KR20130091225A - Functional module and methods for fabricating the same - Google Patents

Abstract

PURPOSE: A functional module is provided to be able to prevent contamination due to particles, and to reduce the equipment investment costs as the roll-to-roll mode equipment does not need to be used. CONSTITUTION: A functional module comprises a film (20) which is attached to a transparent substrate (10) and is able to be exfoliated from the transparent substrate; and a functional layer (40) formed on the film. The transmittance of the film to the exposure light more than 350 nm wavelength is 70% or more. The transmittance to the exposure light less than 350 nm wavelength is 70% or less. A manufacturing method of the functional module comprises a step of attaching the film on a transparent substrate; a step of forming a functional film on the film; and a step of exfoliating the film formed with the functional film from the transparent substrate.

Description

Functional module and methods for fabricating the same

The present invention relates to a functional module and a method of manufacturing the same, and more particularly, to a functional module having a film having a functional film formed thereon which can be attached to and detached from a transparent substrate and performs various roles thereon. will be.

Recently, as the integration of mobile electronic devices and mobile phones is rapidly progressed and the miniaturization process is progressed, touch panel technology, flexible display technology, various electrical films and protective film technologies, and lithography for easily operating mobile multimedia devices Mask technology is also developing remarkably.

In order to implement the above techniques, functional films that can play a specific role on a material film such as a flexible film should be deposited. Conventionally, the functional films are formed by a continuous sputtering process on a flexible film, for example, a polyethylene terephthalate (PET) film, using a large roll-to-roll sputtering method.

However, in the sputtering process using the roll-to-roll sputtering method, the characteristics and reliability of the formed functional film are very sensitive to various process conditions such as DC power, gas flow rate, process pressure, rolling speed, and the like. In particular, when forming a functional film using a roll-to-roll sputtering process, it is possible to cause physical property unevenness of the functional film due to deformation of the film due to tensile stress and heat.

In addition, since the sputtering process is continuously performed on the flexible film wound in the form of a roll, the cleaning process for the flexible film does not proceed, and thus there is a problem in that it is vulnerable to contaminants such as particles.

The present invention is a process for attaching a flexible film on a transparent substrate that does not change the external environment such as heat, and forming a film using an inline, cluster or batch type equipment using a transparent substrate rather than a roll-to-roll method on the flexible film. Provided are a functional module in which a functional film having excellent physical properties, in which a film unevenness is prevented due to deformation of a film due to tensile stress and heat, and a method of manufacturing the same.

The present invention provides a functional module capable of adhering to a flexible film on a transparent substrate and before or after the film formation, to perform a cleaning process for the film, thereby preventing contamination by particles and the like, and a method of manufacturing the same.

The present invention provides a functional module and a method of manufacturing the same, which can reduce the cost of equipment installation by eliminating the need to use a roll-to-roll type of equipment by performing a film forming process using only one device for forming a film using a transparent substrate.

The present invention provides a functional module capable of forming a functional module by forming a functional film on a flexible film and reusing the transparent substrate by easily peeling the functional module from the transparent substrate, and a method of manufacturing the same.

The functional module according to an embodiment of the present invention is attached on a transparent substrate, and includes a film peelable from the transparent substrate and a functional film formed on the film.

The functional film has a film shape or a patterned shape.

The functional film may include a transparent conductive oxide (TCO), an anti-reflective film, an anti-reflective film, a low-e film, a photocatalist film, an EMI film, Conductive film, magnetic film, gas barrier film, Flexible Copper Clad Laminate, phosphorus having the same reflectance as the transparent conductive film so that the wiring pattern of the transparent conductive film is not visible At least one of a blank mask thin film used for an invisible film, an antifouling film, and a photomask.

The film is polyethylene terephthalate (PET), polypropylene (Polypropylene-PP), ABS resin (Acrylonitrile-butadiene-styrene Resin), epoxy resin (Low Density Polyethylene (LDPE), polystyrene) (Polystyrene-PS), Polyamide (PA), Polyacetal (Polyacetal-POM), Polybutylene Terephthalate (PBT), Polycarbonate (PC), Polyphenylene Oxide- MPPO), polyphenylene sulfide resin (PPS), polyimide resin (PI), polyether-ether-ketone (PEEK), polyvinyl chloride resin (PVC) ), Polymethacrylic (PMMA), SAN resin (Acrylonitrlle styrene Resin), thermoplastic polyurethane elastomer (Thrmo Plastic-Polyurethane-TPU), thermoplastic elastomer (Thrmo Plastic Elastomer-TPE), fire Polyester resin comprises at least one material selected from the group consisting of (Unsaturaed polyester resin).

