KR101875952B1 - Optical interconnection module, printed circuit board and method manufacturing of the pcb the same - Google Patents

Abstract

An optical connection module according to an embodiment of the present invention includes a case which forms an appearance and includes a first groove formed in a central region and a second groove formed in an edge region; A light transmitting portion inserted into the first groove of the case; And an optical connecting block inserted in the second groove of the case.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical connection module, an optical printed circuit board including the optical connection module, and a method of manufacturing the optical connection module.

The present invention relates to an optical printed circuit board including the optical connection module and a method of manufacturing the same.

A printed circuit board (PCB), which is generally used, is an electrical printed circuit board, which is coated with a substrate on which a copper thin film circuit is implemented, and is used by electric signal transmission by inserting various components. Such a conventional electric printed circuit board has a problem in signal transmission because it can not follow the electric signal transmission capability of the substrate rather than the processing capability of an electric element as a component.

Especially, these electric signals are sensitive to the external environment and generate noises, which is a great obstacle to electronic products requiring high precision. As a complement to this, an optical printed circuit board using an optical waveguide was developed instead of a metallic circuit such as copper of an electric printed circuit board, and it became possible to produce a high-precision high-tech equipment more stable in radio interference and noise phenomenon.

According to the prior art, in the case of an optical printed circuit board, an optical waveguide is manufactured by bending optical fibers at 90 degrees as disclosed in Prior Art 1 (Publication No. 10-2011-0038522) 0112731), a mirror is formed on the inner core layer to produce an optical waveguide.

However, in the above-mentioned prior art document 1, in the manufacture of an optical printed circuit board, a structure is adopted in which optical fibers are folded at 90 degrees to connect optical fibers with a signal transmission unit TX and a signal reception unit RX. The light loss occurs in the process of folding the optical fiber 90 by 90 degrees. In addition, when there is a step between the bent portion of the optical fiber and the printed circuit board layer in the lamination process for embedding in the printed circuit board, high pressure is applied and transmission loss occurs. In addition, the total thickness of the optical module including the bent portion increases the overall thickness of the printed circuit board.

In the prior art 2, the core protruding outward has a problem in that it is difficult to maintain the angle due to deformation (curling or twisting, etc.) due to heat, pressure and resin flow during lamination have.

According to an embodiment of the present invention, an optical connection module having a new structure, an optical printed circuit board including the same, and a manufacturing method thereof are provided.

 It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise forms disclosed. .

An optical connection module according to an embodiment of the present invention includes a case which forms an appearance and includes a first groove formed in a central region and a second groove formed in an edge region; A light transmitting portion inserted into the first groove of the case; And an optical connecting block inserted in the second groove of the case.

The first groove is formed in a first direction corresponding to the longitudinal direction of the case, and the second groove is formed in a second direction perpendicular to the first direction.

The optical connection block may include: an optical element; And a light reflection block attached to the optical element, wherein the first surface is formed with an inclination angle in a traveling path of the optical signal.

Further, the light reflection block is inserted in the second groove of the case, and the optical element protrudes above the surface of the case.

In addition, the first surface of the light reflection block has an inclination angle of 45 ° or 135 °, and a metal material is formed for reflection of the optical signal.

In addition, at least one through hole is formed around the second groove of the case, and a conductive ball is attached to the metal terminal formed on the optical element, and the conductive ball is inserted into the through hole formed in the case.

The optical transmission unit is an optical waveguide including an optical fiber, a core layer for transmitting an optical signal, and at least one clad layer surrounding the core layer.

The case is formed of a transparent liquid material having a refractive index lower than that of the core layer and the clad layer.

The case is formed to a thickness that satisfies 0.05 to 0.1 mm, the first groove satisfies a depth in the range of 0.028 to 0.075 mm and a width in the range of 0.1 to 0.12 mm, and the second groove has a thickness of 0.05 mm The depth of 0.05 mm and the length of 0.8 mm.

