KR20120101039A - Method for producing terminal for electronic component, and terminal for electronic component produced by the production method - Google Patents

Abstract

The present invention provides a method for producing an electronic component terminal, in which a lead terminal portion plated with lead-free tin and an electronic component terminal where an electronic terminal portion made of aluminum are bonded are obtained. A method for manufacturing an electronic component terminal comprising a lead terminal portion plated with lead-free tin and an electrode terminal portion made of aluminum, wherein the lead terminal portion and the electronic terminal portion are disposed at intervals between the lead terminal portion and the electronic terminal portion. Plasma is generated by applying a voltage, and impact welding is performed while pressing one end of the lead terminal portion and the shaft center of the electronic terminal portion while melting or semi-melting the lead-free tin plating by the plasma.

Description

Method for producing terminal for electronic component and terminal for electronic component obtained by method of manufacturing the same {Method for Producing Terminal for Electronic Component, and Terminal for Electronic Component Produced by the Production Method}

The present invention relates to a method for manufacturing an electronic component terminal having a structure in which an electrode terminal made of an aluminum member and a lead terminal such as a copper wire or a CP line are combined. More specifically, a lead terminal coated with lead-free tin is provided. The manufacturing method of the terminal for electronic components joined to the aluminum electrode, and the terminal for electronic components obtained by the manufacturing method are related.

The terminal for electronic components used for a battery, a capacitor, a capacitor, etc. has a structure in which the lead lead terminal is joined to a pair of rivet parts which function as a pair of electrodes. Moreover, the tab terminal used for an electrolytic capacitor etc. has a structure in which the lead wire was joined to a pair of electrode terminal. Each of these terminals is formed by joining aluminum and copper.

Conventionally, in lug terminals to snap terminals, the coupling between the electrode terminal and the lead lead has been accomplished by mechanical methods such as bolt tightening, caulking, seamer, ultrasonic bonding, and the like. Among them, the mechanical method tends to increase the volume of the junction portion, lower the energy bulk density of the entire battery, and increase the interface resistance of the junction portion. And since it requires production cost, it is not suitable for mass production. In addition, the ultrasonic bonding may adversely affect the active material of the electrode due to the added vibration. In order to solve such a problem, an attempt has recently been made to join the rivet portion and the lead lead portion by welding.

And the tab terminal for electrolytic capacitors is generally performed by welding an electrode terminal and a lead wire by welding.

As the lead lead used for these terminals, copper is often used in order to improve thermal conductivity or electrical conductivity. And in order to improve the soldering characteristic of an electronic component, what plated the surface as said lead wire is used.

On the other hand, in recent years, in consideration of environmental problems, development of a technique using lead-free solder for lead-free electrode terminals or joining of electronic components of electronic components has begun. Also in the lead wire used as a terminal of an electronic component, what is called lead-free tin plating which does not use lead instead of the conventional lead containing tin plating is beginning to be used.

In the terminal of the electronic component using the lead wire with such lead-free tin plating, even if an electrode terminal and this lead wire are joined by welding, sufficient joint strength is not obtained. In order to solve such a problem, Japanese Unexamined Patent Publication No. 10-229152, for example, discloses a method of improving the bonding strength between a copper lead wire and an aluminum electrode terminal by adding silver, bismuth, or the like to tin plating. have.

In Japanese Patent Application Laid-Open No. 08-222482, an aluminum electrode terminal portion is heated, the aluminum is heated in a semi-fused state, the lead wire is joined, and then the aluminum portion is further heated, thereby forming copper-aluminum-tin. A method of forming a diffusion alloy layer to strongly bond a lead wire and an aluminum electrode is disclosed.

However, in the method of adding silver or the like to tin plating, there is a problem in that commercially available lead-free tin plating copper wire cannot be used because the plating process itself must be changed.

In a method of joining lead wires while heating an aluminum electrode, a lead wire (CP wire) coated with copper wire is used as a lead wire, and the aluminum electrode and the iron wire are strongly connected through a diffusion alloy layer made of copper-aluminum-tin. Although it can join, when using the copper lead wire which does not have such an iron core, the joining strength of a copper lead wire and an aluminum electrode does not improve even if said method is used.

