KR20130094611A - Display module including bonded structure between display panel and plate and method of bonding display panel and plate - Google Patents

Abstract

PURPOSE: A method for bonding a display panel and a plate bonded to the display panel is provided to obtain a dam layer of which property do not change by hardening a first resin layer in a solid state or a semisolid state. CONSTITUTION: A first resin is formed on a first plate (110). The first resin is hardened to form a first resin layer. A second resin layer is formed on the first plate. The second resin layer is bonded to a second plate (130). The second resin layer is formed in the inner region of the first resin layer.

Description

Display module including bonded structure between display panel and plate and method of bonding display panel and plate}

The present specification relates to a display module and a bonding method of a plate including a plate bonded to a display panel.

People living in modern times use their cell phones to call, watch, watch movies, DMB, music, etc. while using the cell phone, PMP, navigation, MP3 and MP4 while walking on the street, using public transport, or while driving.

In order to enable users to use the functions more conveniently while performing the functions of the mobile terminals, the mobile terminal displays a function such as an LCD to confirm the user.

In addition, recently, a touch screen with an additional touch panel on the LCD is used to eliminate buttons such as a keypad for input from the outside, and to input and output through the touch screen, thereby making the mobile terminal lighter and more compact. It's accelerating.

Looking at the structure of such a touch screen, it may be arranged in the order of the backlight unit, the liquid crystal panel and the touch window glass from the inside of the mobile terminal.

1 is an exemplary view illustrating a general display module including a touch window glass bonded to an LCD panel.

Referring to FIG. 1, a general display module 10 includes an LCD panel 11, a touch window glass 12, an adhesive layer 13, and a spacer 14.

The touch window glass 12 may be made of tempered glass or synthetic resin to prevent the panel such as a liquid crystal panel or a touch panel from being damaged by an external force. In addition, the touch window glass 12 includes a touch module for a touch function.

Since the touch window glass 12 is located at the outermost side of the mobile terminal, the touch window glass 12 occupies a part of the terminal design and may be formed larger than the inner panel.

The adhesive layer 13 serves to bond the LCD panel 11 and the touch window glass 12 to each other. A double-sided tape (or adhesive tape) may be used as the adhesive layer 130, but in this case, a space generated between the double-sided tape and the touch window glass 12 may increase, and bubbles generated in the space may be increased. The size of the mobile terminal is large enough to be visually recognized from the outside of the mobile terminal, which may be a flaw in the appearance design, and may cause a problem of air bubbles such as being a obstacle in checking the screen displayed through the window glass. have. In addition, the refractive index between the air layer and the touch window glass 12 generated between the LCD panel and the touch window glass 12 may have a problem in that visibility is reduced.

An object of the present specification is to provide a display module and a method of bonding a plate including a plate bonded to a display panel.

Plate bonding method according to the present specification for achieving the above objects,

Forming a first resin linearly along a circumference of the first plate on the first plate; Curing the first resin to form a first resin layer; Forming a second resin layer on the first plate; And

Bonding the second resin layer and the second plate;

The second resin layer may be formed in an inner region of the first resin layer.

As an example related to the present specification, the first plate may be a display panel.

As an example related to the present disclosure, the display panel may be at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP).

As an example related to the present specification, the second resin layer may be bonded to the second plate based on adhesive properties.

As an example related to the present specification, the first resin layer may include at least one of a method of irradiating ultraviolet rays onto the first resin, a method of applying heat to the first resin, and a method of cooling the first resin. It may be to be cured on the basis of.

As an example related to the present specification, a method of cooling the first resin may be a method of rapidly cooling the first resin based on a gas cooled to a low temperature.

As an example related to the present specification, the gas cooled to a low temperature may be air or nitrogen.

As an example related to the present specification, the low temperature may be a temperature within a temperature range of −15 degrees to 0 degrees.

As an example related to the present specification, the first resin layer may be cooled for a time within a time range of 1 second to 20 seconds.

As an example related to the present specification, the second plate may include at least one of cover glass, touch window glass, AR coated glass, and 3D glass. It may be one.

As an example related to the present specification, the second resin layer may be applied to the entire surface of the inner region of the first resin layer.

As an example related to the present specification, the second plate may be bonded to the second resin layer in a vacuum atmosphere.

As an example related to the present specification, the second plate may be bonded to the second resin layer within a temperature range of 40 ° C. to 80 ° C.

