KR20130007256A - Rework apparatus and method of bonding error die - Google Patents

Rework apparatus and method of bonding error die Download PDF

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Publication number
KR20130007256A
KR20130007256A KR1020110064898A KR20110064898A KR20130007256A KR 20130007256 A KR20130007256 A KR 20130007256A KR 1020110064898 A KR1020110064898 A KR 1020110064898A KR 20110064898 A KR20110064898 A KR 20110064898A KR 20130007256 A KR20130007256 A KR 20130007256A
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South Korea
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die
substrate
heating
solder
bad
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KR1020110064898A
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Korean (ko)
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KR101659311B1 (en
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김성욱
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삼성테크윈 주식회사
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Publication of KR20130007256A publication Critical patent/KR20130007256A/en
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Publication of KR101659311B1 publication Critical patent/KR101659311B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0231—Manufacturing methods of the redistribution layers
    • H01L2224/02321—Reworking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/749—Tools for reworking, e.g. for shaping

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)

Abstract

PURPOSE: A rework apparatus of a bonding error die and a method thereof are provided to maximize productivity by automating a rework process to bond a die with high quality and separate a defective die. CONSTITUTION: A support unit(120) absorbs and supports one side of a substrate(110) and is located on the lower side of the support unit. The support unit includes at least one hole inside. A heating unit(130) separates a die(112) from the substrate by absorbing and heating the die. The heating unit includes a die absorbing unit(132) which absorbs the die and a die heating unit(134) which heats the die.

Description

Rework apparatus and method of bonding error die

The present invention relates to a rework apparatus and method of a bonding bad die, and more particularly, to a die that is subjected to a die bonding or flip-chip bonding process used for bare die bonding. ) Or a rework apparatus and method for a bonded bad die for removing a chip and reworking it with a good die or a chip.

The die or chip is bonded to one or both sides of the substrate through a die bonding or flip-chip bonding process. In FIG. 1, a die 11 having a plurality of solder balls 12 is bonded to one surface of a substrate 10. 2, dies 11, 21, 23 having a plurality of solder balls 12, 22, 24 on both surfaces of the substrate 10 are bonded.

When a plurality of dies 11 and 21 are bonded, the inherent performance of the product is exerted by the combination of the performances of the dies 11 and 21 bonded to the entire substrate until each die is fully functional. Therefore, when the dies 11, 21, and 23 bonded to the substrate 10 contain defective dies that do not perform well, the performance of the entire product is affected.

Thus, in order to prevent the defective die from bonding to the substrate 10, the performance inspection of the dies 11, 21, and 23 is performed on a wafer from which a plurality of dies are taken out, but reflow soldering is performed. Through the process, such as an additional bad die occurs.

Accordingly, the dies 11, 21, and 23 bonded to the substrate 10 through the inspection equipment are inspected for the product that passes through the die bonding or the flip chip bonding process to detect the defective die. The defective die identified by the inspection equipment is manually removed from the substrate 10, and then manually removed from the die bonding traces on the substrate 10, and then a new good die is placed and reflow soldered. Bonding again.

Therefore, in the conventional bad die removal operation, it can be seen that the bad die is removed from the substrate 10 by manual operation, and the die bonding trace is removed by manual operation. 3 and 4 illustrate the removal of a defective die from an existing substrate.

In FIG. 3, the hot air 40 is applied to the defective die 11 using the hot air blower 30 by hand, and the solder balls 12 of the heated defective die 11 are melted to remove the defective die 11. However, in the process of applying the hot air 40 to the defective die 11, the adjacent good die 13 also receives unnecessary hot air 40, which may cause heat of the good die 13 to cause further failure. .

In FIG. 4, when the hot air 40 is applied to the defective die 11 using the hot air fan 30 by hand, not only the adjacent good die 13 but also the good die 21 located on the opposite side of the substrate 10. The heat 41 passing through the substrate 10 by the hot air fan 30 may be received. This may cause further failure of the good die 21 on the opposite side.

