CN103155134B - Substrate-placing pallet - Google Patents
Substrate-placing pallet Download PDFInfo
- Publication number
- CN103155134B CN103155134B CN201280003000.6A CN201280003000A CN103155134B CN 103155134 B CN103155134 B CN 103155134B CN 201280003000 A CN201280003000 A CN 201280003000A CN 103155134 B CN103155134 B CN 103155134B
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- China
- Prior art keywords
- substrate
- main body
- ceramic coating
- pallet
- placing
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- 239000000758 substrate Substances 0.000 claims abstract description 220
- 238000000034 method Methods 0.000 claims abstract description 86
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 21
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000033228 biological regulation Effects 0.000 claims abstract description 18
- 238000010276 construction Methods 0.000 claims abstract description 7
- 238000005524 ceramic coating Methods 0.000 claims description 189
- 238000003475 lamination Methods 0.000 claims description 61
- 238000003780 insertion Methods 0.000 claims description 40
- 230000037431 insertion Effects 0.000 claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 37
- 239000007767 bonding agent Substances 0.000 claims description 37
- 239000000919 ceramic Substances 0.000 claims description 36
- 239000011248 coating agent Substances 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 35
- 239000004744 fabric Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 28
- 229910052799 carbon Inorganic materials 0.000 claims description 22
- 229910002804 graphite Inorganic materials 0.000 claims description 20
- 239000010439 graphite Substances 0.000 claims description 20
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 20
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 13
- 238000009941 weaving Methods 0.000 claims description 12
- 229910052573 porcelain Inorganic materials 0.000 claims description 11
- 239000002759 woven fabric Substances 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 10
- 238000007750 plasma spraying Methods 0.000 claims description 10
- 238000001556 precipitation Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 238000009940 knitting Methods 0.000 claims description 3
- 229910004012 SiCx Inorganic materials 0.000 claims 4
- 230000008569 process Effects 0.000 abstract description 71
- 239000010409 thin film Substances 0.000 abstract description 63
- 239000012298 atmosphere Substances 0.000 abstract description 7
- 238000011068 loading method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 33
- 230000015572 biosynthetic process Effects 0.000 description 31
- 239000002585 base Substances 0.000 description 29
- 239000000126 substance Substances 0.000 description 25
- 238000005452 bending Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 20
- 239000004745 nonwoven fabric Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 230000018044 dehydration Effects 0.000 description 9
- 238000006297 dehydration reaction Methods 0.000 description 9
- 239000007921 spray Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229920000049 Carbon (fiber) Polymers 0.000 description 6
- 239000004917 carbon fiber Substances 0.000 description 6
- 238000013036 cure process Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010891 electric arc Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 230000036961 partial effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000002269 spontaneous effect Effects 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000003733 fiber-reinforced composite Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000007749 high velocity oxygen fuel spraying Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- APUGIHICMSAKGR-UHFFFAOYSA-N [Y]=O Chemical compound [Y]=O APUGIHICMSAKGR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007572 expansion measurement Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005334 plasma enhanced chemical vapour deposition Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000011208 reinforced composite material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Pallets (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Substrate-placing pallet, may include that main body, guide portion etc..Described main body can have the slab construction of first that has possessed mounting substrate, and can be made up of carbon carbon composite.Described guide portion, can guide described substrate towards described main body so that described substrate-placing is in the position of each regulation.When forming thin film on solar cell substrate, described substrate-placing pallet may be embodied as, and can also stably maintain physical characteristic, and can be formed as loading the large area of greater number of substrate in the high-temperature process under plasma atmosphere.
Description
Technical field
The present invention relates to substrate-placing pallet.In more detail, the present invention relates in solar-electricity
The substrate-placing pallet of substrate can be loaded with batch-type when forming thin film on the substrate of pond.
Background technology
Generally, plasma enhanced chemical vapor deposition (PECVD) device is utilized to come in solar-electricity
Form the operation of the thin film such as antireflection film etc. on the substrate of pond, can perform to carry to multiple substrates simultaneously
Rise productivity.The operation of described formation thin film can use the pallet that can load multiple substrate.This base
Onboard putting uses pallet, such as, discloses KR published patent the 2007-0117312nd.
In the thin film formation process of described use substrate-placing pallet, at described substrate-placing pallet
Position be formed about thermal source, such as, be provided with heating in the bottom of described substrate-placing pallet
Device heats the substrate being placed in described substrate-placing pallet, and at about 300 DEG C to 700 DEG C
Temperature makes gas carry out reaction and form thin film on the substrate.Therefore, described substrate-placing is used
Pallet needs to use and the material that physical characteristic is low also will not be made in high temperature to manufacture.Conventional substrate
Mounting pallet mainly uses graphite to manufacture.But, the conventional substrate-placing being made up of graphite
With pallet, on the basis of the thickness by about 5mm to about 18mm, there is about 1500mm × 500mm
During the area of degree size, can be because such as bending strength (flexural during described thin film formation process
The deterioration of low mechanical property strength) causes described substrate-placing pallet continually
The situation of central part bending.During as it has been described above, the central part of described substrate-placing pallet bends,
Can be because the heat reception and registration of the thermal source near described substrate-placing pallet cannot be constituted equably, therefore
It is difficult to be formed uniformly thin film on the substrate.Additionally, during transferring described substrate-placing pallet
The vibration caused causes the substrate of mounting on described substrate-placing pallet to flow, its result, very
Extremely can cause the situation that breakage occurs being placed in described substrate-placing pallet.Additionally, in the past
The substrate-placing pallet being made up of graphite because be difficult to have large area, is difficulty with by once
Thin film formation process forms the demand of thin film as far as possible on more substrate, thus there is productivity phase
To relatively low problem.
On the other hand, utilize in the thin film formation process of conventional substrate-placing pallet, can often send out
The raw described substrate-placing pallet caused by hot environment, highly corrosive process gases and plasma is originally
The corrosion of body or the problem of etching, thus, the density of described substrate-placing pallet can reduce and hardness
Can be low, therefore when the process of described substrate-placing pallet, described substrate-placing can occur continually
By the situation that pallet is damaged.That is, because the hardness that described substrate-placing pallet has declines, cause
Under the conditions of conventional thin film formation process, it is impossible to maintain the machinery at described substrate-placing pallet initial stage
Characteristic, therefore can occur the problem that described substrate-placing pallet is damaged.
Summary of the invention
(solving the technical problem that)
It is an object of the invention to, it is provided that substrate-placing pallet, solar cell substrate is formed
The period of thin film, high temperature can also maintain stable physical characteristic and can have big area.
(solving the means of problem)
In order to reach the purpose of the present invention described above, according to the substrate of the exemplary embodiments of the present invention
Mounting pallet can possess main body and guide portion.Described main body, can possess the first of mounting substrate
The slab construction in face, can include carbon-carbon composite or graphite.Described guide portion, can be to described master
Guide described substrate to make described substrate be placed in the position of regulation respectively on body.
In exemplary embodiments, described carbon-carbon composite can include carbon fibre reinforced composite.
Such as, described main body may include that two manufactured by weaving described carbon fibre reinforced composite
Layer is with the fabric of superimposed layer.
In exemplary embodiments, described main body may include that orthogonal isotropy lamination reinforcer, with phase
Different direction lamination is plural to carry out woven with a direction by described carbon fibre reinforced composite
Fabric.According to another exemplary embodiments, described main body may include that plain weave lamination reinforcer, folded
The layer woven fabric of plural plain weave.In yet another illustrative embodiment, described main body can be wrapped
Include: twill lamination reinforcer, the fabric of lamination two or more twill weave.According to another is exemplary again
Embodiment, described main body may include that satin weave lamination reinforcer, and the plural satin weave of lamination is weaved
Fabric.
In another exemplary embodiments, described main body may include that nonwoven fabric laminate reinforcer, lamination
The plural fabric carrying out described carbon fiber-reinforced composite material with non-woven fabrics manufacturing.
In exemplary embodiments, described guide portion, may include that in described main body with intaglio or garland
The bag portion of processing, is used for making described substrate be separated from each other respectively and house.According to another exemplary reality again
Execute example, described guide portion, may include that pin, along described basic neighboring arrangement.Again another
In embodiment, described guide portion, may include that pass-through pocket, expose the bottom surface of described substrate；And it is convex
Go out pin, protrude from the inner face of described pass-through pocket.Such as, described pin and described protrusion pin, point
Do not include: pottery, graphite, carbon-carbon composite, metal, through anodization (anodizing)
Material or ceramic coating process material etc..
In exemplary embodiments, described substrate-placing pallet, it is also possible to including: pore, through institute
State main body, and described substrate-placing in the position of described regulation time, for the bottom surface of described substrate
Air is provided；And air circulation portions, possess and the air flow circuit with groove shape of described pore UNICOM.
Such as, described air flow circuit, the part being connected to entrance with side can be formed obliquely.
In exemplary embodiments, described substrate-placing pallet, it is also possible to including: ceramic coating, shape
First of main body described in Cheng Yu and side and described guide portion.
In exemplary embodiments, described ceramic coating may include that aluminum oxide (AlOx), yttrium oxygen
Compound (YOx), aln precipitation (AlNx), silicon carbide (SiCx) etc..Such as, described pottery
Coating can have about 100 μm thickness to about 400 μm degree, it is possible to use air plasma spraying
(APS) coating procedure is formed.
In exemplary embodiments, described ceramic coating can extend to in first of described main body
The periphery of second of described main body.
In exemplary embodiments, it is also possible in the part with pin hole, described of described ceramic coating
Part that the stress of ceramic coating is concentrated or be formed without the described main body of described ceramic coating
Part forms surface-treated layer.Described surface-treated layer, may include that ceramic bonding agent.Such as,
Described ceramic bonding agent, may include that aluminum oxide.
In exemplary embodiments, described surface-treated layer, the described part with pin hole is coated with
After described ceramic bonding agent, the temperature of about 100 DEG C to about 200 DEG C degree performs about 60 minutes extremely
The hot setting operation of about 180 minutes is formed.
According to the exemplary embodiments of the present invention, shape can be carried out by connecting plural described main body
Become the expansion structure of substrate-placing pallet.
In exemplary embodiments, the contact of the described main body of the expansion structure of described substrate-placing pallet
The thickness of the described ceramic coating in part, can substantially be thinner than in other parts of described main body
The thickness of described ceramic coating.Such as, described ceramic coating in the part of described body contact
Thickness can be about the degree of 100 μm to about 200 μm, the described pottery in other parts of described main body
The thickness of porcelain coating can be about the degree of 150 μm to about 400 μm.
In exemplary embodiments, the part in the part of described body contact can be formed without institute
State ceramic coating, thus make the main body of the expansion structure of described substrate-placing pallet be energized.
In exemplary embodiments, the expansion structure of described substrate-placing pallet, a main body is formed
For the shape of " L " word of substantially 90-degree rotation, another main body is substantially formed as mirror
After the shape of " L " word of picture, contact described main body to make the protuberance of described main body be formed overlappingly.
Now, the expansion structure of described substrate-placing pallet, may include that ceramic coating, be formed at institute
State the top at the interface of the above and described body contact of main body.Additionally, described substrate-placing pallet
Expansion structure main body lower side between the space of regulation can be provided.Described substrate-placing is used
The central part at the interface of the body contact of the expansion structure of pallet and bottom, can be formed without pottery painting
Layer.
In another exemplary embodiments, the expansion structure of described substrate-placing pallet, can be at one
Main body forms insertion section, after another main body forms protuberance, inserts described convex in described insertion section
Go out portion to be formed.
In yet another illustrative embodiment, the expansion structure of described substrate-placing pallet, by a master
The bodily form becomes the "U" shaped shape of substantive 90-degree rotation, after forming protuberance in another main body,
The protuberance inserting another main body described in one main body is formed.Now, described substrate
The expansion structure of mounting pallet, may include that ceramic coating, be formed at the above of described main body with
The top at the interface of described body contact.Additionally, the master of the expansion structure of described substrate-placing pallet
Between the lower side of body, it is provided that the space of regulation.The extension knot of described substrate-placing pallet
The central part at the interface of the body contact of structure, with on bottom, can be formed without described ceramic coating.
In yet another illustrative embodiment, the expansion structure of described substrate-placing pallet, by a master
The bodily form becomes the shape of " L " word of substantially 90-degree rotation, by another main body substance landform
After becoming the shape of " L " word of mirror image, the part at described body contact provides bonded block to carry out shape
Become.Now, the expansion structure of described substrate-placing pallet, may include that ceramic coating, formed
Above described main body, the top at the interface of the above and described body contact of described bonded block.
Additionally, between the downside sidepiece of the main body of the expansion structure of described substrate-placing pallet, it is provided that
The space of regulation.The central part at the interface of the body contact of the expansion structure of described substrate-placing pallet
With on bottom, described ceramic coating can be formed without.
The expansion structure of substrate-placing pallet according to the present invention, it is also possible to including: connect solid
Limiting-members, is used for fixing interconnective described main body.
In exemplary embodiments, described connecting portion part, may include that resettlement section, including tangible
Become the recess of the periphery of interconnective described main body；And insertion section, it is inserted into described collecting
Portion.
In another exemplary embodiments, described connecting portion part, may include that resettlement section, formed
Upper side end in interconnective described main body；Insertion section, is inserted into described resettlement section；And combine
Portion, extends to a part for described insertion section from the bottom surface of described main body.
In yet another illustrative embodiment, described connecting portion part, may include that resettlement section, top,
It is formed at the upper side end of interconnective described main body；Resettlement section, bottom, is formed at described main body
Downside end；Insertion section, top, is inserted into resettlement section, described top；Lower insert portion, is inserted into institute
State resettlement section, bottom；And joint portion, the one of insertion section, described top is extended to from described lower insert portion
Part.
