KR20130055327A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
KR20130055327A
KR20130055327A KR1020110121020A KR20110121020A KR20130055327A KR 20130055327 A KR20130055327 A KR 20130055327A KR 1020110121020 A KR1020110121020 A KR 1020110121020A KR 20110121020 A KR20110121020 A KR 20110121020A KR 20130055327 A KR20130055327 A KR 20130055327A
Authority
KR
South Korea
Prior art keywords
light emitting
light
printed circuit
circuit board
led lamp
Prior art date
Application number
KR1020110121020A
Other languages
Korean (ko)
Inventor
이연우
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020110121020A priority Critical patent/KR20130055327A/en
Publication of KR20130055327A publication Critical patent/KR20130055327A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
    • G02B6/006—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to produce indicia, symbols, texts or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0075—Arrangements of multiple light guides
    • G02B6/0078—Side-by-side arrangements, e.g. for large area displays
    • G02B6/008—Side-by-side arrangements, e.g. for large area displays of the partially overlapping type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

LED lamp according to an embodiment of the present invention, a plurality of light emitting devices (LED, Light Emitting Diode) is mounted and has a plate (plate) shape; A light emitting part disposed to be spaced apart from the mounting part and having a plurality of light emitting parts emitting light generated from the plurality of light emitting devices; And a plurality of light moving parts connecting a light emitting device mounted on the mounting part and a light emitting part formed in the light emitting part to form a path for transferring the light generated from the light emitting device to the light emitting part. According to an embodiment of the present invention, by having a structure in which light generated from the light emitting element mounted on the plate-shaped mounting portion is emitted from the light emitting portion via the light moving portion, the configuration can be simplified compared to the conventional In addition, the manufacturing process can be reduced, which reduces manufacturing costs and production time.

Description

LED lamp {LED lamp}

An LED lamp is disclosed. More specifically, the light emitted from the light emitting device mounted on the plate-shaped mounting portion is emitted from the light emitting portion via the light moving portion, thereby simplifying the structure, and thus the manufacturing cost and manufacturing time. Disclosed is an LED lamp that can reduce the number of hours.

Light Emitting Diode (LED) is a semiconductor device that emits light when current flows, and is a PN junction diode made of gallium arsenide (GaAs) and gallium nitride (GaN) optical semiconductors, and converts electrical energy into light energy. It is an electronic component.

In recent years, blue LEDs and ultraviolet LEDs realized using nitrides excellent in physical and chemical properties have appeared, and white light or other monochromatic light can be made using blue or ultraviolet LEDs and fluorescent materials, .

The light emitting device has advantages such as long lifetime, miniaturization and light weight, strong directivity of light and low voltage driving, and is resistant to shock and vibration, and does not require preheating time and complicated driving. It is possible.

Among these, in particular, in the automobile industry, the adoption of light emitting devices as lamp light sources is increasing, and their applications vary from large luxury cars to light cars. The reason why the light emitting device is applied to a lamp of an automobile is to implement a feeling of luxury, but another reason is that there are economic advantages generated from low power consumption and semi-permanent life.

In particular, the application of light emitting devices has been expanded in DRL (Daytime Running Light), RCL (Rear Combination Lamp), Head Lamp, etc. of automobiles, and as the market grows, cost reduction becomes more important in terms of price.

Such light emitting devices are generally manufactured in the form of LED lamps and mounted on printed circuit boards such as FPCBs. The light emitting device of the LED package may emit light by the power supplied through the substrate.

1 is a schematic diagram of an LED lamp according to a conventional embodiment.

As shown in the drawing, the LED lamp 1 according to the related art includes a plurality of light emitting elements 11, flexible printed circuit boards 13 (FPCB) on which the light emitting elements are mounted at predetermined intervals, and absorbs heat. And a heat dissipation member 15 to be discharged, the lamp body 30 to which the above-described components are mounted, and a back cover 35.

However, in the LED lamp according to the related art, since the mounting position of the light emitting device is not on one plane when the lamp is manufactured, the process of punching the flexible printed circuit board and the heat radiating member to which the light emitting device is mounted may occur. There is no choice but to incur costs associated with this process. In addition, a tape for fixing the flexible printed circuit board to the lamp body is required, and a punching process for cutting or bending the lamp body into a desired shape is required, which makes the manufacturing process complicated and the manufacturing cost increases.

In addition, in order to fix the lamp body to the back cover, a stacking process for pressing the lamp body to the back cover is required, and if the stacking process is performed manually, a separate stacking jig must be provided because of poor productivity. There is also complexity.