According to another aspect of the present invention, there is provided an optical printed circuit board comprising: an insulating layer; And an optical connection module embedded in the insulating layer and transmitting an optical signal, wherein the optical connection module includes a first groove formed in a central region and a second groove formed in an edge region, A light transmitting portion inserted in the first groove of the case; and an optical connecting block inserted in the second groove of the case.

In addition, the first groove formed in the case is formed in a first direction corresponding to the longitudinal direction of the case, and the second groove formed in the case is formed in a second direction perpendicular to the first direction.

In addition, the optical connection block inserted in the second groove of the case includes an optical element and a light reflection block attached to the optical element, the first surface of which has a tilt angle with respect to the traveling path of the optical signal.

In addition, a light reflection block constituting the optical connection block is inserted into the second groove of the case, and the optical element constituting the optical connection block protrudes above the surface of the case and is embedded in the insulation layer.

In addition, the first surface of the light reflection block has an inclination angle of 45 or 135 degrees, and a metal material is formed for reflection of the optical signal.

In addition, at least one through hole is formed around the second groove of the case, a conductive ball is attached to the metal terminal formed on the optical element, and the conductive ball is inserted into the through hole formed in the case.

The optical transmission unit is an optical waveguide including an optical fiber, a core layer for transmitting an optical signal, and at least one clad layer surrounding the core layer.

The case is formed of a transparent liquid material having a refractive index lower than that of the core layer and the clad layer.

The case is formed to a thickness that satisfies 0.05 to 0.1 mm, the first groove satisfies a depth in the range of 0.028 to 0.075 mm and a width in the range of 0.1 to 0.12 mm, and the second groove has a thickness of 0.05 mm The depth of 0.05 mm and the length of 0.8 mm.

According to another aspect of the present invention, there is provided a method of manufacturing an optical printed circuit board, comprising: preparing a case having a first groove and a second groove formed thereon; Inserting a light transmitting portion in a first groove of the prepared case; Inserting an optical connection block in a second groove of the prepared case; And embedding the case into which the optical transmission unit and the optical connection block are inserted, in an insulating layer.

The first groove is formed in a central region of the case in a first direction corresponding to the longitudinal direction of the case and the second groove is formed in an edge region of the case in a second direction perpendicular to the first direction .

In addition, the step of inserting the optical connection block may include inserting the optical connection block including the optical device and the optical device, the optical connection block including a light reflection block formed on the first surface of the optical device, .

In addition, the step of inserting the optical connecting block may include inserting a light reflecting block constituting the optical connecting block in the second groove of the case, wherein the optical element constituting the optical connecting block is mounted on the surface Lt; / RTI >

In addition, the first surface of the light reflection block has an inclination angle of 45 or 135 degrees, and a metal material is formed for reflection of the optical signal.

In addition, the step of preparing the case may include preparing a case having at least one through hole formed around the second groove.

The step of inserting the optical connection block may include the steps of attaching a conductive ball to a metal terminal formed on an optical element of the optical connection block and inserting the attached conductive ball into the through hole to reflow do.

The inserting step includes inserting an optical fiber into a first groove of the case; Or an optical waveguide including a core layer for transmitting an optical signal to the first groove of the case and at least one clad layer surrounding the core layer.

In addition, the step of preparing the case may include preparing a case formed of a transparent liquid material having a refractive index lower than that of the core layer and the clad layer.

The case is formed to a thickness that satisfies 0.05 to 0.1 mm, the first groove satisfies a depth in the range of 0.028 to 0.075 mm and a width in the range of 0.1 to 0.12 mm, and the second groove has a thickness of 0.05 mm The depth of 0.05 mm and the length of 0.8 mm.

The step of fabricating the optical connection block may include preparing a master mold having at least one first block having a predetermined inclination angle on one side thereof, Applying a liquid material in a block of the replica mold to produce a replica mold in which a second block corresponding to the first block is formed, and applying a liquid material in the second block in the replica mold to form an optical connection block Applying a metal material to one side of the formed optical connection block, and separating the optical connection block coated with the metal material from the replica mold.

