KR20120120344A - Method for designing resin-coated saw wire - Google Patents

Abstract

When the workpiece is cut using a resin-coated saw wire coated with a resin on the surface of the steel wire, a process for designing a resin-coated saw wire having a shallow depth of processing altered layer and obtaining a cut surface having a smooth surface is provided. (1) covering the steel wire with a resin having a predetermined hardness, (2) cutting the workpiece with the obtained resin-coated cowwound, (3) examining the depth of the damaged layer on the cut surface of the workpiece, (5) In the case of failure, the steel wire is coated with a stiffer resin, and the above-mentioned (2) to (4) are repeated to determine whether or not the machined altered layer Adjust the hardness of the resin so that the depth is acceptable.

Description

Resin-clad saw wire design method {METHOD FOR DESIGNING RESIN-COATED SAW WIRE}

TECHNICAL FIELD The present invention relates to a saw wire for use in cutting a workpiece such as silicon or ceramics by a saw machine, and more particularly, to a method for designing a resin-coated saw wire in which a resin is coated on the surface of a steel wire. .

Workpieces, such as a silicon and ceramics, are cut | disconnected by the saw machine with which the saw wire was attached. The saw wire travels in one direction or bidirectional (reciprocating direction), and the workpiece can be sliced to an arbitrary width by contacting the workpiece with the saw wire.

When cutting the workpiece, a method of cutting the workpiece (prior to method 1) while spraying a slurry containing abrasive grains (hereinafter sometimes referred to as glass abrasive grains) on the saw wire or the surface of the base wire Background Art A method of cutting a workpiece using a saw wire with a fixed abrasive grain attached and fixed to the abrasive grain (prior method 2) is known. In the former method, the glass abrasive grains contained in the sprayed slurry are drawn in between the workpiece and the saw wire, and the abrasion of the saw wire and the workpiece is promoted, so that grinding of the workpiece is promoted, and the workpiece is cut. On the other hand, in the latter method, abrasion of the workpiece is promoted by the abrasive grains fixed to the surface, so that grinding of the workpiece is promoted, and the workpiece is cut.

In addition, Patent Document 1 discloses a method of cutting a work piece (previous method 3) while embedding a solution containing free abrasive grains by using a wire coated with an abrasive grain resin film on the outer circumferential surface of steel wire such as high carbon steel. have.

By the way, for example, a solar cell is used as a substrate for cutting the silicon by saw wire. By the way, the processing altered layer (it may be called a damage layer) is formed in the cut surface of a cut body at the time of cutting | disconnection. It is pointed out that the quality of bonding to a board | substrate worsens and the characteristic as a solar cell is not fully acquired (patent document 2) in the state in which this process deterioration layer remains (patent document 2), and it is necessary to remove this process deterioration layer.

Japanese Patent Application Publication No. 2006-179677 Japanese Patent Application Laid-open No. 2000-323736

FIG. 1 shows a state in which a steel wire is used as a saw wire as in the conventional method 1, and the glass abrasive grain is sprayed on the steel wire and cut while introducing the abrasive grains. According to the researches of the present inventors, in this method, abrasive grains are drawn in the direction in which the steel wires are plunged into the workpiece, and at the same time, the abrasive grains are introduced between the steel wire and the cut surface of the workpiece (work wall). It turned out that a process is performed and a process altered layer is formed. It has also been found that the surface roughness of the cut surface is also rough.

Fig. 2 shows a state when the fixed abrasive grain is fixed to the surface of the saw wire or the workpiece is cut while the abrasive grain is embedded, as in the conventional methods 2 and 3 described above. According to the researches of the present inventors, in these methods, similarly to FIG. 1, since the grinding processing is performed also on the cut surface (work surface of the workpiece), the processing deterioration layer is deeply formed.

As shown in the said FIG. 1, FIG. 2, since the process altered layer is formed in the cut surface of a cut body in a conventional method, As pointed out by the said patent document 2, in the downstream process, this process altered layer is made Need to be removed. If this process deterioration layer removal process can be skipped, the yield and productivity of a cut | disconnected body can be improved.

In addition, the cut surface is formed with a roughened surface due to the abrasive grains used at the time of cutting, in addition to forming the processing deterioration layer. However, since the surface of a cut body is generally required to be smooth, etching is performed in the downstream process. If this etching process can be omitted, productivity of a cut | disconnected body can be improved.

This invention is made | formed in view of such a situation, The objective is when the workpiece | work is cut | disconnected using the resin coating saw wire which coat | covered resin on the surface of the steel wire, and the depth of a processing altered layer is shallow, and the cut surface of the smooth surface It is providing the design method of the resin coating saw wire which is obtained.

The present invention includes the following forms.

[1] A method for designing a resin-coated saw wire, including a step of coating a steel wire with a resin having a predetermined hardness to obtain a resin-coated saw wire;

The design method of the resin-coated saw wire which adjusts the hardness of resin so that the process deterioration layer depth in the cut surface of a workpiece | work may be made to pass by repeating following (1)-(4).

(1) The workpiece is cut by the obtained resin-coated saw wire.

(2) The depth of processing alteration layer in the cut surface of a workpiece | work is investigated.

(3) Check the passing quality of the deteriorated layer depth.

(4) In case of rejection, the steel wire is covered with a harder resin.

In addition, as a criterion of the said passability, what is necessary is just the depth of the processing deterioration layer which can acquire the effect of this invention, For example, as mentioned later, the processing deterioration layer depth 5 micrometers or less is mentioned as a criterion of acceptance.

[2] The method for designing a resin-coated saw wire according to [1], wherein when the depth of the processed altered layer is deeper than 5 µm, the steel wire is coated with a harder resin.

[3] A method of designing a resin-coated saw wire, including a step of coating a steel wire with a resin having a predetermined hardness to obtain a resin-coated saw wire.

The design method of the resin coating saw wire which adjusts the hardness of resin so that surface roughness in the cut surface of a workpiece | work may pass by repeating following (1)-(4).

(1) The workpiece is cut by the obtained resin-coated saw wire.

(2) The surface roughness in the cut surface of the workpiece is examined.

(3) Check the pass of surface roughness.

(4) In case of rejection, the steel wire is covered with a harder resin.

In addition, as a criterion of the said passability, what is necessary is just surface roughness which can acquire the effect of this invention, For example, as mentioned later, surface roughness 0.5 micrometer or less is mentioned as a criterion of acceptance.

[4] The method for designing a resin-coated saw wire according to [3], wherein when the surface roughness is rougher than 0.5 µm, the steel wire is coated with a harder resin.

