KR20120107656A - Soft-mold and fabricating method of the same, and fabricating method of optical flim using the same - Google Patents

Abstract

PURPOSE: A soft mold and a manufacturing method thereof, and a method using the soft mold are provided to easily transfer circular patterns on a film by using a soft mold in a simple process. CONSTITUTION: A soft mold(1) manufacturing method is as follows. A silicon master wafer(10) has optical patterns and directivity, and a molding liquid(20) is spread on a surface of the silicon master wafer(S2). A base material(30) for a soft mold is touched to the spread molding liquid and cured(S3). The cured molding liquid and base for the soft mold are separated from each other(S4).

Description

SOFT-MOLD AND FABRICATING METHOD OF THE SAME, AND FABRICATING METHOD OF OPTICAL FLIM USING THE SAME}

The present invention relates to a method of transferring to a flexible film by using the surface texturing pattern of an etched (100) silicon wafer, and particularly, obtains a pyramidal pyramidal pattern of nano and micro size on the surface of a oriented silicon wafer. Then, this is related to the manufacturing method which uses this as a master pattern, produces a soft mold, and transfers the original pattern to a film with this soft mold again.

There are various methods for manufacturing pattern masters having unique shapes of nano or micrometer size, such as mechanical processing, laser direct transfer method, and reverse transcription through mold fabrication.

Silicon wafers are distinguished according to the orientation of various crystals, and such silicon is effectively anisotropically etched by dry etching using chemical gas or wet etching capable of chemical etching. That is, depending on the orientation of the substrate to be used and the shape of the mask and the purpose of use, the 'V' shaped or circular undercut, overcut or right angle etching patterns may be realized. This pattern is widely used as a basic platform for loading and modularizing various optical devices such as LED, LD, PD, and fiber array.

An object of the present invention is to implement a pyramid pattern of 'V' shape or square pyramid using an efficient anisotropic etching method of silicon in the etching method of (100) silicon wafer, the silicon wafer formed pattern is implemented for pattern transfer It is to provide a film production method that can be used as a master to produce a soft mold and to form a circular pattern on the film with the soft mold.

As a means for solving the above-described problems, the present invention is applied to the molding liquid on the surface of the (100) silicon master wafer having an directionality embodied in the optical pattern, and to contact the cured molding liquid and the substrate for soft mold To provide a method for producing a soft mold comprising the step of separating the cured molding liquid and the substrate for soft mold.

In this case, the optical pattern implemented on the surface of the silicon mast wafer in the above-described manufacturing process, the pattern of any one of a triangular prism type, triangular pyramidal, pyramid pattern, conical, spherical, non-spherical, or two or more patterns Can be implemented.

The optical pattern may be any one of a triangular prism type, a triangular pyramid type, a pyramid pattern type, and a cone type, and the peak angle of each pattern may be implemented at 65 to 75 degrees.

In addition, the optical pattern implemented on the surface of the silicon wafer used in the above-described manufacturing process, the interval between each optical pattern can be arranged uniformly or non-uniformly spaced in the range of 0.0 ㎛ ~ 100 ㎛, the size of each pattern It can be implemented in the range of 0.1 ㎛ ~ 100 ㎛, pitch is 0.1 ㎛ ~ 100 ㎛.

In addition, the soft mold substrate according to the present invention may be implemented as a light-transmissive polymer film using any one of PC (Polycarbonate), PET, PMMA, PETG, COC.

The soft mold manufactured by the above-described manufacturing process may have the following structure.

Specifically, the base material consisting of a light transmissive polymer film; And a photocurable resin layer laminated on the upper surface of the substrate, wherein the photocurable resin layer further includes a transfer optical pattern having a pattern size of 0.1 μm to 100 μm and a pitch of 0.1 μm to 100 μm. Can be implemented.

The transfer optical pattern may be implemented as a triangular prism, triangular pyramid, pyramid pattern, cone, sphere, non-spherical pattern, or two or more patterns, in particular, the distance between each transfer optical pattern is 0.0 Spaced in the range of μm to 100 μm may be arranged uniformly or non-uniformly.

The optical pattern may be transferred to the optical film by using the soft mold manufactured by the above-described manufacturing method. In this case, any one of hot embossing, lamination, injection molding, nano-imprinting, compression molding and PDMS may be used. The optical pattern may be transferred to an optical film by applying a mold.