(effect of invention)
According to the exemplary embodiments of the present invention, because substrate-placing pallet is by carbon-carbon composite
Constitute, during the thin film formation process therefore performed under relative property high temperature and isoionic atmosphere, can
Stably to maintain multiple physical characteristic, and described substrate-placing pallet can have and increases on a large scale
Big area.Thus, using plasma enhanced chemical vapor deposition at solar cell substrate
During the operation of the thin film of upper formation such as antireflection film etc., utilize described substrate-placing pallet permissible
A lot of substrates are processed simultaneously, therefore can promote productivity, and improve solaode base
The reliability of plate.Additionally, described substrate-placing pallet has good processability, and pass through institute
State the connection of substrate-placing pallet, it is possible to achieve there is the multiple substrate-placing torr of the area of increase
The expansion structure of dish.
Accompanying drawing explanation
Fig. 1 is the plane graph of the substrate-placing pallet representing the exemplary embodiments according to the present invention.
Fig. 2 is the base including non-woven fabrics stacking reinforcer representing the exemplary embodiments according to the present invention
The onboard axonometric chart put by the main body of pallet.
Fig. 3 be represent the exemplary embodiments according to the present invention include that lamination is knitted the most in one direction
The axonometric chart of the main body of the orthogonal anisotropy lamination reinforcer of the fabric made.
Fig. 4 is the guide portion of the substrate-placing pallet representing the exemplary embodiments according to the present invention
Plane graph.
Fig. 5 is the sectional view along A-A' line representing Fig. 4.
Fig. 6 is the guiding of the substrate-placing pallet representing another exemplary embodiments according to the present invention
The plane graph in portion.
Fig. 7 is the sectional view along B-B' line representing Fig. 6.
Fig. 8 is the drawing of substrate-placing pallet representing the yet another illustrative embodiment according to the present invention
Lead the plane graph in portion.
Fig. 9 is the sectional view along C-C' line representing Fig. 8.
Figure 10 is the sky of the substrate-placing pallet for the exemplary embodiments according to the present invention is described
The plane graph of gas circulation portions.
Figure 11 and Figure 12 is to utilize the air circulation portions of Figure 10 to transfer for explanation to be placed in substrate
The sectional view of the process of the substrate on mounting pallet.
Figure 13 to Figure 15 is that the air flow circuit of the air circulation portions for Figure 10 is described is along D-D' line
Sectional view.
Figure 16 is the expansion of the substrate-placing pallet for the exemplary embodiments according to the present invention is described
The plane graph of exhibition structure.
Figure 17 to Figure 19 is the substrate-placing pallet representing the exemplary embodiments according to the present invention
The partial sectional view of expansion structure.
Figure 20 to Figure 22 is to hold in the palm according to the substrate-placing of the exemplary embodiments of the present invention for explanation
The sectional view of the connecting portion part of the expansion structure of dish.
Figure 23 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
With the plane graph of pallet.
Figure 24 is the sectional view of the solar cell substrate mounting pallet representing Figure 23.
Figure 25 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
Sectional view by the guide portion of pallet.
Figure 26 is the solar cell substrate for another exemplary embodiments according to the present invention is described
The air circulation portions plane graph of mounting pallet.
Figure 27 and Figure 28 is to utilize the air circulation portions of Figure 26 to load the process of substrate for explanation
Sectional view.
Figure 29 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
Plane graph with the expansion structure of pallet.
Figure 30 is the pottery of the expansion structure of the solar cell substrate mounting pallet for Figure 29 is described
The sectional view of porcelain coating.
Detailed description of the invention
Below, referring to the drawings the substrate-placing pallet of the exemplary embodiments according to the present invention is carried out
Explanation.The present invention can carry out numerous variations and can have variform, and exemplary embodiments will
It is illustrated in accompanying drawing, and describes in detail in this article.But this embodiment is not special to the present invention
Fixed open form is defined it should be understood that the institute that includes in the thought of the present invention and technical scope
Change, equivalent and sub is had to be embraced within the present invention.When each accompanying drawing is described, can be to phase
Same or similar structural detail uses same or similar reference marks.In Can Zhaofutu, works
Size, for the definition of the present invention, can be extended or in order to schematically structure is described compared to reality,
Can reduced illustrate compared to reality.The term of first, second, third, fourth grade can be used
In explanation various structures element, but described structural detail is not limited to described term.Described term
It is only to use with the purpose from other structural details one structural detail of differentiation.Such as, do not taking off
In the case of the interest field of the present invention, the first structural detail can named second, third or
Four structural details, similar, second, third or the 4th structural detail can also named first knots
Constitutive element part.
Term used herein is merely to illustrate that specific embodiment uses, and is not to use
In limiting the present invention.The singulative mentioned in article, in the case of being not particularly limited, then wraps
Include plural form.In the application, the term of " including " or " having " etc. is only used for appointment and deposits
It is being described the feature described in book, quantity, step, action, structural detail, parts or its group
Close it should be understood that get rid of the most in advance, one or its other above features or numeral, step, dynamic
Work, structural detail, the existence of components or groups thereof or additional probability.
On the other hand, in the case of not carrying out different definition, including technical or scientific terms
At all terms used herein, there is the usual reason with those skilled in the art
Solve identical implication.Term as being defined in normally used dictionary should be construed to, to relevant skill
The implication that the implication that had in art article is consistent, and, do not carry out clearly defined in this application
In the case of, it is not construed as desirability or the implication of excessive formality.
Fig. 1 is the plane graph of the substrate-placing pallet representing the exemplary embodiments according to the present invention.
With reference to Fig. 1, utilize such as the substrate of plasma enhanced chemical vapour deposition (PECVD) device
Processing means (not shown), to perform to be formed such as the thin film of antireflection film etc. to solar cell substrate
During formation process, substrate-placing pallet 100 can load multiple substrate.According to exemplary
The substrate-placing pallet 100 of embodiment can possess, main body 11, guide portion 13 etc..
In exemplary embodiments, main body 11, may include that first residing for substrate；To in institute
State second of first.Such as, first of main body 11 can corresponding main body with second difference
Above and the bottom surface of 11.Now, main body 11 can have substantive smooth plate (plate) shape.
On first of main body 11, top can be loaded and will form multiple substrates of thin film, main body 11
Second, performing during described thin film formation process, substantially with described substrate board treatment
Isologue.Such as, second of main body 11 mainly can be adjacent to, be positioned at described substrate board treatment
The thermal source (not shown) of bottom dispose.Herein, with second substance of main body 11
The thermal source of the described substrate board treatment of isologue, can heats the term of execution of described thin film formation process
It is placed in the substrate of substrate-placing pallet 100.Such as, the thermal source of described substrate board treatment, can
To include: heating plate (heating plate), heating lamp (heating lamp) etc..Exemplary enforcement
In example, the thermal source of described substrate board treatment, second straight bottom of main body 11 can be placed in,
Come substantially isologue in second of main body 11.According to another exemplary embodiments, described substrate
The thermal source of processing means, can not isologue in second of main body 11, but dispose adjacently.
Such as, the thermal source of described substrate board treatment, it is adjacent to main body 11 and disposes, such that it is able to
Sufficiently heat passed on by described substrate.
Described thin film formation process can perform in the relatively-high temperature of about 300 DEG C to about 700 DEG C degree,
Thus, main body 11 needs by the material structure that relatively can stably maintain physical characteristic in high temperature
Become.Additionally, in described thin film formation process, for productive lifting, when performing an operation
Needing to process the substrate of quantity as much as possible, therefore, main body 11 needs by realizing large-area
Material is constituted.In other words, the main body 11 of substrate-placing pallet 100 need by, at relatively-high temperature
In can stably maintain physical characteristic, the material that simultaneously can be fabricated to the biggest area is constituted.
In exemplary embodiments, main body 11 can be by, the base material (stone-like pulse) of carbon element system and carbon element system
The carbon-carbon composite (C/C composite) of particle or fiber mixing is constituted.Additionally, substrate-placing
Include by the main body 11 of pallet 100: the layer being at least made up of plural carbon-carbon composite.
In exemplary embodiments, the substrate-placing main body 11 of pallet 100, may include that plain weave
(plane weave) woven fabric (woven object), such as, main body 11, may include that
Plain weave lamination reinforcer, has the single blade of lamination plural plain weave woven fabric composition
Structure.According to another exemplary embodiments, main body 11, may include that twill (twill weave)
Woven fabric.Such as, main body 11, may include that twill lamination reinforcer, there is lamination two
The structure of single of the fabric composition of above twill weave.According to still another embodiment, main body 11,
May include that satin weave (satin weave) woven fabric.Such as, main body 11, may include that
Satin weave lamination reinforcer, has the knot of single that the lamination woven fabric of two or more satin weave is constituted
Structure.
Below, according to exemplary embodiments.Include carbon fiber-reinforced composite material manufacture possessing to have
Substrate-placing pallet 100 for the main body 11 of the fabric of non-woven fabrics form illustrates.
Fig. 2 is the base including non-woven fabrics stacking reinforcer representing the exemplary embodiments according to the present invention
The onboard axonometric chart put by the main body of pallet.
With reference to Fig. 2, substrate-placing main body 11a of pallet 100, may include that nonwoven fabric laminate
Reinforcer, has the list that the plural fabric that carbon fiber is fabricated to non-woven fabrics form of lamination is constituted
A piece of structure.Now, main body 11a, there is plural the knitting not by carbon fiber of lamination
Make and formed, but by the fabric structure that carbon fiber boundling becomes fiber assembly manufacture with sheet form
Become the structure of single.Although, in Fig. 2, be by four non-woven fabrics 210a of lamination, 210b, 210c,
210d defines main body 11a, but can also form master by the non-woven fabrics of lamination less than three
Body 11a, it is also possible to form main body 11a by the non-woven fabrics of lamination more than five.
As in figure 2 it is shown, manufacture master at lamination four non-woven fabrics 210a, 210b, 210c, 210d
During body 11a, non-woven fabrics 210a, 210b, 210c, 210d respectively can be fine with random alignment carbon
Dimension is formed.That is, non-woven fabrics 210a, 210b, 210c, 210d respectively can be by lack of alignment
Carbon fiber is constituted.Main body 11a, can be made up of the carbon fiber of lack of alignment as mentioned above lamination
Four non-woven fabrics 210a, 210b, 210c, 210d manufacture.In exemplary embodiments, main body 11a,
Because four non-woven fabrics 210a, 210b, 210c, 210d can have carbon fiber lack of alignment respectively
Structure, therefore, the physical characteristic of main body 11a is for including X-direction, Y-direction and Z-direction
All directions, substantially have quasi-isotropic (quasi-isotropic property).Such as, main
Body 11a is for including all directions of X-direction, Y-direction and Z-direction, such as bending strength, Shore
The physical characteristic of hardness, thermal coefficient of expansion etc. is substantive identical or substantive similar.Illustrate according to another
Property embodiment, when main body 11a includes the non-woven fabrics of two laminations, main body 11a can also be for all
Direction has substantial quasi-isotropic, thus, including main body 11a of two non-woven fabrics for institute
Directive physical characteristic can also be substantive identical or substantive similar.
Below, according to another exemplary embodiments of the present invention, the lamination including laminated fabric is strengthened
The main body of the substrate-placing pallet of thing illustrates.
Fig. 3 be represent the exemplary embodiments according to the present invention include that lamination is knitted the most in one direction
The axonometric chart of the main body of the orthogonal anisotropy lamination reinforcer of the fabric made.
With reference to Fig. 3, substrate-placing main body 11b of pallet 100, can have, lamination edge respectively
The structure of one direction woven fabric 21a, 21b, 23a, 23b.Now, fabric 21a, 21b,
23a, 23b are by mutually different direction, i.e. anisotropy lamination manufactures main body 11b.Such as,
The weaving direction of the first fabric 23b can dispose in X direction, the weaving of the second fabric 21b
Direction can dispose along Y-direction, and the weaving direction of the 3rd fabric 23a can be in X direction
Disposing, the weaving direction of the 4th fabric 21a can dispose along Y-direction.Thus,
Main body 11b, may include that orthogonal anisotropy lamination reinforcer, have fabric 21a, 21b, 23a,
23b is in X direction and the structure of Y-direction crossing stack.
According to another exemplary embodiments, the weaving direction of the first fabric 23b can be entered in X direction
Row disposes, and the weaving direction of the second fabric 21b can dispose along Y-direction.Additionally, the 3rd
The weaving direction of fabric 23a can be pacified along different directions substantive from X-direction and Y-direction
Putting, the weaving direction of the 4th fabric 21a can along the weaving direction substance with the 3rd fabric 23a not
Same direction disposes.Thus, main body 11b, may include that polytropism lamination reinforcer, tool
There are fabric 21a, 21b, 23a, 23b along including that the direction used of X-direction and Y-direction carries out lamination
Structure.
When constituting the fabric of main body 11b of substrate-placing pallet 100 not along orthogonal anisotropy lamination
Be in one direction lamination time, main body 11b of substrate-placing pallet 100 can have relatively small
Bending strength, when therefore applying power in main body 11b, the deformation of meeting enlarged body 11b.Now,
Main body 11b of substrate-placing pallet 100 not only can bend or damaged, and is difficult to have large area.
