CN204833227U - Contact screen - Google Patents
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- CN204833227U CN204833227U CN201520468605.3U CN201520468605U CN204833227U CN 204833227 U CN204833227 U CN 204833227U CN 201520468605 U CN201520468605 U CN 201520468605U CN 204833227 U CN204833227 U CN 204833227U
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- screen
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Abstract
The utility model provides a contact screen, including base plate, frame and display circuit, the base plate include frame district and by the visible area that the frame district encloses, the frame forms the frame district, show that the circuit forms the visible area, wherein, have the printing ink layer in the frame district and reserve regionally, reserve regional be on the base plate not by the region that the printing ink layer covered, reserve the region and plated metal LOGO. Therefore, the utility model discloses the short circuit problem of traditional contact screen's conductive film bonding land can not appear in contact screen, can not influence contact screen's electrical property to contact screen's yield has been improved.
Description
Technical field
The utility model relates to display device field, particularly relates to a kind of touch-screen.
Background technology
Manufacturing industry most important development trend post-industrial age that intellectuality being, touch-screen preferably resolves the man-machine interaction bottleneck problem in Intelligent Process, and change its business model (taking smart mobile phone as typical case), facilitate whole industrial chain to develop in a healthy way, therefore have bright prospects, can be widely used in the electronic product such as mobile phone, PDA/ multimedia.By touch sensible principle, existing touch-screen is mainly divided into resistance-type, condenser type, surperficial infrared type touch-screen.Wherein, capacitive touch screen has that structure is simple, transmittance is high, rub resistance, resistance to ambient humidity temperature variation, long service life, can realize the advantages such as multiple point touching, and day by day becomes market centre and the market focus of touch-screen.
In order to effectively reduce touch-control module cost, meet the lightening market trend of terminal consumption electronic product simultaneously, nearly 2 years touch-control industries are actively set about research and development and are reduced (Indiumtinoxide, tin indium oxide) ito thin film or ito glass consumption, layout development individual layer integrated capacitor formula touch-screen (oneglasssolution, OGS), embedded touch or glass film technology.Wherein OGS is a kind of novel capacitive touch screen, and ito glass and cover glass are integrated into a sheet glass.In OGS processing procedure, the general first serigraphy frame ink of glass surface makes circuit again, then cut, CNC, then carry out LOGO serigraphy.But touch-screen LOGO is generally mirror-like silver design, need to use mirror-like silver ink, the resin in mirror-like silver ink is mixed with metal aluminium flake, if ink overflow can cause touch-screen conducting film bonding land bad in serigraphy, affect the electrical property of touch-screen, cause OGS yield to reduce.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of touch-screen, to improve the yield of touch-screen.
To achieve these goals, the utility model embodiment provides following technical scheme:
The utility model provides a kind of touch-screen, comprise substrate, frame and display circuit, the visible area that described substrate comprises rim area and surrounded by described rim area, described frame is formed in described rim area, described circuit is formed in described visible area, wherein, described rim area has reserved area, described reserved area is not printed with the region of ink when being and carrying out ink printing frame on substrate, described reserved area is coated with metal LOGO.
Wherein, the thickness of described metal LOGO is between 2.5 microns to 3 microns.
Wherein, described metal LOGO is formed by metal A g or Mo-Al-Mo complex metal plating layer.
Wherein, described touch-screen also comprises peripheral circuit, and described peripheral circuit is formed in described rim area and is formed in printing ink layer surface, and one-body molded with described metal LOGO.
Wherein, the integrated capacitive touch screen of described touch-screen.
The utility model has supplied a kind of touch-screen, comprise substrate, frame and display circuit, the visible area that described substrate comprises rim area and surrounded by described rim area, described frame is formed in described rim area, described circuit is formed in described visible area, wherein, described rim area has reserved area, described reserved area is not printed with the region of ink when being and carrying out ink printing frame on substrate, described reserved area is coated with metal LOGO.Therefore, the utility model touch-screen there will not be the short circuit problem of the conducting film bonding land of conventional touch screen, can not affect the electrical property of touch-screen, thus improves the yield of touch-screen.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical solution of the utility model, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained as these accompanying drawings.
The schematic diagram of a kind of touch-screen that Fig. 1 provides for the utility model embodiment.
Fig. 2 is the process flow diagram of LOGO method for making first embodiment of touch-screen in Fig. 1.
