KR20130009262A - Tray for loading substrate - Google Patents

Abstract

PURPOSE: The tray for mounting a substrate is provided to improve productivity by processing many substrates at one time in a high temperature process. CONSTITUTION: A body(11) has a planar structure. The body is made of a carbon-carbon composite material. The carbon-carbon composite material includes a carbon fiber strengthening composite material. A guide portion(13) guides a substrate. The guide portion has a protrusion pin for supporting the rear side of the substrate.

Description

Tray for loading substrate {Tray for loading substrate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tray for loading a substrate, and more particularly, to a tray for loading a substrate in a batch type when a thin film is formed on a substrate for a solar cell.

In general, a process of forming a thin film such as an antireflection film on a substrate for a solar cell using a plasma applied chemical vapor deposition (PECVD) apparatus includes a plurality of substrates to improve productivity. Therefore, in the process of forming the aforementioned thin film, a tray for loading a plurality of substrates is used. An example of a tray is disclosed in Korean Patent Application No. 2006-51421.

In the thin film forming process using the tray, a heat source is disposed near the tray, for example, a heater is provided at the lower portion of the tray to heat the substrate loaded in the tray and react the gas at a temperature of about 300 to 700 ° C. Let's do it. Therefore, the mentioned tray should be made of material that is stable in physical properties even at high temperatures. Accordingly, the tray is mainly manufactured from graphite material. However, when the mentioned tray of graphite material is manufactured in a large area of up to 1,500 × 00 mm based on a thickness of about 5 to 18 mm and used in the thin film forming process, it is weak due to mechanical properties such as low flexural strength. The situation where the bend occurs frequently. As such, when the central portion of the tray is bent, heat transfer from the heat source in the vicinity of the tray is not uniform, so that a thin film cannot be easily formed on the substrate. The flow of the stacked substrate occurs, and as a result, even a situation in which the substrate loaded in the tray is broken may occur.

Therefore, it is difficult to form a thin film on many substrates at one time because the tray of the conventional graphite material is difficult to utilize a large area, and as a result, the productivity is hindered.

In addition, in the thin film forming process using the tray mentioned above, a situation in which the tray itself is corroded and etched due to a high temperature environment, a highly corrosive process gas, and a plasma occurs, and as a result, the density of the tray decreases and the hardness of the tray decreases. Frequent breakage of the tray occurs. That is, the hardness of the tray is lowered, and thus, under severe process conditions, the tray may be broken because the mechanical properties of the tray cannot be maintained.

The present invention is to provide a substrate loading tray that can be implemented in a large area while having physically stable properties even in a high temperature process when forming a thin film on a solar cell substrate.

A substrate loading tray according to an embodiment of the present invention for achieving the above object has a flat plate structure having one surface on which a substrate is loaded, and a body made of a carbon-carbon composite material, and the substrate is loaded at a predetermined position. The body is provided with a guide for guiding the substrate.

In the tray for loading a substrate according to the above-mentioned embodiment, the carbon-carbon composite material may include a carbon fiber reinforced composite material.

In the tray for loading a substrate according to the above-mentioned embodiment, the body may be a laminate of at least two woven fabrics obtained by weaving the carbon fiber reinforced composite material.

In the tray for loading a substrate according to the above-mentioned embodiment, the body is at least two orthotropic laminated anisotropic laminate reinforcement, at least two woven fabric woven plain weave woven in at least two woven fabrics in one direction the carbon fiber reinforced composite material It can be either a long-laid plain weave reinforcement, a twill weave fabric with at least two layers of twill weave, or a vertical weaving reinforcement with at least two layers of weaving fabrics.

In the tray for loading a substrate according to an embodiment mentioned above, the body may be provided as a non-woven laminate reinforcement laminated at least two pieces of a woven material obtained in the form of a nonwoven fabric of the carbon fiber reinforced composite material. That is, the body may be provided as a nonwoven fabric laminate reinforcement in which at least two nonwoven fabrics obtained by arranging carbon fibers in an orderly manner are laminated.

In the substrate loading tray according to the above-mentioned embodiment, the body may be placed with at least two substrates, and when the at least two substrates are placed on the body, the guide part may guide each of the substrates separately from each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the guide portion has an intaglio or embossed pocket in the body to receive each of the substrates separately from each other, or to be positioned outside of each of the substrates. It may include a pin that stands on the body, or a through-type pocket of the hole structure and a protrusion-pin that protrudes from the side of the through-type pocket so as to expose the back surface of the substrate to support the back surface of the substrate.

In the tray for loading a substrate according to the aforementioned embodiment, each of the pins and the protruding pins may be provided as a ceramic, graphite, carbon-carbon composite material, metal, anodizing member, or ceramic coating layer treatment member.

In the tray for loading a substrate according to the above-mentioned embodiment, the air-hole for penetrating the air through the body through the body so that the air naturally enters the back surface of the substrate when the substrate is loaded in a predetermined position and The apparatus may further include an air circulation unit having an air-pass formed to have a groove structure while being connected to the air-hole.

In the tray for loading a substrate according to the above-mentioned embodiment, the air-pass is a substrate loading tray, characterized in that to form an inclined portion connecting the inlet surface and the side surface of the groove structure.

In the tray for loading a substrate according to the aforementioned embodiment, the body and the guide portion may further include a ceramic coating layer.

In the substrate loading tray according to the above-mentioned embodiment, the body may be formed of an expansion structure connecting at least two bodies to each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the expansion structure is provided with one body in a 'b' structure and the other body in a 'b' shape so that the upper and lower surfaces are the same height. By connecting them to overlap each other in position.

In the tray for loading a substrate according to the embodiment mentioned above, the expansion structure may form a ceramic coating layer on the bonding surface connected in the lower surface direction from the upper surface and the upper surface of the body of the expansion structure.

In the tray for loading a substrate according to the above-mentioned embodiment, a portion connected to the upper surface from the lower surfaces of the bodies of the expansion structure may be freely formed.

In the substrate loading tray according to the above-mentioned embodiment, the ceramic coating layer may not be formed on the joint surface where the bodies of the expansion structure overlap each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the expansion structure is provided with an insertion portion in any one body facing each other and a protrusion in the other body facing each other so that the upper and lower surfaces are located at the same height. It can be made by connecting the insertion portion and the projection to be fitted to each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the expansion structure is provided with one body in the 'c' structure and the other body in the 'ㅓ' structure to the same top and bottom surface. It can be made by connecting to fit to each other to be located in.

In the tray for loading a substrate according to the embodiment mentioned above, the expansion structure may form a ceramic coating layer on the bonding surface connected in the lower surface direction from the upper surface and the upper surface of the body of the expansion structure.

