KR20130097489A - Composition for encapsulating a display device, method of encapsulating a display device, and a display panel - Google Patents

Abstract

PURPOSE: A composition for sealing a display device is provided to provide a display panel with excellent performance by forming an organic material layer hardly influenced by the formation of an inorganic material layer. CONSTITUTION: A composition for sealing a display device includes a monomer, a crosslinking agent capable of crosslinking the monomer, and a photoinitiator. At least one of the monomer or the crosslinking agent includes a silicon-based material including a silicon atom. A display panel includes a substrate; a display device arranged on the substrate; and a sealing layer (130) sealing the display device. The sealing layer includes one or more polymer organic films (133a-133c) including a siloxane group.

Description

TECHNICAL FIELD The present invention relates to a composition for encapsulating a display device, a method for encapsulating a display device, and a display panel.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for encapsulating a display device, a method of encapsulating a display device, and a display panel, and more particularly to a display device encapsulating a display device capable of producing an organic layer with little or no influence A sealing method of a display device, and a display panel manufactured by such a method.

BACKGROUND ART [0002] In the manufacture of display panels, research on encapsulant materials for preventing moisture and oxygen from penetrating outside has been continuously conducted. In particular, thin film encapsulation (TFE) technology, in which an organic film and an inorganic film are alternately stacked, has been used in connection with the development of a display panel having a recent bending characteristic.

The organic film is formed by forming a layer of a monomer composition for an organic film including a photoinitiator and then irradiating light to polymerize it. The inorganic film mostly uses aluminum oxide (Al ₂ O ₃ ) and is formed using a sputtering method, which is a kind of physical vapor deposition (PVD).

Particularly, the (meth) acryl-based polymer is widely used as the polymer used for the formation of the organic film, and the organic film is damaged due to the oxygen plasma generated in the sputtering process, and the surface or interior part of the polymer film is oxidized and / do. Oxygen impurities such as CO ₂ and CO are generated and outgassed to the outside, resulting in deformation due to the thickness change or outgasing toward the display device, thereby deteriorating the characteristics of the device greatly.

A first object of the present invention is to provide a composition for encapsulating a display device capable of forming an organic film which is hardly or not affected by an inorganic film formation process.

A second object of the present invention is to provide a method of encapsulating a display device capable of forming an organic film which is hardly or not affected by an inorganic film formation process.

A third object of the present invention is to provide a display panel having superior performance by forming an organic film which is hardly or not affected by the formation of an inorganic film.

In order to achieve the first technical object, the present invention provides a display device comprising a monomer, a crosslinking agent capable of crosslinking the monomer, and a photoinitiator, wherein at least one of the monomer or the crosslinking agent comprises a silicon- Thereby providing a sealing composition.

The monomer may include a silicone-based monomer. The silicone-based polymer may be a silicone-based (meth) acrylate monomer or a silicone-based vinyl monomer. In particular, the monomer may include a silyl group, a siloxane group, or a silane group. The molecular weight of the monomer may range from about 100 to about 500. In addition, two or more alkyl groups of 1 to 2 carbon atoms may be bonded to the silicon of the monomer.

Alternatively, the monomer may be selected from the group consisting of (meth) acryloxymethyltrimethylsilane, 2- (trimethylsiloxy) ethyl (meth) acrylate, (meth) acryloxypropylpentamethyldisiloxane, (Meth) acryloxypropyltris (trimethylsiloxy) silane, (meth) acryloxypropylheptaisobutyl-T8-silsesquioxane, 3 - ((meth) acryloyloxy) propyl tri (Meth) acryloyloxy) propyltriethoxysilane, 3 - ((meth) acryloyloxy) propyltripropoxysilane, {3- Propyl} methyldimethoxysilane, {3- ((meth) acryloyloxy) propyl} methyldiethoxysilane, {3- ((meth) acryloyloxy) (Meth) acryloyloxy) butyl} phenyldimethoxysilane, {4- ((meth) acryloyloxy) butyl} phenyldiethoxysilane, {3- (Meth) acryloxypropyl} dimethyldimethoxysilane, {3 - ((meth) acryloyloxy) propyl} phenyldipropoxysilane, (Meth) acryloyloxy) propyl} phenylmethylmethoxysilane, {3 - ((meth) acryloyloxy) propyl} phenylmethylethoxysilane or γ- (meth) acryloxypropyltrimethoxy Silane.

When the monomer is a silicone-based monomer, the composition for encapsulating a display device may include 15 to 65 molar parts of a silicon-based monomer and 35 to 85 molar parts of a crosslinking agent per 100 molar parts of the monomer and the crosslinking agent. The composition for encapsulating a display device may contain an initiator in an amount of 1 to 7 moles per 100 moles of the monomer and the crosslinking agent.

Optionally, the crosslinking agent may comprise a silicone based crosslinking agent. The crosslinking agent may include a silyl group, a siloxane group or a silane group. The molecular weight of the crosslinking agent may be from about 200 to about 800.

