KR20130058251A - Substrate processing system, and transfer module therefor - Google Patents

Abstract

PURPOSE: A substrate processing system and a transfer module therefor are provided to overcome the restriction of installation by forming an extension space for a process module in a transfer chamber. CONSTITUTION: A process module has a process space for treating a substrate. A transfer module(200) includes a transfer chamber(210). The transfer chamber corresponds to a part of the process module. The transfer chamber includes a process space extension part(400). The process space extension part extends the process space.

Description

Substrate processing system, and transfer module therefor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing system, and more particularly, to a substrate processing system for performing substrate processing and a transport module used therein.

The substrate processing system refers to a system for performing substrate processing such as deposition and etching on a substrate, and is a so-called cluster type substrate processing system, which includes a plurality of process modules for performing substrate processing and a transport module to which the process modules are combined. Can be configured.

The number of process modules coupled to the transfer modules may be variously determined according to the type, characteristics, and the like of the substrate processing.

On the other hand, the conventional substrate processing system has a problem in that the size of the process module coupled to the transfer module, the type of substrate processing, the size of the substrate increases, the size of the substrate increases, and the system occupies a lot of space and arrangement.

In particular, the increase in the space in which the system is installed is directly related to the increase in the overall cost for the substrate processing in consideration of the substrate processing requiring a clean environment, and thus the structure and arrangement of the system capable of efficient space and layout are necessary.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system and a transport module used therein, which can recognize the necessity as described above, thereby minimizing the restrictions on the installation environment of the system by streamlining the structure and arrangement of the system.

The present invention has been created to achieve the object of the present invention as described above, the present invention comprises a plurality of process modules formed with a processing space for performing the substrate processing; The plurality of process modules are coupled to each other and include one or more transport modules including a transport robot for introducing a substrate into or out of the process module, wherein the transport chamber of the transport module is provided to at least some of the process modules; Correspondingly, it discloses a substrate processing system characterized in that the processing space expansion unit is formed in communication with the processing space of the process module to expand the processing space.

The processing space expansion part may be formed by partitioning an inner space of the transport chamber by at least one partition member, and may be in communication with the processing space through an opening formed in the transport chamber.

The transfer chamber may have a gate for transferring the substrate to the process module above the opening.

A gate valve may be additionally installed between the process chamber and the opening to open and close the process chamber.

The transport chamber may have one of a circle and a polygon in a horizontal shape viewed from above.

The processing space expansion unit may be formed in plural along the circumferential direction of the transport chamber.

At least some of the processing space expansion units may communicate with each other.

The processing space expansion unit may be installed such that at least a portion of the processing space expansion unit overlaps with each other.

The plurality of processing space expansion units may be arranged in two layers above and below alternately along a horizontal circumferential direction of the transfer chamber to prevent interference with each other.

The process module is provided with one or more guide members for guiding the movement of the substrate support in the coupling direction with the transfer chamber, wherein the substrate support is coupled to the transfer chamber with respect to the gas injection unit installed in the processing space Can be moved in the engagement direction.

The processing space expansion unit may be provided with a guide member for guiding the substrate support at a position corresponding to the guide member of the process module.

The transport module may be installed in plural, and neighboring transport modules may be connected to each other by a connection module.

The present invention also discloses a transfer module of the substrate processing system.

The substrate processing system and the conveying module used therein according to the present invention reduce the length of the process module and ultimately occupy the substrate processing system by forming an expansion space in the conveying chamber to extend the processing space of the process module for substrate processing. By reducing the installation area there is an advantage that can minimize the constraints on the installation environment of the system.

In addition, the substrate processing system according to the present invention and the transfer module used therein reduce the length of the process module by utilizing the internal space of the transfer chamber as a space to expand the processing space of the process module and ultimately reduce the area occupied by the substrate processing system. There is an advantage that can minimize the restrictions on the installation environment of the system.

1 is a plan view showing a substrate processing system according to the present invention.
2A is a horizontal cross-sectional view in the II-II direction in FIG. 1, and FIG. 2B is a horizontal cross-sectional view showing a modification of the substrate processing system of FIG.
3 is a plan view illustrating a modification of the substrate processing system of FIG. 1.
4 is a horizontal cross-sectional view in the III-III direction in FIG.
5 is a plan view illustrating a modification of the substrate processing system of FIG. 3.
6 is a plan view showing another example of a substrate processing system according to the present invention.

