JP2019171627A - Manufacturing method of honeycomb structure forming die, honeycomb structure forming die, and manufacturing method of honeycomb structure - Google Patents

Abstract

To provide a manufacturing method of a honeycomb structure forming die having a high degree of freedom of design such as a shape, a high material yield, and high productivity, a honeycomb structure forming die, and a manufacturing method of a honeycomb structure.SOLUTION: A manufacturing method of a honeycomb structure forming die having a backside hole for introducing a forming raw material and a slit for communicating with the backside hole to extrude the forming raw material into a honeycomb structure incudes a step of forming the honeycomb structure forming die by an additive manufacturing method and a step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of a region constituting the backside hole and the slit of the honeycomb structure forming die.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a die for forming a honeycomb structure, a die for forming a honeycomb structure, and a method for manufacturing a honeycomb structure. In particular, the present invention relates to a method for manufacturing a die for forming a honeycomb structure suitable for an additive manufacturing method, a die for forming a honeycomb structure, and a method for manufacturing a honeycomb structure.

Conventionally, as a method for manufacturing a ceramic honeycomb structure, a honeycomb including a die base body in which a back hole for introducing a forming raw material (kneaded material) and a lattice-shaped slit communicating with the back hole is formed. A method of extrusion molding using a structure molding die has been widely performed.
For forming the slits of the honeycomb structure forming die, for example, when they are arranged in a square shape, they are not arranged on the same line, such as grinding with a grindstone, a hexagonal shape or a combination of a square-octagonal shape, etc. In this case, die-sinking electric discharge machining using electrodes is used.
In order to form such a back hole of the die for forming a honeycomb structure, for example, cutting using a drill or a reamer tool, electric discharge using an electrode, or the like is used.

  In Patent Document 1, when a groove is formed in a plate-like member for forming a back hole, the minimum width of the columnar part defined by the groove and the height of the columnar part are defined in a specific range. Accordingly, it has been proposed to provide a die for forming a honeycomb structure and a method for manufacturing the same, which realize high moldability and are difficult to peel off the two plate-like members constituting the die base.

  In addition, a method of performing slit formation as a gap between assembled members is also known (Patent Document 2). In such a honeycomb structure forming die, a plurality of elongated wires are bundled and joined to form an introduction layer having an introduction hole into which material is introduced on one end side, and the formed body is extruded on the other end side. A molding layer having a molding groove to be formed is formed.

Japanese Patent No. 5361224 Japanese Patent No. 3585815

  Depending on the processing method described in Patent Document 1, there may be a restriction on the design shape. In addition, since a method using a rotary tool is used in a grinding process or the like necessary for forming the slit and the back opening, the hole cross-sectional shape is restricted to a round shape. Moreover, in such a processing method, it is generally performed from a plate-like material, and the material yield is poor by performing processing to remove most of the material. Further, since a plurality of different facilities are used in the manufacture of the honeycomb structure forming die, the total manufacturing lead time becomes long, which is not preferable in terms of productivity.

  In the method described in Patent Document 2, the structure of bundling and joining a plurality of elongated wires is complicated, which increases production costs and tends to increase accumulated errors, and ensures necessary accuracy. It becomes difficult.

  In view of the problems of the invention described in the above-mentioned prior art documents, the present invention provides a method for manufacturing a die for forming a honeycomb structure, which has a high degree of design freedom in shape and the like, a high material yield, and a high productivity, and a honeycomb An object is to provide a die for forming a structure and a method for manufacturing a honeycomb structure.

  The present inventors have found that the above problem can be solved by forming a die for forming a honeycomb structure by an additive manufacturing method using a so-called 3D printer and further providing a predetermined plating layer. The invention has been completed. Specifically, the present invention is specified as follows.

