KR20130051762A

KR20130051762A - Lamp

Info

Publication number: KR20130051762A
Application number: KR1020110117095A
Authority: KR
Inventors: 숭샹 양; 요? 황
Original assignee: 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드
Priority date: 2011-11-10
Filing date: 2011-11-10
Publication date: 2013-05-21

Abstract

PURPOSE: A lamp is provided to increase the heat radiation area of each heat radiation pin by forming each of the heat radiation pin in a curved shape. CONSTITUTION: A heat radiation member(20) is combined to an electrical connection member(10). The heat radiation member comprises a first surface, a second surface, a substrate(21) which have a through-hole(213), a partition member(23), and a plurality of heat radiation pin(24). A plurality of heat radiation pin is protruded to an outside from an outer periphery of the partition member to have a curved shape. At least one LED element(30) is mounted on a first surface of the substrate. A driving circuit module(50) is electrically connected to the LED element and the electrical connection member.

Description

Lamp {LAMP}

The present invention relates to a lighting apparatus, and more particularly to a light emitting diode lamp.

The light emitting diode has a high luminance, low operating voltage, low energy consumption, easy mixing with a direct circuit, simple driving, long life, and the like. To reduce energy consumption and carbon dioxide emissions. However, since the light emitting diode generates a large amount of heat during the operation, it is necessary to dissipate such a large amount of heat to the outside. In particular, in the case where the light emitting diode is applied to an indoor light having a relatively dense structure, heat dissipation is poor, which may not only affect the luminous efficiency of the light emitting diode but may even cause damage to the light emitting diode. .

The present invention has been invented in view of the above point, and an object thereof is to provide a light emitting diode lamp having excellent heat radiation efficiency.

In order to achieve the above object, the present invention provides a substrate having opposing first and second surfaces, a cylinder elongated from the second surface of the substrate, and a projection protruding outward from an outer circumferential surface of the cylinder such that each has a curved shape. A heat dissipation member having a plurality of heat dissipation fins; Provided is a light emitting diode lamp having at least one light emitting diode element mounted on a first surface of the substrate.

In the LED lamp according to the present invention, since each of the heat radiation fins is formed in a curved shape, the heat radiation area of each of the heat radiation fins is increased, so that heat radiation of the heat radiation member is effectively performed. Therefore, since the heat generated during the operation of the LED lamp is quickly dissipated to the outer circumferential environment through the heat dissipation member, it is possible to ensure stable operation of the LED lamp.

1 is a perspective view of a light emitting diode lamp according to the present invention.
FIG. 2 is an exploded view of the light emitting diode lamp shown in FIG. 1.
3 is a plan view of the heat dissipation member illustrated in FIG. 2.
4 is a cross-sectional view of the heat dissipation member shown in FIG. 2.

Hereinafter, a light emitting diode lamp according to the present invention will be described in detail with reference to the exemplary drawings.

1 and 2, the LED lamp 100 according to the embodiment of the present invention includes an electrical connection member 10, a heat dissipation member 20 coupled to the electrical connection member 10, and the heat dissipation. A plurality of light emitting diode elements 30 mounted on the member 20 and a lamp cover 40 coupled to the heat dissipation member 20 to cover the light emitting diode elements 30 are provided.

The electrical connection member 10 is electrically connected to an external power source (not shown) to supply electrical energy to the LED lamp 100. The electrical connection member 10 is a standardized device, which allows the LED lamp 100 to directly replace a traditional incandescent lamp.

The heat dissipation member 20 is made of a material having excellent thermal conductivity and high temperature resistance, such as a metal material or a ceramic material. Copper (Cu), aluminum (Al) or an alloy thereof is used as the metal material. As the ceramic material, it is preferable to use aluminum oxide or aluminum nitride, and the heat dissipation member 20 made of the aluminum oxide or aluminum nitride not only has excellent thermal conductivity and high temperature resistance but also excellent electrical insulation effect. In the present embodiment, the heat dissipation member 20 is made of aluminum which is easily molded. The heat dissipation member 20 is a substrate 21, a ring-shaped mounting portion 22 extending upward from the periphery of the substrate 21, and a lower side from the periphery of the substrate 21. And a plurality of heat dissipation fins 24 formed on the outer circumferential surface of the mounting portion 22 and the cylinder 23 and extended to the outside.

The substrate 21 has a plurality of through-holes 213 penetrating the first surface 211 and the second surface 212 and the first surface 211 and the second surface 212 facing each other. Have The through hole 213 flows air on the first surface 211 and air on the second surface 212.

The mounting portion 22 is extended upward from the periphery of the first surface 211 of the substrate 21. At the upper end of the mounting portion 22, four coupling portions 221 protruding along the circumference toward the center are formed at equal intervals. A recess 222 is formed between each coupling portion 221 and the substrate 21. The coupling part 221 and the recess 222 are used to couple the lamp cover 40 to the first surface 211 side of the substrate 21.

