KR20130064648A - Optical interconnection block, optical printed circuit board and fabricating method of the same - Google Patents

Abstract

PURPOSE: An optical printed circuit board is provided to improve an optical loss characteristic and to reduce thickness of an overall substrate by providing a reflection unit without using an optical waveguide with a bending structure of an optical fiber. CONSTITUTION: An optical connection block(100) includes a vertical coupling groove(110), a horizontal coupling groove(120) and a reflection plate(130). The case forms the exterior and is formed by curing a curable material. The reflection plate maintains its shape by the curable material in the case and is fixed to have a specific inclination angle. The vertical coupling groove couples the other optical connection device in an upper part or a lower part of the optical connection block. The horizontal coupling groove couples the other optical connection device in the left side unit or right side unit of the optical connection block.

Description

Optical connection block, an optical printed circuit board including the same, and a method of manufacturing the same {Optical Interconnection Block, Optical Printed Circuit Board and Fabricating method of the same}

The present invention relates to a structure of an optical printed circuit board and a manufacturing method thereof.

A printed circuit board (PCB), which is generally used, is an electrical printed circuit board, which is coated with a substrate on which a copper thin film circuit is implemented, and is used by electric signal transmission by inserting various components. Such a conventional electric printed circuit board has a problem in signal transmission because it can not follow the electric signal transmission capability of the substrate rather than the processing capability of an electric element as a component.

Especially, these electric signals are sensitive to the external environment and generate noises, which is a great obstacle to electronic products requiring high precision. As a complement to this, an optical printed circuit board using an optical waveguide was developed instead of a metallic circuit such as copper of an electric printed circuit board, and it became possible to produce a high-precision high-tech equipment more stable in radio interference and noise phenomenon.

According to the prior art, in the case of an optical printed circuit board, a mirror is formed on an inner core layer to manufacture an optical waveguide, as disclosed in Prior Document 1 (Publication No. 10-2010-0112731).

That is, in the case of the conventional optical waveguide, as described in the prior document 1 has a mirror to minimize the optical waveguide loss at the end of the optical waveguide, a metal thin film process is added to form the mirror portion in the optical waveguide fabrication.

However, in the prior document 1, the core protruding to the outside is difficult to maintain the angle due to deformation (curing or torsion, etc.) due to heat, pressure, and resin flow during lamination in the process of embedding the printed circuit board. have.

In other words, in the process of embedding the optical waveguide inside the printed circuit board, the mirror at the end of the optical waveguide is damaged, so that the optical path is changed or the optical path is damaged.

In an embodiment according to the present invention, an optical connection block having a new structure, an optical printed circuit board including the same, and a manufacturing method thereof will be provided.

 Technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned above are clearly understood by those skilled in the art to which the embodiments proposed from the following description belong. Could be.

Optical connection block according to an embodiment of the present invention forms the appearance, the case formed by the curing of the cured material; And a reflection part fixed and inserted into the case by curing the curable material and having a predetermined inclination angle with respect to the path of light.

In addition, an optical printed circuit board according to an embodiment of the present invention comprises a first insulating layer; At least one optical connection block embedded in the first insulating layer and including a reflector for reflecting incident light; At least one optical waveguide coupled to the optical connecting block at one side of the optical connecting block and providing a path of light reflected through the optical connecting block; And an optical transmitter and an optical receiver electrically connected to a circuit pattern formed on or below the optical connection block.

In addition, the method of manufacturing an optical printed circuit board according to an embodiment of the present invention comprises the steps of preparing an insulating substrate having at least one circuit pattern; Forming a cavity penetrating the upper and lower surfaces of the prepared insulating substrate; Forming an optical connection block including a reflective plate and an optical waveguide coupled to the optical connection block in the formed cavity; And forming an optical device on at least one of upper and lower portions of the optical connection block.

According to an exemplary embodiment of the present invention, the optical loss can be improved by providing a reflector without using an optical waveguide or an optical fiber having a bending structure, and at the same time, the overall thickness of the substrate can be reduced.