As an example related to the present specification, the second plate may be bonded to the second resin layer under atmospheric pressure or atmospheric pressure.

As an example related to the present specification, the method may further include curing the second resin layer by irradiating ultraviolet rays or heat.

Display module according to the present disclosure for achieving the above object, the display panel; A resin layer formed on the display panel; And a functional plate bonded to the resin layer.

As an example related to the present specification, the resin layer may include: a first resin layer linearly formed along an outer periphery of the display panel on a display panel; And a second resin layer formed on the display panel and formed in an inner region of the first resin layer.

As an example related to the present specification, the dam layer may include a method of irradiating ultraviolet rays on a linear first resin formed along an outer periphery of the display panel on a display panel, a method of applying heat on the linear first resin, and It may be to be cured based on at least one of the ways to cool the linear first resin.

As an example related to the present specification, a method of cooling the linear first resin may be a method of rapidly cooling the linear first resin based on a gas cooled to a low temperature.

As an example related to the present disclosure, the display panel may be at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP).

As an example related to the present specification, the functional plate may include at least one of cover glass, touch window glass, AR coated glass, and 3D glass. It may be

According to one embodiment disclosed herein, a display module including a plate bonded to a display panel and a bonding method of the plate is provided.

In particular, according to the display module and plate bonding method disclosed in the present disclosure, the second resin layer is formed on the display panel by forming a first resin layer acting as a kind of dam and an inner region of the first resin layer. When the layer is adhered to the functional plate, a portion of the second resin layer is prevented from flowing out (or outside).

In particular, by forming the first resin layer by hardening it to a solid or semi-solid state through cooling of the linearly applied first resin, it is possible to obtain a dam layer having no chemical or physical change (or no change in the mass properties). There is an advantage to that.

1 is an exemplary view illustrating a general display module including a touch window glass bonded to an LCD panel.
2 is an exemplary view illustrating a configuration of a display module according to an exemplary embodiment disclosed herein.
Figure 3 is a flow chart showing a plate bonding method according to an embodiment disclosed herein.
Figure 4 is an exemplary view showing a bonding method of the plate according to an embodiment disclosed herein.
5 is an exemplary view showing a cooling hardening method of the first resin of the plate bonding method according to one embodiment disclosed herein.
6 is a conceptual diagram illustrating an operation of an inline bonding process system for manufacturing a display module according to an exemplary embodiment disclosed herein.
7 is an exemplary view showing an inline autoclave processing system according to one embodiment disclosed herein.

The technology disclosed herein may be applied to a display module including a plate and a display panel. However, the technology disclosed herein is not limited thereto, and may be applied to all plate bonding methods and modules including the plate, to which the technical spirit of the technology may be applied.

It is noted that the technical terms used herein are used only to describe specific embodiments and are not intended to limit the scope of the technology disclosed herein. Also, the technical terms used herein should be interpreted as being generally understood by those skilled in the art to which the presently disclosed subject matter belongs, unless the context clearly dictates otherwise in this specification, Should not be construed in a broader sense, or interpreted in an oversimplified sense. In addition, when a technical term used in this specification is an erroneous technical term that does not accurately express the concept of the technology disclosed in this specification, it should be understood that technical terms which can be understood by a person skilled in the art are replaced. Also, the general terms used in the present specification should be interpreted in accordance with the predefined or prior context, and should not be construed as being excessively reduced in meaning.

Also, the singular forms "as used herein include plural referents unless the context clearly dictates otherwise. In this specification, the terms "comprising ", or" comprising "and the like should not be construed as necessarily including the various elements or steps described in the specification, Or may be further comprised of additional components or steps.

Further, the suffix "module" and "part" for the components used in the present specification are given or mixed in consideration of ease of description, and do not have their own meaning or role.

Furthermore, terms including ordinals such as first, second, etc. used in this specification can be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted.

Further, in the description of the technology disclosed in this specification, a detailed description of related arts will be omitted if it is determined that the gist of the technology disclosed in this specification may be obscured. It is to be noted that the attached drawings are only for the purpose of easily understanding the concept of the technology disclosed in the present specification, and should not be construed as limiting the spirit of the technology by the attached drawings.

On the panel Bonded  Description of the display module including the plate

The display module according to the exemplary embodiment disclosed herein includes a display panel, a resin layer formed on the display panel, and a functional plate bonded to the resin layer.

