KR20130013806A - Led lighting unit - Google Patents

Abstract

PURPOSE: An LED lighting device is provided to efficiently discharge heat generated in an LED element by forming a body of a lighting device by doubly injecting a synthetic resin having heat conductivity and electric insulation. CONSTITUTION: An LED element(10) discharges light by recombining an electron with a hole. A radiant heat housing(20) discharges head received from the LED element to the outside. The radiant heat housing is injection-molded with a synthetic resin having heat conductivity and electric insulation. A light source embedding unit(30) is injection-molded into a wire shape on the top side of the radiant heat housing. The LED element and the light source embedding unit are connected with each other by ultrasonic fusing or heat fusing. A plug unit(50) supplies power to an LED module.

Description

LED lighting unit {LED Lighting unit}

The present invention relates to an LED lighting device, and more particularly, by using a thermally conductive resin having electrical insulation properties and a thermally conductive resin having electrical conductivity properties, heat dissipation performance of heat generated in an LED device can be improved. The present invention relates to an LED lighting device that has been improved in the manufacturing process.

In general, a light emitting diode (LED) is a device that bonds a p-type semiconductor and an n-type semiconductor, and emits light while coupling electrons and holes at the junctions. These LEDs can be used for home appliances, remote control, electric signboards, and various automation devices because they can irradiate high efficiency light with low voltage, and they are applied to various lighting devices because they are environment friendly, have excellent durability and long life. Due to the above-described characteristics of the LED, an illumination device such as an incandescent lamp or a fluorescent lamp which is conventionally used is being replaced by a lighting device using an LED.

The LED device used as a light source of the LED lighting device is made of a surface mount device (SMD) method for mounting directly on a printed circuit board (PCB), and the LED device is formed on a plurality of PCBs. The dogs are aligned and combined. The PCB is mounted to a lamp body of a predetermined shape is mounted on the body of the lighting device.

However, in the case of the LED device, the light mainly proceeds in the direction in which the generated light is irradiated, and most of the heat generated during the light generation process is transferred to the PCB side opposite to the direction of light irradiation. Is composed. Therefore, thermal stress is generated on the PCB formed of relatively heat-sensitive material, which may reduce the performance and life of the LED device, causing malfunction and failure of the lighting device, and lowering the light emission efficiency and energy efficiency of the LED device. Is generated. Therefore, in the lighting device using the LED element, the heat dissipation device can be seen as a very important component. Accordingly, the lighting device using the LED is manufactured so that a plurality of heat dissipation fins are integrally formed on the body on which the PCB is installed, so that the heat emitted from the LED element can be quickly discharged.

However, as described above, the body in which the plurality of heat dissipation fins are formed is mainly manufactured by die-casting aluminum. Aluminum die casting processes include 1) aluminum casting, 2) gate and overflow cutting, 3) tap, drilling, milling, and CNC processes 4) sanding 5) plating / powder coating, etc. It consists of. The mold used in the aluminum die casting process is more expensive than the mold used in the resin injection process, and the die life is only about 1/5 to 1/10 of that of the plastic injection mold. little. In addition, since the heat dissipation fins of the body manufactured by the die casting method are not formed as thin as the heat dissipation fins formed through resin injection, the heat dissipation fins formed through the die cast are heat dissipated in the same space, and thus heat is rapidly dissipated. There is a limit to release. In addition, since the entire heat dissipation housing body serves as an electrically conducting conductor, if a power supply mounted inside the heat dissipation housing and insulation measures against the PCB are not sufficiently considered, it may provide a cause of failure of the device or an electric shock to the user.

In addition, since the lighting device using the aluminum heat dissipation structure is considerably heavier than existing lighting devices such as bulbs and fluorescent lights, it is difficult to replace only the body in which the LED element is mounted on the type of lighting case used in the existing lighting device. Falling safety issues may occur.

