entire die materials 42 and 43 and the HIP layer 40 may be plated so as to be covered with the hard chromium plating layer 50, so that the plating unnecessary portion may be removed by grinding or the like in a later step.

After coating the hard chromium plating layer 50 over the entire inner surface side of the die materials 42 and 43 and a part of the HIP layer 40 forming the lip portion 36, the inner surfaces of the die materials 42 and 43. The cutting process is performed such that the hard chromium plating layer 50 and the HIP layer 40 coated on the side face one side. In the cross-sectional view of Fig. 12A, the final grinding line is denoted by G, and the hard chrome plating layer 50 and the HIP layer 40 are cut to this line G, thereby showing Figs. 12B and 12B. As shown in -2), the hard chromium plating layer 50 on the inner surface side of the die materials 42 and 43 and the HIP layer 40 forming the lip portion 36 can be provided on one surface. Thereafter, mirror polishing or mirror processing is performed as necessary. As such, the undercut is undercut to include the entire inner surface side of the die materials 42 and 43 and a part of the HIP layer 40, and the hard chromium plating layer 50 is used to cover the entire inner surface side of the die materials 42 and 43 and the HIP layer ( 40 is formed over a portion of the die material, and then the hard chromium plating layer 50 on the inner surface side of the die materials 42 and 43 and the HIP layer 40 forming the lip portion 36 are cut to one surface to form a die material. The hard chromium plating layer or the electroless nickel plating layer 50 on the inner surface side and the HIP layer 40 forming the lip portion 36 are smoothly finished and can be used stably for a long time without causing a gap or peeling phenomenon between them. have.

As described above, the chromium plating layer 50 on the inner surface side of the die materials 42 and 43 and the HIP layer 40 of the lip portion 36 are finished on one side, and then the entire die materials 42 and 43 are cut into required shapes. And grinding and mirror processing (including buffing) to form the upper die member 32 and the lower die member 33 for the coating die, and the coating liquid supply passage 44 and the lower die member 33. The manifold 37 is formed. However, in FIG. 12C, the upper die member 32 and the lower die member 33 are opposed to each other to form the die body 34, and the die flow path 35 is formed in the die body 34. The coating die 41 manufactured by forming the lip parts 36 and 36 of the front end side of the die flow path 35 is shown.

In order to manufacture the T die 31 and the coating die 41 by the method of the present invention, the die material 42 is basically the same as the embodiment of the manufacturing method of the coating die 41 described with reference to FIGS. 10 to 12. After the HIP treatment and hard chromium plating treatment for 43), the entire die material 42 and 43 are subjected to the shape processing to form the final die-shaped coating die 41. You may perform shape processing before. In that case, it is necessary to calculate the residual state of the HIP layer 40 on the die materials 42 and 43 and the residual state of the hard chromium plating layer 50, and then perform shape processing.

As described above, the shape processing of the die material including the portion of the HIP layer 40 before the hard chromium plating process is performed after hard machining of the die flow from the resin flow port to the leading edge of the outlet port. Plating treatment is performed. In this case, considering the remaining amount of the hard chromium plating layer, machining or grinding processing before plating treatment is performed (see (b-1) and (b-2) in FIG. 11). After hard chrome plating, the hard chrome plating layer 50 and the HIP layer 40 are ground to one surface, as described in FIGS. 12B and 12B, and the mirror polishing and mirror surfaces are processed. The lapping process may be performed. The hard chromium plating treatment portion can also be mirror-processed by buffing the three-dimensional manifold portion, the molten resin or the flow portion of the coating liquid.

According to the T-die 31 and the coating die 41 which concern on this invention demonstrated above, the lip | rip part 36 of the die | dye main body 34 carries out the alloy powder which is excellent in corrosion resistance and abrasion resistance by HIP treatment, The base material of the die | dye main body 34 And the HIP layer 40 diffusion-bonded to an arbitrary thickness, the structure of the lip 8 is densified by HIP treatment of the alloy powder, and pores do not remain inside like the cemented carbide sintered body. In addition, no pinholes are generated during grinding or lapping, there is no decrease in the strength of the joints, no occurrence of coupling defects, and the surface roughness of the lip portion 36 is greatly improved, and the lip inlet 47 of the lip portion 36, which is an edge portion, is formed. It can be finished with sharp edges of 1μm. In addition, the surface roughness of the lip part 6 can be finished by Ry 0.1 micrometer in the lip inlet 47 which is the edge part of the lip part 36, and can further refine the surface roughness in lapping finish.

In addition, if all of the die flow paths 35 of the die main body 34 are formed by the HIP layer 40, the manufacturing cost of the die will be very high, but as with the dies 31 and 41 according to the present invention, Only the lip portion 36 is formed by the HIP layer 40, and the inner wall surface of the die body 34, which forms the die flow path 35 other than the lip portion 36, is covered with hard chromium plating, which is much cheaper than the HIP treatment. The manufacturing cost of a die can be reduced.

Hard chromium plating has a small coefficient of friction, is very smooth, hardly adheres to other materials, and is a plating with anti-rusting properties, which reduces the friction of molten resins and coating liquids, even when using highly molten resins or coating liquids. It is possible to use it permanently without causing scratches and abrasions in the liquid contact portion of the flow path 35.

