KR20130094734A - Vacuum deposition system and method - Google Patents

Abstract

PURPOSE: A vacuum coating system and a vacuum coating method thereof are provided to improve economic feasibility by reducing the loss of materials. CONSTITUTION: A vacuum coating system includes a vacuum return chamber (H) which horizontally returns a work, a the vacuum coating chamber (C) which coats an evaporation coating material on the work, and a line which has multiple vacuum coating chambers. N (N means more than two) lines are installed in parallel with each other. The vacuum line chambers are N line vacuum coating chambers which are installed on the N lines respectively. Each of the N line vacuum coating chambers has an evaporation coating position every line. A second work is returned to the vacuum return chamber of the downstream side in a different line from a first line during a first work is coated on the first line among the N lines.

Description

Vacuum Deposition System and Vacuum Deposition Method {VACUUM DEPOSITION SYSTEM AND METHOD}

The present invention relates to a vacuum deposition system and a vacuum deposition method having a plurality of vacuum deposition chambers arranged in series and a vacuum transfer chamber for transporting a workpiece for depositing each mounting chamber on the series, in particular, manufacturing by a vapor deposition method. A vacuum deposition system and vacuum deposition method suitable for the present invention.

There is a vacuum vapor deposition method in which organic EL or the like is deposited on a work such as a vacuum substrate. In the general vacuum deposition method, it is necessary to control to keep the material evaporation rate constant from the evaporation source in order to maintain stable deposition. In the case of performing physical vapor deposition (PVC) by heating the deposition material by using a method such as resistance heating or induction heating, a constant time is required to stabilize the evaporation rate, and it is necessary to keep the material evaporation rate constant to evaporate at all times. . Therefore, if the workpieces are put into the vacuum deposition chamber and processed one by one, the material to be taken out of the vacuum deposition chamber after the deposition of the workpieces and the material evaporated from the evaporation source while bringing in the new workpieces do not contribute at all to the deposition process, It was a material loss as it was.

Patent document 1 is a method of solving the subject which reduces this material loss. Patent Literature 1 discloses a method of loading, carrying out, and depositing two workpieces alternately in the vacuum deposition chamber in a cluster type vacuum deposition system in which a vacuum deposition chamber is provided around the vacuum transfer chamber.

Japanese Patent Laid-Open No. 2008-227477

However, also in the vacuum vapor deposition system which arrange | positions a vacuum conveyance chamber and a vacuum vapor deposition chamber in series as shown in FIG. 1, reduction of the material loss at the time of carrying in a workpiece is desired.

Accordingly, an object of the present invention is to provide a vacuum deposition system and a vacuum deposition method with good economical efficiency that can reduce material loss in a vacuum deposition system in which a vacuum transfer chamber and a vacuum deposition chamber are arranged in series.

This invention has the following characteristics at least in order to achieve the said objective.

The vacuum vapor deposition system which consists of a line which has the said vacuum vapor deposition chamber which conveys a workpiece horizontally, and the vacuum vapor deposition chamber which vapor-deposits vapor deposition material to the said workpiece | line alternately in series, and has a plurality of said vacuum vapor deposition chambers is carried out. And N (N is 2 or more) lines in parallel with each other, and the vacuum deposition chamber is an N line vacuum deposition chamber provided over each of the N lines, and the N line vacuum deposition chamber is configured to be used for each line. A deposition position for depositing a workpiece, and during deposition of the first workpiece on the first of the N lines, the second workpiece on the downstream side in the vacuum transfer chamber on a different line from the first line; It carries out, and it is a 1st characteristic to carry in a 3rd said workpiece from the said vacuum conveyance chamber of an upstream.

Moreover, this invention arrange | positions the vacuum conveyance chamber which horizontally conveys a workpiece | work and the vacuum deposition chamber which deposits vapor deposition material to the said workpiece | line alternately, and arrange | positions the line which has a plurality of said vacuum deposition chambers in parallel, N ( N has two or more lines, and wherein the vacuum deposition chamber deposits the workpiece in an N-line vacuum deposition chamber installed over each of the N lines, wherein the vacuum deposition chamber comprises: a first line in a first line of the N lines; During the deposition of the workpiece, the second workpiece is transported into the downstream vacuum transfer chamber on a different line from the first line, and the third workpiece is carried in from the vacuum transfer chamber on the upstream side. It is a 2nd characteristic.

