KR20130037355A - Automatic teaching method of substrate transfer robot and substrate treating equipment using the same - Google Patents

Abstract

PURPOSE: An automatic teaching method of a substrate transfer robot and substrate processing equipment using the same are provided to detect the position of a guide line using horizontal and vertical detection units, to automatically teach a coating robot using detected data, and to reduce the time for a teaching process. CONSTITUTION: A guide line is formed in the outer wall of a resist coating chamber(410). The guide line has a horizontal guide line(HGL1,HGL2,HGL3) and a vertical guide line(VGL1,VGL2). A sensor unit(438) is formed in the hand(434) of a coating robot(432). The sensor unit has a horizontal detection unit and a vertical detection unit. The control unit teaches a substrate transfer robot according to the position of the guide line detected by the horizontal and vertical detection units. [Reference numerals] (AA,BB) Moving;

Description

AUTOMATIC TEACHING METHOD OF SUBSTRATE TRANSFER ROBOT AND SUBSTRATE TREATING EQUIPMENT USING THE SAME}

The present invention relates to a teaching method of a substrate transfer robot and a substrate processing facility using the same, and more particularly, to a method of automatically teaching a substrate transfer robot and a substrate processing facility using the same.

In the semiconductor manufacturing process, the photolithography process is a process of forming a desired resist pattern by applying a resist solution to a substrate and exposing and developing using a photo mask. Such photolithography processes include resist solution application processes, exposure and development processes. The substrate transfer apparatus transfers the substrate to a processing unit (or process chamber) that processes each process. Therefore, the substrate transfer apparatus needs to set the position of the transfer robot in order to supply the substrate accurately to each processing unit.

For example, a semiconductor manufacturing facility such as a spinner system or a scrubber has a plurality of processing units and transfers the substrate to the processing unit by a transfer robot. The processing unit proceeds with each process, and the substrate is again transferred to the outside by the transfer robot. It is very important at this time that the substrate is correctly placed in the set position of the plate in the processing unit. If the substrate is incorrectly placed on a plate in the bake module or the application module, process errors such as failure to uniformly heat the entire substrate or uniform application of the photoresist occur. For this purpose, a teaching operation is performed to adjust the position of the transfer robot before the process is performed so that the substrate can be loaded to the correct position of the plate or spin chuck in the processing unit.

On the other hand, while the transfer robot transfers the substrate, the movement position of the transfer robot for loading the substrate into each process module is often deviated from the initially set position due to the collision of the input window or the plate of the processing unit. In this case, it is usually necessary to reset the teaching of the transfer robot in each process module. Patent Literature 1 discloses an automatic teaching apparatus for a substrate transfer robot having a jig, a vision camera, and a proximity sensor. However, since the automatic teaching device of Patent Document 1 requires a separate jig, a vision camera, or the like, there is a problem that it takes a lot of cost to construct the device.

Patent Document 1: Korea Patent Publication 10-2009-0051423 (2009. 05. 22. Publication)

Embodiments of the present invention are to provide a method for automatically teaching a substrate transfer robot with a simple structure.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, the guide line is displayed on the outer wall of the chamber to correspond to the movement path of the substrate transfer robot, and the position of the guide line is detected by a sensor unit provided to the substrate transfer robot according to the movement of the substrate transfer robot. By transmitting to the control unit, the control unit may be provided with the automatic teaching method of the substrate transfer robot for teaching the substrate transfer robot to the position of the guide line transmitted.

The sensor unit may further include a horizontal direction detecting unit and a vertical direction detecting unit, and the control unit automatically controls the substrate transfer robot according to the position of the guide line detected by the horizontal direction detecting unit and the vertical direction detecting unit. A teaching method can be provided.

The guide line may further include a horizontal guide line provided in a horizontal direction under the shutter of the chamber; And a shutter guide line extending upward from the horizontal guide line toward the center of the shutter, wherein the horizontal detector detects a position of the horizontal guide line, and the vertical detector detects a position of the shutter guide line. An automatic teaching method of the substrate transfer robot may be provided to detect the substrate transfer robot.

In addition, the outer wall of the chamber is applied in black, the guide line is applied in white can be provided with the automatic teaching method of the substrate transfer robot.

According to another aspect of the present invention, there is provided a chamber comprising: a chamber in which process processing on a substrate is performed; A substrate transfer robot for transferring a substrate into and out of the chamber; And a controller configured to control an operation of the substrate transfer robot, wherein the controller includes a sensor unit provided to the substrate transfer robot when the substrate transfer robot moves along a guide line displayed on an outer wall of the chamber. When detecting and transmitting, a substrate processing facility for teaching the substrate transfer robot to the position of the transmitted guide line may be provided.