2 is an exemplary view illustrating a configuration of a display module according to an exemplary embodiment disclosed herein.

Referring to FIG. 2, the display module 100 includes a display panel 110, a resin layer 120, and a functional plate 130 (FIG. 2A).

In addition, the display apparatus 100 further includes various components for providing additional functions.

Hereinafter, the components will be described in order.

The display panel 110 may be at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP).

The resin layer 120 serves to bond (or bond and adhere) the display panel 110 and the functional plate 130.

In addition, the resin layer 120 may be made of a material having the same or similar optical refractive index as the functional plate 130. For example, the resin layer 120 may be made of SVR (Super View Resin).

In this case, since the optical refractive index of the resin layer 120 is the same as or similar to that of the functional plate 130, the visibility of the display module 100 may be increased.

According to one embodiment disclosed herein, the resin layer 120, the first resin layer 121 and the display formed linearly along the outer periphery of the display panel 110 on the display panel 110 It is formed on the panel 110, and includes a second resin layer 122 formed in the inner region of the first resin layer 121 (Fig. 2 (b)).

The first resin layer 121 is a method of irradiating ultraviolet rays onto a linear resin layer formed along the outer circumference of the display panel 110 on the display panel 110, and applying heat to the linear resin layer. Hardening based on at least one of the method and the method of cooling the linear resin layer.

Here, the method of cooling the linear resin layer may be a method of rapidly cooling the linear resin layer based on a gas cooled to a low temperature.

In addition, the material constituting the first resin layer 121 is the same as or similar to the material constituting the resin layer 120. For example, the first resin layer 121 may be made of SVR (Super View Resin).

The second resin layer 122 may have an adhesive property, and may be adhered to the functional plate 130 based on the adhesive property.

In this case, when the second resin layer 122 is bonded (or bonded) to the functional plate 130, a portion of the second resin layer 122 is external (or outer). It prevents the outflow to).

In addition, the first resin layer 121 serves to maintain a separation distance between the first plate 110 and the second plate 130.

In addition, the second resin layer 122 may be entirely coated on an inner region of the first resin layer 121.

The functional plate 130 may be a plate for allowing the display module to provide various functions.

For example, the functional plate 130 is at least one of a cover glass, a touch window glass, an AR coated glass, and a 3D glass. It may be.

In the case where the functional plate 130 is a touch window glass, the touch window glass is exposed to the outside so that a user's body part (for example, a finger) or a touch pen (or a stylus pen) is exposed. It can be touched directly by the tip of.

Accordingly, the upper touch window glass may be manufactured using a material having a strength such that scratching does not occur or bending toward the display disposed at the bottom of the touch panel sensor due to external pressure. For example, tempered glass may be used as the material. However, the material of the touch window glass is not necessarily limited to the glass material alone, and the light transmits and the strength is excellent so that it is not easily bent and has insulation, and has a strength such that its surface is not easily damaged during use. Reinforced plastics such as) may be selected.

In the bonding method of the plate according to an embodiment of the present disclosure, forming a first resin layer linearly along the outer periphery of the first plate on the first plate, curing the first resin layer, the Forming a second resin layer on the first plate and bonding the second resin layer and the second plate, wherein the second resin layer may be formed in an inner region of the first resin layer. have.

Figure 3 is a flow chart showing a plate bonding method according to an embodiment disclosed herein.

Referring to Figure 3, the bonding method of the plate according to an embodiment disclosed herein may be made of the following steps.

First, the first resin layer is linearly formed on the first plate to have a predetermined width and height along the outer circumference of the first plate (S110).

Next, the first resin layer is cured (S120).

Next, a second resin layer is formed on the first plate, and the second resin layer is formed in an inner region of the first resin layer (S130).

Next, the second resin layer and the second plate are bonded (or bonded, bonded) (S140).

Next, the second resin layer is cured (S150).

According to one embodiment disclosed herein, the first plate may be a display panel.

For example, the display panel may be at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP).

The second plate may be a functional plate to include a specific function in the display module.

For example, the functional plate may be at least one of a cover glass, a touch window glass, an AR coated glass, and a 3D glass. .

In addition, the second resin layer may be bonded to the second plate based on adhesive properties.

The first resin layer is cured based on at least one of a method of irradiating ultraviolet rays on the first resin layer, a method of applying heat on the first resin layer, and a method of cooling the first resin layer. It may be.