N may be 2, and the other line may be a second line.

Moreover, the said vacuum conveyance chamber may have the feed mechanism which has the multistage coaxial contracted | stretched back and forth in the conveyance direction of the said workpiece | work.

Moreover, you may carry out the said workpiece | work from the said N line vacuum deposition chamber or load chamber of an upstream, and may carry in the said workpiece | work to the said N line vacuum deposition chamber or unload chamber of a downstream side.

In addition, the carrying in or carrying out of the carrying out may be performed through a delivery mechanism that is provided above the deposition position and moves up and down between the deposition position and the carry-in / out position.

The N-line vacuum deposition chamber may also have evaporation source driving means for moving the evaporation source two-dimensionally in the lower region from the deposition position.

The vacuum portion of the vacuum transfer chamber may be provided at a position higher than the deposition position, and the N-line vacuum deposition chamber may have a structure protruding below the vacuum portion of the vacuum transfer chamber.

The vacuum conveying chamber is an N-line vacuum conveying chamber each provided over the N lines, and the N-line vacuum conveying chamber is a means for moving the feed mechanism between the N lines, or one horizontal articulated conveying robot. You may have

Moreover, the said vacuum conveyance chamber may convey the said workpiece | work integral with the workpiece conveyance body or mask which hold | maintains only the said workpiece | work or the said workpiece | work.

According to the present invention, in a vacuum deposition system in which a vacuum transfer chamber and a vacuum deposition chamber are arranged in series, it is possible to provide a vacuum deposition system and a vacuum deposition method with good economical efficiency that can reduce material loss.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the vacuum vapor deposition system in embodiment of this invention.
2 is a side view illustrating the structure of a vacuum deposition chamber and a vacuum transfer chamber.
3 is an explanatory view of a feed mechanism in a vacuum transfer chamber.
4 is a diagram showing the structure of an evaporation source drive means for moving an evaporation source over two lines and depositing a work of two lines.
FIG. 5 is a diagram showing an operation flow of a vapor deposition processing flow and an evaporation source performed over two lines. FIG.
6 is a diagram schematically showing the operation of the evaporation source.

An embodiment of the present invention will be described using FIGS. 1 to 6. 1 shows a vacuum deposition system 100 in an embodiment of the present invention. The vacuum vapor deposition system 100 has two parallel lines LA and LB, and the control apparatus 40 which manages the whole part and controls each part. The vacuum deposition system 100 includes three vacuum deposition chambers CA, CB, and CC across both lines, load chambers IA and IB for carrying the work W into each line, and processing from each line. The unloading chambers EA and EB which carry out the completed workpiece | work W are provided. In addition, the vacuum vapor deposition system 100 has the vacuum conveyance chamber HA1-HA4 and HB1-HB4 (it represents only H when it represents typically) which has a feed mechanism mentioned later which conveys the workpiece | work W. As shown in FIG. Each feed mechanism is provided between each vacuum deposition chamber C (only C is represented when represented) or between the load chambers IA and IB or the unload chambers EA and EB and the corresponding vacuum deposition chamber C. The workpiece | work W is conveyed between and. Arrow KA shows the conveyance range of the workpiece | work W of each feed mechanism. For example, arrow KA1 shows the conveyance range of the feed mechanism of vacuum conveyance chamber HA1. In addition, the small arrows shown in the load chambers IA, IB and the unload chambers EA, EB of each line represent the conveyance direction of the workpiece | work W. As shown in FIG. That is, the left side is the upstream side and the right side is the downstream side.

By this structure, this embodiment can comprise the apparatus which deposits the lower surface of the workpiece | work W uniformly. The same vapor deposition material may be deposited between each vacuum deposition chamber C, or a different vapor deposition material may be deposited. In addition, the number of each vacuum vapor deposition chamber C should not be limited to 3 but just plurality. In addition, you may connect a former process or a later process instead of a load chamber or an unload chamber.

