KR20120108247A - Construction method for asphalt pavement using chipping aggragate - Google Patents

Construction method for asphalt pavement using chipping aggragate Download PDF

Info

Publication number
KR20120108247A
KR20120108247A KR1020110025908A KR20110025908A KR20120108247A KR 20120108247 A KR20120108247 A KR 20120108247A KR 1020110025908 A KR1020110025908 A KR 1020110025908A KR 20110025908 A KR20110025908 A KR 20110025908A KR 20120108247 A KR20120108247 A KR 20120108247A
Authority
KR
South Korea
Prior art keywords
aggregate
chipping
asphalt
chipping aggregate
spraying
Prior art date
Application number
KR1020110025908A
Other languages
Korean (ko)
Other versions
KR101418081B1 (en
Inventor
곽미금
이정현
황인동
장영두
Original Assignee
곽미금
이정현
장영두
황인동
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 곽미금, 이정현, 장영두, 황인동 filed Critical 곽미금
Priority to KR1020110025908A priority Critical patent/KR101418081B1/en
Publication of KR20120108247A publication Critical patent/KR20120108247A/en
Application granted granted Critical
Publication of KR101418081B1 publication Critical patent/KR101418081B1/en

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/24—Methods or arrangements for preventing slipperiness or protecting against influences of the weather
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C7/00—Coherent pavings made in situ
    • E01C7/08—Coherent pavings made in situ made of road-metal and binders
    • E01C7/18—Coherent pavings made in situ made of road-metal and binders of road-metal and bituminous binders
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C7/00—Coherent pavings made in situ
    • E01C7/08—Coherent pavings made in situ made of road-metal and binders
    • E01C7/35—Toppings or surface dressings; Methods of mixing, impregnating, or spreading them
    • E01C7/353—Toppings or surface dressings; Methods of mixing, impregnating, or spreading them with exclusively bituminous binders; Aggregate, fillers or other additives for application on or in the surface of toppings with exclusively bituminous binders, e.g. for roughening or clearing
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C7/00—Coherent pavings made in situ
    • E01C7/08—Coherent pavings made in situ made of road-metal and binders
    • E01C7/35—Toppings or surface dressings; Methods of mixing, impregnating, or spreading them
    • E01C7/356—Toppings or surface dressings; Methods of mixing, impregnating, or spreading them with exclusively synthetic resin as a binder; Aggregate, fillers or other additives for application on or in the surface of toppings having exclusively synthetic resin as binder

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Road Paving Structures (AREA)

Abstract

PURPOSE: A construction method of an asphalt pavement using chipping aggregate is provided to improve slipping resistance by preventing chipping aggregate from being separated from an asphalt pavement. CONSTITUTION: A construction method of an asphalt pavement using chipping aggregate is as follows. Chipping aggregate(20) is manufactured by coating the surface of aggregate with a coating material. A pavement(10) is formed by spreading asphalt on a concrete base layer(1). The chipping aggregate is spread on the top surface of the pavement.

Description

칩핑 골재를 이용한 아스팔트 포장공법{CONSTRUCTION METHOD FOR ASPHALT PAVEMENT USING CHIPPING AGGRAGATE}Asphalt paving method using chipping aggregates {CONSTRUCTION METHOD FOR ASPHALT PAVEMENT USING CHIPPING AGGRAGATE}

본 발명은 토목 분야에 관한 것으로서, 상세하게는 아스팔트 포장공법에 관한 것이다.The present invention relates to the field of civil engineering, and in particular, to an asphalt pavement method.

매스틱 아스팔트(mastic saphalt)는 석회석분, 채움재(filler), 천연 아스팔트 분말을 주재료로 하는 특수 아스팔트 포장재를 말하며, 구스 아스팔트(guss asphalt), 아스팔트 꿀레(Asphalt coule) 등으로도 불리운다.Mastic saphalt refers to a special asphalt pavement mainly composed of limestone powder, filler, natural asphalt powder, and is also called as goss asphalt, asphalt coule, and the like.

이는 위 주재료가 적절한 비율로 배합된 혼합액, 골재, 모래, 석회석분, 채움재 등을 고온(170℃?250℃)에서 혼합한 후 포설하는 방식으로 시공되는데, 이때 혼합액의 중량은 혼합물 전체중량의 15?34% 정도를 차지하고, 모래 및 골재, 석분 등은 혼합물 전체중량의 66?85%를 차지한다.It is constructed by mixing and mixing mixed liquid, aggregate, sand, limestone powder, filler material, etc., which are mixed in an appropriate ratio at a high temperature (170 ℃ -250 ℃), where the weight of the mixed liquid is 15% of the total weight of the mixture. It accounts for about 34%, and sand, aggregate and stone powder make up 66 ~ 85% of the total weight of the mixture.