On the other hand, when a copper wire is used as the lead wire, about 10% of the internal resistance of the capacitor can be reduced compared to the CP wire, and the energy saving effect of at least 10% can be expected by using such a low ESR type capacitor in the digital home appliance. Known. In addition, capacitors used in hybrid vehicles, electric vehicles, and the like are required to have high reliability, and therefore, those fixed by welding are used rather than fixing conventional aluminum electrodes and lead terminals with screws or rivets. Thus, in electrode terminals, such as a capacitor | condenser and a capacitor, the lead wire which consists of copper single substance rather than CP line | wire is used preferably, and development of the joining technique of an aluminum electrode and a copper lead wire is calculated | required.

MEANS TO SOLVE THE PROBLEM When the conventional welding is performed in the lead terminal part plated with a lead-free tin and the electronic component terminal by which the aluminum electrode terminal part was joined, an intermetallic compound, such as tin-copper or tin-aluminum, will be added to the junction interface of silver and aluminum. It was found that the weld strength decreased due to the presence of such an intermetallic compound. By employing a specific welding method, it has been found that these intermetallic compounds are not formed at the copper / aluminum junction interface, and thus an electronic component terminal excellent in welding strength can be realized.

Accordingly, an object of the present invention is to bond copper and aluminum even when a lead-free tin plated lead wire commercially available as a lead wire terminal part is used in an electronic component terminal in which lead-free tin plated lead terminal portions and aluminum electrode terminal portions are joined. It is an object of the present invention to provide a method for producing an electronic component terminal, in particular a tab terminal for a capacitor, in which an intermetallic compound does not substantially exist at the interface and an terminal for an electronic component having excellent bonding strength is obtained.

Further, another object of the present invention is to provide a terminal for an electronic component which is substantially free of an intermetallic compound on the joining interface between copper and aluminum obtained by the above-described manufacturing method and which has excellent joining strength.

And the manufacturing method of the terminal for electronic components in this invention is a manufacturing method of the terminal for electronic components by which the lead terminal part plated with lead-free tin and the electrode terminal part which consists of aluminum are joined together,

The lead terminal portion and the electrode terminal portion are arranged at intervals,

Plasma is generated by adding a voltage between the lead terminal portion and the electrode terminal portion,

Performing welding by pressing the lead terminal portion and the axis of the electrode terminal portion while melting or semi-melting the lead-free tin plating by the plasma.

In still another embodiment of the present invention, an electronic component terminal obtained by the manufacturing method of the present invention is also provided.

According to the present invention, in an electronic component terminal in which a lead-free tin plated lead terminal portion and an aluminum electrode terminal portion are joined, even if a commercially available lead-free tin-plated lead wire is used as the lead wire terminal portion, it is substantially applied to the junction interface between copper and aluminum. Therefore, an intermetallic compound does not exist, and the terminal for electronic components excellent in joining strength can be implement | achieved.

1 shows a schematic view of a tab terminal for an electrolytic capacitor, which is an example of the present invention.
It is sectional drawing of the tab terminal which expanded the welding part of the aluminum electrode terminal part and copper lead wire terminal part in FIG.
Figure 3 shows the pressing process during impact welding in the present invention.
4 shows a welding step of a method for manufacturing an electronic component terminal according to still another embodiment of the present invention.
5 shows a welding step of a method for manufacturing an electronic component terminal according to still another embodiment of the present invention.
Fig. 6 shows a welding step of a method for manufacturing an electronic component terminal in still another embodiment of the present invention.
FIG. 7: shows the electron microscope observation image (50 times) of the cross section of the weld part of the tab terminal for electrolytic capacitors in Example 1. FIG.
FIG. 8: shows the electron microscope observation image (50 times) of the cross section of the weld part of the tab terminal for electrolytic capacitors in the comparative example 1. FIG.