The film is attached onto the transparent substrate through an adhesive member or attached to the transparent substrate by a method of compressing under vacuum and high pressure.

The said film has 70% or more of the transmittance | permeability with respect to the exposure light of 350 nm wavelength or more in exposure light, and is 70% or less with respect to the exposure light of 350 nm wavelength or less.

The light passing through the transparent substrate and the film has a transmittance of 70% or more with respect to exposure light of 350 nm or more.

When the functional film is a blank mask thin film, the functional film may be a light shielding film, an antireflection film, a phase inversion film, an etch stop film, a hard mask film, and may be formed of one of the films, or a single layer film or one or more selected films. It consists of laminated multilayer films.

The functional film is one selected from Ti, V, Co, Ni, Zr, Nb, Pd, Zn, Cr, Al, Mn, Cd, Mg, Li, Se, Cu, Mo, Hf, Ta, W, Ag, Fe It consists of the above materials, or consists of any one or more of nitrogen (N), carbon (C), oxygen (O), hydrogen (H) and fluorine (F) in a single metal, single layer film or multilayer film Is made in the form of.

When the functional film is a film used for a touch panel, the functional film includes at least one material of ITO, ZnO, SnO ₂ , SiO ₂ , Nb ₂ O ₅ , TiO ₂ , SiON, Si ₃ N ₄ , and Al ₂ O ₃ . Or made of Ti, V, Co, Ni, Zr, Nb, Pd, Zn, Cr, Al, Mn, Cd, Mg, Li, Se, Cu, Mo, Hf, Ta, W, Ag, Fe 1 It is composed of at least one material or at least one of nitrogen (N), carbon (C), oxygen (O), hydrogen (H) and fluorine (F) in the single metal, in the form of a single layer or a multilayer film Is done.

The film has a film shape or a patterned shape, and in the case of a multilayer film, the laminated films all have the shape of a film or at least one film is patterned.

In addition, the method of manufacturing a functional module according to an embodiment of the present invention, the step of attaching a film on a transparent substrate, forming a functional film on the film and the step of peeling the film on which the functional film is formed from the transparent substrate It includes.

The functional film on the film is formed of a single layer film or a multilayer film.

The method may further include patterning at least one functional film before the peeling of the film.

Attaching the film peeled off the transparent substrate onto another material film.

The method may further include cleaning the film before attaching the film on the transparent substrate.

After attaching the film on the transparent substrate, further comprising the step of cleaning the film.

The film is attached onto the transparent substrate via an adhesive member or by a crimping method in a vacuum or high pressure state.

The present invention is a film forming process using an inline, cluster or batch type of equipment using a transparent film to attach a flexible film on a transparent substrate that does not change the external environment, such as heat, and a roll-to-roll, not a roll-to-roll method on the flexible film It is possible to provide a functional module in which a functional film of excellent physical properties in which the film unevenness due to deformation of the film due to tensile stress and heat is prevented is formed.

In addition, the present invention can proceed the cleaning step for the film before or after the film is deposited on the transparent substrate to prevent contamination by particles and the like.

In addition, the present invention does not need to use a roll-to-roll type of equipment by using only one device for forming a film by using a transparent substrate, thereby reducing equipment cost.

In addition, the present invention can form a functional module by forming a functional film on a flexible film, and the transparent substrate can be reused by easily peeling the functional module from the transparent substrate.

1A and 1C are cross-sectional views illustrating a functional module according to an embodiment of the present invention.
2 is a plan view showing a film according to an embodiment of the present invention.
3A to 3C are diagrams for explaining a method for manufacturing a functional module according to an embodiment of the present invention.
4A and 4B illustrate a method of reusing a functional module and a transparent substrate according to an exemplary embodiment of the present invention.
Figure 5 is a graph shown for explaining the transmittance of the film according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1C are cross-sectional views illustrating a functional module according to an embodiment of the present invention, and FIG. 2 is a plan view showing a film according to an embodiment of the present invention.

1A, 1C, and 2, the functional module 50 according to the embodiment of the present invention may include a film 20 attached to the transparent substrate 10 and a functional film deposited on the film 20. 40, 60).

The transparent substrate 10 includes synthetic quartz glass, soda lime glass, alkali-free glass, low thermal expansion glass, and the like, and is used for blank masks, blank masks, or photomasks for semiconductors, flat panel displays, and the like. Or a glass substrate for producing a product for FPD.