매스틱 아스팔트 혼합물에 섞이는 혼합액은 기존의 가열아스팔트 용액과는 달리 온도나 하중변화에 의해 일어나는 단점들을 모두 극복할 수 있는 높은 결합력과 내구성 및 방수성을 갖는다. Unlike the conventional heating asphalt solution, the mixed solution mixed with the mastic asphalt mixture has high bonding strength, durability, and waterproofness to overcome all the disadvantages caused by temperature or load changes.

특히, 매스틱 아스팔트 혼합물은 고온에서 일정 시간 가열혼합하면, 그 혼합물은 화산에서 분출된 용암이 흘러내리는 것처럼 유동성이 매우 뛰어나며 자연냉각되므로, 별도의 다짐 공정을 수행하지 않아도 포장층을 일체화시킬 수 있다는 장점이 추가된다.Particularly, when the mastic asphalt mixture is heated and mixed at a high temperature for a certain time, the mixture has a very fluidity and is naturally cooled, such as lava flowed from a volcano, so that the pavement layer can be integrated without a separate compaction process. The advantage is added.

다만, 이러한 매스틱 아스팔트에 의해 형성된 포장체의 표면은 대단히 매끄러운 구조를 취하게 되므로, 차량의 주행에 대한 미끄럼 저항을 높이기 위하여 그 표면에 칩핑(chipping) 골재를 살포하는 등 별도의 처리를 수행하여야 한다.However, since the surface of the pavement formed by the mastic asphalt has a very smooth structure, in order to increase the sliding resistance to the running of the vehicle, a separate treatment such as spraying chipping aggregate must be performed on the surface. do.

그런데, 종래에는 위 칩핑 골재로서 일반 골재를 그대로 살포하는 방식을 취하였는바, 이와 같이 시공하는 경우 골재와 매스틱 아스팔트 포장체의 결합력이 좋지 못하여 골재의 이탈이 많다는 점, 이로 인하여 계획된 미끄럼 저항성을 확보할 수 없다는 점 등의 문제가 있었다.By the way, conventionally, as the above chipping aggregate, the general aggregate was sprayed as it is. In this case, the aggregate and the mastic asphalt pavement have a poor bonding strength, so that the aggregate has a lot of slippage. There was a problem such as not being able to secure.

본 발명은 상기와 같은 문제점을 해결하기 위하여 도출된 것으로서, 아스팔트 포장체로부터 칩핑 골재의 이탈을 방지하여 우수한 미끄럼 저항성을 확보할 수 있도록 하는 칩핑 골재를 이용한 아스팔트 포장공법을 제시하는 것을 그 목적으로 한다.The present invention was derived to solve the above problems, an object of the present invention is to propose an asphalt paving method using a chipping aggregate to ensure the excellent sliding resistance by preventing the separation of the chipping aggregate from the asphalt pavement. .

상기 과제의 해결을 위하여, 본 발명은 골재(21)의 표면을 코팅재(22)에 의해 코팅하여 칩핑 골재(20)를 제조하는 칩핑 골재 제조단계; 아스팔트를 포설하여 포장체(10)를 형성하는 포장단계; 상기 칩핑 골재(20)를 상기 포장체(10)의 상면에 살포하는 칩핑 골재 살포단계;를 포함하는 칩핑 골재를 이용한 아스팔트 포장공법을 제시한다.In order to solve the above problems, the present invention is a chipping aggregate manufacturing step of manufacturing a chipping aggregate 20 by coating the surface of the aggregate 21 with a coating material (22); Paving step of paving asphalt to form a package (10); Presenting an asphalt paving method using a chipping aggregate comprising a; chipping aggregate spraying step of spraying the chipping aggregate 20 on the upper surface of the package (10).

상기 코팅재(22)는 아스팔트, 유화아스팔트, 에폭시, MMA 수지, 폴리머 계열 접착제 중 하나 또는 2 이상의 혼합에 의해 이루어지는 것이 바람직하다.The coating material 22 is preferably made by mixing one or two or more of asphalt, emulsified asphalt, epoxy, MMA resin, and polymer-based adhesive.