Then, removal of the defective die 11 by manual operation takes a lot of time to remove the defective die 11 and clean the substrate, and a good article for rebonding to the position where the defective die 11 was bonded. Separate mounting equipment is required to mount the die. In addition, there is a problem that the entire product must be reheated in the reflow soldering equipment in order to bond the substrate 10 and a new good die through melting solder balls. Thus, a problem arises in which the process is complicated as a whole.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. It provides a work apparatus and method.

In addition, the present invention provides a rework apparatus and method for a bonded bad die, which simplifies the process and shortens the process time by automatically performing a series of rework processes of removing the defective die from the substrate and cleaning the substrate to bond a new good die. .

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to one or more embodiments of the present invention, there is provided a reworking apparatus for a poor bonding die, comprising: support means for absorbing and supporting one surface of a substrate; And heating means for adsorbing and heating a die bonded to the substrate to separate the die from the substrate, wherein the heating means is a transparent material that adsorbs the die. And a die heating unit for heating the die by transmitting the die adsorption unit by the emitted light.

In addition, a method of reworking a bonding failure die according to an embodiment of the present invention for achieving the above object, the step of adsorbing and supporting one surface of the substrate; Absorbing a bad die bonded to the substrate; Illuminating the adsorbed defective die to heat the defective die; And separating the bad die from the substrate.

Other specific details of the invention are included in the detailed description and drawings.

According to the present invention, thermal effects can be minimized on a good die bonded to a substrate by automatically performing a rework process of removing a defective die and bonding a new good die.

In addition, a series of rework processes that remove defective die from the substrate and clean the substrate to bond new good dies can be performed automatically to simplify the process and reduce process time.

In addition, productivity can be maximized by automatically performing a series of rework processes and eliminating manual work.

1 is a diagram in which a die is bonded to one surface of a substrate.
2 is a diagram in which dies are bonded to both sides of a substrate.
FIG. 3 is a view illustrating an operation of removing a defective die from a substrate in which a conventional die is bonded to one surface.
FIG. 4 is a view illustrating an operation of removing a defective die from a substrate having conventional die bonded to both sides.
5 is a diagram illustrating a rework apparatus of a bad bonding die according to an exemplary embodiment of the present invention.
Fig. 6 is a view showing the supporting means of the rework apparatus of the bad bonding die of the present invention.
7 is a view showing an embodiment of the cleaning means of the rework apparatus of the bad bonding die of the present invention.
8 is a view showing another embodiment of the cleaning means of the rework apparatus of the bad bonding die of the present invention.
9A to 9D are views showing the entire process performed by the rework apparatus of the bad bonding die of the present invention.
10 is a flowchart illustrating a rework method of a bad bonding die according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

5 is a diagram illustrating a rework apparatus of a bad bonding die according to an exemplary embodiment of the present invention.

The rework apparatus 100 (hereinafter referred to as a rework apparatus) of the defective bonding die includes a support means 120 and a heating means 130. In addition, it may further include a cleaning means 140, 150, a driving means (not shown) and the alignment means 160.

The support means 120 sucks and supports one surface of the substrate 110. In general, the support means 120 is positioned below the substrate 110 to support the substrate.

6 is a view showing the support means of the rework device of the bad bonding die of the present invention, the support means 120 has at least one hole (122) therein. The heating wire 124 is installed in the hole 122. The heating wire 124 conducts heat to the substrate 110 as a whole so that the heat applied to the substrate 110 by the heating means 130 is not scattered to the periphery, but only to the die 120 positioned below the heating means 130. It serves to be delivered. Then, the temperature of the substrate 110 is raised by the heating wire 124 as a whole, so that the die 112 to which the heat is applied by the heating means 130 quickly reaches the melting temperature of the solder ball 114, thereby increasing the heating time. To reduce it. In the present specification, die is used in a generic term that includes a chip in addition to a bare die.

In addition, a first driving part (not shown) for moving the supporting means 120 is connected to the supporting means 120. In general, the first driving part is positioned below the supporting means 120 to make the supporting means 120 Z. The first driving unit moves the support means 120 in at least one direction including at least one of a vertical direction and two directions perpendicular to the vertical direction, but not limited thereto. That is, of course, it can also move in the X-axis direction (front-back direction) and Y-axis direction (left-right direction).