According to the exemplary embodiment of the present invention, substrate-placing pallet 100, as it has been described above, because have
For including anisotropy or main body 11b of polytropism lamination reinforcer, main body 11b therefore can be promoted
Physical characteristic prevent deformation or the breakage of substrate-placing pallet 100, substrate can be made to carry simultaneously
Put, with pallet 100, there is relatively large area.In other words, the substrate-placing main body of pallet 100
When 11b includes anisotropy or polytropism lamination reinforcer, as it has been described above, fabric 21a, 21b, 23a,
The weaving direction of 23b can be along including that the multiple direction of X-direction and Y-direction disposes, therefore,
Main body 11b can have along multiple direction that to improve bending strength, thermal coefficient of expansion etc. improved
Physical characteristic.Therefore, it can be effectively prevented substrate-placing pallet 100 bend or the phenomenon of breakage,
And substrate-placing pallet 100 can be made easily to have large area.According to still another embodiment, base
Onboard main body 11b putting use pallet 100, in addition to above-mentioned orthogonal anisotropy lamination reinforcer,
During including plain weave lamination reinforcer, twill lamination reinforcer, satin weave lamination reinforcer, also by by institute
State fabric to carry out disposing and lamination along anisotropy, such that it is able to promote substrate-placing with the master of pallet 100
The physical characteristic of the bending strength of body 11b, thermal coefficient of expansion etc..
According to the exemplary embodiments of the present invention, substrate-placing pallet 100 can possess main body 11a,
11b, described main body includes: weave plural carbon-carbon composite and the piece of cloth that formed or tool
There is the fabric of non-woven fabrics.Therefore, substrate-placing pallet 100 can be stablized in relatively-high temperature
Ground maintains physical characteristic, and can be fabricated to have large area.According to exemplary embodiments, possess
The substrate-placing pallet 100 of the main body 11 being made up of carbon-carbon composite has about 3mm extremely
During the thickness of about 15mm degree, can have the large area of about 2000mm × 1000mm degree.
Now, substrate-placing pallet 100, compared to the substrate-placing pallet being made up of graphite in the past,
Can have the bending strength of about 2 times to about 4 times.In exemplary embodiments, substrate-placing pallet 100
The big of about 2000mm × 1000mm degree can be had with the thickness benchmark of about 5mm to about 8mm
Area.That is, according to the substrate-placing pallet 100 of the exemplary embodiments of the present invention, compared to
Toward the substrate-placing pallet being made up of graphite, can have while there is the thinnest thickness
Bigger area.Additionally, as it has been described above, because include the substrate-placing pallet of carbon-carbon composite
100, there is while there is relatively large area relatively light weight, therefore can be more easily
Process substrate-placing pallet 100.
Use and perform thin film shape according to the substrate-placing pallet 100 of the exemplary embodiments of the present invention
When becoming operation, because multiple substrate-placing is in main body 11, therefore, described substrate can be pacified respectively
It is placed in the spaced assigned position of described main body 11.As it is shown in figure 1, be provided in substrate-placing
By the guide portion 13 of the main body 11 of pallet 100, when loading described substrate on the main body 11, Ke Yiyin
Lead described substrate to make described substrate be placed in fixed position.That is, first (example of main body 11
As, above) on can load the substrate of at least two, first of main body 11 is upper loads described base
During plate, guide portion 13 can guide described substrate to come the most mutually and dispose with being separated by predetermined distance.
Fig. 4 is the guide portion of the substrate-placing pallet representing the exemplary embodiments according to the present invention
Plane graph, Fig. 5 is the sectional view along A-A' line representing Fig. 4.In Fig. 4 and Fig. 5, for reference
The substantive identical parts of the parts that Fig. 1 illustrates will use identical reference marks.
With reference to Fig. 4 and Fig. 5, possess the guide portion 13 of main body 11 in substrate-placing pallet, can
To include: multiple bags of portions (pocket) 31, for making the substrate being placed on first of main body 11
200 are separated from each other at a prescribed interval and house.Such as, bag portion 31 respectively can be in main body 11
First, carry out intaglio with the degree of depth of regulation and be processed to form.That is, bag portion 31 can have respectively
It is formed at concave surface (recess) or the shape of groove (groove) of main body 11.Herein, bag portion 31
Can have, the area similar or the biggest with the area substance of each substrate 200.Each bag of portion
31 can have, the multiple planar shaped of substantive polygon, substantive circular, substantive ellipse etc.
Shape.But, the flat shape in this bag portion 31 can be according to the substrate 200 being contained in bag portion 31
Shape and change.When guide portion 13 includes bag portion 31, substrate 200 performs form thin film
During operation, substrate 200 can be positioned in bag portion 31 respectively.According to another exemplary embodiments,
Guide portion 13, can include from first of the main body 11 bag portion protruded with specified altitude.Herein,
The bag portion of the protrusion of guide portion 13, corresponding to the shape of each substrate 200, can have substance many
The flat shape of dihedral, substantive circular, substantive ellipse etc..Additionally, guide portion 13 is convex
Output portion can have, the area similar or the biggest with the area substance of each substrate 200.
Fig. 6 is the guiding of the substrate-placing pallet representing another exemplary embodiments according to the present invention
The plane graph in portion, Fig. 7 is the sectional view along B-B' line representing Fig. 6.In Fig. 6 and Fig. 7, for
The parts identical with the parts substance illustrated with reference to Fig. 1 will use identical reference marks.
As shown in FIG. 6 and 7, it is provided that in the guide portion 13 of the main body 11 of substrate-placing pallet,
May include that pin (pin) 51, be placed on first of main body 11, be used for making to be placed in master
Substrate 200 on first of body 11 is separated from each other and houses.Such as, guide portion 13, can wrap
Include: the neighboring along each substrate 200 being placed on first of main body 11 is arranged at predetermined intervals
Arrange multiple pins 51.The area in the region of respective limited main body 11 by this pin 51
Can be similar or the biggest with the area substance of each substrate 200.Although Fig. 6 illustrates around
Eight pins 51 of one substrate 200, but the quantity of the pin 51 of guide portion 13 can be more than eight
Individual, it is also possible to less than eight.Additionally, pin 51 substance is to enter with octagonal structure in Fig. 6
Go arrangement, but the arrangement architecture of the pin 51 of guide portion 13, can be according to each substrate 200
Shape and change.Such as, the pin 51 of leader 13 can with substantive circular structure,
Substantive oval structure, substantive polygonal structure etc. dispose.Including this pin 51
Guide portion 13, on substrate 200 perform formed thin film operation during, substrate 200 can be fixed
On first of main body 11.
In exemplary embodiments, the pin 51 of guide portion 13 may include that respectively pottery, graphite,
Carbon-carbon composite, metal, at the material, ceramic coating of anodization (anodizing)
The material etc. of reason.According to exemplary embodiments, the pin 51 of guide portion 13 respectively can be by pottery structure
Become or include that coating has the material of pottery, thus preventing from performing for the operation phase forming described thin film
Between occur electric arc (arcing).
Fig. 8 is the drawing of substrate-placing pallet representing the yet another illustrative embodiment according to the present invention
Leading the plane graph in portion, Fig. 9 is the sectional view along C-C' line representing Fig. 8.In Fig. 8 and Fig. 9, right
Identical reference marks will be used in the parts identical with the parts substance illustrated with reference to Fig. 1.
With reference to Fig. 8 and Fig. 9, it is provided that in the guide portion 13 of the main body 11 of substrate-placing pallet, can
To include: pass-through pocket 61, through main body 11；Protrude pin 63, extend from main body 11.Pass-through pocket
61 can have respectively, substantive polygonal shape, substantive circular shape, substantive ellipse
The multiple flat shape of the shape etc. of shape.Herein, each pass-through pocket 61 can have, substantive big
Area in each substrate 200 area.Additionally, protrude the pin 63 inwall from each pass-through pocket 61,
Protrude along parallel direction substantive for main body 11.Although exemplified with arranging at predetermined intervals in Fig. 8
Eight protrusion pins 63 of row, but the quantity protruding pin 63 of guide portion 13 is in contrast, can
To be increased or decreased.Such as, protrude pin 63 quantity can according to the shape of substrate 200, pass through
The shape of logical bag 61 etc. and change.The protrusion pin 63 of guide portion 13 can be supported to be contained in pass-through pocket
The bottom surface of the substrate 200 of 61, so that substrate 200 is contained in guide portion 13.Substrate 200 houses
When the guide portion 13 including pass-through pocket 61 and protrude pin 63, the bottom surface of substrate 200 can be exposed,
Thin film is formed the most more easily on second of substrate 200.That is, because possess include through
In the main body 11 of the guide portion 13 of bag 61 and protrusion pin 63, the substrate 200 of mounting can reveal respectively
Go out bottom surface, therefore along with reacting gas successfully can be provided to the bottom surface of each substrate 200, permissible
On the bottom surface of each substrate 200, easily form thin film.In exemplary embodiments, guide portion 13
Protrude pin 63 and may include that pottery, graphite, carbon-carbon composite, metal, Jing Guoyang respectively
The material etc. that the material of polarization process, ceramic coating process.According to exemplary embodiments, guide portion 13
Each protrude pin 63 and may include that the conductive material such as metal or graphite, thus performing institute
State the period of operation for forming thin film, successfully can be formed on the bottom surface of each substrate 200
Thin film.
Figure 10 is the sky of the substrate-placing pallet for the exemplary embodiments according to the present invention is described
The plane graph of gas circulation portions, Figure 11 and Figure 12 is to utilize the air circulation portions of Figure 10 for explanation
The sectional view of the process of the substrate that transfer is placed on substrate-placing pallet.In Figure 10 to Figure 12,
Identical reference marks will be used for the parts identical with the parts substance illustrated with reference to Fig. 1.
With reference to Figure 10, the air circulation portions 91 of substrate-placing pallet, at substrate-placing pallet
During the process of the top transfer substrate 200 of main body 11, perform to carry out to the second face of substrate 200
The effect of air circulation.Substrate is transferred on first of the main body 11 of described substrate-placing pallet
During 200, when described substrate-placing pallet unloading (unloading) substrate 200, base
Between the bottom surface of plate 200 and first of the main body 11 of described substrate-placing pallet it may happen that
Air drag, and because this air drag causes being held in the palm from described substrate-placing by substrate 200
Dish successfully unloads.That is, substrate 200 is unloaded from the main body 11 of described substrate-placing pallet
During load, can cause occurring from described substrate because of the air drag of the bottom surface moment applying of substrate 200
The phenomenon that mounting pallet cannot depart from.In exemplary embodiments, air circulation portions 91, from described
When carried base board 200 is unloaded in first face of the main body 11 of substrate-placing pallet, to the bottom surface of substrate 200
Circulation air reduces the air drag putting on substrate 200.Its result is, can be more easily
Substrate 200 is unloaded from described substrate-placing pallet.
In exemplary embodiments, air circulation portions 91, may include that airport 91a, from main body 11
Second (such as, bottom surface) extend to first of main body 11；And air flow circuit 91b, respectively
UNICOM is in each airport 91a.Airport 91a, is placed in the position set in advance at substrate 200
Time, can be naturally externally to the bottom surface offer air of substrate 200.Such as, each airport 91a
May be located at below the central part of each substrate 200.Air flow circuit 91b is respectively provided with connection, and each is empty
The groove shape of pore 91a.Additionally, air flow circuit 91b can get involved on the first of main body 11
Airport 91a is connected with each other.Although exemplified with air circulation portions 91 in Figure 10 to Figure 12
Around it is mounted with the guide portion 13 including the pin 51 with reference to Fig. 6 explanation, but sky can also be adjoined
Gas circulation portions 91 disposes the guide portion 13 including the bag portion 31 with reference to Fig. 4 explanation.
As shown in FIG. 11 and 12, first top in the main body 11 of substrate-placing pallet is moved
During sending substrate 200, when described substrate-placing pallet unloads carried base board 200, can pass through
Air circulation portions 91 is circulated to the bottom surface of substrate 200 supply air naturally.Thus, may be used
To send out between reducing first of the main body 11 of the bottom surface of substrate 200 and described substrate-placing pallet
Raw air drag, therefore can easily by substrate 200 from the main body of described substrate-placing pallet
11 unload.That is, when described substrate-placing pallet possessing air circulation portions 91, by sky
Gas circulation portions 91 and the air that is naturally circulated, be possible to prevent the damage of substrate 200 or prevent
The damage of the thin film being formed on substrate 200, and can stably make substrate 200 from described substrate
Mounting pallet unloads.
On the other hand, air circulation portions 91, not only in above-mentioned substrate 200 uninstall process, and
When substrate 200 is loaded on first of theme 11, also naturally enter to substrate 200 bottom surface
Line space gas circulates.Thus, substrate 200 bottom surface the air pressure applied, base can be effectively prevented
The substrate 200 being likely to occur in plate 200 loading procedure is from the main body 11 of described substrate-placing pallet
The phenomenon slided.Its result is, substrate 200 can be stably at position forming film accurately.
As it has been described above, the substrate-placing pallet of the exemplary embodiments according to the present invention, because possessing
Circulation portions 91, is possible to prevent substrate 200 or the damage of thin film being formed on substrate 200, and can
To be more prone to and stably to process substrate 200.
According to exemplary embodiments, the substrate-placing pallet 100 of diagram in Fig. 1, pottery can be included
Porcelain coating (not shown), is formed on first of main body 11.This ceramic coating is provided in main body
Time on 11, the plasma because generating during forming thin film on substrate 200 can be protected to cause substrate
Mounting pallet 100 is impaired, for example, it is possible to from burn into etch damage, main body 11 volatilization (i.e.,
Density declines) etc. protective substrate mounting pallet 100 in situation, be also possible to prevent, at substrate simultaneously
Mounting damage to substrate-placing pallet 100 during the process of pallet 100.Such as, described pottery
Coating, may include that aluminum oxide (AlOx), yttrium oxide (YOx), Zirconium oxide (ZrOx)
Deng oxidation system pottery.They can be used alone or be used in mixed way.Additionally, described pottery
Porcelain coating can utilize air plasma spraying (APS) coating procedure to be formed at the first of main body 11
On face.On the other hand, described ceramic coating can also utilize fast velocity oxygen fuel to spray (HVOF) work
Sequence, vacuum plasma spray coating (VPS) operation, power spray (kinetic spray) coating procedure etc.