In the tray for loading a substrate according to the above-described embodiment, the expansion structures may be inserted into each other so that parts facing each other may be freely formed.

In the substrate loading tray according to the above-mentioned embodiment, the ceramic coating layer may not be formed on the bonding surface connected from the lower surface of the body of the expansion structure in the upward direction.

In the tray for loading a substrate according to the above-mentioned embodiment, the expansion structure is provided with one body in a 'b' structure and the other body in a 'b' shape so that the upper and lower surfaces are the same height. It can be screwed together as well as connected to overlap each other in position.

In the tray for loading a substrate according to the embodiment mentioned above, the expansion structure is formed on the upper surface of the body of the expansion structure, the bonding surface connected from the upper surface to the lower surface direction and the exposed surface where the screw is exposed on the upper surface can do.

In the tray for loading a substrate according to the above-mentioned embodiment, a portion connected to the upper surface from the lower surfaces of the bodies of the expansion structure may be freely formed.

In the substrate loading tray according to the above-mentioned embodiment, the ceramic coating layer may not be formed on the joint surface where the bodies of the expansion structure overlap each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the expansion structure may further include a connection-fixing part for fixing the bodies that are connected to each other.

In the tray for loading a substrate according to the above-mentioned embodiment, the connection-fixing portion is formed by stepping from the outer surface to the inner surface of each of the bodies facing each other to be connected to each other and is provided by connecting the bodies together. And a fitting portion coupled to the stepped portion by interference fit.

In the tray for loading the substrate according to the above-mentioned embodiment, the connection-fixing part is formed in a structure that cuts off a part of each side of the bodies facing each other to be connected to each other and the groove portion provided by connecting the bodies with each other; It may include a fitting portion to be fitted to the groove portion, and a fastening portion which is screwed from the lower portion of each of the body to the fitting portion.

In the tray for loading a substrate according to the above-mentioned embodiment, the connection-fixing portion is formed by cutting down a portion of each side of each of the bodies facing each other to be connected to each other and is provided by connecting the bodies to each other. The upper portion and the lower-fitting portion fitted to the groove portion and the lower-groove portion, and the upper and the lower groove portion, respectively, and the fastening portion which is screwed from the lower-fitting portion to the upper-fitting portion It can be provided.

According to the present invention mentioned there is provided a tray made of a carbon-carbon composite material. In particular, the carbon fiber-reinforced composite material of the carbon-carbon composite material is provided with a tray obtained in the form of a woven or non-woven fabric obtained by weaving. As described above, since the mentioned tray is provided as a carbon-carbon composite material, it can be easily provided in a large area by stably maintaining physical properties such as flexural strength in a high temperature process.

Therefore, if the tray of the present invention is applied to a process of forming a thin film such as an anti-reflection film on a solar cell substrate using a plasma applied chemical vapor deposition apparatus, it is possible to process many substrates at once while being stable even at a high temperature process. Not only the improvement but also the reliability can be secured.

In addition, in the case of a tray made of a carbon-carbon composite material, as described above, since it is physically stable, the tray itself is corroded and etched by being less affected by process gas and plasma in the thin film forming process using the tray. It can be minimized. Thus, by continuously maintaining the density of the tray and the hardness of the tray, it is possible to prevent a situation of damage during handling of the tray.

In addition, since the carbon-carbon composite material of the tray has good workability, not only the tray can be manufactured in various structures, but also members such as guides can be easily deformed and applied to change the design of the tray more actively. Can cope

1 is a schematic block diagram showing a substrate loading tray according to an embodiment of the present invention.
FIG. 2 is a schematic view illustrating a body provided as a nonwoven laminate reinforcement in the tray of FIG. 1.
FIG. 3 is a schematic view illustrating a body provided with an orthotropic lamination reinforcement in which the weaves woven in one direction in the tray of FIG. 1 are anisotropically stacked.
4 is a schematic diagram illustrating an example of a guide unit in the tray of FIG. 1.
5 is a cross-sectional view taken along line AA ′ of FIG. 4.
6 is a schematic view illustrating another example of a guide part in the tray of FIG. 1.
FIG. 7 is a cross-sectional view taken along line BB ′ of FIG. 6.
FIG. 8 is a schematic view illustrating still another example of a guide unit in the tray of FIG. 1.
9 is a cross-sectional view taken along line CC ′ of FIG. 8.
FIG. 10 is a schematic view illustrating an air circulation unit provided in the tray of FIG. 1.
11 and 12 are schematic diagrams for describing a method of transferring a substrate loaded in a tray using the air circulation unit of FIG. 10.
13 to 15 are cross-sectional views taken along line DD ′ of FIG. 10, and illustrate air-passes of the air circulation unit.
FIG. 16 is a view illustrating an extension structure in which the bodies of the tray of FIG. 1 are connected to each other.
17 to 19 are diagrams illustrating examples of connecting the extension structure of FIG. 16.
20 to 22 are views for explaining the connection-fixing provided in the expansion structure of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

1 is a schematic block diagram showing a substrate loading tray according to an embodiment of the present invention.

Referring to FIG. 1, the tray 100 may load a plurality of substrates when a thin film such as an antireflection film is formed on a substrate for a solar cell using a plasma applied chemical vapor deposition apparatus (PECVD). And a guide portion 13.

Specifically, the body 11 has one surface on which the substrate is placed. Thus, the body 11 has an upper surface, which is one surface on which the substrate is placed, and a lower surface that is opposite to the upper surface, which is one surface on which the substrate is placed, and has a flat plate structure. In particular, the upper surface of the body 11 is a portion for loading a plurality of substrates as a portion on which the substrate is loaded, and the lower surface of the body 11 is a portion facing the substrate processing apparatus in which a process for forming a thin film is mainly performed. Here, the lower surface of the body 11 can be understood as a part facing the heat source mainly provided in the lower portion of the substrate processing apparatus. And the heat source facing the lower surface of the body 11 is mainly placed in the tray 100 when forming the thin film referred to as a heating plate (heating lamp), heating lamp (heating lamp) and the like, and also loaded on the tray 100 To heat the substrate. Here, the heat source is generally located to face the lower surface of the body 11, in some cases it may be located in the vicinity other than the lower surface of the body (11). That is, it can be understood that the heat source can be located near the body 11.

In particular, since the process for forming the aforementioned thin film is performed at a high temperature of about 300 to 700 ° C., the body 11 should be provided as a material capable of maintaining stable physical properties even at high temperatures. In addition, since the productivity is an important factor in the formation of the aforementioned thin film, a large amount of substrates must be processed in a single process, and thus the body 11 should be provided as a material capable of realizing a large area. That is, the body 11 of the tray 100 is to be provided with a material capable of realizing a large physical area, in particular an ultra-large area, while maintaining stable physical properties even at high temperatures.