On the other hand, due to the importance of heat dissipation in the LED lighting device, in order to more advantageously respond to the heat dissipation in the ultra-high brightness LED lighting device uses a metal substrate (Metal PCB) instead of the F4 PCB used in the general circuit. Metal substrates are not only expensive compared to conventional PCBs, but also have electrical conductivity of about 2 W / mK between a pattern layer forming a circuit and a metal layer (copper or aluminum plate) for heat diffusion and heat conduction. It needs to be bonded with an adhesive layer. However, in the apparatus requiring the thermal conductivity of 2W / mK or more of the electrically insulating adhesive layer, there is a problem that the adhesive layer acts as a thermal resistance. In addition, since the metal substrate itself is not in contact with air to release heat, the metal substrate only plays a role of diffusing and conducting heat of the LED element to a heat dissipation structure such as a heat dissipation fin that emits heat to air. The metal substrate itself acts as a thermal resistance, unless the substrate has an infinite level of thermal conductivity.

In particular, in order to bond such a metal substrate on which the LED element is mounted to a heat dissipation structure such as a heat dissipation fin, it is necessary to use another heat conductive adhesive, heat conductive double-sided tape, heat conductive grease, etc. other than those mentioned above. This happens in addition. For example, the contact surface of the metal substrate and the heat dissipation structure seems to be completely horizontal to the naked eye, but in fact, the contact surfaces are only partially contacted with each other (typically less than 1%), and the rest are filled with air, so that the heat resistance inhibits heat dissipation of the LED element. Acts as. Therefore, the present invention is supplemented with a thermally conductive adhesive, a thermally conductive double-coated tape, a thermally conductive grease, and the like, but also has a problem of inhibiting optimum heat dissipation since it has its own thermal resistance.

The present invention has been made in view of the above problems, it is possible to effectively discharge the heat generated from the LED device, provides a light and low cost LED lighting device and a method of manufacturing the same, the environment generated during the manufacturing process The goal is to minimize contamination of

LED lighting device according to the invention at least one or more LED elements; A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the LED element to the outside; An electrically conductive light source mounting unit in which a double injection molding is formed on the upper surface of the heat dissipation housing in a wire shape by using a synthetic resin having both thermal conductivity and electrical conductivity, and the LED element is mounted on an upper side thereof; And a plug unit, one end of which is exposed to the outside of the heat dissipation housing, the other end of which is supplied with power to the LED module side, wherein the LED element and the conductive light source mounting unit are any of ultrasonic fusion and thermal fusion. It is characterized in that the connection.

The heat dissipation housing may be formed of a synthetic resin material having a thermal conductivity of 1 W / mK or more and an electrical resistivity of 1 MΩ · m or more, and the conductive light source mounting portion may be formed of a synthetic resin material having a thermal conductivity of 1 W / mK or more and an electrical resistivity of 100 kΩ · cm or less. .

The heat dissipation housing may include a heat conductive connection part formed of a synthetic resin having both thermal conductivity and electrical conductivity at a position corresponding to the center of the LED element, and insulated from wiring of the conductive light source mounting part.

The conductive light source may be plated with a conductive material at at least one or more positions of the light source mounting portion, the extension wiring portion, and the heat conductive connection portion.

LED lighting apparatus according to an embodiment of the present invention, a plurality of LED elements having the same standard; A heat dissipation housing which is injection-molded with a synthetic resin having both thermal conductivity and electrical insulation to form a body of the lighting apparatus; Using a synthetic resin having both thermal conductivity and electrical conductivity, a wiring pattern in which + and-poles are respectively connected to the upper surface of the heat dissipation housing is double injection molded, and the surface is plated with an electrically conductive metal material. A conductive light source mounting part mounted on the pattern such that the plurality of LED elements are spaced at equal intervals; And a plug unit, one end of which is exposed to the outside of the heat dissipation housing, the other end of which is connected to the PCB module and supplies power to the PCB side, wherein the LED element and the conductive light source mounting unit are ultrasonically fused and thermally fused. It is characterized by being connected in any one of the ways.

According to the present invention as described above, since the double injection of the synthetic resin having excellent thermal conductivity and both thermal conductivity and electrical insulation of the flame-retardant material, to form the body of the lighting device, the lighting device with an expensive die-cast metal material as in the prior art Even without forming the body, the heat generated by the LED element can be effectively released.