The sensor unit may include a horizontal direction detection unit and a vertical direction detection unit, and the control unit may be provided by a substrate processing apparatus for teaching the substrate transfer robot according to the position of the guide line detected by the horizontal direction detection unit and the vertical direction detection unit. Can be.

The guide line may further include a horizontal guide line provided in a horizontal direction under the shutter of the chamber; And a shutter guide line extending upward from the horizontal guide line toward the center of the shutter, wherein the horizontal detector detects a position of the horizontal guide line, and the vertical detector detects a position of the shutter guide line. A substrate processing facility may be provided to detect the substrate and teach the substrate transfer robot.

In addition, a substrate processing facility may be provided in which the outer wall of the chamber is coated in black and the guide line is coated in white.

According to the embodiment of the present invention, it is possible to reduce the time required for the teaching operation.

In addition, according to the embodiment of the present invention, the teaching accuracy can be increased.

Moreover, according to the Example of this invention, work efficiency can be improved.

1 is a view of the substrate processing equipment from above.
FIG. 2 is a view of the installation of FIG. 1 as viewed from the AA direction. FIG.
FIG. 3 is a view of the installation of FIG. 1 viewed in the BB direction. FIG.
4 is a view of the installation of FIG. 1 as viewed from the CC direction.
5 is a view illustrating a guide line and an application part robot provided in the resist application chamber of FIG. 1.
6 to 8 are views illustrating a method of automatically teaching the applicator robot with the sensor unit of FIG. 5.

Hereinafter, with reference to the accompanying drawings will be described in detail the automatic teaching method and substrate processing equipment using the substrate transfer robot according to an embodiment of the present invention. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

The facility of this embodiment is used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the equipment of this embodiment is used to perform a coating process, a developing process, and a pre-exposure treatment process required before and after the liquid immersion exposure to the substrate.

1 to 4 are schematic diagrams of substrate processing equipment according to an embodiment of the present invention. 1 is a view of the substrate processing equipment from above. FIG. 2 is a view of the installation of FIG. 1 viewed from the A-A direction. FIG. FIG. 3 is a view of the installation of FIG. 1 viewed in the direction B-B. FIG. 4 is a view of the installation of FIG. 1 viewed from the C-C direction.

1 to 4, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate S is moved in the state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, a front open unified pod (FOUP) having a front door may be used as the cassette 20.

The load port 100 has a mounting table 120 on which the cassette 20 containing the substrates S is placed. The mounting table 120 is provided in plurality. The mounting tables 200 are arranged in a line along the second direction 14. In Fig. 1, four placement tables 120 are provided.

The index module 200 transfers the substrate S between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 drives four axes so that the hand 221 which directly handles the substrate S can be moved and rotated in the first direction 12, the second direction 14, and the third direction 16. This has a possible structure. The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. In addition, the frame 210 is further provided with a door opener (not shown) for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store the plurality of substrates S, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One support S is placed on each support 332. In the housing 331, the index robot 220, the first buffer robot 360, and the developing unit robot 482 of the developing module 402, which will be described later, move the substrate S to the support 332 in the housing 331. An opening (not shown) is provided in a direction in which the index robot 220 is provided, a direction in which the first buffer robot 360 is provided, and a direction in which the developing unit robot 482 is provided to be able to carry in or take out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. For example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate S between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate S, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate S is placed and cooling means 353 for cooling the substrate S. As shown in FIG. As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate S on the cooling plate 352. The housing 351 has an index robot 220 so that the developing robot 482 provided to the index robot 220 and the developing module 402 to be described later can carry or unload the substrate S into the cooling plate 352. The provided direction and developing part robot 482 has an opening (not shown) in the provided direction. In addition, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The coating and developing module 400 performs a process of applying a photoresist on the substrate S before the exposure process and a process of developing the substrate S after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. As an example, the application module 401 is located above the developing module 402.

The application module 401 performs a process of applying a photoresist such as photoresist to the substrate S and a heat treatment process such as heating and cooling of the substrate S before and after the photoresist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example is provided in which nine resist application chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which nine bake chambers 420 are provided is shown. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes the baking chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first of the second buffer module 500 described later. The substrate S is transferred between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photo resist on the substrate S. The resist application chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate S. The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the substrate S placed on the support plate 412. The nozzle 413 has a circular tubular shape and can supply the photoresist to the center of the substrate S. FIG. Optionally, the nozzle 413 has a length corresponding to the diameter of the substrate S, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid, such as deionized water, to clean the surface of the substrate S on which the photoresist is applied.

