KR20120079290A - A high efficiency heat insulation board using shape memory alloy - Google Patents

Abstract

PURPOSE: A high efficiency cooling pin using a shape memory alloy is provided to increase thermal conductivity through wide surface by expanding pins according to increase of temperature. CONSTITUTION: A plurality of radiation fins(22) is formed in a long band form by using an elastic body. The elastic body has excellent thermal conductivity. A plurality of the radiation pins is attached to a shape memory alloy. The shape memory alloy is transformed according to temperature. A plurality of the radiation pins has a rounded shape.

Description

High efficiency heat insulation board using shape memory alloy {A high efficiency heat insulation board using shape memory alloy}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat sinks applied to various devices in various fields, such as computers, and more particularly, by using shape memory alloys, fins of conventional heat sinks have a shape like a long strip. By replacing with fins, the shape memory alloy is characterized in that it is configured to maximize the surface area of the heat sink in a given space by expanding each fin when the device is operated and the temperature rises, while maintaining a minimum fin volume at room temperature. It relates to a high efficiency heat sink.

In general, the heat sink serves to release the temperature of the machine or various devices to the outside, and has a condition that the large surface area and the thermal conductivity should be good.

Since the conventional heat sink is installed as a fixture that is mostly non-deformable, a relatively large volume is required to have a large surface area, thereby increasing the volume of various devices more than necessary, and preventing the miniaturization and installing them. Even though it takes up a lot of places, it becomes a factor of various difficulties.

As an example of the conventional heat sink structure as described above, there is a "heat radiating device for a portable computer" as described, for example, in Korean Patent Publication No. 10-0446958 (registered on August 24, 2004).

The above-described heat dissipation device of a portable computer of the Patent No. 10-0446958 relates to a heat dissipation device of a portable computer that transmits electrical heat generated inside the main body of the portable computer to a display unit and discharges it to the outside.

That is, more specifically, the "heat radiation device of a portable computer" of the above Patent No. 10-0446958, the method using a conventional shape memory alloy, the shape memory alloy does not play a role of direct heat conduction, but only of the electrical heat radiation device In order to solve the problem that it was not sufficient to solve the electric heat generated by the integrated device built into the portable computer because it is limited to the auxiliary means, by mounting the inside of the main body by effectively discharging the electric heat generated inside the main body of the portable computer through the display unit It is an object of the present invention to provide a heat dissipation device capable of stably operating an electronic circuit.

To this end, the "heat radiation device of a portable computer" of the Patent No. 10-0446958 described above, the display unit is attached to the outside of the rear case in order to discharge the electric heat generated inside the main body of the portable computer and transmitted to the display unit to the outside. It further comprises a heat transfer fin, characterized in that the heat transfer fin is composed of a shape memory alloy.

That is, the above-mentioned patent is composed of a bidirectional shape memory alloy that the heat transfer fin is bent when the temperature rises according to the temperature of the wall surface and flattened when the temperature is lowered, and is attached to the wall surface when the temperature of the wall surface is low. When the wall temperature rises, the heat transfer fins bend and penetrate deeply into the surrounding fluid, thereby increasing heat transfer by generating a high temperature difference between the protrusions of the fins and the wall attachment point.

However, the heat dissipation device of the registered patent has only one configuration for transmitting heat, and its heat dissipation area is small, so that the application field is limited to relatively small electronic products such as notebook computers, mobile phones, and audio.

In addition, as another example of such a prior art, there is a "heat radiation device of an audio amplifier using a shape memory alloy" as described, for example, in Korean Patent No. 10-0220508 (registered on June 22, 1999).

As described in the above-mentioned Patent No. 10-0220508, "The heat dissipation device of the audio amplifier using the shape memory alloy", the foreign matter such as dust through the heat dissipation hole formed to discharge the heat generated inside the amplifier to the outside of the amplifier This is a heat dissipation device of an audio amplifier using a shape memory alloy that not only prevents product performance from being lowered and improves cooling performance, but a conventional amplifier has a tuner or a laser disc player placed thereon. Since the upper heat dissipation is not used to emit heat, and to install a cooling fan in the amplifier is to solve the problem of disturbing the music enjoyment due to the noise generated from the fan.