FIG. 2 is a side view showing the structure of the vacuum deposition chamber C and the vacuum transfer chamber H, and is an arrow view of HA2, CB, and HA3 of the line LA seen from the direction of the arrow D. FIG. Basically, since the structures of the vacuum deposition chamber C and the vacuum transfer chamber H are the same, the symbols indicating CB, HA2, HA3, etc., which indicate a place, are not shown in each structure.

The vacuum deposition chamber C has a large part and the transmission part 2 which delivers the workpiece | work W between the feed mechanism F, and the vapor deposition part 1 which deposits a vapor deposition material on the workpiece | work W. As shown in FIG. . Moreover, the vacuum deposition chamber C has the cryopump 9 which maintains the inside of a vacuum deposition chamber at predetermined | prescribed vacuum degree, and the gate valve 10 provided between the vacuum conveyance chamber H. As shown in FIG. The gate valve does not necessarily need to be installed in all the vacuum conveyance chambers H. FIG. At least, the gate valves associated with each of the lines LA and LB may be provided so as not to be in the open state. For example, you may provide a gate valve in the carry-in exit of the vacuum conveyance chamber or the load chamber, or the unload chamber of the most upstream and the downstream. In addition, the workpiece | work W is hold | maintained by the workpiece conveyance body 4 which has an opening part for vapor deposition in a center part, and is conveyed. Of course, you may convey a workpiece | work directly. In that case, it is preferable to hold the surface opposite to a vapor deposition surface.

The delivery unit 2 receives the work carrier 4 from the upstream feed mechanism F at the delivery position UP, moves to the deposition position JP indicated by the broken line, and returns to the original delivery position UP after deposition, It has the delivery mechanism 20 which delivers the workpiece conveyance body 4 to the feed mechanism F of a downstream side. Although the transmission mechanism 20 shown in FIG. 2 is for the line LA, the transmission mechanism 20 for the line LB which has the same structure exists in the back side of the paper surface.

As for the delivery mechanism 20, the tip is fixed to the delivery body 21 which has an opening part in the vapor deposition side similarly to the workpiece conveyance body 4, and the four corner parts (only two corners are shown in FIG. 2) of the delivery body 21, It has the support rod 22 which moves in the sheath part 23 provided through the vacuum seal (not shown) of the upper part of the vacuum deposition chamber C. As shown in FIG. The transfer body 21 is elevated by a ball screw shaft 25b having a tip fixed to a central portion of two opposite sides (only one side is described in FIG. 2). At this time, the ball screw shaft 25b is driven by the nut 25n transmitted by the magnetic fluid seal which does not show the drive of a motor, and moves inside the sheath part 24. As shown in FIG.

Next, before describing the vapor deposition part 1, the feed mechanism F in the vacuum conveyance chamber H is demonstrated with FIG. 2 using FIG. 3 (a) shows a neutral state in which the feed mechanism F is not extended at all, and FIG. 3 (b) shows the state in which the feed mechanism F is moved to the rightmost direction in the conveying direction of the workpiece W and extended. Indicates. It moves and expands to the left side similarly to FIG. 3 (b).

The feed mechanism F includes two moving shafts 31 (one of the ground side in FIG. 3) provided on the moving base 31b and in parallel in the conveying direction of the workpiece W on the moving base 31b. And one linear motion shaft composed of a total of four linear motion bearings 33 (only two of the track axes shown in FIG. 3 are shown) moving on the drive shaft 32 spaced apart from a predetermined position X from both ends of each track shaft. . And the feed mechanism F comprises the multistage linear motion shaft by fixing the linear motion bearing 33 to the movement base 31b of the upper end. In addition, the part which mounts the workpiece conveyance body 4 of the uppermost direct drive shaft is called table 34, and the fixed base 31a is being fixed to the bottom part of the vacuum conveyance chamber H. As shown in FIG.

The linear motion bearings 33 at each stage of the feed mechanism F thus constructed are moved to the right, and the extended state becomes Fig. 3 (b), and the most contracted state is Fig. 3 (a). The feed mechanism of (H) can convey the workpiece | work W with the range of the arrow KA shown in FIG.