상기 칩핑 골재 제조단계에서 상기 코팅재(22)는 상기 골재(21)의 중량에 대하여 0.5~2 중량부가 코팅되는 것이 바람직하다.In the chipping aggregate manufacturing step, the coating material 22 may be coated with 0.5 to 2 parts by weight based on the weight of the aggregate 21.

상기 칩핑 골재 제조단계 이전, 상기 골재(21)를 가열하여 수분 및 더스트를 제거하는 골재 가열단계를 포함하는 것이 바람직하다.Before the chipping aggregate manufacturing step, it is preferable to include an aggregate heating step of removing the moisture and dust by heating the aggregate 21.

상기 칩핑 골재 제조단계는 상기 코팅재(22)를 150~180℃로 가열하여 코팅하는 것이 바람직하다.The chipping aggregate manufacturing step is preferably coated by heating the coating material 22 to 150 ~ 180 ℃.

상기 칩핑 골재 살포단계는 상기 칩핑 골재(20)를 100~120℃로 가열하여 살포하는 것이 바람직하다.The chipping aggregate spraying step is preferably sprayed by heating the chipping aggregate 20 to 100 ~ 120 ℃.

상기 칩핑 골재 살포단계에서 상기 칩핑 골재(20)의 살포량은 5~20kg/㎡인 것이 바람직하다.The spreading amount of the chipping aggregate 20 in the chipping aggregate spraying step is preferably 5 ~ 20kg / ㎡.

상기 칩핑 골재 살포단계 이후, 상기 포장체(10) 및 칩핑 골재(20)의 살포면을 다짐하는 다짐단계를 더 포함하는 것이 바람직하다.After the chipping aggregate spraying step, it is preferable to further include a compacting step of compacting the spreading surface of the package 10 and the chipping aggregate 20.

상기 다짐단계에서 다짐온도는 60~90℃인 것이 바람직하다.In the compacting step, the compaction temperature is preferably 60 ~ 90 ℃.

상기 포장단계에서 상기 포장체(10)는 매스틱 아스팔트의 포설에 의해 형성되는 것이 바람직하다.In the paving step, the package 10 is preferably formed by laying mastic asphalt.

본 발명은 아스팔트 포장체로부터 칩핑 골재의 이탈을 방지하여 우수한 미끄럼 저항성을 확보할 수 있도록 하는 칩핑 골재를 이용한 아스팔트 포장공법을 제시한다.The present invention provides an asphalt pavement method using a chipping aggregate to prevent the separation of the chipping aggregate from the asphalt pavement to ensure excellent slip resistance.

도 1 이하는 본 발명의 실시예를 도시한 것으로서,
도 1은 포장체의 단면도.
도 2는 칩핑 골재의 단면도.Figure 1 below shows an embodiment of the present invention,
1 is a cross-sectional view of a package.
2 is a cross-sectional view of the chipping aggregate.

이하, 첨부도면을 참조하여 본 발명의 실시예에 관하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1 이하에 도시된 바와 같이, 본 발명에 의한 아스팔트 포장공법은 기본적으로, 골재(21)의 표면을 코팅재(22)에 의해 코팅하여 칩핑 골재(20)를 제조하는 칩핑 골재 제조단계; 콘크리트 기층(1), 교량의 상판 등의 위에 아스팔트를 포설하여 포장체(10)를 형성하는 포장단계; 칩핑 골재(20)를 포장체(10)의 상면에 살포하는 칩핑 골재 살포단계;를 포함하여 구성된다.As shown in Figure 1, the asphalt pavement method according to the present invention basically, the chipping aggregate manufacturing step of producing a chipping aggregate 20 by coating the surface of the aggregate 21 with a coating material 22; A paving step of paving the pavement 10 by laying asphalt on a concrete base layer 1, a top plate of a bridge, or the like; It is configured to include; chipping aggregate spraying step of spraying the chipping aggregate 20 on the upper surface of the package (10).

여기서, 코팅재(22)란 아스팔트, 유화아스팔트, 에폭시, MMA 수지, 폴리머 계열 접착제 등과 같이, 골재(21)와 매스틱 아스팔트의 접착력을 증대시킬 수 있는 재료를 의미한다.Here, the coating material 22 refers to a material capable of increasing the adhesion between the aggregate 21 and the mastic asphalt, such as asphalt, emulsified asphalt, epoxy, MMA resin, and polymer adhesive.