(1) A manufacturing method of a die for forming a honeycomb structure having a back hole for introducing a forming raw material, and a slit communicating with the back hole to extrude the forming raw material into the honeycomb structure,
Forming the honeycomb structure forming die by an additive manufacturing method; and
A method of manufacturing a die for forming a honeycomb structure, comprising a step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the portion constituting the back hole and the slit of the die for forming the honeycomb structure.
(2) The method for manufacturing a die for forming a honeycomb structure according to (1), wherein the plating layer has a thickness of 20 to 200 μm.
(3) The honeycomb structure forming die according to (1) or (2), wherein the surface roughness (Ra) of the portion where the plating layer is provided of the die for forming the honeycomb structure is 0.3 to 7 μm. A method of manufacturing the base.
(4) The manufacturing method of the die for forming a honeycomb structure according to (3), wherein the surface roughness (Ra) of the portion where the plating layer is provided of the die for forming the honeycomb structure is 0.3 to 3 μm. .
(5) Furthermore, before providing the said plating layer, the fluid grinding | polishing process which grind | polishes the said die for honeycomb structure shaping | molding by flowing an abrasive fluid into the said back hole and the said slit is included (1)-(4) A method for manufacturing a die for forming a honeycomb structure according to any one of the above.
(6) The surface roughness (Ra) of the part constituting the back hole and the slit of the honeycomb structure forming die before the fluid polishing step is 5 to 20 μm. The method for manufacturing a die for forming a honeycomb structure according to (5), wherein the surface roughness (Ra) of the portion constituting the hole and the slit is 1 to 10 μm.
(7) The method for manufacturing a die for forming a honeycomb structure according to (6), wherein a surface roughness (Ra) of a portion constituting the back hole and the slit is set to 1 to 5 μm by the fluid polishing step.
(8) The manufacturing method of the die for forming a honeycomb structure according to any one of (1) to (7), wherein the plating layer is an electroless Ni plating layer.
(9) A honeycomb structure forming die having a back hole for introducing a forming raw material and a slit communicating with the back hole to extrude the forming raw material into the honeycomb structure, wherein the back hole and the slit A die for forming a honeycomb structure in which at least a part of a portion constituting the substrate is covered with a plating layer having a thickness of 10 to 300 μm, and a surface roughness (Ra) in the portion covered with the plating layer is 0.3 to 7 μm.
(10) The die for forming a honeycomb structure according to (9), which is a sintered body.
(11) The die for forming a honeycomb structure according to (10), which is a sintered body formed by an additive manufacturing method.
(12) The die for forming a honeycomb structure according to any one of (9) to (11), wherein the plating layer has a thickness of 20 to 200 μm.
(13) The die for forming a honeycomb structure according to any one of (9) to (12), wherein a surface roughness (Ra) in a portion covered with the plating layer is 0.3 to 5 μm.
(14) The die for forming a honeycomb structure according to any one of (9) to (13), wherein the plating layer is an electroless Ni plating layer.
(15) The die for forming a honeycomb structure according to any one of (9) to (14), wherein the plating layer is on the outermost surface.
(16) A honeycomb structure forming die is manufactured by the method for manufacturing a honeycomb structure forming die according to any one of (1) to (8), and further, the honeycomb structure is formed using the honeycomb structure forming die. A method for manufacturing a honeycomb structure including a step of extruding a body.
(17) A method for manufacturing a honeycomb structure including a step of extruding a honeycomb structure using the die for forming a honeycomb structure according to any one of (9) to (15).

  According to the present invention, it is possible to design a die with a high degree of freedom, and because it is an additional process, the material yield is good, and the basic structure can be formed with a single facility, so the manufacturing lead time is greatly reduced compared to the conventional method. Is possible.

1 is a perspective view schematically showing a honeycomb structure forming die manufactured according to an embodiment of the present invention. FIG. FIG. 2 is a perspective view showing a honeycomb structure extruded by the honeycomb structure forming die shown in FIG. 1. It is one of the design drawings of the die for forming a honeycomb structure used in the additive manufacturing method in Examples and Comparative Examples.

