KR101495990B1 - Diaphragm assembly and speaker device having same - Google Patents

Abstract

The present invention relates to a diaphragm assembly and a speaker device, and a speaker device according to the present invention includes a diaphragm including a top surface and a bottom surface facing the top surface, the diaphragm generating sound pressure by vibration; A bobbin extending from the bottom surface of the diaphragm; A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin; A magnetic field circuit for supplying a magnetic field to the voice coil; And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit, wherein the bobbin includes: a first heat dissipation pattern for emitting heat generated from the voice coil to at least a part of a surface of the bobbin; .

Description

TECHNICAL FIELD [0001] The present invention relates to a diaphragm assembly and a speaker device including the diaphragm assembly.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diaphragm assembly and a speaker device including the diaphragm assembly, and more particularly, to a speaker device improved in heat dissipation performance.

 A dynamic speaker apparatus applies a current varying according to an audio signal to a voice coil, and the voice coil receives an electromagnetic force by a magnetic field of the magnetic field circuit to generate a sound pressure by vibrating the diaphragm.

During operation of the speaker device, the voice coil is continuously supplied with current, and heat is generated by the resistance component of the voice coil. In operation, the voice coil is heated to 100 ° C or more, and the heat of the voice coil not only lowers the speaker efficiency but also causes the speaker device to malfunction.

The heat generation of the voice coil causes the magnet of the speaker device to heat up, and the magnet generally has a low magnetic field intensity in a high temperature environment. The decrease in the strength of the magnetic field due to the heating is more serious in the neodymium magnet than in the ferrite magnet.

On the other hand, a slim TV component speaker device designed to have a low height may consist of two or more magnetic circuit and two or more voice coils. In this case, since the input current is divided into a plurality of voice coils, heat is dissipated and heat dissipation does not occur seriously. However, when a slim TV component speaker device is constituted by a single magnetic field circuit and a single voice coil, the input current is concentrated in a single voice coil, so that there is a problem that performance deterioration due to heat generation occurs seriously.

Next, the voice coil is composed of a copper wire or a copper clad aluminum wire (CCAW) conductor and an insulating layer surrounding it. When the voice coil is heated, an insulating layer is burnt and a short between the voice coil is generated. The resistance is changed to reduce the speaker efficiency, and in the worst case, the speaker device is not operated.

Various methods for improving the heat radiation efficiency of the speaker device have been proposed.

United States Patent No. 6,815,063 entitled " MAGNETIC FLUID "discloses a speaker device using a magnetic fluid (ferrofluid) to improve the heat radiation efficiency. The magnetic fluid (ferrofluid) arranged to contact the voice coil can save the heat generated from the voice coil and conduct the stored heat to the outside to improve the heat radiation efficiency of the speaker device.

However, since the magnetic fluid has its own high viscosity, the magnetic fluid acts as a vibration resistance of the vibration system when it contacts the voice coil, thereby reducing the displacement of the vibration film. Since the high output speaker device having a high input power of several hundreds w has a high driving force, the effect of reducing the displacement of the diaphragm due to the viscosity of the magnetic fluid is insignificant. However, since a speaker device for a TV component or a speaker device for a TV component having a low input power of about 10 W has a relatively low driving force, the vibration film displacement due to the viscosity of the magnetic fluid is effectively reduced, there is a problem. Therefore, improvement of heat dissipation using a magnetic fluid has a problem that it can not be used in a speaker device for parts having a low input power.

Korean Patent Laid-Open Publication No. 2004-0050960 discloses a speaker device which is attached to a yoke and has improved heat radiation efficiency through a heat sink having a plurality of radiating fins. The heat sink attached to the yoke can improve the heat radiation efficiency of the speaker device by radiating the heat inside the speaker device to the outside. However, since the yoke does not come into direct contact with the voice coil as the heat source, only a part of heat due to radiation or convection There is a problem in that the increase in heat radiation efficiency is insignificant because heat can not be emitted due to discharge and conduction.

Korean Utility Model Registration No. 0218617 "Speaker with heat dissipating means" discloses a speaker device in which a radiating hole is formed in a yoke to improve radiating efficiency. The heat dissipation hole formed in the yoke can improve the heat radiation efficiency of the speaker device by discharging the heat inside the speaker device to the outside. However, since the yoke can not directly contact the voice coil, which is a heat source, There is a problem in that the coil only emits heat due to radiation or convection and does not emit heat due to conduction and does not include a forced convection structure to increase the heat radiation efficiency.

Korean Utility Model Registration Utility No. 0107822 "Voice coil heat radiating structure of coaxial speaker" discloses a speaker device in which the bobbin is extended to the upper surface of the diaphragm and the heat radiating member is formed in the extended portion to improve the heat radiation efficiency. Since the heat dissipating member of the bobbin extended portion discharges heat through the bobbin in direct contact with the voice coil, it is possible to radiate heat by conduction having the highest heat transfer efficiency, which is advantageous in that the heat radiation efficiency is high. However, since such a structure must include an extension extending to the upper surface of the diaphragm, a speaker device using a dome-shaped or planar diaphragm instead of a speaker device using the cone-shaped diaphragm has a problem that its height is increased by the extension. Particularly, in the case of speaker devices for parts used in TVs, smart phones, tablet PCs, notebook computers, etc., since the slimness and compactness of recent products have to be mounted in a very limited space, A planar diaphragm or a dome-shaped diaphragm is often employed. Therefore, the heat dissipation structure through the bobbin extension part has a problem that it is difficult to adopt it in the recent speaker devices for parts.

