KR20120126419A - Method for manufacturing touch pannel - Google Patents

Abstract

PURPOSE: A method for manufacturing a touch panel is provided to reduce manufacturing costs or additional equipment for controlling align by exposing a photoresist layer though a single light source. CONSTITUTION: A mesh pattern is formed in a photomask. The photomask is arranged in the upper portion of a first photoresist layer. Using irradiation of light, the first photoresist layer and a second photoresist layer are hardened at the same time. A first and a second opening portion are formed by developing the first and the second photoresist layer. A metal material is formed in the first and the second opening portion. A first and a second metal mesh layer are formed in the transparent substrate(110) by exfoliating the first and the second photoresist layer.

Description

Manufacturing Method of Touch Panel {METHOD FOR MANUFACTURING TOUCH PANNEL}

The present invention relates to a method for manufacturing a touch panel.

With the development of mobile communication technology, terminals such as mobile phones, PDAs, and navigation have expanded their functions to more diverse and complex media providing means such as audio, video, wireless internet web browsers, etc. have. Therefore, a larger display screen is required to be implemented within the limited size of the electronic information terminal, and thus, a display method using a touch panel is receiving more attention. In addition, the touch panel has an advantage of saving space compared to the conventional key input method by integrating the screen and the coordinate input means. Therefore, recently developed display devices employ a display employing a touch panel to further increase screen size and user convenience. Such a touch panel can be used as a flat panel display device such as an electronic notebook, a liquid crystal display device (LCD), a plasma display panel (PDP), and an electro luminescence (EL) And is a tool used by a user to select desired information while viewing the image display apparatus.

Meanwhile, with the rapid expansion of the thin-film display business centered on LCDs, the demand for transparent conductive film materials is increasing rapidly. Indium thin oxide (ITO) has been mainly used as such a transparent conductive film material. Given the increasing demand for applications related to the outstanding properties of ITO as a transparent electrode, the consumption of these materials is expected to increase in the future. However, Indium, which constitutes ITO, is one of the rare rare and depleted resources, and its supply is greatly reduced. Experts say that indium will be depleted in as little as 10 years or as long as 25 years. This is because scarcity is high because indium is purified as a by-product of zinc ore. Even before depletion, a sharp rise in indium prices is driving up manufacturing costs for related applications, making it very urgent to develop new transparent conductive films that do not contain indium.

The present invention has been made to solve the above problems, an object of the present invention, to provide a touch panel in which a transparent electrode is formed of a metal thin film formed with a fine pattern in place of ITO, furthermore, on both sides of the transparent substrate By simultaneously patterning the formed photoresist layer, to provide a method of manufacturing a touch panel improved in the degree of matching between the metal mesh electrode formed on one surface of the transparent substrate and the metal mesh electrode formed on the other surface.

In a method of manufacturing a touch panel according to a preferred embodiment of the present invention, (A) preparing a transparent substrate having a first photoresist layer formed on one surface, a second photoresist layer formed on the other surface, and a photomask having a mesh pattern formed thereon Disposing on top of the first photoresist layer; (B) irradiating the photomask with light to simultaneously cure the first photoresist layer and the second photoresist layer; (C) developing the first photoresist layer and the second photoresist layer to form a first opening in the first photoresist layer and a second opening in the second photoresist layer; And (D) forming a metal material in the first opening and the second opening, and peeling the first photoresist layer and the second photoresist layer to form a first metal mesh layer on one surface of the transparent substrate. Forming a second metal mesh layer on the other surface of the transparent substrate.

Here, in the step (B), by irradiating light to the photomask, the first photoresist layer is selectively cured, and at the same time, the second light is transmitted to the other surface of the transparent substrate by passing through the transparent substrate. And selectively curing the photoresist layer.

In addition, after the step (D), (E) selectively removing the first metal mesh layer to form a first metal mesh electrode; And (F) selectively removing the second metal mesh layer to form a second metal mesh electrode.

In addition, the step (E), (E1) forming an etching paste on the upper surface of the first metal mesh layer to selectively expose the first metal mesh layer; And (E2) removing the first metal mesh layer in contact with the etching paste to form a first metal mesh electrode.

In addition, the step (F) may include: (F1) forming an etching paste on an upper surface of the second metal mesh layer to selectively expose the second metal mesh layer; And (F2) removing the second metal mesh layer in contact with the etching paste to form a second metal mesh electrode.