According to the embodiment of the present invention, the optical coupling module can be manufactured by using the optical transmission unit having the inclination angle of 45 degrees, thereby improving the light loss characteristic and reducing the thickness of the entire printed circuit board.

Further, by providing the optical connection module in which the light reflection block, the optical device and the optical transmission unit are integrated, it is possible to easily align the optical device and the optical transmission unit, to form the through hole in the optical connection module, By forming the conductive balls, it is possible to solve the problem of deformation caused during the optical element mounting and the reflow process.

1 is an exploded view and a cross-sectional view of an optical connection module according to an embodiment of the present invention.
FIGS. 2 to 6 are views for explaining the manufacturing method of the optical connection module shown in FIG. 1 in the order of process.
7 to 9 are views illustrating a method of manufacturing a light reflection block according to an embodiment of the present invention.
10 is a view showing an optical printed circuit board according to an embodiment of the present invention.
11 to 18 are cross-sectional views illustrating a manufacturing method of the optical printed circuit board shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

According to the embodiment of the present invention, in providing the optical connection module using the optical transmission part having the inclination angle of 45 degrees, according to the embodiment of the present invention, the optical reflection module, the optical device, By forming the module, it is possible to easily align the optical element and the optical transmission section, to form a through hole in the optical connection module, and to insert the conductive ball in the formed through hole, Try to solve the problem of misalignment.

1 is an exploded view and a cross-sectional view of an optical connection module according to an embodiment of the present invention.

1 (a) and 1 (b), the optical connection module 100 includes a first groove 112 formed in a central region, a second groove 114 formed in an edge region, A first case 110 including a through hole 116 formed in a peripheral region of the second groove 114, a light transmitting portion 130 inserted into the first groove 112 of the case 110, The optical connector according to claim 1, further comprising: an optical connection block (120, 122, 124, 126, 128) inserted into a second groove (114) of the case (110) And a second case 140 for embedding the optical transmission unit 130 and the optical connection block 120, 122, 124, 126, and 128,

The first case 110 forms an appearance of the optical connection module 100. The first case 110 is formed of a transparent liquid material having a specific refractive index, and the refractive index is determined by the refractive index of the material forming the light transmitting part 130.

That is, the first case 110 is formed of a transparent liquid material having a refractive index lower than that of the light transmitting unit 130, and is preferably a light transmitting material capable of transmitting light.

A first groove (112) is formed in a central region of the first case (110). At this time, the first groove 112 may have a depth smaller than a thickness of the first case 110 on the upper surface of the first case 110. Alternatively, as shown in the drawing, the first groove 112 may be formed as a through hole passing through the upper surface and the lower surface.

The first groove 112 provides a seating space in which the light transmitting portion 130 can be seated. The first grooves 112 may be formed in a single shape, or may be formed in a plurality of shapes. The first grooves 112 have a number corresponding to a transmission channel of the optical signal and are formed in a central region of the first case 110.

At this time, the first grooves 112 are formed in a first direction corresponding to the longitudinal direction of the first case 110.

The first groove 112 has a depth that satisfies the range of 0.025 mm to 0.075 mm, and has a width that satisfies the range of 0.1 to 0.12 mm.

The first groove 112 may have a U-shape or a V-shape according to the shape of the light transmitting part 130 so that the light transmitting part 130 can be seated on the first case 110 more easily. .

The light transmitting portion 130 is inserted into the first groove 112.

The optical transmission unit 130 provides a transmission path of the optical signal.

For this purpose, the optical transmission unit 130 may be formed of optical fibers. Alternatively, the optical transmission unit 130 may include an optical waveguide including a core layer for transmitting an optical signal and at least one clad layer surrounding the core layer.

A second groove 114 is formed in an edge region of the first case 110.

A light reflection block 126 attached to the optical connection block is inserted into the second groove 114. Accordingly, it is preferable that the second groove 114 is formed to be larger than the width and the depth of the light reflection block 124. The second grooves 114 are formed in a second direction perpendicular to the first direction.