It is formed in main body 11.In exemplary embodiments, described ceramic coating uses by oxidation system pottery
The spray-on coating powder that porcelain is constituted, utilizes air plasma spraying operation to spray and holds in the palm in substrate-placing
Obtain in the main body 11 of dish 100.According to another exemplary embodiments, described ceramic coating except
Beyond oxidation system pottery as above, it is also possible to including: such as aln precipitation (AlNx), silicon-carbon
The non-oxide system pottery of compound (SiCx) etc..When described ceramic coating includes non-oxide system pottery,
Can utilize power spray operation, aerosol evaporation operation etc. that described ceramic coating is formed at main body 11
On.
When described ceramic coating has the thickness less than about 100 μm, cannot in a part for main body 11
It is sufficiently formed described ceramic coating, it is therefore possible to occur main body 11 to expose or described ceramic coating
There is pin hole (pin hole) in surface, and because for formed the high-temperature process of described thin film with etc.
Ion, may cause described ceramic coating impaired.On the other hand, described ceramic coating has and exceedes about
During the thickness of 400 μm, can cause because the bonding force between main body 11 and described ceramic coating declines
Described ceramic coating departs from from main body 11.Additionally, the upper of substrate-placing pallet 100 not only can be made
The flatness on surface, portion is low, and also results in the centre bending of substrate-placing pallet 100.
In view of this problem, described ceramic coating can be on the basis of the first of main body 11, with about 100
μm is formed to the thickness of 400 μm degree.
In exemplary embodiments, described ceramic coating can be formed at first and side of main body 11
On.Additionally, described ceramic coating can also be formed at the marginal portion of second of main body 11 (i.e.,
The periphery of bottom surface) on.The period of thin film is formed, because being exposed to high temperature and plasma at substrate 200
Part is main body 11 first periphery with second of side and main body 11, therefore described
When ceramic coating is formed on the periphery of first of main body 11, side and second, Ke Yiyou
Main body 11 is protected on effect ground during described thin film formation process.That is, substrate-placing pallet 100 is permissible
Including the described ceramic coating being formed in main body 11, therefore, described ceramic coating is possible to prevent,
During forming described thin film formation process, because high temperature and plasma cause main body 11 corrode or etch
Phenomenon.Including described ceramic coating substrate-placing pallet 100 because can high temperature and etc. from
Can also stably maintain physical characteristic under sub-atmosphere, therefore can extend substrate-placing pallet 100
Life-span (life time), and substrate-placing pallet 100 can be processed more easily.Additionally,
Its deformation it is substantially prevented from, hence with substrate while promoting the flatness of substrate-placing pallet 100
When mounting pallet 100 adds hot substrate 200, it can be ensured that the uniformity that heat is passed on, and can hold
Maintain substrate 200 efficiency of heating surface continuously.
On the other hand, when the main body 11 of substrate-placing pallet 100 forms described ceramic coating,
A part for described ceramic coating likely can occur pin hole.Occur on ceramic coating as above
During pin hole, during the operation that described thin film is formed, described pin hole part can concentrate electricity momentaryly
Lotus and electric current and act as occurring the reason of electric arc.In view of this point, according to the base of exemplary embodiments
Onboard putting uses pallet 100, also includes: surface-treated layer (not shown), is made up of ceramic bonding agent and
Cover the pin hole occurred on described ceramic coating.Now, described surface-treated layer can be substantially
Fill out the pin hole of described ceramic coating.Such as, the ceramic bonding agent of described surface-treated layer can be by,
Mix for water, acid, alkali, oil, solvent etc. have outstanding repellence the oxidation system of inorganic matter
Pottery is constituted.
In exemplary embodiments, can make up pin hole such as described ceramic coating defect as described in table
Face processes layer, after the position coating ceramic bonding agent of the pin hole generation of described ceramic coating, often
Warming middle-JIAO performs the spontaneous curing process of about 24 hours and obtains.According to another embodiment, described surface
Process layer, after being coated with described ceramic bonding agent, performs about in the temperature of room temperature to about 50 DEG C degree
After the skimming processes of 30 minutes to 90 minutes or dehydration, about 100 DEG C to about 200 DEG C degree
The hot setting carried out in temperature about 60 minutes to about 180 minutes obtains.In still another embodiment,
Described surface-treated layer is after being coated with described ceramic bonding agent, about 100 DEG C to about 200 DEG C degree
Temperature in only carry out the solidification process of about 60 minutes to 180 minutes and obtain.Another is exemplary again
In embodiment, described surface-treated layer is after being coated with described ceramic bonding agent, at about 100 DEG C to about
The temperature of 200 DEG C of degree only carries out the high temperature cure process of about 60 minutes to about 180 minutes and obtains
?.In other words, the surface-treated layer being made up of described ceramic bonding agent is to pass through, and performs spontaneous curing
Process or continuously perform skimming processes or dehydration and high temperature cure process or to only carry out high temperature solid
Change process and formed.Above-mentioned dehydration or skimming processes perform about 30 minutes less than time
Time, cannot can successfully constitute dehydration or the defat of described ceramic bonding agent, in contrast, perform
When exceeding about 90 minutes, the inefficiency of the operation of described surface-treated layer can be resulted in.Additionally,
Described high temperature cure process about 100 DEG C less than temperature in perform time, can cannot successfully constitute institute
Stating the solidification of ceramic bonding agent, in contrast, exceeding about 200 DEG C in execution can successfully be constituted
When performing in the temperature of solidification, the carbon of the substrate of described ceramic bonding agent constitutes in the way solidified and can change
For carbon dioxide, and cause the density of the base material of described ceramic bonding agent low.
As it has been described above, according to the substrate-placing of the exemplary embodiments of the present invention with pallet 100 except institute
State and beyond ceramic coating, can also possess described surface-treated layer, cover described ceramic coating as pipe
The defect in foot hole, therefore can stably maintain physical characteristic during forming the operation of described thin film.
But, during first of the main body 11 of the substrate-placing pallet 100 described ceramic coating of upper formation,
The part that the entrance of the air flow circuit 91b of air circulation portions 91 is connected with side is arranged as substantive hanging down
Time straight, can be in this coupling part concentrated stress, its result causes the described ceramic coating may be from main body
11 depart from.
Figure 13 to Figure 15 is that the air flow circuit of the air circulation portions for Figure 10 is described is along D-D' line
Sectional view.
As shown in FIG. 13 to 15, the entrance of the air flow circuit 91b with groove structure is connected with side
Part 121 is formed slopely, such that it is able to the entrance that dispersion concentrates on air flow circuit 91b is connected with side
The stress of part 121.Thus, it is possible to fully suppress described ceramic coating from air flow circuit 91b's
The phenomenon that entrance departs from side connection portion 121.
According to exemplary embodiments, the part 121 that the entrance of air flow circuit 91b is connected with side, as
Shown in reference marks 121 in Figure 13, can be formed as towards main body 11, the most gradually to become
Narrow structures slope.In another exemplary embodiments, the entrance of air flow circuit 91b is connected with side
Part 121, as shown in the reference marks 131 in Figure 14, can be formed as portions incline.Again another
In embodiment, the part 121 that the entrance of air flow circuit 91b is connected with side, such as the reference in Figure 15
Shown in symbol 141, can be formed with substantive rounding (rounded) structures slope.On the other hand,
The end of air flow circuit 91b is formed as rounding shape to prevent the disengaging of described ceramic coating.
Figure 16 is the expansion of the substrate-placing pallet for the exemplary embodiments according to the present invention is described
The plane graph of exhibition structure (extension structure).
With reference to Figure 16, multiple substrate-placing pallet 100 can be connected with each other and use to realize substrate-placing
The expansion structure 400 of pallet.I.e., it is possible to be connected with each other the main body of multiple substrate-placing pallet 100
The expansion structure 400 of substrate-placing pallet is provided.For example, it is possible to be connected with each other adjacent substrate
The main body of mounting pallet 100 forms the expansion structure 400 of substrate-placing pallet.
In exemplary embodiments, multiple substrate-placing pallets 100 form the expansion of substrate-placing pallet
During exhibition structure 400, compared to a substrate-placing pallet 100, the extension of substrate-placing pallet
Structure 400 can have broader area.Such as, it is connected with each other two and there is about 3mm to about 15mm
The substrate-placing pallet 100 of the area of the thickness of degree and about 2000mm × 1000mm degree
When forming the expansion structure 400 of substrate-placing pallet, the expansion structure 400 of substrate-placing pallet
Can have the area increased of about 2000mm × 2000mm degree.
As it has been described above, utilize the substrate-placing by connecting plural substrate-placing pallet 100
More substrate can be processed with the expansion structure 400 of pallet simultaneously, therefore, it can be greatly improved
The productivity of one of the key factor in the manufacture of solar cell substrate.
Figure 17 to Figure 19 is the substrate-placing pallet representing the exemplary embodiments according to the present invention
The partial sectional view of expansion structure.
With reference to Figure 17, the expansion structure of described substrate-placing pallet, will have a base of protuberance
The onboard shape putting " L " word being arranged as substantially rotating about 90 degree by the main body of pallet 100,
The main body 11 with another substrate-placing pallet 100 of protuberance is substantially arranged as mirror
After the shape of " L " word (substantially rotating " L " word of about 180 degree) of picture, it is connected with each other base
Onboard putting is formed with pallet 100.That is, by a substrate-placing the first of the main body of pallet 100
Second face of face and the main body of another substrate-placing pallet 100 is orientated as in the same plane
After, the protuberance substance being connected as substrate-placing pallet 100 is overlapping, thus realizes substrate-placing
With the expansion structure of pallet.
In the expansion structure of the substrate-placing pallet according to exemplary embodiments, substantive rotation about 90
The main body of one substrate-placing pallet 100 with " L " word shape of degree and substance have mirror
The main body substance of another substrate-placing pallet 100 of " L " word shape of picture connects in consistent manner.
Now, can be with shape on the interface 165 between the above and main body of the main body of substrate-placing pallet 100
Become to have ceramic coating 161.Such as, ceramic coating 161 can extend to edge from the surface of described main body
The central part at the interface 165 of the substantive vertical direction contact of described main body.Ceramic coating 161,
During described thin film formation process, it is possible to prevent plasma to carry from the above substrate that infiltrates into of described main body
Wounded substrate mounting pallet 100 is carried out at the interface 165 putting the body contact with pallet 100.The opposing party
Face, the sky of regulation can be got involved in the bottom at the interface 165 connecting the main body of substrate-placing pallet 100
Between 163.That is, although the top of the main body of substrate-placing pallet 100 contacts with each other with central part,
But the bottom of described main body can be separated by the interval of regulation.The substrate-placing main body of pallet 100
During the space 163 provided between bottom performs thin film formation process in relatively-high temperature, by housing
The substrate-placing phenomenon shunk and/or expand of pallet 100, such that it is able to prevent substrate-placing from holding in the palm
Dish 100 is impaired.The central part at the interface 165 between the main body of this substrate-placing pallet 100 with
Bottom is formed without ceramic coating 161.
With reference to Figure 18, according to the expansion structure of the substrate-placing pallet of another exemplary embodiments, peace
Put the master of a substrate-placing pallet 100 of the groove of the shape of " U " word with about 90-degree rotation
Body 11, the central authorities at its sidepiece dispose the master of another substrate-placing pallet 100 with protuberance
After body 11, the protuberance of the main body of another substrate-placing pallet 100 is inserted into one
The groove of the main body of substrate-placing pallet 100 is implemented.Now, first of described main body permissible
Being positioned on substantial same plane, the second face of described main body also is located on substantial the same face.
In exemplary embodiments, the length of the protuberance of the main body of a substrate-placing pallet 100 can be real
Matter is less than another substrate-placing degree of depth of the groove of the main body of pallet 100.Therefore, described main body
Sidepiece between can be provided with the space 173 of regulation.Space 173 between this main body is relatively
During high temperature performs operation, house contraction and/or the expansion of substrate-placing pallet 100, prevent
The substrate-placing damage of pallet 100.Additionally, the main body of substrate-placing pallet 100 above with
Ceramic coating 171 can be formed on the upper interface surface 175 of described main body.Such as, ceramic coating 171
Can be from the above interface 175 extending to described body contact of the main body of substrate-placing pallet 100
Top.That is, ceramic coating 171 can be not formed between central part and the bottom of described body contact,
Ceramic coating 171 prevents plasma from the main body 11 of the expansion structure of described substrate-placing pallet
Face is permeated and wounded substrate mounting pallet 100 along interface 175.
Although the expansion structure of the substrate-placing pallet illustrated in Figure 18 is to use at a substrate-placing
The protuberance of the main body inserting another substrate-placing pallet 100 in the groove of the main body of pallet 100 comes
Implement, but the main body of a substrate-placing pallet 100 can include plural groove, corresponding
Main body in another substrate-placing pallet 100 of these grooves can also have plural protrusion
Portion.Such as, the sidepiece substance of the main body 11 of a substrate-placing pallet 100 possesses for " E "
The shape of word, another substrate-placing sidepiece of the main body 11 of pallet 100 forms two protuberances,
Thus connect substrate-placing pallet 100, thus realize the expansion structure of substrate-placing pallet.
Now, the groove of the main body of substrate-placing pallet 100 or the size of protuberance can be according to substrate-placings
Different by the size of pallet 100.Additionally, a substrate-placing groove for the main body of pallet 100
Quantity can not be corresponding with the quantity of the protuberance of the main body of another substrate-placing pallet 100.That is,
The quantity of the groove of the main body of one substrate-placing pallet 100 can be than another substrate-placing pallet
The quantity of the protuberance of the main body of 100 is few or many.
With reference to Figure 19, according to the expansion structure of the substrate-placing pallet of still another embodiment, a base
The sidepiece of the onboard main body put with pallet 100 has the shape of " L " word of substantive 90-degree rotation,
The main body of another substrate-placing pallet 100 has " L " word shape of substantial mirror, and leads to
Cross use to provide as the bonded block 187 of screw connects substrate-placing pallet 100.Herein,
Above and the bottom surface of the main body of substrate-placing pallet 100 can lay respectively at the plane that substance is identical
On.Therefore, bonded block 187 can above through to bottom surface from described main body.