5 is an exemplary view showing a plate bonding method according to the first embodiment disclosed in the present specification.

Referring to FIG. 5, the plate bonding method according to the first embodiment disclosed in the present specification includes placing the first plate 110 on a stage (not shown) that fixes the first plate 110 by a vacuum suction method or the like. After supply fixing, applying the first resin 1211 onto the first plate 110 through an application device 210 or an apparatus such as a nozzle (FIG. 5 (a)). The first resin 1211 is applied to the outer portion of the first plate 110, and adjusts the width and height of the first resin 1211 by adjusting the nozzle size, the moving speed, etc. of the coating device 210. It is possible to.

The coating of the first resin 1211 may be performed by applying the coating device 210 while the stage is stopped, or may be applied in the opposite operation.

The first resin 1211 may be made of various materials. For example, the first resin 1211 may be made of SVR (Super View Resin).

In addition, in the plate bonding method according to the first embodiment disclosed herein, the first resin 1211 is cured by irradiating the light source 220 to the first resin 1211 to harden the first resin layer 121. Forming step (FIG. 5 (b)).

For example, the light source 220 may be ultraviolet (UV) ultra-violet (UV).

That is, the first resin layer 121 may be formed by curing the first resin 1211 by irradiating ultraviolet rays onto the first resin 1211.

The light source 220 may be installed in close proximity to the coating device 22 and may be irradiated with ultraviolet rays to the first resin 1211 while moving in the same manner as the coating device 22.

The first resin 1211 is cured in a semi-solidified state by the ultraviolet irradiation to become a first resin layer 121 that maintains width and height. The hardening height of the first resin layer 121 forms a separation distance between the first plate 110 and the second plate 130.

In addition, according to the first modified embodiment, the first resin layer may be formed by applying heat on the first resin layer.

In addition, in the plate bonding method according to the first embodiment disclosed herein, the second resin layer 122 is formed on the first plate 110 and the inner region of the first resin layer 121 (or Applying) (Fig. 5 (c)).

The resin layer 122 may be coated using a coating device 210 such as a nozzle. The second resin layer 122 is preferably made of the same material as the first resin layer 121.

According to the first embodiment, the second resin layer 122 may be entirely coated on the inner region of the first resin layer 121.

In this case, when the second resin layer 122 is bonded (or bonded) to the second plate 130, a portion of the second resin layer 122 is external (or outer). It prevents the outflow to).

In addition, according to the first embodiment, the second resin layer 122 has an optical refractive index such that the optical properties of the display module 100 are maintained even after being adhered to the second plate 130. 130 and the same or similar material. For example, the second resin layer 122 may be made of SVR (Super View Resin).

In addition, the plate bonding method according to the first embodiment disclosed herein includes the step of bonding the second resin layer 122 and the second plate 130 (Fig. 5 (d)).

Here, the second resin layer 122 may be bonded to the second plate 130 based on the adhesive property.

The second plate 130 may be a functional plate. For example, the second plate 130 may include at least one of a cover glass, a touch window glass, an AR coated glass, and a 3D glass. It may be

The second plate 130 may be bonded to the second resin layer 122 within various conditions. For example, the second plate 130 may be bonded to the second resin layer 122 in a vacuum atmosphere. In addition, for example, the second plate 130 may be bonded to the second resin layer 122 within a temperature range of 40 ° C to 80 ° C. In addition, for example, the second plate 130 may be bonded to the second resin layer 122 at atmospheric or atmospheric pressure conditions.

By bonding in the vacuum atmosphere, the air present therein is discharged. In addition, a portion of the first resin layer 121 in contact with the second resin layer 122 is mixed with the second resin layer 122 as the temperature of 40 ° C. to 80 ° C. is applied to the first resin layer. The boundary between the 121 and the second resin layer 122 is lost. In addition, an upper portion of the first resin layer 121 in contact with the second plate 130 is firmly adhered to the second plate 130.

At the same time, the second resin layer 122 is firmly adhered to the second plate 130.

By pressing the second plate 130 in the direction of the first plate 110 at an appropriate pressure, the second resin layer 122 has an internal space between the first plate 110 and the second plate 130. Will be filled completely.

In addition, it will be apparent to those skilled in the art that adhesion (or bonding) between the second resin layer 122 and the second plate 130 may be performed under various conditions.