Therefore, in the present invention, the body 11 is provided with a carbon-carbon composite material. In particular, the carbon-carbon composite material may include a carbon fiber reinforced composite material, that is, carbon fiber. And the mentioned woven fabric is not provided with a single sheet as the body 11, but is provided with the body 11 what laminated | stacked and reinforced at least 2 sheets.

Specifically, the body 11 may be provided with a plain weave woven fabric referred to as a woven fabric woven into a single sheet and provided with a plain woven laminate reinforcement in which at least two single sheets are laminated, or a twill woven fabric. A woven weave referred to as a woven fabric may be provided in a single sheet and provided as a twill laminate reinforcement laminated at least two sheets, or a woven weave mentioned as a woven weave in a single weave may be provided in a single sheet. It can also be provided with the vertical lamination reinforcement laminated | stacked at least 2 sheets.

And it will be described with respect to the tray 100 having a woven body 11 to obtain a nonwoven fabric of the carbon fiber reinforced composite material mentioned as follows.

FIG. 2 is a schematic view illustrating a body provided as a nonwoven laminate reinforcement in the tray of FIG. 1.

Referring to Figure 2, a carbon fiber reinforced composite material, that is, a body (11a) provided with a non-woven laminate reinforcement laminated at least two sheets of a woven material obtained in the form of a non-woven fabric of carbon fibers in a single sheet, the body referred to ( 11a) is not to form carbon fibers by weaving, but to laminate at least two pieces of a single sheet of a woven fabric formed by binding the carbon fibers to a fiber aggregate and forming a fabric. In the following description, the four nonwoven fabrics 210a, 210b, 210c, and 210d are laminated to obtain a body 11a. However, when the non-woven fabrics are laminated to form the body 11a, at least two nonwoven fabrics are formed. It is not limited to the number.

Thus, in FIG. 2, the body 11a obtained by stacking four nonwoven fabrics 210a, 210b, 210c, and 210d, and each of the mentioned nonwoven fabrics 210a, 210b, 210c, and 210d is disordered with carbon fibers. Form by arranging. That is, the body 11a in FIG. 2 can be obtained by arranging each of the four nonwoven fabrics 210a, 210b, 210c, and 210d formed by arranging carbon fibers randomly. Here, each of the nonwoven fabrics 210a, 210b, 210c, and 210d may be quasi-isotropic in all other directions, not just the X direction, the Y direction, and the Z direction, because the nonwoven fabrics 210a, 210b, 210c, and 210d are already arranged in a disordered manner. . That is, as mentioned above, even when the at least two nonwoven fabrics are laminated to form a quasi-isotropic body 11a, physical properties such as flexural strength, shore hardness, coefficient of thermal expansion, etc. are similar in the X and Y directions and in all other directions. Therefore, when the at least two nonwoven fabrics are uniformly laminated regardless of the direction in which the lamination is made, it is possible to obtain the body 11a provided with the nonwoven fabric laminate reinforcement.

In addition, the body 11 may be provided as a reinforcement of the woven fabrics described with reference to FIG. 3 below.

FIG. 3 is a schematic view illustrating a body provided with an orthotropic lamination reinforcement in which the weaves woven in one direction in the tray of FIG. 1 are anisotropically stacked.

Referring to FIG. 3, a body 11b obtained by laminating the weaves 21a, 21b, 23a, 23b and the weaves 21a, 21b, 23a, 23b that may be provided as the body 11b is shown. As such, the woven fabrics 21a, 21b, 23a, 23b mentioned are those woven in one direction. However, the woven fabrics 21a, 21b, 23a, and 23b woven in one direction may be provided as the body 11b by laminating in different directions, that is, anisotropically. As an example, the first weave 21a is laminated so as to be arranged in the Y direction, the second weave 23a under the first weave 21a is laminated so as to be arranged in the X direction, and the second weave 23a is below. The body 11b includes an orthogonal anisotropic lamination reinforcement in which the third weave 21b is laminated so as to be arranged in the Y direction and the fourth weave 23b beneath the third weave 21b is arranged to be arranged in the X direction. It could be. As another example, although not shown, the multi-layered laminate reinforcement laminated the first woven fabric to be arranged in the X direction, the second woven fabric to be arranged in the Y direction, and the third woven fabric to be arranged to be arranged in a different direction from the X and Y. Water may also be provided as a body (11b).

If the body 11b is laminated in one direction, which is the same direction, without being laminated with orthogonal anisotropy, the deformation of the tray body 11b is increased more than that of orthogonal anisotropy because the force is applied only in one direction, that is, in one direction. In this case, as the tray 100 body 11b has a low bending strength, the tray 100 body 11b may be frequently bent and broken, and a large area may be easily implemented. Not. Therefore, the substrate stacking tray 100 according to the present invention is provided with a body 11b having an orthogonal anisotropic lamination reinforcement rather than one direction of isotropy as mentioned.

Accordingly, when the tray 100 body 11b is provided as an orthogonal anisotropic laminate reinforcement, physical properties may be obtained by the arrangement and lamination according to the X direction and the Y direction, or the X direction, the Y direction, and other directions different from X and Y. In addition, since they can have the same characteristics as each other, it can have a good bending strength, thermal expansion coefficient and the like. In addition, in addition to orthotropic laminate reinforcement, in the case of plain weave reinforcement, twill weave reinforcement, or vertical weave reinforcement, it is possible to have good bending strength, coefficient of thermal expansion, and the like by arranging and laminating in anisotropy.

As such, the tray 100 of the present invention is provided with a body 11 by using a woven or nonwoven fabric obtained by weaving a carbon-carbon composite material as a single sheet and laminating at least two sheets. As a result, it may be possible to maintain a large physical property while maintaining stable physical properties even at high temperatures.

As an example, the tray 100 having the body 11 of the carbon-carbon composite material may be provided to have a large area of about 2,000 × 1,000 mm based on a thickness of about 3 to 15 mm, preferably about It may be provided to have a large area of about 2,000 × 1,000mm based on the thickness of 5 to 8mm. As mentioned, the tray 100 body 11 of the carbon-carbon composite material may be provided to have a large area of about 2,000 × 1,000 mm even though the thickness of the tray 100 is about 3 to 15 mm, preferably about 5 to 8 mm. It will be described later, but because the bending strength characteristics are about 2 to 4 times higher than that of a conventional tray of graphite material.

Therefore, in the case of the substrate stacking tray 100 of the present invention, it is possible to implement a wider area while having a thinner thickness than the conventional tray of graphite material. Thus, although the tray 100 mentioned above is implemented in a large area, the weight of the tray 100 can be sufficiently lowered, thereby allowing easier handling of the tray 100.