Hereinafter, a substrate processing system according to the present invention and a transport module used therein will be described in detail with reference to the accompanying drawings.

1 is a plan view showing a substrate processing system according to the present invention, Figure 2a is a horizontal cross-sectional view in the II-II direction in Figure 1, Figure 2b is a horizontal cross-sectional view showing a modification of the substrate processing system of Figure 1, Figure 3 1 is a plan view showing a modification of the substrate processing system of FIG. 1, FIG. 4 is a horizontal cross-sectional view in the III-III direction of FIG. 3, FIG. 5 is a plan view showing a modification of the substrate processing system of FIG. A plan view showing another example of a substrate processing system according to the present invention.

1 and 2A, the substrate processing system according to the present invention includes: a plurality of process modules 101 to 107 in which a processing space S for performing substrate processing is formed; It includes one or more transfer module 200 is coupled to a plurality of process modules (101 ~ 107).

The process modules 101 to 107 are substrates that perform substrate processing such as etching and deposition, and various configurations such as the number and arrangement of the substrates may be performed according to the type of substrate processing.

The substrate treatment targets include semiconductor substrates, glass substrates for LCD panels, OLED substrates, solar cell substrates, and the like.

The process modules 101 to 107 may include a process chamber 110 in which a gate 190 for entering and exiting the substrate 10 is formed between the transfer modules 200 to be described later.

As shown in FIGS. 1 and 2A, the process chamber 110 is provided with a processing space S for performing substrate processing, and various structures are possible according to substrate processing.

On the other hand, the process chamber 110, for example, as shown in Figures 1 and 2A, the lift pin 120 to support the substrate 10 conveyed by the carrier robot 300 to be described later, as well as to move up and down And a substrate support part 130 for supporting the substrate 10 by the lowering of the lift pins 120, and a gas injection part (not shown) installed above the substrate support part 130 to inject gas for substrate processing. Can be installed.

The lift pin 120 is a configuration for transferring the substrate 10 to the carrier robot 300, and any configuration may be used as long as it can support the substrate 10 and move up and down.

In this case, the lift pin 120 is driven by the driving unit 121 installed in or outside the process chamber 110, and a structure for sealing the process chamber 110, that is, a bellows, is omitted for convenience of description.

In addition, the process chamber 110 may be connected to the gas exhaust pipe for pressure control, gas exhaust in the processing space (S).

The substrate support unit 130 may be configured in various ways as a structure for supporting the substrate 10 to perform substrate processing.

On the other hand, with respect to the substrate support 130, the process chamber 110 is the upper region where the gate 190 for the substrate transfer with the transfer chamber 210 is formed, and is installed below the upper region and the substrate 10 It may include a lower region in which the substrate support 130 for supporting is installed.

As an example, the substrate support 130 is installed in the process chamber 110, particularly in the lower region, to move horizontally when the substrate treatment is performed while moving in the horizontal direction with respect to the gas ejection unit. One or more guide members 150 may be installed in the process chamber 110 to move horizontally.

Here, the processing space expansion unit 400 to be described later may be further provided with a guide member for guiding the movement of the substrate support 130 at a position corresponding to the guide member 150 of the process module (101 ~ 107).

At this time, the horizontal direction of movement of the substrate support 130 is preferably moved in the coupling direction with the transfer module 200, the movement of the substrate support 130 may be driven by various methods.

In addition, the process chamber 110 in which the guide member 150 is installed receives the substrate 10 from the transfer module 200 in the upper region, and the guide member 150 is installed in the lower region so that the substrate support 130 is horizontal. The vertical cross-sectional shape may have a 'T' shape inverted so as to perform substrate processing by movement.

The gas injection unit is configured to inject a processing gas onto the processing space S, in particular, the substrate 10 to perform the substrate processing, and is configured to correspond to the entire surface of the substrate 10, or the substrate support 130 may be a gas. When the substrate treatment is performed while moving in the horizontal direction with respect to the spraying unit, the gas may be sprayed onto a portion of the substrate 10.

Meanwhile, the process modules 101 to 107 may be supplied with various types of power according to substrate processing.

In addition, the plurality of process modules 101 to 107 may perform various combinations based on substrate processing, such as performing the same substrate treatment or performing different substrate treatments.

The transfer module 200 is configured to transfer or carry out the substrate 10 in the processing space S of each process module 101 to 107.

The transfer module 200 includes a transfer chamber 210 to which a plurality of process modules 101 to 107 are coupled.