In addition, according to an embodiment of the present invention, the optical connection block and other optical connection devices (external devices, optical connection blocks, optical waveguides, optical fibers, etc.) may be aligned by coupling using coupling grooves and coupling pins.

In addition, according to an embodiment of the present invention, it is possible to provide optical coupling paths of various three-dimensional structures using a single or a plurality of optical connection blocks.

1 is an external view of an optical connection block according to an embodiment of the present invention.
2 is a perspective view of an optical connection block according to an embodiment of the present invention.
3 to 5 are views for explaining a reflector formed inside the optical connection block.
6 is a view illustrating an optical waveguide according to an embodiment of the present invention.
7 is a diagram illustrating a connection relationship between an optical connection block and an optical waveguide.
8 is a view illustrating an optical printed circuit board according to an exemplary embodiment of the present invention.
9 to 12 are cross-sectional views illustrating a method of manufacturing the optical printed circuit board shown in FIG. 8 in order of process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In an embodiment according to the present invention, the optical loss characteristics may be improved by providing a reflector without using an optical waveguide or an optical fiber having a bending structure, and at the same time, the overall thickness of the substrate may be reduced. In addition, according to an embodiment of the present invention, the optical connection block and another optical connection device (external device, optical connection block, optical waveguide, optical fiber, etc.) may be aligned by coupling using a coupling groove and a coupling pin. According to the embodiment of the present invention, the optical coupling path of various three-dimensional structures can be provided using a single or a plurality of optical connection blocks.

1 is an external view of an optical connection block according to an embodiment of the present invention, the second is a perspective view of the optical connection block according to an embodiment of the present invention.

1 and 2, the optical connection block 100 forms an appearance, and a case (optical connection block itself) formed by hardening of a cured material, and a vertical coupling groove formed through the upper and lower surfaces of the case. 110 and a horizontal coupling groove 120 formed through the left and right sides of the case, and fixed and inserted into the case, and a reflecting plate 130 having a predetermined inclination angle.

The case forms an appearance and is formed by hardening of the cured material.

The reflective plate 130 is maintained in the case by the cured material and is fixed at a predetermined inclination angle.

The vertical coupling groove 110 is provided to couple another optical connection device to the top or bottom of the optical connection block 100.

By the optical coupling device coupled to the upper or lower portion of the optical connection block 100 by the vertical coupling groove 110, the path of the light can be changed from the first direction to the upper direction or the lower direction.

The horizontal coupling groove 120 is provided to couple another optical connection device to the left side or the right side of the optical connection block 100.

By the optical coupling device coupled to the left side or the right side of the optical connection block 100 by the horizontal coupling groove 120, the path of the light can be changed from the second direction to the left or right direction.

The case is formed of a light transmissive material. This is to efficiently transmit the light to the reflective plate 130 formed inside the case without losing the light.

The case is made of a polymer-based material such as acrylic, epoxy, polyimide, fluorinated acrylic, or fluorinated polyimide.

The reflector 130 has a predetermined inclination angle and is fixedly inserted into the case. The inclination angle can be changed with respect to the path of light.

For example, when the light incident from the upper direction is to be reflected in the right direction, the reflecting plate 130 is formed to be inclined 135 ° based on the lower surface and the left surface of the case. In addition, when reflecting the light incident from the upper direction in the left direction, the reflecting plate 130 is formed to be inclined 45 ° with respect to the lower surface and the left surface of the case.

However, when the reflective plate 130 is formed to be inclined at an angle of any of 45 ° or 135 °, and the optical connection block on which the reflective plate 130 is formed is rotated, the reflective plate 130 located inside the rotating direction is rotated. Since the reflection plate 130 is changed to 135 ° or 45 °, the reflection plate 130 may be formed only at 45 ° or 135 °.

A method of manufacturing the optical connection block as described above will be briefly described.

First, the reflector plate 130 is prepared.

The reflective plate 130 may be prepared by preparing a thin plate having an arbitrary area and forming a metal layer based on a metal material on both surfaces of the prepared thin plate. The metallic material includes aluminum or silver with high reflectivity. In addition, the metal layer may be formed by various methods such as sputtering or plating.