In addition, the plate bonding method according to the first embodiment, further comprises the step of curing the second resin layer by irradiating ultraviolet or heat.

Although the ultraviolet rays irradiated to the light source 220 are used to cure the first resin 1211 in the first embodiment disclosed herein, another method is to use the method of cooling and curing the first resin 1211. It is also possible.

FIG. 7 is an exemplary view showing curing of the first resin 1211 by cooling disclosed herein.

Referring to FIG. 7, the first resin 1211 is applied onto the first plate 110 through a coating device 210 or an apparatus such as a nozzle in the same manner as shown in FIG. 5A (FIG. 7A). )).

Next, discharging the gas cooled by the cooler 230 to the first resin 1211 to cool (or harden) the first resin 1211 to form the first resin layer 121. (FIG. 7 (b)).

That is, the hardening method of the first resin 1211 according to the second embodiment may be formed based on a method of cooling the first resin 1211. By the cooling, the first resin 1211 is cured in a semi-solidified state to become the first resin layer 121 to maintain a predetermined width and height. The first resin layer 121 forms a separation distance between the first plate 110 and the second plate 130.

The method of cooling the first resin 1211 may be a method of rapidly cooling the first resin 1211 based on a gas cooled to a low temperature. For example, the gas cooled to low temperature may be air or nitrogen.

In addition, the low temperature may be a temperature in the range of -15 ℃ to 0 ℃.

In addition, the first resin 1211 may be cooled by being exposed to a low temperature cooled gas discharged from the cooler 230 for a time within a time range of 1 second to 20 seconds.

The cooler 230 is installed in close proximity to the applicator 22 to move the same along the applicator 22 to discharge the cooled gas to the applied first resin 1211 to the first resin ( It is possible to cool 1211). It is also possible to install a plurality of coolers 230 for proper cooling.

Subsequent formation of the second resin layer 122 and bonding of the second plate 130 are the same as described above.

The display module according to one embodiment disclosed herein may be automatically manufactured and inspected by an in-line bonding process system (or equipment).

Hereinafter, an in-line system that performs the bonding process of C / G and B / A will be described below with reference to FIGS. 6 to 7.

Here, C / G corresponds to the second plate 130 of the present invention as a cover glass for a touch window, and B / A refers to the first plate 110 of the present invention as an LCD panel.

6 is a conceptual diagram illustrating an operation of an inline bonding process system for manufacturing a display module according to an exemplary embodiment disclosed herein.

Referring to FIG. 6, an inline bonding process system for manufacturing a display module according to an exemplary embodiment disclosed herein may be operated (or operated) in the following processes (or steps).

First, B / A (or LCD panel) and C / G (or cover glass) may be supplied in sheets, respectively, and may be continuously fed (or supplied) to the inline bonding process system (B / A and C). / G supply stage).

In this case, the protective film included in the B / A (or LCD panel) and C / G (or cover glass) may be removed (not shown).

A linear resin layer is coated on the B / A in a square shape, and ultraviolet rays are irradiated or a cooling gas is injected into the linear resin layer to cure the linear first resin to form a dam layer as a first resin layer ( Application and curing of the dam layer). Here, the dam layer may be in a solid or semisolid state.

Next, the inner resin layer of the second resin layer is completely coated on the inner side of the dam layer (inner front coating step).

After application of the front surface of the inner resin layer, the glass (or plate) transfer device supplies the C / G and B / A to the combiner.

The combiner automatically aligns the C / G and B / A in a vacuum to discharge the display module in which the C / G and B / A are bonded (vacuum bonding step).

In addition, the discharged display module is subjected to the bubble, foreign matter, unfilled inspection in the automatic inspection machine, and automatically sorts the good or bad goods and moves only the good goods to the curing machine (automatic inspection step).

The curing machine may be cured by irradiating ultraviolet or heat to the display module determined as good (curing step).

The hardened product can be automatically put into the box.

7 is an exemplary view showing an inline autoclave processing system according to one embodiment disclosed herein.

Referring to FIG. 7, C / G 130 and B / A 110 may be supplied to the inline autoclave processing system in a sheet through a feeder (FIG. 7 (a)).

Next, the dam layer 121 may be formed through the application equipment (or apparatus) and the hardener for curing the dam layer (FIG. 7B).