The film 20 is attached onto the transparent substrate 10 via the adhesive member 30 or compressed on the transparent substrate 10 in a vacuum and high pressure state, for example, a laminating method. do. The adhesive member 30 may have various forms such as a polymer material or a tape, and is formed of a material having strong adhesive force and a small shrinkage and expansion rate due to heat, and a transparent substrate by light of a specific wavelength such as ultraviolet light, specific sound waves or materials. It is formed of a material that can be easily peeled off from (10).

The film 20 is made of polyethylene terephthalate (PET), polypropylene (PP), ABS resin (Acrylonitrile-butadiene-styrene Resin), epoxy resin, low density polyethylene (Low Density Polyethylene-LDPE) , Polystyrene (PS), polyamide (Polyamide-PA), polyacetal (Polyacetal-POM), polybutylene terephthalate (PBT), polycarbonate (PC), polyphenylene oxide (Polypenylene oxide) Oxide-MPPO, Polyphenylene sulfide resin (PPS), Polyimide resin (PI), Poly ether-ether-ketone (PEEK), Polyvinyl chloride Resin -PVC), Polymethacrylic (PMMA), SAN Resin (Acrylonitrlle styrene Resin), Thermoplastic Elastomer (Thrmo Plastic-Polyurethane-TPU), Thermoplastic Elastomer (TPE), Unsaturated Material such as a polyester resin (polyester resin Unsaturaed) that, alone or in combination are formed in the form of a film.

Referring to FIG. 2, the film 20 may be attached to a portion where the functional film 40 on the transparent substrate 10 is formed or a portion required over the entire surface.

As the functional module 50 is peeled off from the transparent substrate 10 and reused in a manner of being attached onto another material film, the functional films 40 and 60 formed on the film 20 may have various shapes. In detail, the functional films 40 and 60 may have a film shape or a patterning shape, and may have a single layer or a multilayer structure. In the case of a multilayer film, the stacked films may all have the shape of a film, or at least one film may be formed. Has a patterned shape. The functional module 50 may be peeled off to have the form of a touch panel, a flexible display field, various electrical films, and a protective film.

The functional films 40 constituting the functional module 50 may include, for example, a transparent conductive oxide (TCO), an anti-reflection film (Reflective), a low e film, Photocatalist film, EMI film, conductive film, magnetic film, gas barrier film, flexible copper clad laminate, transparent conductive film It may be an invisible film or a pollution prevention film having a reflectance equivalent to that of the transparent conductive film so that the wiring pattern is not visible.

When the functional module 50 is a transparent conductive film, the functional film 40 formed on the film 20 may be formed of, for example, ITO, ZnO, SnO _2, or the like, formed on the entire surface of the film 20. Or in the form of a pattern. When the functional module 50 is an anti-reflection film, the functional film 40 has a multilayer structure in which materials such as SiO ₂ , Nb ₂ O ₅ , TiO _2, and the like are stacked. For example, the hard coating layer, the high refractive index layer, and the like. 3 layers structure composed of low refractive index layer, 4 layers structure composed of hard coating layer, middle refractive index layer, high refractive index layer and low refractive index layer and hard coating layer, high refractive index layer, low refractive index layer, high refractive index layer and low refractive index layer. It can have a variety of forms, such as the structure of the five layers configured. When the functional module 50 is a reflective film, the functional film 40 may have a structure in which metal materials such as Al and Ag are formed on the SiO ₂ layer, which is a resin layer. When the functional module 50 is a low emission film, the functional film 40 may have a multi-layered structure in which ZnO, Ag, SnO _2, and the like are stacked on the film 20. When the functional module 50 is a photocatalytic film, the functional film 40 may be a film on which the TiO ₂ is formed, for example. When the functional module 50 is an electromagnetic shielding film, the functional film 40 may have a single layer or a multilayer structure formed of metal materials such as ZnO, Ag, Cu, and Al. When the functional module 50 is a conductive film, the functional film 40 may have a single layer or a multilayer structure formed of materials such as Al, Cu, Ni, and Cr. When the functional module 50 is a magnetic film, the functional film 40 may have a single layer or a multilayer structure formed of materials such as Fe, Co, and Ni. When the functional module 50 is a gas light transmitting film, the functional film 40 may have a single layer or a multilayer structure formed of materials such as SiO ₂ , SiON, Si ₃ N ₄ , and Al ₂ O ₃ . When the functional module 50 is a flexible circuit board, the functional film 40 may have a single layer or a multilayer structure formed of materials such as Cr and NiCr. For example, when the functional film 40 is a film used for a touch panel, the functional film 40 may include ITO, ZnO, SnO ₂ , SiO ₂ , Nb ₂ O ₅ , TiO ₂ , SiON, Si ₃ N ₄ , Al ₂ O ₃ It may be made of thin films formed of any one or more of the materials.