In this case, the first case is formed to have a thickness that satisfies 0.05 to 0.1 mm, the first groove 112 satisfies a depth in the range of 0.028 to 0.075 mm and a width in the range of 0.1 to 0.12 mm, The grooves 114 meet a width of 0.05 mm, a depth of 0.05 mm and a length of 0.8 mm.

A through hole 116 is formed in a region around the second groove 114 of the first case 110.

The through holes 116 are formed through the upper and lower surfaces of the case 110 and are formed to have a width larger than the diameter of the conductive balls. The through hole 116 guides the mounting position of the optical device.

In the through hole 116, a conductive ball 128 attached to the optical connection block is inserted. The conductive ball 128 is connected to the metal terminal 122 formed on the optical element 120 and the conductive ball 128 connected to the metal terminal 122 is inserted into the through hole 116, The optical element 120 can be easily attached to the case 110 by performing the above process. The conductive ball 128 may be a solder ball, and may be replaced with another metal ball other than the solder ball.

The optical transmission unit 130 and the optical connection block are inserted into the first case 110 formed as described above.

The optical connection block includes an optical element 120, a metal terminal 122, an adhesive paste 124, a light reflection block 126, and a conductive ball 128.

The optical element 120 includes an optical transmitter (not shown) and an optical receiver (not shown).

The optical transmitter generates and outputs an optical signal and includes a driver integrated circuit (not shown) and a light emitting element (not shown). The light emitting element is driven by the driver integrated circuit.

In this case, the light emitting device may include a VCSEL (Vertical-Cavity Surface-Emitting Laser), which is a light source device for emitting a light signal. The VCSEL is a light source element that transmits or amplifies a light source signal in a manner of vertically irradiating a laser beam.

The optical receiver includes a receiver integrated circuit (not shown) and a light receiving element (not shown). The light receiving element receives light generated from the optical transmitter and is driven by the receiver integrated circuit. The light receiving element may include a photo detector (PD), which is an element for detecting an optical signal.

A light reflection block 126 is attached to the optical element 120 by the adhesive paste 124. The light reflection block 126 is formed such that the first surface has a certain inclination angle with respect to the traveling path of the optical signal.

The light reflection block 126 is formed using a mold so that the first surface has a predetermined inclination angle. In addition, a metal material is applied to the first surface, and the first surface becomes a metal reflection surface by the formed metal material, and reflection of the optical signal is made.

The light reflection block 126 may be formed in various shapes according to the shape of the mold, for example, the first surface may have a shape such as a triangular column or a rhombic column having a predetermined inclination angle.

The first surface of the light reflection block 126 is formed to have an inclination angle of either 45 degrees or 135 degrees.

The light reflection block 126 is inserted into the second groove 114 formed in the first case 110.

The second groove 114 is formed with a width corresponding to the thickness of the light reflecting block 126 so that the entire optical connecting block is not inserted into the second groove and the light reflecting block 126 Are inserted into the second grooves 114. As shown in Fig. Accordingly, the optical element 120 protrudes above the surface of the first case.

A conductive ball 128 is attached to the metal terminal 122 of the optical element 120. The conductive ball 128 attached to the optical element 120 is inserted into the through hole 116 formed in the first case 110.

A second case 140 is formed on the first case 110. The second case 140 may be formed of the same material as the first case 110 and may be stacked on the first case 110 to embed the optical device 120 and the optical transmission unit 130 .

As described above, the optical connection module 100 according to the embodiment of the present invention includes the first case 110 in which the first groove 112, the second groove 114, and the through hole 116 are formed, 130 is inserted into the first case 110 and the optical device 120 having the conductive ball 128 and the light reflecting block 126 attached thereto is inserted into the first case 110. The optical device 120 and the optical transmission Thereby forming a second case 140 for embedding the portion 130 therein.