[5] The method for designing a resin-coated saw wire according to any one of [1] to [4], wherein the film thickness of the resin is 2 to 15 µm.

[6] The method for designing a resin-coated saw wire according to any one of [1] to [5], wherein the wire diameter of the steel wire is 130 µm or less.

[7] A method of manufacturing a cut body by cutting a workpiece by a resin coated saw wire, the process of spraying abrasive grains on a resin coated saw wire coated with a steel wire with a resin of which hardness is adjusted, and between the cut surface and the resin coated saw wire And a step of cutting the workpiece by introducing the abrasive grain in a direction in which the coated saw wire is cut in the workpiece while suppressing the introduction of the abrasive grain into the workpiece.

[8] The method for producing a cut body according to [7], which is cut so that the depth of the deteriorated layer on the cut surface of the workpiece is 5 µm or less.

[9] The method for producing a cut body according to [7], in which the surface roughness at the cut surface of the workpiece is cut to be 0.5 µm or less.

[10] The method for producing a cut body according to any one of [7] to [9], wherein the cut loss of the workpiece is cut so as to be 1 to 1.1 times the wire diameter of the resin-coated saw wire.

[11] The method for producing a cut body according to any one of [7] to [10], wherein the abrasive grain is sprayed and cut into diamond abrasive grains.

[12] The method for producing a cut body according to any one of [7] to [11], wherein the resin has a hardness at 120 ° C of 0.07 kPa or more.

[13] A cut product produced by the method according to any one of [7] to [12].

[14] A resin-coated saw wire used in the production method according to any one of [7] to [12].

According to the present invention, the surface of the saw wire is covered with a resin and the hardness thereof is adjusted. Therefore, the introduction of the abrasive grains between the cut surface and the resin-coated saw wire can be suppressed by the resin while the abrasive grains are drawn in and cut. Therefore, formation of the processing altered layer in the cut surface can be suppressed. Moreover, when a workpiece | work is cut | disconnected using this resin coating saw wire, the cutting body which has a smooth surface can be manufactured. Therefore, in the downstream process, the etching process for removing a process altered layer or making a surface smooth can be skipped, and productivity of a cut body can be improved.

Moreover, when the resin-coated saw wire of this invention is used, since the entry of the abrasive grain between a cut surface and a resin-coated saw wire is suppressed, cutting loss can be made small and productivity of a cut body can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows a state when the workpiece is cut | disconnected with a steel wire.
It is a schematic diagram which shows a state when the workpiece is cut | disconnected by the steel wire with a fixed abrasive grain.
It is a schematic diagram which shows the mode at the time of cutting | disconnecting a workpiece | work with the resin coating saw wire.
FIG. 4 is a drawing substitute photograph photographing the surface of the resin-coated saw wire (comparative example) after cutting the workpiece in No. 32 in Table 2. FIG.
5 (a) and 5 (b) are cross-sectional views for explaining the procedure for measuring the depth of the damaged layer.
It is a photograph drawing substitute photograph which took the cut surface of the workpiece | work in No. 25 of Table 2 with the optical microscope.
FIG. 7 is a drawing substitute photograph photographing a cut surface of a workpiece in No. 27 in Table 2. FIG.
FIG. 8 is a drawing substitute photograph photographing a cut surface of a workpiece in No. 32 in Table 2. FIG.
FIG. 9 is a drawing substitute photograph photographing a cut surface of a workpiece in No. 33 in Table 2. FIG.
FIG. 10 is a drawing substitute photograph photographing a cut surface of a workpiece in No. 35 of Table 2 with an optical microscope. FIG.
It is a drawing substitute photograph which took the cut surface of the workpiece | work of No.37 of Table 2 with the optical microscope.
It is a graph which shows the relationship between the hardness of resin measured at 120 degreeC, and the number of the abrasive grains dug into the resin surface.
It is a graph which shows the relationship between the hardness of resin measured at 120 degreeC, and the depth of the processing altered layer formed in the cut surface.

As shown in FIGS. 1 and 2, when the workpiece is cut while spraying the abrasive grain on the saw wire by using a steel wire or a steel wire with fixed abrasive grains as the saw wire, a processing altered layer is deeply formed on the cut surface of the workpiece. As a result, the surface roughness of the cut surface becomes rough.

On the other hand, when a resin-coated saw wire is used, the processing altered layer can be made shallow and the surface can be made smooth. The state at the time of cut | disconnecting a workpiece | work using a resin coating saw wire is demonstrated using FIG. As shown in FIG. 3, resin is formed on the surface of the resin-coated saw wire of the present invention, and at the time of cutting the workpiece, the abrasive is drawn between the saw wire and the workpiece cutting surface by bringing the resin on the surface into close contact with the cutting surface. Can be prevented. Therefore, the processing altered layer is hard to be formed in the cut surface, and the surface of the cut surface tends to be smooth.

By the way, when the resin coated on the surface of the steel wire is soft, as in the conventional method 3, the abrasive grains penetrate into the resin, and as shown in Fig. 2, the abrasive grain is interposed between the resin-coated saw wire and the workpiece, and thus the processed surface is deteriorated. A layer is formed.

Therefore, the inventors of the present invention prevent the abrasive grains from penetrating into the resin surface by appropriately adjusting the hardness of the resin coated on the surface of the steel wire, and when the workpiece is cut by the resin-coated saw wire, the processed deformed layer is formed. It discovered that the depth was shallow and the surface roughness of a cut surface can be made small, and this invention was completed. Specifically, it is a design method of the resin-coated saw wire which includes the process of coating a steel wire with resin of predetermined hardness, and obtaining a resin-coated saw wire, and repeating following (1)-(4) to the cut surface of a workpiece | work What is necessary is just to set it as the design method of the resin-coated saw wire which adjusts the hardness of resin so that surface characteristics (processing-deterioration layer depth, surface roughness, etc.) in a pass may pass.

(1) The workpiece is cut by the obtained resin-coated saw wire.

(2) The surface property (processing deterioration layer depth, surface roughness) in the cut surface of a workpiece | work is investigated.

(3) Check the passability of surface properties.

(4) In case of rejection, the steel wire is covered with a harder resin.

If the workpiece cut by the resin-coated saw wire is examined for the surface properties of the cut surface, and the property is rejected, the resin is designed to produce a resin-coated saw wire by coating a harder resin on the surface of the steel wire. The surface property of a cut surface can be made favorable.