In addition, the functional module 50 may be used as a blank mask used in the photomask. In this case, the functional film 40 may be made of only a metal material as a metal film, or may include one or more metals and silicon (Si), and may include nitrogen (N), carbon (C), oxygen (O), It may further include any one or more materials of hydrogen (H) and fluorine (F). Metals constituting the metal film include, for example, titanium (Ti), vanadium (V), cobalt (Co), nickel (Ni), zirconium (Zr), niobium (Nb), palladium (Pd), and zinc (Zn). ), Chromium (Cr), aluminum (Al), manganese (Mn), cadmium (Cd), magnesium (Mg), lithium (Li), selenium (Se), copper (Cu), molybdenum (Mo), hafnium (Hf) ), Tantalum (Ta), and tungsten (W). The functional film 40 may be in the form of a single film or may be in the form of a continuous film in which components are changed stepwise or continuously.

The functional film 40 may be a light shielding film, an antireflection film, a phase inversion film, an etch stop film, or a hard mask film. The functional film 40 may be formed of one of the above-described films, or may be formed by stacking one or more selected films. When the functional film 40 is laminated with one or more of the films, the films may be formed of a material having the same etching characteristics or etching selectivity with respect to the same etching material except for an etching rate. For example, when the metal film 30 is laminated in the order of the light shielding film, the antireflection film, and the hard mask film, the hard mask film has an etch selectivity with respect to the light shielding film and the antireflection film, and thus, when the hard mask film is patterned, the light shielding film The anti-reflection film is not etched, and the hard mask film serves as a mask when the light shielding film and the anti-reflection film are etched.

3A and 3B are diagrams for explaining a method of manufacturing a functional module according to an embodiment of the present invention.

Referring to FIG. 3A, the functional module 50 according to the embodiment of the present invention attaches the film 20 to the required size through the adhesive member 30 on the transparent substrate 10. The film 30 is strongly adhered onto the transparent substrate 10 without deformation under external environmental conditions such as heat through the adhesive member 30 in a vacuum or high pressure state, thereby forming a functional film 40 that proceeds subsequently. At the time of deformation, deformation of the film 20 hardly occurs. The film 20 may be attached to the transparent substrate 10 by various methods including a compression process so that the flatness after attachment is similar to the flatness of the transparent substrate 10. Any method that satisfies the flatness may be used. Do.

Subsequently, the functional film 40 is formed on the film 20. The functional film 40 may include, for example, a transparent conductive oxide (TCO), an anti-reflection film (Anti Reflection), a reflective film, a low e film, a photocatalist film, and an electromagnetic wave. Transparent conductive film so that wiring patterns of EMI film, conductive film, magnetic film, gas barrier film, flexible copper clad laminate, and transparent conductive film are not visible It may be an invisible film, an antifouling film, a film for a blank mask, or a film for a photomask having a reflectance equivalent to the same.

The functional film 40 is not formed by a roll-to-roll method of sputtering, but a chemical vapor deposition (CVD) method or a sputtering method on the film 20 attached to the transparent substrate 10. It can be formed by various methods such as PVD (Physica Vapor Deposition) method, atomic layer deposition (Atomic layer deposition) method, thermal oxidation method including. This is to remove contaminants such as particles, and as the patterns of the semiconductor device and the FPD device are miniaturized and the pattern of the photomask is also miniaturized, the particles have a great influence on the yield of the photomask. The roll-to-roll sputtering process is vulnerable to contaminants such as particles as the cleaning process for the film 20 does not proceed during and after the attachment of the lower film 20. However, when the deposition process is performed using the inline equipment, the cluster equipment, or the batch type deposition equipment, the cleaning process may be performed on the film 20 to prevent contamination by particles or the like. In addition, by performing the film forming process on the transparent substrate using the film forming method as described above, it is possible to prevent the film unevenness due to the deformation of the film due to the tensile stress and heat generated when the film is formed using the roll-to-roll sputtering process have. When the film forming process is performed using the film forming equipment into which the transparent substrate is introduced as described above, without using the roll-to-roll sputtering method, roll to roll is performed by using only one of the equipment used for the film forming process. There is no need to use equipment to reduce the cost of equipment. In addition, when the functional film 40 is formed, a jig may be disposed at an edge portion of the film 20 to prevent peeling of the film 20.