To this end, the "radiating device of the audio amplifier using the shape memory alloy" of the Patent No. 10-0220508, the opening and closing of the left and right opening by the shape memory alloy spring on the side of the amplifier instead of removing the upper heat dissipation opening of the amplifier case. The installation of the plate not only prevents foreign matter from entering the amplifier, but also improves heat dissipation.

However, the heat dissipation device of Patent No. 10-0220508 is only a configuration for performing ventilation through opening and closing of the opening and closing plate, not strictly a direct heat dissipation through a structure such as a heat sink.

In addition, as another example of the prior art as described above, there is, for example, such as the "heat radiating device of electronic products" described in Korea Patent Publication No. 10-1996-0028746 (published on July 22, 1996).

The above-mentioned "heat dissipation device of electronic products" of the Patent Publication No. 10-1996-0028746, the heat dissipation lid formed by cutting a portion of the upper panel corresponding to the vertical upper portion of the heat dissipation plate installed on the PCB inside the electronics, and the heat sink upper surface And a plurality of shape memory alloy springs installed between the predetermined position of the heat sink and the bottom surface of the corresponding heat dissipation lid, and extending when the temperature of the heat sink is above the predetermined temperature, and then contracting to automatically open and close the heat dissipation lid. Protruding toward the center from the side of the opening and closing hole on the upper panel formed in accordance with the shape is configured to include a support jaw to maintain the same horizontal plane as the upper panel during the closing operation of the heat dissipation lid.

Therefore, according to the configuration as described above, the "heat radiating device of the electronic product" of the above-mentioned Patent Publication No. 10-1996-0028746, a part of the upper panel automatically when the heat sink on the PCB is overheated with a long time use of the electronic products It is configured to be lifted so that heat can be efficiently released and automatically closed when the temperature drops.

However, the above-mentioned "heat dissipation device for electronic products" of the Patent Publication No. 10-1996-0028746 also describes a heat dissipation means as a kind of ventilation means, similar to the above-mentioned Patent No. 10-0220508, the size of the heat dissipation device itself The method of reducing or increasing the heat dissipation area is not described at all.

Therefore, as described above, in the configuration of the heat sink, it is essential to provide a heat sink having a large area in order to have a small volume before installation and to be easy to install, and to have sufficient thermal conductivity after installation. The structure and the formation method of the heat sink which satisfy all the requirements are not provided.

The present invention has been devised to solve the problems of the conventional heat sink as described above. Therefore, the object of the present invention is to occupy a small volume before installation and to facilitate the installation, and after installation, a myriad of fins are used to increase the temperature. In accordance with the expansion, it is to provide a high efficiency heat sink using a new shape memory alloy that can provide an efficient heat dissipation effect in a small volume by having sufficient thermal conductivity through a large area.

In order to achieve the above object, according to the present invention, in the high-efficiency heat sink using the shape memory alloy, formed of a material having a high thermal conductivity and the base forming the main body of the heat sink, the flexibility and good thermal conductivity It is formed in the form of an elongated band using an elastic body, and has a structure attached to the shape memory alloy that is deformed according to the temperature in the center portion, and comprises a plurality of heat radiation fins having a shape wound round from one end, When the temperature rises above the proper temperature, the shape memory alloy is deformed and deformed from the wound form to the unfolded form, so that the heat dissipation action is performed, thereby reducing the space required for the installation of the heat sink. At the same time, the heat dissipation area is increased to have an excellent heat dissipation effect. The high-efficiency heat sink using a shape memory alloy, characterized in that the generated is provided.

Here, the base is characterized in that it is made of a material such as copper, aluminum, or their alloys.

In addition, the heat radiation fin is characterized in that it is formed using a material such as a thin aluminum plate, carbon fiber.

In addition, the elastic body constituting the heat dissipation fin is characterized in that the plastic deformation does not easily occur and is a material having high thermal conductivity.