In FIG. 2, the center distance in the conveyance direction between the vacuum conveyance chamber H and the vacuum deposition chamber C, ie, the workpiece conveyance distance on one side, is KA / 2. When the length L of the fixed base 31a and the moving base 31b of FIG. 3 is L = KA / 2, and the width | variety which the linear motion bearing 33 supports the table 34 is L / 2, The one-side movement amount X for one axis of the linear motion guide 35 composed of the raceway shaft 32 and the linear motion bearing 33 is equal to L / 4. Since the required one-side stroke of the feed mechanism F should just be conveyance distance KA / 2 = L or more, the number of necessary linear motion guides 35 is four axes. In addition, the length L of the fixed base 31a and the moving base 31b is set to L = 2 / in consideration of the fact that the gate valve 10 exists between the chambers, or that the gap between the inner wall and the mechanism portion of each chamber is necessary. When the width is 5KA and the width of the linear bearing 33 supporting the table 34 is L / 2, X = L / 4 = 1 / 10KA, and the conveyance distance is KA / 2. Therefore, the linear motion guide 35 Is a five-stage overlap.

In addition, in FIG. 2, the feed mechanism F of a three stage arm is shown in order to avoid the complexity of drawing. In the specific drive of the feed mechanism F, for example, when each stage of the movement base 31b and the table 34 at the lowermost stage move the movement base 31b, the link mechanism is arranged so that each stage moves equidistantly. In addition, a ball screw is attached to the fixed base 31a, and rotational drive such as a motor is introduced from the outside of the chamber to be driven by the ball screw. By fixing the nut of the ball screw to the movement base 31b of the lowest end, each movement base 31b and the table 34 can move at constant speed. As a result, the movement distance of the absolute table 34 becomes (N + 1) times each with the number N of the movement base 31b with respect to the movement distance X of the lowest movement base 31b.

Next, the vapor deposition part 1 is demonstrated again in FIG. The vapor deposition unit 1 is provided with a hollow linkage mechanism 51 of two links for connecting wirings, pipes and the like for supplying various utilities to the moving evaporation source 71 without being exposed in a vacuum, and the deposition position JP. It has a plate 11. The movable end side of the hollow arm mechanism 51 is connected to the standby box 51k, and the fixed side is fixed to the bottom wall of the vacuum deposition chamber C via the vacuum seal 51s. The evaporation source 71 is fixed to the atmospheric box 51k. The interconnects of the standby box 51k and the two links 51a and 51b are rotatably vacuum sealed, and the inside thereof is in an atmospheric atmosphere. Therefore, pipes such as a feeder line and a signal line required for the evaporation source 71 are isolated from the vacuum atmosphere, and it is possible to prevent the outgassing from the wiring or the resin pipe that adversely affects the deposition in the vacuum, thereby providing high reliability. Vapor deposition is possible.

As shown in FIG. 2, the vacuum part Hp of the vacuum conveyance chamber H is installed in the position higher than the deposition position JP, and also the workpiece | work can be lifted up and down between the deposition position and the delivery part 2 ,. The delivery mechanism 20 is provided and the length of the conveyance direction of the delivery part 2 is shortened. As a result, while the length of the conveyance direction of the vacuum deposition chamber C can be shortened, the stroke of the feed mechanism F can be shortened, and the length of the conveyance direction of the vacuum conveyance chamber H can be shortened. have. In addition, the vacuum conveyance chamber H may have an accessory | attachment, such as a cryopump which is not shown in figure, The part is a position lower than vapor deposition position JP, such as between the vapor deposition parts 1 of the vacuum vapor deposition chamber C, and the like. Can also be installed on

On the other hand, in the vapor deposition part 1, the area | region which the evaporation source 71 which exists under the vapor deposition position JP moves two-dimensionally has the protrusion structure which protruded below the vacuum conveyance chamber H. As shown in FIG. As a result, the atmospheric region when not depositing can be provided in a protruding structure. In this embodiment, the cryopump 9 is also provided in the lower part of the vacuum conveyance chamber H. FIG.

As a result, according to this embodiment, the line length of the lines LA and LB of the vacuum deposition system 100 shown in FIG. 1 can be shortened.