In the step (B), the planar shape of the first opening portion and the second opening portion are the same, and the first opening portion and the second opening portion are aligned with the transparent substrate interposed therebetween.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

According to the present invention, there is an effect of improving the degree of matching between the metal mesh electrode formed on one surface of the transparent substrate and the metal mesh electrode formed on the other surface.

In addition, according to the present invention, since the photoresist layers formed on both sides of the transparent substrate can be simultaneously exposed using a single light source disposed on one side of the transparent substrate, no additional equipment or additional cost for alignment adjustment is required. Therefore, there is an effect that can reduce the manufacturing cost and process time. In addition, since the metal mesh electrode and the electrode wiring can be simultaneously formed on the transparent substrate, the process time can be shortened.

1 to 10 are views showing a manufacturing method of a touch panel according to a preferred embodiment of the present invention in the order of processes;
11A is a perspective view of a touch panel according to an embodiment of the present invention;
11B is a front view of a touch panel according to an embodiment of the present invention; And
11C is a rear view of the touch panel according to the embodiment of the present invention;
The figure which shows.

The objects, specific advantages, and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

1 to 10 are views showing a manufacturing method of the touch panel 100 according to a preferred embodiment of the present invention in the order of process. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in FIG. 1, photoresist layers 210 and 220 are formed on both surfaces of the transparent substrate 110. In the present specification, in order to express the invention clearly, both surfaces of the transparent substrate 110 are defined as one surface of the transparent substrate 110 and the other surface of the transparent substrate 110, respectively, and a photoresist formed on one surface of the transparent substrate 110. The photoresist layer formed on the other surface of the first photoresist layer 210 and the transparent substrate 110 is referred to as a second photoresist layer 220. The main technical feature of the present invention is to simultaneously pattern two photoresist layers 210 and 220 respectively formed on both sides of the transparent substrate 110, which is possible because the transparent substrate 110 has a light transmitting property. Accordingly, the transparent substrate 110 employed in the present invention preferably has a transmittance of at least 80% or more, and a support force capable of supporting the metal mesh electrodes 415 and 425 (see FIG. 10) to be described later. In consideration of the above-described transmittance and supporting force, the material of the transparent substrate 110 is polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyether sulfone ( PES), Cyclic Olefin Polymer (COC), Triacetylcellulose (TAC) Film, Polyvinyl Alcohol (PVA) Film, Polyimide (PI) Film, Polystyrene (PS), Biaxially Stretched Polystyrene (Kresin) Although it is preferable to form with containing biaxially oriented PS (BOPS), glass (GLASS), or tempered glass, it is not necessarily limited to this.

Meanwhile, a dry film method or a liquid photosensitive material method may be used as a method of forming the photoresist layers 210 and 220 on the transparent substrate 110. The dry film method is a method of thermally compressing a dry film on both sides of a substrate using a laminator, and the liquid photosensitive material method is a method of coating and drying a liquid photosensitive material photosensitive by ultraviolet (UV) on the substrate. Currently known coating methods include a screen coating method, a dip coating method, a roll coating method, and an ED (Electro Deposition) method.

Next, as shown in FIG. 2, the patterned photomask 300 is provided, and the photomask 300 is brought into close contact with or close to the upper portion of the first photoresist layer 210. Technical features of the present invention are to arrange a light source (not shown) on one surface of the transparent substrate 110 or one of the other surfaces, and simultaneously expose both surfaces of the transparent substrate 110 by using light emitted from the light source. Therefore, the photomask 300 may be disposed not only on the first photoresist layer 210 but also on the second photoresist layer 220. At this time, a pattern of a mesh structure is formed in the photomask 300 to selectively transmit light.

Next, as shown in FIG. 3, ultraviolet rays are irradiated from the upper portion of the photomask 300 to selectively cure the first photoresist layer 210 and the second photoresist layer 220. In the present embodiment, the first and second photoresist layers 210 and 220 are formed using a negative type photoresist, and the present process will be described in more detail.

First, the first photoresist layer 210 disposed in close proximity to the photomask 300 is selectively exposed. A portion of the first photoresist layer 210 exposed to ultraviolet rays is cured by a polymerization reaction, and portions other than the first photoresist layer 210 do not change. At the same time, the light reaching the first photoresist layer 210 through the photomask 300 passes through the transparent substrate 110 and then the second photoresist layer 220 formed on the other surface of the transparent substrate 110. Reach optional. Similarly, a portion of the second photoresist layer 220 exposed to ultraviolet rays is cured by a polymerization reaction, and portions other than the second photoresist layer 220 do not change. In particular, in the present invention, the first photoresist layer 210 and the second photoresist layer 220 are cured in the same shape. In FIG. 3, the cured portions of the photoresist layers 210 and 220 are darker. The cured portion and the uncured portion of the photoresist layers 210 and 220 were divided.