  Hereinafter, with reference to the drawings, a method for manufacturing a honeycomb structure forming die (hereinafter, also simply referred to as “die”), a honeycomb structure forming die, and a method for manufacturing a honeycomb structure according to the present invention will be described. However, the present invention is not construed as being limited thereto, and various changes, modifications, and improvements can be made based on the knowledge of those skilled in the art without departing from the scope of the present invention. Can be added.

(1. Die for forming honeycomb structure)
In the present invention, a honeycomb structure forming die to be manufactured has a basic structure of a back hole for introducing a forming raw material, and a slit for extruding the forming raw material into the honeycomb structure in communication with the back hole. It is sufficient if it is present, and its specific shape is not limited.
Typically, in one embodiment of the present invention, the honeycomb structure forming die has at least two surfaces 5 and 6 as shown in FIG. A plate-shaped base 2 having a back hole 3 formed and a slit 4 communicating with the back hole 3 on the other surface 6 is provided, and a forming raw material introduced into the back hole 3 is extruded from the slit 4 to form a honeycomb. This is a honeycomb structure forming die 1 for forming a structure 10 (see FIG. 2).

  As will be described later, according to the present invention, since the die design with a high degree of freedom is possible, the die for forming a honeycomb structure to be manufactured may be more complicated than the structure shown in FIG. Good.

  As will be described later, when a honeycomb structure forming die is manufactured by the additive manufacturing method, due to technical restrictions of the additive manufacturing method, the forming raw material and the honeycomb structure forming die are in contact with each other when the honeycomb structure is extruded. In some cases, the unevenness of the surface of the portion constituting the portion to be formed, that is, the back hole and slit of the honeycomb structure forming die is higher than that of the conventional manufacturing method. In this case, there is a problem that the molding raw material does not flow or does not flow as intended, and accurate and uniform flow rate adjustment becomes difficult.

  As a result of further diligent investigation on this problem, the present inventor provided a plating layer having a thickness of 10 to 300 μm on at least a part of the surface of the portion constituting the back hole and slit of the honeycomb structure forming die. It was found that the surface roughness (Ra) at the site was reduced. That is, by providing the plating layer having a thickness of 10 to 300 μm, it is possible to adjust the flow rate accurately and uniformly while enjoying the advantages of a completely new manufacturing method called an additive manufacturing method. It is possible to extrude the honeycomb structure having the. From this point of view, the plating layer is a portion where the forming raw material and the honeycomb structure forming die come into contact when the honeycomb structure is extruded, that is, the portion constituting the back hole and the slit of the honeycomb structure forming die. It is preferable to provide the entire surface.

  When the thickness of the plating layer is thinner than 10 μm, the effect of reducing the surface roughness (Ra) at the site is not sufficient. From this viewpoint, the thickness of the plating layer is more preferably 20 μm or more, and more preferably 30 μm or more. On the other hand, when the thickness of the plating layer is greater than 300 μm, the man-hour required for the plating process increases, and the back hole shrinks, thereby increasing the pressure during extrusion of the honeycomb structure. From this viewpoint, the thickness of the plating layer is more preferably 250 μm or less, and more preferably 200 μm or less.

  Further, from the viewpoint of facilitating the extrusion of the honeycomb structure, it is preferable that the surface roughness (Ra) at the portion where the plating layer is provided is 0.3 to 7 μm. Even if the surface roughness (Ra) is smaller than 0.3 μm, the effect is small, and the difficulty in manufacturing increases, so 0.3 μm is set as the lower limit. From this viewpoint, the surface roughness (Ra) is more preferably 0.5 μm or more, and more preferably 0.7 μm or more. On the other hand, when the surface roughness (Ra) exceeds 7 μm, accurate and uniform flow rate adjustment becomes difficult. From this viewpoint, the surface roughness (Ra) at the portion where the plating layer is provided is more preferably 5 μm or less, and more preferably 3 μm or less.

  In the present invention, the thickness of the plating layer is indicated as a thickness of the plating layer by measuring the back hole or slit width before and after plating with an image measurement microscope and calculating the difference. Specifically, the back hole diameter and the slit gap amount are measured at five locations where the plating layer is arbitrarily provided for each of the back hole and the slit, and an average value thereof is taken.