Subsequently, when the metal layer is formed, the thin plate is cut into an arbitrary size (for example, several μm to several mm) to manufacture the reflective plate 130.

Thereafter, the formed reflector is fixed to the prepared frame. In this case, the reflector 130 has a predetermined inclination angle as described above, and is fixed inside the frame.

In addition, the cured material is introduced into the frame in which the reflector is fixed, thereby curing the injected cured material to form an outer case, and when the outer case is formed, the reflector 130 existing therein is It is fixed inside the case by curing the cured material.

Thereafter, the case formed by hardening of the cured material is cut to a predetermined size to manufacture an optical connection block 100 of individual units.

As described above, the cured material may include an epoxy series having excellent light transmittance, and may further include a polymer series such as acrylic, polyimide, and fluorinated acrylic or fluorinated polyimide.

3, 4, and 5 are diagrams for describing the reflector 130 formed in the optical connection block 100.

Referring to FIG. 3, the optical connection block 100 may change a transmission path of light. That is, the light incident from the left side is reflected to the upper side perpendicular to the incident direction.

A light source positioned on the upper side of the reflective plate 130 by reflecting light incident from the optical coupling device coupled to the left side by the horizontal coupling groove 120 of the optical connecting block 100 upward. I can pass it on.

At this time, the light is reflected by the upper surface of the reflecting plate 130, it is reflected in the vertical direction of the incident direction.

In addition, referring to FIG. 3, the reflector 130 may reflect light incident from the upper side in a left direction that is a vertical direction of the incident direction.

Referring to FIG. 4, the optical connection block 100 may change the transmission path of light differently. That is, the reflector 130 may reflect light incident from the lower side in a right direction perpendicular to the incident direction.

4, the optical connection block 100 reflects light incident from the right side in a downward direction perpendicular to the incident direction.

In this case, the light is reflected by the lower surface of the reflecting plate 130, it is reflected in the vertical direction of the incident direction.

In addition, referring to FIG. 5, the optical connection block 100 may change the transmission path of light differently.

That is, the upper surface of the reflecting plate 130 reflects the light incident from the upper side in the left direction, which is the vertical direction in the incident direction, or reflects the light incident in the left direction, in the upper direction, the vertical direction of the incident direction.

In addition, the lower surface of the reflector 130 reflects light incident from the lower side in the right direction, which is the vertical direction in the incident direction, or reflects light incident in the right direction, in the lower direction, the vertical direction of the incident direction.

Accordingly, even one reflective plate 130 may provide a transmission path for a plurality of lights.

6 is a view illustrating an optical waveguide according to an embodiment of the present invention.

The optical waveguide 200 includes a first cladding layer 210, a first core layer 220, a second cladding layer 230, a second core layer 240, and a third cladding layer 250.

In this case, coupling grooves are formed on the left side and the right side of the optical waveguide 200. The formed coupling groove is provided for coupling with the optical connection block 100 described above by a coupling pin.

Preferably, the coupling grooves are formed on the left side and the right side of the first cladding layer 210 and the left side and the right side of the third cladding layer 210.

This is to minimize the loss of light transmitted to the first core layer 220 and the second core layer 240 by the insertion of the coupling pin.

An optical waveguide according to an embodiment of the present invention includes a plurality of core layers.

This is different from the core layer providing the path of the light reflected through the first surface of the reflecting plate 130 included in the optical connection block 100 and the core layer providing the path of the light reflected through the second surface. This is to minimize the loss of light.

The first cladding layer 210 and the second cladding layer 230 are formed to surround the first core layer 220, and the second cladding layer 230 and the third cladding layer 250 are the second core layer 240. ) Is formed by wrapping.

The first, second and third cladding layers 210, 230, and 250 may be made of a polymer-based material such as, for example, acrylic, epoxy, polyimide, fluorinated acrylic, or fluorinated polyimide. Is done.

The first core layer 220 and the second core layer 240 are interposed between the first and second cladding layers or the second cladding layer and the third cladding layer, and serve as a path through which an optical signal is transmitted.