The crosslinking agent may be a (meth) acrylic group, or a compound having two or more vinyl groups. The crosslinking agent may be at least one selected from the group consisting of 1,3-bis ((meth) acryloxypropyl) tetramethyldisiloxane, 1,3-bis ((meth) acryloxypropyl) ) Acryloxypropyl) tetrakis (trimethylsiloxy) disiloxane, 1,3-bis ((meth) acryloxy) -2-trimethylsiloxypropane, 1,3,5,7- 5,7-tetramethylcyclotetrasiloxane, tris (vinyldimethylsiloxy) methylsilane, or 1,3,5-trivinyl-1,1,3,5,5-pentamethyltrisiloxane.

When the crosslinking agent is a silicone crosslinking agent, the composition for encapsulating the display device may contain 30 to 70 parts by mole of the monomer and 30 to 70 parts by mole of the silicone crosslinking agent per 100 parts by mole of the monomer and the crosslinking agent.

According to another aspect of the present invention, there is provided a method of manufacturing a display device, comprising: forming a metal oxide layer on a substrate on which a display device is disposed; Forming a layer of a composition for encapsulating a display device of claim 1 on the layer of metal oxide; Applying energy to the layer of the composition for encapsulating a display device to cause an initiation reaction to initiate a polymerization reaction of the composition for encapsulating the display device; And forming a layer of a metal oxide on the layer of the polymerized composition for encapsulating the display device. At this time, the step of forming a layer of the composition for encapsulating a display device, the step of applying energy, and the step of forming a layer of a metal oxide on the layer of the polymerized composition for sealing a display device may be repeated at least twice.

The metal oxide may be aluminum oxide (Al ₂ O ₃ ). In addition, forming the layer of metal oxide may include generating an oxygen plasma.

According to a third aspect of the present invention, A display device disposed on the substrate; And a sealing layer for sealing the display device, wherein the sealing layer comprises one or more polymer organic layers including a siloxane group. The sealing layer may include a structure in which an inorganic film and a polymer organic film are alternately stacked two or more times.

By using the composition for encapsulating a display device and the encapsulation method for a display device according to the present invention, it is possible to form an organic film which is hardly or not affected by the formation process of an inorganic film, and thus a display panel with superior performance can be manufactured.

1 is a side cross-sectional view conceptually showing a display panel according to an embodiment of the present invention.
2 is a side cross-sectional view illustrating an encapsulation layer according to one embodiment of the present invention.
3A to 3D are side cross-sectional views sequentially illustrating a method of manufacturing an encapsulation layer according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. However, embodiments of the inventive concept may be modified in various other forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the inventive concept are preferably interpreted as being provided to those skilled in the art to more fully describe the inventive concept. The same reference numerals denote the same elements at all times. Further, various elements and regions in the drawings are schematically drawn. Accordingly, the inventive concept is not limited by the relative size or spacing depicted in the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and conversely, the second component may be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the expressions "comprising" or "having ", etc. are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, It is to be understood that the invention does not preclude the presence or addition of one or more other features, integers, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs, including technical terms and scientific terms. In addition, commonly used, predefined terms are to be interpreted as having a meaning consistent with what they mean in the context of the relevant art, and unless otherwise expressly defined, have an overly formal meaning It will be understood that it will not be interpreted.

1 is a side cross-sectional view conceptually showing a display panel 100 according to an embodiment of the present invention.

Referring to FIG. 1, a display device 120 is disposed on a substrate 110, and the display device 120 is covered with an encapsulating layer 130. The substrate 110 may be a glass substrate, but may in particular be a flexible polymer substrate. For example, the flexible polymer substrate may include, but is not limited to, polyimide, polycarbonate, polyethersulfone, polyethylene, polyethylene naphthalate, or polyethylene terephthalate. Alternatively, the substrate 110 may be a metal substrate such as SUS, aluminum, or copper.

The display device 120 may be a display device such as an LCD device, an OLED device, or the like. For example, the display device 120 may include an anode layer, an organic layer, and a cathode layer that are sequentially stacked.

The anode layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc indium-tin oxide (ITO-Ag-ITO), indium-zinc oxide-silver-indium-zinc oxide (IZO-Ag-IZO), indium- (IZTO-Ag-IZTO), or aluminum-zinc oxide-silver-aluminum-zinc oxide (ATO-Ag-ATO). The anode layer may transmit the electrons to the organic layer when a predetermined positive voltage is applied.

In addition, the organic material layer may include a hole injection layer (HIL), a hole transporting layer (HTL), an emitting layer (ETL), an electron transporting layer (ETL) And an electron injection layer (EIL).

The cathode layer may be a metal electrode, and electrons may be supplied to the organic layer when a predetermined negative voltage is applied. For example, the cathode layer may be formed of a laminate of lithium fluoride and aluminum (LiF / Al), a laminate of calcium and aluminum (Ca / Al), a laminate of calcium and silver (Ca / Ag) And / or gold.

Other configurations of the display device 120 are well known in the art and will not be described in detail.

The encapsulation layer 130 is an encapsulation layer in which an organic layer and an inorganic layer are alternately stacked. The encapsulation layer 130 will be described with reference to FIG. 2, which is a side sectional view showing the encapsulation layer 130 according to an embodiment of the present invention.