U.S. Patent No. 6,815,063 Korean Patent Publication No. 2004-0050960 Korean Utility Model Registration No. 0218617 Korea Registered Utility Model No. 0107822

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a diaphragm assembly and a speaker device including the same, wherein a bobbin to which a voice coil is coupled includes a first heat dissipation pattern, So that the heat radiation performance of the speaker device can be improved.

The diaphragm assembly and the speaker device including the diaphragm assembly according to the embodiment of the present invention may further include a first heat dissipation protrusion part having a first heat dissipation pattern extending outside the bobbin and acting as a heat dissipation fin, Another object is to improve the heat dissipation performance.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the diaphragm assembly further include a second heat dissipation pattern in which the diaphragm contacts the first heat dissipation pattern on the bottom surface, And it is another object to improve the heat radiation performance of the speaker device by enlarging the surface area of heat radiation.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the second diaphragm assembly may further include a second heat dissipation protrusion extending from the second heat dissipation pattern to the outside of the diaphragm, So as to improve the heat radiation performance of the heat sink.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the same further include a fourth heat radiation pattern in which the rod contacts the second heat radiation pattern to rapidly dissipate the heat of the voice coil through heat conduction Another object of the present invention is to improve the heat dissipation performance of the speaker device by enlarging the heat dissipation surface area.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the same further include a fifth heat radiation pattern in which the damper is in contact with the fourth heat radiation pattern so that the heat of the voice coil is quickly discharged Another object of the present invention is to improve the heat dissipation performance of the speaker device by enlarging the heat dissipation surface area.

According to an aspect of the present invention, there is provided a speaker apparatus comprising: a diaphragm including an upper surface and a lower surface facing the upper surface, the diaphragm generating sound pressure by vibration; A bobbin extending from the bottom surface of the diaphragm; A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin; A magnetic field circuit for supplying a magnetic field to the voice coil; And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit, wherein the bobbin includes: a first heat dissipation pattern for emitting heat generated from the voice coil to at least a part of a surface of the bobbin; .

In the speaker device according to the embodiment of the present invention, the diaphragm further includes a second heat radiation pattern on at least a part of the bottom surface, and the second heat radiation pattern is in contact with the first heat radiation pattern, And emits heat conducted from the first heat emission pattern.

In the speaker device according to an embodiment of the present invention, the diaphragm further includes a third heat radiation pattern at least a part of the upper surface, and the third heat radiation pattern is in contact with the second heat radiation pattern And emits heat conducted through the second heat emission pattern.

The speaker device according to the embodiment of the present invention may further include a rod extending from the bottom surface of the diaphragm, and the rod further includes a fourth heat emission pattern on at least a part of the surface And the fourth heat emission pattern contacts the second heat emission pattern and emits heat conducted through the second heat emission pattern.

The speaker device according to the embodiment of the present invention may further include a damper for elastically supporting the rod in combination with the frame or the magnetic circuit, And the fifth heat radiation pattern is in contact with the fourth heat radiation pattern and emits heat conducted through the fourth heat radiation pattern.

 In the speaker device according to an embodiment of the present invention, the first heat dissipation pattern is formed of at least one of a metal layer, a thermally conductive resin layer, a graphene layer, and a thermally conductive ceramic layer.

In the speaker device according to the embodiment of the present invention, the bobbin is formed of a first metal sheet having a columnar shape with open top and bottom, and forms an integral part of the first heat emission pattern.

In the speaker device according to the embodiment of the present invention, the first metal sheet may be formed of any one of Ag, Au, Cu, and Al, or an alloy including at least one of Ag, Au, Cu, .

In the speaker device according to the embodiment of the present invention, the bobbin further includes a first film layer made of a paper material or a resin material on the first metal sheet.

In the speaker device according to the embodiment of the present invention, the voice coil is wound on the lower portion of the bobbin, and the first heat radiation pattern is formed on the surface of the bobbin, And a first heat dissipating protrusion part.

In the speaker device according to an embodiment of the present invention, the second heat radiation pattern is formed of at least one of a metal layer, a thermally conductive resin layer, a graphene layer, and a thermally conductive ceramic layer.

In the speaker device according to the embodiment of the present invention, the diaphragm includes a second metal sheet, and the second heat radiation pattern is the second metal sheet.

In the speaker device according to the embodiment of the present invention, the diaphragm includes a surround formed at an edge of the diaphragm, coupled with the frame, having a concave or convex shape formed inside and a void formed at the center And the second metal sheet is bonded to the void of the surround.

In the speaker device according to an embodiment of the present invention, the second metal sheet may be formed of any one of Ag, Au, Cu, and Al, or an alloy including at least any one of Ag, Au, Cu, .

In the speaker device according to the embodiment of the present invention, the second heat radiation pattern may further include at least one second heat radiation protrusion extending outwardly from the bottom surface of the diaphragm.

In the speaker device according to an embodiment of the present invention, the fourth heat radiation pattern is formed of at least one of a metal layer, a thermally conductive resin layer, a graphene layer, and a thermally conductive ceramic layer.