Fig. 3 is the process flow diagram of step 103 in Fig. 2.
Fig. 4 is the process flow diagram of step 104 in Fig. 2.
Fig. 5 is the process flow diagram of LOGO method for making second embodiment of touch-screen in Fig. 1.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
To understand, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.On the contrary, when an element be called as on " directly existing " another element or layer, " being directly connected to " or " being directly coupled to " another element or layer time, there is not intervening elements or layer.The identical mark that meets refers to identical element all the time.In this used time, term "and/or" comprises any of one or more associated listed items and all combinations.
To understand, although first, second grade of term can be used here to describe various element, assembly, region, layer and/or part, these elements, assembly, region, layer and/or part should not be subject to the restriction of these terms.These terms are only for differentiating an element, assembly, region, layer or part and another element, assembly, region, layer or part.Therefore, the first element discussed below, assembly, region, layer or part can be called as the second element, assembly, region, layer or part and not deviate from instruction of the present utility model.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.To understand, space relative terms is intended to contain except the orientation shown in figure, device different orientation in use or operation.Such as, if the device in accompanying drawing is reversed, be then described to " " element of other elements or feature " under " or " below " will in other elements or feature " top ".Therefore, exemplary term " ... below " can contain on and under two kinds of orientations.Device can otherwise orientation (90-degree rotation or other orientations), and space relativity descriptor used is here interpreted accordingly.
Terminology used here is only to describe specific embodiment, does not really want to limit the utility model.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Will be further understood that, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, operation, element and/or assembly, but does not get rid of other features one or more, entirety, step, operation, element, the existence of assembly and/or its combination or increase.
Unless otherwise defined, all terms used herein (comprising technical term and scientific terminology) all have the identical meanings that the those of ordinary skill in field belonging to the utility model is understood usually.Will be further understood that, the term defined in such as universaling dictionary, otherwise should be interpreted as having the implication that implication with them in the linguistic context of association area is consistent, and should not be interpreted as idealized or excessive formal meaning, unless so defined clearly at this.
Refer to Fig. 1, the utility model embodiment provides a kind of touch-screen 500.Described touch-screen comprises substrate 510, frame and circuit.The visible area 514 that described substrate 510 comprises rim area 512 and surrounded by described rim area 512.Described frame is formed in described rim area 512.Described circuit is formed in described visible area 514.Wherein, described rim area has reserved area, be not printed with the region of ink when described reserved area is and carries out ink printing frame on substrate, described reserved area is coated with metal LOGO.As described in Figure, the pattern of described metal LOGO can be letter, as ABC.Also other pattern can be changed to according to actual needs.
In the present embodiment, described metal LOGO is formed by metal A g or Mo-Al-Mo complex metal plating layer.The integrated capacitive touch screen of described touch-screen.The thickness of described metal LOGO is between 2.5 microns to 3 microns.In other embodiments, described metal LOGO also can be other metals LOGO according to actual needs.
Alternatively, described touch-screen 500 also comprises peripheral circuit (not shown).Described peripheral circuit is formed in described rim area, and one-body molded with described metal LOGO.
It should be noted that, so-called described peripheral circuit and described metal LOGO one-body molded be structurally, described peripheral circuit and described metal LOGO are seamless link, and both are formed simultaneously, and material is identical.
In the present embodiment, described touch-screen 500 comprises substrate 510, frame and circuit.The visible area 514 that described substrate 510 comprises rim area 512 and surrounded by described rim area 512.Described frame is formed in described rim area 512.Described circuit is formed in described visible area 514.Wherein, described rim area has printing ink layer and reserved area, described reserved area is not by region that described printing ink layer covers on substrate.Described reserved area is coated with metal LOGO.Therefore, the utility model touch-screen 500 there will not be the short circuit problem of the conducting film bonding land of conventional touch screen, can not affect the electrical property of touch-screen 500, thus improves the yield of touch-screen 500.
Refer to Fig. 2, the utility model first scheme first embodiment provides a kind of touch-screen LOGO method for making.Described method comprises the steps:
Step 101, forms frame by being printed on substrate, to form the first semi-manufacture, wherein, described frame has reserved area.