When the workpiece is cut by the resin-coated saw wire while injecting the abrasive grain into the saw wire using a resin-coated saw wire adjusted to an appropriate surface hardness, the resin-coated saw wire is applied to the workpiece as shown in FIG. 3. In the direction of cutting, the abrasive grains are drawn in. However, since the introduction of the abrasive grains between the cut surface and the resin-coated saw wire is suppressed by the resin, almost no deformed layer is formed on the cut surface of the workpiece, so that the cut surface becomes smooth.

In the surface properties, the processing altered layer depth is 5 µm or less (preferably 4 µm or less, more preferably 3 µm or less), or the surface roughness [arithmetic mean roughness (Ra)] is 0.5 µm or less (preferably 0.4 µm). Hereinafter, it is recommended to design a resin-coated saw wire so that it becomes more preferably 0.3 micrometer or less). The cut body cut | disconnected by the resin coating saw wire designed as mentioned above can be used suitably as a raw material for solar cells, for example.

What is necessary is just to measure the depth of a process alteration layer, and to measure the depth of the transition etch pit introduced at the time of cutting a workpiece | work, by etching a cut surface.

What is necessary is just to measure arithmetic mean roughness Ra with surface roughness by Mitsudo Toy Corporation "CS-3200 (device name)."

Next, the resin coated saw wire which can be used suitably in this invention is demonstrated.

The resin-coated saw wire used by this invention coat | covers the resin designed according to the said guideline on the surface of a steel wire.

As said steel wire, it is preferable to use the steel wire whose tensile strength is 3000 Mpa or more. As a steel wire whose tensile strength is 3000 Mpa or more, the high carbon steel wire containing 0.5 to 1.2% of C can be used, for example. As a high carbon steel wire, the piano wire material prescribed by JIS G3502 can be used, for example. In addition, the upper limit of the tensile strength of the steel wire is preferably 5000 MPa in consideration of the possibility that the ductility disappears and the breakage may easily occur during abnormality such as sealing ratio.

It is good to make the diameter of the said steel wire as small as possible in the range which can bear the load provided at the time of cutting | disconnection, for example, 130 micrometers or less, Preferably it is 110 micrometers or less, More preferably, it is 100 micrometers or less. By reducing the diameter of the steel wire, the cutting loss can be reduced, and the productivity of the cut body can be improved. Moreover, it is preferable that the diameter of a steel wire shall be 60 micrometers or more.

As the resin, a thermosetting resin or a thermoplastic resin can be used. Among these resins, a phenol resin, an amide resin, an imide resin, a polyamideimide, an epoxy resin, a polyurethane, a formal, an ABS resin, vinyl chloride, polyester, and the like can be used. Can be used as appropriate. Particularly, polyamideimide, polyurethane, or polyester can be suitably used.

The said resin can be formed by apply | coating the commercially available varnish to the surface of the said steel wire, and heating this.

As said varnish, the varnish for an enameled ship commercially available from Totoku Toryo Co., Ltd., the electric wire varnish marketed from Kyocera Chemical Co., Ltd., etc. can be used.

As said varnish for enameled wires, the following can be used, for example.

(a) Polyurethane varnish (`` TPU F1 '', "TPU F2-NC", "TPU F2-NCA", "TPU 6200", "TPU 5100", "TPU 5200", "TPU 5700", "TPU K5 132") "TPU 3000K", "TPU3000EA", etc .; products manufactured by Totoku Toryo Kabushiki Kaisha.)

(b) polyester varnishes ("LITON 2100S", "LITON 2100P", "LITON 3100F", "LITON 3200BF", "LITON 3300", "LITON 3300KF", "LITON 3500SLD", "Neoheat 8200K2", etc.); Product made by Kyo Doryo Kabushiki Kaisha.)

(c) Polyamide-imide varnish ("Neoheat AI-00C" etc .; product made by Totoku Toryo Kabushiki Kaisha.)

(d) Polyester imide varnishes (Neoheat 8600A, Neoheat 8600AY, Neoheat 8600, Neoheat 8600H3, Neoheat 8625, Neoheat 8600E2, etc .; products manufactured by Totoku Toyo Kaobushiki Kaisha) .)

As said electric wire varnish, varnish for heat-resistant urethane copper wire (epoxy modified formal resin, such as "TVE5160-27"), varnish for formal copper wire (polyvinyl formal resin, such as "TVE5225A"), heat-resistant formal Varnishes for copper wire (epoxy modified formal resins such as `` TVE5230-27 ''), varnishes for polyester copper wire (`` TVE5350 series '', polyester resins) and the like (both manufactured by Kyocera Chemical Co., Ltd.) can be used. .

After apply | coating the said varnish to the surface of the said steel wire, it may heat-cure at 250 degreeC or more (preferably 300 degreeC or more), for example, and just coat | cover the surface of a steel wire with resin. Moreover, as an upper limit of the said thermosetting, it is preferable to set it as 400 degreeC in consideration of the possibility that the intensity | strength of a steel wire may begin to fall. The hardness of the said resin can be adjusted, for example by changing the kind of resin to coat | cover, or changing the heating temperature at the time of forming resin.

As said resin, it is preferable to use resin whose hardness when it measures at 120 degreeC is 0.07 kPa or more. That is, when cutting the work piece by the resin-coated saw wire, the wire is moved at a speed of 500 m / min, for example, and the work piece is cut while the wire and the abrasive or the wire and the work contact each other. Therefore, it is thought that the surface of a wire will raise temperature by frictional heat, and will exceed 100 degreeC. Therefore, when the hardness of the resin is adjusted based on the hardness measured at 100 ° C. or lower (for example, room temperature), the resin cannot withstand the frictional heat generated during actual work cutting, and the resin softens. There is. When the resin is softened, since the abrasive grains are more likely to penetrate into the resin, the depth of the processed deterioration layer is large and the surface may be rough.

Therefore, it is recommended to adjust the hardness of the resin based on the hardness measured at a temperature exceeding 100 ° C (for example, 120 ° C) so as not to soften even when frictional heat is generated during cutting of the workpiece. Specifically, as the resin, it is preferable to use a resin having a hardness of 0.07 kPa or more when measured at 120 ° C, and more preferably use a resin of 0.1 kPa or more. By using a resin having a hardness of 0.07 Pa or more when measured at 120 ° C., the number of abrasive grains penetrating into the resin surface can be suppressed to 20 / (50 μm × 200 μm) or less, and the processing is formed on the cut body. The depth of the deteriorated layer can be made small and the surface of the cut body can be smoothed. In addition, the hardness of resin is so good that it is hard, and the upper limit is not specifically set.