According to an embodiment of the present invention, by having a structure in which light generated from the light emitting element mounted on the plate-shaped mounting portion is emitted from the light emitting portion via the light moving portion, the configuration can be simplified compared to the conventional In addition, LED lamps are provided that can reduce the manufacturing process and reduce manufacturing costs and manufacturing time.

In addition, according to the embodiment of the present invention, since the light emitting element is mounted on the mounting portion of the planar shape, there is provided an LED lamp that can facilitate the heat dissipation design.

In addition, according to an embodiment of the present invention, since the light emitting device is mounted on a mounting portion connected to the optical fiber instead of the light emitting portion, it is possible to increase the design freedom of the light emitting portion, thereby facilitating the design. A lamp is provided.

In addition, according to an embodiment of the present invention, the mounting portion equipped with the light emitting element is mounted on the electric module, there is provided an LED lamp that can facilitate the design according to the shape of the electric module with good design freedom of the mounting portion.

LED lamp according to an embodiment of the present invention, a plurality of light emitting devices (LED, Light Emitting Diode) is mounted and has a plate (plate) shape; A light emitting part disposed to be spaced apart from the mounting part and having a plurality of light emitting parts emitting light generated from the plurality of light emitting devices; And a plurality of light moving parts connecting the light emitting device mounted on the mounting part and the light emitting part formed on the light emitting part to form a path for transferring the light generated from the light emitting device to the light emitting part. By such a configuration, the light generated from the light emitting element mounted on the plate-shaped mounting portion is emitted from the light emitting portion via the light moving portion, thereby simplifying the configuration compared to the prior art. In addition to reducing the manufacturing process, manufacturing costs and manufacturing time can be reduced.

According to one side, the light moving unit may be provided as an optical fiber (optical fiber) that can switch the movement path of the light in the desired direction.

According to one side, the mounting portion, a plate-shaped printed circuit board on which the plurality of light emitting elements are mounted in the longitudinal direction; And a heat radiating member coupled to the printed circuit board to absorb and release heat generated from the light emitting device.

According to one side, the heat dissipation member is a heat sink plate (heat sink plate), it may be mounted on the printed circuit board so as to be located on the opposite side of the light emitting device with the printed circuit board in between.

According to one side, the printed circuit board may be a metal core printed circuit board (MCPCB).

According to one side, the light emitting portion is made in an irregular shape so as to correspond to the irregular shape of the installation area, the light emitting portion of the light emitting portion and the light emitting element of the mounting portion is one-to-one by the light moving portion having a different length from each other Can be connected to.

According to one side, the LED lamp is mounted to the electric module of the vehicle as a light source of the vehicle, the mounting portion may be manufactured according to the shape of the electric module.

According to an embodiment of the present invention, according to the embodiment of the present invention, by having a structure in which light generated from the light emitting element mounted on the plate-shaped mounting portion is emitted from the light emitting portion via the light moving portion, In addition to simplifying the configuration, the manufacturing process can be reduced, thereby reducing manufacturing costs and manufacturing time.

In addition, according to the embodiment of the present invention, since the light emitting device is mounted on a planar mounting portion, it is possible to facilitate the heat dissipation design.

In addition, according to the embodiment of the present invention, since the light emitting device is mounted on the mounting portion connected to the optical fiber instead of the light emitting portion, the design freedom of the light emitting portion can be increased, thereby facilitating the design.

In addition, according to an embodiment of the present invention, the mounting portion is mounted to the electric module is mounted with a light emitting element, the design freedom of the mounting portion can be good at this time can facilitate the design according to the shape of the electric module.

1 is a schematic diagram of an LED lamp according to a conventional embodiment.
2 is a perspective view schematically showing an LED lamp according to an embodiment of the present invention.
3 is a partially enlarged view of a portion of FIG. 2.

Hereinafter, configurations and applications according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following description is one of several aspects of the patentable invention and the following description forms part of the detailed description of the invention.

In the following description, well-known functions or constructions are not described in detail for the sake of clarity and conciseness.

Hereinafter, a case in which an LED lamp according to an embodiment of the present invention is used as a light source of a vehicle will be described. However, an application range of the LED lamp according to the embodiment of the present invention is not limited thereto. Naturally, the present invention can be applied to lighting having an irregular appearance and the like.

FIG. 2 is a perspective view schematically showing an LED lamp according to an embodiment of the present invention, and FIG. 3 is a partially enlarged view of a portion of FIG. 2.