In the process using the tray 100, since the substrates are stacked in plural sheets, when the plural substrates are stacked in the body 11, the substrates should be stacked at a predetermined position while being separated from each other. Thus, by providing the aforementioned guide portion 13 in the body 11, the substrate can be guided so that the substrate is loaded at a predetermined position when the substrate is loaded on the body 11. That is, at least two substrates are loaded on the upper surface of the body 11, and when the at least two substrates are loaded on the upper surface of the body 11, the guide part 13 guides the at least two substrates separately from each other. .

4 is a schematic view illustrating an example of a guide unit in the tray of FIG. 1, and FIG. 5 is a cross-sectional view taken along line AA ′ of FIG. 4.

4 and 5, as an example of the guide part 13 provided in the body 11, the aforementioned guide part 13 is mainly each of the substrates 200 loaded on the upper surface of the body 11. It may be provided with a pocket (31) engraved on the upper surface of the body 11 so as to be stored separately from each other. As such, when the guide part 13 is provided as the pocket 31, each of the substrates 200 is stacked in the pocket 31 when the thin film is formed. Here, in the case of the guide part 13 mentioned above, only the pocket 31 which was engraved was demonstrated, but it can also be provided also as an embossed pocket instead of intaglio processing. That is, while the indented pocket 31 has a structure that is dug downward from the upper surface of the body 11, in the case of not shown but embossed pocket, the portion on which the substrate is placed protrudes from the upper surface of the body It can be understood that it is a pocket having a structure that becomes.

6 is a schematic view illustrating another example of a guide part in the tray of FIG. 1, and FIG. 7 is a cross-sectional view taken along line BB ′ of FIG. 6.

Referring to FIGS. 6 and 7, as another example of the guide part 13 provided in the body 11, the guide part 13 mentioned above may each of the substrates 200 mounted on the upper surface of the body 11. It may be provided with a pin (51) standing on the upper surface of the body 11 to be received separately from each other. In other words, the pin 51 has a structure that is erected on the outer periphery of each of the substrates 200 loaded on the upper surface of the body 11. In other words, the pin 51 is erected so as to surround each of the substrates 200 loaded on the upper surface of the body 11. As such, when the guide part 13 is provided as the pin 51, each of the substrates 200 has a configuration in which the fin 51 is enclosed when the process for forming a thin film is performed. In addition, the pin 51 may be provided as a ceramic, a metal, graphite, a carbon-carbon composite material, an anodizing member, or a ceramic coating layer treatment member. In particular, in the case of the fin 51 mentioned above, it may be more appropriate to provide a ceramic or ceramic coating layer treatment member because it may also act as a factor that may cause arcing when performing a process for forming a thin film. .

FIG. 8 is a schematic view illustrating still another example of a guide unit in the tray of FIG. 1, and FIG. 9 is a cross-sectional view taken along line C-C ′ of FIG. 8.

8 and 9, as another example of the guide part 13 provided in the body 11, the guide part 13 mentioned may include a through-hole pocket 61 and a through-hole pocket 61 having a hole structure. ) Is provided with a protruding-pin 63 protruding from the side surface of the through-type pocket 61 to support the back surface of the substrate 200 to be received. Support to be exposed. Accordingly, in the case of the guide part 13 including the through-hole pocket 61 and the protruding pin 63, the back surface of each of the substrates 200 is completely exposed, so that the back surface of each of the substrates 200 is completely exposed. There is an advantage in that a thin film can be formed more easily. That is, the substrate 200 mounted on the body 11 having the guide portion 13 including the through pocket 61 and the protrusion-pin 63 is exposed to the rear surface of the substrate 200 because the rear surface thereof is exposed. By providing the plasma source smoothly, a thin film may be formed on the back surface of the substrate 200. Similarly, in the case of the protruding-pin 63, a ceramic, metal, graphite, carbon-carbon composite material, an anodizing member, or a ceramic coating layer treatment member may be provided, and when performing a process for forming a thin film, a smooth thin film formation, That is, since it is advantageous to provide a conductive material so that a smooth deposition can be made, it may be more appropriate to provide a metal.

FIG. 10 is a schematic view for explaining an air circulation unit provided in the tray of FIG. 1, and FIGS. 11 and 12 are schematic views for explaining a method for transferring a substrate loaded in the tray using the air circulation unit of FIG. 10. The drawings.

First, referring to FIG. 10, the air circulation unit 91 circulates air to the rear surface of the substrate 200 when the substrates 200 are transferred from the upper surface of the body 11 of the tray 100. Here, the back surface of each of the substrates 200 and the upper surface of the tray 100 body 11 when each of the substrates 200 are transported, especially unloaded, from the top surface of the tray 100 body 11. Air resistance occurs, and as a result, smooth unloading of each of the substrates 200 is not achieved. That is, when the substrates 200 are unloaded from the tray 100 body 11, each of the substrates 200 may be formed by the tray 100 due to an air resistance generated on the back surface of each of the substrates 200. The situation does not fall off. Thus, when the air circulation unit 91 is provided to unload each of the substrates 200 from the upper surface of the body 100 of the tray 100, the air resistance is circulated from the substrate 200 to reduce the air resistance. As a result, each of the substrates 200 may be smoothly unloaded.

Therefore, the air circulation portion 91 mentioned above communicates with air from the bottom of the body 11 to the top of the body 11 so that air naturally enters and exits the back surface of the substrate 200 when the substrate 200 is loaded at a predetermined position. An air path 91b is formed on the upper surface of the hole 91a and the body 11 to have a groove structure while being connected to the air-hole 91a.

In addition, the air circulation part 91 mentioned above is formed in the tray 11 which has the pin 51 of FIG. 6 as the guide part 13, This is an example. That is, the air circulation unit 91 includes the tray 100 including the pin 51 of FIG. 6 as the guide unit 13 as well as the tray 100 including the pocket 31 of FIG. 4 as the guide unit 13. It can be understood that the present invention can be formed in a tray), and in particular, it can be formed in a tray having an embossed pocket 31 in addition to the engraved pocket 31.

11 and 12, when each of the substrates 200 is transported, especially unloaded, from the upper surface of the body 11 of the tray 100, each of the substrates 200 is transferred through the air circulation unit 91. The air is circulated naturally to the back side. Thus, as mentioned above, when the air resistance generated on the back surface of each of the substrates 200 and the upper surface of the tray 100 body 11 decreases, each of the substrates 200 may be smoothly removed from the upper surface of the body body 11 of the tray 100. Unloading is done. That is, each of the substrates 200 may be unloaded more stably by the air that is naturally circulated using the air circulation unit 91 mentioned above.