The hardness of the said resin can be measured by the nanoindentation method, for example.

What is necessary is just to set the film thickness of the said resin to 2-15 micrometers, for example. When resin is too thin, there exists a possibility that it may become difficult to form resin uniformly on the surface of a steel wire. In addition, when the resin is too thin, the resin is abraded at the initial stage of cutting, so there is a fear that the wire (steel wire) is exposed, and the wire is worn and the wire is easily broken. Therefore, the film thickness of resin becomes like this. Preferably it is 2 micrometers or more, More preferably, it is 3 micrometers or more, Especially preferably, it is 4 micrometers or more. However, when the resin is too thick, the diameter of the resin-coated saw wire increases, so that the cutting loss increases, which may deteriorate the productivity. Moreover, since the ratio of resin which occupies for the whole resin coated saw wire becomes large too much, there exists a possibility that the intensity | strength of the whole resin coated saw wire may fall. Therefore, when it is going to raise productivity and enlarges the wire flux of a wire, there exists a tendency which becomes easy to disconnect. Therefore, the film thickness of resin becomes like this. Preferably it is 15 micrometers or less, More preferably, it is 13 micrometers or less, Especially preferably, it is 10 micrometers or less. Moreover, the upper limit and the lower limit of the film thickness of the said resin can be combined arbitrarily, and it can also be set as the range of the film thickness of the said resin.

Although the diameter (wire diameter) of the said resin-coated saw wire is not specifically limited, Usually, it is about 100-300 micrometers (preferably 100-150 micrometers).

As the workpiece | work made into the cutting object by the said resin coating saw wire, silicon, ceramics, a crystal, a semiconductor member, a magnetic material, etc. can be used, for example.

Next, the conditions at the time of cutting a workpiece | work using the said resin coated saw wire and manufacturing a cut | disconnected body are demonstrated.

When cutting a workpiece | work by the said sheathed wire, an abrasive grain is sprayed on a saw wire, and a workpiece | work is cut | disconnected. As this abrasive grain, a silicon carbide abrasive grain (SiC abrasive grain), a diamond abrasive grain, etc. can be used, for example. In particular, in order to make a cut surface smooth, it is preferable to use a diamond abrasive grain.

As said diamond abrasive grain, "SCM fine diamond (brand name)" by the Smithy Materials Co., Ltd. can be used, for example. As a diamond abrasive grain, although a polycrystal type or a single crystal type can be used, it is preferable to use a single crystal type. This is because the single crystal type is hard to be broken during cutting.

The average particle diameter of the said abrasive grain is not specifically limited, For example, what is necessary is just 2-15 micrometers (preferably 4-10 micrometers, More preferably, 4-7 micrometers).

The average particle diameter of the said abrasive grain can be measured, for example by "micro track HRA (device name)" by Nikiso Corporation.

The abrasive grains are usually sprayed with a slurry dispersed in a processing liquid. As the processing liquid, a water-soluble processing liquid or an oil-based processing liquid can be used. As the water-soluble processing liquid, ethylene glycol-based processing liquid "H4" made by Yushiro Kogyo Co., Ltd., propylene glycol-based processing liquid "Hystat TMD (brand name)" by Sanyo Kasei Kogyo Co., Ltd. Can be used. As an oil-based processing liquid, Yushiro Chemical Co., Ltd. "Yoshiron Oil (brand name)" etc. can be used.

As for the density | concentration of the abrasive grain in the said slurry, what is 5-50 mass% (preferably 5-30 mass%, More preferably, 5-10 mass%) can be used.

The temperature of the slurry may be, for example, 10 to 30 ° C (preferably 20 to 25 ° C).

The conditions at the time of cutting | disconnecting a workpiece | work by the said resin coating saw wire are 0.1-0.8 mm / min (preferably 0.1-0.35 mm / min, more preferably 0.25-0.35 mm) Per minute), and the wire speed of the resin-coated saw wire may be 300 m / min or more (preferably 500 m / min or more, more preferably 800 m / min or more).

The tension (N) applied to the resin-coated saw wire is preferably set to satisfy the range of the following formula (1) calculated based on the tensile force of the element wire (steel wire before coating the resin). In the following formula (1), the range of 50 to 70% of the tensile strength (N) of the steel wire is to prevent disconnection at the time of cutting, and to set it to "-5.0" is the resin coating saw at the time of cutting. This is because the sum of the cutting load applied to the wire and the drawing load applied when the resin-coated saw wire is drawn out from the workpiece is about 5.0N.

In addition, although the tensile strength of a steel wire changes with the component composition of a steel wire and a wire diameter, when the piano wire (class A) prescribed | regulated to JIS G3522 is used, the tensile strength of the steel wire of 100 micrometers of wire diameters is 24.3 N, The tensile strength of the steel wire having a wire diameter of 120 μm is 34.4 N, and the tensile strength of the steel wire having a wire diameter of 130 μm is 39.7 N. When a piano wire (Class B) is used, the tensile strength of the steel wire having a wire diameter of 100 μm is 26.5 N and the wire diameter is used. The tensile strength of steel wire of 120 micrometers is 37.7N, and the tensile strength of steel wire of 130 micrometers of wire diameter is 45.7N.

When the workpiece is cut by the resin coated saw wire, the cutting loss of the workpiece is about 1 to 1.1 times (preferably 1 to 1.05 times, more preferably 1 to 1.04) relative to the wire diameter of the resin coated saw wire. Times, more preferably 1 to 1.03 times). Therefore, productivity of a cut | disconnected body can be improved.

That is, according to the resin-coated saw wire of this invention, since the hardness of resin is adjusted suitably, even if an abrasive grain is sprayed on a resin-coated saw wire, the inflow of the abrasive grain between a cut surface and a resin-coated saw wire is made with the said resin. Since it is suppressed, cutting loss becomes small.

On the other hand, as in the said conventional method 1, the cutting loss at the time of using a steel wire as a saw wire becomes the width which added about three times the length of the average diameter of a grain to the diameter of a steel wire. Therefore, in order to improve productivity, it is necessary to reduce the diameter of the steel wire, but there is a limit to increase the strength so that the steel wire is not disconnected, so there is a limit to reducing the cutting loss.

In addition, as in the conventional method 3, when the abrasive film is dug into the resin film, the wire diameter of the saw wire becomes large, and thus the cutting loss of the workpiece increases.