The heating means 130 adsorbs and heats the die 112 bonded to the substrate 110 to separate the die 112 from the substrate 110. Herein, the heating means 130 may include a die adsorption part 132 made of a transparent material that adsorbs the die 112, and a die heating part that transmits the die 112 by heating the die adsorption part 132. 134).

The die heating unit 134, which penetrates the die adsorption unit 132 and heats the die 112, irradiates light by infrared radiation or laser radiation so that the light passes through the die adsorption unit 132. Heat 112. As described above, the conventional method applies the hot air 40 generated by the hot air blower 30 to melt the solder balls 12 of the defective die 11 to heat the adjacent die 13 and the opposite die ( 21 also has a problem that the heat is applied to the heat through the substrate (10). However, the die heating unit 134 of the present invention emits light to pass through the die adsorption unit 132, so that heat can be applied only to the target defective die 112 by light.

Since the die adsorption unit 132 is vacuum-adsorbed the die 112 and positioned between the die heating unit 134 and the substrate 110, the die adsorption unit 132 transmits light emitted by the die heating unit 134 to transmit the transparent material. It is preferable that it consists of. Since the transparent material through which light is transmitted, transparent glass will be used a lot, but it is not limited thereto.

Here, the die heating unit 134 may emit light by infrared radiation or laser radiation. Light emitted by infrared rays or lasers passes through the die adsorption unit 132 to heat the die 112. When the die 112 is heated using a laser or infrared light, it is possible to precisely control the region to be heated to a desired temperature. However, in the case of using the hot air fan 30 or a heater (not shown), it is difficult to precisely control the temperature. Thus, since precise control of the temperature is possible by laser or infrared light, it is possible to heat the die 112 at a desired luminous intensity for a desired time depending on the bonding arrangement of the dies bonded to the substrate 110. That is, by applying the optimal heating profile for a short time according to the bonding arrangement of the die 112, it is possible to minimize the thermal impact on the die around the bad die.

In addition, the heating unit 130 is connected to the second driving unit (not shown) and is movable in the X / Y / Z axis direction. That is, the heating means 130 can move in the front-rear direction, the left-right direction, and the vertical direction by the second driving unit, and vacuum-adsorbs and heats the die 112 directly above the die 112 that is determined to be defective. ), And remove it.

Fig. 7 is a view showing one embodiment of the cleaning means of the rework apparatus of the bad bonding die of the present invention, and Fig. 8 is a view showing another embodiment of the cleaning means of the rework apparatus of the bad bonding die of the present invention. to be.

The rework apparatus 100 of the present invention further comprises cleaning means 140, 150 for removing the solder residue 116 remaining in the portion of the substrate 110 from which the die 112 is separated. Even though the die 112 bonded to the substrate 110 by the heating means 130 is adsorbed and heated to remove the die 112 from the substrate 110, the solder of the solder ball 114 is neatly soldered to the substrate ( 110). Thus, the solder residue 116 must be cleanly removed from the substrate 110. Such cleaning means 140, 150 may be cleaning means 140 that adsorbs solder residue 116 or cleaning means 150 that sucks up solder residue 116.

The cleaning means 140 for adsorbing the solder residue 116 includes a solder heating part 142 for heating the solder residue 116 and a solder adsorbent 148 for adsorbing and removing the solder residue 116. And an adsorbent recovery unit 144 for supplying the adsorbent and an adsorbent recovery unit 146 for recovering the solder adsorbent 148. Here, in general, the solder heating unit 142 uses a conventional hot air blower 40 or a heater, but is not limited thereto. In addition, the solder adsorbent 148 may have a tape shape having a copper mesh, but other solder adsorbents 148 may be used.

After the cleaning means 140 moves to the area of the substrate 110 where the solder residue 146 is located, the solder adsorbent 144 is heated from the adsorbent supply part 144 while the solder residue 116 is heated by the solder heating part 142. 148 is used to remove the solder residue 116 from the substrate. Thereafter, the solder adsorbent 148 which adsorbs the solder residue 116 is recovered to the adsorbent recovery part 146.

The cleaning means 150 for sucking the solder residue 116 includes a solder heating portion 152 for heating the solder residue 116 and a solder suction portion for sucking and removing the solder residue 116. 154). Here, in general, the solder heating unit 142 uses a conventional hot air blower 30 or a heater, but is not limited thereto. In addition, the solder suction unit 154 sucks the solder residue 116 by vacuum suction or the like.