The cylinder 23 is extended downward from the circumference of the second surface 212 of the substrate 21. The cylinder 23 has a hollow structure, and an accommodating space 231 is formed therein. The driving circuit module 50 is accommodated in the accommodation space 231. The driving circuit module 50 is electrically connected to the light emitting diode element 30 and the electrical connection member 10. An open opening 232 is formed at one end of the cylinder 23 away from the substrate 10. The electrical connection member 10 is coupled to the opening 232.

The heat dissipation fins 24 protrude in a radial shape while surrounding the outer circumferential surface of the cylinder 23. Each heat radiation fin 24 extends along the axial direction of the cylinder 23. Referring to FIG. 3, each of the heat dissipation fins 24 has a curved shape, and includes a first straight portion 241, a second straight portion 245, and the first straight portion 241 and the second straight portion 245. ) Has a bend portion (243) for connecting. The first linear portion 241 and the second linear portion 245 are positioned on different busbars of the cylinder 23 by the bent portion 243. In other words, each of the heat dissipation fins 24 has a "S" shape. The height of each heat radiation fin 24 (that is, the distance protruding from the outer circumferential surface of the cylinder 23) becomes smaller toward the other end side from the mounting portion 22 side. Thus, the limited area of the heat dissipation fins 24 can be fully utilized while the volume of the LED lamp 100 is reduced. The heat dissipation fins 24 are installed in pairs of two. In each pair of heat dissipation fins 24, the gap 23 gradually increases from the side in contact with the outer circumferential surfaces of the cylinder 23 and the mounting portion 22 toward the protruding end side, while the cylinder 23 is from the mounting portion 22 side. The distance becomes smaller toward the other end of. Therefore, the outer circumferential space of the heat dissipation member 20 can be sufficiently used.

The light emitting diode element 30 is mounted on the first surface 211 of the substrate 21, and is electrically connected to the driving circuit module 50 by passing a conductive wire through the through hole 213 of the substrate 211. Connected.

The lamp cover 40 is made of a transparent material such as glass, plastic, or the like. The lamp cover 40 has a hollow hemisphere structure with one side open. The lamp cover 40 is coupled to the mounting portion 22 of the heat dissipation member 20 to cover the light emitting diode element 30.

When the LED lamp 100 operates, a part of the heat emitted by the LED device 30 is directly transmitted to the heat radiating fins 24 through the substrate 21 of the heat radiating member 20. Is flowed into the cylinder 23 through the through hole 213 of the substrate 21 and then transferred to the heat dissipation fin 24. Finally, the heat emitted by the light emitting diode device 30 is dissipated to the outer circumferential environment through the plurality of heat dissipation fins 24. In addition, heat emitted by the driving circuit module 50 is also dissipated to the outer circumferential environment through the plurality of heat dissipation fins 24. Since each heat sink fin 24 is formed in a curved shape, its heat dissipation area is increased, so that the heat dissipation member 20 is effectively radiated. Therefore, since the heat generated during the operation of the light emitting diode lamp 100 is quickly dissipated to the outer circumferential environment through the heat radiating member 20, it is possible to ensure a stable operation of the light emitting diode lamp 100.

As mentioned above, although this invention was demonstrated using preferable embodiment, the scope of the present invention is not limited to a specific embodiment and should be interpreted by the attached Claim. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

100 --- light emitting diode lamp
10 --- Electrical connection member
20 --- heat dissipation member
21 --- Board
211 --- first surface
212 --- Second surface
213 --- through hole
22 --- Mounting
221 --- coupling
222 --- groove
23 --- tubular
231 --- Space
232 --- opening
24 --- heat sink fins
241 --- first straight line
243 --- Bends
245 --- Second straight line
30 --- light emitting diode element
40 --- lamp cover
50 --- Drive Circuit Module

Claims

A heat dissipation member having a substrate having opposing first and second surfaces, a cylinder elongated from the second surface of the substrate, and a plurality of heat dissipation fins protruding outward from the outer circumferential surface of the cylinder so that each has a curved shape; ,
And at least one light emitting diode element mounted on the first surface of the substrate.

The method of claim 1,
The curved heat dissipation fin has a first straight portion, a second straight portion, and a bent portion connecting the first straight portion and the second straight portion, wherein the first straight portion and the second straight portion are mutually spaced apart from each other. Light emitting diode lamp, characterized in that located on another bus bar.

The method of claim 1,
The radiating fins are paired two by two,
In each pair of heat dissipation fins, the distance from the side in contact with the outer circumferential surface of the cylinder and the mounting portion is gradually increased toward the protruding end side, while the distance from the mounting side is gradually smaller toward the end side away from the mounting portion of the cylinder. LED lamp, characterized in that the losing.

The method of claim 1,
The height of each heat sink fin becomes smaller toward the end side away from the mounting portion of the cylinder from the mounting portion side.

The method of claim 1,
And a through-hole penetrating the first surface and the second surface in the substrate.

The method of claim 1,
The light emitting diode lamp further includes a lamp cover,
The substrate has a ring-shaped mounting portion extending from the first surface, and a coupling portion protruding toward the center of the mounting portion at equal intervals is formed at the periphery of the mounting portion, and the coupling portion and the substrate extend the lamp cover. The light emitting diode lamp, characterized in that for forming a groove for coupling to the heat radiating member.