KR20120064305A - Pick-up device for transferring diced semiconductor chips - Google Patents

Pick-up device for transferring diced semiconductor chips Download PDF

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Publication number
KR20120064305A
KR20120064305A KR1020100125481A KR20100125481A KR20120064305A KR 20120064305 A KR20120064305 A KR 20120064305A KR 1020100125481 A KR1020100125481 A KR 1020100125481A KR 20100125481 A KR20100125481 A KR 20100125481A KR 20120064305 A KR20120064305 A KR 20120064305A
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South Korea
Prior art keywords
semiconductor chip
pick
holder member
pickup
head
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KR1020100125481A
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Korean (ko)
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박성원
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주식회사 루셈
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A pick-up device for transferring diced semiconductor chips is provided to prevent the malfunction of a pickup action itself by picking up the side of a semiconductor chip. CONSTITUTION: A holder member(120) is attached to a lower portion of a pick-up head(110). The holder member includes a grip portion opened for gripping the side of the semiconductor chip in a center area. An tube expanding member(130) is installed in a through hole within the pick-up head. The tube expanding member is extended to an adjacent area to a grip portion inside the holder member. A spindle(140) pressures downward the tube expanding member for expanding the grip portion.

Description

다이싱된 반도체칩을 이송하기 위한 픽업 장치 {Pick-Up Device for transferring diced Semiconductor Chips}Pick-up device for transferring diced semiconductor chips

본 발명은 다이싱된 반도체칩을 이송하기 위한 픽업 장치에 관한 것으로서, 보다 상세하게는 웨이퍼 형태에서 다이싱(dicing) 공정을 통해 얻어진 개개의 반도체칩을 후속되는 ILB(inner lead bonding) 공정을 위해 이송하기 위해 픽업하는 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pickup device for transferring a diced semiconductor chip, and more particularly, to a subsequent inner lead bonding (ILB) process of individual semiconductor chips obtained through a dicing process in a wafer form. A device for picking up for transporting.

웨이퍼상에 제작된 반도체 칩은 별도의 패키징(Packaging) 공정을 통해 개개의 칩 제품으로 양산된다. 패키징 공정에서는 먼저 Dicing(SAW) 공정을 통해 웨이퍼상에 패터닝(patterning) 되어 있는 수많은 칩을 개개의 칩으로 나누어 주고, ILB 공정을 통해 Dicing 이 완료된 칩의 범프(Bump)와 필름상의 이너리드(inner lead)를 열압착 방식(Thermo-compression)으로 접합함으로써 외부로의 전기적인 통로를 형성시켜 준다.Semiconductor chips fabricated on wafers are mass-produced as individual chip products through separate packaging processes. In the packaging process, a number of chips patterned on the wafer are divided into individual chips through a dicing (SAW) process, and bumps and inner films on the film, which have been completed through the ILB process, are processed. Leads are connected by thermo-compression to form an electrical path to the outside.

Dicing 된 반도체칩을 Dicing 장치로부터 ILB 장치로 이송하기 위해서는 개개의 반도체칩을 픽업하여 ILB 장치로 이송하기 위한 픽업 장치가 필요하다. 도 1 은 일반적인 픽업장치의 외관을 도시한 도면이고, 도 2 는 도 1 내의 이송헤드를 도시한 도면이다. 픽업장치는 Dicing 장치와 ILB 장치 사이에 배치되어 반도체칩을 픽업하여 이송하며, 이송 동작은 도 2 와 같은 이송헤드(transfer head)에 의해 수행된다.In order to transfer the dicing semiconductor chip from the dicing device to the ILB device, a pickup device for picking up each semiconductor chip and transferring the dicing semiconductor chip to the ILB device is required. 1 is a view showing the appearance of a general pickup apparatus, Figure 2 is a view showing the transfer head in FIG. The pickup device is disposed between the dicing device and the ILB device to pick up and transfer the semiconductor chip, and the transfer operation is performed by a transfer head as shown in FIG.

