KR20120129680A - Optical semiconductor based lighting apparatus - Google Patents

Optical semiconductor based lighting apparatus Download PDF

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Publication number
KR20120129680A
KR20120129680A KR1020110048080A KR20110048080A KR20120129680A KR 20120129680 A KR20120129680 A KR 20120129680A KR 1020110048080 A KR1020110048080 A KR 1020110048080A KR 20110048080 A KR20110048080 A KR 20110048080A KR 20120129680 A KR20120129680 A KR 20120129680A
Authority
KR
South Korea
Prior art keywords
semiconductor
optical
envelope
light
annular reflector
Prior art date
Application number
KR1020110048080A
Other languages
Korean (ko)
Inventor
송태훈
Original Assignee
주식회사 포스코엘이디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 포스코엘이디 filed Critical 주식회사 포스코엘이디
Priority to KR1020110048080A priority Critical patent/KR20120129680A/en
Publication of KR20120129680A publication Critical patent/KR20120129680A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PURPOSE: An optical semiconductor based lighting apparatus is provided to extend the light distribution of a transparent envelop and to minimize the dark zone. CONSTITUTION: A transparent envelope(20) of bulb type is combined in a socket base. A mount member(30) is formed at the socket base. An optical semiconductor device array unit(40) comprises plural semiconductor optical devices which are arranged in a row. A round-shaped reflecting unit(50) reflects light of the optical semiconductor device array unit in at least one direction.

Description

Optical semiconductor based lighting device {OPTICAL SEMICONDUCTOR BASED LIGHTING APPARATUS}

The present invention relates to an optical semiconductor-based lighting device, and more particularly, to a bulb-type optical semiconductor-based lighting device with improved light distribution characteristics.

Fluorescent and incandescent lamps have been widely used as light sources for illumination. Incandescent lamps have high power consumption and are inferior in efficiency and economy, and for this reason, their demand is greatly reduced. This decline is expected to continue in the future. On the other hand, fluorescent lamps are more efficient and economical at about one-third of the power consumption of incandescent lamps. However, fluorescent lamps have a problem in that blackening occurs due to a high applied voltage, resulting in short lifespan. In addition, since the fluorescent lamp uses a vacuum glass tube in which mercury, which is a harmful heavy metal material, is injected together with argon gas, there is a disadvantage of being unfriendly to the environment.

Recently, the demand for a lighting device including a semiconductor optical device such as an LED as a light source, that is, the LED lighting device is rapidly increasing. LED lighting devices have the advantage of long lifetime and low power driving. In addition, the LED illumination device is environmentally friendly since it does not use environmentally harmful substances such as mercury.

LED lighting apparatuses having various kinds and various structures have been developed, and one of them has been developed a bulb-type LED lighting apparatus including a similar form of incandescent lamp.

Conventional bulb-type LED lighting device has a light-transmissive envelope having a bulb shape, a socket base coupled to the top of the envelope, and a printed circuit board (PCB) disposed horizontally near the socket base in the envelope It includes, and a plurality of LED is mounted on the PCB to emit light toward the bottom of the envelope. Conventional bulb-type LED lighting device, due to the linearity of the LED, the disadvantages in the light distribution characteristic that the light from the plurality of LEDs are mainly emitted only through the lower portion of the envelope and little light is emitted to the side and rear of the envelope There is this.

Accordingly, an object of the present invention is to provide an optical semiconductor-based lighting apparatus which minimizes dark areas by expanding light distribution around the transmissive envelope.

Another problem to be solved by the present invention is to provide an optical semiconductor-based lighting device that eliminates the dark region in the rear by extending the distribution of light distribution around the front of the bulb-type envelope to the rear.

Optical semiconductor based lighting apparatus according to an aspect of the present invention, the socket base; A bulb-type light transmitting envelope coupled to the socket base; A mount member standing upright on said socket base; A semiconductor optical element array unit having a plurality of semiconductor optical elements arranged along the longitudinal direction of the mount member; Located in the middle of the translucent envelope, and includes an annular reflector for reflecting light from the semiconductor optical element array unit in at least one of the front and rear.

In the description and claims, the term 'annular reflector' includes not only the meaning of one reflective member having an annular shape, but also the meaning of the combination of reflective members arranged to have an approximately annular shape.

According to one embodiment, a plurality of the semiconductor optical device array unit is arranged along the circumference of the mount member.

According to one embodiment, the mount member comprises a heat sink.

The translucent envelope includes a first translucent cover coupled directly to the socket base and a second transmissive cover coupled to the first transmissive cover, wherein the annular reflector has an edge portion at the first translucent portion. It is fixed between the cover and the second translucent cover.

According to an embodiment, the optical semiconductor based lighting apparatus may further include one or more other annular reflectors installed at different heights from the annular reflectors.