In addition, the air circulation unit 91 circulates air naturally to the back surface of each of the substrates 200 when loading each of the substrates 200 as well as unloading the respective substrates 200. Due to the air pressure generated on the back surface of each of the 200, it is possible to sufficiently prevent a situation in which each of the substrates 200 on which the loading is slid from the body 11.

As described above, the substrate stacking tray 100 of the present invention has an advantage of handling the substrate 200 more easily and stably by using the air circulation unit 91.

In addition, the upper surface of the body 11 of the tray 100 may be provided with a ceramic coating layer. As described above, the ceramic coating layer may be formed from damage that may be applied to the tray 100 itself by the plasma generated when the thin film is formed, that is, corrosion, etching, and volatilization (density reduction) of the base body 11. This is to protect the tray 100, and to prevent the tray 100 from being damaged when the tray 100 is handled.

Specifically, the ceramic coating layer may include aluminum oxide, yttrium oxide, zirconium oxide, or the like as the oxide ceramic. These may be used independently, or may mix and use two or more. In addition, the ceramic coating layer may be formed by performing an atmospheric plasma spray (APS) coating process. In addition, the ceramic coating layer may be formed by performing a high-speed oxygen-fuel spray (HVOF) process, a vacuum plasma spray (VPS), a kinetic spray coating process, or the like. Thus, the ceramic coating layer mentioned above may be formed by spraying the spray coating powder made of aluminum oxide, yttrium oxide, zirconium oxide, or the like into the tray 100 body 11 by performing an atmospheric plasma spray coating process or the like.

In addition to the oxide ceramics mentioned, the ceramic coating layer may also include non-oxide ceramics such as aluminum nitride, silicon carbide and the like. Here, when the ceramic coating layer includes a non-oxide ceramic, it may be mainly formed by performing a kinetic spray coating process, an aerosol deposition process, or the like.

In this case, when the ceramic coating layer is formed to have a thickness of less than about 100 μm, the ceramic coating layer is not sufficiently formed at a portion thereof, so that the body 11 is exposed or pin-holes are generated on the surface of the ceramic coating layer. In addition, it is not preferable because a situation in which the ceramic coating layer is damaged by high temperature and plasma may occur. In addition, when the ceramic coating layer is formed to have a thickness exceeding about 400 μm, adhesion between the body 11 and the ceramic coating layer is not good, so that the ceramic coating layer may be peeled off from the body 11. 100) not only the flatness of the upper surface may be reduced, but also a situation in which the central portion of the tray 11 is bent may occur. Therefore, the ceramic coating layer mentioned above is formed to have a thickness of about 100 to 400 μm.

In addition, the ceramic coating layer may be formed on the upper and side surfaces of the body 11, and may also be formed on the lower edge portion of the body 11, which is a part of the body 11 exposed to high temperature and plasma when the thin film is formed. This is because the upper and side and the lower surface of the body 11 is about the edge portion.

As such, in the present invention, the ceramic coating layer mentioned in the tray 100 body 11 is formed. Thus, when the ceramic coating layer forms a thin film, the body 11 itself is prevented from being corroded or etched due to high temperature and plasma. Therefore, since the tray 100 on which the ceramic coating layer is formed may maintain stability in high temperature and plasma atmosphere, the tray 100 may be handled more easily as well as the life-time of the tray 100 may be extended. In addition, by sufficiently preventing the deformation of the flatness of the tray 100, it is possible to continuously maintain the temperature uniformity and heating efficiency during heating of the substrate through the tray 100.

In addition, when the aforementioned ceramic coating layer is formed, pin-holes may occur in a portion of the ceramic coating layer. As such, the pin-holes generated in the ceramic coating layer may act as a cause of arcing due to the concentration of charge and current temporarily in the pin-hole portion in the process of forming a thin film. Thus, in the present invention, when a pin-hole occurs in the ceramic coating layer, a surface treatment layer made of a ceramic bonding material is further formed in the pin-hole region. That is, the pin-hole region is filled with a ceramic bonding material. Here, the ceramic bonding material may be formed of an oxide ceramic mixed with an inorganic material having excellent resistance to water, acid, alkali, oil, solvent, and the like.

The surface treatment layer made of the above-mentioned ceramic bonding material may be obtained by applying the ceramic bonding material to a portion where pin-holes have occurred in the ceramic coating layer and then naturally curing at room temperature for about 24 hours, or from room temperature to about 50 Degreasing or dehydration for about 30 to 90 minutes at a temperature of < RTI ID = 0.0 > C < / RTI > followed by high temperature curing for about 60 to 180 minutes at a temperature of about 100 to 200 ° C, or at a temperature of about 100 to 200 ° C. It can be obtained by performing high temperature curing alone for about 60 to 180 minutes. That is, the surface treatment layer made of a ceramic bonding material can be formed by performing natural curing, continuously performing degreasing or dehydration and high temperature curing, or by performing only high temperature curing alone. Here, in the case of dehydration or degreasing mentioned above, it is not preferable to perform dehydration or degreasing smoothly for less than about 30 minutes. In addition, in the case of high temperature curing is not preferable because the curing is not performed smoothly at a temperature of less than about 100 ℃, when performing at a temperature exceeding about 200 ℃ during the curing of the carbon of the base material It is not preferable because a situation occurs in which the density of the base metal is reduced by changing to carbon dioxide.

As such, the tray 100 according to the present invention can be confirmed that it is possible to maintain more stable physical properties by forming and improving the surface treatment layer not only the ceramic coating layer but also pin-holes, which may occur and affect the process. Can be.

However, as mentioned above, when the ceramic coating layer is formed on the upper surface of the body 11 of the tray 100, when the inlet surface and the side of the air-pass 91b are vertically provided, the stress is applied to the vertically connected portion. Is concentrated, and as a result, a situation in which the ceramic coating layer is peeled off may occur.

13 to 15 are cross-sectional views taken along line D-D 'of FIG. 10, and illustrate air-passes of the air circulation unit.

Accordingly, as shown in FIGS. 13 to 15, the inclined portion 121 is connected to the inlet surface and the side surface of the groove structure of the air-pass 91b so that the stress concentrated on the portion 121 to which the inlet surface and the side surface are connected. As a result, it is possible to sufficiently suppress the situation in which the ceramic coating layer is peeled off at the portion 121 at which the inlet surface and the side surface are connected.

Here, the portion 121 in which the inlet surface and the side surface of the groove structure of the air-pass 91b are connected may first be formed to be inclined in a tapered downward structure as shown in FIG. 13, and as shown in FIG. 14. It may be formed to be inclined (reference numeral 131), or may be formed to be inclined in a rounded structure as shown in Figure 15 (reference numeral 141).