According to the present invention, the present invention relates to a method for transferring and fabricating a flexible film using a surface texturing pattern of an etched directional silicon wafer, in particular nano and micro-sized pyramids on a oriented silicon wafer surface. After obtaining the shape square pyramid pattern, it is used as a master pattern to produce a soft mold, and again, the original pattern is transferred to the film by the soft mold, thereby forming a circular pattern on the film in a very simple process.

In particular, the surface texturing pattern of the (100) silicon wafer may be embodied in a very simple process of manufacturing at the same time as the light extraction effect is excellent, there is also the effect of implementing a fine pattern and a large-area film production using the same.

1 is a flow chart illustrating a manufacturing process according to the present invention.
2 is a conceptual diagram showing a manufacturing process diagram according to the present invention.
Figure 3 is a planar image showing an enlarged image of the wafer surface after the etching process according to the present invention.
Figure 4 is a side image showing an enlarged image of the wafer surface after the etching process according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

1 and 2 show a manufacturing process flow chart and process diagram according to the present invention.

Referring to the drawings, the manufacturing process of the soft mold according to the present invention, the molding liquid is applied to the surface of the (100) silicon master wafer having a direction in which the optical pattern is implemented, the soft molding substrate is applied to the applied molding liquid And a step of separating the cured molding solution and the soft mold substrate from contacting and curing.

Each process step will be described in detail using the examples described below. Hereinafter, in the process step of the present invention, the process will be described by applying a (100) silicon wafer having a particular orientation. "(100)" is an identification symbol indicating the directionality of silicon.

The silicon master wafer used in the present invention uses a structure in which an optical pattern is implemented on a surface, and the optical pattern is formed of a pyramid pattern of nano- or micro-sized square pyramid structure on the surface of the silicon wafer by using an etching material. The structure may be used.

One Embodiment of a Method of Implementing an Optical Pattern on a Silicon Wafer Surface

It will be apparent to those skilled in the art that the silicon wafer in which the optical pattern according to the present invention is implemented can be implemented in various ways. However, the method of implementing the optical pattern as a preferred embodiment is as follows.

Implementation of the optical pattern on the silicon wafer according to the present invention can be implemented by a process of etching the surface of the silicon wafer. In particular, wet etching using an etching solution material may be used to implement a pyramidal pattern having a nano- or micro-sized square pyramid structure, which is applicable to both using and not using an etching mask.

In this case, the etching solution used for etching may be used by further comprising any one or two or more organic solvents selected from Isopropyl alcohol, ethyl alcohol, methyl alcohol, acetone in KOH. That is, the KOH solution is basically a basic wet etching solution, and may be composed of a mixed solution of organic solvents such as isopropyl alcohol, ethyl alcohol, methyl alcohol, acetone, and DI (deionized water). In particular, it may be an appropriate combination of a plurality of solvents such as KOH, Isopropyl alcohol, ethyl alcohol, methyl alcohol, acetone.

One embodiment of the compounding ratio is as follows. In an exemplary embodiment of the present invention, it is preferable that the etching solution is formed in a weight ratio (wt%) of KOH: organic solvent: DI water in a ratio of 1: 4: 45. That is, when the etching conditions are formed at a ratio of DI water: IPA: KOH = 90: 8: 2 (wt%), the efficiency of the nano, or micrometer sized pyramid pyramid pattern implementation is maximized. .

In particular, the KOH solution, which is the main component of the etching solution, has the property of etching at an angle of 57.3 degrees with respect to the surface of the silicon wafer. Thus, by appropriately adjusting the pattern size and etching conditions of the etching mask, the KOH solution can be etched into an appropriate size pyramid structure. . In addition, by controlling the temperature and the etching time of the etching solution, nucleation-inducing factor, that is, ultrasonic shock can also be implemented as an etching variable as the triggering condition for triggering silicon etching, in particular, when ultrasonic shock is applied simultaneously with etching, The reproducibility and etching rate can be improved very uniformly and efficiently.

3 is a planar image showing an enlarged image of the wafer surface after the etching process according to the present invention, Figure 4 is a side image showing an enlarged image of the wafer surface after the etching process according to the present invention.