Referring to FIG. 3B, the photoresist film 60 is formed on the functional film 40 for the functional module 50 requiring the pattern, and the photoresist pattern 60a is formed by performing exposure and development processes. The etching process is performed to form the functional film pattern 40a and to remove the photoresist pattern. In this case, when the functional film 40 is formed of a plurality of laminated films, the photoresist pattern forming process and the etching process may be performed a plurality of times as necessary.

4A and 4B illustrate a method of reusing a functional module and a transparent substrate according to an exemplary embodiment of the present invention.

4A and 4B, after manufacturing of the functional module 50 according to the embodiment of the present invention, the transparent substrate 10 is peeled off from the transparent substrate 10 in the form of a film to form another material film ( Shutrate 70 is attached to the adhesive member 30 through the medium can be used in the touch panel, flexible display field, various electrical films and protective films, lithography and the like. The material film 70 may be, for example, a glass substrate for a touch screen, a medium for manufacturing a flexible display, an electronic device product, or a substrate for manufacturing a photomask of another type.

In addition, the transparent substrate 10 from which the functional module 50 has been peeled off can be reused. That is, when the functional module 50 is formed, the transparent substrate 10 is not damaged as the functional films 40 are formed on the film 20. Accordingly, the transparent substrate 10 performs a simple cleaning process. Can be reused after. For example, when the functional module 50 is used as a pattern for a photomask, since the transparent substrate 10 does not undergo an etching process or the like when the film 20 is removed, it is not damaged and thus scratches are not present. It has a flatness similar to that of. Therefore, the transparent substrate 10 from which the film 20 is removed is subjected to a constant cleaning process, and then the film 20 is attached again to form a functional film pattern, that is, a metal film pattern, or the transparent substrate 10. It can be reused by forming a functional film pattern directly on the surface of the film.

5 is a graph illustrating the transmittance of a film according to an embodiment of the present invention.

Referring to FIG. 5, the film 20 has a transmittance of 70% or more with respect to the exposure light of 350 nm wavelength or more and the transmittance of 70% or less with respect to the exposure light of 350 nm wavelength or less. Light passing through the transparent substrate 10 and the film 20 has a transmittance of 70% or more with respect to the exposure light of 350nm or more. Therefore, the film 20 can function as an optical filter film which transmits most of exposure light of a desired wavelength, especially exposure light of 350 nm wavelength or more, and almost blocks exposure light of 350 nm wavelength or less.

For example, when the functional module 50 is used for a blank mask and a photomask, especially when used as a photomask for manufacturing FPD, only the exposure light of 350 nm wavelength or more is transmitted, and the exposure light of 330 nm wavelength or less It is not necessary to separately install an optical filter in the exposure apparatus by the film which almost blocks. Therefore, there is no fear that the energy characteristic of the exposure light deteriorates due to deterioration of the optical filter, and the cost and effort for replacing the optical filter can be reduced.

As described above, the functional module according to the present invention attaches the film on a material having no change in the external environment such as heat, such as synthetic quartz glass, soda lime glass, alkali free glass, low thermal expansion glass, and rolls on top of the film. In-line, cluster or batch type equipment using a transparent substrate rather than a two-roll method is used to form a functional film used in the touch panel, flexible display field, various electrical films and protective films, lithography, and the like.

Accordingly, the cleaning process may be performed before and after the film is attached on the transparent substrate, thereby preventing contamination by particles or the like. In addition, unevenness of the film due to deformation of the film due to tensile stress and heat generated when forming a film using a roll-to-roll sputtering process can be prevented. In addition, since the film forming process is performed using only one device to form a film by using a transparent substrate, it is not necessary to use a roll-to-roll type device, thereby reducing equipment cost.

In addition, since the film can transmit only light of a specific wavelength or more, it may serve as an optical filter without forming a separate film.

In addition, since the film can be easily peeled from the transparent substrate, an expensive transparent substrate can be reused.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation in the embodiment in which said invention is directed. It will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the appended claims.