According to the embodiment of the present invention as described above, the optical connection module can be manufactured by using the optical transmission part having the inclination angle of 45 degrees, thereby improving the light loss characteristic and reducing the thickness of the entire printed circuit board.

Further, by providing the optical connection module in which the light reflection block, the optical device and the optical transmission unit are integrated, it is possible to easily align the optical device and the optical transmission unit, to form the through hole in the optical connection module, By forming the conductive balls, it is possible to solve the problem of deformation caused during the optical element mounting and the reflow process.

FIGS. 2 to 6 are views for explaining the manufacturing method of the optical connection module shown in FIG. 1 in the order of process.

First, referring to FIG. 2, a first case 110 including a first groove 112, a second groove 114, and a through hole 116 is prepared.

At this time, the first case 110 is formed of a transparent liquid material having a specific refractive index, and the refractive index is determined by the refractive index of the material forming the light transmitting part 130 to be inserted later. More specifically, the first case 110 is preferably formed of a transparent liquid material (light-permeable material) having a refractive index lower than the index of refraction of the later-inserted light transmitting portion 130.

The first groove 112 formed in the first case 110 may provide a seating space in which the light transmitting part 130 can be seated and may include a number corresponding to the number of the light transmitting parts 130 to be inserted And is formed in a first direction corresponding to the longitudinal direction of the case 210 in a central region of the first case 110.

Also, the first groove 112 has a depth that satisfies the range of 0.025 mm to 0.075 mm, and has a width that satisfies the range of 0.1 to 0.12 mm. The first groove 112 may have a U-shape or a V-shape according to the shape of the light transmitting part 130 so that the light transmitting part 130 can be seated on the first case 110 more easily. .

The second groove 114 formed in the edge region of the first case 110 provides a space for allowing the optical connection block, more specifically the light reflection block 126, to be inserted.

The second grooves 114 are formed in a second direction perpendicular to the first direction in which the first grooves 112 are formed at a predetermined distance from one end of the first grooves 112.

A through hole 116 is formed in a peripheral region of the first case 110 where the second groove 114 is formed. The through hole 116 is formed through the upper surface and the lower surface of the first case 110 and has a width larger than the diameter of the conductive ball. The through hole 116 guides the mounting position of the optical device.

Next, referring to FIG. 3, an optical element 120 is prepared.

The optical device 120 may include any one of an optical transmitter (not shown) and an optical receiver (not shown).

The optical transmitter generates and outputs an optical signal, and includes a driver integrated circuit (not shown) and a light emitting element (not shown). The light emitting element is driven by the driver integrated circuit.

In this case, the light emitting device may include a VCSEL (Vertical-Cavity Surface-Emitting Laser), which is a light source device for emitting a light signal. The VCSEL is a light source element that transmits or amplifies a light source signal in a manner of vertically irradiating a laser beam.

The optical receiver includes a receiver integrated circuit (not shown) and a light receiving element (not shown). The light receiving element receives light generated from the optical transmitter and is driven by the receiver integrated circuit. The light receiving element may include a photo detector (PD), which is an element for detecting an optical signal.

A metal terminal 122 is formed on a lower surface of the optical element 120.

An adhesive paste 122 is formed in a region of the optical element 120 where the light reflection block 126 is to be formed in an area where the metal terminal 122 is not formed.

4, a light reflection block 126 is formed on the adhesive paste 122 formed on the optical element 120, thereby attaching the light reflection block 126 to the optical element 120. FIG.

The light reflection block 126 is formed using a mold, and the first surface has a predetermined inclination angle. In addition, a metal material is applied to the first surface, and the first surface becomes a metal reflection surface by the formed metal material, so that the incident optical signal is reflected.

The light reflection block 126 may be formed in various shapes according to the shape of the mold, for example, the first surface may have a shape such as a triangular column or a rhombic column having a predetermined inclination angle. The first surface of the light reflection block 126 is formed to have an inclination angle of either 45 degrees or 135 degrees.

Next, referring to FIG. 5, a conductive ball 128 is attached to a metal terminal 122 formed on the optical element 120 to manufacture an optical connection block.