In addition, since the LED element and the conductive light source mounting part can be directly connected to each other without any additional fixing means such as soldering or epoxy adhesive by thermal fusion or ultrasonic fusion, heat transfer loss that may occur when soldering or adhesive is used is eliminated. It is possible to minimize.

1 is a perspective view showing an example of an LED lighting apparatus according to the present invention,
Fig. 2 is a bottom perspective view of Fig. 1,
3 is an exploded perspective view of FIG. 1;
4 is an exploded perspective view of FIG. 2;
5 is a perspective view of an LED lighting apparatus according to another embodiment of the present invention, and
6 is an exploded perspective view of FIG. 5.

Hereinafter, the LED lighting apparatus according to the present invention will be described with the drawings.

As shown in FIG. 1 to FIG. 6, the LED lighting apparatus according to the present invention includes an LED element 10, a heat dissipation housing 20, a conductive light source mounting unit 30, a PCB module 40, and a plug unit 50. ).

The LED element 10 is a semiconductor element formed of a p-n junction structure of a semiconductor and emits light by recombination of electrons and holes, and is driven by current in one direction. Therefore, in order to use the light emitting diode for general lighting, an AC-DC converter is required. Recently, LEDs that can be driven using an AC power source without an AC-DC converter have been developed for use in general lighting, but because of their relatively high cost, the LED element 10 operating from a DC power source is still present. It is used a lot. Also in the case of the present invention, since the LED element 10 operating in a direct current environment is used, it has a terminal portion to which the + and-poles are joined.

Only one LED device 10 may be used when a high brightness and high efficiency device is used, but in general, it is preferable to mount and use a plurality of LED devices 10. According to a preferred embodiment of the present invention, the LED element 10 is preferably arranged so that the three LED elements 10 having the same standard spaced apart, but is not limited to this, different colors as necessary It is also possible to mount the LED element 10 having.

The heat dissipation housing 20 may withstand the high heat emitted from the LED element 10 and is injection molded into a synthetic resin having excellent heat resistance and thermal conductivity so as to discharge heat to be transferred from the LED element 10 to the outside. As the material of the heat dissipation housing 20, any one of high thermal-conductive polyamide (nylon), poly phenyl sulphide (PPS), liquid crystal polymer (LCP), noryl (NORYL) resin, and ultem (PEI) may be used. have. In general, PPS / LCP injection material has thermal conductivity of 0.1 ~ 0.2W / mK, and Ultem (PEI) injection material is amorphous high-performance thermoplastic, which has imide bonds and good processability which gives excellent heat resistance and strength. It is resin of the formation of the ether bond which shows. In addition, an additive such as aluminum nitride may be added to the synthetic resin to improve thermal conductivity. Synthetic resin materials having both thermal conductivity and electrical insulation can maintain mechanical strength in a high temperature environment, and since they are flame retardant materials, they are suitable for use in lighting devices that generate a lot of heat.

In the case of the present invention, it is preferable to use LCP (Liquid Crystal Polymer) as the material of the heat dissipation housing 20.

An example of an LCP is LCP-based flame retardant and high flow synthetic resins developed by Unitika, Japan.The thermal conductivity is 30W / mK or more, the electrical resistivity of the electrically conductive resin is 10Ω · cm, and the electrical resistivity of the electrically insulating resin. Has 10 ¹⁴ Ω · cm or more of flame retardancy and has the following physical properties.

As described above, when the heat dissipation housing 20 is formed using a synthetic resin having both thermal conductivity and electrical insulation, a heat dissipation plate or a heat dissipation layer made of metal is formed on the upper surface 21 of the heat dissipation housing as in the prior art. There is no need to do so, it is possible to simplify the structure and reduce the manufacturing cost.

As shown in FIGS. 1 and 5, the upper surface 21 on which the LED element 10 of the heat dissipation housing 20 is mounted is formed to have a substantially circular shape, and has a conical shape in which the diameter decreases toward the lower side. Prepared. In this case, the heat dissipation housing 20 is provided with a heat dissipation fin 23 to radiate heat efficiently. The heat dissipation fin 23 is formed to extend in the longitudinal direction toward the lower side with respect to the upper surface 21, is configured to be as wide as possible the contact area with air.