The cleaning means 140 and 150 may be connected to a third driving part (not shown) to move in the X / Y / Z axis direction. That is, the cleaning means 140 and 150 can be moved in the front-back direction (X-axis direction), the left-right direction (Y-axis direction), and the vertical direction (Z-axis direction) by the third drive unit, so that the defective die 112 is removed. The solder residue 116 remaining at the position where it was placed is adsorbed and removed.

The first driving unit connected to the support means 120, the second driving unit connected to the heating unit 130, and the third driving unit connected to the cleaning units 140 and 150 form one driving unit (not shown). That is, the driving means may include a first driving part for moving the support means 120 in the Z-axis direction, a second driving part for moving the heating means 130 in the X / Y / Z-axis direction, and the cleaning means ( The components of the rework apparatus 100 are driven by including a third driving unit for moving the 140 and 150 in the X / Y / Z axis direction. In addition, the first, second and third driving units are connected to the housing (not shown) of the rework apparatus 100 so that the supporting means 120, the heating means 130, and the cleaning means 140, 150 are configured as one device. Or spaced apart into separate modules.

9A to 9D are views showing the entire process performed by the rework apparatus of the bad bonding die of the present invention.

In FIG. 9A, after adsorbing and fixing the substrate 110 with the supporting means 120, the defective die 112 on one surface of the substrate 110 is adsorbed and heated by the heating means 130, and the defective die 112 is fixed. Is removed from the substrate 110. At this time, the die adsorption unit 132 adsorbs the defective die 112, the die heating unit 134 penetrates the die adsorption unit 132, and irradiates light onto the defective die 112 to expose the solder ball 114. Will melt. Then, when the heating means 130 is moved, the defective die 112 is adsorbed by the die adsorption unit 132 and removed. The support means 120 moves in the vertical direction (Z-axis direction) by the first drive part of the drive means, and the heating means 130 is moved in the X-axis direction (front and rear direction) and Y-axis direction by the second drive part of the drive means. (Left and right directions) and Z-axis direction (vertical direction) can be moved. That is, the first driving part for moving the support means 120 in the vertical direction and the heating means 130 for moving in at least one or more of three directions including a vertical direction and two directions perpendicular to the vertical direction. The second driving portion becomes an element constituting the driving means.

In FIG. 9B, solder residue 116 remains where the defective die 112 is removed, which is removed by the cleaning means 140, 150. The solder residue 116 is heated by the cleaning means 140 and 150, and the solder residue 116 is adsorbed and removed. The cleaning means 140 and 150 may move in the vertical direction, the front-rear direction, and the left-right direction by the third driving part of the driving means. That is, the third driving part for moving the cleaning means 140, 150 in at least one of three directions including a vertical direction and two directions perpendicular to the vertical direction is an element of the driving means. At this time, the solder residue 116 may be removed by the cleaning means 140 and 150 while moving the substrate 110 from which the defective die 112 is removed by the heating means 130 by a conveyor (not shown). have.

In FIG. 9C, the heating means 130 is aligned by the alignment means 160 at the position of the substrate 110 from which the defective die has been removed to vacuum suction the good die 113 and place it in the substrate 110. The alignment means 160 is positioned between the substrate 110 and the heating means 130 that absorbs the good die 113, and analyzes the image acquired by the camera to align the positions where the die 112 is to be bonded.

In FIG. 9D, the heating means 130 is lowered in the Z-axis direction, thereby placing the good die 113 at the position where the defective die 112 is removed, and heating the good die 113 in that state to heat the good die 113. Melt solder 115 is bonded to the die die 113 to the substrate (110). Through this, it is possible to simply die bonding by the heating means 130 without performing the reflow soldering process again.

10 is a flowchart illustrating a rework method of a bad bonding die according to an embodiment of the present invention.