In the speaker device according to the embodiment of the present invention, the rod is formed of a columnar third metal sheet having open top and bottom surfaces, and integrally formed with the fourth heat releasing pattern.

In the speaker device according to an embodiment of the present invention, the third metal sheet may be formed of any one of Ag, Au, Cu, and Al, or an alloy including at least one of Ag, Au, Cu, .

In the speaker device according to the embodiment of the present invention, the rod may further include a second film layer made of a paper material or a resin material on the third metal sheet.

In the speaker device according to the embodiment of the present invention, the fourth heat radiation pattern may further include at least one third heat radiation protrusion formed on a surface of the rod and extending in an outer direction of the rod do.

In the speaker device according to the embodiment of the present invention, the fourth heat emission pattern may further include at least one fourth heat emission protrusion formed on a surface of the rod and extending in an inner direction of the rod do.

In the speaker device according to an embodiment of the present invention, the fifth heat dissipation pattern is formed of at least one of a metal layer, a thermally conductive resin layer, a graphene layer, and a thermally conductive ceramic layer.

In the speaker device according to the embodiment of the present invention, the damper has a top surface coupled to a bottom surface of the rod, and at least one end of which is coupled to the frame or the magnetic circuit, Is formed.

In the speaker device according to an embodiment of the present invention, the leaf spring is formed of any one of Ag, Au, Cu, and Al, or an alloy including at least any one of Ag, Au, Cu, .

In the speaker device according to an embodiment of the present invention, the fifth heat radiation pattern may be formed on the surface of the damper and may include at least one fifth heat radiation protrusion extending outwardly of the damper .

The speaker device according to the embodiment of the present invention may further include a damper for elastically supporting the bobbin in combination with the frame or the magnetic circuit, And the fifth heat radiation pattern is in contact with the first heat radiation pattern and emits heat conducted through the first heat radiation pattern.

The speaker device according to the embodiment of the present invention may further include a damper for elastically supporting the vibration plate in combination with the frame or the magnetic field circuit, And the fifth heat radiation pattern is in contact with the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.

A diaphragm assembly according to the present invention includes: a diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating a negative pressure by vibration; A bobbin extending from the bottom surface of the diaphragm; And a voice coil to which an audio signal is applied and which includes an insulating layer surrounding the conductive layer and the conductive layer, the voice coil being wound on the bobbin, And a first heat dissipation pattern for dissipating heat generated in the voice coil.

In the diaphragm assembly according to an embodiment of the present invention, the diaphragm further includes a second heat radiation pattern on at least a part of the bottom surface, and the second heat radiation pattern is in contact with the first heat radiation pattern And emits heat conducted through the first heat emission pattern.

In the diaphragm assembly according to an embodiment of the present invention, the diaphragm further includes a third heat radiation pattern on at least a part of the upper surface, and the third heat radiation pattern is in contact with the second heat radiation pattern And emits heat conducted through the second heat emission pattern.

In a diaphragm assembly according to an embodiment of the present invention, the diaphragm plate assembly further includes a rod extending from the bottom surface of the diaphragm, and the rod further includes a fourth heat emission pattern on at least a part of the surface And the fourth heat emission pattern contacts the second heat emission pattern and emits heat conducted through the second heat emission pattern.

The diaphragm assembly according to an embodiment of the present invention may further include a damper for elastically supporting the rod in combination with a frame or a magnetic field circuit of the speaker device, 5th heat release pattern, and the fifth heat emission pattern contacts the fourth heat emission pattern and emits heat conducted through the fourth heat emission pattern.

According to the above-described structure, the diaphragm assembly and the speaker device including the same according to the present invention are characterized in that the bobbin to which the voice coil is coupled includes the first heat dissipation pattern to rapidly radiate the heat of the voice coil through the heat conduction, Thereby improving the heat dissipation performance of the semiconductor device.

The diaphragm assembly and the speaker device including the diaphragm assembly according to the embodiment of the present invention may further include a first heat dissipation protrusion part having a first heat dissipation pattern extending outside the bobbin and acting as a heat dissipation fin, Thereby providing an effect of improving the heat radiation performance.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the diaphragm assembly further include a second heat dissipation pattern in which the diaphragm contacts the first heat dissipation pattern on the bottom surface, But also the heat dissipation performance of the speaker device is improved by enlarging the surface area of heat dissipation.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the second diaphragm assembly may further include a second heat dissipation protrusion extending from the second heat dissipation pattern to the outside of the diaphragm, Thereby improving the heat dissipation performance of the semiconductor device.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the same further include a fourth heat radiation pattern in which the rod contacts the second heat radiation pattern to rapidly dissipate the heat of the voice coil through heat conduction And the heat dissipation performance of the speaker device is improved by enlarging the heat dissipation surface area.

The diaphragm assembly according to another embodiment of the present invention and the speaker device including the same further include a fifth heat radiation pattern in which the damper is in contact with the fourth heat radiation pattern so that the heat of the voice coil is quickly discharged And the heat dissipation performance of the speaker device is improved by enlarging the heat dissipation surface area.