The first and second core layers 220 and 240 are also made of a polymer-based material similar to the first, second and third cladding layers 210, 230, and 250, and are higher than the cladding layer for efficient optical signal transmission. Has a refractive index. In this case, the first and second core layers 220 and 240 may be formed of SiO ₂ mixed with silica or a polymer.

In this case, the first core layer 220 is disposed inside the first cladding layer 210 and the second cladding layer 230, and compared with the first cladding layer 210 and the second cladding layer 230. Since it has a high refractive index, light passing through the first core layer 220 is totally reflected at the interface between the first core layer 220 and the first and second cladding layers 210 and 230, so that the first core layer Proceed along 220.

Similarly, the second core layer 240 is disposed inside the second cladding layer 230 and the third cladding layer 250, and is disposed on the second cladding layer 230 and the third cladding layer 250. Since it has a relatively high refractive index, the light passing through the second core layer 240 is totally reflected at the interface between the second core layer 240 and the second and third cladding layers 230 and 250, so that the second core Proceed along layer 240.

Meanwhile, the optical waveguide 200 as described above may be formed by an embossing process or a photolithography process using a polymer material having excellent light transmittance and flexibility, for example, an organic-inorganic polymer material.

In this case, the organic-inorganic polymer material may be, for example, low density polyethylene, low-density polyethylene (LLDPE), high density polyethylene, polypropylene, amide series nylon 6 6, nylon 66, nylon 6/9, nylon 6/10, nylon 6/12, nylon 11, nylon 12, polystyrene Polyvinyl chloride, polyvinylidene chloride, polycarbonate, cellulose acetate, or poly (meth) acrylate. The polyvinylidene chloride may be selected from the group consisting of polystyrene, polyethyleneterephthalate, polybutyl terephthalate, polyvinyl chloride, ) Acrylate (poly (meth) acrylate). Of these materials, any of these materials may be selected in consideration of their thermal and mechanical properties It may be made by a combination thereof.

7 is a diagram illustrating a connection relationship between an optical connection block and an optical waveguide.

The first optical waveguide 200 is coupled to the left side of the optical connection block 100, and the second optical waveguide 300 is coupled to the right side of the optical connection block 100. Combined.

Accordingly, the lower surface of the reflective plate 130 provided in the optical connection block 100 reflects the light transmitted through the first core layer 220 of the first optical waveguide 200, and the optical connection block 100 The upper surface of the reflective plate 130 provided in the reflects the light incident from the upper side to the second core layer 340 of the second optical waveguide 300.

Accordingly, one optical connection block 100 may be provided to process a plurality of lights.

8 is a view illustrating an optical printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 8, the optical printed circuit board 400 may be buried in a first insulating layer 410, a circuit pattern 420 formed on the first insulating layer 410, and inside the first insulating layer 410. At least one optical connection block (100a, 100b, 100c), at least one optical waveguide (200, 300) coupled with the at least one optical connection block (100a, 100b, 100c), and the first insulating layer (410) Of the optical transmitter and the optical receiver 440, 450, 460, 470 formed on the upper or lower portion of the optical connection block (100a, 100b, 100c) is formed, the second surface formed on the upper and lower surfaces of the first insulating layer 410 An insulating layer 480.

The first insulating layer 410 and the second insulating layer 480 function as a base member to provide durability to the optical printed circuit board.

The first and second insulating layers 410 and 480 may be support substrates of an optical printed circuit board on which a single circuit pattern is formed, but one circuit pattern 420 is formed among the optical printed circuit boards having a plurality of stacked structures. It may also mean an insulating layer region.

When each of the first and second insulating layers 410 and 480 means one insulating layer among a plurality of stacked structures, a plurality of circuit patterns are continuously formed on or under the first and second insulating layers 410 and 480. It can be formed as.

Conductive vias (not shown) may be formed in the first insulating layer 410 to electrically connect circuit patterns between different layers.

The circuit pattern 420 may be made of an electrically conductive metal such as gold, silver, nickel, copper, and the like for electric signal transmission, and is preferably formed using copper.