Referring to FIG. 6, an optical connection block and a light transmitting portion 130 are inserted into the first case 110.

A light reflection block 126 of the optical connection block is inserted into a second groove 114 formed in the first case 110 and the conductive ball 128 is inserted into the through hole 116.

In addition, the optical element 120 is protruded above the first case 110.

Also, the light transmitting part 130 is inserted into the first groove 112 of the first case 110.

The inserted optical transmission unit 130 may include an optical fiber for providing a transmission path of an optical signal and may include a core layer for transmitting an optical signal and at least one clad for surrounding the core layer. Optical waveguide.

When the optical connection block and the optical transmission unit are inserted, a second case 140 for embedding the optical connection block and the optical transmission unit is formed on the first case 110.

The second case 140 may be formed of the same material as the first case 110.

According to the embodiment of the present invention as described above, it is possible to easily align the optical element and the optical transmission unit by providing the optical connection module in which the optical connection block and the optical transmission unit are integrated, thereby forming the through hole in the optical connection module By forming the conductive ball in the through hole, the problem of deformation occurring during the optical element mounting and reflow process can be solved.

7 to 9 are views illustrating a method of manufacturing a light reflection block according to an embodiment of the present invention.

First, referring to FIG. 7, a master mold 310 as a basis for manufacturing the light reflection block 126 is prepared.

The master mold 310 includes a plurality of first grooves 315 corresponding to the inclination angle of the light reflection block 126.

Next, referring to FIG. 8, a duplicate mold 320 is manufactured using the prepared master mold 310.

The replica mold 320 may be manufactured by applying a liquid material to the prepared master mold 310, curing the applied liquid material, and then separating the master mold 310. At this time, the liquid material used in the production of the replica mold 320 preferably has good mold release and transparency, but is preferably a material. For example, it is preferable to use a material such as silicone which can be thermally cured.

The replica mold 320 has a plurality of second grooves 325 corresponding to the first grooves 315 of the master mold 310.

Referring to FIG. 9, a liquid material is applied to the replica mold 320, and the UV and thermal curing processes are then performed. When the applied liquid material is cured to a certain extent, chromium, silver, or the like is applied to specific surfaces of the plurality of light reflection blocks 126 formed in the plurality of second grooves 325 by the curing through sputtering Is formed.

Thereafter, each of the light reflection blocks 126 on which the thin film of chrome or silver is formed is separated from the replica mold 320.

10 is a view showing an optical printed circuit board 400 according to an embodiment of the present invention.

10, the optical printed circuit board 400 includes a first insulating layer 420, a first circuit pattern 430 formed on at least one surface of the first insulating layer 420, A second circuit pattern 410 formed on the optical connection module 100 and electrically connected to the optical connection module 100, a second circuit pattern 410 formed on the first circuit pattern 430 formed on the first circuit pattern 430, A second insulating layer 440 formed on upper and lower portions of the first insulating layer 420 to fill the optical connection module 100 and the first and second circuit patterns 430 and 410, A via 460 formed in the layer 440 and electrically connected to the first circuit pattern 430 or the second circuit pattern 410 is formed on the second insulating layer 440, And a protective layer 480 formed on the second insulating layer 440. The third insulating layer 440 is formed on the second insulating layer 440,

The first insulating layer 420 functions as a base member for providing durability to the optical printed circuit board.

The first insulating layer 420 may be a supporting substrate of an optical printed circuit board on which a single circuit pattern is formed, but may include an insulating layer region in which at least one circuit pattern of the plurality of laminated optical printed circuit boards is formed It may mean.

When each of the first insulating layers 420 is an insulating layer of a plurality of laminated structures, a plurality of circuit patterns may be continuously formed on the upper or lower surface of the first insulating layer 420.

A via (not shown) may be formed in the first insulating layer 420 to electrically connect circuit patterns between different layers.

A first circuit pattern 430 is formed on the upper surface and the lower surface of the first insulation layer 420.