In addition, as in the conventional method 2, the cutting loss when the workpiece is cut using a steel wire with fixed abrasive grains is equal to the diameter of the steel wire with fixed abrasive grains. It is possible to reduce the diameter of or reduce the diameter of the fixed abrasive grain. However, if the diameter of the steel wire is made too small, the strength becomes insufficient, and it cannot endure the cutting load applied at the time of cutting, and there is a risk of disconnection. In addition, when the diameter of the fixed abrasive is reduced, the workpiece becomes difficult to be ground, and thus productivity is lowered.

Hereinafter, although an Example is given and this invention is demonstrated further more concretely, this invention is not restrict | limited by the following example of course, Of course, it is also possible to add and implement suitably in the range suitable for the said later description. They are all included in the technical scope of the present invention.

Example

In Experimental Example 1, the cutting loss (kerf loss) when the workpiece was cut by a saw wire to prepare a cut body was examined. In Experimental Example 2 below, the workpiece was sawed by a saw wire. When the cuts were prepared to prepare the cut bodies, the depths of the processed deformed layers formed on the cut surfaces and the surface roughness were examined.

[Experimental Example 1]

While mounting the work piece (monocrystalline silicon) on the workbench, while placing the saw wire on the upper part of the work piece and spraying the abrasive grain on the saw wire, the work piece is cut by the wire running by cutting the work piece and cutting the work piece. Loss (cuff loss) was measured.

As said saw wire, the saw wire of the kind shown in following Table 1 was used.

In No. 1 of Table 1 below, as a saw wire, a piano wire rod defined in JIS G3502 (A class, a wire rod equivalent to "SWRS 82A". Specifically, C: 0.82 mass%, Si: 0.19 mass%, Mn: Steel wire containing 0.49 mass%, and the remaining portion of the wire rod composed of iron and unavoidable impurities.

In No. 2 of Table 1 below, as the saw wire, Ni plating is performed on the surface of the steel wire fresh with a diameter of 120 μm of the piano wire used in No. 1, and the Ni-plated layer is a diamond abrasive grain having a maximum diameter of 17.5 μm. The wire with the fixed abrasive grain which fixed is used. The diameter of the wire with fixed abrasive grains was 155 μm.

No. 3-5 of Table 1 below is an example using the resin-coated saw wire which coat | covered resin by the thickness shown in following Table 1 on the surface of a steel wire as a saw wire.

As the steel wire, in No. 3 of Table 1, a fresh steel wire having a diameter of 120 µm was used for the piano wire used in No. 1, and in No. 4 of Table 1, the piano wire used in No. 1 was 130 in diameter. A steel wire fresh at µm was used, and in No. 5 of Table 1, a wire steel fresh at 110 µm in diameter was used for the piano wire used in No. 1 above.

After apply | coating the following varnish to the surface of the said steel wire, the said resin was hardened | cured and formed by heating. Specifically, prior to forming the resin, after degreasing the steel wire, the number of coatings was divided into 4 to 10 times to coat the varnish, which was heated and cured to form a resin on the surface of the steel wire.

In Nos. 3 to 5 shown in Table 1 below, varnish "W143" for polyurethane wire prescribed in JIS C2351 (manufactured by Totoku Toyo Chemical Co., Ltd., varnish "TPU F1 (brand name)" for enameled wire, coating film composition after baking) Silver polyurethane), and the heating temperature was 250 degreeC.

In Table 1 below, the diameter of the resin-coated saw wire is shown.

Next, using the saw wires of Nos. 1 to 5, single-crystal silicon (60 mm x 20 mm x 50 mm) using a multi-wire saw (manufactured by Yasunaga, "D-500") Was cut (sliced). Slicing was performed while spraying the slurry which suspended the SiC abrasive grain or the diamond abrasive grain of the average particle diameter shown in following Table 1 to the process liquid.

In No. 1 of Table 1 below, SiC abrasive grains (manufactured by Shinano Denki Siren Co., Ltd., Shinano Random Co., Ltd.) having an average particle diameter of 13 µm are used as processing grains. The slurry suspended in the "Ethylene glycol system aqueous solution" by Kogyo Co., Ltd. was used.

In Nos. 3 to 5 of Table 1 below, as abrasive grains, diamond abrasive grains (manufactured by Sumishi Materials Co., Ltd., " SCM Finer (trade name) ") having an average particle diameter of 5.6 mu m are processed liquids (Yoshiro Chemical). The slurry suspended in "Ethylene glycol system aqueous solution" by Kogyo Co., Ltd. was used.

SiC abrasive grain concentration in a slurry was 50 mass%, diamond abrasive grain concentration was all 5 mass%, the temperature of the slurry was 20-25 degreeC, and the supply amount of the slurry was 100 L / min.

Ascending speed (cutting speed) of work bench equipped with work piece is 0.3mm / min, wire speed of resin coated saw wire is 500m / min, tension of resin coated saw wire is 25N, winding number of resin coated saw wire is 41 times, The winding pitch of the resin coated saw wire was set to 1 mm.

In addition, in No. 2 of Table 1, the slicing process was performed between the saw wire and the single crystal silicon while spraying an ethylene glycol-based aqueous solution containing no abrasive grains as the processing liquid.

The cutting loss at the time of slicing under the above conditions was measured, and the results are shown in Table 1 below.

In addition, the difference (width loss) between the cutting loss and the wire diameter of the saw wire is calculated, and the results are shown in Table 1 below.

From Table 1, it can be considered as follows. No. 1 is a comparative example using a steel wire as a saw wire. When cutting a workpiece, glass abrasive grains are introduced between the steel wire and the workpiece, and the workpiece is cut excessively, resulting in a cutting loss of 160 µm. It became. In addition, the width loss was increased to 40 mu m. Therefore, productivity deteriorates. In order to narrow the cutting loss, it is conceivable to reduce the diameter of the steel wire, but since the steel wire itself is also cut at the time of cutting the workpiece, if the diameter of the steel wire is too small, breakage of the steel wire easily occurs. As in No. 1, when the diameter of steel wire is 120 micrometers, since disconnection does not generate | occur | produce, it is necessary to exchange steel wires until the diameter of steel wire reduces to 100 micrometers.

No. 2 is a comparative example using a wire with fixed abrasive grains as a saw wire, and since the workpiece is cut without spraying glass abrasive grains, the cutting loss of the workpiece is equal to the wire diameter of the wire with fixed abrasive grains. 155 micrometers.