EMBODIMENT OF THE INVENTION The terminal for electronic components which concerns on this invention is demonstrated in detail, referring drawings.

In the method for manufacturing a terminal for an electronic component according to the present invention, a lead terminal portion coated with lead-free tin and an electrode terminal portion made of aluminum are disposed at intervals, and a plasma is generated by adding a voltage between the lead terminal portion and the electrode terminal portion. And performing welding by pressing the lead terminal portion and the center of the electrode terminal portion while melting or semi-melting the lead-free tin plating by the plasma. In this invention, the tin plating layer of a lead terminal part is made into a semi-melt state, and impact welding is performed, pressing a lead terminal part and an aluminum electrode terminal part in that state. In the terminal for electronic components thus obtained, the tin metal layer is substantially free from the welding interface between the lead and the aluminum electrode. Since tin does not exist in the interface between an aluminum electrode and a lead wire, such an intermetallic compound, such as tin-copper, is not formed, and the welding strength of a terminal improves. Here, "substantially" does not mean a state in which intermetallic compounds such as Cu ₃ Sn and Cu ₆ Sn ₅ are removed at the molecular level, but tin-copper or the like at the interface between copper and aluminum. Means a state in which the alloy does not exist as an intermetallic compound layer. In addition, the state where the lead-free tin plating was "semi-melted" shows that the tin of the solid state which was not welded in part may be included.

Hereinafter, although the tap terminal used as an electrolytic capacitor terminal is demonstrated about the manufacturing method of the terminal for electronic components of this invention as an example, this invention is not limited to the manufacturing method of such a tab terminal, It is a double weight. It goes without saying that the present invention can also be applied to other condenser terminals such as electrolytic capacitors, and to manufacturing methods such as lug terminals or snap terminals used in the capacitors.

1 shows a schematic view of a tab terminal for an electrolytic capacitor, which is an example of the present invention. The lead wire 2 coated with the lead-free tin plating 4 is welded to the aluminum electrode terminal 1 having the flat plate portion 3. 2 is a cross-sectional view of a tab terminal in which a welded portion of an aluminum electrode terminal and a lead wire is enlarged.

The lead wire 2 is coated with lead-free tin plating 4, and typically, a tin coated on the copper wire 5 with a thickness of about 12 µm can be suitably used. As the lead terminal, in addition to coating the above copper wire with lead-free tin plating, a lead wire (CP wire) coated with copper may be coated with lead-free tin plating. This lead wire is cut | disconnected to the desired length calculated | required as a tab terminal. In this invention, it is preferable that the one end part by the side of the junction of a lead wire with the aluminum electrode is shape | molded by taper shape. The tapered shape may be wedge shaped or conical shaped. It is preferable that the tip angle of the lead wire tip part molded to a taper shape is 30-90 degrees. More preferably, it is 55-65 degrees. If the tip angle is an acute angle of more than 30 °, the machining becomes difficult, and if it exceeds 90 °, the lead end portion may be bent and welded out of the center of the aluminum electrode when the lead wire is pressed and welded to the aluminum electrode. Furthermore, in the case of the wedge shape, it is preferable that the ridge line of the wedge tip has an angle of 3 to 90 °, preferably about 35 to 85 ° with respect to the axial direction of the lead wire. In this way, by setting the tip portion of the lead wire at an acute angle, plasma discharge during impact welding is preferably performed.

On the other hand, the aluminum electrode terminal portion is formed by cutting a wire material made of aluminum into a predetermined length, joining the copper lead wire of a predetermined length by welding, and forming the head of the aluminum wire material flat by a press.

The welding method in this invention is demonstrated in detail, referring drawings. First, it arrange | positions at intervals so that the copper lead wire (lead terminal part) 2 and the aluminum wire (aluminum electrode terminal part) 1 may not contact (FIG. 3 (a)). The arrangement of both terminal portions may be fixed by, for example, holding both terminal portions with respective chucks or the like. In addition, the space | interval which both terminals do not contact is about 0.3-10 mm. If the interval is wider than 10 mm, it is necessary to increase the voltage in order to generate plasma, and if it is narrower than 0.3 mm, there is a possibility that a short circuit occurs when voltage is applied to both terminals. The voltage applied to both terminal portions is about 5 to 100 V from the viewpoint of plasma discharge, and can be appropriately adjusted according to the distance between the two terminals.