Referring to FIG. 2, an inorganic film 131d is formed on the lowermost portion of the sealing layer 130. The inorganic film 131d may be a layer in direct contact with the substrate 110 (see FIG. 1) and the display device 120 (see FIG. 1). The inorganic layer (131d) may include may include a metal oxide and, for example, aluminum oxide (Al ₂ O _3). The inorganic layer 131d may be formed by sputtering, chemical vapor deposition (CVD), metal organic chemical vapor deposition (MO-CVD), plasma enhanced chemical vapor deposition -enhanced chemical vapor deposition (PE-CVD), or the like. However, it is not limited thereto.

The organic films 133a, 133b, and 133c and the inorganic films 131a, 131b, and 131c may be alternately stacked on the inorganic film 131d. The inorganic films 131a, 131b, and 131c may be formed of the same material as the inorganic film 131d. The organic films 133a, 133b, and 133c are formed by forming a monomer composition layer on the inorganic films 131d, 131a, and 131b, respectively, and then supplying energy such as light or heat thereto to polymerize the monomers . This will be described in detail later. Although the organic films 133a, 133b and 133c and the inorganic films 131a, 131b and 131c are alternately laminated three times in FIG. 2, the number of the organic films 133a, 133b and 133c and the number of the inorganic films 131a, It is possible.

The organic layers 133a, 133b, and 133c may include a polymer layer including a siloxane group (-Si-O-). In particular, the organic layers 133a, 133b, and 133c may include a (meth) acryl-based polymer layer containing a siloxane group.

For example, the organic layers 133a, 133b, and 133c may be a layer formed by photopolymerizing and / or thermally polymerizing a composition for encapsulating a display device according to an embodiment of the present invention. Hereinafter, the monomer composition for encapsulating a display device for manufacturing the organic films 133a, 133b, and 133c will be described in detail.

The monomer composition may include a monomer for forming a polymer by polymerization, a crosslinking agent for allowing the monomers to crosslink with each other, and an initiator for initiating polymerization of the monomer.

The initiator may be a photoinitiator, for example, benzoin; Benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin phenyl ether; Benzoin acetate; Acetophenones such as acetophenone, 2,2-dimethoxyacetophenone, 4- (phenylthio) acetophenone, and 1,1-dichloroacetophenone; Benzyl ketalation such as benzyl dimethyl ketal and benzyl diethyl ketal; Anthraquinones such as 2-methyl anthraquinone, 2-ethyl anthraquinone, 2-tertiary butyl anthraquinone, 1-chloro anthraquinone and 2-amylanthraquinone; Triphenylphosphine; Benzoylphosphine oxides such as diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide and phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide; Benzophenones such as benzophenone, dimethoxybenzophenone, diphenoxycibenzophenone, and 4,4'-bis (N, N'-dimethylamino) benzophenone; 1-aminophenyl ketone compounds; 1-hydroxyphenyl ketones such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-1- {4- (2-hydroxyethoxy) phenyl} -2-methyl-1-propanone; Triazine compounds, and the like, but are not limited thereto.

The initiator may also be a thermal initiator, for example, azobisisobutyronitrile, benzoyl peroxide, dicumyl peroxide, 2,2'-azobis (4-methoxy-2,4 -Dimethylvaleronitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobisisobutyronitrile, 2,2'-azobis (2-methylbutyro Nitrile), 1,1'-azobis (cyclohexane-1-carbonitrile), 2,2'-azobis (N-butyl-2-methylpropionamide), 2,2'- Hexyl-2-methylpropionamide), tertiary butyl peroxide, ditertiary amyl peroxide, methyl ethyl ketone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, 1,1- (T-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, , 1-azobiscyanocyclohexane, 1,1-bis (t-butylperoxy ) Cycloalkyl FIG decane, tert-butyl peroxybenzoate or the like diisopropyl peroxydicarbonate, but is not limited to it.

The monomer may include a silicon-based monomer containing a silicon atom in the molecule. In particular, the monomer may be a monomer containing a (meth) acrylic group or a vinyl group, and may be a silicone-based (meth) acrylate monomer or a silicone-based vinyl monomer including silicon as the (meth) Silicon-based monomers. The silicon atom may be contained in the monomer in the form of a silyl group, a siloxane group or a silane group.

The monomer may have a molecular weight of from about 100 to about 500. If the molecular weight of the monomer is too high, it may not evaporate well in a flash evaporation process performed for monomer deposition. If the molecular weight of the monomer is too small, the vapor pressure may be too high and the deposition may not occur. However, the molecular weight of the monomer is not limited to the above numerical range.

In particular, the monomer may have two or more alkyl groups of 1 to 2 carbon atoms bonded to the silicon atom.

Examples of the silicone (meth) acrylate monomer having a (meth) acryl group include (meth) acryloxymethyltrimethylsilane, 2- (trimethylsiloxy) ethyl (meth) acrylate, (Meth) acryloxypropylbis (trimethylsiloxy) methylsilane, (meth) acryloxypropyltris (trimethylsiloxy) silane, (meth) acryloxypropylheptaisobutyl-T8-silsesquioxane (Meth) acryloyloxy) propyltrimethoxysilane, 3 - ((meth) acryloyloxy) propyltrimethoxysilane, 3- (Meth) acryloyloxypropyl} methyldiethoxysilane, {3 - ((meth) acryloyloxy) propyl} methyldimethoxysilane, (4 - ((meth) acryloyloxy) butyl} phenyldimethoxysilane, {4- ( (Meth) acryloyloxy) propyl} phenyldipropoxysilane, {3 - ((meth) acryloyloxy) propyl} phenyldiethoxysilane, (Meth) acryloyloxypropyl} dimethyldimethoxysilane, {3 - ((meth) acryloyloxy) propyl} phenylmethylmethoxysilane, {3- ) Propyl} phenylmethylethoxysilane, and gamma- (meth) acryloxypropyltrimethoxysilane. However, it is not limited to these monomers.