  The “surface roughness (Ra)” referred to in the present invention is JIS B0601 (2013) “Product Geometrical Specification (GPS) —Surface Properties: Contour Curve Method—Terminology, Definition and Surface Properties Parameters Surface Roughness— It means the surface roughness measured according to “4.2.1 Arithmetic mean height of contour curve” and “Arithmetic mean roughness Ra” in “Definitions and indications”. In the present invention, the reference length L = 4 mm.

  As will be described later, since the present invention also assumes that the die for forming a honeycomb structure is manufactured by an additive manufacturing method, the die for forming a honeycomb structure in this case is a sintered body. Is a sintered body formed by an additive manufacturing method.

  Moreover, the kind of the plating layer is not particularly limited, and for example, electric Ni plating can be employed. Especially, it is preferable to employ | adopt an electroless Ni plating layer from the reason of the uniformity of plating. The method of providing the electroless Ni plating layer is not limited, and can be provided by various known methods.

  Further, the die for forming a honeycomb structure may be coated with an abrasion-resistant material from the viewpoint of extending the life and wear resistance. However, in the present invention, the honeycomb structure is formed by providing a plating layer. It is not always necessary to use such a coating because it can achieve the wear resistance required for the base. That is, in the present invention, the plating layer can be provided on the outermost surface of the die for forming a honeycomb structure.

(2. Manufacturing method of die for forming honeycomb structure)
The method for manufacturing a die for forming a honeycomb structure according to the present invention includes a step of forming the die for forming a honeycomb structure by an additional manufacturing method, and a portion constituting the back hole and the slit of the die for forming the honeycomb structure A step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the substrate.

Typically, a thin layer of metal or alloy powder constituting the die for forming a honeycomb structure is formed, and the powder in the thin layer is solidified by sintering or fusion bonding with an electron beam or a laser to form a shaped article layer The layered object can be manufactured by forming the layer and stacking the layer of the modeled object.
Preferably, a thin layer is formed by spreading a powder of a metal or an alloy constituting the honeycomb structure forming die on the modeling stage, and then the electron beam is irradiated to the portion to be modeled. A honeycomb structure forming die can be manufactured by repeating the process of dissolving the powder and then solidifying by natural cooling a plurality of times.

  According to the additive manufacturing method, it is not necessary to perform processing for removing excess material, or the material yield is remarkably increased as compared with the prior art because it is suppressed to a very small amount. In addition, since the basic structure can be formed with a single facility, the manufacturing lead time can be greatly suppressed as compared with the conventional method.

The material of the metal or alloy constituting the die for forming a honeycomb structure is not limited, and various materials can be selected as necessary. For example, a stainless alloy or a cemented carbide can be used. Stainless steel alloy, for example, SUS630 (C: 0.07 or less, Si: 1.00 or less, Mn: 1.00 or less, P: 0.040 or less, S: 0.030 or less, Ni: 3.00-5. Preferred examples include 00, Cr: 15.50 to 17.50, Cu: 3.00 to 5.00, Nb + Ta: 0.15 to 0.45, Fe: balance (unit: mass%)). .
As the cemented carbide, for example, tungsten carbide is sintered with at least one metal selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), titanium (Ti), and chromium (Cr). A preferred example is a cemented tungsten carbide-based cemented carbide.
Any material can be used in the present invention as long as it can be used in the additive production method.

  In addition, for the above-described reason, after forming the honeycomb structure forming die by the additive manufacturing method, the thickness 10 to 10 so as to cover at least a part of the portion constituting the back hole and the slit of the honeycomb structure forming die. It is necessary to provide a 300 μm plating layer. From this point of view, the plating layer is a portion where the forming raw material and the honeycomb structure forming die come into contact when the honeycomb structure is extruded, that is, the portion constituting the back hole and the slit of the honeycomb structure forming die. It is preferable to provide the entire surface.

  Moreover, the preferable range of the thickness of a plating layer and the surface roughness (Rz) in the site | part in which the said plating layer was provided is as above-mentioned.