Above the main body of the expansion structure being illustrated in the substrate-placing pallet of Figure 19, bonded block
Ceramic coating 181 can be formed at the top at the interface 185 of the above and described body contact of 187.This
Outward, regulation space can be got involved between the bottom of the main body of the expansion structure of described substrate-placing pallet
183 are separated by.Now, ceramic coating 181 and space 183, respectively can be with reference Figure 17 explanation
Ceramic coating 161 identical with space 163 substance or perform the function that substance is similar.Such as,
Ceramic coating 181 is possible to prevent plasma from the main body of the expansion structure of described substrate-placing pallet
Face is permeated and wounded substrate mounting pallet 100 along interface 185.Additionally, described substrate-placing torr
Space 183 between the main body of the expansion structure of dish can house substrate-placing during high-temperature process
Contraction or expansion with pallet 100.On the other hand, the expansion structure of described substrate-placing pallet
Ceramic coating 181 can be formed without on the central part at the interface 185 between main body and bottom.
In the expansion structure of the substrate-placing pallet illustrated with reference to Figure 17 to Figure 19, if substrate carries
Put and between the main body with pallet 100, do not constitute mutually energising, can cause forming inequality on the substrate
Even thin film, the expansion structure of the most described substrate-placing pallet can be by substrate-placing pallet
The main body ground connection of 100.The connecing of main body for the expansion structure of such described substrate-placing pallet
Ground, the part at the interface 165,175,185 of the body contact of substrate-placing pallet 100 is permissible
It is formed without ceramic coating 161,171,181.
As it has been described above, include according to the substrate-placing pallet of the exemplary embodiments of the present invention: by carbon
The main body that-carbon composite is constituted, is therefore possible not only in the high-temperature process under plasma atmosphere stable
Ground maintains physical characteristic, and because may be constructed large-area extension, therefore can process more simultaneously
The substrate of many quantity.
In exemplary embodiments, substrate-placing pallet, is that carbon-carbon composite performs impregnation successively
(impregnation) operation, heat treatment step, lamination procedure, pattern making procedure, crystallization step,
Guide portion formation process, the formation process etc. of ceramic coating obtain.
Refer again to Figure 16, when forming the expansion structure 400 of substrate-placing pallet, it is necessary to fixing phase
The main body of the substrate-placing pallet 100 connected.The expansion structure 400 of substrate-placing pallet
The main body that substrate-placing pallet 100 connects is when being fixed, and substrate-placing is with the master of pallet 100
Between body unfolded to without width or occur between face end poor on the body.Exemplary enforcement
In example, the expansion structure 400 of substrate-placing pallet can also possess connecting portion part 300, Gu
The main body of fixed interconnective substrate-placing pallet 100.Such as, multiple connecting portions part 300
The periphery of the main body of adjacent substrate-placing pallet 100 can be connected and be fixed.Thus,
The structural stability of the expansion structure 400 of substrate-placing pallet can be promoted.Diagram in Figure 16
Although the expansion structure 400 of substrate-placing pallet includes two connecting portion parts 300, but connects
The quantity connecing fixed component 300 can be increased or decreased according to the size of substrate-placing pallet 100.
Figure 20 to Figure 22 is to hold in the palm according to the substrate-placing of the exemplary embodiments of the present invention for explanation
The sectional view of the connecting portion part of the expansion structure of dish.In Figure 20 to Figure 22, for Figure 16
Identical parts will use identical reference marks.
With reference to Figure 20, the connecting portion part of the expansion structure of described substrate-placing pallet can wrap
Include: resettlement section 330a and insertion section 330b.Now, the resettlement section 330a of described connecting portion part
May include that the groove of the periphery of the main body being formed at substrate-placing pallet 100.According to these
Groove, can form end difference portion between the periphery of described main body.The insertion of described connecting portion part
Portion 330b can possess projection, inserts the groove of resettlement section 330a.Such as, insertion section 330b can
To have the shape of substantive " U " word rotating about 180 degree.Additionally, include the receipts of described groove
Appearance portion 330a may correspond to insertion section 330b and has substantive " U " rotating about 180 degree
The shape of word.In the expansion structure of the substrate-placing pallet that Figure 20 illustrates, described connecting portion
The insertion section 330b of part is incorporated into resettlement section 330a, so that adjacent substrate-placing pallet 100
It is connected with each other and fixing.Herein, the width of the groove of resettlement section 330a respectively can be with insertion section 330b
Protruding width substance similar or substantive big.In exemplary embodiments, described connecting portion
The resettlement section 330a of part can be by the periphery of substrate-placing pallet 100 main body with the width specified
Partial removal is formed.Additionally, the insertion section 330b of described connecting portion part can by with base
Onboard put or substantive similar material substantive identical by the main body of pallet 100 and constitute.In this receipts
Appearance portion 330a inserts insertion section 330b, so that substrate-placing pallet 100 connects forms institute
State the expansion structure of substrate-placing pallet.Herein, described connecting portion part has said structure,
Therefore the connective stability of substrate-placing pallet 100 can be promoted.
With reference to Figure 21, according to the connecting portion part of still another embodiment, may include that resettlement section
340a, insertion section 340b and joint portion 340c.Resettlement section 340a can partial removal substrate-placing
Formed with the upper side end of the main body of pallet 100.Such as, two adjacent main bodys can share one
Individual resettlement section 340a.Insertion section 340b may be inserted into and be fixed on resettlement section 340a.Insertion section 340b
Can have little size similar or substantive with resettlement section 340a substance.Joint portion 340c is permissible
Formed to insertion section 340b from the bottom surface of two adjacent main bodys.Such as, joint portion 340c can wrap
Including: screw or pin, through described main body is also buried and is stood on insertion section 340b.Although Figure 21 illustrates
Joint portion 340c includes two screws, but the quantity constituting the screw of joint portion 340a can root
Different by the size of pallet 100 according to substrate-placing.As it has been described above, described substrate-placing pallet
Expansion structure, when possessing connecting portion part as shown in figure 21, can make substrate-placing pallet
The main body of 100 more stably connects and fixing.
With reference to Figure 22, according to the connecting portion part of yet another illustrative embodiment, can possess: on
Resettlement section, portion 350a, resettlement section, bottom 351a, insertion section, top 350b, lower insert portion 351b and
Joint portion 353.Resettlement section, top 350a can be formed at the master of adjacent substrate-placing pallet 100
The upper side end of body, resettlement section, bottom 351a can be provided in the downside end of the main body adjoined.That is,
Two adjacent main bodys can share top resettlement section 350a and resettlement section, a bottom respectively
351a.Herein, the size of resettlement section, top 350a can equivalently-sized with resettlement section, bottom 351,
Can also be different.Resettlement section, top 350b and resettlement section, bottom 351b is inserted into top respectively and receives
Appearance portion 350a and resettlement section, bottom 351a also fixes.Top and lower insert portion 350b, 351b can
And have respectively with top and the similar or substantive little chi of resettlement section, bottom 350a, 351a substance
Very little.Joint portion 353 can be stood on a part for through lower insert portion 351b and described main body burying
Insertion section, top 350b.Such as, joint portion 353 may include that screw or pin, inserts from bottom
Portion 351b extends to a part of insertion section, top 350b.The screw quantity of this joint portion 353 can
It is increased or decreased with the size according to substrate-placing pallet 100.Described substrate-placing pallet
When expansion structure possesses connecting portion part as shown in figure 22, substrate-placing pallet can be made more
Add and stably connect and fixing.
In the connecting portion part of exemplary embodiments, above the insertion section 330b shown in Figure 20,
The above of insertion section, top 350b shown in above and Figure 22 of the insertion section 340b shown in Figure 21 can
In the plane that the above substance of the main body to be positioned at and connect respectively is identical.According to another exemplary reality
Execute example, above the insertion section 330b shown in Figure 20, above the insertion section 340b shown in Figure 21
And insertion section, the top 350b shown in Figure 22 above can from the main body connected respectively above with rule
Fixed height protrudes.Additionally, the bottom surface of the lower insert portion 351b shown in Figure 22 may be located at and institute
State in the substantive identical plane in bottom surface of main body, it is also possible to from the bottom surface of described main body with specified altitude
Protrude downwards.On the other hand, described in the bottom surface of the joint portion 340c described in Figure 21 and Figure 22
The bottom surface of joint portion 353 may be located in the plane identical with the bottom surface substance of the main body connected, also
Can protrude downwards with specified altitude from the bottom surface of described main body.
According to another exemplary embodiments, the insertion shown in insertion section 330b, Figure 21 described in Figure 20
Insertion section, top 350b shown in portion 340b, Figure 22 and lower insert portion 351b is respectively in order to prevent
Electric arc, it is possible to use pottery, the metal processed through ceramic coating, graphite etc. are formed.
Substrate-placing is formed according to the substrate-placing pallet of exemplary embodiments as it has been described above, connect
During with the expansion structure of pallet, the main body of interconnective substrate-placing pallet can use more than one
Connecting portion part be attached, such that it is able to prevent the main body of substrate-placing pallet connected
Between between unfolded distance or the main body of substrate-placing pallet occur end poor.Thus, even if connecting many
When individual substrate-placing pallet forms the expansion structure of substrate-placing pallet, it is also possible to promote described
The stability of the expansion structure of substrate-placing pallet.
Below, the substrate-placing pallet of the experimental example according to the present invention and comparative example will be had
Physical characteristic illustrates.
Substrate-placing pallet according to experimental example 1 is to use orthogonal anisotropy lamination reinforcer manufacture,
Substrate-placing pallet according to experimental example 2 is to use plain weave lamination reinforcer manufacture.According to experimental example
Substrate-placing pallet be use nonwoven fabric laminate reinforcer manufacture, according to the substrate-placing of comparative example
It is to use the conventional substrate-placing pallet being made up of graphite material with pallet.Now, according to experiment
Example 1 to experimental example 3 with the substrate-placing pallet of comparative example with the thickness of about 7mm degree is respectively
Benchmark is provided with identical area.Below, table 1 for measure according to experimental example 1 to experimental example 3 with than
The result of the physical characteristic of the substrate-placing pallet of relatively example.
Table 1
| Bending strength [MPa] | Shore hardness | Thermal coefficient of expansion [× 10-6/℃] | |
| Experimental example 1 | 140-160 | 72-81 | 0.5-2.0 |
| Experimental example 2 | 150-170 | 70-82 | 0.2-0.5 |
| Experimental example 3 | 130-150 | 77-85 | 0.1-0.3 |
| Comparative example | 40-60 | 45-60 | 4.8-5.5 |
Bending strength (flexural strength) is evaluated
For the substrate-placing pallet of experimental example 1 to experimental example 3 with comparative example, according to [KSL 1591]
Experiment regulation, measure bending strength through for several times.
As shown in Table 1 above, it is about according to the bending strength of the substrate-placing pallet of experimental example 1
140MPa to about 160MPa degree, according to the bending strength of the substrate-placing pallet of experimental example 2
It is about 150MPa to about 170MPa degree.The bending resistance of the substrate-placing pallet according to experimental example 3
Intensity is about 130MPa to about 150MPa degree, anti-according to the substrate-placing pallet of comparative example
Curved intensity is about 40MPa to about 60MPa degree.
Survey from according to the bending strength of experimental example 1 to experimental example 3 with the substrate-placing pallet of comparative example
Amount result understands, according to the substrate-placing pallet of the present invention compared to conventional substrate-placing pallet
There is the bending strength at least improving more than three times.Thus it has been confirmed that according to the substrate of the present invention
Mounting pallet, compared to the substrate-placing pallet being made up of graphite material in the past, can have relatively
Can have broader area while thin thickness, and can have be greatly improved strong
Degree.
Shore hardness (Shore hardness) is evaluated
For the substrate-placing pallet of experimental example 1 to experimental example 3 with comparative example, according to [KSL 0807]
Experiment regulation, measure Shore hardness through for several times.
As shown in Table 1 above, it is about 72 according to the Shore hardness of the substrate-placing pallet of experimental example 1
To about 81 degree, it is about 70 to about 82 according to the Shore hardness of the substrate-placing pallet of experimental example 2
Degree.The Shore hardness of the substrate-placing pallet according to experimental example 3 is about 77 to about 85 degree,
The Shore hardness of the substrate-placing pallet according to comparative example is about 45 to about 60 degree.
Survey from according to the Shore hardness of experimental example 1 to experimental example 3 with the substrate-placing pallet of comparative example
Amount result understands, according to the substrate-placing pallet of the present invention compared to conventional substrate-placing pallet
There is more excellent Shore hardness characteristic.
Thermal coefficient of expansion (Thermal expansion coefficient) evaluates unit (× 10-6/℃)
For the substrate-placing pallet of experimental example 1 to experimental example 3 with comparative example, about 1200 DEG C of journeys
In the temperature of degree, specify according to the experiment of [KSLM ISO 12987], measure through for several times hot swollen
Swollen coefficient.
As shown in Table 1 above, it is about according to the thermal coefficient of expansion of the substrate-placing pallet of experimental example 1
0.5×10-6/ DEG C to about 2.0 × 10-6/ DEG C degree, according to the heat of the substrate-placing pallet of experimental example 2
The coefficient of expansion is about 0.2 × 10-6/ DEG C to about 0.5 × 10-6/ DEG C degree.Substrate according to experimental example 3 carries
Put and be about 0.1 × 10 with the thermal coefficient of expansion of pallet-6/ DEG C to about 0.3 × 10-6/ DEG C degree, according to comparing
The thermal coefficient of expansion of the substrate-placing pallet of example is about 4.8 × 10-6/ DEG C to about 5.5 × 10-6/ DEG C journey
Degree.