The vinyl-based monomer having vinyl group may include, for example, vinylsilane-based monomer such as vinyltrimethoxysilane and vinyltriethoxysilane. However, it is not limited to these monomers.

The crosslinking agent may be a compound containing two or more (meth) acrylic groups or vinyl groups. The crosslinking agent may include a silicone crosslinking agent, for example, a silicone crosslinking agent including a silyl group, a siloxane group or a silane group.

The molecular weight of the crosslinking agent may be from about 200 to about 800. If the molecular weight of the crosslinking agent is too high, it may not evaporate well in a flash evaporation process performed for composition layer deposition as in the monomers described above. If the molecular weight of the cross-linking agent is too small, the vapor pressure may be too large to cause the deposition to occur. However, the molecular weight of the crosslinking agent is not limited to the above-mentioned numerical range.

The silicone-based crosslinking agent may include, for example, a diol di (meth) acrylate crosslinking agent or a purryl (meth) acrylate crosslinking agent. More specifically, the silicone-based crosslinking agent may be, for example, 1,3-bis ((meth) acryloxypropyl) tetramethyldisiloxane, 1,3-bis ((meth) acryloxypropyl) ((Meth) acryloxypropyl) tetrakis (trimethylsiloxy) disiloxane, 1,3-bis ((meth) acryloxy) Tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, tris (vinyldimethylsiloxy) methylsilane, or 1,3,5-trivinyl-1,1,3,5,5-penta Methyltrisiloxane, and the like. However, it is not limited thereto.

In the composition for encapsulating a display device, either the monomer or the crosslinking agent may include silicon, and both the monomer and the crosslinking agent may include silicon.

Examples of the silicone-free crosslinking agent that can be used in the composition for encapsulating a display device include tricyclodecane dimethanol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, Acrylates such as ethylene glycol di (meth) acrylate, dicyclopentenyl di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, neopentyl glycol di (Meth) acrylate, 1,4-butanediol (meth) acrylate, tetraethylene glycol di (meth) acrylate, trimethanol propane tri (meth) acrylate, ethylene oxide PO) modified trimethanol propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol tetra (meth) acrylate, EO-modified bisphenol A di Acrylate, PO-modified bisphenol A di (meth) acrylate, or 1,12-dodecanediol di (meth) acrylate. However, it is not limited thereto.

Examples of the monomer that does not contain silicon that can be used in the composition for encapsulating a display device include lauryl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-ethylhexyl (meth) Acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl (meth) acrylate, 2-tetrachlorophenoxy (meth) acrylate, dicyclopentadiene (Meth) acrylate, 2-trichlorophenoxyethyl (meth) acrylate, tetrabromophenyl (meth) acrylate, 2-tetrabromophenoxyethyl (Meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2- , It may be used, such as pentachlorophenyl (meth) acrylate, penta-bromophenyl (meth) acrylate, or isobornyl (meth) acrylate (isobornyl (meth) acrylate). However, it is not limited thereto.

When the composition for encapsulating a display device comprises a silicone-based monomer, the display device encapsulating composition may contain 15 to 65 molar parts of the silicone monomer and 35 to 85 molar parts of the crosslinking agent per 100 molar parts of the monomer and the crosslinking agent. At this time, the composition may contain 1 mole part to 7 mole part of a photo initiator per 100 mole part of the monomer and the crosslinking agent. If the content of the silicone-based monomer is too low, the effect of preventing damage caused by the oxygen plasma is not obtained and it may be difficult to achieve the object of the present invention. If the content of the silicone-based monomer is too high, the effect of preventing damage caused by the oxygen plasma is strengthened. However, aggregation may occur at the time of vapor deposition of the composition, and adhesion properties to the lower film quality may deteriorate.

When the composition for encapsulating a display device includes a silicone crosslinking agent, the display device encapsulating composition may include 30 to 70 parts by mole of the monomer and 30 to 70 parts by mole of the silicone crosslinking agent per 100 parts by mole of the monomer and the crosslinking agent. At this time, the composition may contain 1 mole part to 7 mole part of a photo initiator per 100 mole part of the monomer and the crosslinking agent. If the content of the silicone-based crosslinking agent is too low, the effect of preventing damage caused by the oxygen plasma is not obtained and it may be difficult to achieve the object of the present invention. If the content of the silicone-based crosslinking agent is too high, the effect of preventing damage caused by oxygen plasma is strengthened. However, aggregation may occur during deposition of the composition, and adhesion properties to the lower film quality may be deteriorated.

Hereinafter, a method of manufacturing the sealing layer 130 will be described with reference to the drawings. FIGS. 3A to 3D are side cross-sectional views sequentially illustrating a manufacturing method of the sealing layer 130. FIG. 3A, an inorganic film 131d is formed on a substrate 110 (see FIG. 1) on which a display device 120 (see FIG. 1) is disposed. The material of the inorganic film 131d and the manufacturing method thereof have been described with reference to FIG. 2, so that detailed description thereof will be omitted.