It should be noted that, described substrate being formed frame is obtained by screen printing ink.Alternatively, serigraphy can adopt silk, nylon, dacron or stainless steel metal silk screen.Above-mentioned silk screen is stretched tight on screen frame, its tensioning is fixed.Manual method of carving paint film or photochemistry plate-making is adopted to obtain serigraphy half tone used.During printing, pour ink in one end of screen printing forme, ink can not pass through mesh voluntarily under without the effect of external force, and when scraping ink with sdueegee with certain pitch angle and pressure, ink is transferred on the substrate under half tone by half tone.Have gap between half tone and substrate, during printing, under the effect of sdueegee, forme and substrate form a nip, form printing surface, thus realize the formation of frame without several nips.Wherein, the minimum nip width that serigraphy obtains can accomplish about 100 μm.The substrate being printed with frame constitutes described first semi-manufacture.Described reserved area is not printed with the region of ink when being and carrying out ink printing frame on substrate.
Step 102, metal-coated membrane on described first semi-manufacture, to form the second semi-manufacture.
It should be noted that, described metal film is Ag film or Mo-Al-Mo metal film.In the present embodiment, on described first semi-manufacture, metal-coated membrane adopts magnetron sputtering mode metal-coated membrane on described first semi-manufacture.Particularly, vacuum magnetic-control sputtering technology utilizes plasma in Ar-O2 mixed gas under the effect of electric field and alternating magnetic field, accelerated high-energy particle bombardment target material surface.After energy exchange, the atom of target material surface departs from former lattice and overflows, and transfers to matrix surface and film forming.In magnetron sputtering technology, the atom spilt be with the energetic ion positive energy exchange with few thousand electron volts after splash out, its energy is higher, often exceeds 1 ~ 2 order of magnitude than evaporation atom, thus comparatively evaporates better by the film of sputtering method formation and the adhesiveness of substrate.If substrate adds suitable bias voltage when sputtering, can take into account the cleaning of substrate, this is also beneficial to the Step Coverage of film former.In addition, high-melting-point, the low-vapor pressure material film that can not prepare by evaporation technology can be prepared with sputtering method, be convenient to the film preparing compound or alloy.
Step 103, utilizes mask to described second semi-manufacture exposure imaging, the predetermined pattern on mask to be formed on the region of the described reserved area of described second half-finished correspondence.
It should be noted that, the present embodiment adopts wet development mode.Developer solution is the alkali lye that concentration is lower, as KOH, NaOH, organic base etc.
Refer to Fig. 3, alternatively, this step S103 can comprise:
Step 1031, described second semi-manufacture are coated with photoresist.
It should be noted that, in the present embodiment, adopt spin coating mode or method of roll coating to be coated with photoresist in described second surface of semi-finished.In other embodiments, other mode also can be adopted in described second surface of semi-finished to be coated with photoresist.
Step 1032, utilizes the ultraviolet of preset wavelength to scribble on the second semi-manufacture of photoresist by being radiated at after mask, thus the predetermined pattern on described mask is intactly copied on the region of the described reserved area of described second half-finished correspondence.
It should be noted that, in the present embodiment, described photoresist is eurymeric photoresist.Described eurymeric photoresist illumination part of photoresist under the ultraviolet irradiation of described preset wavelength is decomposed, and solubleness increases, and described second half-finished frame region forms the pattern consistent with the predetermined pattern on described mask.In other examples, described photoresist also can be negative light resistance agent.The illumination part generation cross-linking reaction of described negative light resistance agent photoresist under the ultraviolet irradiation of described preset wavelength, solubleness diminishes, and described second half-finished frame region forms the pattern contrary with the predetermined pattern on described mask.
Step 104, by etching described second semi-manufacture with described pattern, stripping forms metal LOGO pattern in described reserved area.
Refer to Fig. 4, alternatively, this step S104 can comprise:
Step 1041, adopt acid mixture as on etchant and described second semi-manufacture not by the metal film generation chemical reaction that described photoresist is protected, etch obtain LOGO pattern, to form the 3rd semi-manufacture.
Wherein, described acid mixture comprises phosphoric acid and nitric acid.
Step 1042, peels off described 3rd half-finished photoresist by the alkali lye of preset concentration, thus obtains metal LOGO pattern in described reserved area.
The alkali lye of described preset concentration is KOH, NaOH or organic base.