From the thermal coefficient of expansion measurement result of the substrate-placing pallet according to experimental example 1, according to
The substrate-placing pallet of the present invention has more excellent heat compared to conventional substrate-placing pallet
The coefficient of expansion.Thus it has been confirmed that according to the substrate-placing pallet of the present invention compared to conventional stone
The substrate-placing pallet of ink material has more excellent heat durability.
Figure 23 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
With the plane graph of pallet, Figure 24 is the section view of the solar cell substrate mounting pallet representing Figure 23
Figure.
With reference to Figure 23 and Figure 24, substrate-placing pallet 500 is using plasma enhanced chemical gas
Phase precipitation equipment to be formed as during the thin film of antireflection film etc. on solar cell substrate, Ke Yizai
Put multiple substrate 600.In exemplary embodiments, substrate-placing pallet 500 can possess: main body
511, ceramic coating 515, guide portion 513 etc..
According to exemplary embodiments, main body 511 may include that first (above such as),
Two (such as, bottom surfaces) and side.Such as, the main body 511 of substrate-placing pallet 500 is permissible
There is substantive smooth plate shape.Multiple substrate 600 can be disposed on first of main body 511,
Thus perform to be formed the operation of thin film on substrate 600.Second of main body 511 can substantive with
It is placed in lower plane heat source (not shown) isologue of main body 511.Such as, the of main body 511 it is adjacent to
The described thermal source of two, may include that heating plate, heating lamp etc., for being placed in substrate load
Put and heat with the substrate 600 of pallet 500.Described thermal source can be placed in the second of main body 511
Below face, it is also possible to be placed in and substrate 600 is heated in the range of set point of temperature being adjacent to main body
The position of 511.
The operation forming described thin film on substrate 600 is the phase about 300 DEG C to about 700 DEG C degree
High temperature is performed under plasma atmosphere, it is therefore desirable to using can also under high temperature and plasma atmosphere
Stably maintain the material of physical characteristic to form main body 511.Such as, substrate-placing pallet 500
Main body 511 can be made up of graphite, carbon-carbon composite etc..Substrate-placing is with the master of pallet 500
Body 511 may include that when being made up of carbon-carbon composite, and main body 511 is strengthened by woven carbon fibre
Composite and the fabric that manufactures；Or carbon fiber-reinforced composite material is fabricated to knitting of non-woven fabrics form
Thing.
In exemplary embodiments, the main body 511 of substrate-placing pallet 500 can have lamination two
The structure of the strengthening of above fabric.Such as, the substrate-placing main body 511 of pallet 500, can wrap
Include: plain weave lamination reinforcer, have that lamination is manufactured by woven carbon fibre reinforced composite material two
The structure of individual above fabric.Additionally, main body 511, may include that twill lamination reinforcer, tool
There is the structure of the fabric of lamination two or more twill weave；Or satin weave lamination reinforcer, has lamination
The woven fabric construction of plural satin weave.On the other hand, main body 511, it is also possible to including: just
Hand over anisotropy lamination reinforcer, have and knit so that different direction is woven so that different direction lamination is plural
The structure of thing.
In exemplary embodiments, substrate-placing pallet 500, may include that ceramic coating 515,
Be formed at first of main body 511 with on side.According to another exemplary embodiments, ceramic coating 515
On the edge (that is, periphery) of can also be formed at main body 511 second.Ceramic coating
515, the main body 511 at the substrate-placing pallet 500 including graphite or carbon-carbon composite uses
Plasma enhanced chemical vapor deposition unit to be formed such as reflective film on solar cell substrate
Deng thin film formation process during, be possible to prevent corrosion or the etching caused by high temperature and plasma.
According to exemplary embodiments, ceramic coating 515 may include that aluminum oxide, yttrium oxide,
The oxidation system pottery of Zirconium oxide etc..They can be used alone or be mutually combined use.
Additionally, ceramic coating 515, it is possible to use air plasma spraying (APS) coating procedure, at a high speed
Oxygen fuel sprays (HVOF) operation, vacuum plasma sprays paint (VPS) operation, power spray (kinetic
Spray) coating procedure etc. are formed.Such as, ceramic coating 515 can pass through, will by aluminum oxide,
The spray-on coating powder that yttrium oxide, Zirconium oxide etc. are constituted is by air plasma spraying coating procedure
It is ejected in the main body 511 of substrate-placing pallet 500 and obtains.
In another exemplary embodiments, ceramic coating 515, in addition to above-mentioned oxidation system pottery,
Can also include: the non-oxide system such as aln precipitation, silicon carbide pottery.Ceramic coating 515 includes
During non-oxide system pottery, it is possible to use power spray coating procedure, aerosol evaporation operation etc. will be made pottery
Porcelain coating 515 is formed in main body 511.
Ceramic coating 515 have about 100 μm less than thickness time, a part for main body 511 has can
Can cannot be adequately formed ceramic coating 515.Now, main body 511 can be caused to expose or ceramic coating
515 there is pin hole, and are caused ceramic coating 515 impaired by high temperature and plasma.Ceramic coating 515
When having the thickness exceeding about 400 μm, between main body 511 and ceramic coating 515, adhesion can be low
Cause ceramic coating 515 to depart from from main body 511, thus do not only result in substrate-placing pallet 500
The flatness on surface is low, and the central part of substrate-placing pallet 500 can be caused to bend.Therefore,
Ceramic coating 515 can be on the basis of the surface of main body 511, with about 100 μm to 400 μ m thick shapes
Become.
In exemplary embodiments, ceramic coating 515 can be formed at first and side of main body 511
On, furthermore, it is possible to extend on the periphery of second of main body 511.Thus, ceramic coating 515,
During described thin film formation process, can protect and be exposed to the of high temperature and isoionic main body 511
Simultaneously, the periphery of second of the side of main body 511 and main body 511.
According to exemplary embodiment, because substrate-placing pallet 500 can possess is formed at main body
Ceramic coating 515 on 511, when therefore forming thin film on substrate 600, be possible to prevent by high temperature and
The main body 511 that plasma causes is corroded or etches.Because the substrate-placing including ceramic coating 515 is used
Pallet 500 can also stably maintain physical characteristic under high temperature and plasma atmosphere, therefore can prolong
The life-span of long substrate-placing pallet 500, and substrate-placing pallet 500 can be made to be more prone to
Process, it is also possible to the flatness being substantially prevented from substrate-placing pallet 500 is low.Its result is, profit
When adding hot substrate 600 with substrate-placing pallet 500, the heat of substrate 600 can be maintained constantly
Pass on uniformity and the efficiency of heating surface.
On the other hand, substrate-placing with in the main body 511 of pallet 500 formed ceramic coating 515 time,
Pin hole can occur in a part for ceramic coating 515.Such as, the substrate-placing being made up of graphite is used
When forming ceramic coating 515 in the main body 511 of pallet 500, ceramic coating 515 almost may not be used
There is pin hole.Compared to this, the master of the substrate-placing pallet 500 being made up of carbon-carbon composite
When forming ceramic coating 515 on body 511, a part for ceramic coating 515 can occur pin hole.
When forming pin hole on ceramic coating 515, during described thin film formation process, described pin hole portion meeting
Because momentary ground electric charge and current convergence cause arc phenomenon.
In exemplary embodiments, it is contemplated that the generation of the pin hole of ceramic coating 515, described in including
In a part for the ceramic coating 515 of pin hole, also form the surface being made up of ceramic bonding agent and process
Layer (not shown).Such as, described surface-treated layer fills and leads up described pin hole, and is formed at pottery
In a part for coating 515.Herein, the ceramic bonding agent of described surface-treated layer can be by, mixing
Have for water, acid, alkali, oil, solvent etc. have outstanding repellence inorganic matter oxidation system pottery
Porcelain is constituted.
In exemplary embodiments, the part that the pin hole of ceramic coating 515 occurs is coated with described pottery
After bonding agent, room temperature performs the spontaneous curing operation of about 24 hours to obtain the process of described surface
Layer.According to another exemplary embodiments, at a temperature of room temperature to about 50 DEG C, to coating pottery painting
Ceramic bonding agent in the pin hole generation part of layer 515 carries out about 30 minutes to about 90 minutes de-
After fat process or dehydration, at a temperature of about 100 DEG C to about 200 DEG C, perform about 60 minutes to about
The hot setting operation of 180 minutes forms described surface-treated layer.In yet another illustrative embodiment,
Only at a temperature of about 100 DEG C to about 200 DEG C degree, to the pin hole coating ceramic coating 515
The ceramic bonding agent in part occurred carries out the hot setting operation of about 60 minutes to about 180 minutes
Form described surface-treated layer.That is, the surface-treated layer being made up of described ceramic bonding agent, permissible
Utilize spontaneous curing operation, follow-up in skimming processes or the high temperature cure process of dehydration or high temperature
Solidification processs etc. are formed.Described dehydration or described skimming processes perform about 30 minutes less than time,
Cannot successfully constitute dehydration or the defat of described ceramic bonding agent.Described dehydration or described defat
When process performs to exceed about 90 minutes, the process efficiency that can make the described surface-treated layer of formation is low.
Additionally, described high temperature cure process about 100 DEG C less than at a temperature of perform time, it is impossible to the completeest
Become the hardening of ceramic bonding agent；Described high temperature cure process more than about 200 DEG C at a temperature of perform time,
Carbon in described ceramic bonding agent can be changed to carbon dioxide in the way constituting solidification and cause described
The density of surface-treated layer is low.
According to the exemplary embodiments of the present invention, substrate-placing pallet 500, process ceramic coating 515
In addition, it is also possible to including: surface-treated layer, the defect being used for covering described thin film formation process causes
The pin hole of the ceramic coating 515 occurred.Thus, substrate-placing pallet 500 can maintain more
Stable physical characteristic, and zero defect can be formed on substrate 600, be formed uniformly thin film.
In another exemplary embodiments, described surface-treated layer is not only at ceramic bonding agent 515 generator tube
In the part in foot hole, but also drawing on can being formed at first that is arranged in main body 511 described later
Lead portion 513 pin periphery with in the part being formed without ceramic coating 515 main body 511.This
Outward, it is easy with ceramic coating 515 that the surface-treated layer being made up of described ceramic bonding agent can also be formed
From the part that main body 511 departs from.Herein, the portion that ceramic coating 515 easily departs from from main body 511
Point can correspond to, part that the pin of guide portion 513 disposes, the entrance of air flow circuit described later with
A part for the ceramic coating 515 that the part iso-stress that side connects is concentrated.Described surface-treated layer shape
When one-tenth and ceramic coating 515 are easily from the part that main body 511 departs from, substrate can be promoted further
The uniformity of the described thin film formed on 600.
During utilizing the described thin film formation process of substrate-placing pallet 500, because at substrate-placing
With loading multiple substrate 600 on pallet 500, the most multiple substrates 600 can be placed in main body 511
First on the assigned position that is mutually separated by.Now, main body 511 provides guide portion 513, can
To guide substrate 600, make the assigned position that substrate 600 is placed on first of main body 511.
Such as, during first of main body 511 two above substrates 600 of upper mounting, guide portion 513 can be drawn
Lead substrate 600 and be separated from each other the position of regulation.
In exemplary embodiments, guide portion 513, may include that a bag portion (pocket) 531, intaglio
It is machined in first of main body 511, by each for the substrate 600 on first that is placed in main body 511
From being separated from each other and housing.For example, it is possible to carry out shape with a part for the shape removal main body 511 of regulation
Become bag portion 531.When performing the operation for forming described thin film, substrate 600 can be contained in respectively
In the bag portion 531 of guide portion 513.In another exemplary embodiments, guide portion 513 may include that
The bag portion protruded with specified altitude from main body 511.Such as, garland processing main body 511 forms a bag portion
531。
Figure 25 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
Sectional view by the guide portion of pallet.
With reference to Figure 25, guide portion 513 may include that pin (pin) 551, is arranged in main body 511
First on, the substrate on first that is placed in main body 511 is each separated from each other and houses.
When substrate 600 performs the operation forming described thin film, substrate 600 can be made to be positioned at pin 551
In the region limited.Such as, the pin 551 of guide portion 513 respectively can be by, pottery, metal,
Graphite, carbon-carbon composite, the material etc. that processes through anodized material, ceramic coating come
Constitute.The pin 551 of guide portion 513 likely act as occurring during described thin film formation process
The factor of electric arc (arcing), therefore pin 551 is more preferably, pottery or ceramic coating process
Material constitute.
In another exemplary embodiments, the substrate-placing guide portion 513 of pallet 500, may include that
The pass-through pocket of hole shape；And protrusion pin, protrude from the side of described pass-through pocket, support to be accommodated in
The bottom surface of the substrate 600 of this pass-through pocket.As it has been described above, substrate can be supported by guide portion 513
The bottom surface of 600 is exposed to the direction, downside of main body 511.Including described pass-through pocket and described protrusion pipe
The guide portion 513 of foot, because the bottom surface of substrate 600 can be made to expose, therefore can make thin film more hold
Change places on the bottom surface being formed at substrate 600.Such as, described protrusion pin may include that pottery, gold
Genus, graphite, carbon-carbon composite, through anodized material, ceramic coating process material
Deng.Described protrusion pin more preferably includes: as the metal of conductive material, thus is performing
During described thin film formation process, described thin film is made more successfully to be formed on substrate 600.
As it has been described above, substrate-placing pallet 500 can possess the guide portion 13 with various structures.
Thus, the structure of substrate-placing pallet 500 suitably can change according to multiple requirement.
Figure 26 is the solar cell substrate for another exemplary embodiments according to the present invention is described
The air circulation portions plane graph of mounting pallet, Figure 27 and Figure 28 utilizes Figure 26 for explanation
Air circulation portions loads the sectional view of the process of substrate.