Then, the display device encapsulating composition layer 133 'is formed on the inorganic film 131d. In order to form the display device encapsulating composition layer 133 'on the inorganic film 131d, the pressure inside the chamber is set to a high vacuum of less than about 100 mTorr and the composition is heated to about 150 ° C to 250 ° C to flash evaporate flash evaporation. Then, the composition may be condensed and deposited on the surface of the inorganic film 131d to form a display device encapsulating composition layer 133 '.

Then, energy can be supplied to the display device encapsulating composition layer 133 'to cause a polymerization reaction. When a photoinitiator is contained in the composition, a polymerization reaction can be initiated by supplying light (hv). When a thermal initiator is contained in the composition, heat can be supplied to initiate the polymerization reaction.

The polymerization reaction may be performed after forming the display device encapsulating composition layer 133 'or may be performed simultaneously with formation of the display device encapsulating composition layer 133'. When the polymerization reaction is performed simultaneously with the formation of the display device encapsulating composition layer 133 ', light and / or heat may be continuously irradiated and / or supplied to the position where the composition is deposited.

Referring to FIG. 3B, the inorganic film 131a is formed on the organic film 133a formed by the completion of the polymerization reaction by sputtering, chemical vapor deposition (CVD), metal organic chemical vapor deposition deposition, MO-CVD, plasma-enhanced chemical vapor deposition (PE-CVD), or the like. The inorganic film (131a), for example, as aluminum oxide (Al ₂ O _3).

Referring to FIG. 3C, the display device encapsulating composition layer 133 'is formed again on the inorganic film 131a. Since the method of forming the display device encapsulating composition layer 133 'has been described in detail in the description of FIG. 3A, detailed description thereof will be omitted here.

Referring to FIG. 3D, the inorganic film 131b is formed on the organic film 133b obtained by polymerizing the display device encapsulating composition layer 133 '. The method of forming the inorganic film 131b has been described in detail with reference to FIG. 3B, and a detailed description thereof will be omitted here.

By repeating the above-described processes, the display panel sealed with the sealing layer 130 having a desired thickness can be manufactured.

Hereinafter, the constitution and effects of the present invention will be described in more detail with reference to specific experimental examples and comparative examples. However, these experimental examples are only intended to clarify the present invention and are not intended to limit the scope of the present invention.

Experimental Example I-Synthesis of silicone-based monomer

<Experimental Example 1>

20 moles of methacryloxymethyltrimethylsilane and 30 moles of 2- (trimethylsiloxy) ethylmethacrylate were used as a silicone monomer, and 50 moles of tricyclodecane dimethanol diacrylate was used as a crosslinking agent. As a photoinitiator, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used to prepare a monomer composition. Then, a layer of the monomer composition was formed on the aluminum oxide film formed on the polyimide film in a vacuum of 200 DEG C by a flash evaporation method, and then the monomer composition was irradiated with light of 390 nm to polymerize the monomer composition The thickness of the polymer film was measured.

Then, the oxygen plasma was treated for 30 seconds while being supplied at a pressure of 0.5 mTorr and a flow rate of 50 sccm, and left at normal pressure for 24 hours, and then the thickness of the polymer film was measured. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 2>

The experiment was conducted under the same conditions as Experimental Example 1, except that the plasma treatment time for the polymer film was set to 60 seconds. As a result, it was measured that the thickness of the polymer film decreased by 50 Å.

&Lt; Comparative Example 1 &

Except that 30 molar parts of lauryl acrylate and 20 molar parts of trimethylol propane were used as monomers, and 50 mol parts of 1,12-dodecanediol dimethacrylate was used as a crosslinking agent. As a result, it was measured that the thickness of the polymer film decreased by 100 Å.

Comparative Example 2

The experiment was conducted under the same conditions as in Comparative Example 1, except that the plasma treatment time for the polymer film was set to 60 seconds. As a result, it was measured that the thickness of the polymer film decreased by 150 ANGSTROM.

Comparing Experimental Example 1, Experimental Example 2, and Comparative Example 1 and Comparative Example 2, it can be seen that the polymer film formed by using the silicon-based monomer for the plasma treatment at the same time is superior to the polymer film formed by using the monomer containing no silicon Less damage can be seen.

<Experimental Example 3>

Except that 30 parts by weight of methacryloxymethyltrimethylsilane and 20 parts by weight of methacryloxypropylpentamethyldisiloxane were used as the monomers. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 4>

Except that 20 mol parts of methacryloxymethyltrimethylsilane and 20 mol of 3-methacryloxypropylbis (trimethylsiloxy) methylsilane were used as monomers and 60 mol of tricyclodecane dimethanol diacrylate was used as a crosslinking agent Experiments were carried out under the same conditions as in Experimental Example 1. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 5>

20 parts by mol of methacryloxymethyltrimethylsilane and 10 parts by mol of methacryloxypropyltris (trimethylsiloxy) silane as monomers were used, and 40 parts by mol of tricyclodecanedimethanol diacrylate and 1,6-hexanediol diacrylate And 30 parts by weight of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator and 2 parts by mol of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator. As a result, it was measured that the thickness of the polymer film decreased by 35 Å.