1 is an exploded perspective view of a speaker device according to an embodiment of the present invention;
2 is a longitudinal sectional view of a speaker device according to an embodiment of the present invention.
3 is a perspective view of a bobbin according to an embodiment of the present invention;
4 is a perspective view of a bobbin according to another embodiment of the present invention;
5 is a perspective view of a diaphragm assembly according to an embodiment of the present invention.
6 is an exploded perspective view of a diaphragm according to an embodiment of the present invention;
7 is a perspective view of a diaphragm assembly according to another embodiment of the present invention.
8 is a perspective view of a diaphragm according to an embodiment of the present invention;
9 is a perspective view of a diaphragm assembly according to another embodiment of the present invention;
10 is a perspective view of a rod according to an embodiment of the present invention;
11 is a combined view of a rod and a suspension according to an embodiment of the present invention.
12 is a combined view of a rod and a suspension according to another embodiment of the present invention.
13 is a cross-sectional view of a speaker device according to an embodiment of the present invention.

2 is a cross-sectional view of a speaker device 100 according to an embodiment of the present invention, and arrows in FIG. 2 are sectional views of a speaker device 100 according to an embodiment of the present invention. 1 shows a heat transfer path of a speaker device 100 according to an embodiment of the present invention. A speaker device 100 according to the present invention includes a diaphragm 110, a bobbin 120, a voice coil 130, a magnetic circuit 140, and a frame 150.

The diaphragm 110 includes an upper surface and a lower surface facing the upper surface, and performs a function of generating a negative pressure by vibration. The material of the diaphragm 110 is not particularly limited and may be a paper material, a polymer material, a metal material, or the like known as the material of the diaphragm 110. The shape of the diaphragm 110 is not particularly limited and may be a circle, an ellipse, a track, a polygon including a rectangle, or an irregular shape. In the case of the speaker device 100 for a TV part, as shown in FIG. 1, it may be a rectangular shape having a major axis and a minor axis.

The bobbin 120 is formed to extend from the bottom surface of the diaphragm 110. The bobbin 120 has a function of winding a voice coil 130 to be described later and a function of vibrating the diaphragm 110 by transmitting the electromagnetic force induced in the voice coil 130 to the diaphragm 110 by the magnetic field circuit 140 . The material of the bobbin 120 is not particularly limited, but it is common to use a light paper material or a polymer material so as not to increase the weight of the vibration system. The shape of the bobbin 120 is not particularly limited, and it is general that the bobbin 120 is formed by rolling the film in a cylindrical or polygonal column shape.

The voice coil 130 includes a conductive layer to which an audio signal input from an external circuit or the like is applied and an insulating layer surrounding the conductive layer to prevent a short circuit between the voice coil 130, Respectively. The voice coil 130 typically winds a copper wire or a CCAW wire.

The magnetic field circuit 140 is connected to the voice coil 130 which is constituted by a top plate 141, a magnet 142 and a yoke 143 and is inserted into a space between the top plate 141 and the yoke 143 142) for supplying a magnetic field. The structure of the magnetic field circuit 140 is divided into an inner shape, an outer shape, and a mixed shape according to the positional relationship between the voice coil 130 and the magnet 142. The structure of the magnetic circuit 140 of the present invention is not particularly limited, , An outer shape, or a mixed shape, and the structure of another known magnetic circuit 140 is also applicable.

The frame 150 has a function of supporting the magnetic circuit 140 by coupling the rim of the diaphragm 110 and supporting the magnetic circuit 140 in the case where the parts are stored inside according to the shape of the speaker device 100, Or may be in the form of a frame 150 in which some parts such as the diaphragm 110 are exposed to the outside and only the magnetic circuit 140 is supported.

≪ Embodiment 1: Speaker device using a bobbin as a heat dissipating structure >

The first embodiment of the present invention is a speaker device 100 using a bobbin 120 as a heat dissipation structure.

The bobbin 120 according to the first embodiment of the present invention is configured to include a first heat dissipation pattern 121 that emits heat generated in the voice coil 130 on at least a part of its surface. The first heat releasing pattern 121 may be formed of at least one of a metal layer having a high thermal conductivity, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.

The first heat radiation pattern 121 may have a predetermined shape along the surface of the bobbin 120 and may be formed in a plurality of patterns as shown in FIG. Or may be formed on the inner surface of the bobbin 120 or on both the outer surface and the inner surface of the bobbin 120 as shown in Fig. The larger the area of the first heat radiation pattern 121 is, the wider the heat radiation surface, and the heat radiation performance of the speaker device 100 can be improved.

The bobbin 120 itself may be formed of a metal sheet such as an aluminum sheet. In this case, the bobbin 120 is formed of a columnar first metal sheet having open top and bottom surfaces, and the first heat radiation pattern 121 forms an integral part of the bobbin 120. The first metal sheet may be formed of any one of Ag, Au, Cu, or Al, which is a metal having a high thermal conductivity, or may be formed of an alloy containing at least one of Ag, Au, Cu, and Al.

The bobbin 120 may be configured to further include a first film layer made of a paper material or a resin material on the first metal sheet in order to stably maintain the cross-sectional shape of the bobbin 120. [

On the other hand, it is helpful to improve the heat dissipation performance by forming the first heat radiation pattern 121 in a three-dimensional form and enlarging the area of the heat radiation surface. In this case, the first heat radiation pattern 121 is formed on the surface of the bobbin 120 as shown in Fig. 4, and the voice coil 130 is wound on the bobbin 120 at least one And the first heat dissipation protrusion 122 of the first heat dissipation protrusion 122 is formed.