Reference Figure 26, the air circulation portions 591 of solar cell substrate mounting pallet, can be at base
Plate 600 respectively during first top of the main body 511 of substrate-placing pallet 500 is transferred,
Air is provided on the bottom surface of substrate 600.From substrate-placing the first of the main body 511 of pallet 500
When carried base board 600 is unloaded in face, between bottom surface and first of main body 511 of substrate 600, air can occur
Resistance, its result causes constituting substrate 600 and successfully unloads.Such as, by substrate 600 from base
Onboard put when unloading by the main body 511 of pallet 500, betide the sky of the bottom surface of substrate 600 because of moment
Atmidometer causes substrate 600 not depart from from substrate-placing pallet 500.From substrate-placing pallet 500
Main body 511 when unloading carried base board 600, air circulation portions 591 provides empty on the bottom surface of substrate 600
Gas, reduces above-mentioned air drag, so that substrate 600 successfully unloads.
In exemplary embodiments, air circulation portions 591, can possess: airport 591a, from main body
Second of 511 through to main body 511 first, thus it is placed in assigned position at substrate 600
Time, air is provided to the bottom surface of substrate 600 naturally；And air flow circuit 591b, in main body 511
First upper and airport 591a UNICOM, and has groove shape.
With reference to Figure 27 and Figure 28, by substrate 600 from the substrate-placing main body 511 of pallet 500
During the unloading of top, it is circulated by air circulation portions 591 and naturally supplies to the bottom surface of substrate 600
To air.As it has been described above, along with bottom surface and the substrate-placing main body 511 of pallet 500 of substrate 600
Between occur air drag reduce, substrate 600 can be successfully from substrate-placing pallet 500
Main body 511 unloads.That is, air circulation portions 591 is utilized naturally to carry out air circulation, the most permissible
More stably unload carried base board 600.
According to exemplary embodiments, air circulation portions 591, it is loaded in main body 511 at substrate 600
Time, it is also possible to air is provided naturally on the bottom surface of substrate 600, such that it is able to effectively place,
The air pressure occurred because of the bottom surface of substrate 600 causes the phenomenon that substrate 600 slides from main body 511.
During as it has been described above, substrate-placing pallet 500 possesses air supply unit 591, can be more prone to and
Stably process substrate 600.
In exemplary embodiments, substrate-placing is with forming pottery on the bottom surface of the main body 511 of pallet 500
In the case of coating 515, during the sections transverse that the entrance of air flow circuit 591b is connected with side, stress
Can concentrate on this coupling part, its result causes ceramic coating 515 to depart from from main body 511.Therefore,
The part that the entrance of the groove shape of air flow circuit 519 is connected with side forms the knot as narrowed downwards
Structure, the structure etc. of substantive rounding are formed obliquely, and thus can disperse to concentrate on air flow circuit 591b
The stress of entrance and side connection portion, its result is, can effectively place air flow circuit 591b
The part that is connected with side of entrance in the phenomenon that departs from of ceramic coating 515.
Figure 29 is the solar cell substrate mounting representing another exemplary embodiments according to the present invention
With the plane graph of the expansion structure of pallet, Figure 30 is for illustrating that the solar cell substrate of Figure 29 carries
Put the sectional view of the ceramic coating of the expansion structure using pallet.
With reference to Figure 29, the main body of substrate-placing pallet 500 can be connected with each other to form substrate-placing
With the expansion structure 700 of pallet.Such as, it is connected with each other plural substrate-placing pallet 500
Main body realize the expansion structure 700 of substrate-placing pallet.Connect at least two substrate-placing to use
When pallet 500 forms the expansion structure 700 of substrate-placing pallet, solar energy can be greatly promoted
The manufacture of cell substrates act as the productivity of key factor.
With reference to Figure 30, it is connected with each other the main body of substrate-placing pallet 500 to form substrate-placing torr
During the expansion structure 700 of dish, the part of the ceramic coating 515 being formed in described main body can have
Different thickness.Such as, during described thin film formation process, affected as by high temperature and plasma
The described main body of relatively large part may be formed over relatively thick ceramic coating 515, make
For being affected the periphery of the side F and bottom surface F' of relatively small described main body by high temperature and plasma
On can form relatively thin ceramic coating 515.
As it has been described above, connect substrate-placing pallet 500 to form the extension knot of substrate-placing pallet
During structure 700, the interconnective part of main body of substrate-placing pallet 500 (such as, carries from substrate
Put and be connected to part E of bottom surface, E' with the body upper of the expansion structure 700 of pallet) because
The effect affected by high temperature and plasma during described thin film formation process is relatively small, the most permissible
Form relatively thin ceramic coating 515.
According to the exemplary embodiments of the present invention, the main body of the expansion structure 700 of substrate-placing pallet
Side F and bottom surface F' periphery and interconnective part E of described main body, E' on pottery painting
The thickness of layer 515 can be real compared to the thickness of the ceramic coating 515 in other parts of described main body
Matter is thin.Such as, the thickness of the ceramic coating 515 on interconnective part E of described main body, E'
Can be about 100 μm to 200 μm degree, including the pottery in other above parts of described main body
The thickness of coating 515 can be about 150 μm to 400 μm.
In exemplary embodiments, the expansion structure 700 of substrate-placing pallet, as shown in figure 29, peace
Put the master of a substrate-placing pallet 500 of the groove of the shape of " U " word with about 90-degree rotation
Body, after another substrate-placing is with formation protuberance in the main body of pallet 500, another is main
The protuberance of body is inserted in the groove of a main body and is formed.The expansion structure of substrate-placing pallet
700, it is being connected with each other the main body of groove and the protuberance with the "U" shaped shape of 90-degree rotation respectively
When being formed, the main body of the expansion structure 700 of substrate-placing pallet above and connecting above these
Connect to lower side to interface on could be formed with ceramic coating 515, the central authorities of the side of described main body
Portion can get involved the space of regulation and mutually be separated by.The pottery being formed on the interface between described main body
Coating 515 is possible to prevent, and plasma is upper from the main body of the expansion structure 700 of substrate-placing pallet
Face, along the contacting permeation connected to direction, bottom surface, causes wounded substrate mounting pallet 500.Additionally,
Along with the lateral parts of described main body is separated by, substrate-placing torr can be housed during high-temperature process
The contraction of dish 500 and/or expansion.Additionally, the main body of the expansion structure 700 of substrate-placing pallet it
Between interface on be formed without ceramic coating 515, make substrate-placing pallet 500 contact.Form base
Onboard when putting with the expansion structure 700 of pallet, when not constituting energising between substrate-placing pallet 500,
Described thin film can substance be formed on described substrate unevenly, therefore can contact substrate-placing and use
Pallet 500 forms the expansion structure 700 of substrate-placing pallet.For this contact, substrate carries
Put and can be formed without ceramic coating 515 in a part for the main body with the expansion structure 700 of pallet.
According to exemplary embodiments, connect substrate-placing pallet 500 and form substrate-placing pallet
Expansion structure 700 time, it is also possible to possess connecting portion part 550, be used for fixing interconnective
Main body.Along with the expansion structure 700 of substrate-placing pallet possesses connecting portion part 550, permissible
Promote the connection of described main body and fixing stability, thus can improve, substrate-placing pallet
The structural stability of expansion structure 700.This connecting portion part 550, can be with reference Figure 20
Substantive identical to connecting portion part 300 that Figure 22 illustrates or there is substantive similar structure.
Below, the characteristic of the ceramic coating of the substrate-placing pallet of the experimental example according to the present invention is entered
Row explanation.
In experimental example 4, manufacture substrate-placing pallet, including: utilize air plasma spraying to be coated with
Layer operation is coated with the ceramic coating of aluminum oxide in the main body being made up of orthogonal anisotropy reinforcer.This
Time, it is about 100 μm degree according to the thickness of the ceramic coating of experimental example 4.In experimental example 5, except
Ceramic coating has beyond the thickness of about 250 μm, has manufactured the substrate-placing identical with experimental example 4 and has used
Pallet.In experimental example 6, in addition to the thickness that ceramic coating has about 350 μm, manufacture and reality
Test the substrate-placing pallet that example 4 is identical.According to experimental example 7, except ceramic coating has about 400
Beyond the thickness of μm, manufacture the substrate-placing pallet identical with experimental example 4.In experimental example 8,
In addition to the thickness that ceramic coating has about 90 μm, manufacture the substrate identical with experimental example 4 and carried
Put and use pallet.According to experimental example 9, in addition to the thickness that ceramic coating has about 410 μm, manufacture
The substrate-placing pallet identical with experimental example 4.Below, table 2 includes according to experimental example for measurement
The result of the characteristic of the substrate-placing pallet of the ceramic coating of 4 to experimental example 9.
Table 2
| The flatness of pallet | Bending wire [mm] | Main body is exposed | Adhesion [MPa] | |
| Experimental example 4 | 0.65 | 1.2 | x | 6.2 |
| Experimental example 5 | 0.71 | 0.7 | x | 6.7 |
| Experimental example 6 | 0.98 | 1.5 | x | 5.8 |
| Experimental example 7 | 1.72 | 2.5 | x | 5.9 |
| Experimental example 8 | 0.68 | 1 | o | 5.8 |
| Experimental example 9 | 2.98 | 4.5 | x | 4.5 |
The flatness evaluation of substrate-placing pallet
The flatness of the substrate-placing pallet according to experimental example 4 to experimental example 9 is to be the most all by 25
The measured value in individual place is calculated as meansigma methods.As shown in described table 2, carry according to the substrate of experimental example 4
Put and be about 0.65 degree by the flatness of pallet, smooth according to the substrate-placing pallet of experimental example 5
Degree is about 0.71 degree, is about 0.98 journey according to the flatness of the substrate-placing pallet of experimental example 6
Degree, is about 1.72 degree, according to experimental example according to the flatness of the substrate-placing pallet of experimental example 7
The flatness of the substrate-placing pallet of 8 is about 0.68 degree, uses according to the substrate-placing of experimental example 9
The flatness of pallet is about 2.98 degree.
Confirmation result from the flatness of the substrate-placing pallet according to experimental example 4 to experimental example 9 can
Know, during the ceramic coating of the thickness that the main body of substrate-placing pallet forms over about 400 μm, base
Onboard putting can be low by the flatness of pallet.
The bending wire evaluation of substrate-placing pallet
During the bending wire of substrate-placing pallet is measured, respectively will be according to experimental example 4 to experimental example 9
Substrate-placing pallet vertical erect, measure according to experimental example 4 to reality at both sides connection wire
Test the degree of crook in each centre of the substrate-placing pallet of example 9.As shown in described table 2,
Substrate-placing pallet according to experimental example 4 has bent about 1.2mm degree, according to the base of experimental example 5
Onboard putting has bent about 0.7mm degree with pallet, bends according to the substrate-placing pallet of experimental example 6
About 1.5mm degree, has bent about 2.5mm degree according to the substrate-placing pallet of experimental example 7,
Substrate-placing pallet according to experimental example 8 has bent about 1.0mm degree, according to the base of experimental example 9
Onboard putting has bent about 4.5mm degree with pallet.
Bending wire evaluation result from the substrate-placing pallet according to experimental example 4 to experimental example 9 can
Know, during the ceramic coating of the thickness that the main body of substrate-placing pallet forms over about 400 μm, base
Onboard putting can bend the biggest with pallet.
The main body (mother metal) of substrate-placing pallet exposes evaluation
Observe by the naked eye the mother metal performing the substrate-placing pallet according to experimental example 4 to 9
(main body) exposes evaluation.As shown in described table 2, according to experimental example 4 to experimental example 7 and experimental example
Unconfirmed in the case of the substrate-placing pallet of 9 expose to mother metal, but according to the base of experimental example 8
Onboard putting is exposed with having confirmed mother metal in the case of pallet.
Knowable to the mother metal (main body) of the substrate-placing pallet according to experimental example 4 to 9 exposes evaluation,
When forming about 100 μm in the main body of substrate-placing pallet less than the ceramic coating of thickness, as mother metal
Main body can expose.
The adhesion evaluation of ceramic coating
As shown in described table 2, measure the adhesion of the ceramic coating according to experimental example 4 to experimental example 9
Result be to be about 6.2MPa degree according to the adhesion of the ceramic coating of experimental example 4, according to reality
The adhesion of the ceramic coating testing example 5 is about 6.7MPa degree, according to the ceramic coating of experimental example 6
Adhesion be about 5.8MPa degree, be about according to the adhesion of the ceramic coating of experimental example 7
5.9MPa degree, is about 5.8MPa degree according to the adhesion of the ceramic coating of experimental example 8, according to
The adhesion of the ceramic coating of experimental example 9 is about 4.5MPa degree.
From the adhesion evaluation result of the ceramic coating according to experimental example 4 to experimental example 9, substrate
When forming over the ceramic coating of about 400 μ m thick in the main body of mounting pallet, for described main body
The adhesion of ceramic coating can be low.
Knowable to above-mentioned experimental example 4 to experimental example 9, according to the ceramic coating of the present invention, carry with substrate
Put with the main body of pallet above on the basis of form the thickness of about 100 μm to 400 μm degree time, described
The physical characteristic of substrate-placing pallet can get a promotion.
As it has been described above, the exemplary embodiments with reference to the present invention is illustrated, technology belonging to the present invention
Field it will be appreciated by the skilled person that without departing from the thought of the present invention of the technical scope recorded and district
In the case of territory, the present invention can be carried out multiple modifications and changes.
The substrate-placing pallet of the exemplary embodiments according to the present invention, on solar cell substrate
When forming thin film, can also stably maintain physical characteristic in the high-temperature process of plasma ambient, also
Can have the large area that can load greater number of substrate.Described base is utilized thus, it is possible to promote
The onboard reliability putting the operation forming thin film with pallet on the substrate, it is also possible to promote solar energy
The productivity of cell substrates manufacturing process.Come easily furthermore, it is possible to connect described substrate-placing pallet
Form the expansion structure of substrate-placing pallet, therefore can more promote the production of substrate manufacture operation
Property.