At this time, the transfer chamber 210 is provided with a transfer robot 300 for introducing the substrate 10 into the processing space (S) or taken out from the process module (101 ~ 107).

The conveying robot 300 may be any configuration such as a rail method or a multi-joint robot as long as it is a configuration capable of transferring or transporting the substrate 10 to the process modules 101 to 107.

The transfer chamber 210 has a gate valve 220 at a position corresponding to each process module 101 to 107 in order to transfer or remove the substrate 10 into the processing space S of each process module 101 to 107. A gate 211 that is opened and closed by is formed.

And the conveying chamber 210 may have a variety of shapes of the horizontal shape seen from the upper side, for example, may have any one of a circle and a polygon, for forming a predetermined vacuum pressure in the interior space (IS) An exhaust pipe (not shown) may be connected.

On the other hand, when the substrate processing is performed while the process modules 101 to 107 move in the horizontal direction with respect to the gas injection unit, in particular, the substrate support unit 130 is coupled to the process modules 101 to 107 to the transfer module 200. When the horizontal direction is moved in the direction of the horizontal length of the process module (101 ~ 107) is long, there is a problem that the installation area of the system increases.

Therefore, the substrate processing system according to the present invention needs to prevent the increase in the installation area of the system due to the increase in the horizontal length of the process modules 101 to 107.

Accordingly, the present invention corresponds to at least some of the process modules 101 to 107 and communicates with the process spaces S of the process modules 101 to 107 to expand the process space S to expand the process space S. It is characterized by solving the above problems by additionally formed in the conveying chamber 210.

That is, the transport module 200 forms a processing space expansion unit 400 for expanding the processing space S of the process modules 101 to 107 in the transport chamber 210, and the processing space expansion unit 400. By communicating with the processing space (S) it is possible to perform the substrate treatment while moving in the horizontal direction relative to the gas injection unit without increasing the horizontal length of the process modules (101 ~ 107).

On the other hand, the processing space expansion unit 400 may be any configuration as long as it can form an expansion space (S2) to expand the processing space (S), for example, as shown in Figure 2a, one or more partitions The inner space IS of the transfer chamber 210 may be divided by the members 410 and 420.

In addition, the processing space expansion unit 400 communicates with the processing space S through the opening 230 formed in the transport chamber 210.

In this case, the transfer chamber 210 has a gate 211 for substrate transfer with the process modules 101 to 107 formed above the opening 230.

On the other hand, the expansion space S2 of the processing space expansion unit 400 may be unnecessary according to the type of substrate processing, the substrate processing time, and the like. Considering this, it is necessary to separate the processing space (S).

Therefore, as shown in FIG. 2B, a separate gate valve 240 may be additionally installed between the processing space expansion unit 400 and the process chamber 110.

Here, the process chamber 110 is further formed with a gate 180 that is opened and closed by the gate valve 240.

When the guide member 150 is installed in the process chamber 110, the guide member 150 may be separately installed in the processing space expansion unit 400.

Meanwhile, a plurality of the process modules 101 to 107 may be disposed along the circumferential direction of the transfer chamber 210. In response thereto, the processing space expansion unit 400 may follow the circumferential direction of the transfer chamber 210. It may be formed in plural.

In this case, when the processing space expansion unit 400 is installed in plural, the horizontal size of the transport chamber 210 may be relatively large to prevent interference with neighboring processing space expansion units 400.

Therefore, for the improvement thereof, as shown in FIGS. 3 and 4, the processing space expansion unit 400 may be installed such that at least a portion of the processing space expansion unit 400 overlaps with each other.

As illustrated in FIG. 4, the plurality of processing space expansion units 300 may further include a processing space expansion unit 400 immediately adjacent to the processing space expansion unit 300 positioned at the lowermost side in the vertical direction. It can be located at.

In addition, as shown in FIG. 4, the plurality of processing space expansion units 300 are appropriately arranged in two layers to prevent interference with each other, for example, alternately along a horizontal circumferential direction of the transfer chamber 210. It may be arranged in two layers.

At this time, the conveying chamber 210 is located at the lower side to prevent unnecessary increase of the internal space IS, which increases the load and time for forming a predetermined vacuum pressure when the internal space IS is increased. The upper space of the processing space expansion unit 400, the lower space of the processing space expansion unit 400 located on the upper side is more preferably formed to exclude the internal space (IS).