The bake chamber 420 heat-treats the substrate S. For example, the bake chambers 420 may be a prebake process or a photoresist that heats the substrate S to a predetermined temperature and removes organic matter or moisture from the surface of the substrate S before applying the photoresist. A soft bake step or the like performed after coating on S) is performed, and a cooling step or the like for cooling the substrate S is performed after each heating step. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.

The developing module 402 includes a developing process of supplying a developing solution to obtain a pattern on the substrate S to remove a part of the photoresist, and a heat treatment process such as heating and cooling performed on the substrate S before and after the developing process. Perform. The developing module 5402 has a developing chamber 460, a baking chamber 470, and a conveying chamber 480. The development chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The development chamber 460 and the bake chamber 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 460 are provided, and a plurality of developing chambers 460 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which nine developing chambers 460 are provided is shown. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which nine bake chambers 470 are provided is shown. Alternatively, however, the bake chamber 470 can be provided in greater numbers.

The transfer chamber 480 is positioned in parallel with the second buffer 330 of the first buffer module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The developing unit robot 482 includes the bake chambers 470, the developing chambers 460, the second buffer 330 and the cooling chamber 350 of the first buffer module 300, and the second buffer module 500. The substrate S is transferred between the second cooling chambers 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The development chambers 460 all have the same structure. However, the types of developers used in the respective developing chambers 460 may be different from each other. The developing chamber 460 removes a region to which light is irradiated from the photoresist on the substrate S. FIG. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

The development chamber 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located in the housing 461 and supports the substrate S. The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the substrate S placed on the support plate 462. The nozzle 463 has a circular tubular shape and can supply the developer to the center of the substrate S. FIG. Optionally, the nozzle 463 has a length corresponding to the diameter of the substrate S, and the discharge port of the nozzle 463 may be provided as a slit. In addition, the developing chamber 460 may further be provided with a nozzle 464 for supplying a cleaning solution such as deionized water to clean the surface of the substrate S to which the developing solution is supplied.

The bake chamber 470 heat-treats the substrate S. For example, the bake chambers 470 are heated after each baking process and a hard bake process for heating the substrate S after the developing process is performed and a post bake process for heating the substrate S before the developing process is performed. And a cooling process for cooling the finished substrate. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with a cooling means 473 such as a cooling water or a thermoelectric element. Or the heating plate 472 is provided with a heating means 474 such as a hot wire or a thermoelectric element. The cooling plate 471 and the heating plate 472 may be provided in one bake chamber 470, respectively. Optionally, some of the bake chambers 470 may have only a cooling plate 471, while the other may have only a heating plate 472. [

As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. In addition, the application module 401 and the development module 402 may have the same chamber arrangement as viewed from above.

The second buffer module 500 is provided as a passage through which the substrate S is transported between the coating and developing module 400 and the pre-exposure processing module 600. In addition, the second buffer module 500 performs a predetermined process on the substrate S, such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 transports the substrate S between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates S on which the process is performed in the application module 401. The first cooling chamber 530 cools the substrate S on which the process is performed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes the edge of the substrates S on which the cooling process is performed in the first cooling chamber 530. The buffer 520 temporarily stores the substrate S before the substrates S processed in the edge exposure chamber 550 are transferred to the pretreatment module 601 described later. The second cooling chamber 540 cools the wafers W before the substrates S processed in the post-processing module 602, which will be described later, are transferred to the developing module 402. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the substrates S processed in the post-processing module 602 may be temporarily stored in the added buffer and then transferred to the developing module 402.

When the exposure apparatus 900 performs the liquid immersion exposure process, the exposure before and after processing module 600 may perform a process of applying a protective film that protects the photoresist film applied to the substrate S during the liquid immersion exposure. In addition, the pre and post-exposure processing module 600 may perform a process of cleaning the substrate S after the exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre-exposure treatment module 600 may perform a post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pretreatment module 601 performs a process of processing the substrate S before performing the exposure process, and the post-processing module 602 performs a process of processing the substrate S after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. As an example, the pretreatment module 601 is located on top of the aftertreatment module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The pretreatment robot 632 is provided between the protective film applying chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500, and the first buffer 720 of the interface module 700 described later. The substrate S is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film applying chamber 610 applies a protective film on the substrate S to protect the photoresist film during the liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate S. The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate S placed on the supporting plate 612. The nozzle 613 has a circular tubular shape and can supply a protection liquid to the center of the substrate S. As shown in FIG. Optionally, the nozzle 613 has a length corresponding to the diameter of the substrate S, and the discharge port of the nozzle 613 may be provided as a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film applying chamber 610 rotates the substrate S placed on the support plate 612 to supply the protective liquid to the center area of the substrate S. FIG.