As described above, according to the present invention, in place of the conventional general heat sink using a fixture such as metal, by applying a shape memory alloy whose shape is deformed according to temperature to an elastic body having good thermal conductivity, efficient heat dissipation with a small volume It is possible to provide a high efficiency heat sink using a new shape memory alloy that can provide an effect.

Therefore, according to the present invention, it is easy to install by taking up a small volume before installation, and after installation, it expands as the temperature rises and has sufficient thermal conductivity through a large area, thereby providing efficient heat dissipation effect with a small volume. It is possible to provide a high efficiency heat sink using a new shape memory alloy.

1 is a view showing a heat sink installed in a computer as an example of a heat sink used in the related art.
2 is a conceptual view schematically showing the overall configuration of a high-efficiency heat sink using a shape memory alloy according to the present invention, a view showing a state in which the heat radiation fin is wound before heat is transferred to the heat sink.
3 is a conceptual view schematically showing the configuration of the heat radiation fins applied to the high efficiency heat sink using the shape memory alloy according to the present invention, the heat is transferred to the heat sink is a view showing a state where the heat radiation fins are unfolded.
4 is a conceptual diagram schematically showing a configuration of a heat radiation fin applied to a high efficiency heat sink using a shape memory alloy according to the present invention.

Hereinafter, with reference to the accompanying drawings, a specific embodiment of a high efficiency heat sink using a shape memory alloy according to the present invention will be described.

Here, it should be noted that the contents described below are only examples for carrying out the present invention, and the present invention is not limited to the contents of the embodiments described below.

That is, the present invention is to provide a heat sink having a wide heat dissipation area even in a narrow volume by configuring the shape of the heat sink to be deformed according to the temperature by using a shape alloy alloy reacting with temperature.

To this end, in accordance with the present invention, in place of the heat sink using a conventional fixed fixture, by combining a shape memory alloy that is deformed according to temperature to an elastic body having good thermal conductivity, while reducing the space required for installation, Through the deformation of the shape memory alloy, a high efficiency heat sink using a shape memory alloy having a larger heat dissipation area than the installation area is provided.

Here, before describing the details of the high efficiency heat sink using the shape memory alloy according to the present invention, the features of the shape memory alloy will be described.

Shape memory alloy generally refers to an alloy having a property of changing a crystal structure of a metal according to a change of temperature and having a characteristic of storing a certain shape. A general metal is deformed by external stress at a relatively low temperature. When it is received, it initially shows elastic behavior, and then plastic deformation occurs and permanent deformation occurs.

However, in some alloys, it has been found that even after plastic deformation occurs, when the material is heated above a certain temperature, the phenomenon of returning to the original shape before deformation is found, and this phenomenon is called a shape memory effect (SME). The alloy that exhibits this effect is called shape memory alloy (SMA).

More than 10 types of such shape memory alloys are known, but those currently used industrially due to their characteristics and manufacturing problems include Ni-Ti alloys and Cu-Zn-Al alloys.

In addition, due to these characteristics, shape memory alloys are now widely used in various fields ranging from various mechanical devices, electronic products, and garments.

Subsequently, with reference to FIG. 1, the schematic structure of the conventional heat sink currently widely used is demonstrated.

Referring to FIG. 1, FIG. 1 illustrates a heat sink 11 installed in a computer main body 10 as an example of a conventional heat sink.

That is, as shown in Figure 1, the existing heat sink 11 is determined in a square or circular shape, and thus occupies a relatively large volume in comparison with other components in the computer body 10, Due to inadequate utilization of space, the heat dissipation area in the complicated and narrow installation space is quite limited and the heat dissipation effect is limited.

In order to solve this disadvantage, the present invention, the heat sink using a shape memory alloy as follows.

Next, with reference to FIG. 2, the whole structure of the high efficiency heat sink using the shape memory alloy which concerns on this invention is demonstrated.

Referring to FIG. 2, FIG. 2 is a conceptual view and a partially enlarged view schematically showing the overall configuration of a high efficiency heat sink using a shape memory alloy according to the present invention.