The first circuit pattern 430 may be formed of an electrically conductive metal such as gold, silver, nickel, and copper for electrical signal transmission. Preferably, the first circuit pattern 430 is formed using copper.

The first circuit pattern 430 may be formed by a conventional manufacturing process of a printed circuit board such as an additive process, a subtractive process, an MSAP (Modified Semi Additive Process) And the detailed description thereof is omitted here.

The first insulating layer 420 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite substrate, or a glass fiber impregnated substrate. When the first insulating layer 420 includes a polymer resin, the first insulating layer 420 may include FR- And ABF (Ajinomoto Build up Film). Alternatively, it may include a polyimide resin, but the present invention is not limited thereto.

A second insulating layer 440 is formed on the upper and lower portions of the first insulating layer 420.

The second insulating layer 440 may be formed of the same material as the first insulating layer 420.

A third circuit pattern 470 is formed on the second insulating layer 440.

The third circuit pattern 470 may be formed of the same material and the same method as the first circuit pattern 430.

The optical connection module 100 manufactured as described above is formed on the first insulation layer 420.

The optical device 120 included in the optical connection module 100 is electrically connected to the first circuit pattern 430 formed on the first insulation layer 420.

At this time, the optical device included in the optical connection module 100 includes an optical transmitter (not shown) and an optical receiver (not shown).

The optical transmitter generates and outputs an optical signal and includes a driver integrated circuit (not shown) and a light emitting element (not shown). The light emitting element is driven by the driver integrated circuit.

In this case, the light emitting device may include a VCSEL (Vertical-Cavity Surface-Emitting Laser), which is a light source device for emitting a light signal. The VCSEL is a light source element that transmits or amplifies a light source signal in a manner of vertically irradiating a laser beam.

The optical receiver includes a receiver integrated circuit (not shown) and a light receiving element (not shown). The light receiving element receives light generated from the optical transmitter and is driven by the receiver integrated circuit. The light receiving element may include a photo detector (PD), which is an element for detecting an optical signal.

As described above, in the embodiment of the present invention, the optical connection module 100 manufactured as described above is manufactured, and the optical connection module 100 is inserted into the insulation layer to form the optical path, And an optical printed circuit board having high efficiency can be manufactured.

A second circuit pattern 410 electrically connected to the optical device 120 is formed on the optical connection module 100.

A via 460 is formed in the second insulating layer 440 and the second circuit pattern 410 and the third circuit pattern 470 are electrically connected by the via 460 formed.

A protective layer 470 is formed on the second insulating layer 440.

The protective layer 470 is formed to protect the surface of the second insulating layer 440 and may have an opening (not shown) exposing the surface of the third circuit pattern 470 to be exposed.

As described above, in the embodiment of the present invention, the optical connection module 100 manufactured as described above is manufactured, and the optical connection module 100 is inserted into the insulation layer to form the optical path, And an optical printed circuit board having high efficiency can be manufactured.

11 to 18 are cross-sectional views illustrating a manufacturing method of the optical printed circuit board shown in Fig.

Referring to FIG. 11, first, the optical connection module 100 is manufactured.

Referring to FIG. 12, a second circuit pattern 410 electrically connected to the optical device 120 formed in the optical connection module 100 is formed on the prepared optical connection module 100.

Referring to FIG. 13, a first insulating layer 420 having at least one first circuit pattern 430 is prepared.

More specifically, the first insulating layer 420 is first prepared. When a conductive layer (not shown) is laminated on at least one surface of the first insulating layer 420, the laminated structure of the first insulating layer 420 and the conductive layer may be a conventional CCL (Copper Clad Laminate) have.

Alternatively, the conductive layer may be formed by performing non-electrolytic plating on the first insulating layer 420. When the conductive layer is formed by non-electrolytic plating, the upper surface and the lower surface of the first insulating layer 420 may be illuminated to smoothly perform plating. Thereafter, the conductive layer formed on at least one surface of the first insulating layer 420 is etched to form a second circuit pattern 430.