Next, as shown in FIG. 4, the first photoresist layer 210 and the second photoresist layer 220 are developed at the same time, and the portion which is cured by being exposed to ultraviolet rays is left on the transparent substrate 110. The hardened portion is dissolved in the developer and removed. When the uncured portions of the photoresist layers 210 and 220 are selectively removed, a first opening 213 is formed in the first photoresist layer 210 and a second opening 223 is formed in the second photoresist layer 220. . After development, it is preferable to perform a water washing and drying process in order to remove the developer and the like remaining on the substrate.

Next, as illustrated in FIGS. 5 and 6, the metal material 400 on the first photoresist layer 210 and the second photoresist layer 220, the first opening 213, and the second opening 223. ), The first photoresist layer 210 and the second photoresist layer 220 remaining on the transparent substrate 110 are peeled off to form a first metal on one surface of the transparent substrate 110. The second metal mesh layer 420 is formed on the other surface of the mesh layer 410 and the transparent substrate 110 (FIG. 6). 6A is a cross-sectional view of the transparent substrate 110 having the metal mesh layers 410 and 420 formed on both surfaces thereof, and FIG. 6B is a perspective view of the transparent substrate 110 having the metal mesh layers 410 and 420 formed on both surfaces thereof. The metal material 400 includes gold (Au), silver (Ag), palladium (Pd), platinum (Pt), aluminum (Al), copper (Cu), nickel (Ni), tin (Sn), and alloys thereof , Indium tin oxide (ITO), and the like, and the method of forming the metal material 400 includes, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), and plasma enhanced chemical vapor deposition (PECVD). Sputtering process, screen printing, gravure, gravure offset or direct printing process such as inkjet, coating process, wet or Dry plating processes can be applied. Meanwhile, in order to increase adhesion to the transparent substrate 110, it is preferable to deposit the metal material 400 after first depositing a material such as titanium (Ti).

Through the above process, the first metal mesh layer 410 and the second metal mesh layer 420 are simultaneously formed on both surfaces of the transparent substrate 110, and are exposed and developed by one photomask 300. Since the process has been carried out, there is an excellent matching effect.

The processes up to now have been the process of forming the metal mesh layers 410 and 420 on the transparent substrate 110 by finely patterning the photoresist layers 210 and 220 and then depositing the metal material 400. The metal mesh layers 410 and 420 formed on both surfaces of the substrate 110 are patterned more widely to form the metal mesh electrodes 415 and 425. That is, the metal mesh electrodes 415 and 425 have individual electrodes having various planar shapes regularly and repeatedly arranged, and the individual electrodes have a metal mesh structure. The first metal mesh electrode 415 is formed by removing a portion of the first metal mesh layer 410, and the second metal mesh electrode 425 is formed by removing a portion of the second metal mesh layer 420.

As shown in FIGS. 7 and 8, in order to form the first metal mesh electrode 415, first, an etching is performed on the upper surface of the first metal mesh layer 410 so that a part of the first metal mesh layer 410 is exposed. Paste 500 is selectively printed (FIG. 7). Specifically, the etching paste 500 is printed on the metal mesh to be etched by using a screen mask (not shown) on the transparent substrate 110 on which the first metal mesh layer 410 is formed. FIG. 7A is a cross-sectional view illustrating a structure in which an etching paste is partially formed on the first metal mesh layer 410, and FIG. 7B is a perspective view of the structure.

Next, the etching paste 500 is heated and dried to etch the first metal mesh layer 410, and when the first metal mesh layer 410 in a portion in contact with the etching paste 500 is removed by etching, the cleaning process is performed. Finish with (Fig. 8). In addition to the screen printing method described above, the etching paste 500 may be printed by various printing methods, for example, aerosol jet, ink jet, flexo, gravure, or the like. There is a printing method.