That is, as shown in Figure 2, the high-efficiency heat sink 20 using the shape memory alloy according to the present invention is formed of a material having a high thermal conductivity such as copper or aluminum to form the base 21 of the body of the heat sink 20 And, it is composed of a myriad of heat radiation fins 22 are formed in a long elongated strip form of a material having a high flexibility to actually perform a heat radiation action.

Here, the base 21 is made of a material such as copper, aluminum, or an alloy thereof, and the heat dissipation fin 22 may be made of a material such as a thin aluminum plate or carbon fiber, for example.

More specifically, first, before heat is generated in the base 21, each of the heat dissipation fins 22 is formed in an initial state as shown in FIG. The heat sink can be easily installed even in a small area.

In addition, when heat is generated in the base 21 after installation and heat dissipation is required, the shape memory alloy attached to the heat dissipation fin 22 deforms due to heat, and deforms in an unfolded state as shown in FIG. ) Before heat is generated, it has very high heat dissipation efficiency compared to the initial wound state.

Here, the deformation of the heat dissipation fins 22 is a structure in which the shape memory alloy 41 is attached to the heat dissipation fins 22, as shown in FIG. 4, due to the formation of the heat dissipation fins 22 in the form of an elongated strip. will be.

That is, referring to FIG. 4, FIG. 4 is a conceptual view illustrating the configuration of the heat dissipation fin 22 having a band shape as described above.

As shown in Fig. 4, the heat dissipation fin 22 is a fine fin having a shape such as an elongated band. As described above, for example, a thin aluminum plate, carbon fiber, or the like, has a high flexibility and good thermal conductivity. The shape memory alloy 41, which is formed of a material and deforms with temperature, is attached to the center portion thereof.

Therefore, by forming the heat dissipation fins 22 in a structure in which the shape memory alloy 41 is attached as described above, deformation occurs in the shape memory alloy 41 when the temperature of the heat sink 20 rises above an appropriate temperature. Due to the difference in length, the heat dissipation fin 22 is deformed into the unfolded state as shown in FIG. 3 in the wound state as shown in FIG. 2.

As described above, according to the present invention, by joining the shape memory alloy that the shape is deformed according to the temperature to the elastic body having good thermal conductivity, so that the shape of the myriad heat sink is deformed according to the temperature, using a conventional general fixture It is possible to provide a high efficiency heat sink using a shape memory alloy having a good heat dissipation effect even in a small area through the deformation of the shape memory alloy while reducing the space required for installation in place of the heat sink.

As described above, the details of the high-efficiency heat sink using the shape memory alloy according to the present invention have been described through the embodiments of the present invention as described above, but the present invention is not limited only to the contents described in the above embodiments. It is a matter of course that the present invention can be modified, changed, combined and replaced by a person skilled in the art according to the design needs and various other factors.

10. Computer Base 11. Heat Sink
20. Heat sink 21. Base
22. Heat radiation fins 41. Shape memory alloy

Claims (4)

In the high efficiency heat sink using the shape memory alloy,
A base formed of a material having high thermal conductivity and forming a main body of the heat sink;
It is formed in the form of a long band using an elastic body having high flexibility and good thermal conductivity, and has a structure in which a shape memory alloy is attached to a central portion thereof, which is deformed according to temperature, and includes a plurality of heat dissipation fins having a shape wound round from one end thereof. Configured by
When the temperature of the heat sink rises above the proper temperature, the deformation occurs in the shape memory alloy, and the heat sink is deformed into a unfolded form in a wound form, whereby a heat dissipation action is performed, whereby it is required to install the heat sink. A high efficiency heat sink using a shape memory alloy, which is configured to reduce space and increase heat dissipation area to have an excellent heat dissipation effect. The method of claim 1,
The base is a high-efficiency heat sink using a shape memory alloy, characterized in that made of a material such as copper, aluminum, or their alloys. The method of claim 1,
The heat radiation fin is a high efficiency heat sink using a shape memory alloy, characterized in that formed using a thin aluminum plate, or a material such as carbon fiber. The method of claim 1,
The elastic body constituting the heat dissipation fin is a high-efficiency heat sink using a shape memory alloy, characterized in that the plastic deformation does not occur easily and the material has high thermal conductivity.

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