As shown in these drawings, the LED lamp 100 according to an embodiment of the present invention, the plate-shaped mounting portion 110 is mounted with a plurality of light emitting elements (111, LED, Light Emitting Diode) and The light emitting unit 130 is disposed to be spaced apart from the mounting unit 110 and has a plurality of light emitting portions 131 to emit light generated from the plurality of light emitting devices 111. It may include a light moving unit 150 for forming a path for transmitting the light generated from the device 111 to the light emitting portion 131 of the light emitting unit 130.

Referring to each configuration, first, the mounting portion 110 of the present embodiment is provided in a plate shape, as shown schematically in Figs. 2 and 3, the plurality of light emitting elements 111 mounted on one surface thereof in the longitudinal direction. The printed circuit board 113 and the heat dissipation member 115 may be attached to the other surface of the printed circuit board 113 to absorb light generated from the light emitting element 111 and emit the light to the outside.

The plurality of light emitting devices 111 may be regularly coupled to the printed circuit board 113 to generate light according to power supplied through the printed circuit board 113. Due to the application of the light emitting device 111, not only can consume less power, but also semi-permanent use can be reduced cost.

The printed circuit board 113 of the present embodiment may be electrically connected to the light emitting device 111 and may transfer power to the light emitting device 111 to switch the light emitting device 111. The printed circuit board 113 may be provided as a metal core printed circuit board 113 (MCPCB, Metal Core Printed Circuit Board). Therefore, since the heat dissipation effect is superior to that of a general printed circuit board, heat generated when the light emitting element 111 emits light can be reduced.

However, the type of the printed circuit board 113 is not limited to the metal core printed circuit board 113 described above, but it is obvious that other types of printed circuit boards may be applied. For example, it is natural that a flexible printed circuit board (FPCB) or the like having a plate shape but having flexibility and being able to be deformed to some extent depending on the installation area may be applied.

As described above, since the printed circuit board 113 of the present embodiment is provided in a plate shape, the plurality of light emitting devices 111 can be easily mounted (that is, a punching process of the printed circuit board is not required as in the prior art). Therefore, the LED lamp 100 of the present embodiment can be easily mounted in, for example, a lamp installation area of an automobile.

In addition, the LED lamp 100 of the present embodiment may be mounted to a head lamp or the like as a light source of the vehicle as described above, wherein the LED lamp 100 is mounted to the electric module (not shown) in the mounting space in which the head lamp is mounted Can be. That is, the design freedom of the mounting unit 110 is good, so that the mounting unit 110 may be manufactured according to the shape of the electric module, and thus the LED lamp 100 may be easily mounted on the vehicle.

On the other hand, the printed circuit board 113 of the present embodiment, as shown in Figure 3, the plate-shaped heat radiation member 115 may be mounted. The heat dissipation member 115 may be provided as a heat sink plate, and the heat dissipation member 115 may be mounted on the printed circuit board 113 so as to be positioned on the opposite side of the light emitting element 111 with the printed circuit board 113 therebetween. Can be.

The heat radiating member 115 absorbs heat generated when the light emitting device 111 emits light and emits heat to the outside, thereby preventing excessive heating of the light emitting device 111 and the printed circuit board 113. have.

The heat dissipation member 113 may be provided in an integral plate shape, as shown in FIG. 3, but the opposite surface of the printed circuit board 113 formed of unit pieces and corresponding to the position where the light emitting element 111 is mounted. Of course, each may be mounted on.

On the other hand, the light generated from the above-described light emitting device 111 may be emitted through the light emitting unit 130, rather than directly illuminating the outside.

As shown in FIG. 3, the light emitting unit 130 according to the present exemplary embodiment is a portion in which light is substantially emitted to illuminate the outside, and is disposed to be spaced apart from the mounting unit 110 and corresponding to the above-described light emitting devices 111. Light emitting portions 131.

The light emitting unit 130 may be integrally manufactured in an irregular shape according to the shape of the installation area (for example, an irregular shape), and the plurality of light emitting parts 131 may be formed in accordance with the number of the light emitting elements 111. Spaced apart. That is, light generated from the light emitting element 111 may be emitted to the outside through the light emitting portion 131 of the light emitting unit 130.

Since the light emitting unit 130 serves to emit light transmitted to the outside by being mounted only in the installation area, the light emitting unit 130 can be simplified and manufactured, and the light emitting unit 111 such as the light emitting element 111 can be simplified. Since the configuration is not mounted, it is not necessary to consider the tolerance setting between the correlation parts such as the light emitting element 111, and thus a free design can be made to correspond to the shape of the installation area.

On the other hand, the light emitting portion 131 of the light emitting portion 130 of the present embodiment and the light emitting element 111 of the mounting portion 110, as shown in Figs. 2 and 3, the light forming the movement path of light It is delivered via the eastern part 150.