When a voltage is applied between the copper lead wire and the aluminum wire in such a state, as shown in Fig. 3B, the plasma discharge P is generated at the tip end portion of the copper lead wire or the end of the aluminum wire. By the plasma P, the lead-free tin plating 4 coated on the copper lead wire is in a semi-melt to molten state. Further, the tip of the copper lead wire 2 and the shaft center portion of the aluminum wire 1 are also in a molten state by the plasma P. FIG.

The copper lead wire is fixed in the above state, and the aluminum wire is pressed to join the copper lead wire and the aluminum wire by impact welding so that the copper lead wire touches the axial center of the aluminum wire (FIG. 3C). If the lead-free tin plating is welded to the copper lead wire and the aluminum wire in the state of melting or semi-melting only when pressed, the copper lead wire (excluding the lead-free tin plating layer 4 melted at the time of pressing, as shown in FIG. The tip of 2) is inserted into the shaft center 1 of the aluminum wire (electrode terminal portion). When solidified in such a state, the tip of the lead wire inserted into the aluminum electrode is joined to the aluminum electrode while maintaining the tapered shape. Tin metal layer is hardly formed in the joining interface of aluminum / copper in this lead wire tip part. That is, the tin metal layer is formed only in the vicinity of the weld reinforcement 4 ', and the tin 4 layer is in a state where almost no tin 4 remains in the portion where the lead wire is inserted into the aluminum electrode portion. As a result, the intermetallic compound of tin and aluminum to tin and copper is no longer formed at the copper / aluminum junction interface.

Pressing of both terminal parts is performed by fixing the copper lead wire 2 and pressing the aluminum wire (electrode terminal part) 1 side. In addition, as shown in Fig. 3D, the pressing force may be further increased when the lead wire 2 is embedded in the shaft center of the aluminum wire 1 (electrode terminal portion) by pressing. By pressing in this way, the intermetallic compound of tin and aluminum to tin and copper is no longer formed in a copper / aluminum junction interface, As a result, the tab terminal excellent in joining strength can be obtained. In addition, it is necessary to say that the copper lead wires 2 may be pressed against the axial center of the aluminum wires by holding the aluminum wires (electrode terminal portions) 1 in the upside down direction and pressing the copper lead wires 2 side in a reverse direction. There is no. In the present invention, the above CP wire may be used instead of the copper lead wire.

The inventors have found that the bonding strength of an aluminum electrode / lead wire forms an intermetallic compound such as Cu ₃ Sn or Cu ₆ Sn ₅ at the interface between such a tin layer and aluminum, or a tin layer and copper, and the intermetallic compound phase (phase). It has been found that cracks are generated and advanced due to the presence of the metal phase) and the tin metal phase, and the terminal is cut at the junction interface between the aluminum electrode and the lead wire. That is, in conventional welding, the tin plating coated on the copper lead wire melts to form a tin metal phase on the junction interface between aluminum and copper, and at the same time, a tin-copper or tin-aluminum alloy phase such as Cu ₆ Sn ₅ ( Intermetallic compound phase) is also formed. If the layer made of tin metal or intermetallic compound present at the junction interface has a certain thickness, cracks are generated in the layer due to external stress or the like, and the cracks are advanced to other sites, thereby cutting the terminal. In this invention, the terminal for electronic components which is excellent in joining strength can be implement | achieved by joining a copper lead wire and an aluminum electrode part using the welding method in which substantially no intermetallic compounds, such as copper- tin, exist.

In addition, it was found that generation of blowholes is also suppressed by impact welding while melting or semi-melting lead-free tin plating of lead wires in this way. That is, when welding a copper lead wire and an aluminum wire by conventional resistance welding, it is thought that a part of tin vaporizes and a blowhole generate | occur | produces by the rapid temperature rise (about 2000 degreeC), However, in the manufacturing method of this invention, In this case, since the tin plating layer is melted so that the tin layer is not formed on the aluminum / copper interface, it is considered that the blowhole itself does not occur.