As shown in the image, a pyramid pattern having a 'V' shape or a square pyramid can be realized by using an efficient anisotropic etching method of silicon through the etching method according to the present invention. Can be used as a master for In addition, the pattern of the silicon wafer formed in accordance with the present invention has the advantage of extracting the multi-angle radiation of the Lambertian light source such as LED, OLED light source in a constant direction and the maximum amount of light possible without loss This is implemented.

To this end, the optical pattern, the interval between each optical pattern is spaced in the range of 0.0 ㎛ ~ 100 ㎛ can be arranged uniformly or unevenly. This range includes cases where the gaps between the respective optical patterns are formed to be in close contact with each other or partially overlap each other.

In addition, the size of each pattern may be formed in the range of 0.1 ㎛ ~ 100 ㎛, pitch of 0.1 ㎛ ~ 100 ㎛. If the size of the pattern is out of the range of 0.1 ㎛ ~ 100 ㎛, there is a problem that the effect of light extraction is significantly reduced. Pitch is defined here as meaning the distance between the central axis of each pattern.

Further, the optical pattern is any one of triangular prism type, triangular pyramid shape, pyramid pattern type, and conical shape, and the angle of the peak of each pattern may be formed at 65 to 75 degrees.

Referring to FIG. 2, first, an optical pattern 11 is implemented on the surface of a (100) silicon master wafer 10 having directivity through the above-described one-step process (S 1), and then shown in S 2. As described above, a process of coating the molding liquid 20 on the surface of the silicon master wafer 10 is performed, and the substrate 30 for soft mold is coated on the upper surface of the molding liquid 20. The molding liquid 20 may be a photocurable or thermosetting resin, but in the preferred embodiment of the present invention, it is more preferable to form the photocurable resin.

The soft mold base 30 is preferably using a light-transmitting polymer film, for example, may be any one of PC (Polycarbonate), PET, PMMA, PETG, COC, but is not necessarily limited to all soft Optical film can be applied.

Thereafter, as shown in S 3 to S 4, the molding liquid is irradiated with light in a UV region to cure the molding liquid, and then for the cured molding liquid 20 and the soft mold having the transfer pattern 21. A process of separating the soft mold 1 made of the substrate 30 from the silicon wafer 10 and trimming the soft mold according to the purpose may be performed.

The soft mold 1 manufactured by the above-described manufacturing process includes a transfer optical pattern having a structure in which the optical pattern formed on the surface of the (100) silicon master wafer having directivity is transferred.

That is, as shown in the process diagram of step S4 of FIG. 2, the soft mold according to the present invention includes a substrate 10 composed of a light transmissive polymer film and a photocurable resin layer laminated on an upper surface of the substrate 10. And a transfer optical pattern 21 having a pattern size of 0.1 μm to 100 μm and a pitch of 0.1 μm to 100 μm on the photocurable resin layer. Can be configured.

As described above, the substrate 10 is implemented as a light transmissive polymer film, which may use any one of PC (Polycarbonate), PET, PMMA, PETG, COC.

In addition, the transfer optical pattern 21 is a structure in which the optical pattern formed on the surface of the silicon master wafer is transferred in the manufacturing process described above, and thus has a pattern having the same structure as the optical pattern, for example, triangular prism, triangular pyramid, and pyramid. Patterns, conical, spherical, non-spherical, any one of the shape of the pattern, or may be implemented in two or more patterns. As described above in the manufacturing process, the transfer optical pattern, the interval between each transfer optical pattern is spaced in the range of 0.0 ~ 100 ㎛ can be arranged uniformly or non-uniform, in particular triangular prism type, triangular pyramidal, pyramid In the case of any one of a pattern type and a cone shape, the angle of the peak of each pattern may be implemented at 65 to 75 degrees.

The soft mold 1 of such a structure is one of hot embossing, lamination, injection molding, nano-imprinting, compressive molding, and PDMS. By applying the soft mold in any one process it is possible to manufacture the optical film by transferring the optical pattern to the optical film.

The present invention is to remove the oxide film on the surface of the (100) silicon wafer having a directional and to perform the etching by applying ultrasonic waves to the etching process to the etching solution containing KOH on the surface of the wafer to master the silicon wafer whose surface is etched in a pyramid shape Make it available as a mold. The optical pattern implemented in this process, that is, the pyramidal pattern has excellent light extraction effect and is very simple and effective because the pattern formation method uses only wet etching as compared to the existing methods. The silicon master pattern has a size of 12 inches or more, and the silicon master pattern has an advantage of effectively etching wafers of any size.