4 is a diagram showing the structure of the evaporation source drive means for moving over the lines LA and LB of the evaporation source 71 and depositing the workpieces W of the two lines LA and LB. FIG. 4A is a plan sectional view of the chamber C reduced from the deposition surface of the work W, and FIG. 4B is a front sectional view of the chamber C cut away from the bottom thereof. The evaporation source driving means includes the AB line moving means 60 for moving the evaporation source 71 and the wiring piping portion 72 between the lines LA and LB, and the evaporation source 71 into the lines LA and LB. And in-line scanning means 80 for scanning.

First, the movement means 60 between AB lines is demonstrated. The AB line moving means 60 moves the standby box 51k on which the evaporation source 71 is mounted up and down shown in Fig. 4A, and moves to the deposition scanning line in which the work WA or WB exists. Has a role to play.

In order to play the role, the AB inter-line movement means 60 includes an AB-line movement table 62 supported by the AB-line movement linear guide 61 fixed to the chamber bottom 1a, and the AB line. In order to move the inter-movement table between AB, the roller-type rack and pinion 65 which consists of the roller pinion 65p and the rack 65r for converting rotational motion into linear motion, and for transmitting a drive to the pinion, The drive transmission part 64 between AB lines and the drive introduction part 63 which introduce rotational motion from the exterior of the chamber C, ie, the atmospheric side, to the said drive transmission part. As the roller pinion 65p rotates, the AB line movement table 62 to which the rack 65r is fixed moves linearly by the guidance of the AB line movement linear guide 61.

The AB line-moving motor 63m is provided outside the vacuum deposition chamber in order to suppress heat generation and oscillation in the vacuum deposition chamber C. FIG. Therefore, the magnetic fluid seal 63s which can transmit rotation of the AB inter-drive motor 63m to the AB inter-line drive transmission part 64 in a vacuum atmosphere, and can seal a vacuum, and said magnetic fluid seal and AB The coupling 63c which connects the drive motor 63m between lines, and absorbs the misalignment and declination at the time of assembly is required. In addition, the drive transmission part 64 between the AB lines connects the magnetic fluid seal 63s and the pinion shaft 64s, and furthermore, a coupling 64c for absorbing misalignment and declination during assembly, and a roller pinion ( It consists of a bearing 64b which supports the pinion shaft 64s which is the rotation shaft of 65p). On the other hand, the in-line scanning means 80 is provided inside the chamber C.

The in-line scanning means 80 is connected to the in-line scanning linear guide 81 provided on the AB interline movement table 62 for linearly guiding the waiting box 51k, and to the atmospheric atmosphere inside the waiting box 51k. Coupling which connects the installed in-line drive motor 82m, the magnetic fluid seal 82s which is a vacuum rotational seal, and the said in-line drive motor and the said magnetic fluid seal, and absorbs the misalignment and declination at the time of assembly ( An in-line drive introduction portion 82 made of 82c, and a roller-type rack and pinion 83 made of a roller pinion 83p and a rack 83r for converting rotational motion into linear motion.

The movement relationship by converting the rotational motion of the roller pinion 83p of the inline scanning means 80 and the rack 83r into linear motion is a reverse relationship with the case of the AB line movement means 60. The rack 83r is fixed to the movement table between AB lines, and the roller pinion 83p rotates and moves. That is, the standby box 51k and the evaporation source 71 are guided by the scanning linear guide 81 in a line, and are scanned by the state in the state which enclosed the drive introduction part 82 in a line.

In the above embodiment, the case which has 2 lines was demonstrated. For example, in FIG. 4A, the chamber is expanded in the moving direction, and the AB inter-drive line introduction portion 63 and the AB line-drive transmission unit 64 are aligned with the stroke of the AB-line movement table 62. ), And by adding a pair of roller pinions 65p at appropriate positions, a vacuum deposition chamber over three or more lines can be configured.

Next, the vapor deposition processing flow in the embodiment will be described using FIG. 5. FIG. 5 shows a deposition processing flow and an operation flow of the evaporation source 71 performed over the lines LA and LB. 6 is a diagram schematically showing the operation of the evaporation source 71 at this time. The solid line or the broken line of the hollow arm mechanism 51 of the two links in FIG. 6 shows the attitude | position in the right end part or the left end part of the lines LA and LB.

The processes or operations of the vacuum deposition chambers C and the vacuum transfer chambers H constituted by the lines described below are performed in synchronization for each line unit.

