MY163372A - Method for manufacturing terminal for electronic component, and terminal for electronic component obtained by the same - Google Patents

Method for manufacturing terminal for electronic component, and terminal for electronic component obtained by the same

Info

Publication number
MY163372A
MY163372A MYPI2012700244A MYPI2012700244A MY163372A MY 163372 A MY163372 A MY 163372A MY PI2012700244 A MYPI2012700244 A MY PI2012700244A MY PI2012700244 A MYPI2012700244 A MY PI2012700244A MY 163372 A MY163372 A MY 163372A
Authority
MY
Malaysia
Prior art keywords
terminal portion
electronic component
terminal
lead
manufacturing
Prior art date
Application number
MYPI2012700244A
Inventor
Shuhei Yoshizawa
Yoshio Yokohama
Futoshi Ishii
Original Assignee
Kohoku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kohoku Kogyo Kk filed Critical Kohoku Kogyo Kk
Publication of MY163372A publication Critical patent/MY163372A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

THERE IS DISCLOSED A METHOD FOR MANUFACTURING A TERMINAL FOR AN ELECTRONIC COMPONENT COMPRISING A LEAD-FREE TIN-PLATED LEAD TERMINAL PORTION (2) AND AN ELECTRODE TERMINAL PORTION (1) INCLUDING ALUMINUM BONDED TO THE LEAD TERMINAL PORTION (2), COMPRISING THE STEPS OF: PLACING THE LEAD TERMINAL PORTION (2) AND THE ELECTRODE TERMINAL PORTION (1) AT A SPACING; APPLYING A VOLTAGE BETWEEN THE LEAD TERMINAL PORTION (2) AND THE ELECTRODE TERMINAL PORTION (1) TO GENERATE PLASMA; AND PERFORMING PERCUSSION WELDING WHILE PRESSING ONE END OF THE LEAD TERMINAL PORTION (2) AND THE SHAFT CORE OF THE ELECTRODE TERMINAL PORTION (1) WHILE MELTING OR SEMI-MELTING THE LEAD-FREE TIN PLATING BY THE PLASMA.
MYPI2012700244A 2009-11-02 2009-11-02 Method for manufacturing terminal for electronic component, and terminal for electronic component obtained by the same MY163372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/068767 WO2011052091A1 (en) 2009-11-02 2009-11-02 Method for producing terminal for electronic component, and terminal for electronic component produced by the production method

Publications (1)

Publication Number Publication Date
MY163372A true MY163372A (en) 2017-09-29

Family

ID=43921533

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012700244A MY163372A (en) 2009-11-02 2009-11-02 Method for manufacturing terminal for electronic component, and terminal for electronic component obtained by the same

Country Status (5)

Country Link
JP (1) JP5461570B2 (en)
KR (1) KR101616453B1 (en)
CN (1) CN102138190B (en)
MY (1) MY163372A (en)
WO (1) WO2011052091A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105478943A (en) * 2016-01-07 2016-04-13 深圳市金联富电子科技有限公司 Welding process for capacitor lead
TWI740793B (en) * 2016-10-04 2021-09-21 日商湖北工業股份有限公司 Method for manufacturing lead terminal of chip type electrolytic capacitor and chip type electrolytic capacitor
DE102018113342A1 (en) 2018-06-05 2019-12-05 Tdk Electronics Ag CONDENSER, A CONDENSER AND A COLLAR RAIL COMPLEMENTING ARRANGEMENT AND METHOD FOR THE PRODUCTION OF A CONDENSER
CN112053850B (en) * 2020-10-12 2022-05-24 立敦电子科技（惠州）有限公司 Preparation method of special miniature-capacitor shrinkage guide pin
WO2022131160A1 (en) * 2020-12-14 2022-06-23 湖北工業株式会社 Lead terminal for electrolytic capacitors and method for producing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299863A (en) * 1987-05-27 1988-12-07 インステイチユト　エレクトロスバルキ　イメニ　イ−．オ−．パトナ　アカデミイ　ナウク　ウクラインスコイ　エスエスア−ル Electric arc condenser-discharge percussion stud welding method
WO1996006700A2 (en) * 1994-08-25 1996-03-07 Qqc, Inc. Nanoscale particles, and uses for same
JPH08222482A (en) * 1995-02-10 1996-08-30 Matsushita Electric Ind Co Ltd Manufacture of external lead-out wire for aluminum electrolytic capacitor
JP4401678B2 (en) * 2003-05-09 2010-01-20 湖北工業株式会社 Electronic component terminal and method for manufacturing the same
JP4497478B2 (en) * 2005-05-31 2010-07-07 国立大学法人秋田大学 Capacitor lead terminal welding method
CN101264541A (en) * 2008-05-09 2008-09-17 哈尔滨工业大学 Additional electric arc heating copper backing board pre-heating aluminum alloy and magnesium alloy welding method

Also Published As

Publication number Publication date
KR101616453B1 (en) 2016-04-28
WO2011052091A1 (en) 2011-05-05
JPWO2011052091A1 (en) 2013-03-14
CN102138190A (en) 2011-07-27
JP5461570B2 (en) 2014-04-02
KR20120101039A (en) 2012-09-12
CN102138190B (en) 2013-03-06

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