In example embodiments, the semiconductor optical device array unit may include an elongated PCB attached to the mount member, and the plurality of semiconductor optical devices may be mounted on the PCB so as to be arrayed in a length direction of the mount member.

According to one embodiment, a light diffusing material for scattering light may be applied to the light transmitting envelope or the annular reflector.

According to an embodiment, a wavelength conversion material may be applied to the light transmitting envelope or the annular reflector.

According to one embodiment, the wavelength conversion material may include a remote phosphor (remote phosphor).

According to one embodiment, the mount member may comprise a hollow.

According to an aspect of the present invention, there is provided a light transmitting envelope; A plurality of semiconductor optical elements located within the translucent envelope; An optical semiconductor-based lighting apparatus is provided to extend inwardly from an inner circumference of the light transmitting envelope, and includes a reflective member that changes a traveling direction of light from the plurality of semiconductor optical devices.

Preferably, the reflective member may be an annular reflector provided in the middle of the transmissive envelope so as to reflect the light from the plurality of semiconductor optical elements to the front and rear of the transmissive envelope.

Preferably, the plurality of semiconductor optical devices includes at least one semiconductor optical device positioned lower than the annular reflecting unit and at least one semiconductor optical element positioned higher than the annular reflecting unit, wherein the annular reflecting unit emits light at each of the top and bottom surfaces thereof. Reflects backward and forward of the translucent envelope.

Preferably, at least one semiconductor optical device of the plurality of semiconductor optical devices is positioned at the same height as the annular reflector.

The term 'semiconductor optical element' refers to a device including or using an optical semiconductor such as a light emitting diode chip. Preferably, the semiconductor optical device is a package level LED including a light emitting diode chip therein.

The optical semiconductor-based lighting apparatus according to the present invention has an advantage that the dark region is minimized by extending the distribution of light distribution around the transmissive envelope. Furthermore, the optical semiconductor-based illumination device according to the present invention, unlike the prior art in which the light distribution is limited to the front periphery of the bulb-type translucent envelope, has the advantage that the light distribution is extended to the rear, thereby eliminating the dark areas in the rear. Has

1 is a partial cutaway perspective view of an optical semiconductor based lighting apparatus according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the optical semiconductor based lighting apparatus shown in FIG. 1.
3 is a view for explaining the operation of the optical semiconductor-based lighting device shown in FIG.
4 to 6 are views for explaining other embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 to 3, the optical semiconductor-based lighting device 1 according to an embodiment of the present invention is a bulb type, that is, a bulb-type optical semiconductor-based lighting device, and includes a socket base 10. Bulb-shaped light transmitting envelope 20 coupled to the lower end of the socket base 10, the mounting member 30 is vertically positioned in the light transmitting envelope 20, and the circumference of the mounting member 30 A plurality of semiconductor optical device array unit 40 is disposed along a predetermined interval along the. In addition, the optical semiconductor-based illumination device 1 includes an annular reflector 50 positioned inside the translucent envelope 20.

The mount member 30 has a columnar shape and extends vertically while being coupled to the center of the socket base 10 so as to be surrounded by the light transmitting envelope 20. It is preferable that the mount member 30 functions as a heat sink, and furthermore, it is preferable that the mount member 30 is made of a material having good thermal conductivity such as metal. The mount member 30 preferably includes a heat dissipation hollow 31 in the vertical length direction so as to receive heat from the semiconductor optical device array unit 40 and quickly discharge it. In addition, the mount member 30 includes a plurality of flat mounting surfaces 32. The plurality of mount surfaces 32 are formed at regular intervals along the circumference of the mount member 30 and are vertically formed long along the longitudinal direction.

The plurality of semiconductor optical device array units 40 are disposed on the plurality of mount surfaces 32, respectively. The plurality of semiconductor optical device array units 40 may be mounted on each of the plurality of mounting surfaces 32, and may be disposed at predetermined intervals along a circumference of the mounting member 30, and the plurality of PCBs 42. And an array of semiconductor optical elements 44 mounted on each of the PCBs 42 and arranged in the longitudinal direction of the mount member 30. In addition, all the semiconductor optical elements 44 in the plurality of semiconductor optical element array units 40 are arranged to emit light toward the transmissive envelope 20.

According to the above-described structure, a plurality of semiconductor optical elements 44 arranged long along the longitudinal direction of the translucent envelope 20 are present in the translucent envelope 20 and at the same time, the translucent envelope 20 There are a plurality of semiconductor optical elements 44 which are arranged in an annular manner facing the translucent envelope 20 inside the.