The light moving part 150 of the present embodiment may be provided as an optical fiber 150 having excellent light transmission efficiency. Since the optical fiber 150 has very low energy (light) loss, light generated from the light emitting element 111 may be transmitted to the light emitting portion 131 with little loss, and may be damaged due to little external influence. There is almost no. In addition, since the optical fiber 150 is flexible, the space of the installation area is not limited.

As shown in FIG. 3, the light moving part 150 is connected to the light emitting device 111 and the other end thereof to the light emitting part 131. That is, one light emitting element 111 and one light emitting portion 131 correspond to one light moving part 150. Therefore, when power is applied through the printed circuit board 113 and the selected light emitting device 111 is turned on, light is transmitted to the light emitting part 131 through the light moving part 150 connected thereto, so that the light emitting device is externally provided. Light generated from 111 may be illuminated.

However, in this embodiment, although the light moving unit 150 is provided as the optical fiber 150 for light transmission, it is not limited thereto, and it is natural that other materials having high light transmission efficiency may be applied.

As described above, according to the exemplary embodiment of the present invention, the light generated from the light emitting element 111 mounted on the plate-shaped mounting unit 110 is emitted from the emission unit 130 via the light moving unit 150. By having a structure that can be simplified, not only the configuration can be simplified, but also the manufacturing process can be reduced compared to the conventional manufacturing cost and manufacturing time can be reduced, and the plurality of light emitting elements 111 to the plate-shaped mounting portion 110 Mounting can facilitate heat dissipation design.

In addition, since the light emitting device 111 is mounted on the printed circuit board of the mounting unit 110 connected by the light moving unit 150 instead of the light emitting unit where light is directly emitted, the mounting structure of the light emitting unit can be simplified. You can also increase your degrees of freedom.

In addition, the mounting unit 110 on which the light emitting element 111 is mounted may be mounted to, for example, the vehicle's electric module. In this case, the design of the mounting unit 110 may be good, thereby facilitating the design according to the shape of the electric module. have.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

100: LED lamp 110: mounting portion
111 light emitting device 113 printed circuit board
115: heat radiating member 130: light emitting part
131: light emitting portion 150: optical fiber

Claims (7)

A mounting part in which a plurality of light emitting diodes (LEDs) are mounted and having a plate shape;
A light emitting part disposed to be spaced apart from the mounting part and having a plurality of light emitting parts emitting light generated from the plurality of light emitting devices; And
A plurality of light moving parts connected to the light emitting device mounted on the mounting part and the light emitting part formed on the light emitting part to form a path for transferring the light generated from the light emitting device to the light emitting part;
LED lamp comprising a.
The method of claim 1,
The light moving unit is an LED lamp provided with an optical fiber (optical fiber) that can switch the movement path of light in a desired direction.
The method of claim 1,
Wherein,
A plate-shaped printed circuit board on which the plurality of light emitting elements are mounted in a longitudinal direction; And
And a heat dissipation member coupled to the printed circuit board to absorb and release heat generated from the light emitting device.
The method of claim 3,
The heat dissipation member is a heat sink plate (heat sink plate), LED lamp mounted to the printed circuit board so as to be located on the opposite side of the light emitting device with the printed circuit board interposed therebetween.
The method of claim 3,
The printed circuit board is a LED lamp of the metal core printed circuit board (MCPCB, Metal Core Printed Circuit Board).
The method of claim 1,
The light emitting unit is made of an irregular shape so as to correspond to the irregular shape of the installation area, the light emitting portion of the light emitting unit and the light emitting element of the mounting portion is connected to the LED by the light moving portion having a different length from one to one lamp.
The method of claim 1,
The LED lamp is a light source of the vehicle, the LED lamp is mounted to the electric module of the vehicle, wherein the mounting portion is manufactured according to the shape of the electric module.
KR1020110121020A 2011-11-18 2011-11-18 Led lamp KR20130055327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110121020A KR20130055327A (en) 2011-11-18 2011-11-18 Led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110121020A KR20130055327A (en) 2011-11-18 2011-11-18 Led lamp

Publications (1)

Publication Number Publication Date
KR20130055327A true KR20130055327A (en) 2013-05-28

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Application Number Title Priority Date Filing Date
KR1020110121020A KR20130055327A (en) 2011-11-18 2011-11-18 Led lamp

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104165318A (en) * 2014-07-31 2014-11-26 江苏彤明高科汽车电器有限公司 Kicker light daytime running light for automobile

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104165318A (en) * 2014-07-31 2014-11-26 江苏彤明高科汽车电器有限公司 Kicker light daytime running light for automobile

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