In the present invention, the lead-free tin plating on the surface of the lead wire is melted or semi-melted by plasma discharge during impact welding. In order to more completely make the lead-free tin plating melt or semi-melt, the tip portion of the lead wire is You may heat. As such a heating method, as shown in FIG. 4, only the tip portion of the copper lead wire 2 can be locally heated by condensing the irradiation light with the lens 7 using the halogen lamp heater 6. The heating temperature is such that the temperature at which tin melts, that is, the surface of the copper lead wire terminal is about 240 ° C. In addition, in order to prevent the solder wettability of a plating layer from falling, it is better not to heat a part other than the to-be-welded part of a lead as much as possible, and therefore it is preferable to heat only a lead end part.

In addition, in order to prevent oxidation of aluminum / copper at the time of welding, when inert gas, such as argon and nitrogen, is inject | poured into a welding part, as a heating method of another embodiment, as shown in FIG. 5, heated inertness By injecting gas into the weld portion, the tip portion of the copper lead wire can also be heated. When the inert gas injection apparatus 10 is attached to a welding apparatus, it can implement by attaching the heating apparatus 11 in the middle of the gas introduction path 12. As a heating apparatus, conventional heating techniques, such as a ceramic heater, can be used. The heating device 11 is adjusted so that the inert gas temperature near the outlet of the injection device 10 is about 240 ° C., which is the melting point of tin. As the inert gas, N ₂ or argon gas can be appropriately used.

Furthermore, the heating by the halogen lamp heater and the injection of the heated inert gas may be performed simultaneously.

In the manufacture of the lug terminal and the snap terminal, when welding the lead wire 2 to the aluminum electrode 1, as shown in FIG. 6, the positive electrode portion is covered with a transparent resin container 13 having excellent elasticity, and An inert gas is filled in the inside of the transparent resin container 13, and a hot wire is irradiated from the outside of the transparent resin container 13 by the halogen lamp heater 6 to heat the tip of the lead wire 2. The transparent resin container can use transparent resin films, such as polyolefin, suitably.

In the terminal for electronic components manufactured as described above, the tin-copper compound or the tin-aluminum compound does not substantially exist at the welding interface between the aluminum electrode portion and the lead wire, and the bonding strength, in particular, the electrode portion made of aluminum and copper It is excellent in the cutting strength of the lead wire which consists of.

In the terminal for an electronic component manufactured by the above method, the thickness of the tin metal layer present at the junction interface between the lead wire made of copper and the aluminum electrode portion is 80% or less of the copper lead wire tin plating layer. Thus, the welding strength can be raised by making the thickness of the tin metal layer which exists in a copper / aluminum interface thin. As shown in Fig. 3A, the tin metal layer does not need to be formed uniformly at the joining interface by welding, but it is more preferable that the tin layer is not formed at the tip portion of the copper lead wire. The thickness of the tin metal layer in this invention shows the maximum thickness of the tin metal layer which exists in a joining interface.

Moreover, in the terminal for electronic components obtained by the said manufacturing method, especially the copper terminal wire and CP wire are used as a lead terminal part, and the tab terminal for capacitor | condensers which used aluminum wire as an aluminum electrode part WHEREIN: Since no tin layer was formed at the interface, it was found that the occurrence of whiskers seen in the tab terminal plated with conventional lead-free tin is suppressed. The suppression of whisker generation of the tab terminal by the manufacturing method of the present invention was an unexpected surprising effect. Although the reason is not exact, it is considered that the tin metal hardly exists in the vicinity of the weld joint part of a tab terminal.

Example  One

 As a lead terminal member, this lead copper wire was cut | disconnected to 20 mm length using the 0.6-mm diameter copper lead wire with lead-free tin plating (plating thickness 12 micrometers). Further, an aluminum wire of 1.2 mm Ø was used as the aluminum electrode terminal member, and this aluminum wire was cut into a length of 9 mm.