In addition, in the case of the end portion of the air-pass 91b to be rounded, the peeling of the ceramic coating layer mentioned above is minimized.

FIG. 16 is a view illustrating an extension structure in which the bodies of the tray of FIG. 1 are connected to each other.

Referring to FIG. 16, the aforementioned tray 100 may extend by connecting the bodies 11 to each other. That is, the tray 100 may be formed of an expansion structure 1000 that connects at least two bodies 11 to each other.

Thus, the tray 100 in the present invention can be provided to have a larger large area than a single structure when forming the expansion structure 1000 as mentioned. For example, when two trays 100 having a large area of about 2,000 × 1,000mm based on a thickness of about 3 to 15mm are connected to each other, the tray 100 may be extended to have a larger area of 2,000 × 2,000mm.

As such, when the at least two bodies 11 of the tray 100 are connected to each other to form the expansion structure 1000, there is a greater demand for improvement in productivity, which serves as an important factor in the manufacture of a solar cell substrate. Can satisfy.

17 to 19 are diagrams illustrating examples of connecting the extension structure of FIG. 15.

First, referring to FIG. 17, the mentioned expansion structure may include one body 11 having a 'b' shape and the other body 11 having a 'b' shape with a body 11 having an expansion structure. The upper and lower surfaces of the shells may be connected to each other to overlap each other at the same height. And when the expansion structure is made by connecting so as to overlap each other in the 'b' structure and 'b' structure, the ceramic coating layer 161 is attached to the joint surface connected from the upper surface and the upper surface of the body 11 of the expansion structure. And, the portion 163 connected in the upward direction from the lower surface of the body 11 of the expansion structure may be formed freely. Here, the ceramic coating layer 161 is formed to prevent plasma from penetrating into the bonding surface connected in the lower direction from the upper surfaces of the body 11 of the expansion structure to damage the tray 100, the body of the expansion structure The formation of the parts connected in the upward direction from the lower surface to the upper surface is a result of considering the contraction and expansion of the tray 100 in a high temperature process. In addition, in the formation of the above-mentioned extension structure, the bonding surface 165 overlapping each other does not form a ceramic coating layer for grounding between the trays 100.

And, referring to Figure 18, the mentioned expansion structure is provided with any one of the body 11 of the 'c' structure and the other body 11 of the 'ㅓ' structure to provide the body (11) The upper and lower surfaces of the shells may be connected to each other to be fitted at the same height. Here, the ceramic coating layer 161 is formed on the bonding surface connected from the upper surface and the upper surface of the body 11 of the expansion structure when the expansion structure is made by fitting so as to fit into the 'c' structure and 'ㅓ' structure. And the parts 173 facing each other by being inserted into each other may be freely formed. Here, forming the ceramic coating layer 161 to prevent the plasma from penetrating the damage to the tray 100 from the upper surface of the body 11 of the expansion structure to the bonding surface connected in the lower direction as shown in FIG. The formation of the parts 173 facing each other by being inserted into each other is a result of considering the contraction and expansion of the tray 100 in a high temperature process. In addition, in the formation of the aforementioned expanded structure, the ceramic coating layer is not formed on the bonding surface 165 on the bonding surface connected from the lower surface to the upper surface for grounding between the trays 100.

Here, in the case of the expanded structure of FIG. 18, any one body 11 may be provided in a 'c' shape, and the other body 11 may be provided in a 'k' shape. And the lower and the lower limit is to be connected so as to be fitted to each other, in the case of the expansion structure mentioned in the insertion portion in any one of the body 11 facing each other among the body 11 facing each other and It may be understood that the insertion part and the protrusion are connected to each other so that the upper and lower surfaces are provided at the same height by providing protrusions on the other body 11 facing each other. Therefore, the expansion structure in FIG. 18 can be understood as any one of the body 11 provided in the 'c' structure as the body 11 provided with an insertion portion, the other body 11 provided in the 'ㅓ' structure It can be understood that the protrusion 11 is provided with a body 11, so that the upper body and the lower surface of the '11' structure (11) and the '11' body 11 is located at the same height so that the insertion portion and the protrusion It can be provided in an extension structure by connecting so that it may fit.

Therefore, in addition to the expansion structure in FIG. 18, the mentioned expansion structure is provided with any one body 11 in a 'ㅌ' shape and the other body 11 in a 'ㅕ' shape to provide a body of the expansion structure ( 11) They may also be made by connecting the upper and lower surfaces to be fitted to each other at the same height. As such, the mentioned extension structure can be provided in various forms.

In addition, referring to FIG. 19, the mentioned expansion structure includes one body 11 having an 'b' shape and the other body 11 having a 'b' shape with a body 11 of the expansion structure. The upper and lower surfaces of the shells may be overlapped with each other to be positioned at the same height and may be formed by coupling the screws 187. That is, the expansion structure in FIG. 19 can be understood as further adding a screw 187 coupling to the expansion structure in FIG. Here, when the expansion structure is formed by screwing the portions overlapping each other in the 'b' structure and 'b' structure, the joints connected in the direction of the upper and lower surfaces of the body 11 of the expansion structure The ceramic coating layer 181 may be formed on the head of the screw 187, which is an exposed surface exposed to the surface and the upper surface, and the portion 183 connected to the upper surface from the lower surface of the body 11 of the expanded structure may be freely formed. . Here, forming the ceramic coating layer 181 is to prevent the plasma from penetrating the damage to the tray 100 from the upper surface of the body 11 of the expansion structure to the bonding surface connected in the lower direction as shown in FIG. To form a portion of the expansion structure body 11 connected to the upper surface from the lower surface thereof is a result in consideration of the contraction and expansion of the tray 100 in a high temperature process. In addition, in the formation of the aforementioned extension structure, the ceramic coating layer is not formed on the bonding surface 185 overlapping each other for grounding between the trays 100.

Here, in the above-described extension structure of FIGS. 17 to 19, since the thin film formed on the substrate is formed non-uniformly when the current is not energized between the respective trays 100 and the body 11, each of the extension structures is formed. The tray 100 is to form a structure to ground between the bodies (11). Therefore, the ceramic coating layer is not formed on a part of the trays 100 and the body 11 of the expansion structure 1000 for the aforementioned grounding.

As described above, since the tray 100 in the present invention is provided using a carbon-carbon composite material, not only can the physical properties be stably maintained even at a high temperature process in a plasma environment, but also a large number of substrates are loaded. Possible large area implementations are possible.

In the case of the tray 100 mentioned above, impregnation, heat treatment, lamination, molding, crystallization, formation of the guide portion 13 and formation of a ceramic coating layer may be obtained sequentially from a carbon-carbon composite material. have.