<Experimental Example 6>

20 parts by mol of methacryloxymethyltrimethylsilane, 20 parts by mol of methacryloxypropyltris (trimethylsiloxy) silane and 25 parts by mol of tetrahydrofurfuryl acrylate were used as monomers, and 35 parts by mol of tricyclodecanedimethanol diacrylate as a crosslinking agent And 2 parts by mol of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 7>

40 molar parts of methacryloxypropyltris (trimethylsiloxy) silane and 25 molar parts of tetrahydrofurfuryl acrylate as monomers and 35 molar parts of tricyclodecanedimethanol diacrylate as a crosslinking agent were used, and diphenyl (2,4 , 6-trimethylbenzoyl) phosphine oxide was used as the initiator. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 8>

40 moles of methacryloxypropyltris (trimethylsiloxy) silane and 20 moles of lauryl acrylate as a monomer, and 40 moles of tricyclodecane dimethanol diacrylate as a cross-linking agent were added, and diphenyl (2,4,6 -Trimethylbenzoyl) phosphine oxide was used instead of 2-methyl-2-pyrrolidone. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 9>

20 moles of methacryloxypropylheptaisobutyl-T8-silsesquioxane and 30 moles of tetrahydrofurfuryl acrylate as monomers and 50 moles of tricyclodecane dimethanol diacrylate as a crosslinking agent were used, and as a photoinitiator, diphenyl (2, 4, 6-trimethylbenzoyl) phosphine oxide was used as the initiator. As a result, it was measured that the thickness of the polymer film decreased by 35 Å.

<Experimental Example 10>

40 molar parts of methacryloxypropyltris (trimethylsiloxy) silane and 20 molar parts of tetrahydrofurfuryl acrylate as monomers and 40 mol of 1,6-hexanediol diacrylate as a crosslinking agent were used, and phenyl bis (2, 4,6-trimethylbenzoyl) phosphine oxide was used as the initiator. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

&Lt; Experimental Example 11 &

40 molar parts of methacryloxypropyltris (trimethylsiloxy) silane and 20 molar parts of lauryl acrylate as crosslinking agents, 40 molar parts of tricyclodecane dimethanol diacrylate as a crosslinking agent, 2,2'-azobis (2-methyl Propionitrile) were used in place of 4 parts by weight of the compound of the present invention. As a result, it was measured that the thickness of the polymer film decreased by 25 Å.

<Experimental Example 12>

40 molar parts of tetraethylene glycol diacrylate as a crosslinking agent and 4 molar parts of 4,4'-bis (N, N (methacryloyloxy) propyltrimethoxysilane and 20 molar parts of lauryl acrylate as a monomer) '-Dimethylamino) benzophenone was used in place of 2-methyl-2-pyrrolidone. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 13>

50 molar parts of {4- (methacryloyloxy) butyl} phenyldimethoxysilane as a monomer, 50 molar parts of pentaerythritol tetramethacrylate as a crosslinking agent, phenyl bis (2,4,6-trimethylbenzoyl) phosphine Oxide was used in an amount of 2.5 parts by weight. As a result, it was determined that the thickness of the polymer film decreased by 15 Å.

<Experimental Example 14>

Methacryloxypropyltrimethoxysilane and 30 molar parts of 2- (trimethylsiloxy) ethyl acrylate as a monomer, 40 molar parts of ethylene oxide (EO) -modified trimethanolpropane tri (meth) acrylate as a crosslinking agent, Except that 2 parts by mol of 2-hydroxy-1- {4- (2-hydroxyethoxy) phenyl} -2-methyl-1-propanone was used. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

It can be seen from the results of Experimental Examples 3 to 14 that the thickness reduction due to the damage of the polymer film is remarkably reduced as compared with Comparative Examples 1 and 2. [

Experimental Example II-Silicone Crosslinking Agent

<Experimental Example 15>

Except that 20 mol parts of lauryl acrylate and 40 mol of tetrahydrofurfuryl acrylate were used as monomers and 40 mol of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane was used as a crosslinking agent. 1. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 16>

Except that 20 mol parts of lauryl acrylate and 40 mol of tetrahydrofurfuryl acrylate were used as monomers and 40 mol of 1,3-bis (3-methacryloxypropyl) -2-trimethylsiloxypropane was used as a crosslinking agent Were tested under the same conditions as those of Experimental Example 1. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experiment 17>

Except that 30 mol parts of lauryl acrylate was used as a monomer and 40 mol parts of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane and 30 mol of tricyclodecanedimethanol diacrylate were used as a crosslinking agent Experiments were carried out under the same conditions as in Experimental Example 1. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 18>

30 moles of lauryl acrylate was used as a monomer, and 40 moles of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane and 30 moles of 1,12-dodecanediol dimethacrylate were used as a crosslinking agent The test was carried out under the same conditions as in Experimental Example 1. [ As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

Experimental Example 19

30 moles of 1,3-bis (3-methacryloxypropyl) tetrakis (trimethylsiloxy) disiloxane and 30 moles of tricyclodecanedimethanol diacrylate as a crosslinking agent, 40 moles of lauryl acrylate as a monomer, Except that 2 mol parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as an initiator. As a result, it was measured that the thickness of the polymer film decreased by 25 Å.