Nos. 3 to 5 are examples in which the workpiece is cut using a resin-coated saw wire coated with a resin on the surface of the steel wire, the cutting loss of the workpiece is 125 to 147 µm, and the width loss is small to 3 to 4 µm, It can be seen that the productivity can be improved. Moreover, when the surface of the resin-coated saw wire used for the slicing process was observed visually, the abrasive grain was hardly attached.

Nos. 1 to 3 are all examples of using a steel wire having a diameter of 120 µm and having a fresh steel wire as an element wire, and therefore have the same tensile strength, and the risk of disconnection is considered to be the same. Comparing Nos. 1 to 3, the cutting loss of No. 3 (resin-coated saw wire) is the smallest, and the productivity is the best.

Based on the results obtained in Experimental Example 1, considering a case where a wafer having a thickness of 0.18 mm, which is the mainstream, is cut out of single crystal silicon having a length of 300 mm, a steel wire of No. 1 is used as the saw wire. Since the cutting loss is 160 µm, the number of wafers acquired is 882. When the wire with fixed abrasive grains of No. 2 is used, the cutting loss is 155 µm, so the number of wafers is 895 pieces, and when the resin-coated saw wire of No. 3 is used, the cutting loss is 135. Since the thickness is µm, the number of wafers acquired is 952 sheets.

In the case where the resin-coated saw wire is used, since the resin has an effect of improving the wear resistance of the steel wire, the reduction in the diameter of the steel wire itself is unlikely to occur even when slicing is performed. Therefore, the diameter of the steel wire itself can be made smaller. For example, when cutting a workpiece | work using the resin coating saw wire which coated the polyurethane resin with 6 micrometers in thickness on the surface of the 110-micrometer-thick steel wire like No. 5, a cutting loss is 125 micrometers. Since the number of wafers to be acquired is 983, productivity can be further improved.

On the other hand, in the case of the wire with fixed abrasive grains, from the viewpoint of ensuring cutting property, the average grain size of the abrasive grains is required to be 15 µm or more, and the drawn load from the wire of the wire with fixed abrasive grains is free abrasive grain. 3 to 5 times of using is required. Therefore, it is difficult to make the wire diameter of the wire with fixed abrasive grains 120 micrometers or less from a viewpoint of preventing a disconnection. Therefore, as shown in No. 2, it is difficult to make cutting loss 155 micrometers or less.

[Experimental Example 2]

When the workpiece (monocrystalline silicon) is mounted on the workbench, while the saw wire is placed above the work piece, the abrasive wire is sprayed on the saw wire, and the work piece is cut and cut by the wire running. The loss of cutting, the depth of the processed deformed layer formed on the cut surface, and the surface roughness of the cut surface were measured.

As said saw wire, the saw wire of the kind shown in following Table 2 was used.

Nos. 21 to 32 in Table 2 below are examples of using a resin-coated saw wire in which a resin is coated on the surface of a steel wire with a thickness shown in Table 2 below as a saw wire.

As the steel wire, in Nos. 21 to 32 of Table 2, a fresh wire with a diameter of 130 μm was used for the piano wire used in No. 1 of Experimental Example 1.

After apply | coating the following varnish to the surface of the said steel wire, the said resin was hardened | cured and formed by heating. Specifically, prior to resin formation, the steel wire is subjected to degreasing treatment, and then the coating varnish is divided into 4 to 10 times, and then the varnish is coated, and the resin is heated to 150 to 300 ° C, which is heated to cure and hardened. Resin was formed on the surface of the resin. The heating temperature is shown in Table 2 below.

In No.21 shown in the following Table 2, varnish "W141" for polyester wire prescribed | regulated to JIS C2351 (manufactured by Totoku Toyo Co., Ltd., varnish "LITON 2100S (brand name)" for enamel wire, the coating film composition after baking is terephthalic acid System polyester] was used.

In Nos. 22 to 28 and 30 to 32 shown in Table 2 below, varnish "W143" for polyurethane wire prescribed in JIS C2351 (manufactured by Totoku Toyo Co., Ltd., varnish for enameled wire "TPU F1 (brand name)", Polyurethane] was used for the coating film composition after baking.

In No. 29 shown in the following Table 2, the varnish for polyamide-imide wire [manufactured by Totoku Toyo Chemical Co., Ltd., the varnish for enamel wire "Neoheat AI-00C" (brand name), the coating film composition after baking is used a polyamide-imide] It was.

In No. 33 in Table 2, a steel wire fresh with a diameter of 120 μm was used for the piano wire used in No. 1 of Experimental Example 1.

In Nos. 34 and 35 of Table 2, a fresh steel wire having a diameter of 160 μm was used for the piano wire used in No. 1 of Experimental Example 1.

In Nos. 36 and 37 in Table 2 below, wires with a fixed abrasive grain used in No. 2 of Experimental Example 1 (with a diameter of 155 μm) were used.

Here, about the resin-coated saw wire shown to Nos. 25-32 of Table 2, the hardness of resin was measured by the nanoindentation method. Hardness was measured at room temperature (23 ° C) or 120 ° C. Specific measurement conditions are as follows.

<< measurement conditions common at room temperature and 120 degreeC >>

Measuring Device: Nano Indenter XP / DCM by Agilent Technologies

Analysis software: `` Test Works 4 '' by Agilent Technologies

Tip: XP

Strain rate: 0.05 / sec

Measuring point spacing: 30㎛

Standard Sample: Fused Silica

<< measurement conditions at room temperature >>

Measurement Mode: CSM (Continuous Stiffness Measurement)

Excitation vibration frequency: 45:

Excitation vibration amplitude: 2nm

Indentation Depth: up to 500nm

Measuring point: 15 points

Measurement environment: room temperature 23 ℃ in the air conditioner

The hardness measurement at room temperature was performed by the continuous stiffness measuring method, and the hardness in the range whose indentation depth from the outermost surface of a resin film is 400-450 nm was measured. Hardness measurement was performed at 15 points, and the measurement result was averaged and hardness was computed. In addition, when there existed an abnormal value (3 times or more with respect to an average value, or 1/3 or less) among the measurement results, this was removed and the result of a new measurement was added and it adjusted so that the sum total of a measurement point might be 15 points.

<< measurement conditions at 120 degreeC >>

Measurement Mode: Basic (Load Relief Measurement)

Indentation Depth: up to 450nm

Measuring point: 10 points

Measurement environment: keep the sample tray at 120 ℃ with resistance heating heater

The hardness measurement at 120 degreeC was performed by the load removal measuring method, and the hardness in the indentation depth from the outermost surface of the resin film at 450 nm position was measured. That is, when measuring hardness while heating a sample, since a continuous rigidity measuring method cannot be employ | adopted like when measuring hardness at room temperature, load is adjusted so that a measurement position may be 450 nm position indentation depth from the outermost surface. The hardness measurement was performed.