In the reworking method of the bonding failure die, one surface of the substrate 110 is adsorbed and supported (S1010), the defect die 112 bonded to the substrate 110 is adsorbed (S1020), and the adsorption failure After the light is irradiated onto the die 112 and the defective die 112 is heated (S1030), the defective die 112 is separated from the substrate 110 (S1040). Here, the step S1030 of heating the bad die 112 further includes a step of heating the bad die 112 by irradiating a laser or infrared rays to the bad die 112.

Next, after the defective die 112 is separated from the substrate 110 (S1040), the solder residue 116 remaining on the portion of the substrate 110 from which the defective die 112 is separated is removed (S1050). .

Next, the substrate 110 and the good die 113 are aligned so that the good die 113 is aligned on the portion of the substrate 110 from which the defective die 112 is separated (S1060).

Finally, a good die 113 is disposed on a portion of the substrate 110 from which the bad die 112 is separated, and the good die 113 is heated and bonded (1070).

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: rework device 110: substrate
120: support means 130: heating means
140, 150: cleaning means 160: alignment means

Claims (12)

Support means for adsorbing and supporting one surface of the substrate; And
An apparatus for reworking a bad bonded die, comprising heating means for adsorbing and heating a die bonded to the substrate to separate the die from the substrate.
And the heating means includes a die adsorption unit made of a transparent material for adsorbing the die, and a die heating unit for heating the die by transmitting the die adsorption unit by radiated light. The method of claim 1,
And a hole is formed inside the support means, and a rework device of a defective bonding die having a heating wire installed therein. The method of claim 1,
The die heating unit is a rework device of a bonding failure die that emits the light by infrared radiation or laser radiation. The method of claim 1,
And a cleaning means for removing solder residue remaining in the portion where the die is separated from the substrate. 5. The method of claim 4,
The cleaning means may include a solder heating part for heating the solder residue, an absorbent supply part for supplying a solder adsorbent for adsorbing and removing the solder residue, and an adsorbent recovery part for recovering the solder adsorbent. Rework device. 5. The method of claim 4,
And the cleaning means comprises a solder heating portion for heating the solder residue and a solder suction portion for sucking and removing the solder residue. 5. The method of claim 4,
A first driving part for moving the support means in a vertical direction, a second driving part for moving the heating means in at least one or more of three directions including a vertical direction and two directions perpendicular to the vertical direction, and the cleaning means Reworking apparatus of the bonding failure die further comprising a drive means including a third driving unit for moving the at least one of the three directions. Adsorbing and supporting one surface of the substrate;
Absorbing a bad die bonded to the substrate;
Illuminating the adsorbed defective die to heat the defective die; And
Separating the bad die from the substrate. The method of claim 8,
Heating the bad die includes irradiating a laser or infrared light to the bad die. The method of claim 8,
Removing the solder residue remaining in the portion of the substrate where the bad die has been separated. The method of claim 10,
And aligning the substrate and the good die so that the good die is aligned on the portion of the substrate where the bad die is separated. The method of claim 10,
Disposing a good die on a portion of the substrate where the bad die is separated, and heating and bonding the good die;
KR1020110064898A 2011-06-30 2011-06-30 Rework apparatus of bonding error die KR101659311B1 (en)

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KR101659311B1 KR101659311B1 (en) 2016-09-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210012980A (en) * 2019-07-26 2021-02-03 한국광기술원 Micro LED repair process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190018250A (en) 2017-08-14 2019-02-22 주식회사 루멘스 rework method and apparatus in SMT

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250544A (en) * 1995-02-24 1996-09-27 Internatl Business Mach Corp <Ibm> Rework method of semiconductor chip
JP2001244621A (en) * 2000-02-28 2001-09-07 Nec Corp Method for re-working semiconductor device and re- working jig
KR20050076591A (en) * 2004-01-19 2005-07-26 가부시키가이샤 신가와 Die bonding method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250544A (en) * 1995-02-24 1996-09-27 Internatl Business Mach Corp <Ibm> Rework method of semiconductor chip
JP2001244621A (en) * 2000-02-28 2001-09-07 Nec Corp Method for re-working semiconductor device and re- working jig
KR20050076591A (en) * 2004-01-19 2005-07-26 가부시키가이샤 신가와 Die bonding method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210012980A (en) * 2019-07-26 2021-02-03 한국광기술원 Micro LED repair process

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