Moreover, in order to make it easy to make the surface roughness (Ra) of the surface of the part constituting the back hole or slit of the honeycomb structure forming die after providing the plating layer within the above range, the plating layer It is preferable to include a fluid polishing step of polishing the die for forming a honeycomb structure by flowing an abrasive fluid in the back hole and slit of the die before providing the substrate.
Typically, polishing can be performed by repeatedly passing a fluid (such as oil) containing abrasive grains such as diamond and silicon carbide through a die for forming a honeycomb structure. The composition of the abrasive fluid and the conditions of the polishing step are not limited and can be appropriately selected and changed as necessary.

  From the viewpoint of facilitating setting the surface roughness (Ra) of the portion constituting the back hole or slit of the honeycomb structure forming die after providing the plating layer to the above range, The surface roughness (Ra) of the portion constituting the back hole and slit of the honeycomb structure forming die before the polishing step is 5 to 20 μm, and the portion constituting the back hole and slit of the die is formed by the fluid polishing step. The surface roughness (Ra) is preferably 1 to 10 μm. In particular, if the surface roughness (Ra) of the portion constituting the back hole and slit of the die is set to 1 to 5 μm by the fluid polishing step, it is preferable because the thickness of the plating layer can be reduced.

  As described above, the plating layer is preferably an electroless Ni plating layer. The method for providing the electroless Ni plating layer is not particularly limited, and various known methods can be used. Electroless Ni plating is performed by heating a plating solution containing nickel and a reducing agent such as sodium hypophosphite or sodium borohydride to about 80 to 100 ° C. to plate a die for forming a honeycomb structure. It can be performed by immersing in a liquid for a predetermined time.

(3. Manufacturing method of honeycomb structure)
In one aspect of the method for manufacturing a honeycomb structure of the present invention, a honeycomb structure forming die is manufactured by the method for manufacturing a honeycomb structure forming die of the present invention, and the honeycomb structure forming die is further used. A method for manufacturing a honeycomb structure including a step of extruding the honeycomb structure.

  In one aspect, the method for manufacturing a honeycomb structure of the present invention is a method for manufacturing a honeycomb structure including a step of extruding the honeycomb structure using the honeycomb structure forming die of the present invention.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to a following example.

[composition]
Stainless steel metal powder (Mn: 1.00 or less, Mo: 0.3 or less, Ni: 3.00 to 5.00, Cr: 15.50 to 17.50) is used as a raw material for the die for forming a honeycomb structure. , Cu: 3.00 to 5.00, Fe: 70 to 80 (unit: mass%)) were prepared.

[Additional manufacturing]
The honeycomb structure forming die of each example and comparative example uses a 3D printer ProX300 manufactured by 3D systems, and the above stainless metal powder is formed into a thin layer on the stage, which is irradiated with an electron beam. A powder having a basic structure shown in FIG. 1 was produced by solidifying the powder to form a shaped article layer and repeatedly laminating the shaped article layer. A design drawing of a base used in modeling is shown in FIG.

[Plating layer]
For each example, about the die for forming a honeycomb structure formed by the above-described addition manufacturing,
Fluid polishing is performed using EX-4350 fluid polishing machine EX-4350, degreased, immersed in a 35% hydrochloric acid bath for 1 minute, electroplated in a nickel chloride acidic bath, and immediately after that Electroless plating was performed in a continuous acid plating process in an acid nickel bath, and an electroless Ni plating layer having a thickness shown in Table 1 was provided on the back hole of the die and the surface of the slit. The method for measuring the thickness of the electroless Ni plating layer is as described above.
Note that the surface roughness (Ra) of the back hole and slit of the honeycomb structure forming die before the fluid polishing and the honeycomb structure before the electroless Ni plating layer is provided after the fluid polishing is performed. Table 1 shows the surface roughness (Ra) of the back hole and slit of the body-forming die. The method for measuring the surface roughness (Ra) is as described above.