On the surface facing the LED device 10 of the upper surface 21 may be formed a heat conducting connecting portion 24 so that the heat of the LED device 10 can be thermally conducted toward the heat dissipation housing 20.

The heat conduction connecting portion 24 is preferably formed at a position corresponding to the center of the LED element 10, which is the heat generated in the LED element 10 is generated the most in the center portion of the LED element 10 Because. The thermally conductive connector 24 may remain unconnected with the LED element 10, but in order to double the effect of thermal conductivity, the LED element 10 is connected / adhered to the LED element 10 using solder or a thermally conductive adhesive. It is desirable to.

The thermally conductive connector 24 may function as the thermally conductive connector 24 only by the heat dissipation housing itself formed of a synthetic resin having both thermal conductivity and electrical insulation. However, according to a preferred embodiment of the present invention, as shown, the heat conductive connection portion 24 of the conductive light source mounting portion 30 provided in a ring shape by forming a synthetic resin having both thermal conductivity and electrical conductivity The ring 31 may be disposed in a ring shape between the wires 31 and 32 to be formed of the same material as the conductive light source mounting unit 30 through double injection. According to such a configuration, the LED is separated to be electrically insulated from the conductive light source mounting unit 30, and the heat conducting connection unit 24 is plated with a metallic material together with the conductive light source mounting unit 30. Connection / adhesion with element 10 is also possible.

The LED device 10 and the conductive light source mounting portion 30 may be configured in various ways, but the present invention may be configured without any additional conductive connecting member such as soldering, ultrasonic welding unit or thermal welding unit 100 ( 1 and 5) can be electrically connected.

That is, as illustrated in FIG. 5, when terminals 11a and 11b connected to different polarities are provided at both ends of the LED element 10, a plurality of through holes are formed in each terminal, The plurality of protrusions may be formed on the wirings 31 and 32 provided on the upper surface 21 so as to be penetrated, and the heat fusion unit 100 may be configured by hot pressing the protrusions.

The lower side of the heat dissipation housing 20 is provided with an opening for inserting / coupling the PCB module 40 and plug unit 50 to be described later. The shape of the opening can be changed depending on the structure of the plug unit 50.

The conductive light source mounting unit 30 is formed by double injection molding in a wire shape on the upper surface of the heat dissipation housing 20 by using a synthetic resin having both thermal conductivity and electrical conductivity, where the LED element 10 is mounted. do.

The conductive light source mounting portion 30 is provided to have a substantially ring shape, as shown in FIGS. 1 and 3. That is, the wiring patterns 31 and 32 respectively connected to the + and − poles of the LED element 10 are injection molded to have ring shapes having different diameters.

According to another embodiment of the present invention, the conductive light source mounting portion 30, as shown in Figs. 5 and 6, coupled with the terminals (11a) (11b) formed on both ends of the LED element (10). It is also possible to form a structure of a complementary shape, which is connected by ultrasonic fusion here.

In addition, the conductive light source mounting portion 30 may form a groove having a predetermined depth in the upper surface 21 of the heat dissipation housing 20, and may be double injection molded to fit the groove, or the upper surface ( It is also possible to carry out double injection molding so as to be stacked at a certain height. In the case of the present invention, since both the material of the heat dissipation housing 20 and the material of the conductive light source mounting portion 30 are made of a synthetic resin having both thermal conductivity and electrical insulation, the thermal conductivity at the contact surface is not reduced, so it may be any way. .

On the other hand, in order to lower the resistance value of the conductive light source mounting portion 30, the surface may be plated with a metal material. That is, since the conductive light source mounting portion 30 is a material through which electricity passes, and the heat dissipation housing 20 is made of an insulating material, it is possible to perform electroplating while applying electricity to the conductive light source mounting portion 30. . Alternatively, the conductive light source mounting portion 30 may be plated using a chemical plating method. As such, when the conductive light source mounting portion 30 is plated with a metal material, the electrical conduction with the LED element 10 mounted on the conductive light source mounting portion 30 may be further improved.