본 발명은 매스틱 아스팔트 포장체와 같이 표면이 매끄럽게 형성되는 아스팔트 포장체(10)의 상면에 골재를 살포하되, 종래와 같이 일반 골재(21)를 그대로 살포하는 것이 아니라, 이를 코팅재(22)에 의해 먼저 코팅한 후 살포한다는 특징이 있는 것이다(도 2).The present invention is spraying aggregate on the upper surface of the asphalt pavement 10, the surface is formed smoothly, such as mastic asphalt pavement, but not spraying the general aggregate 21 as it is, conventionally, to the coating material 22 It is characterized by the first coating and then spraying (Fig. 2).

이와 같이 코팅재(22)에 의해 코팅된 칩핑 골재(20)가 살포되는 경우, 그 표면에 코팅된 코팅재(22)와 아스팔트 포장체(10)의 친화력에 의해 우수한 결합력을 발휘하게 되는바, 종래와 같은 칩핑 골재의 이탈을 방지할 수 있고, 이로 인하여 차량에 대한 우수한 미끄럼 저항성을 확보한다는 효과가 있다.As such, when the chipping aggregate 20 coated by the coating material 22 is sprayed, it exhibits excellent bonding force by the affinity of the coating material 22 and the asphalt pavement 10 coated on the surface thereof. It is possible to prevent the departure of the same chipping aggregate, thereby ensuring an excellent sliding resistance for the vehicle.

코팅되는 코팅재(22)의 양은 골재(21)의 중량에 대하여 0.5~2 중량부 정도가 적절한데, 이보다 작으면 코팅의 효과가 너무 작고, 이보다 크면 코팅재와 골재의 결합력이 커져 작업성을 떨어뜨리기 때문이다.The amount of the coating material 22 to be coated is appropriate about 0.5 to 2 parts by weight based on the weight of the aggregate (21), if less than this, the effect of the coating is too small, if greater than this the bonding strength of the coating material and the aggregate is greater to reduce workability Because.

골재(21)에 대한 코팅 이전, 먼저 골재(21)를 180~300℃ 정도로 가열하여 수분 및 더스트를 제거하는 것이 바람직하다.Before coating the aggregate 21, it is preferable to first heat the aggregate 21 to about 180 ~ 300 ℃ to remove moisture and dust.

골재(21)에 대한 코팅재(22)의 원활한 코팅이 이루어지도록 하기 위해서는, 코팅재(22)의 종류에 따라 적절한 혼합온도 하에서 위 코팅작업이 수행되도록 하여야 한다.In order to achieve a smooth coating of the coating material 22 on the aggregate 21, the above coating operation should be performed under an appropriate mixing temperature according to the type of coating material (22).

코팅재(22)로서 일반 아스팔트를 사용하는 경우에는 아스팔트를 150~180℃로 가열하여 코팅하는 것이 바람직하고, 상온형 아스팔트를 사용하는 경우에는 상온에서 코팅하는 것으로 충분하다.In the case of using general asphalt as the coating material 22, it is preferable to coat the asphalt by heating to 150 to 180 ° C, and in the case of using room temperature asphalt, it is sufficient to coat at room temperature.

칩핑 골재의 살포 시 포장체(10)의 온도가 고온을 유지하는 것이 결합력의 증대를 위해 바람직한데, 포장체(10)의 두께가 얇아 금방 식게 된 경우에는 칩핑 골재(20)를 100~120℃로 가열하여 살포하는 것이 바람직하다.It is preferable to maintain a high temperature of the package 10 when spraying the chipping aggregate for the purpose of increasing the bonding strength, if the thickness of the package 10 is cooled quickly, the chipping aggregate 20 is 100 ~ 120 ℃ It is preferable to spray by heating.

칩핑 골재(20)의 살포량은 5~20kg/㎡ 정도가 바람직한데, 이보다 작으면 골재가 촘촘하게 박히지 않아 미끄럼 저항성의 개선 정도가 작아지고, 이보다 많으면 비효율적이기 때문이다.The spreading amount of the chipping aggregate 20 is preferably about 5 to 20 kg / m 2, because the smaller the aggregate, the less the degree of improvement of the sliding resistance is reduced, and more than this is inefficient.

본래 매스틱 아스팔트 포장에는 다짐이 필요 없지만, 칩핑 골재(20)의 살포 이후, 포장체(10) 및 칩핑 골재(20)의 살포면을 다짐하는 경우, 그 결합력이 더욱 우수해진다는 장점이 추가된다.Originally, mastic asphalt pavement does not require compaction, but after the spreading of the chipping aggregate 20, when the spreading surface of the package 10 and the chipping aggregate 20 is compacted, an advantage that the bonding force is further improved is added. .