Since the lip portion 36 is formed by the HIP layer 40 in which the alloy powder is diffusion-bonded to the base material of the die body 34 by HIP treatment at an arbitrary thickness, the lip portion 36 is attached to the lip portion formed by attaching a cemented carbide material. The bonding strength with the base material is greatly increased. In addition, since the HIP layer 40 forming the lip portion 36 has a thickness of at least several millimeters to several tens of millimeters, the HIP layer 40 can be repeatedly used by maintenance grinding, and can be processed any number of times until the HIP layer 40 disappears. can do. Hard chromium plating layer 50 is inexpensive and recoverable.

In the above embodiment, the hard chromium plating layer 50 is coated on the inner wall surface of the die main body 34 forming the die flow paths 35 other than the lip portion 36. You may coat | cover a nickel plating layer on the inner wall surface of the die main body 34 which forms the die flow path 35 other than the lip | rip part 36 by nickel plating process. The electroless nickel plating process is a plating process without using electricity, and since the film thickness of the plating becomes uniform, it is suitable for having a complicated shape and dimensional accuracy if immersed in the plating liquid. The plating layer formed by this electroless nickel plating treatment has good adhesion to the base material, uniform plating film thickness, excellent wear resistance equivalent to that of the hard chromium plating layer 50, and excellent corrosion resistance.

One… Potter Die
2… Upper die
3 ... Lower die
4… Die body
5 ... Die euro
6 ... Coating liquid supply passage
7 ... Manifold
8… Lip
9 ... Liner
10... Lip euro part
11 ... Lip entrance
12, 13 ... Die material
14 ... Concave for Alloy Powder
18 ... capsule
19 ... Alloy powder
20... HIP layer
24, 25... Concave for Alloy Powder
31 ... Potter Die
32 ... Upper die member
33 ... Lower die member
34 ... Die body
35 ... Die euro
36 ... Lip
37 ... Manifold
39 ... Lip euro part
40 ... HIP layer
41 ... Potter Die
42, 43... Die material
50 ... Hard Chrome Plating Layer

Claims (12)

A die is provided at the front end side of the die flow path formed in the die body, and discharges the coating liquid or molten resin supplied from the die flow path from the lip part, wherein at least the lip part has an excellent corrosion resistance and wear resistance. A die, which is formed of a HIP layer which is directly diffusion-bonded to a base material of a die main body by pressure release pressure) processing. The die according to claim 1, wherein the alloy powder to be HIP-treated is made of a nickel-based alloy or a cobalt-based alloy. The die according to claim 1, wherein the base material of the die body is made of austenite / ferrite two-phase stainless steel. 2. The die according to claim 1, wherein a hard chromium plating layer or an electroless nickel plating layer is formed on the inner wall of the die body forming the die passages other than the lip portion. A lip part is provided at the front end side of a die flow path formed in a die body, and the die manufacturing method which discharges the coating liquid or molten resin supplied to the said die flow path from a lip part at least has a favorable corrosion resistance and abrasion resistance by HIP treatment. An alloy powder is formed by the HIP layer bonded directly to the base material of a die main body, The manufacturing method of the die characterized by the above-mentioned. 6. The capsule according to claim 5, wherein a capsule made of a die material having a recess for the alloy powder is formed, and the alloy powder recess of the die material of the capsule is filled with an alloy powder having good corrosion resistance and abrasion resistance, and the capsule is filled with the HIP device. HIP treatment is carried out at a high temperature and high pressure in a processing chamber to form a HIP layer in which the alloy powder is directly diffusion-bonded to a die material, and the die body is formed by machining the die material and the HIP layer. A die manufacturing method is formed in the die. The upper die and the lower die are formed by cutting and removing unnecessary portions of the upper die material and the lower die material, respectively, in which the HIP layer is formed by HIP processing, and the butting surfaces of both the upper and lower dies are cut. The die body is formed by abutting the abutment surfaces of the upper die and the lower die formed in this way, and the die flow path is formed in the die body by integrally fastening both the upper and lower dies while the liner is sandwiched between the abutment surfaces. The manufacturing method of the die characterized by the above-mentioned. 7. The die according to claim 6, wherein the recess for the alloy powder is formed in a shape that is three-dimensionally curved or bent, and forms a die flow path in the die body that is three-dimensionally bent or bent. Method of preparation. The die manufacturing method according to claim 5, wherein a hard chromium plating layer or an electroless nickel plating layer is formed on the inner wall of the die body forming the die flow paths other than the lip portion. 10. The hard cut portion according to claim 9 is subjected to an undercut treatment of the required cut amount in order to perform hard chromium plating treatment or electroless nickel plating treatment on the inner surface side surfaces of the die material other than the HIP layer serving as the lip portion. A chromium plating layer or an electroless nickel plating layer is formed, The die manufacturing method characterized by the above-mentioned. The said undercut part contains a part of HIP layer, and the hard chromium plating layer or the electroless nickel plating layer is formed over the whole inner surface side of the die material which performed the undercut process, and a part of HIP layer. Method for producing a die. 12. The hard chromium plating layer or the electroless nickel plating layer on the inner side of the die material after forming a hard chromium plating layer or an electroless nickel plating layer over the entire portion of the inner surface side of the die material and the HIP layer forming the ribs. The die manufacturing method characterized by cutting the HIP layer forming the lip on one surface.

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