  When the honeycomb structure is formed by extruding the kneaded clay using the honeycomb structure forming die of each example and comparative example to be manufactured, and a honeycomb structure having the expected properties can be manufactured. Is “◯”. When a honeycomb structure having the expected properties could not be manufactured, “X” was shown, and Table 1 shows the formability.

DESCRIPTION OF SYMBOLS 1 ... Base for honeycomb structure shaping | molding 2 ... Base body 3 ... Back hole 4 ... Slit 5, 6 ... Both surfaces 10 of die for honeycomb structure shaping | molding ... Honeycomb structure 11 ... Partition 12 ... Cell

Claims (17)

A manufacturing method of a die for forming a honeycomb structure having a back hole for introducing a forming raw material, and a slit communicating with the back hole to extrude the forming raw material into the honeycomb structure,
Forming the honeycomb structure forming die by an additional manufacturing method; and
A method for manufacturing a honeycomb structure forming die, comprising a step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the portion constituting the back hole and the slit of the die for forming the honeycomb structure.   The method for manufacturing a die for forming a honeycomb structure according to claim 1, wherein the plating layer has a thickness of 20 to 200 µm.   The method for manufacturing a honeycomb structure forming die according to claim 1 or 2, wherein the honeycomb structure forming die has a surface roughness (Ra) of a portion provided with the plating layer of 0.3 to 7 µm.   The method for manufacturing a die for forming a honeycomb structure according to claim 3, wherein the honeycomb structure forming die has a surface roughness (Ra) of 0.3 to 3 µm at a portion where the plating layer is provided.   Furthermore, before providing the said plating layer, the fluid grinding | polishing process which grind | polishes the said die for a honeycomb structure shaping | molding by flowing an abrasive fluid into the said back hole and the said slit is included in any one of Claims 1-4. Manufacturing method for a honeycomb structure forming die.   The honeycomb structure forming die before the fluid polishing step has a surface roughness (Ra) of the portion constituting the back hole and the slit of 5 to 20 μm. The method for manufacturing a die for forming a honeycomb structure according to claim 5, wherein the surface roughness (Ra) of the portion constituting the slit is 1 to 10 µm.   The method for manufacturing a die for forming a honeycomb structure according to claim 6, wherein a surface roughness (Ra) of a portion constituting the back hole and the slit is set to 1 to 5 µm by the fluid polishing step.   The method for manufacturing a die for forming a honeycomb structure according to any one of claims 1 to 7, wherein the plating layer is an electroless Ni plating layer.   A die for forming a honeycomb structure having a back hole for introducing a forming raw material and a slit communicating with the back hole for extruding the forming raw material into the honeycomb structure, the back hole and the slit being configured A die for forming a honeycomb structure, wherein at least a part of the portion is covered with a plating layer having a thickness of 10 to 300 µm, and the surface roughness (Ra) in the portion covered with the plating layer is 0.3 to 7 µm.   The die for forming a honeycomb structure according to claim 9, wherein the die is a sintered body.   The die for forming a honeycomb structure according to claim 10, which is a sintered body formed by an additive manufacturing method.   The die for forming a honeycomb structure according to any one of claims 9 to 11, wherein the plating layer has a thickness of 20 to 200 µm.   The die for forming a honeycomb structure according to any one of claims 9 to 12, wherein a surface roughness (Ra) at a portion covered with the plating layer is 0.3 to 5 µm.   The die for forming a honeycomb structure according to any one of claims 9 to 13, wherein the plating layer is an electroless Ni plating layer.   The die for forming a honeycomb structure according to claim 9, wherein the plating layer is on the outermost surface.   A honeycomb structure forming die is manufactured by the method for manufacturing a honeycomb structure forming die according to any one of claims 1 to 8, and further the honeycomb structure is extruded using the honeycomb structure forming die. A method for manufacturing a honeycomb structure including the steps.   A method for manufacturing a honeycomb structure, comprising the step of extruding a honeycomb structure using the die for forming a honeycomb structure according to any one of claims 9 to 15.