10: transparent substrate
20: Film
30: Adhesive member
40: functional film
50: functional module
60 photoresist film
70: material film

Claims (18)

A film attached to the transparent substrate and peelable from the transparent substrate; And
A functional film formed on the film;
Functional module containing. The method of claim 1,
Wherein said functional film has a film shape or a patterned shape. The method of claim 1,
The functional film may include a transparent conductive oxide (TCO), an anti-reflective film, an anti-reflective film, a low-e film, a photocatalist film, an EMI film, Conductive film, magnetic film, gas barrier film, Flexible Copper Clad Laminate, phosphorus having the same reflectance as the transparent conductive film so that the wiring pattern of the transparent conductive film is not visible Functional module, characterized in that any one or more of the blank film (Invisible film), anti-fouling film, a thin film of the blank mask used in the photomask. The method of claim 1,
The film is polyethylene terephthalate (PET), polypropylene (Polypropylene-PP), ABS resin (Acrylonitrile-butadiene-styrene Resin), epoxy resin (Low Density Polyethylene (LDPE), polystyrene) (Polystyrene-PS), Polyamide (PA), Polyacetal (Polyacetal-POM), Polybutylene Terephthalate (PBT), Polycarbonate (PC), Polyphenylene Oxide- MPPO), polyphenylene sulfide resin (PPS), polyimide resin (PI), polyether-ether-ketone (PEEK), polyvinyl chloride resin (PVC) ), Polymethacrylic (PMMA), SAN resin (Acrylonitrlle styrene Resin), thermoplastic polyurethane elastomer (Thrmo Plastic-Polyurethane-TPU), thermoplastic elastomer (Thrmo Plastic Elastomer-TPE), fire Polyester resin (polyester resin Unsaturaed) of the functional module, characterized in that made including at least one material. The method of claim 1,
And said film is attached onto said transparent substrate by means of an adhesive member or by compression under vacuum and high pressure. The method of claim 1,
The film has a transmittance of 70% or more for exposure light of 350 nm wavelength or more, and transmittance of 70% or less for exposure light of 350 nm wavelength or less. The method of claim 1,
The light passing through the transparent substrate and the film has a transmittance of 70% or more for the exposure light of 350nm or more. The method of claim 1,
When the functional film is a blank mask thin film, the functional film may be a light shielding film, an antireflection film, a phase inversion film, an etch stop film, a hard mask film, and may be formed of one of the films, or a single layer film or one or more selected films. Functional module comprising a laminated multilayer film. The method of claim 1,
The functional film is one selected from Ti, V, Co, Ni, Zr, Nb, Pd, Zn, Cr, Al, Mn, Cd, Mg, Li, Se, Cu, Mo, Hf, Ta, W, Ag, Fe It consists of the above materials, or consists of any one or more of nitrogen (N), carbon (C), oxygen (O), hydrogen (H) and fluorine (F) in a single metal, single layer film or multilayer film Functional module, characterized in that consisting of. The method of claim 1,
When the functional film is a film used in a touch panel, the functional film may include ITO, ZnO, SnO ₂ , SiO ₂ , Nb ₂ O ₅ , TiO ₂ , SiON, Si ₃ N ₄ , Al ₂ O ₃ Made of any one or more of the materials, or Ti, V, Co, Ni, Zr, Nb, Pd, Zn, Cr, Al, Mn, Cd, Mg, Li, Se, Cu, Mo, Hf, Ta, W At least one selected from Ag, Fe, or any one or more of nitrogen (N), carbon (C), oxygen (O), hydrogen (H), and fluorine (F) in the single metal. Functional module characterized in that the form of a single layer film or a multilayer film. 11. The method according to any one of claims 8 to 10,
Wherein the film has a shape or a patterned shape of a film, and in the case of a multilayer film, all of the stacked films have a shape of a film or at least one film has a patterned shape. Attaching a film on the transparent substrate;
Forming a functional film on the film; And
Peeling the film on which the functional film is formed from the transparent substrate;
Method for producing a functional module comprising. 13. The method of claim 12,
The functional film on the film is a manufacturing method of the functional module, characterized in that formed in a single layer film or a multilayer film. The method according to claim 12 and 13,
And prior to peeling off the film, patterning at least one of the functional films. 13. The method of claim 12,
And attaching the film peeled off the transparent substrate onto another material film. 13. The method of claim 12,
And before the step of attaching the film on the transparent substrate, cleaning the film. 13. The method of claim 12,
And after the adhering the film on the transparent substrate, cleaning the film. 13. The method of claim 12,
And the film is attached onto the transparent substrate through an adhesive member or by a crimping method in a vacuum or high pressure state.

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