In the deposition processing flow shown in FIG. 5, the evaporation source 71 finishes deposition of the work WB of the line LB, moves to the left end of the LB line, and deposits each vacuum deposition chamber in the line LA. It shows from the state AS0, BS0, JS0 which the workpiece | work WA is already set and waiting in the position JP.

First, the evaporation source 71 moves from the left end of the line LB to the left end of the line LA, as shown by arrow J1 in FIG. 6. At this time, the line LB raises the workpiece | work WB to the delivery position UP (BS1), and starts carrying out to the downstream vacuum conveyance chamber H. The evaporation source 71 moves to the left end of the line LA, and then moves the lower surface of the work WA of the line LA from left to right (arrow J2 in FIG. 6), and returns to the left end again ( Arrow J3 in FIG. 6). As the operation of the evaporation source 71 is performed once to a plurality of times, the workpiece WA is deposited in the line LA (AS1).

On the other hand, in the line LB, the carrying-out operation of the workpiece | work WB continues during vapor deposition of the line LA also after BS1 mentioned above. That is, the workpiece | work WB is carried out from the vacuum deposition chamber C to the downstream vacuum conveyance chamber H by the downstream feed mechanism F (BS2). Thereafter, the new work WB is loaded into the delivery position UP of the vacuum deposition chamber C from the upstream vacuum conveyance chamber H by the upstream feed mechanism F (BS3). In some cases, after performing an operation such as positioning or the like (BS4), it is dropped to the deposition position JP to set a new work WB and waits until the deposition of the line LA is completed (BS5).

Subsequently, when vapor deposition ends in the line LA, the evaporation source 71 moves from the left end of the line LA to the left end of the line LB, as indicated by arrow J4 of FIG. 6 ( JS3) Then, similarly to step JS2, as shown by arrows J5 and J6 of FIG. 6, the lower surface of the workpiece B of the line LB is reciprocated once to several times (JS4), (WB) is deposited (BS6). In the meantime, in the line LA, the process shown by step BS1-BS5 of the line LB is performed in step AS2-AS6. After that, the above-described steps are repeated.

In addition, in the above description, although the movement between AB lines was performed on the left edge side, you may carry out on the right edge side, as shown by the arrows J7 and J8 shown by the double-dotted line. In addition, although the scanning of the lower surface of the work was reciprocated once or more than once, one or more scanning in one direction by the loop of the arrows J1, J2, J8, J6 or J4, J5, J8, J3 is performed once or more. You may carry out.

According to the present embodiment described above, in each vacuum deposition chamber, while depositing the workpieces on one line, the deposited workpieces on the other line and the new workpieces are brought in and lost without any contribution to the deposition process. It is possible to provide a deposition line or a vacuum deposition method capable of reducing the material.

In addition, according to the present embodiment described above, compared to the deposition line composed of two independent short lines, in each vacuum deposition chamber, while depositing the workpiece in one line, the deposited workpiece of the other line is carried out, By bringing in a new work, the time which is not processed can be shortened and a high throughput deposition line or a vacuum deposition method can be provided.

In the above embodiment, although the vapor deposition was carried out uniformly on the workpiece surface without using a mask, a mask may be provided below the vapor deposition position and pattern vapor deposition may be performed. In this case, you may provide the mechanism which aligns and moves a mask and a workpiece relatively. For example, in embodiment described above, you may perform alignment by moving a delivery mechanism relatively. In addition, the mask and the work may be integrally conveyed and deposited.

In addition, although the feed mechanism was provided for every line in the above embodiment, the vacuum conveyance chamber may also be provided over two lines similarly to a vacuum deposition chamber, and one feed mechanism may be moved and shared between lines.

In addition, a vacuum transfer chamber may be provided over two lines similarly to a vacuum deposition chamber, and one horizontal articulated transfer robot may be provided in place of a feed mechanism, which carries out two lines of work in and out of the center.