The transparent envelope 20 has a first transparent cover 22 directly coupled to the socket base 10, and a second transparent cover detachably coupled to a lower opening of the first transparent cover 22. (24). Each of the first light transmissive cover 22 and the second light transmissive cover 24 may be provided with connecting means for mutual coupling thereof. The connecting means may be male and female threads respectively formed at portions where the first transparent cover 22 and the second transparent cover 24 contact each other. Alternatively, the connecting means may be fitted or engaged instead of the male and female threads. Can be. As the connecting means, an additional material such as an adhesive may be used. The first light transmissive cover 22 and the second light transmissive cover 24 are preferably made of a light transmitting resin material, but may be made of other light transmitting materials.

On the other hand, the annular reflector 50 extends inward from the inner circumferential surface of the transparent envelope 20 in the middle of the length (that is, the height) of the transparent envelope 20. Accordingly, in the light transmitting envelope 20, the semiconductor optical element 44 positioned below the annular reflector 50 and the semiconductor optical element 44 positioned lower than the annular reflector 50 are disposed. exist. The upper surface of the annular reflector 20 mainly reflects light from the semiconductor optical element 44 located higher than the annular reflector 50, and the bottom of the annular reflector 20 is the annular reflector 50. It mainly reflects light from the semiconductor optical element 44 located lower than). In addition, the annular reflector 50 may be at approximately the same height as at least one semiconductor optical element 44, in which case part of the light from the semiconductor optical element 44 at the same height as itself. Reflect the rest from the top at the bottom.

In addition, since the annular reflector 50 entirely surrounds the plurality of semiconductor optical elements 44 arranged in an annular shape, the annular reflector 50 can almost radially reflect light emitted from the semiconductor optical elements 44.

In the present exemplary embodiment, the annular reflector 50 is disposed at a position where the first transparent cover 22 and the second transparent cover 24 are coupled to each other. Furthermore, when the first translucent cover 22 and the second translucent cover 24 are combined to form one translucent envelope 20, the annular reflector 50 has an edge portion at the edge portion thereof. It may be engaged and fixed between the light transmissive cover 22 and the second light transmissive cover 24. In this case, the annular reflector 50 may be made of a compressible or viscoelastic material that can be compressed between the first transparent cover 22 and the second transparent cover 24. Alternatively, a fastening or engagement shape with respect to the first translucent cover 22 and the second translucent cover 24 may be provided above and below the annular reflector 50 to mediate the annular reflector 50. The first light transmissive cover 22 and the second light transmissive cover 24 may be coupled to each other.

The annular reflector 50 may have white, silver white or metallic luster. In addition, the annular reflector 50 may be made of a light-transmitting material to reflect only part of the light and transmit the rest or to change only the direction of the light.

Various methods may be considered to suppress or reduce a phenomenon in which the vicinity of the installation area of the annular reflector 50 becomes dark. For example, a light diffusing material is applied to the translucent envelope 20 and / or the annular reflecting part 50 in a coating method or a sheet attaching method so that light scattered by the light diffusing material is scattered by the annular reflecting part 50. ) To cover the installation area. As another example, it may be considered to appropriately adjust the light transmittance and / or reflectance of the annular reflector 50. Furthermore, the light transmittance and the light reflectivity of the annular reflector 50 may be different in the radial direction, for example, to increase the light transmittance of a part of the annular reflector 50 adjacent to the transmissive envelope 20. Can be. This may be implemented, for example, by assembling two or more ring members of different diameters to make one annular reflector.

Although not shown, a wavelength converting material for converting optical wavelengths, more preferably, a remote poster, may be applied to the annular reflector 50 and / or the light beam envelope 20.

As shown in FIG. 3, light from the semiconductor optical element 44 positioned higher than the annular reflector 50 in the transmissive envelope 20 is mainly emitted directly to the side of the envelope 20 or is annularly reflected. Reflected on the upper surface of the portion 50 is emitted to the rear of the envelope (20). In addition, the light emitted from the semiconductor optical element 44 positioned lower than the annular reflector 50 in the transmissive envelope 20 is emitted directly to the side of the envelope 20 or reflected on the bottom surface of the annular reflector 50. And is discharged forward of the envelope 20. These light emission characteristics, or light distribution characteristics, are almost the same throughout the circumference of the envelope 20. Therefore, the optical semiconductor-based lighting apparatus according to the present embodiment has excellent light distribution characteristics in which light is almost evenly distributed over the entire periphery of the translucent envelope 20.

4 is a view illustrating an optical semiconductor-based lighting apparatus according to another embodiment of the present invention. Referring to FIG. 4, a pattern 52 having an uneven shape scattering light on a surface of the annular reflector 50 is illustrated. Are formed. The rest of the configuration is the same as in the previous embodiment.