In addition, the optical pattern on the silicon wafer can be obtained a nano, or micrometer-sized square pyramid pyramid pattern through a simple etching solution, it can be used as a master pattern to produce a large area film.

In addition, the pattern-transfer film formed through the nano- or micro-sized pattern in the form of a paramid square pyramid can realize a uniform and maximum light extraction efficiency with respect to the light source of the Lambertian emission type.

The technique according to the present invention is important to maximize the incidence of external sunlight in solar cell manufacturing, in which the surface of the transparent conductive oxide (TCO) to form a micro pyramid pattern to be useful for the production of a surface film having the maximum transmittance without the reflected light Can be used.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

10: silicon wafer
11: optical pattern
20: molding liquid
21: transfer pattern
30: base material for soft mold

Claims (16)

The molding liquid is applied to the surface of the (100) silicon master wafer having the directionality embodied in the optical pattern,
The base for soft mold is brought into contact with the applied molding liquid and cured;
A method for producing a soft mold comprising the step of separating the cured molding liquid and the substrate for soft mold.
The method according to claim 1,
The optical pattern implemented on the silicon master wafer surface,
Method of producing a soft mold, characterized in that the triangular prism type, triangular pyramid, pyramid pattern, conical, spherical, non-spherical pattern, or two or more patterns.
The method according to claim 1,
The optical pattern,
Triangular prism, triangular pyramid, pyramid pattern, conical pattern
The angle of the peak of each pattern is 65-75 The manufacturing method of the soft mold characterized by the above-mentioned.
The method according to claim 2 or 3,
The optical pattern,
A method of manufacturing a soft mold in which an interval between each optical pattern is spaced in a range of 0.0 μm to 100 μm to be uniformly or unevenly arranged.
The method of claim 4,
The optical pattern,
The manufacturing method of the soft mold whose size of each pattern is 0.1 micrometer-100 micrometers, and a pitch is 0.1 micrometer-100 micrometers.
The method according to claim 8,
The soft mold base material,
Soft mold manufacturing method using any one of PC (Polycarbonate), PET, PMMA, PETG, COC.
Transfer the optical pattern to the optical film using a soft mold prepared by the manufacturing method of claim 1,
Apply the soft mold to any one of hot embossing, lamination, injection molding, nano-imprinting, compression molding, and PDMS. To transfer the optical pattern to the optical film.
A substrate composed of a light transmissive polymer film;
A photocurable resin layer laminated on the upper surface of the substrate; And
A transfer optical pattern formed on the photocurable resin layer; Including,
The size of the said transfer optical pattern is 0.1 micrometer-100 micrometers, The soft mold characterized by the range of 0.1 micrometer-100 micrometers.
The method according to claim 8,
The transfer optical pattern,
A soft mold comprising a triangular prism shape, a triangular pyramid shape, a pyramid pattern shape, a conical shape, a spherical shape, a non-spherical shape pattern, or two or more patterns.
The method according to claim 8,
The transfer optical pattern,
A soft mold in which intervals between respective transfer optical patterns are spaced in a range of 0.1 μm to 100 μm to be uniformly or non-uniformly arranged.
The method according to claim 8,
The transfer optical pattern,
Triangular prism, triangular pyramid, pyramid pattern, conical pattern
Soft point of each pattern is 65-75, The soft mold characterized by the above-mentioned.
The method according to claim 8,
The above description,
Soft mold using any one of polycarbonate (PC), PET, PMMA, PETG and COC.
An optical film produced by the method of using the soft mold of claim 7.
The method according to claim 13,
The optical film,
Polymeric optical film substrates;
A second optical pattern formed on an upper surface of the polymer optical film substrate;
The second optical pattern is an optical film arranged in a pattern of any one of a triangular prism type, triangular pyramid shape, pyramid pattern type, conical shape, spherical shape, non-spherical shape, or a combination of two or more patterns.
The method according to claim 14,
The second optical pattern,
The size is in the range of 0.1-100 μm, the pitch is 0.1-100 μm,
The optical film is arranged uniformly or non-uniformly spaced apart in the range of 0.0 ㎛ ~ 100 ㎛ between the second optical pattern.
The method according to claim 15,
The second optical pattern,
Optical film with an angle of 65 to 75 degrees at the tip of each pattern.

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