Next, an inner resin layer 122 may be applied to an inner region of the dam layer 121 through an applicator for applying a resin layer (FIG. 7C).

Next, the inner resin layer 122 and the C / G 130 may be bonded through a bonding machine (Fig. 7 (d)).

Next, bubbles, foreign matters, and unfilled inspection may be performed on the display module to which the internal resin layer 122 and the C / G 130 are bonded through the automatic inspector 240 (FIG. 7E). ).

Next, secondary curing through a curing machine may be performed on the display module determined as good (FIG. 7 (f)).

As described above, the in-line bonding process system (or equipment, apparatus) according to one embodiment bonds C / G and B / A in a vacuum state, and automatically manufactures a display module through automatic inspection and automatic curing, It may be a system for performing an inline automatic bonding process for evaluating quality.

As described above, according to the display module and plate bonding method according to the embodiments disclosed herein, by forming an internal resin layer on the dam layer and the inner region of the dam layer on the display panel, the inner resin layer is functional When bonded with the plate, it prevents a portion of the inner resin layer from flowing out (or outer).

In particular, by forming the dam layer by hardening it in a solid or semi-solid state through cooling of the resin layer applied linearly, it is possible to obtain a dam layer having no chemical or physical change (or no change in the mass properties). There may be.

The scope of the present invention is not limited to the embodiments disclosed herein, and the present invention can be modified, changed, or improved in various forms within the scope of the present invention and the claims.

100: display module 110: first plate
120: resin layer 130: second plate

Claims (20)

Forming a first resin linearly along a circumference of the first plate on the first plate;
Curing the first resin to form a first resin layer;
Forming a second resin layer on the first plate; And
Bonding the second resin layer and the second plate;
And the second resin layer is formed in an inner region of the first resin layer. The method of claim 1, wherein the first plate,
Plate bonding method which is a display panel. The display panel of claim 2, wherein the display panel comprises:
And at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP). The method of claim 1, wherein the second resin layer,
Plate bonding method is bonded to the second plate based on the adhesive properties. The method of claim 1, wherein the first resin layer,
And hardening based on at least one of a method of irradiating ultraviolet rays onto the first resin, a method of applying heat to the first resin, and a method of cooling the first resin. The method of claim 5, wherein the first resin is cooled.
Plate bonding method is a method of rapidly cooling the first resin based on the gas cooled to low temperature. The method of claim 6, wherein the gas cooled to low temperature,
The plate bonding method is air or nitrogen. The method of claim 6, wherein the low temperature,
And a temperature within a temperature range of -15 degrees to 0 degrees. The method of claim 6, wherein the first resin,
The plate bonding method is cooled for a time in the time range of 1 second to 20 seconds. The method of claim 1, wherein the second plate,
The plate bonding method of at least one of the cover glass (Cover Glass), touch window glass (Touch Window Glass), AR Coated Glass (3D Glass). The method of claim 1, wherein the second resin layer,
The plate bonding method is applied to the entire surface of the inner region of the first resin layer. The method of claim 1, wherein the second plate,
The plate bonding method to be bonded to the second resin layer in a vacuum atmosphere. The method of claim 1, wherein the second plate,
Plate bonding method is bonded to the second resin layer in the temperature range of 40 ℃ to 80 ℃. The method of claim 1, wherein the second plate,
Plate bonding method is bonded to the second resin layer at atmospheric or atmospheric conditions. The method of claim 1,
And irradiating ultraviolet rays or heat to harden the second resin layer. Display panel;
A first resin layer linearly formed along an outer periphery of the display panel on the display panel;
A second resin layer formed on the display panel and formed in an inner region of the first resin layer; And
And a functional plate bonded to the first and second resin layers. The method of claim 16, wherein the first resin layer,
At least one of a method of irradiating ultraviolet rays on the linear first resin formed along the outer periphery of the display panel on the display panel, a method of applying heat on the linear first resin, and a method of cooling the linear first resin. Display module that is cured on the basis. The method of claim 17, wherein the linear first resin is cooled.
The display module is a method of rapidly cooling the linear first resin based on the gas cooled to low temperature. The method of claim 16, wherein the display panel,
And at least one of a liquid crystal display (LCD) panel, an organic light emitting diodes (OLED) panel, and a plasma display panel (PDP). The method of claim 16, wherein the functional plate,
And at least one of a cover glass, a touch window glass, an AR coated glass, and a 3D glass.

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