The first circuit pattern 430 may be formed by a dry film lamination process, an exposure process, a development process, an etching process, and a peeling process.

14, the optical connection module 100 is mounted on the first circuit pattern 430 formed on the first insulation layer 420. Referring to FIG.

That is, the through hole 116 formed in the optical connection module 100 is placed on the first circuit pattern 430 formed on the first insulation layer 420, So that the first circuit pattern 430 and the optical element 130 are electrically connected to each other.

Next, referring to FIG. 15, a second insulating layer 440 is stacked on top and bottom of the first insulating layer 420 to fill the optical connection module 100.

Referring to FIG. 16, holes may be formed through the first surface of the second insulating layer 440 and a second surface opposite to the first surface, and the second circuit patterns 410 and Holes 450 for exposing one circuit pattern 430 are formed.

The via hole 450 may be formed by a physical drilling process, or may be formed using a laser. When the via hole 450 is formed using a laser, the second insulating layer 440 can be opened using a YAG laser or a CO ₂ laser.

Referring to FIG. 17, the via hole 450 is filled with the via 460 to form the via 460.

The via 460 may be formed by applying a metal paste in the via hole 450.

18, a third circuit pattern 470 connected to the via hole 450 is formed and a protective layer 480 is formed to protect the surface of the second insulating layer 440 .

As described above, since the optical path can be easily formed by inserting the optical connection module 100 manufactured as described above into the insulating layer, not only the productivity of the optical printed circuit board can be increased, Efficiency can be increased.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: Optical connection module
400: optical printed circuit board

Claims (30)

delete delete delete delete delete delete delete delete delete delete Insulating layer; And
And an optical connection module embedded in the insulating layer and transmitting an optical signal,
The optical connection module includes:
A first case including a first groove formed in a central region and a second groove formed in an edge region to form an appearance;
A light transmitting portion inserted in the first groove of the first case;
An optical coupling block inserted in the second groove of the first case; And
And a second case disposed on the first case and embedding the light transmitting portion and the optical connecting block,
Wherein the first case and the second case comprise the same material,
The optical connection block includes:
Optical devices; And
And a light reflection block attached to the optical element, the first reflection surface being formed at an inclination angle with respect to a traveling path of the optical signal,
Wherein the light reflection block is inserted in the second groove of the first case,
Wherein the optical element protrudes above a surface of the first case,
Wherein the second case has a function of embedding the light transmitting portion and the projected optical element,
At least one through hole is formed around the second groove of the first case,
A conductive ball is attached to a metal terminal formed on the optical element,
Wherein the conductive ball is inserted in the through hole having a width larger than the diameter of the conductive ball and exposed by the through hole,
And the upper surface of the optical connection block is located on the same plane as the upper surface of the second case. 12. The method of claim 11,
The first groove formed in the first case is formed in a first direction corresponding to the longitudinal direction of the first case,
And the second groove formed in the first case is formed in a second direction perpendicular to the first direction. delete delete 12. The method of claim 11,
Wherein the first surface of the light reflection block has an inclination angle of 45 or 135 and a metallic material is formed for reflection of the optical signal. 12. The method of claim 11,
And a part of the conductive ball protrudes from the surface of the bottom surface of the first case. 12. The method of claim 11,
Wherein the optical transmission unit is an optical waveguide including an optical fiber, a core layer for transmitting the optical signal, and at least one clad layer surrounding the core layer. 18. The method of claim 17,
Wherein the first case and the second case are formed of a transparent liquid material having a refractive index lower than that of the core layer and the clad layer. 12. The method of claim 11,
Wherein the first case is formed to a thickness of 0.05 to 0.1 mm,
Wherein the first groove meets a depth in the range of 0.028 to 0.075 mm and a width in the range of 0.1 to 0.12 mm,
The second groove satisfies a width of 0.05 mm, a depth of 0.05 mm and a length of 0.8 mm. delete delete delete delete delete delete delete delete delete delete delete

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