Again, referring to FIG. 16, it is necessary to fix the bodies 11 which are connected to each other when the tray 100 is extended. If the body 11 that is connected to each other in the tray 100 of the expansion structure 1000 is not fixed as one, a gap between the bodies 11 that are connected to each other is opened or a phase difference is formed in each of the upper surfaces of the bodies 11. Etc. may occur.

Thus, the present invention further includes a connection-fixing part 300 for fixing the bodies 11 that are connected to each other in the tray 100 of the expansion structure 1000 as one. Therefore, by having the connection-fixing part 300 mentioned above, the bodies 11 may be fixed to be connected as one, thereby strengthening and stabilizing the connection state with respect to the tray 100 of the expansion structure 1000.

20 to 22 are views for explaining the connection-fixing provided in the expansion structure of FIG.

First, referring to FIG. 20, the connection-fixing part 300 is prepared by connecting the bodies 11 to each other by stepping from the outer side to the inner side of each of the bodies 11 facing each other to be connected. The stepped portion 330a and the stepped portion 330a may be provided with a fitting portion 330b coupled to the interference fit. Here, the stepped portion 330a is formed by shaving a portion of the outer surface of each of the bodies 11 and shaping a portion of the inner surface connected to the cut portion to form a groove or a hole having a deeper step. It can be provided by connecting each of the bodies (11) facing each other. Thus, by inserting the fitting portion 330b to the stepped portion 330a mentioned to be fixed to the body 11 to be connected to one to strengthen the connection state to the tray 100 of the expansion structure 1000 and It can stabilize.

And, referring to Figure 21, the connection-fixing part 300 is provided by connecting the bodies 11 to each other by forming a structure to shave a portion of the upper side of each of the body 11 facing each other to be connected to each other A recess 340a, a fitting portion 340b fitted to the recess 340a, and a fastening portion 340c for screwing from the lower portion of each of the bodies 11 to the fitting portion 340b may be provided. have. As such, in FIG. 21, the connection-fixing part 300 formed by screwing may be provided to more stably fix the bodies 11 which are connected to each other.

In addition, referring to Figure 22, the connection-fixing part 300 is formed in a structure to shave a portion of the lower side and lower side of each of the body 11 facing each other to be connected to each other to connect the body 11 The upper-groove 350a and the lower-groove 351a provided by the upper-groove 350a and the lower-groove 350b and the lower-groove 350a and the lower-groove 351a, respectively. 351b and a fastening portion 353 through which the screw is fastened from the bottom-fitting portion 351b to the top-fitting portion 350b. In addition, even in the case of Figure 22 by providing a connection-fixing part 300 made of screw fastening can be more stably fixed to the body (11) that is connected to each other.

And in the connection-fixing part 300 mentioned above, the fitting portion 330b of FIG. 20, the fitting portion 340b of FIG. 21, and the upper-fitting portion 350b of FIG. 22 are connected to each other. Coupling may be made to have the same upper surface as the upper surface, and in some cases it may also be made of a structure that protrudes slightly from the upper surface of the body (11) which is connected to each other. In addition, the lower-fitting portion 351b of FIG. 22 may be coupled to have the same lower surface as the lower surface of the bodies 11 that are connected to each other, and in some cases, the lower portions of the bodies 11 that are connected to each other. It may also be made of a structure protruding from the surface. In addition, the fastening part 340c of FIG. 21 and the fastening part 353 of FIG. 22 may not be protruded from the lower surfaces of the bodies 11 that are connected to each other, or in some cases, may have a structure that protrudes.

In addition, the fitting portion 330b of FIG. 20, the fitting portion 340b of FIG. 21, and the upper-fitting portion 350b and the lower fitting portion 351b of FIG. 22 are all treated with ceramic and ceramic coating to prevent arcing. It can be prepared using a metal, graphite and the like.

As described above, the tray 100 in the present invention is connected to each other by connecting the body 11 facing each other to be connected to each other when the expansion structure 1000 is formed using a connection-fixing body (11) It is possible to minimize the gap between them, or the occurrence of a phase difference on each of the upper surfaces of the body (11). Thus, the tray 100 can be used stably despite the expansion structure 1000.

Hereinafter, the physical properties of the aforementioned tray of the present invention will be described.

Trays having the same area on the basis of a thickness of about 7 mm, trays made of orthotropic lamination reinforcement in the first comparative example, trays made of plain weave lamination reinforcement in the second comparative example, and nonwoven fabric lamination reinforcement in the third comparative example The tray which consists of was prepared. In addition, as a fourth comparative example, a tray made of a conventional graphite material was provided.

 burglar( flexural strength ) Characteristics: unit ( MPa )

Flexural strength characteristics were measured several times in accordance with the test specification of [KS L 1591] for each of the trays of the first to fourth comparative examples mentioned.

As a result of the measurement, as in Table 1, it was measured as about 140 to 160 for the first comparative example, about 150 to 170 for the second comparative example, and about 130 to 150 in the third comparative example. And in the case of the fourth comparative example it was measured to about 40 to 60.

Thus, it can be confirmed that the tray in the present invention has at least three times the flexural strength characteristics of the conventional tray.

Therefore, the substrate stacking tray of the present invention, as mentioned above, has a thinner thickness than the conventional tray of graphite material and can be implemented in a wider area, so that the weight of the tray is sufficient despite the large area. It can also be lowered.

Shore hardness characteristics

Shore hardness characteristics were measured several times in accordance with the test regulations of [KS B 0807] for each of the trays of the first to fourth comparative examples mentioned.

As a result of the measurement, as in Table 1, it measured about 72 to 81 for the first comparative example, about 70 to 82 for the second comparative example, and about 77 to 85 for the third comparative example. And in the case of the fourth comparative example it was measured to about 45 to 60.

Thus, it can be confirmed that the tray in the present invention has better shore hardness characteristics than the conventional tray.

Coefficient of thermal expansion characteristics: unit (× 10-6 / ℃)

The coefficient of thermal expansion was measured several times in accordance with the test regulations of [KS M ISO 12987] at about 1,200 ° C. at temperature conditions for each of the trays of the first to fourth comparative examples mentioned.

As a result of the measurement, as in Table 1, the first comparative example was measured at about 0.5 to 2.0, the second comparative example was measured at about 0.2 to 0.5, and the third comparative example was measured at about 0.1 to 0.3. And in the case of the fourth comparative example it was measured to about 4.8 to 5.5.

As such, it can be confirmed that the tray in the present invention has better thermal expansion coefficient characteristics than the conventional tray. Therefore, it can be seen that the tray of the present invention has better physical properties than the tray of the conventional graphite material.