이때, 다짐 온도는 60~90℃ 정도를 유지하는 것이 바람직하다.At this time, it is preferable to keep compaction temperature about 60-90 degreeC.

이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께 하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

1 : 콘크리트 기층 10 : 포장체
20 : 칩핑 골재 21 : 골재
22 : 코팅재1: concrete base 10: package
20: chipping aggregate 21: aggregate
22: coating material

Claims (10)

골재(21)의 표면을 코팅재(22)에 의해 코팅하여 칩핑 골재(20)를 제조하는 칩핑 골재 제조단계;
아스팔트를 포설하여 포장체(10)를 형성하는 포장단계;
상기 칩핑 골재(20)를 상기 포장체(10)의 상면에 살포하는 칩핑 골재 살포단계;를
포함하는 칩핑 골재를 이용한 아스팔트 포장공법.A chipping aggregate manufacturing step of manufacturing the chipping aggregate 20 by coating the surface of the aggregate 21 with the coating material 22;
Paving step of paving asphalt to form a package (10);
The chipping aggregate spraying step of spraying the chipping aggregate 20 on the upper surface of the package 10;
Asphalt pavement method using a chipping aggregate containing. 제1항에 있어서,
상기 코팅재(22)는
아스팔트, 유화아스팔트, 에폭시, MMA 수지, 폴리머 계열 접착제 중 하나 또는 2 이상의 혼합에 의해 이루어지는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 1,
The coating material 22
Asphalt pavement method using a chipping aggregate, characterized in that the asphalt, emulsified asphalt, epoxy, MMA resin, polymer-based adhesives or a mixture of two or more. 제2항에 있어서,
상기 칩핑 골재 제조단계에서
상기 코팅재(22)는 상기 골재(21)의 중량에 대하여 0.5~2 중량부가 코팅되는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 2,
In the chipping aggregate manufacturing step
The coating material 22 is asphalt paving method using a chipping aggregate, characterized in that 0.5 to 2 parts by weight based on the weight of the aggregate (21). 제2항에 있어서,
상기 칩핑 골재 제조단계 이전,
상기 골재(21)를 가열하여 수분 및 더스트를 제거하는 골재 가열단계를 포함하는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 2,
Before the chipping aggregate manufacturing step,
Asphalt pavement method using a chipping aggregate, characterized in that it comprises an aggregate heating step of removing the moisture and dust by heating the aggregate (21). 제2항에 있어서,
상기 칩핑 골재 제조단계는
상기 코팅재(22)를 150~180℃로 가열하여 코팅하는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 2,
The chipping aggregate manufacturing step
Asphalt paving method using the chipping aggregate, characterized in that the coating material is heated to 150 ~ 180 ℃ coating. 제1항에 있어서,
상기 칩핑 골재 살포단계는
상기 칩핑 골재(20)를 100~120℃로 가열하여 살포하는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 1,
The chipping aggregate spraying step
Asphalt pavement method using a chipping aggregate, characterized in that the spraying by heating the chipping aggregate 20 to 100 ~ 120 ℃. 제1항에 있어서,
상기 칩핑 골재 살포단계에서
상기 칩핑 골재(20)의 살포량은 5~20kg/㎡인 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 1,
In the chipping aggregate spraying step
Asphalt paving method using the chipping aggregate, characterized in that the spreading amount of the chipping aggregate 20 is 5 ~ 20kg / ㎡. 제1항에 있어서,
상기 칩핑 골재 살포단계 이후,
상기 포장체(10) 및 칩핑 골재(20)의 살포면을 다짐하는 다짐단계를 더 포함하는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.The method of claim 1,
After the chipping aggregate spraying step,
Asphalt paving method using a chipping aggregate, characterized in that it further comprises a compacting step of compacting the spraying surface of the package 10 and the chipping aggregate (20). 제8항에 있어서,
상기 다짐단계에서
다짐온도는 60~90℃인 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.9. The method of claim 8,
In the compaction step
Asphalt pavement method using a chipping aggregate, characterized in that the compaction temperature is 60 ~ 90 ℃. 제1항 내지 제9항 중 어느 한 항에 있어서,
상기 포장단계에서 상기 포장체(10)는 매스틱 아스팔트의 포설에 의해 형성되는 것을 특징으로 하는 칩핑 골재를 이용한 아스팔트 포장공법.10. The method according to any one of claims 1 to 9,
In the paving step, the pavement 10 is asphalt paving method using the chipping aggregate, characterized in that formed by laying mastic asphalt.
KR1020110025908A 2011-03-23 2011-03-23 Construction method for asphalt pavement using chipping aggragate KR101418081B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110025908A KR101418081B1 (en) 2011-03-23 2011-03-23 Construction method for asphalt pavement using chipping aggragate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110025908A KR101418081B1 (en) 2011-03-23 2011-03-23 Construction method for asphalt pavement using chipping aggragate