The copper lead wire and the aluminum wire cut | disconnected to predetermined length were made to hold each electrode of the impact welding apparatus. Next, the irradiation light was condensed through the lens using a halogen lamp heater (IHU-A: Ushio Electric Co., Ltd.), and the aluminum electrode side tip portion of the lead wire member was irradiated. It was 260 degreeC when the temperature of the tip part of a lead wire member was measured with the non-contact thermometer.

Next, plasma discharge was performed by applying a voltage (about 50 V) to the positive electrode in this state, and welding was carried out while pressing one end of the copper lead wire to the center of the aluminum wire to join the copper lead wire and the aluminum wire. And the other end of the welded aluminum wire was pressed and flattened, the flat part was cut | disconnected so that it might become a predetermined shape, and the tab terminal 1 for electrolytic capacitors was obtained.

Example  2

As a lead wire terminal member, a 1.0 mm diameter copper lead wire with lead-free tin plating (plating thickness of 12 µm) was used. The copper lead wire was cut | disconnected to 10.0 mm length, and one tip part was processed into the conical shape of 60 degrees (taper process). Moreover, in the sealing plate member in which the aluminum base material was sealed by resin by the integral molding, the welding surface of the aluminum base material was smoothed by the press. These copper lead wires and sealing plate members were supplied to respective base materials of the impact welding apparatus.

Next, in this state, a voltage (approximately 50 V) is applied to the positive electrode to perform plasma discharge, and welding is carried out while pressing the tapered shape of the copper lead wire to the axis of the sealing plate member, and the copper lead wire and the sealing plate member are joined together. And the sealing plate lead terminal for capacitors were obtained.

Example  3

In Example 2, the lead terminal was obtained like Example 2 except having processed one tip part of the copper lead wire into the wedge shape of 60 degree tip angle.

Comparative example  One

As the lead terminal member and the aluminum electrode terminal member, the same terminal as in Example 1 was used, and both terminals were joined by conventional resistance welding (applied voltage 50V), and in the same manner as in Example 1, the other side of the welded aluminum wire was One end was pressed and flattened, and the flat part was cut | disconnected so that it might become a predetermined shape, and the tab terminal 2 for electrolytic capacitors was obtained.

Observation of the junction interface

In order to observe the side cross section of the obtained tab terminal, the sample was polished in the lateral direction. An ion etching process of about 80 μm was applied to the polished surface, and surface observation and auger electron spectroscopy (AES) plane analysis were performed using a scanning auger electron spectrometer (SAM670, manufactured by PHI). In AES surface analysis, it measured on the conditions of 20 kV of acceleration voltages, 15 nA of sample currents, and 70 nm or less of beam diameters. From the AES surface analysis results, no intermetallic compound such as Cu ₆ Sn ₅ was detected in the tab terminal 1. On the other hand, the tab terminal (2), the tin, and Cu ₆ Sn presence of intermetallic compounds such as ₅ was found in the junction interface.

In addition, the sample was ground in the lateral direction in the same manner as described above, and used for SEM observation. The SEM observation image (50 times) of the bonding cross section of the tab terminal 1 is shown in FIG. 7, and the SEM observation image (50 times) of the bonding cross section of the tab terminal 2 is shown in FIG. From the SEM observation result shown in FIG. 7, in the tab terminal 1, formation of the tin layer and the intermetallic compound layer of copper / aluminum was not seen in the lead end part in the junction interface part of a lead wire and an aluminum electrode. Moreover, in the joining interface in the vicinity of welding reinforcement, the intermetallic compound of 1-2 micrometers and the tin layer of 1 micrometer or less were formed between a copper layer and an aluminum layer. The thickness of the intermetallic compound layer is thicker than that of the tin layer is believed to be due to the consumption of tin by reaction with copper or aluminum during welding. On the other hand, in the tab terminal 2, it was confirmed that the tin layer is formed in the front-end | tip part of a copper lead wire and the interface surface of aluminum electrode electron.