Claims (7)
1. a substrate-placing pallet, it is characterised in that including:
Main body, has the slab construction of first that has possessed mounting substrate, and includes that carbon-to-carbon is combined
Material or graphite；And
Guide portion, guide described substrate towards described main body so that described substrate-placing is in each rule
Fixed position；
Described guide portion includes: pass-through pocket, exposes the bottom surface of described substrate；And protrusion pin, from institute
The inner face stating pass-through pocket protrudes, and supports the bottom surface of described substrate；
Ceramic coating, is formed at first and side and described guide portion of described main body；Described pottery
Coating includes: select free aluminum oxide (AlOx), yttrium oxide (YOx), aln precipitation (AlNx),
More than one in the group that silicon carbide (SiCx) is constituted；Described ceramic coating, has 100 μm extremely
The thickness of 400 μm；Described ceramic coating, is to utilize air plasma spraying (APS) coating procedure
Formed；Described ceramic coating, extends to in the of the described main body of first of described main body
The periphery of two；
Including the surface-treated layer of ceramic bonding agent, it is formed at the pin hole that has of described ceramic coating
Partly, the stress of described ceramic coating is concentrated part or be formed without the institute of described ceramic coating
State the part of main body；Described ceramic bonding agent includes: aluminum oxide；Described surface-treated layer, in institute
State after having in the part of pin hole and being coated with described ceramic bonding agent, the temperature of 100 DEG C to 200 DEG C
The middle execution hot setting operation of 60 minutes to 180 minutes is formed；
The expansion structure of substrate-placing pallet is formed by connecting plural described main body；
Described pottery in the contact portion of the described main body of the expansion structure of described substrate-placing pallet
The thickness of porcelain coating, the thickness of the described ceramic coating being thinner than in other parts of described main body；Described
The thickness of the described ceramic coating in the part of body contact is 100 μm to 200 μm, described main body
The thickness of the described ceramic coating in other parts is that 150 μm are to 400 μm；At described body contact
It is formed without described ceramic coating in a part in part, thus makes described substrate-placing pallet
The main body energising of expansion structure；
The expansion structure of described substrate-placing pallet also includes connecting portion part, for fixing mutual
The described main body connected；Described connecting portion part includes resettlement section, is formed at interconnective described
The upper side end of main body；Insertion section, is inserted into described resettlement section；And joint portion, from described main body
Bottom surface extends to a part for described insertion section.
2. a substrate-placing pallet, it is characterised in that including:
Main body, has the slab construction of first that has possessed mounting substrate, and includes that carbon-to-carbon is combined
Material or graphite；And
Guide portion, guide described substrate towards described main body so that described substrate-placing is in each rule
Fixed position；
Pore, through described main body, and described substrate-placing in the position of described regulation time, be used for
Air is provided to the bottom surface of described substrate；And air circulation portions, possess and the having of described pore UNICOM
The air flow circuit of groove shape；
Described air flow circuit, is formed obliquely the part being connected to entrance with side；
Ceramic coating, is formed at first and side and described guide portion of described main body；Described pottery
Coating includes: select free aluminum oxide (AlOx), yttrium oxide (YOx), aln precipitation (AlNx),
More than one in the group that silicon carbide (SiCx) is constituted；Described ceramic coating, has 100 μm extremely
The thickness of 400 μm；Described ceramic coating, has 100 μm thickness to 400 μm；Described pottery is coated with
Layer, is to utilize air plasma spraying (APS) coating procedure to be formed；Described ceramic coating, prolongs
Long to in the periphery of second of the described main body of first of described main body；
Including the surface-treated layer of ceramic bonding agent, it is formed at the pin hole that has of described ceramic coating
Partly, the stress of described ceramic coating is concentrated part or be formed without the institute of described ceramic coating
State the part of main body；Described ceramic bonding agent includes: aluminum oxide；Described surface-treated layer, in institute
State after having in the part of pin hole and being coated with described ceramic bonding agent, the temperature of 100 DEG C to 200 DEG C
The middle execution hot setting operation of 60 minutes to 180 minutes is formed；
The expansion structure of substrate-placing pallet is formed by connecting plural described main body；
Described pottery in the contact portion of the described main body of the expansion structure of described substrate-placing pallet
The thickness of porcelain coating, the thickness of the described ceramic coating being thinner than in other parts of described main body；Described
The thickness of the described ceramic coating in the part of body contact is 100 μm to 200 μm, described main body
The thickness of the described ceramic coating in other parts is that 150 μm are to 400 μm；At described body contact
It is formed without described ceramic coating in a part in part, thus makes described substrate-placing pallet
The main body energising of expansion structure；
The expansion structure of described substrate-placing pallet also includes connecting portion part, for fixing mutual
The described main body connected；Described connecting portion part includes resettlement section, is formed at interconnective described
The upper side end of main body；Insertion section, is inserted into described resettlement section；And joint portion, from described main body
Bottom surface extends to a part for described insertion section.
3. a substrate-placing pallet, it is characterised in that including:
Main body, has the slab construction of first that has possessed mounting substrate, and includes that carbon-to-carbon is combined
Material or graphite；And
Guide portion, guide described substrate towards described main body so that described substrate-placing is in each rule
Fixed position；
Described guide portion includes: pass-through pocket, exposes the bottom surface of described substrate；And protrusion pin, from institute
The inner face stating pass-through pocket protrudes, and supports the bottom surface of described substrate；
Ceramic coating, is formed at first and side and described guide portion of described main body；Described pottery
Coating includes: select free aluminum oxide (AlOx), yttrium oxide (YOx), aln precipitation (AlNx),
More than one in the group that silicon carbide (SiCx) is constituted；Described ceramic coating, has 100 μm extremely
The thickness of 400 μm；Described ceramic coating, is to utilize air plasma spraying (APS) coating procedure
Formed；Described ceramic coating, extends to in the of the described main body of first of described main body
The periphery of two；
Including the surface-treated layer of ceramic bonding agent, it is formed at the pin hole that has of described ceramic coating
Partly, the stress of described ceramic coating is concentrated part or be formed without the institute of described ceramic coating
State the part of main body；Described ceramic bonding agent includes: aluminum oxide；Described surface-treated layer, in institute
State after having in the part of pin hole and being coated with described ceramic bonding agent, the temperature of 100 DEG C to 200 DEG C
The middle execution hot setting operation of 60 minutes to 180 minutes is formed；
The expansion structure of substrate-placing pallet is formed by connecting plural described main body；
Described pottery in the contact portion of the described main body of the expansion structure of described substrate-placing pallet
The thickness of porcelain coating, the thickness of the described ceramic coating being thinner than in other parts of described main body；Described
The thickness of the described ceramic coating in the part of body contact is 100 μm to 200 μm, described main body
The thickness of the described ceramic coating in other parts is that 150 μm are to 400 μm；At described body contact
It is formed without described ceramic coating in a part in part, thus makes described substrate-placing pallet
The main body energising of expansion structure；
The expansion structure of described substrate-placing pallet also includes connecting portion part, for fixing mutual
The described main body connected；Described connecting portion part includes: resettlement section, top, is formed at and is connected with each other
The upper side end of described main body；Resettlement section, bottom, is formed at the downside end of described main body；Top
Insertion section, is inserted into resettlement section, described top；Lower insert portion, is inserted into resettlement section, described bottom；
And joint portion, a part for insertion section, described top is extended to from described lower insert portion.
4. a substrate-placing pallet, it is characterised in that including:
Main body, has the slab construction of first that has possessed mounting substrate, and includes that carbon-to-carbon is combined
Material or graphite；And
Guide portion, guide described substrate towards described main body so that described substrate-placing is in each rule
Fixed position；
Pore, through described main body, and described substrate-placing in the position of described regulation time, be used for
Air is provided to the bottom surface of described substrate；And air circulation portions, possess and the having of described pore UNICOM
The air flow circuit of groove shape；
Described air flow circuit, is formed obliquely the part being connected to entrance with side；
Ceramic coating, is formed at first and side and described guide portion of described main body；Described pottery
Coating includes: select free aluminum oxide (AlOx), yttrium oxide (YOx), aln precipitation (AlNx),
More than one in the group that silicon carbide (SiCx) is constituted；Described ceramic coating, has 100 μm extremely
The thickness of 400 μm；Described ceramic coating, has 100 μm thickness to 400 μm；Described pottery is coated with
Layer, is to utilize air plasma spraying (APS) coating procedure to be formed；Described ceramic coating, prolongs
Long to in the periphery of second of the described main body of first of described main body；
Including the surface-treated layer of ceramic bonding agent, it is formed at the pin hole that has of described ceramic coating
Partly, the stress of described ceramic coating is concentrated part or be formed without the institute of described ceramic coating
State the part of main body；Described ceramic bonding agent includes: aluminum oxide；Described surface-treated layer, in institute
State after having in the part of pin hole and being coated with described ceramic bonding agent, the temperature of 100 DEG C to 200 DEG C
The middle execution hot setting operation of 60 minutes to 180 minutes is formed；
The expansion structure of substrate-placing pallet is formed by connecting plural described main body；
Described pottery in the contact portion of the described main body of the expansion structure of described substrate-placing pallet
The thickness of porcelain coating, the thickness of the described ceramic coating being thinner than in other parts of described main body；Described
The thickness of the described ceramic coating in the part of body contact is 100 μm to 200 μm, described main body
The thickness of the described ceramic coating in other parts is that 150 μm are to 400 μm；At described body contact
It is formed without described ceramic coating in a part in part, thus makes described substrate-placing pallet
The main body energising of expansion structure；
The expansion structure of described substrate-placing pallet also includes connecting portion part, for fixing mutual
The described main body connected；Described connecting portion part includes: resettlement section, top, is formed at and is connected with each other
The upper side end of described main body；Resettlement section, bottom, is formed at the downside end of described main body；Top
Insertion section, is inserted into resettlement section, described top；Lower insert portion, is inserted into resettlement section, described bottom；
And joint portion, a part for insertion section, described top is extended to from described lower insert portion.
5. according to the substrate-placing pallet one of claim 1-4 Suo Shu, it is characterised in that described
Carbon-carbon composite includes:
Carbon fibre reinforced composite.
Substrate-placing pallet the most according to claim 5, it is characterised in that described main body
Including:
The two-layer manufactured by weaving described carbon fibre reinforced composite is with the fabric of superimposed layer.
Substrate-placing pallet the most according to claim 6, it is characterised in that described main body
Including:
Orthogonal isotropy lamination reinforcer, with different direction lamination plural with a direction by described
Carbon fibre reinforced composite carries out woven fabric；Or plain weave lamination reinforcer, lamination two with
On the woven fabric of plain weave；Or twill lamination reinforcer, knitting of lamination two or more twill weave
Thing；Or satin weave lamination reinforcer, the woven fabric of the plural satin weave of lamination.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0070235 | 2011-07-15 | ||
| KR10-2011-0070244 | 2011-07-15 | ||
| KR1020110070244A KR20130009270A (en) | 2011-07-15 | 2011-07-15 | Tray for loading substrate of manufacturing solar cell |
| KR1020110070235A KR101796475B1 (en) | 2011-07-15 | 2011-07-15 | Tray for loading substrate |
| PCT/KR2012/005570 WO2013012210A2 (en) | 2011-07-15 | 2012-07-13 | Tray for loading substrates |
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| CN103155134A CN103155134A (en) | 2013-06-12 |
| CN103155134B true CN103155134B (en) | 2016-10-26 |
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| CN (1) | CN103155134B (en) |
| WO (1) | WO2013012210A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018013421A1 (en) * | 2016-07-09 | 2018-01-18 | Applied Materials, Inc. | Substrate carrier |
| US20200255941A1 (en) * | 2019-02-11 | 2020-08-13 | Kennametal Inc. | Supports for chemical vapor deposition coating applications |
| CN110396679B (en) * | 2019-07-11 | 2024-07-30 | 苏州迈正科技有限公司 | Composite tray |
| CN114763606A (en) * | 2021-01-14 | 2022-07-19 | 营口金辰机械股份有限公司 | Plasma enhanced chemical vapor deposition equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101993664A (en) * | 2009-08-29 | 2011-03-30 | 襄樊封神胶业有限公司 | High temperature resistant inorganic ceramic adhesive |
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| KR0119740Y1 (en) * | 1994-10-24 | 1998-08-01 | 문정환 | Tray for keeping semiconductor |
| JP3035727B2 (en) * | 1996-06-10 | 2000-04-24 | ゴールド工業株式会社 | Parts transport tray |
| KR101064528B1 (en) * | 2009-06-24 | 2011-09-14 | 주식회사 티씨케이 | Tray for solar cell and manufacturing method thereof |
| KR101545482B1 (en) * | 2009-11-11 | 2015-08-19 | 주식회사 테스 | Wafer tray unit |
| TWI563589B (en) * | 2009-11-27 | 2016-12-21 | Jusung Eng Co Ltd | Tray, substrate processing apparatus using the same, and manufacturing method of tray |
| KR101152598B1 (en) * | 2010-05-31 | 2012-06-04 | 주식회사 테스 | Substrate treating apparatus |
| KR101753079B1 (en) * | 2011-01-14 | 2017-07-19 | 주성엔지니어링(주) | Tray, substrate processing apparatus using the same |
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| CN101993664A (en) * | 2009-08-29 | 2011-03-30 | 襄樊封神胶业有限公司 | High temperature resistant inorganic ceramic adhesive |
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| CN103155134A (en) | 2013-06-12 |
| WO2013012210A3 (en) | 2013-03-14 |
| WO2013012210A2 (en) | 2013-01-24 |
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