The circuit pattern 420 may be formed by an additive process, a subtractive process, a modified semi additive process (MSAP), a semi additive process (SAP) process, or the like, which is a conventional manufacturing process of a printed circuit board. Possible details are omitted here.

The first and second insulating layers 410 and 480 may be thermosetting or thermoplastic polymer substrates, ceramic substrates, organic-inorganic composite substrates, or glass fiber impregnated substrates. It may include an epoxy-based insulating resin such as Bismaleimide Triazine (ABS), Ajinomoto Build up Film (ABF), and may also include a polyimide-based resin, but is not particularly limited thereto.

In the first insulating layer 410, a through hole 430 (see FIG. 10) formed through laser machining or cutting is formed.

The optical connection blocks 100a, 100b and 100c and the optical waveguides 200 and 300 are formed in the receiving groove 430.

The optical connection block includes a first optical connection block 100a, a second optical connection block 100b, and a third optical connection block 100c. In each of the optical connection blocks 100a, 100b, and 100c, the reflecting plate is formed to be inclined at a predetermined inclination angle.

Although the drawings illustrate that three optical connection blocks are formed, this is only an example, and the number of formation of the optical connection blocks may be increased or decreased according to the transmission state of light.

Optical waveguides 200 and 300 are connected to the optical connection blocks 100a, 100b, and 100c.

The optical waveguides 200 and 300 may include the first cladding layers 210 and 310, the first core layers 220 and 320, the second cladding layers 230 and 330, the second core layers 240 and 340, and the third. Clad layers 250 and 350 are included.

In this case, coupling grooves are formed on the left and right surfaces of the optical waveguides 200 and 300. The formed coupling grooves are provided for coupling with the optical connection blocks 100a, 100b, 100c described above by the coupling pins.

The optical waveguides 200 and 300 according to the embodiment of the present invention include a plurality of core layers.

The first cladding layers 210 and 310 and the second cladding layers 230 and 330 are formed to surround the first core layers 220 and 320 and the second cladding layers 230 and 330 and the third cladding layer 250. , 350 is formed to surround the second core layers 240 and 340.

The first, second and third cladding layers 210, 230, 250, 310, 330, 350 may be, for example, acryl, epoxy, polyimide, fluorinated acrylic, fluorinated polyimide, or the like. Made of a polymer-based material.

The first core layers 220 and 320 and the second core layers 240 and 340 are interposed between the first and second cladding layers or the second cladding layer and the third cladding layer, and serve as a path for transmitting an optical signal.

The first and second core layers 220, 240, 320, and 340 are also made of a polymer-based material similar to the first, second, and third cladding layers 210, 230, 250, 310, 330, and 350. It has a higher refractive index than the cladding layer for optical signal transmission. In this case, the first and second core layers 220, 240, 320, and 340 may be formed of SiO ₂ in which silica or a polymer is mixed.

In this case, the first core layers 220 and 320 are disposed inside the first cladding layers 210 and 310 and the second cladding layers 230 and 330, and the first cladding layers 210 and 310 are formed. Since the refractive index is higher than that of the second cladding layers 230 and 330, the light passing through the first core layers 220 and 320 may be transferred to the first core layers 220 and 320 and the first and second cladding layers 210 and 210. It is totally reflected at the interface between 230, 310, and 330, and progresses along the first core layers 220 and 320.

Similarly, the second core layers 240 and 340 are disposed inside the second cladding layers 230 and 330 and the third cladding layers 250 and 350, and the second cladding layers 230 and 330. Since the refractive index is higher than that of the third cladding layers 250 and 350, the light passing through the second core layers 240 and 340 is transferred to the second core layers 240 and 340 and the second and third cladding layers 230. , Total reflection at the interface between the 250, 330, and 350 passes along the second core layers 240 and 340.

Meanwhile, the optical waveguides 200 and 300 as described above may be formed by an embossing process or a photolithography process using a polymer material having excellent light transmittance and flexibility, for example, an organic-inorganic polymer material.