A plurality of first heat dissipating protrusions 122 may be formed on the inner surface of the bobbin 120, a plurality of the first heat dissipating protrusions 122 may be formed on the inner surface of the bobbin 120, The shape of the first heat dissipating protrusion 122 is not particularly limited and is formed into a three-dimensional shape that can enlarge the heat dissipation surface area.

≪ Second Embodiment: Speaker device using bobbin and diaphragm as a heat dissipating structure &

A second embodiment of the present invention is a speaker device 100 using a bobbin 120 and a diaphragm 110 as a heat dissipating structure.

According to the second embodiment of the present invention, the diaphragm 110 further includes a second heat radiation pattern 111 on at least a part of the bottom surface, and the second heat radiation pattern 111 includes a first heat radiation pattern 121, And discharges the conducted heat in the heat exchanger.

The material of the second heat emission pattern 111 may be a metal layer, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer having a high thermal conductivity. In this case, the diaphragm 110 may be formed of a paper, a polymer film, or the like, which is a material of a general diaphragm 110 and has low thermal conductivity, and may be formed so that a second heat radiation pattern 111 having high thermal conductivity is attached to the bottom surface.

In order to maximize the heat dissipation surface area of the bottom surface of the diaphragm 110, the diaphragm 110 itself may be formed of a second metal sheet 114 such as an aluminum sheet or a second metal sheet may be attached to the bottom surface of the diaphragm 110, It is more preferable to use the whole as a heat dissipation structure.

According to this embodiment, the second metal sheet 114 is formed of any one of Ag, Au, Cu, or Al having high thermal conductivity, or made of an alloy containing at least any one of Ag, Au, Cu, . The diaphragm 110 may include a second metal sheet 114 and the second heat release pattern 111 may be formed integrally with the diaphragm 110 as a second metal sheet 114.

6, the diaphragm 110 is formed at the edge of the frame 150 of the speaker device 100 so as to engage with the frame 150, and has a concave or convex shape formed inside and a void is formed at the center And the second metal sheet 114 may be configured to couple to the voids of the surround 113. [ Since the surround 113 generally uses a soft rubber material to provide a damping force to the diaphragm, the surround 113 has a different material from the vibration surface of the diaphragm 114.

Referring to FIG. 7, when the second heat releasing pattern 111 is formed in a three-dimensional shape, the heat releasing surface area can be further enlarged. According to this embodiment, the second heat dissipation pattern 111 further includes at least one second heat dissipation protrusion 112 extending outward from the bottom surface of the diaphragm 110. In this case, the second heat radiating protrusions 112 serve as radiating fins, so that the heat radiating performance of the speaker device 100 can be further improved.

8, it is preferable that not only the bottom surface of the diaphragm 110 facing the inside of the speaker but also the top surface of the diaphragm 110 facing the outside of the speaker is used as a heat dissipating structure. When the diaphragm 110 is formed of the second metal sheet 114 as described above, the upper surface of the diaphragm 110 also functions as a heat dissipation structure.

In the embodiment where the diaphragm 110 is formed of a polymer film having a low thermal conductivity and the second heat radiation pattern 111 having a high thermal conductivity is formed on a part of the bottom surface of the diaphragm 110, A method of forming a via contact hole and filling a via contact hole with a material having a high thermal conductivity or forming a material having a high thermal conductivity along a part of the edge of the diaphragm 110, Can be formed.

In this case, the diaphragm 110 further includes a third heat dissipation pattern 115 on at least a part of the upper surface, and the third heat dissipation pattern 115 includes a second heat dissipation pattern 111, for example, via a via contact hole or an edge, . According to this structure, the heat generated in the voice coil 130 is conducted through the first heat radiation pattern 121 of the bobbin 120 and the second heat radiation pattern 111 on the bottom of the vibration plate 110, And is discharged to the outside of the speaker device 100 through the antenna 115 to further improve the heat radiation performance of the speaker device 100.

According to the second embodiment of the present invention described above, not only the bobbin 120 directly contacting the voice coil 130 as a heat source but also the diaphragm 110 can be utilized as a heat dissipating structure. Particularly, the surface area of the diaphragm 110 is wider than the surface area of the bobbin 120 so that the surface area of heat dissipation is enlarged and the area of the heat dissipating surface is extended to the area spaced apart from the voice coil 130, Lt; / RTI >

≪ Third Embodiment: Speaker device using bobbin, diaphragm, and rod as heat dissipating structure &

A third embodiment of the present invention is a speaker apparatus 100 using a bobbin 120, a diaphragm 110, and a rod 160 as a heat dissipating structure. The rod 160 extends from the lower surface of the diaphragm 110 and can be used as a heat dissipating structure similar to the bobbin 120. When the damper 170 is coupled with a damper 170 described below, To transmit the damping force.