1: deposition unit
2:
4: work carrier
9: cryo pump
10: gate valve
11: barrier plate
20: delivery mechanism
40: Control device
51: hollow arm mechanism with two links
60: means of movement between AB lines
71: evaporation source
80: means of transport in line
100: vacuum deposition system
C, CA, CB, CC: vacuum deposition chamber
EA, EB: Unloading Room
F: feed mechanism
H, HA1 to HA3, HB1 to HB4: vacuum conveying chamber
IA, IB: Load Room
W: Walk

Claims (14)

A vacuum vapor deposition system configured to alternately arrange a vacuum transfer chamber for horizontally conveying a workpiece and a vacuum vapor deposition chamber for depositing vapor deposition material on the workpiece, the line having a plurality of the vacuum vapor deposition chambers,
N (N is 2 or more) lines are provided in parallel with each other, and the vacuum deposition chamber is an N line vacuum deposition chamber provided over each of the N lines, and the N line vacuum deposition chamber is the workpiece for each line. Has a deposition position for depositing, and during deposition of the first work on the first of the N lines, the second work is carried out to the vacuum transfer chamber downstream on a different line from the first line. And bringing in the third workpiece from the vacuum transfer chamber on the upstream side. The vacuum deposition system of claim 1, wherein N is 2 and the other line is a second line. The said vacuum conveyance chamber has a feed mechanism which has a multistage coaxially extended back and forth in the conveyance direction of the said workpiece | work, The said vacuum conveyance chamber is a said workpiece | work from the said N-line vacuum deposition chamber or a load chamber of an upstream side. And depositing the workpiece into the downstream N-line vacuum deposition chamber or the unloading chamber. The said N-line vacuum deposition chamber has a transfer mechanism which delivers the said workpiece above the said deposition position, The said transfer mechanism has the lifting means which raises and lowers the said workpiece, The said N line vacuum deposition chamber is characterized by the above-mentioned. Vacuum deposition system. The vacuum deposition system according to claim 1 or 2, wherein the N-line vacuum deposition chamber has evaporation source driving means for moving the evaporation source in a two-dimensional phase in a region below from the deposition position. The vacuum part of the said vacuum conveyance chamber is provided in the position higher than the said deposition position, The said N-line vacuum deposition chamber has a structure which protrudes below the vacuum part of the said vacuum conveyance chamber, It is characterized by the above-mentioned. Vacuum deposition system. The said vacuum conveyance chamber is respectively an N-line vacuum conveyance chamber provided over the said N line, The said N-line vacuum conveyance chamber has a means which moves the said feed mechanism between the said N lines, It is characterized by the above-mentioned. Vacuum deposition system. The said vacuum conveyance chamber is an N-line vacuum conveyance chamber each installed over the said N line, The said N-line vacuum conveyance chamber has one horizontal articulated conveying robot, The said conveying robot Silver carries out the said workpiece | work from the said N line vacuum deposition chamber or load chamber of an upstream, and carries in the said workpiece | work to the said N line vacuum deposition chamber or unload chamber of a downstream side. The vacuum vapor deposition system according to claim 1 or 2, wherein the vacuum conveyance chamber conveys only the workpiece or the workpiece integrated with a workpiece carrier or a mask holding the workpiece. A vacuum transfer chamber for transporting the workpiece horizontally and a vacuum deposition chamber for depositing deposition material on the workpiece are alternately arranged in series, and the lines having a plurality of the vacuum deposition chambers are arranged in parallel with each other (N is N or more). In the vacuum deposition method of depositing the said workpiece in each N line vacuum deposition chamber provided over the said vacuum deposition chamber of said N line,
During deposition of the first work on the first line of the N lines, the second work is carried out to the downstream vacuum conveying chamber on a different line from the first line, and the third work is removed. Carrying in from the said vacuum conveyance chamber upstream, The vacuum vapor deposition method characterized by the above-mentioned. The vacuum deposition method according to claim 10, wherein N is 2 and the other line is a second line. The said workpiece | work is carried out from the said N-line vacuum deposition chamber or load chamber of an upstream, and the said workpiece | work is carried in to the said N-line vacuum deposition chamber or unload chamber of a downstream side. Vacuum deposition method. The vacuum deposition according to claim 10 or 11, wherein the carrying in or carrying out is carried out through a transfer mechanism provided above the deposition position and lifting up and down between the deposition position and the carry-in / out position. Way. The vacuum vapor deposition method according to claim 10 or 11, wherein the vacuum conveyance chamber conveys only the workpiece or the workpiece integrated with a workpiece carrier or a mask holding the workpiece.

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