In this case, the organic-inorganic polymer material may be, for example, low density polyethylene, low-density polyethylene (LLDPE), high density polyethylene, polypropylene, amide series nylon 6 6, nylon 66, nylon 6/9, nylon 6/10, nylon 6/12, nylon 11, nylon 12, polystyrene Polyvinyl chloride, polyvinylidene chloride, polycarbonate, cellulose acetate, or poly (meth) acrylate. The polyvinylidene chloride may be selected from the group consisting of polystyrene, polyethyleneterephthalate, polybutyl terephthalate, polyvinyl chloride, ) Acrylate (poly (meth) acrylate). Of these materials, any of these materials may be selected in consideration of their thermal and mechanical properties It may be made by a combination thereof.

The first optical waveguide 200 is formed between the first optical connection block 100a and the second optical connection block 100b, and the first optical waveguide 200 is formed between the second optical connection block 100b and the third optical connection block 100c. Two optical waveguides 300 are formed.

In addition, the optical waveguides 200 and 300 may be coupled to an upper side or a lower side of the optical connection block rather than the side of the optical connection block. This is implemented by inserting a coupling pin into a vertical coupling groove provided in the optical connection block.

As such, in the present invention, the optical connection block (100a, 100b, 100c) and the optical waveguide (200, 300) can be easily provided through the appropriate path of movement, and the optical waveguide (200, 300) By not processing, light loss can be minimized.

In addition, by coupling the optical connection blocks (100a, 100b, 100c) and the optical waveguides (200, 300) by the coupling pin, the optical waveguide 200 to the optical connection blocks (100a, 100b, 100c) to minimize the optical loss , 300).

Hereinafter, a manufacturing method of an optical printed circuit board will be described with reference to the accompanying drawings.

9 to 12 are cross-sectional views illustrating a method of manufacturing the optical printed circuit board shown in FIG. 8 in order of process.

Referring to FIG. 9, first, a first insulating layer 410 is prepared. In this case, when the first insulating layer 410 is an insulating layer in which conductive layers (not shown) are stacked, the laminated structure of the first insulating layer 410 and the conductive layer may be a conventional copper clad laminate (CCL). have.

Alternatively, the conductive layer may be a plating layer formed by electroless plating on the upper and lower surfaces of the first insulating layer 410. In this case, when the conductive layer is formed by electroless plating, the plating may be smoothly performed by applying roughness to the upper and lower surfaces of the first insulating layer 410.

Next, the conductive patterns formed on the upper and lower surfaces of the first insulating layer 410 are etched to form a circuit pattern 420.

The circuit pattern 420 may be formed through a dry film lamination, exposure, development, etching, and peeling process.

Next, as shown in FIG. 10, a through hole 430 penetrating the upper and lower surfaces of the first insulating layer 410 is formed.

Next, as shown in FIG. 11, a structure in which the optical connection blocks 100a, 100b and 100c and the optical waveguides 200 and 300 are coupled to each other is inserted into the formed through hole 430.

The inserted structure is the first optical waveguide 200, the first optical waveguide 200 coupled to the right side of the first optical connection block 100a, the optical waveguide 200 according to an embodiment of the present invention The second optical waveguide block 100b coupled to the right side of the second optical waveguide 300 coupled to the right side of the second optical waveguide block 100b and the third optical waveguide 300 coupled to the right side of the second optical waveguide 300. Optical connection block 100c.

The connection state between the optical connection blocks 100a, 100b, and 100c and the optical waveguides 200 and 300 is only an embodiment of the present invention, and optionally, the number of optical waveguides or optical connection blocks can be increased, and optical connection Optical waveguides can be coupled to the upper and lower sides, as well as to the left and right sides of the block.

Next, referring to FIG. 12, a separate circuit pattern for realizing the optical device is further formed on at least one surface of the formed optical waveguides 200 and 300.

An optical device is mounted on the circuit pattern 420 formed on the first insulating layer 410 and the circuit patterns formed on the optical waveguides 200 and 300.

The optical device includes optical transmitters 440 and 460 and optical receivers 450 and 470, the arrangement of which may be determined by the optical connection blocks 100a, 100b and 100c and the optical waveguides 200 and 300.