Experimental Example 20

40 mol parts of 1,3-bis (3-methacryloxypropyl) tetrakis (trimethylsiloxy) disiloxane and 30 mol of lauryl acrylate as a monomer were used as a crosslinking agent, and 1,12-dodecanediol dimethacrylate 30 Moles, and 2 parts by mol of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

Experimental Example 21

30 moles of lauryl acrylate was used as a monomer, and 40 moles of 1,3-bis (methacryloxy) -2-trimethylsiloxypropane and 30 moles of tricyclodecane dimethanol diacrylate were used as a crosslinking agent, Except that 2 parts by mol of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

Experimental Example 22

30 moles of tetrahydrofurfuryl acrylate as a monomer was used, and 20 moles of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane as a crosslinking agent, 1,3,5,7-tetravinyl- 10 moles of 5,7-tetramethylcyclotetrasiloxane and 40 moles of tricyclodecane dimethanol diacrylate were used, and 2 moles of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator The test was carried out under the same conditions as in Experimental Example 1. [ As a result, it was measured that the thickness of the polymer film decreased by 25 Å.

<Experimental Example 23>

30 parts by mol of isobornyl acrylate (IBA) as a monomer, 20 parts by mol of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane as a crosslinking agent, 1,3,5,7-tetravinyl- 10 molar parts of 1,3,5,7-tetramethylcyclotetrasiloxane and 40 molar parts of tricyclodecanedimethanol diacrylate were used, and 1 mol of phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide as a photoinitiator Was used in the same manner as in Experimental Example 1. [ As a result, it was measured that the thickness of the polymer film decreased by 25 Å.

<Experimental Example 24>

(3-methacryloxypropyl) tetramethyldisiloxane, 20 moles of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane, 10 moles of tris (vinyldimethylsiloxy) methylsilane and 10 moles of tricyclodecane dimethanol as the crosslinking agent Except that 40 mol of diacrylate was used and 1 mol of phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

<Experimental Example 25>

30 moles of isobornyl acrylate monomer as a monomer and 20 moles of 1,3-bis (3-methacryloxypropyl) tetramethyldisiloxane as a crosslinking agent, 1,3-trivinyl-1,1,3,5, Except that 10 molar parts of 5-pentamethyltrisiloxane and 40 molar parts of tricyclodecanedimethanol diacrylate were used and 2 molar parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide was used as a photoinitiator Were tested under the same conditions as those of Experimental Example 1. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 26>

30 moles of dicyclopentadiene methacrylate as a monomer, 30 moles of tris (vinyldimethylsiloxy) methylsilane and 40 moles of tricyclodecanedimethanol diacrylate as a cross-linking agent were used, and as a photoinitiator dimethoxybenzophenone 2 Except that the molar part was used. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 27>

20 parts by mol of 2-hydroxypropyl methacrylate and 30 parts by mol of tetrabromophenyl acrylate were used as monomers, and 30 parts by mol of 1,3-bis (acryloxypropyl) tetramethyldisiloxane and 1,3-bis 2-trimethylsiloxypropane as a photoinitiator and 4 molar parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide as a photoinitiator were used in the same manner as in Experimental Example 1 Respectively. As a result, it was measured that the thickness of the polymer film decreased by 20 Å.

Experimental Example 28

30 moles of butoxyethylacrylate and 30 moles of pentachlorophenylacrylate were used as monomers, 20 moles of 1,3,5-trivinyl-1,1,3,5,5-pentamethyltrisiloxane as a crosslinking agent, 20 molar portions of 3-bis (acryloxy) -2-trimethylsiloxypropane were used and 4 molar portions of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was used as a thermal initiator Were tested under the same conditions as in Experimental Example 1. &lt; tb &gt; &lt; TABLE &gt; As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 29>

40 moles of ethyl diethylene glycol methacrylate and 20 moles of 2-trichlorophenoxyethyl methacrylate were used as monomers, and 40 moles of 1,3-bis (acryloxypropyl) -2-trimethylsiloxylpropane was used as a crosslinking agent , And 4 parts by mol of tertiary butyl peroxybenzoate as a thermal initiator was used. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

<Experimental Example 30>

30 moles of lauryl methacrylate and 30 moles of dicyclopentenyloxyethyl acrylate were used as monomers and 20 moles of 1,3-bis (methacryloxy) -2-trimethylsiloxypropane and 1,3-bis (Acryloxypropyl) tetrakis (trimethylsiloxy) disiloxane was used in an amount of 20 parts by mass, and 4 parts by mol of 2-tertiarybutyl anthraquinone was used as a photoinitiator. As a result, it was measured that the thickness of the polymer film decreased by 30 Å.

It can be seen from the results of Experimental Examples 15 to 30 that the thickness reduction due to the damage of the polymer film was remarkably reduced even when the crosslinking agent containing silicon was used as compared with Comparative Examples 1 and 2.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, The present invention may be modified in various ways. Therefore, modifications of the embodiments of the present invention will not depart from the scope of the present invention.

The present invention can be usefully applied to the display industry.