On the other hand, when performing a plating operation on the conductive light source mounting portion 30, to facilitate the power connection between the conductive light source mounting portion 30 and the PCB module 40, as shown in FIG. The through slit 25 may be formed at the end of each of the wiring patterns 31 and 32 on the top surface of the heat dissipation housing 20. When the through slit 25 is formed in this manner, the plating liquid may flow to the inner side surface of the heat dissipation housing 20, and the PCB module 40 and the conductive light source mounting portion 30 may be inside the heat dissipation housing 20. Can be electrically connected.

According to this configuration, since the circuit can be connected to the inside of the heat dissipation housing 20, since the connection is possible to conduct electricity through soldering on the inner side of the conductive light source mounting portion 30 instead of the upper surface of the LED element 10 Design freedom for mounting and electrical connection with the PCB module 40 can be increased. In addition, when the inner portion of the heat dissipation housing 20 of the conductive light source mounting portion 30 is provided in the shape of a connector, the connection part is formed in the shape of engaging the PCB module 40 with the connector, and the PCB module 40 and It is also possible to connect the electrically conductive light source mounting part 30 so that electricity can be supplied without soldering.

The PCB module 40 includes a power supply unit provided with SMPS, and converts AC power into DC power to supply DC power to the LED device 10, or converts DC power into current optimized for the LED device 10. Supply. Since an embodiment of the present invention uses a halogen replacement LED bulb called MR16 as an example, the PCB module 40 receives DC power from an external source, converts DC / DC, and controls power for optimal LED light emission. Do it. However, when used in a general bulb lighting device, it may be provided with a configuration for AC / DC conversion and power control, and when using the LED device 10 that can receive an AC input directly, the entire PCB module 40 may be It is also possible to delete.

The plug unit 50 is to be fitted in the opening formed in the lower side of the heat dissipation housing 20, it is preferable to provide a fastening unit to enable snap fit coupling, but is not limited to this, screw coupling method or It can be combined by various methods such as adhesion. The plug unit 50 is provided with at least two through-holes through which the plug pin 51 can pass, and is preferably formed of an insulating material.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

10; LED device 20; Heat dissipation housing
21; Upper surface 23; Heat sink fin
24; Thermally conductive connections 25; Through slit
30; An electrically conductive light source mounting portion 40; PCB Module
50; Plug unit 51; Plug pins
100; Thermal weld

Claims (5)

At least one LED device;
A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the LED element to the outside;
An electrically conductive light source mounting unit in which a double injection molding is formed on the upper surface of the heat dissipation housing in a wire shape by using a synthetic resin having both thermal conductivity and electrical conductivity, and the LED element is mounted on an upper side thereof; And
One end is exposed to the outside of the heat dissipation housing, and the other end thereof is a plug unit for supplying power to the LED module side;
The LED device and the conductive light source mounting unit LED lighting apparatus, characterized in that connected by any one method of ultrasonic welding and thermal welding.
The method of claim 1,
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 1 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The conductive light source mounting unit, the LED lighting apparatus, characterized in that the thermal conductivity is formed of a synthetic resin material of 1W / mK or more and the electrical resistivity of 100 Ω · cm or less.
The heat dissipation housing of claim 2, wherein
And a thermally conductive connection portion formed using a synthetic resin having both thermal conductivity and electrical conductivity at a position corresponding to the center of the LED element, and insulated from wiring of the conductive light source mounting portion.
The method of claim 3, wherein
LED lighting apparatus characterized in that the plated with a conductive material in at least one position of the conductive light source mounting portion, expansion wiring portion and the heat conductive connection portion.
A plurality of LED elements having the same specification;
A heat dissipation housing which is injection-molded with a synthetic resin having both thermal conductivity and electrical insulation to form a body of the lighting apparatus;
Using a synthetic resin having both thermal conductivity and electrical conductivity, a wiring pattern in which + and-poles are respectively connected to the upper surface of the heat dissipation housing is double injection molded, and the surface is plated with an electrically conductive metal material. A conductive light source mounting part mounted on the pattern such that the plurality of LED elements are spaced at equal intervals; And
One end is exposed to the outside of the heat dissipation housing, the other end is connected to the PCB module, the plug unit for supplying power to the PCB side;
The LED device and the conductive light source mounting unit LED lighting apparatus, characterized in that connected by any one method of ultrasonic welding and thermal welding.

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