The baking chamber 620 heat-treats the substrate S on which the protective film is applied. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 includes cleaning chambers 660, post-exposure bake chambers 670, a second cooling chamber 540 of the second buffer module 500, and a second of the interface module 700 described below. The substrate S is transported between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate S after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate S. The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate S placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the center area of the substrate S while rotating the substrate S placed on the support plate 662. Optionally, while the substrate S is rotated, the nozzle 663 may linearly or rotationally move from the center region of the substrate S to the edge region.

The post-exposure bake chamber 670 heats the substrate S on which the exposure process is performed using ultraviolet rays. The post-exposure bake process heats the substrate S to amplify an acid generated in the photoresist by exposure to complete the change of the properties of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate S between the pre- and post-exposure processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 transports the substrate S between the first buffer 720, the second buffer 730, and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates S processed in the pretreatment module 601 before they are moved to the exposure apparatus 900. The second buffer 730 temporarily stores the substrates S processed in the exposure apparatus 900 before moving to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed in the housing 721 and are provided spaced apart from each other along the third direction 16. One support S is placed on each support 722. The housing 721 is a direction and pretreatment robot provided with the interface robot 740 so that the interface robot 740 and the pretreatment robot 632 can bring in or take out the substrate S into the support 722 into the housing 721. 632 has an opening (not shown) in the direction provided. The second buffer 730 has a structure generally similar to that of the first buffer 720. However, the housing 4531 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in the direction in which the post-processing robot 682 is provided. The interface module may be provided with only the buffers and the robot as described above without providing a chamber for performing a predetermined process on the substrate.

5 is a view illustrating a guide line and an application part robot provided in the resist application chamber of FIG. 1.

Referring to FIG. 5, a guide line GL is provided on an outer wall of the resist coating chamber 410. The guide line GL has horizontal guide lines HGL1, HGL2 and HGL3 and vertical guide lines VGL1 and VGL2. The horizontal guide lines HGL1, HGL2 and HGL3 are provided in parallel with the first direction 12, respectively. The horizontal guide lines HGL1, HGL2, and HGL3 are provided under the shutter 415 of the resist coating chamber 410, respectively. The horizontal guide lines HGL1, HGL2, and HGL3 are provided corresponding to the number of stacked resist coating chambers 410. In FIG. 5, three horizontal direction guide lines HGL1, HGL2, and HGL3 are provided to correspond to the resist coating chamber 410 having three stages stacked in the third direction 16. The vertical guide lines VGL1 and VGL2 are provided in parallel with the third direction 16. The vertical guide line VGL1 connects one end of the first direction 12 of the horizontal guide lines HGL1 and HG12. The vertical guide line VGL2 connects the other end of the first direction 12 of the horizontal guide lines HGL1 and HG12. The horizontal guide lines HGL1, HGL2 and HGL3 and the vertical guide lines VGL1 and VGL2 are connected in series. The shutter guide lines SGL face the center of the shutter 415 and protrude side by side in the third direction 16 from the horizontal guide lines HGL1, HGL2 and HGL3. The outer wall of the resist coating chamber 410 and the guide lines HGL1, HGL2, HGL3, VGL1, VGL2, and SGL may be distinguished from each other by different colors. For example, the outer wall of the resist coating chamber 410 may be coated in black, and the guide lines HGL1, HGL2, HGL3, VGL1, VGL2, and SGL may be coated in white.

The sensor unit 438 is provided to the hand 434 of the applicator robot 432. 6 to 8 are views illustrating a method of automatically teaching the applicator robot with the sensor unit of FIG. 5. Referring to the drawings, the sensor unit 438 has a horizontal direction detector HS and a vertical direction detector VS. The horizontal detection unit HS detects the position of the horizontal guide line HGL1. The vertical direction detection unit VS detects positions of the vertical direction guide line VGL1 and the shutter guide line SGL. Both the horizontal detector HS and the vertical detector VS may have a light receiver and a light emitter. The horizontal direction detector HS has a first horizontal direction detector HS1 and a second horizontal direction detector HS2. The first horizontal direction detector HS1 and the second horizontal direction detector HS2 are provided parallel to the first direction 12 and spaced apart from each other by a predetermined distance. Referring to FIG. 8, the spaced distance between the first horizontal direction detector HS1 and the second horizontal direction detector HS2 is longer than the width of the first direction 12 of the vertical guide line VGL1. The vertical direction detection unit VS has a first vertical direction detection unit VS1 and a second vertical direction detection unit VS2. The first vertical direction detector VS1 and the second vertical direction detector VS2 are provided parallel to the third direction 16 and spaced apart from each other by a predetermined distance. Referring to FIG. 6, the spaced distance between the first vertical direction detection unit VS1 and the second vertical direction detection unit VS2 is longer than the width of the third direction 16 of the horizontal direction guide line HGL1. Unlike the above, the sensor unit 438 may be provided as a vision camera.