In an embodiment of the present invention, a first optical transmitter 440 is formed on the first optical connection block 100a, and a second optical transmitter 460 is formed below the second optical connection block 100b. The first optical receiver 450 is formed on the second optical connection block 100b, and the second optical receiver 470 is formed below the third optical connection block 100c.

The optical transmitter generates and outputs an optical signal, and includes a driver integrated circuit (not shown) and a light emitting device (not shown). The light emitting device is driven by the driver integrated circuit to generate light in a direction in which the first mirror 132 is formed.

In this case, the light emitting device may include a vertical-cavity surface-emitting laser (VCSEL) that is a light source device that emits an optical signal. The VCSEL is a light source element that transmits or amplifies a light source signal in a manner of vertically irradiating a laser beam.

The optical receiver includes a receiver integrated circuit (not shown) and a light receiving element (not shown).

The light receiving element receives light generated from the optical transmitter and is driven by the receiver integrated circuit. The light receiving element may include a photo detector (PD), which is an element for detecting an optical signal.

Subsequently, the optical connection blocks 100a, 100b and 100c, the optical waveguides 200 and 300, the optical transmitters 440 and 460 and the optical receivers 450 and 470 are disposed on the upper and lower surfaces of the first insulating layer 410. To form a second insulating layer 480 to be buried.

Looking at the optical path in the optical printed circuit board formed in this way, first the first light is generated by the first optical transmitter 440, the generated first light is reflected by the first optical connection block (100a) It is provided to the second optical connection block 100b along the first optical waveguide 200. The second optical connection block 100b receives the first light and accordingly reflects the first light upwardly perpendicular to the direction of incidence, the reflected first light being first optical receiver 450. Is received by.

In addition, the second light is generated in the second optical transmitter 460, the generated second light is reflected by the second optical connection block (100b) along the second optical waveguide 300, the third optical connection block To 100c. The third optical connection block 100c receives the second light and accordingly reflects the second light downwardly perpendicular to the direction of incidence, the reflected second light being second optical receiver 470. Is received by.

According to the embodiment according to the present invention as described above, it is possible to improve the optical loss characteristics and reduce the overall thickness of the substrate by providing a reflector without using the optical waveguide or the optical fiber of the bending structure.

In addition, according to an embodiment of the present invention, the optical connection block and other optical connection devices (external devices, optical connection blocks, optical waveguides, optical fibers, etc.) may be aligned by coupling using coupling grooves and coupling pins.

In addition, according to an embodiment of the present invention, it is possible to provide optical coupling paths of various three-dimensional structures using a single or a plurality of optical connection blocks.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: optical connection block
200, 300: optical waveguide
400: optical printed circuit board

Claims (26)