9 and 10, in order to form the second metal mesh electrode 425, the upper surface of the second metal mesh layer 420 is first exposed so that a part of the second metal mesh layer 420 is exposed. The etching paste 500 is selectively printed on (Fig. 9). Specifically, the etching paste 500 is printed on the metal mesh to be etched by using a screen mask (not shown) on the transparent substrate 110 on which the second metal mesh layer 420 is formed. Next, the etching paste 500 is heated and dried to etch the second metal mesh layer 420, and when the second metal mesh layer 420 in a portion in contact with the etching paste 500 is removed by etching, the cleaning process is performed. Finish with (Fig. 10).

Meanwhile, the shapes of the first metal mesh electrode 415 and the second metal mesh electrode 425 may be variously modified depending on how to set a region where the etching paste 500 is printed on the metal mesh layers 410 and 420. Do. For example, FIG. 11 illustrates a metal mesh electrode formed by repeatedly arranging diamond-shaped metal electrodes in one direction. FIG. 11A illustrates a diamond-shaped first metal mesh electrode 415 formed on one surface of the transparent substrate 110 in a perspective view. 11B and 11C are front and rear views of FIG. 11A. That is, the first metal mesh electrode 415 formed on one surface of the transparent substrate 110 is formed so that the diamond metal electrodes are repeatedly arranged in the Y-axis direction (FIG. 11B), and the second metal mesh electrode formed on the other surface of the transparent substrate 110 is formed. The metal mesh electrode 425 is formed such that the diamond-shaped metal electrode is repeatedly arranged in the X-axis direction (FIG. 11C). In this case, the second metal mesh electrode 425 is removed by etching of the first metal mesh layer 410. The second metal mesh layer 420 may be selectively formed on the other surface of the transparent substrate 110 so as to correspond to the formed region. The structure of the metal mesh electrode of the type shown in FIG. 11 is merely exemplary, and the metal mesh electrode implemented with the electrode structure of all shapes known in the art will also be included in the scope of the present invention.

Although a preferred embodiment of the present invention has been described in detail, this is for explaining the present invention in detail, the manufacturing method of the touch panel according to the present invention is not limited to this, within the technical spirit of the present invention It is clear that modifications and improvements are possible by those with knowledge of the world.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

100: touch panel 110: transparent substrate
210: first photoresist layer 220: second photoresist layer
213: first opening 223: second opening
300: photomask 400: metal material
410: first metal mesh layer 420: second metal mesh layer
415: first metal mesh electrode 425: second metal mesh electrode
500: etching paste

Claims (6)

(A) preparing a transparent substrate having a first photoresist layer formed on one surface, a second photoresist layer formed on the other surface, and disposing a photomask on which a mesh pattern is formed on the first photoresist layer;
(B) irradiating the photomask with light to simultaneously cure the first photoresist layer and the second photoresist layer;
(C) developing the first photoresist layer and the second photoresist layer to form a first opening in the first photoresist layer and a second opening in the second photoresist layer; And
(D) a metal material is formed in the first opening and the second opening, and the first photoresist layer and the second photoresist layer are peeled off to form a first metal mesh layer and the transparent surface on one surface of the transparent substrate. Forming a second metal mesh layer on the other surface of the substrate;
Method of manufacturing a touch panel comprising a.
The method according to claim 1,
Step (B) is,
Irradiating light to the photomask to selectively cure the first photoresist layer, and simultaneously harden the second photoresist layer with light transferred through the transparent substrate to the other surface of the transparent substrate. ;
Method of manufacturing a touch panel comprising a.
The method according to claim 1,
After the step (D),
(E) selectively removing the first metal mesh layer to form a first metal mesh electrode; And
(F) selectively removing the second metal mesh layer to form a second metal mesh electrode;
Method of manufacturing a touch panel further comprising.
The method according to claim 3,
Step (E),
(E1) forming an etching paste on an upper surface of the first metal mesh layer to selectively expose the first metal mesh layer; And
(E2) forming a first metal mesh electrode by removing the first metal mesh layer in contact with the etching paste;
Method of manufacturing a touch panel comprising a.
The method according to claim 3,
Step (F) is
(F1) forming an etching paste on an upper surface of the second metal mesh layer to selectively expose the second metal mesh layer; And
(F2) forming a second metal mesh electrode by removing the second metal mesh layer in contact with the etching paste;
Method of manufacturing a touch panel comprising a.
The method according to claim 1,
In the step (B), the planar shape of the first opening portion and the second opening portion is the same, and the first opening portion and the second opening portion are aligned with the transparent substrate therebetween. Manufacturing method.

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