In the tray of the present invention mentioned above, when forming a thin film on a substrate for a solar cell, it is possible not only to stably maintain physical properties even at a high temperature process in a plasma environment, but also to realize a large area capable of loading a larger number of substrates. Therefore, not only the reliability of the process can be secured but also the productivity can be sufficiently secured. In addition, since the tray mentioned above is easily formed into an extended structure, more improved productivity can be expected.

Accordingly, the tray of the present invention is expected to be more actively utilized in the manufacture of solar cells that require recent productivity as an important factor.

In addition, since the tray of the present invention can handle the solar cell substrate more easily and stably, even the advantage of improving the efficiency in the process can be expected, and the solar cell can be provided in various ways. It is also possible to actively cope with structural changes and design changes that may occur in the manufacturing process.

Although described with reference to the preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated.

Claims (28)

A body made of a carbon-carbon composite material having a flat plate structure having one surface on which a substrate is loaded; And
And a guide part for guiding the substrate on the body such that the substrate is loaded at a predetermined position. The tray for loading a substrate according to claim 1, wherein the carbon-carbon composite material comprises a carbon fiber reinforced composite material. 3. The substrate loading tray according to claim 2, wherein the body is formed by laminating at least two woven materials obtained by weaving the carbon fiber reinforced composite material. The method of claim 3, wherein the body is an orthotropic laminate reinforcement of at least two anisotropically laminated at least two woven fabrics of the carbon fiber-reinforced composite material, a plain weave laminate reinforcement laminated at least two woven fabrics The twill stack reinforcement which laminated | stacked the at least 2 piece of woven fabric by twill, or the vertical lamination reinforcement which laminated | stacked at least 2 piece of woven fabric to be woven by a weaving fabric, The board | substrate stacking tray characterized by the above-mentioned. The substrate loading tray according to claim 2, wherein the body comprises a nonwoven fabric laminate reinforcement in which at least two woven fabrics of the carbon fiber reinforced composite material are obtained in the form of a nonwoven fabric. The apparatus of claim 1, wherein the guide part includes an intaglio or embossed pocket in the body to receive each of the substrates separately from each other, or a pin that stands on the body so as to be positioned outside each of the substrates. Or a through-hole pocket having a hole structure and a protruding-pin which protrudes from a side surface of the through-hole so as to expose the back surface of the substrate to support the back surface of the substrate. The tray for loading a substrate according to claim 6, wherein each of the pin and the protruding pin is formed of a ceramic, graphite, carbon-carbon composite, metal, anodizing member or ceramic coating layer treatment member. According to claim 1, When the substrate is loaded in a predetermined position is connected to the air-hole and the air-hole through the body to let the air in and out through the body so that the air naturally enters the back surface of the substrate And an air circulation unit having an air-pass formed to have a groove-structure. 10. The substrate loading tray of claim 8, wherein the air-pass is formed to obliquely form a portion where the inlet surface and the side surface of the groove structure are connected to each other. The substrate loading tray of claim 1, further comprising a ceramic coating layer on the body and the guide portion. The substrate loading tray of claim 1, wherein the body has an expansion structure connecting at least two bodies to each other. 12. The method of claim 11, wherein the expansion structure is to provide one body in the 'b' structure and the other body in the 'b' structure to connect the top and bottom so that they overlap each other in the same height position The tray for board | substrate loading characterized by the above-mentioned. The substrate stacking tray of claim 12, wherein the expansion structure forms a ceramic coating layer on a bonding surface connected from the upper surface and the upper surface to the lower surface of the bodies of the expansion structure. The tray for loading a substrate according to claim 12, wherein a portion connected in a direction upward from a lower surface of the bodies of the expanded structure is formed to be spaced apart. 13. The substrate loading tray of claim 12, wherein a ceramic coating layer is not formed on a joint surface in which the bodies of the expansion structure overlap each other. 12. The method of claim 11, wherein the expansion structure is provided with the insertion portion in any one of the body facing each other and the projections in the other body facing each other so that the insertion portion and the projection is mutually located at the same height A tray for loading a substrate, which is made by connecting so as to be fitted. 17. The method of claim 16, wherein the expansion structure is to provide one body in the 'c' structure and the other body in the 'ㅓ' structure to connect so that the upper and lower surfaces are fitted to each other at the same height The tray for board | substrate loading characterized by the above-mentioned. 18. The tray for loading a substrate according to claim 17, wherein the expansion structure forms a ceramic coating layer on bonding surfaces connected from the upper surfaces and upper surfaces of the bodies of the expansion structure to the lower surface. 18. The tray for loading a substrate according to claim 17, wherein the expansion structures are formed to be inserted into each other so that portions facing each other are freely formed. 20. The substrate loading tray of claim 19, wherein a ceramic coating layer is not formed on a bonding surface connected from the lower surfaces of the bodies of the expansion structure in an upward direction. 12. The method of claim 11, wherein the expansion structure is provided so that any one of the body in the 'b' structure and the other body in the 'b' structure so that the upper and lower surfaces are superimposed on one another at the same height. And a board for loading the substrate characterized in that the screw coupling. 22. The method of claim 21, wherein the expansion structure is a substrate loading, characterized in that to form a ceramic coating layer on the upper surface of the body of the expansion structure, the bonding surface is connected from the upper surface to the lower surface direction and the exposed surface of the screw exposed on the upper surface Tray. 22. The substrate loading tray of claim 21, wherein a portion connected in a direction upward from a lower surface of the bodies of the expanded structure is formed to be spaced apart. 22. The substrate loading tray of claim 21, wherein a ceramic coating layer is not formed on a joint surface of the bodies of the extended structure overlapping each other. 12. The substrate loading tray according to claim 11, further comprising a connection-fixing part for fixing the bodies connected to each other in the expansion structure. 26. The method of claim 25, wherein the connection-fixing portion is formed by stepping from the outer surface of each of the bodies facing each other to be connected to the inner side stepped to the stepped portion and the stepped portion provided by connecting the body to each other Tray for loading the substrate, characterized in that it has a fitting portion coupled to. 26. The method of claim 25, wherein the connection-fixing portion is formed in a structure to cut off the upper side portion of each of the body facing each other to be connected to each other and the groove portion provided by connecting the body with each other, the groove portion inserted into the groove portion And a fastening part for screwing from a lower part of each of the bodies to the fitting part. 26. The apparatus of claim 25, wherein the connection-fixing part is formed by cutting down the lower side portion and the lower side portion of each of the bodies facing each other so that the connection-fixing portion is formed by connecting the bodies with each other. -A recess, and an upper-fitting part and a lower-fitting part fitted to each of the upper-recessing part and the lower recessed part, and a fastening part for screwing from the lower-fitting part to the upper-fitting part. A substrate loading tray.

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