The hardness measurement at 120 degreeC was performed, attaching the said resin-coated saw wire to the metal sample tray for nanoindentation with a ceramic adhesive, heating a sample tray with a resistance heating heater, and maintaining it at 120 degreeC.

The hardness measurement at 120 degreeC was performed at 10 points, and the measurement result was averaged and hardness was computed. In addition, when there existed an abnormal value (3 times or more with respect to an average value, or 1/3 or less) among the measurement results, this was removed, and the newly measured result was added, and it adjusted so that the sum total of a measurement point might be 10 points.

The hardness measured at room temperature or 120 ° C. is shown in Table 2 below.

Next, using the saw wire, single crystal silicon (60 mm x 20 mm x 50 mm) is cut (sliced) by a multi-wire saw (manufactured by Yasunaga, Ltd., "D-500") and cut into pieces. Was prepared. The slicing process was performed while spraying the slurry which suspended the diamond abrasive grain or SiC abrasive grain of the average particle diameter shown in following Table 2 between the saw wire and single crystal silicon in ethylene glycol-type aqueous solution.

In Nos. 21, 24 to 32, 34, and 35 in Table 2 below, diamond abrasive grains (SCM Fine Diamond Co., Ltd. product, "SCM Fine Diamond (trade name)") having an average particle diameter of 5.6 µm are processed as abrasive grains. The slurry suspended in the liquid ("ethylene glycol type aqueous solution" by the Kogyo Co., Ltd.) was used.

In Nos. 22 and 23 of Table 2 below, SiC abrasive grains (manufactured by Shinano Denki Siren Kabushiki Kaisha, "Shinano Random (brand name)") having an average particle diameter of 5.6 µm are processed liquids (Yoshiro Kagyo Kogyo Co., Ltd.). The slurry suspended in the "ethylene glycol system aqueous solution" manufactured by Corporation was used.

In No. 33 of Table 2 below, as an abrasive, a SiC abrasive grain (manufactured by Shinano Denki Siren Kabushiki Kaisha, "Shinano Random (brand name)") having an average particle diameter of 13 µm was processed liquid (manufactured by Yushiro Chemical Industries, Ltd.). The slurry suspended in "ethylene glycol aqueous solution" was used.

The concentration of the diamond abrasive grains was 5% by mass, the concentrations of the SiC abrasive grains were Nos. 22 and 23, 5% by mass, and No. 33 was 50% by mass, the slurry temperature was 20 to 25 ° C, and the supply amount of the slurry was 100 L / min. It was made. Ascending speed of worktable mounted work piece is 0.1mm / min, 0.3mm / min, or 1mm / min, line speed of resin coated saw wire is 500m / min, tension of resin coated saw wire is 25N, resin coated saw wire The winding number of was set 41 times and the winding pitch of the resin coating saw wire was set to 1 mm.

Further, in Nos. 36 and 37 in Table 2, the slicing process was performed between the saw wire and the single crystal silicon while injecting an ethylene glycol-based aqueous solution containing no abrasive grains as the processing liquid.

Next, the surface of the resin-coated saw wire used for the slicing process was visually observed. As a result, hardening of the abrasive grain was hardly confirmed on the surface of the resin-coated saw wire used in Nos. 21 to 31. On the other hand, the penetration of the abrasive grain was confirmed on the surface of the resin-coated saw wire used by No.32. The figure substituted photograph which photographed the surface of the resin coating saw wire used by No.32 is shown in FIG.

Here, about the resin-coated saw wire used by Nos. 25-32, the number of the abrasive grains which penetrated into the resin surface was measured in the following procedure. That is, the surface of the used resin-coated saw wire was photographed 400 times with an optical microscope, and the number of abrasive grains observed in the 50 micrometer x 200 micrometer area | region near the center of the resin-coated saw wire was visually measured. . The measurement area is shown by the dotted line in FIG.

Next, about the cut body obtained by the slicing process, the depth of the processing alteration layer formed in the cut surface and the surface roughness of the cut surface were measured.

`` Processing Deterioration Layer Depth ''

The depth of the processed altered layer formed on the cut surface is embedded in the resin such that the cut body is inclined at 4 ° with respect to the horizontal direction as shown in Fig. 5 (a), and as shown in Fig. 5 (b). The cut body and the resin were polished to expose the cut surface of the cut body. Next, the exposed surface was etched with the etching solution of the composition shown in Table 3 below, and the processed deformed layer (transition etch pit introduced at the time of cutting the workpiece) formed at the time of cutting the workpiece was observed with an optical microscope.

The photograph taken by the optical microscope of the cut surface of a workpiece | work is shown to FIG. 6-11. Fig. 6 shows No. 25, Fig. 7 shows No. 27, Fig. 8 shows No. 32, Fig. 9 shows No. 33, Fig. 10 shows No. 35, and Fig. 11 shows No. 37.

When observed with the optical microscope, the processing deterioration layer was shown in black and this depth (thickness) was measured. The measurement results are shown in Table 2 below.

Surface roughness

As for the surface roughness of a cut surface, the arithmetic mean roughness Ra was measured over 10 mm with respect to a cutting direction (depth direction of cutting) using Mitsudo Co., Ltd. "CS-3200 (device name)." The measurement results are shown in Table 2 below.

From Table 2, it can be considered as follows. Nos. 21 to 31 are examples in which a cut body is manufactured using a resin-coated saw wire obtained through the process specified in the present invention, and the depth of the processing altered layer formed on the cut surface is shallow to 5 µm or less, and the arithmetic mean roughness of the cut surface. Ra is almost smooth at 0.5 micrometer or less.

On the other hand, No. 32-37 is an example which produced the cut | disconnected body using the saw wire obtained without passing through the process prescribed | regulated by this invention. Among them, No. 32 is an example in which a resin-coated saw wire coated with a resin on the surface of a steel wire is used. However, since the resin is too soft, a phenomenon in which abrasive grains penetrate into the resin during slicing processing has occurred. In addition, the processing altered layer depth formed in the cut surface became deeper than 5 micrometers.

In Nos. 33 to 35, since a steel wire was used as the saw wire, abrasive grains were drawn in between the steel wire and the workpiece, resulting in a large cutting loss. Moreover, the depth of the processing deterioration layer formed in the cut surface was deep, and the surface roughness also became rough.