A case forming an appearance and formed by curing the cured material; And
And a reflective part fixed and inserted into the case by curing the curable material, the reflector having a predetermined inclination angle with respect to the path of light. The method of claim 1,
The case has a rectangular parallelepiped shape and is formed. The method of claim 1,
The reflector includes:
And an inclination angle of 45 ° or 135 ° with respect to the bottom surface of the case and fixed to the case. The method of claim 1,
And at least one coupling groove formed in the case for coupling with an external device or an optical waveguide. 5. The method of claim 4,
The coupling groove
At least one vertical coupling groove penetrating the upper and lower surfaces of the case;
And at least one horizontal coupling groove penetrating the left and right sides of the case. The method of claim 1,
The cured material,
An optical connecting block, characterized in that the light transmitting material containing any one of epoxy, polyimide, fluorinated acrylic and fluorinated polyimide. A first insulating layer;
At least one optical connection block embedded in the first insulating layer and including a reflector for reflecting incident light;
At least one optical waveguide coupled to the optical connecting block at one side of the optical connecting block and providing a path of light reflected through the optical connecting block;
And an optical transmitter and an optical receiver electrically connected to a circuit pattern formed on or below the optical connection block. 8. The method of claim 7,
The optical connection block,
A rectangular parallelepiped case formed by hardening of the cured material, forming an appearance;
And a reflective part fixedly inserted into the case by curing the cured material and formed to be inclined with respect to a path of light. The method of claim 8,
The reflector includes:
An optical printed circuit board having an inclination angle of 45 ° or 135 ° with respect to a bottom surface of the case and fixed in the case. The method of claim 8,
And at least one coupling groove formed in the case for coupling to an external device or the optical waveguide. The method of claim 8,
The optical waveguide,
The first cladding layer,
A first core layer formed on the first clad layer,
A second clad layer formed on the first core layer;
A second core layer formed on the second clad layer;
An optical printed circuit board comprising a third cladding layer formed on the second core layer. 12. The method of claim 11,
In this case,
An optical printed circuit board formed of a material having a lower refractive index than a material forming at least one of the first core layer and the second core layer. 12. The method of claim 11,
And the first and second core layers are formed of a material having a refractive index higher than that of the materials constituting the first, second and third clad layers. 12. The method of claim 11,
A first coupling groove on at least one side of the optical connection block;
A second coupling groove is formed on at least one side of the first clad layer and the third clad layer,
And a coupling pin, a portion of which is inserted into the first coupling groove and the other portion of which is inserted into the second coupling groove to couple the optical connection block and the optical waveguide. The method of claim 8,
The reflector plate includes a first face and a second face facing the first face,
The first surface of the reflecting plate reflects light incident in the first direction in the second direction,
And a second surface of the reflecting plate reflects light incident in a third direction in a fourth direction. The method of claim 8,
The optical connection block,
A first optical connection block coupled to the left side of the optical waveguide;
And a second optical connection block coupled to the right side of the optical waveguide. Preparing an insulating substrate on which at least one circuit pattern is formed;
Forming a cavity penetrating the upper and lower surfaces of the prepared insulating substrate;
Forming an optical connection block including a reflective plate and an optical waveguide coupled to the optical connection block in the formed cavity; And
Forming an optical device on at least one of the upper and lower portion of the optical connection block. 18. The method of claim 17,
The optical connection block,
A rectangular parallelepiped case formed by hardening of the cured material, forming an appearance;
And a reflective part fixedly inserted into the case by curing the cured material and formed to be inclined with respect to the path of light. 19. The method of claim 18,
The reflector includes:
A method of manufacturing an optical printed circuit board having an inclination angle of 45 ° or 135 ° with respect to a bottom surface of the case and fixed in the case. The method of claim 17,
At least one first coupling groove is formed in the optical connection block for coupling with an external device or the optical waveguide.
A second coupling groove is formed on one side of the optical waveguide,
And inserting a portion of a coupling pin into the first coupling groove and inserting a portion of the coupling pin into the second coupling groove to couple the optical connection block to the optical waveguide. 18. The method of claim 17,
The optical waveguide,
The first cladding layer,
A first core layer formed on the first clad layer,
A second clad layer formed on the first core layer;
A second core layer formed on the second clad layer;
The manufacturing method of the optical printed circuit board comprising a third cladding layer formed on the second core layer. 22. The method of claim 21,
In this case,
The method of manufacturing an optical printed circuit board formed of a material having a lower refractive index than a material forming at least one of the first core layer and the second core layer. 22. The method of claim 21,
And the first and second core layers are made of a material having a refractive index higher than that of the materials constituting the first, second and third clad layers. 22. The method of claim 21,
The reflector plate includes a first face and a second face facing the first face,
The first surface of the reflective plate reflects the first light incident in the first direction in the second direction,
And a second surface of the reflecting plate reflects the second light incident in the third direction in the fourth direction. 25. The method of claim 24,
The first light is transmitted to either the first or second core layer of the optical waveguide formed on the left side of the optical connection block,
And the second light is transmitted to a core layer different from the transmission path of the first light among the second and first core layers of the optical waveguide formed on the right side of the optical connection block. 25. The method of claim 24,
Forming the optical device,
Forming an optical transmitter or an optical receiver on the optical connection block to transmit or receive the first light;
And forming an optical receiver for transmitting or receiving the second light under the optical connection block.

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