In the present embodiment, touch-screen LOGO method for making comprises: form frame by being printed on substrate, to form the first semi-manufacture, wherein, described frame has reserved area; Metal-coated membrane on described first semi-manufacture, to form the second semi-manufacture; Utilize mask to described second semi-manufacture exposure imaging, the predetermined pattern on mask to be formed on the region of the described reserved area of described second half-finished correspondence; And by etching described second semi-manufacture with described pattern, stripping forms metal LOGO pattern in described reserved area.Therefore, LOGO method for making of the present utility model, the ink overflow problem in there will not be traditional LOGO to make, thus after avoiding ink ink overflow, cause the short circuit problem of touch-screen conducting film bonding land, therefore, the electrical property of touch-screen can not be affected, improve the yield of touch-screen.
Refer to Fig. 5, the utility model first scheme second embodiment provides a kind of touch-screen LOGO method for making.The method that described second embodiment provides is similar to the method that described first embodiment provides, in the second embodiment, and described method step 401-404.Wherein, described step 401 is identical with described step 101.Described step 402 is identical with described step 102.Therefore step 401 and 402 repeats no more.
Step 403, utilize mask to described second semi-manufacture exposure imaging, while on the region predetermined pattern on mask being formed in the described reserved area of described second half-finished correspondence, the default peripheral wiring pattern on mask is formed on the region of the described frame of described second half-finished correspondence.
Step 404, by etching described second semi-manufacture with the peripheral trace-diagram case of predetermined pattern and budget, stripping forms metal LOGO pattern, and form peripheral metal cabling on described frame in described reserved area.
It should be noted that, by step 403 and 404 known, described metal LOGO and described peripheral metal cabling are made simultaneously (i.e. both seamless links), further increase production efficiency.And described metal LOGO is identical with described peripheral metal cabling material.
In addition, described touch-screen LOGO method for making comprises and forms frame by being printed on substrate, to form the first semi-manufacture, wherein, described frame has reserved area; Metal-coated membrane on described first semi-manufacture, to form the second semi-manufacture; Utilize mask to described second semi-manufacture exposure imaging, while on the region predetermined pattern on mask being formed in the described reserved area of described second half-finished correspondence, the default peripheral wiring pattern on mask is formed on the region of the described frame of described second half-finished correspondence; And by etching described second semi-manufacture with the peripheral trace-diagram case of predetermined pattern and budget, stripping forms metal LOGO pattern, and form peripheral metal cabling on described frame in described reserved area.Therefore, LOGO method for making of the present utility model, the ink overflow problem in there will not be traditional LOGO to make, thus after avoiding ink ink overflow, cause the short circuit problem of touch-screen conducting film bonding land, therefore, the electrical property of touch-screen can not be affected, improve the yield of touch-screen.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (5)
1. a touch-screen, comprise substrate, frame and display circuit, the visible area that described substrate comprises rim area and surrounded by described rim area, described frame is formed in described rim area, described circuit is formed in described visible area, wherein, described rim area has printing ink layer and reserved area, described reserved area is that described reserved area is coated with metal LOGO not by the region that described printing ink layer covers on substrate.
2. touch-screen as claimed in claim 1, it is characterized in that, the thickness of described metal LOGO is between 2.5 microns to 3 microns.
3. touch-screen as claimed in claim 1, it is characterized in that, described metal LOGO is formed by metal A g or Mo-Al-Mo complex metal plating layer.
4. touch-screen as claimed in claim 1, it is characterized in that, described touch-screen also comprises peripheral circuit, and described peripheral circuit is formed in described rim area and is formed in printing ink layer surface, and one-body molded with described metal LOGO.
5. touch-screen as claimed in claim 1, is characterized in that, the integrated capacitive touch screen of described touch-screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520468605.3U CN204833227U (en) | 2015-07-02 | 2015-07-02 | Contact screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520468605.3U CN204833227U (en) | 2015-07-02 | 2015-07-02 | Contact screen |
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| Publication Number | Publication Date |
|---|---|
| CN204833227U true CN204833227U (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520468605.3U Expired - Fee Related CN204833227U (en) | 2015-07-02 | 2015-07-02 | Contact screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325628A (en) * | 2015-07-02 | 2017-01-11 | 南昌欧菲光科技有限公司 | Method for manufacturing touch screen LOGO, and touch screen |
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- 2015-07-02 CN CN201520468605.3U patent/CN204833227U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325628A (en) * | 2015-07-02 | 2017-01-11 | 南昌欧菲光科技有限公司 | Method for manufacturing touch screen LOGO, and touch screen |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20180702 |
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| CF01 | Termination of patent right due to non-payment of annual fee |