5 to 8, a method of automatically teaching the applicator robot will be described.

The operator displays the guide line GL on the outer wall of the resist coating chamber 410 so as to correspond to a path in which the hand 434 of the applicator robot 432 moves. In this case, the guide line GL includes horizontal guide lines HGL1, HGL2 and HGL3, vertical guide lines VGL1 and VGL2, and a shutter guide line SGL. Subsequently, as the applicator robot 432 moves, the sensor unit 438 provided to the hand 434 of the applicator robot 432 detects the position of the guide line GL and transmits the position to the control unit 439. Subsequently, the controller 439 teaches the applicator robot 432 to the position of the transmitted guide line GL. For example, the sensor unit 438 detects the positions of the guide lines HGL1, HGL2, HGL3, VGL1, VGL2, and SGL, and turns the signal ON. Signal 'may be transmitted to the controller 439. Accordingly, in the state of FIG. 6, the horizontal detection unit HS of the sensor unit 438 transmits an 'ON signal' that detects the position of the horizontal guide line HGL1 to the control unit 439, and the sensor The vertical detection unit VS of the unit 438 transmits an 'OFF signal' to the controller 439, and the controller 439 moves the applicator robot 432 in parallel with the first direction 12. And teach. In the state of FIG. 7, the horizontal detection unit HS of the sensor unit 438 still transmits an 'ON signal' to the control unit 439, and the second vertical direction detection unit VS2 of the sensor unit 438 is The 'ON signal' and the first vertical direction detection unit VS1 transmit the 'OFF signal' to the control unit 439, and the control unit 439 moves the applicator robot 432 in the third direction ( Move in parallel with 16) and teach. At this time, the application unit robot 432 moves in the third direction 16 until the second vertical direction detection unit VS2 transmits an 'OFF signal' to the control unit 439. Subsequently, in the state of FIG. 8, the first horizontal direction detection unit HS1 and the second vertical direction detection unit VS2 of the sensor unit 438 transmit an 'ON signal' to the control unit 439, and the second horizontal direction. The direction detector HS2 and the first vertical direction detector VS1 transmit an 'OFF signal' to the controller 439, and the controller 439 transmits the applicator robot 432 to the third direction 16. Move them side by side. In the same way, the teaching of the applicator robot 432 is performed on the horizontal guide lines HGL2 and HGL3, the vertical guide line VGL2, and the shutter guide line SGL.

As described above, the positions of the guide lines HGL1, HGL2, HGL3, VGL1, VGL2, and SGL are detected by the horizontal direction detector HS and the vertical direction detector VS, and the controller 439 uses the detected data. By automatically teaching the applicator robot 432, the time required for the teaching operation can be reduced, the teaching accuracy can be increased, and the work efficiency can be improved.

In addition, the above-described automatic teaching method of the substrate transfer robot is not limited to the applicator robot, and is applicable to all substrate transfer robots that transfer the substrate to the process chamber, and also to substrate processing equipment that performs other processes such as a cleaning process. Applicable.

In addition, in the above description, the present invention has been exemplified in the case where the present invention is applied to a substrate processing facility having a structure in which a plurality of chambers are stacked.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

** Explanation of symbols on the main parts of the drawing **
1: substrate processing equipment
100: load port
200: index module
300: first buffer module
400: application and development module
500: second buffer module
600: pre and post-exposure processing module 700: interface module

Claims (2)

The guide line is displayed on the outer wall of the chamber so as to correspond to the movement path of the substrate transfer robot, and the sensor unit provided to the substrate transfer robot detects the position of the guide line according to the movement of the substrate transfer robot and transmits the guide line to the controller. Automatic teaching method of the substrate transfer robot for teaching the substrate transfer robot to the position of the guide line transmitted. The method of claim 1,
The sensor unit has a horizontal direction detecting unit and a vertical direction detecting unit,
And the control unit teaches the substrate transfer robot according to the position of the guide line detected by the horizontal direction detector and the vertical direction detector.

Images