Meanwhile, as illustrated in FIG. 5, at least some of the processing space expansion units 400 may communicate with each other when the processing space expansion units 400 do not affect substrate processing of other process modules.

Of course, the plurality of processing space expansion units 400 may include the internal space IS of the transfer chamber 210 and the expansion space S2 of the other processing space expansion unit 400 by the partition members to perform stable substrate processing. It is desirable to be isolated from.

Meanwhile, as illustrated in FIGS. 1 and 3, the transport module 200 is connected to a load lock module 910 for receiving or discharging the substrate 10 from the outside, or as illustrated in FIG. 6. The load lock module 910 for receiving the substrate 10 from and the unlock lock module 920 for discharging to the outside may be connected.

The load lock module 910 and the unload lock module 920 transfer the substrate 10 to the transfer module 200 or discharge it to the transfer module 200 while converting the pressure between atmospheric pressure and vacuum pressure between the transfer module 200 and the outside. Various configurations are possible as the configuration for this.

Meanwhile, as illustrated in FIG. 6, the substrate processing system having the configuration as described above includes a plurality of transfer modules 210, and neighboring transfer modules 210 are connected to each other by a connection module 930 so that the substrate ( 10) can be delivered.

Here, the connection module 930 may be simply configured to perform substrate transfer, perform substrate processing such as deposition or etching, or temporarily store the substrate 10.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: process module 200: transfer module
300: carrier robot 400: processing space expansion unit

Claims (18)

A plurality of process modules having a processing space for performing substrate processing; Comprising the plurality of process modules and includes one or more transfer module including a transfer robot for introducing a substrate into the process module or carried out from the process module,
The conveying chamber of the conveying module corresponds to at least some of the process modules, characterized in that the processing space expansion unit is formed in communication with the processing space of the process module to expand the processing space. The method according to claim 1,
And the processing space expansion unit partitions an inner space of the transport chamber by at least one partition member, and communicates with the processing space through an opening formed in the transport chamber. The method according to claim 2,
The transfer chamber is a substrate processing system, characterized in that the gate for transferring the substrate with the process module is formed above the opening. The method according to claim 2,
And a gate valve for opening and closing the process chamber and the opening part. The method according to claim 1,
The transfer chamber is a substrate processing system, characterized in that the horizontal shape viewed from above has one of a circle and a polygon. The method according to any one of claims 1 to 5,
And a plurality of processing space expansion units formed along a circumferential direction of the transfer chamber. The method of claim 6,
And the plurality of processing space expansion units at least partially communicate with each other. The method of claim 6,
The processing space expansion unit is a substrate processing system, characterized in that installed so that at least a portion overlaps with the processing space expansion unit adjacent. The method of claim 6,
And the plurality of processing space expansion units are arranged in two upper and lower layers alternately along the horizontal circumferential direction of the transfer chamber to prevent interference with each other. The method of claim 6,
The process module
At least one guide member for guiding movement of the substrate support portion supporting the substrate in the engagement direction with the transfer chamber is provided,
And the substrate support part is moved in a coupling direction in which the process module is coupled to the transfer chamber with respect to the gas injection part installed in the processing space. The method according to any one of claims 1 to 5,
The process module
At least one guide member for guiding movement of the substrate support portion supporting the substrate in the engagement direction with the transfer chamber is provided,
And the substrate support part is moved in a coupling direction in which the process module is coupled to the transfer chamber with respect to the gas injection part installed in the processing space. The method of claim 11,
The processing space expansion unit is a substrate processing system, characterized in that the guide member for guiding the movement of the substrate support in the position corresponding to the guide member of the process module. The method according to any one of claims 1 to 5,
The conveying module is installed in plurality,
Substrate transfer system, characterized in that the adjacent conveying modules are connected to each other by a connection module. A conveyance module of a substrate processing system according to any one of claims 1 to 5. The method according to claim 14,
And a guide member for guiding the movement of the substrate support at a position corresponding to the guide member for guiding the movement of the substrate support in the process module to which the processing space extension is coupled. The method according to claim 14,
And the plurality of processing space expansion units at least partially communicate with each other. The method according to claim 14,
The processing space expansion unit is formed in plural along the circumferential direction of the transport chamber, the processing space expansion unit is characterized in that at least a portion overlapping with the processing space expansion unit neighboring up and down. The method according to claim 14,
The plurality of processing space expansion unit is characterized in that the transfer module is arranged in two layers up and down alternately along the horizontal circumferential direction of the transfer chamber to prevent interference with each other.

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