Publications (2)

Publication Number Publication Date
KR20120108247A true KR20120108247A (en) 2012-10-05
KR101418081B1 KR101418081B1 (en) 2014-07-31

Family

ID=47279871

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110025908A KR101418081B1 (en) 2011-03-23 2011-03-23 Construction method for asphalt pavement using chipping aggragate

Country Status (1)

Country Link
KR (1) KR101418081B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101975217B1 (en) * 2018-08-20 2019-08-28 태륭건설(주) Method for repairing pavement
KR102611264B1 (en) * 2022-06-20 2023-12-07 주식회사 케이그린 Surface pavement for road

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248700B1 (en) * 2020-06-23 2021-05-04 태륭건설(주) Coating composition for chipping aggregate and coating method using the same
CN111996861A (en) * 2020-07-21 2020-11-27 湖南砼艺市政工程建设有限公司 Construction process of anti-skid pavement structure constructed by MMA (methyl methacrylate)
KR102362823B1 (en) 2021-12-24 2022-02-15 한국건설기술연구원 Post treatment composition for chip seal and maintenance method using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100316083B1 (en) * 1998-12-22 2002-02-19 한정국 Construction method of anti-slip road
JP4054124B2 (en) * 1999-02-15 2008-02-27 住友ゴム工業株式会社 Non-slip pavement construction method
KR100373492B1 (en) * 2000-03-13 2003-02-25 주식회사 인텍 Color granule and method for manufacturing thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101975217B1 (en) * 2018-08-20 2019-08-28 태륭건설(주) Method for repairing pavement
KR102611264B1 (en) * 2022-06-20 2023-12-07 주식회사 케이그린 Surface pavement for road

Also Published As

Publication number Publication date
KR101418081B1 (en) 2014-07-31

Similar Documents

Publication Publication Date Title
KR20120108247A (en) Construction method for asphalt pavement using chipping aggragate
KR101498661B1 (en) The composition and construction method for non permeable asphalt pavement using natural bitumen
MX2019002009A (en) Asphalt composition.
NZ752919A (en) Paver adhesive and method of laying pavers
CA2893933C (en) Methods for reducing asphalt pavement thickness, increasing aggregate-to-aggregate contact of asphalt paving materials, and improving low temperature cracking performance of asphalt paving materials
CN102322009A (en) Normal temperature type epoxy resin modified emulsified bitumen stress absorption layer
CN105036613A (en) Crack pressure-sensitive solidification self-healing asphalt concrete, as well as preparation method and application method thereof
CN105064207A (en) High-performance steel bridge deck paving structure
CN109021505A (en) Sealing material and its preparation method and application at polymer emulsified asphalt ultrathin table
CN103334364B (en) Micro-table pavement structure and micro-table pavement construction method
CN103966935B (en) ECC (engineered cementitious composite) durable type colored road pavement structure and paving method thereof
CN104724980B (en) A kind of cold mixing type bituminous concrete mixture and preparation method thereof
US9890299B1 (en) Spray paving coating and method
KR101079265B1 (en) Pavement method for concrete bridge using guss asphalt
CN109722078A (en) A kind of environment-protecting color roadway applications material and road markings laying method
KR101214075B1 (en) The pavement method for the slip prevention of the road
KR101015260B1 (en) Pavement method for bridge using guss asphalt
CN110862742A (en) High-permeability modified epoxy asphalt for cement concrete bridge deck pavement and application thereof
KR100628368B1 (en) Non-slip surface reinforcing agent comprising the garnet and constructing method using the same
JP2000001821A (en) Floor-slab waterproof structure and execution method
KR20180056123A (en) Modified aspalt binder and manufacturing method compoisition thereof
KR101693472B1 (en) Construction method using water resistance layer and stone mastic asphalt
GB2608348A (en) Reactive cold-applied thermoplastic bond coat
CN207210958U (en) A kind of bridge deck water-proof tack coat and a kind of bridge floor
CN204919328U (en) High -performance steel bridge deck pavement structure

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20130522

Effective date: 20140327

GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170412

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180420

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20190417

Year of fee payment: 6