Fig. 9 shows a third embodiment of the present invention. The speaker device 100 according to the third embodiment of the present invention further includes a rod 160 extending from the bottom of the diaphragm 110 and the rod 160 further includes a fourth heat radiation pattern 161 . The fourth heat emission pattern 161 is configured to contact the second heat emission pattern 111 formed on the bottom surface of the diaphragm 110. According to this structure, the heat generated in the voice coil 130 is conducted through the first heat radiation pattern 121 of the bobbin 120 and the second heat radiation pattern 111 on the bottom surface of the vibration plate 110, So that the heat radiation performance of the speaker device 100 is further improved.

The fourth heat emission pattern 161 may be formed of at least one of a metal layer having a high thermal conductivity, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.

The rod 160 may be formed in a columnar shape with open top and bottom similar to the shape of, for example, the bobbin 120, and the rod 160 may be formed as a third And the fourth heat radiation pattern 161 and the third metal sheet may be integrally formed with the metal sheet. The cross-sectional shape of the rod 160 may be a curved shape such as a circle, an ellipse, a track shape, or a polygonal shape or an irregular shape including a rectangle.

The third metal sheet may be formed of any one of Ag, Au, Cu, and Al having high thermal conductivity, or may be formed of an alloy containing at least one of Ag, Au, Cu, and Al.

On the other hand, in order to stably maintain the shape of the rod 160 in the embodiment in which the rod 160 is formed of the third metal sheet, the rod 160 is formed of a paper material or a second film It is preferable to further include a layer.

Meanwhile, the fourth heat emission pattern 161 may be formed integrally with the rod 160, or otherwise formed in a predetermined pattern shape along the surface of the rod 160. These patterns may be formed in a plurality of patterns and may be formed on the inner or outer surface of the rod 160 and may be formed on the inner and outer surfaces of the rod 160.

10, the heat dissipation performance of the speaker device 100 can be further improved by forming the fourth heat release pattern 161 in a three-dimensional shape. According to this embodiment, the fourth heat dissipation pattern is further configured to include at least one third heat dissipating protrusion 162 formed on the surface of the rod 160 and extending outward or inward of the rod 160 .

In the case of the third embodiment of the present invention, the diaphragm assembly includes a diaphragm 110, a bobbin (not shown) 120 and the rod 160 to provide an effect of improving the heat radiation performance of the speaker device 100 by expanding the area where the heat releasing surface can be formed.

≪ Fourth Embodiment: Speaker device using bobbin, diaphragm, rod and damper as heat dissipating structure &

A fourth embodiment of the present invention is a speaker apparatus 100 using a bobbin 120, a vibration plate 110, a rod 160 and a damper 170 as a heat dissipating structure. The damper 170 is a component that engages with the diaphragm assembly and provides a damping force to the diaphragm 110 together with the surround 113 of the diaphragm 110. [ The speaker device 100 according to the fourth embodiment of the present invention uses the damper 170 as a heat dissipating structure so that the heat generated in the voice coil 130 is transmitted through the bobbin 120, the diaphragm 110, And is conducted to the damper 170 and discharged through the damper 170 to improve the heat radiation performance.

Hereinafter, a fourth embodiment of the present invention will be described with reference to Figs. 11 and 12. Fig. The speaker device 100 according to the fourth embodiment further includes a damper 170 that elastically supports the rod 160 in combination with the frame 150 or the magnetic field circuit 140. The damper 170 is connected to the frame 150 or the magnetic field circuit 140 which is a structure in which one side does not vibrate in spite of the vibration of the diaphragm 110 and the other side vibrates according to the vibration of the diaphragm 110. [ (110), the bobbin (120), or the rod (160). The damper 170 may be formed of a fabric material having a self-elasticity and corrugated as shown in FIG. 11, or a metal material serving as a leaf spring as shown in FIG.

The damper 170 is further configured to include a fifth heat dissipation pattern 171 that dissipates heat generated in the voice coil 130. When the damper 170 is coupled to the bobbin 120, 171 are in contact with the first heat radiation pattern 121 formed on the bobbin 120 or when the damper 170 is bonded to the bottom surface of the vibration plate 110, It is configured to contact the fourth heat radiation pattern 161 formed on the rod 160 when the heat radiation pattern 111 contacts the damper 170 or when the damper 170 is coupled to the rod 160. [

The fifth heat dissipation pattern 171 may be formed of at least one of a metal layer having a high thermal conductivity, a thermally conductive resin layer, a graphene layer, and a thermally conductive ceramic layer. When the damper 170 is formed of a low thermal conductivity material, A fifth heat radiation pattern 171 such as a metal pattern having a high thermal conductivity may be patterned on a part of the surface of the damper 170 as shown in FIG. 12, when the damper 170 itself is formed of a metal having a high thermal conductivity, the fifth heat dissipation pattern 171 is formed integrally with the damper 170. As shown in FIG. For example, when the upper surface of the damper 170 engages with the bottom surface of the rod 160 and at least one end thereof is a leaf spring that engages with the frame 150 or the magnetic circuit 140, the fifth heat radiation pattern 171 is formed separately And is formed integrally with the damper 170 without being deformed.

When the damper 170 is formed of a leaf spring, the leaf spring is formed of any one of Ag, Au, Cu, or Al, which is a metal having high thermal conductivity, or an alloy containing at least one of Ag, Au, Cu, .