FIG. 5 is a view for explaining an optical semiconductor based lighting apparatus according to another embodiment of the present invention. Referring to FIG. 5, the optical semiconductor based lighting apparatus according to the present embodiment includes a plurality of annular reflectors 50a and 50b. And 50c, and the plurality of annular reflectors 50a, 50b, and 50c are formed at different heights on the inner circumferential surface of the translucent envelope 20. The translucent envelope 20 allows the plurality of annular reflectors 50a, 50b to couple the plurality of annular reflectors 50a, 50b, 50c to the translucent envelope 20 in a manner similar to the previous embodiment. 50c) may include three or more translucent covers that can be coupled with each in between. Alternatively, the structure in which the plurality of annular reflectors 50a, 50b, 50c are integrated with each other and at least one of the plurality of annular reflectors 50a, 50b, 50c are previously integrated with the light transmitting envelope 20. Structure may be considered. The rest of the configuration is the same as in the previous embodiments.

FIG. 6 is a view for explaining an optical semiconductor based lighting apparatus according to another embodiment of the present invention. Referring to FIG. 6, the optical semiconductor based lighting apparatus according to the present embodiment faces toward the side of the envelope 20. A first semiconductor optical element 44a and a second semiconductor optical element 44 facing the front of the envelope 20. The second semiconductor optical element 44b contributes to increasing the amount of light to the front.

10: socket base 20: translucent envelope
22, 24: transparent cover 30: mount member
40: semiconductor optical element array unit 42: PCB
44: semiconductor optical element 50, 50a, 50b, 50c: annular reflector

Claims (14)

Socket base;
A bulb-type translucent envelope coupled to the socket base;
A mount member standing upright on the socket base;
A semiconductor optical element array unit having a plurality of semiconductor optical elements arranged along the longitudinal direction of the mount member; And
Located in the middle of the translucent envelope, the optical semiconductor-based illumination device including an annular reflector for reflecting light from the semiconductor optical element array unit in at least one of the front and rear direction. The optical semiconductor based illuminating device according to claim 1, wherein a plurality of the semiconductor optical device array units are arranged along a circumference of the mount member. The optical semiconductor based illumination device of claim 2, wherein the mount member comprises a heat sink. 2. The translucent envelope of claim 1, wherein the translucent envelope includes a first translucent cover coupled directly to the socket base and a second transmissive cover coupled to the first transmissive cover, wherein the annular reflector has an edge portion at the first translucent cover. And the second translucent cover is fixed between the optical semiconductor based illumination device. The optical semiconductor based illumination device of claim 1, further comprising at least one other annular reflector installed at a different height from the annular reflector. The semiconductor optical device array unit of claim 1, wherein the semiconductor optical device array unit includes an elongated PCB attached to the mount member, and the plurality of semiconductor optical devices are mounted on the PCB such that the plurality of semiconductor optical devices are arrayed in a length direction of the mount member. Optical semiconductor based lighting device. The optical semiconductor based illuminating device according to claim 1, wherein a light diffusing material for scattering light is applied to the light transmitting envelope or the annular reflector. The optical semiconductor based illuminating device according to claim 1, wherein a wavelength conversion material is applied to the translucent envelope or the annular reflector. The optical semiconductor based illuminating device according to claim 8, wherein the wavelength conversion material comprises a remote phosphor. The optical semiconductor based illumination device of claim 1, wherein the mount member comprises a hollow. Light transmitting envelope;
A plurality of semiconductor optical elements positioned within the translucent envelope; And
The optical semiconductor-based illuminating device is installed to extend inwardly from the inner circumference of the light-transmitting envelope, and comprises a reflecting member for changing the traveling direction of the light emitted from the plurality of semiconductor optical devices. The method according to claim 11, wherein the reflecting member, at least part of the annular reflector provided in the middle of the length of the translucent envelope to reflect the light from the plurality of semiconductor optical elements to the front and rear of the translucent envelope. Optical semiconductor-based lighting device, characterized in that. The semiconductor device of claim 12, wherein the plurality of semiconductor optical devices include one or more semiconductor optical devices located lower than the annular reflector and one or more semiconductor optical devices located higher than the annular reflector, wherein the annular reflector receives light from an upper surface and a lower surface, respectively. Optical semiconductor-based illumination device, characterized in that for reflecting back and front of the translucent envelope. The optical semiconductor based illumination device of claim 12, wherein at least one semiconductor optical device of the plurality of semiconductor optical devices is positioned at the same height as the annular reflector.
KR1020110048080A 2011-05-20 2011-05-20 Optical semiconductor based lighting apparatus KR20120129680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110048080A KR20120129680A (en) 2011-05-20 2011-05-20 Optical semiconductor based lighting apparatus

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Application Number Priority Date Filing Date Title
KR1020110048080A KR20120129680A (en) 2011-05-20 2011-05-20 Optical semiconductor based lighting apparatus

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KR20120129680A true KR20120129680A (en) 2012-11-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104295945A (en) * 2013-07-18 2015-01-21 王芳 An omnidirectional light bulb and manufacture method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104295945A (en) * 2013-07-18 2015-01-21 王芳 An omnidirectional light bulb and manufacture method thereof

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