100: display panel 110: substrate
120: display device 130: sealing layer
131a, 131b, 131c and 131d: inorganic films 133a, 133b and 133c:
133 ': composition layer for encapsulating display device

Claims (20)

A composition for encapsulating a display device comprising a monomer, a crosslinking agent capable of crosslinking the monomer, and a photoinitiator,
A composition for encapsulating a display device, wherein at least one of the monomer or the crosslinking agent comprises a silicon-based material containing silicon atoms. The method of claim 1,
The monomer comprises a silicone monomer, wherein the silicone polymer is a silicone-based (meth) acrylate monomer or a silicone-based vinyl monomer composition for encapsulation. 3. The method of claim 2,
Wherein the monomer comprises a silyl group, a siloxane group, or a silane group. The method of claim 3, wherein
Wherein the monomer has a molecular weight of from 100 to 500. The composition for encapsulating a display device according to claim 3, wherein two or more alkyl groups of 1 to 2 carbon atoms are bonded to silicon of the monomer. The method of claim 5, wherein
Wherein the monomer is selected from the group consisting of (meth) acryloxymethyltrimethylsilane, 2- (trimethylsiloxy) ethyl (meth) acrylate, (meth) acryloxypropylpentamethyldisiloxane, (meth) acryloxypropylbis (trimethylsiloxy) (Meth) acryloxypropyltris (trimethylsiloxy) silane, (meth) acryloxypropylheptaisobutyl-T8-silsesquioxane, 3- ((meth) acryloyloxy) propyltrimethoxysilane (Meth) acryloyloxy) propyltriethoxysilane, 3 - ((meth) acryloyloxy) propyltriopropoxysilane, {3- (Meth) acryloyloxypropyl} methyldipropoxysilane, {4- ((meth) acryloyloxy) propyl} methyldiethoxysilane, {3- (Meth) acryloyloxy) butyl} phenyldimethoxysilane, {4- ((meth) acryloyloxy) butyl} phenyldiethoxysilane, {3- (3 - ((meth) acryloyloxy) propyl} dimethyl methoxysilane, {3- ((meth) acryloyloxy) propyl} phenyldipropoxysilane, (Meth) acryloyloxy) propyl} phenylmethylmethoxysilane, {3- ((meth) acryloyloxy) propyl} phenylmethylethoxysilane or γ- (meth) acryloxypropyltrimethoxysilane Wherein the composition for sealing a display device is a composition for sealing a display device. 3. The method of claim 2,
Wherein the composition for encapsulating a display device comprises from 15 to 65 parts by mole of the silicone monomer and from 35 to 85 parts by mole of the crosslinking agent based on 100 parts by mole of the monomer and the crosslinking agent. The method of claim 7, wherein
Wherein the photoinitiator is contained in an amount of 1 mole part to 7 mole parts per 100 mole parts of the monomer and the crosslinking agent. The method of claim 1,
Wherein the crosslinking agent comprises a silicone-based crosslinking agent. The method of claim 9,
Wherein the crosslinking agent comprises a silyl group, a siloxane group, or a silane group. 11. The method of claim 10,
Wherein the crosslinking agent has a molecular weight of 200 to 800. The composition for encapsulating display device according to claim 10, wherein the crosslinking agent is a compound having two or more (meth) acrylic groups or vinyl groups. 11. The method of claim 10,
Wherein the crosslinking agent is selected from the group consisting of 1,3-bis ((meth) acryloxypropyl) tetramethyldisiloxane, 1,3-bis ((meth) acryloxypropyl) ) Acryloxypropyl) tetrakis (trimethylsiloxy) disiloxane, 1,3-bis ((meth) acryloxy) -2-trimethylsiloxypropane, 1,3,5,7- Tetramethylcyclotetrasiloxane, tris (vinyldimethylsiloxy) methylsilane, or 1,3,5-trivinyl-1,1,3,5,5-pentamethyltrisiloxane. Wherein the composition for encapsulating a display device is a composition for encapsulating a display device. The method of claim 9,
Wherein the composition for encapsulating a display device comprises 30 to 70 parts by mole of the monomer and 30 to 70 parts by mole of the silicone crosslinking agent per 100 parts by mole of the monomer and the crosslinking agent. Forming a layer of a metal oxide on a substrate on which the display device is disposed;
Forming a layer of a composition for encapsulating a display device of claim 1 on the layer of metal oxide;
Applying energy to the layer of the composition for encapsulating a display device to cause an initiation reaction to initiate a polymerization reaction of the composition for encapsulating the display device; And
Forming a layer of metal oxide on the layer of polymerized composition for encapsulating the display device;
The method comprising the steps of: The method of claim 15,
Wherein the step of forming a layer of the composition for encapsulating a display device, the step of applying energy, and the step of forming a layer of a metal oxide on a layer of the polymerized composition for encapsulating a display device are repeated at least twice. Bagging method. The method of claim 15,
Wherein the metal oxide is aluminum oxide (Al ₂ O ₃ ). The method of claim 15,
Wherein forming the layer of metal oxide comprises generating an oxygen plasma. &Lt; RTI ID = 0.0 &gt; 15. &lt; / RTI &gt; materials;
A display device disposed on the substrate; And
An encapsulating layer sealing the display device;
The display panel of claim 1, wherein the encapsulation layer comprises one or more polymer organic films including siloxane groups. The method of claim 19,
Wherein the sealing layer comprises a structure in which an inorganic film and a polymer organic film are alternately stacked two or more times.

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