Referring to FIG. 13, the fifth heat emission pattern 171 may be formed in three dimensions to enlarge the heat emission surface area. In this case, the fifth heat dissipation pattern 171 is formed on the surface of the damper 170 and further includes at least one fifth heat dissipation protrusion 172 extending outwardly of the damper 170. In this case, the fifth heat radiating protrusion 172 functions as a radiating fin, thereby providing an effect of improving the heat radiation performance of the speaker device 100.

In the case of the conventional speaker device 100, the damper 170 is formed of a paper material having a corrugation and can not be used as a heat radiating structure. In the case of the conventional speaker device 100 in which the damper 170 is formed by the metal leaf spring, the damper 170 is coupled to the diaphragm 110 and the bobbin 120 made of paper or polymer having low thermal conductivity, The heat generated in the coil 130 is not discharged to the outside. According to the fourth embodiment of the present invention, the damper 170 functions as a heat radiating structure for forming a heat transfer path with the voice coil 130, thereby improving the heat radiation performance of the speaker device 100.

Hereinafter, a diaphragm assembly constituting a vibration system of the speaker device 100 will be described. The diaphragm assembly basically includes a diaphragm 110, a bobbin 120 and a voice coil 130 as a set of parts of the speaker device 100 and may include a rod 160 or a damper 170 according to an embodiment have. Since the structure and function of the diaphragm assembly are the same as those of the speaker device described above, repeated description is omitted.

First, in the case of using the bobbin 120 of the diaphragm assembly as a heat dissipation structure, the diaphragm assembly includes the diaphragm 110, the bobbin 120, and the voice coil 130, And a first heat radiation pattern 121 for radiating heat generated in the voice coil 130.

The lower surface of the diaphragm 110 is in contact with the first heat radiation pattern 121 of the bobbin 120 and the first heat radiation pattern 121 of the bobbin 120 is in contact with the lower surface of the bobbin 120, And a second heat dissipation pattern (111) for dissipating heat conducted through the heat dissipation pattern (121).

The upper surface of the diaphragm 110 may be a second heat dissipation pattern on the bottom surface of the diaphragm 110 in the case of using the bobbin 120 of the diaphragm assembly, the bottom surface of the diaphragm 110, And a third heat dissipation pattern 115 that contacts the first heat dissipation pattern 111 and emits heat conducted through the second heat dissipation pattern 111.

Next, in the embodiment where the bobbin 120 of the diaphragm assembly, the bottom surface of the diaphragm 110, and the rod 160 are used as a heat dissipation structure, the rod 160 is connected to the second heat dissipation 111 of the bottom surface of the diaphragm 110, And a fourth heat emission pattern (161) that contacts the pattern and emits heat conducted through the second heat emission pattern (111).

Lastly, in the embodiment where the bobbin 120 of the diaphragm assembly, the bottom surface of the diaphragm 110, and the damper 170 are utilized as a heat dissipation structure, the damper 170 is disposed on the fourth heat dissipation pattern 161 of the rod 160, And a fifth heat dissipation pattern 171 for dissipating heat generated in the voice coil 130 in contact with the second heat dissipation pattern 171.

100: speaker device 110: diaphragm
111: second heat emission pattern 120: bobbin
121: first heat emission pattern 130: voice coil
140: magnetic field circuit 150: frame
160: load 161: fourth heat radiation pattern
170: damper 171: fifth heat radiation pattern

Claims (32)

A diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating sound pressure by vibration;
A bobbin extending from the bottom surface of the diaphragm;
A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin;
A magnetic field circuit for supplying a magnetic field to the voice coil; And
And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit,
Wherein the bobbin includes a first heat radiation pattern for emitting heat generated in the voice coil to at least a part of a surface thereof,
Wherein a second heat radiation pattern is formed on a bottom surface of the diaphragm or a third heat radiation pattern is formed on an upper surface of the diaphragm.
The method according to claim 1,
Wherein the second heat radiation pattern contacts the first heat radiation pattern and emits heat conducted from the first heat radiation pattern.
3. The method of claim 2,
Wherein the third heat radiation pattern contacts the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.
3. The method of claim 2,
The speaker device further comprising a rod extending from the bottom surface of the diaphragm,
Wherein the rod further comprises a fourth heat emission pattern on at least a portion of the surface,
Wherein the fourth heat radiation pattern contacts the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.
5. The method of claim 4,
The speaker device further includes a damper for elastically supporting the rod in combination with the frame or the magnetic circuit,
Wherein the damper further comprises a fifth heat release pattern on at least a part of the surface,
Wherein the fifth heat emission pattern contacts the fourth heat emission pattern and emits heat conducted through the fourth heat emission pattern.
The semiconductor device according to claim 1, wherein the first heat-
A metal layer, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.
A diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating sound pressure by vibration;
A bobbin extending from the bottom surface of the diaphragm;
A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin;
A magnetic field circuit for supplying a magnetic field to the voice coil; And
And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit,
Wherein the bobbin includes a first heat radiation pattern for emitting heat generated in the voice coil to at least a part of a surface thereof,
Wherein the bobbin is formed of a first metal sheet having a columnar shape opened on an upper surface and a lower surface to form an integral body with the first heat radiation pattern.
8. The method according to claim 7,
Ag, Au, Cu, or Al, or an alloy containing at least one of Ag, Au, Cu, and Al.
8. The bobbin according to claim 7,
Further comprising a first film layer of a paper material or a resin material on the first metal sheet.
A diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating sound pressure by vibration;
A bobbin extending from the bottom surface of the diaphragm;
A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin;
A magnetic field circuit for supplying a magnetic field to the voice coil; And
And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit,
Wherein the bobbin includes a first heat emission pattern for emitting heat generated in the voice coil to at least a part of the surface,
Wherein the first heat radiation pattern further comprises at least one first heat radiation protrusion formed on a surface of the bobbin and extending from the bobbin.
The semiconductor device according to claim 2, wherein the second heat-
A metal layer, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.
3. The method of claim 2,
Wherein the diaphragm comprises a second metal sheet,
And the second heat radiation pattern is the second metal sheet.
13. The method of claim 12,
The diaphragm includes a circumference formed at an edge of the diaphragm and coupled with the frame, a concave or convex shape formed inside and a void formed at the center,
And the second metal sheet couples to the void of the surround.
13. The method as claimed in claim 12,
Ag, Au, Cu, or Al, or an alloy containing at least one of Ag, Au, Cu, and Al.
The semiconductor device according to claim 2, wherein the second heat-
And at least one second heat radiation protrusion extending outward from the bottom of the diaphragm.
The plasma display panel of claim 4, wherein the fourth heat-
A metal layer, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.
5. The apparatus of claim 4,
And a third metal sheet in the form of a column having open top and bottom surfaces to form an integral part of the fourth heat radiation pattern.
The method as claimed in claim 17,
Ag, Au, Cu, or Al, or an alloy containing at least one of Ag, Au, Cu, and Al.
5. The apparatus of claim 4,
And a second film layer of a paper material or a resin material on the third metal sheet.
The plasma display panel of claim 4, wherein the fourth heat-
And at least one third heat dissipating protrusion formed on a surface of the rod and extending outwardly of the rod.
The plasma display panel of claim 4, wherein the fourth heat-
And at least one fourth heat radiating protrusion formed on a surface of the rod and extending inward of the rod.
6. The method of claim 5, wherein the fifth heat-
A metal layer, a thermally conductive resin layer, a graphene layer, or a thermally conductive ceramic layer.
6. The damper according to claim 5,
Wherein the upper surface is joined to the bottom surface of the rod and at least one end is integrally formed with the fifth heat radiation pattern by a leaf spring that engages with the frame or the magnetic field circuit.

24. The apparatus as claimed in claim 23,
Ag, Au, Cu, or Al, or an alloy containing at least one of Ag, Au, Cu, and Al.
6. The method of claim 5, wherein the fifth heat-
And at least one fifth heat radiating protrusion formed on a surface of the damper and extending outwardly of the damper.
A diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating sound pressure by vibration;
A bobbin extending from the bottom surface of the diaphragm;
A voice coil comprising a conductive layer to which an audio signal is applied and an insulating layer surrounding the conductive layer, the voice coil being wound on the bobbin;
A magnetic field circuit for supplying a magnetic field to the voice coil; And
And a frame coupled to an edge of the diaphragm and supporting the magnetic circuit,
Wherein the bobbin comprises: a first heat dissipation pattern for emitting heat generated in the voice coil to at least a part of a surface; And
The speaker device includes a damper for elastically supporting the bobbin in combination with the frame or the magnetic circuit,
Wherein the damper further comprises a fifth heat release pattern on at least a part of the surface,
Wherein the fifth heat radiation pattern is in contact with the first heat radiation pattern and emits heat conducted through the first heat radiation pattern.
3. The method of claim 2,
The speaker device further includes a damper for elastically supporting the diaphragm in combination with the frame or the magnetic field circuit,
Wherein the damper further comprises a fifth heat release pattern on at least a part of the surface,
Wherein the fifth heat radiation pattern is in contact with the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.
A diaphragm including an upper surface and a lower surface opposed to the upper surface, the diaphragm generating sound pressure by vibration;
A bobbin extending from the bottom surface of the diaphragm; And
And a voice coil wound around the bobbin, the voice coil including an electrically conductive layer and an insulating layer surrounding the electrically conductive layer, the audio coil being wound on the bobbin,
The bobbin includes a first heat emission pattern for emitting heat generated in the voice coil to a part of the surface,
Wherein a second heat radiation pattern is formed on a bottom surface of the diaphragm or a third heat radiation pattern is formed on an upper surface of the diaphragm.
29. The method of claim 28,
Wherein the second heat radiation pattern contacts the first heat radiation pattern and emits heat conducted through the first heat radiation pattern.
30. The method of claim 29,
Wherein the third heat radiation pattern contacts the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.
30. The method of claim 29,
The diaphragm assembly further includes a rod extending from the bottom surface of the diaphragm,
Wherein the rod further comprises a fourth heat emission pattern on at least a portion of the surface,
Wherein the fourth heat radiation pattern contacts the second heat radiation pattern and emits heat conducted through the second heat radiation pattern.
32. The method of claim 31,
The diaphragm assembly further includes a damper for elastically supporting the rod in combination with a frame or a magnetic field circuit of the speaker device,
Wherein the damper further comprises a fifth heat release pattern on at least a part of the surface,
And the fifth heat dissipation pattern contacts the fourth heat dissipation pattern and emits heat conducted through the fourth heat dissipation pattern.

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