Since No. 36 and 37 use the wire with a fixed abrasive grain as a saw wire, cutting loss was large and the depth of the processing alteration layer formed in a cut surface was deep, and the surface roughness became rough.

Since the arithmetic mean roughness Ra of a cut surface is 0.5 micrometer or less, said Nos. 21-31 are etched in a micro texture on the surface in this state, when using the said cut body as a raw material of a solar cell, for example. can do. In contrast, in the above Nos. 33 to 37, since the arithmetic mean roughness Ra of the cut surface exceeds 0.5 µm, etching is required to smooth the cut surface before etching the fine texture.

Next, when comparing the hardness of resin and the result of No.25-32 which measured the number of the abrasive grains which penetrated to the resin surface, it can consider as follows. In Nos. 25 to 32, the hardness of the resin measured at room temperature was almost the same at about 0.27 모두, but it was found that the hardness of the resin measured at 120 캜 varied from 0.04 to 0.28.. It is thought that the cause of a deviation in this way exists in the kind of resin and difference of heating temperature.

Here, FIG. 12 shows the relationship between the hardness of the resin measured at 120 ° C. and the number of abrasive grains (the number in the region of observation field of 50 μm × 200 μm) that penetrated into the resin surface. From FIG. 12, it can be seen that as the hardness of the resin measured at 120 ° C. increases, the number of abrasive grains penetrating into the resin decreases.

Moreover, the relationship between the hardness of resin measured at 120 degreeC, and the depth of the processing altered layer formed in the cut surface is shown in FIG. From FIG. 13, it is possible to read the tendency that the depth of the processed altered layer becomes smaller as the hardness of the resin measured at 120 ° C. increases. Moreover, when the hardness of resin measured at 120 degreeC is 0.07 kPa or more, it can grasp | ascertain that the depth of a processing altered layer can be suppressed to 5 micrometers or less.

12 and 13, it is possible to grasp the tendency of decreasing the depth of the processed deterioration layer when the number of abrasive grains penetrating into the resin surface is reduced.

Although this application was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is a Japanese patent application (Japanese Patent Application No. 2010-038017) filed on February 23, 2010, and a Japanese Patent Application (Japanese Patent Application No. 2010-161093) filed on July 15, 2010. The contents of which are incorporated herein by reference.

According to the present invention, the surface of the saw wire is covered with a resin and the hardness thereof is adjusted. Therefore, the introduction of the abrasive grains between the cut surface and the resin-coated saw wire can be suppressed by the resin while the abrasive grains are drawn in and cut. Therefore, formation of the processing altered layer in the cut surface can be suppressed. Moreover, when a workpiece | work is cut | disconnected using this resin coating saw wire, the cutting body which has a smooth surface can be manufactured. Therefore, in the downstream process, the etching process for removing a process altered layer or making a surface smooth can be skipped, and productivity of a cut body can be improved.

In addition, when the resin-coated saw wire of the present invention is used, the inflow of the abrasive grains between the cut surface and the resin-coated saw wire is suppressed, so that the cutting loss can be reduced and the productivity of the cut body can be improved.

Claims (18)

It is a design method of the resin coating saw wire containing the process of coating a steel wire with resin of predetermined hardness, and obtaining a resin coating saw wire,
The method of designing a resin-coated saw wire which repeats the following (1)-(4) and adjusts the hardness of resin so that the depth of the processing alteration layer in the cut surface of a workpiece | work becomes a pass.
(1) The workpiece is cut by the obtained resin-coated saw wire.
(2) The depth of processing alteration layer in the cut surface of a workpiece | work is investigated.
(3) Check the passing quality of the deteriorated layer depth.
(4) In case of rejection, the steel wire is covered with a harder resin. The design method of the resin-coated saw wire of Claim 1 which coat | covers a steel wire with harder resin, when the said processing altered layer depth is deeper than 5 micrometers. It is a design method of the resin coating saw wire containing the process of coating a steel wire with resin of predetermined hardness, and obtaining a resin coating saw wire,
The design method of the resin coating saw wire which adjusts the hardness of resin so that surface roughness in the cut surface of a workpiece | work may pass by repeating following (1)-(4).
(1) The workpiece is cut by the obtained resin-coated saw wire.
(2) The surface roughness in the cut surface of the workpiece is examined.
(3) Check the pass of surface roughness.
(4) In case of rejection, the steel wire is covered with a harder resin. The method for designing a resin-coated saw wire according to claim 3, wherein when the surface roughness is rougher than 0.5 µm, the steel wire is coated with a harder resin. The design method of the resin coating saw wire of Claim 1 or 3 whose film thickness of the said resin is 2-15 micrometers. The design method of the resin coating saw wire of Claim 1 or 3 whose wire diameter of the said steel wire is 130 micrometers or less. A method of manufacturing a cut body by cutting a workpiece with a resin-coated saw wire, and a process of spraying abrasive grains on a resin-coated saw wire coated with a steel wire with a resin of which hardness is adjusted, and an abrasive grain between the cut surface and the resin-coated saw wire. And cutting the workpiece by introducing abrasive grains in a direction in which the coated saw wire is cut in the workpiece while suppressing the introduction of the resin into the workpiece. The manufacturing method of the cut | disconnected body of Claim 7 cut | disconnected so that the processing deterioration layer depth in the cut surface of the said workpiece may be set to 5 micrometers or less. The manufacturing method of the cut body of Claim 7 cut | disconnected so that the surface roughness in the cut surface of the said workpiece may be set to 0.5 micrometer or less. The method for producing a cut body according to claim 7, wherein the cut loss of the workpiece is cut so as to be 1 to 1.1 times the wire diameter of the resin-coated saw wire. The method for producing a cut body according to claim 7, wherein the abrasive grain is sprayed and cut as diamond abrasive grains. The manufacturing method of the cut | disconnected body of Claim 7 using what the hardness in 120 degreeC is 0.07 kPa or more as said resin. The method for producing a cut body according to claim 8, wherein the resin having a hardness at 120 ° C of 0.07 kPa or more. The method for producing a cut body according to claim 9, wherein the resin having a hardness at 120 ° C of 0.07 kPa or more. The method for producing a cut body according to claim 10, wherein the resin having a hardness at 120 ° C of 0.07 kPa or more. The method for producing a cut body according to claim 11, wherein the resin having a hardness at 120 ° C of 0.07 kPa or more. The cut body manufactured by the method of any one of Claims 7-16. The resin-coated saw wire used for the manufacturing method in any one of Claims 7-16.

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