Moreover, the thickness of the tin layer was measured by SEM observation. The results are shown in Table 1.

Flexibility  Endurance test

About the obtained tab terminal 1 and the tab terminal 2, the bending durability test was done. The bending endurance test measures the number of cycles to be cut by holding the press portion of the aluminum electrode terminal portion of the tab terminal and bending the welded portion by 90 ° to the left and right in a state where a load of 1 kg is applied to the copper lead wire. It is. The results were as shown in Table 1.

Whiskers  length measurement

The length of the whisker growing on the weld joint surface of each terminal obtained above was measured. The measurement of the whisker length was performed by measuring the length of the whisker growing in the weld reinforcement part after leaving each terminal for 2,000 hours at 60 degreeC in 95 RH% environment.

As is also clear from the results shown in Table 1, the tab terminal 1 was cut at the welded portion of copper-aluminum, and the cutting cycle was 2.5 or more, which was excellent in weld strength. On the other hand, it turns out that the tab terminal 2 bonded by the conventional welding method is inadequate in bonding strength by formation of an intermetallic compound. In addition, it turns out that the whisker generation | occurrence | production of the terminal obtained by the manufacturing method of this invention is suppressed.

Lead wire heating method Sn layer thickness
(Μm) Joint strength
(Cycles) Whisker length
(Μm)
Example 1 Impact welding
+
Local heating
0
3.25
0
Example 2 Impact welding
+
Cone Shape (Tapered) Machining
0
3.0
0
Example 3 Impact welding
+
Wedge geometry machining
0.3
2.75
0 Comparative Example 1 Resistance welding 10.0 1.2 200

1: aluminum electrode terminal
2: lead wire
3: reputation

Claims (12)

As a manufacturing method of the terminal for electronic components by which the lead terminal part by lead-free tin plating and the electrode terminal part which consists of aluminum are joined together,
The lead terminal portion and the electrode terminal portion are arranged at intervals,
Plasma is generated by adding a voltage between the lead terminal portion and the electrode terminal portion,
A method for manufacturing an electronic component terminal, comprising: performing impact welding while pressing one end of the lead terminal portion and an axis of the electrode terminal portion while melting or semi-melting the lead-free tin plating by the plasma. The method of claim 1,
The manufacturing method of locally heating only the to-be-welded part of the said lead terminal part. The method of claim 2,
The manufacturing method of local heating of the said lead terminal part by a non-contact heater. The method according to any one of claims 1 to 3,
The manufacturing method of heating the said lead terminal part by injecting heated inert gas. The method according to any one of claims 1 to 4,
And a step of forming a tapered shape at the junction side end of the lead terminal portion. The method of claim 5, wherein
The joining side edge part of the said lead terminal part is shape-processed by cone shape of tip angle 30-90 degrees. The method of claim 5, wherein
A joining end of the lead terminal portion is formed into a wedge shape having a tip angle of 30 to 90 °, and the ridge line of the wedge tip has an angle of 3 to 90 ° with respect to the axial direction of the lead terminal. The terminal for an electronic component obtained by the manufacturing method in any one of Claims 1-7, Comprising: A tin-copper compound or a tin-aluminum compound is not substantially present in the junction interface of the said lead terminal part and the said electrode terminal part. Terminal for electronic components. The method according to any one of claims 1 to 8,
An electronic component terminal, wherein said lead wire is made of copper or CP wire. The method of claim 9,
The terminal for electronic components whose thickness of the tin layer which exists in the junction interface of the said copper lead terminal part and an aluminum electrode terminal part is 80% or less of the thickness of the lead-free tin plating layer plated by the lead terminal part. The method of claim 9,
The terminal for electronic components whose thickness of the tin layer which exists in the junction interface of the said copper lead terminal part and an aluminum electrode terminal part is 20% or less of the thickness of the lead-free tin plating layer plated by the lead terminal part. The method according to any one of claims 8 to 11,
Terminal for electronic components used as a tab terminal for capacitors.

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