도 3 은 도 2 의 픽업헤드를 도시한 도면이고, 도 4 는 도 3 의 픽업헤드가 다이싱된 반도체칩을 픽업한 상태를 도시한 도면이다.3 is a diagram illustrating the pickup head of FIG. 2, and FIG. 4 is a diagram illustrating a state in which the pickup head of FIG. 3 picks up a diced semiconductor chip.

픽업헤드(10)는 실린더(11)와 러버콜렛(rubber collet)(13)으로 구성된다. 실린더(11)는 진공장치(도시되지 않음)에 의해 러버콜렛(13)에 진공 흡착력을 가하는 기능을 한다. 도 3 에 도시된 바와 같이, 실린더(11)가 하방 이동됨에 따라 러버콜렛(13)이 반도체칩(20)의 상면에 접촉된다. 이때, 도 4 에 도시된 바와 같이 반도체칩(20)의 하면을 지지하는 멤브레인(30)은 그 하부에 설치된 E-핀(40)의 상향 이동에 의해 상방으로 이동되며, 이에 따라 반도체칩(20)이 러버콜렛(13)의 하면에 접촉된다. 이러한 상태에서 실린더(11)는 진공장치의 동작에 의해 러버콜렛(13)에 진공 흡착력을 가하게 되고, 이에 따라 반도체칩(20)이 러버콜렛(13)에 흡착된다. 흡착된 반도체칩(20)은 도 2 에 도시된 바와 같은 이송헤드에 의해 ILB 장치로 이송된다. 반도체칩(20)이 ILB 장치로 이송된 후 러버콜렛(13)의 진공 흡착력은 해제되고, 이에 따라 반도체칩(20)이 ILB 장치 내의 원하는 위치에 놓여진다.The pickup head 10 is composed of a cylinder 11 and a rubber collet 13. The cylinder 11 functions to apply a vacuum suction force to the rubber collet 13 by a vacuum device (not shown). As shown in FIG. 3, as the cylinder 11 is moved downward, the rubber collet 13 contacts the upper surface of the semiconductor chip 20. At this time, as shown in FIG. 4, the membrane 30 supporting the lower surface of the semiconductor chip 20 is moved upward by the upward movement of the E-pin 40 disposed below the semiconductor chip 20. ) Is in contact with the lower surface of the rubber collet (13). In this state, the cylinder 11 applies a vacuum suction force to the rubber collet 13 by the operation of the vacuum apparatus, and thus the semiconductor chip 20 is adsorbed to the rubber collet 13. The absorbed semiconductor chip 20 is transferred to the ILB apparatus by a transfer head as shown in FIG. After the semiconductor chip 20 is transferred to the ILB device, the vacuum suction force of the rubber collet 13 is released, thereby placing the semiconductor chip 20 at a desired position in the ILB device.

그런데 상기와 같은 종래의 픽업 장치는 실리콘 재질의 러버콜렛(13)의 사용으로 칩 패턴면과 골드범프(Gold Bump)의 손상을 감소시킬 수는 있으나 반도체칩(20)의 상부와 러버콜렛(13)의 직접 접촉이 불가피하므로 이러한 손상을 완전히 배제하지는 못한다. 반도체칩(20)의 상면에는 ILB 공정에서 이너리드(inner lead)를 반도체칩(20)에 부착시키기 위하여 범프가 형성되는데, 특히 다이싱된 반도체칩(20)의 크기가 매우 작은 경우에는 러버콜렛(13)이 범프와 직접 접촉하게 되어 범프의 손상이 불가피하게 된다. 이 경우 반도체칩(20)의 전기적 연결 상태가 불완전하게 되어 핀간의 쇼트에 의한 불량 발생이 야기된다.By the way, the conventional pickup device as described above can reduce the damage of the chip pattern surface and the gold bump by using the rubber collet 13 of silicon material, but the upper part and the rubber collet 13 of the semiconductor chip 20. ) Direct contact is inevitable and does not completely rule out such damage. A bump is formed on an upper surface of the semiconductor chip 20 to attach an inner lead to the semiconductor chip 20 in an ILB process. In particular, when the size of the diced semiconductor chip 20 is very small, a rubber collet is formed. (13) comes into direct contact with the bumps, which inevitably damages the bumps. In this case, the electrical connection state of the semiconductor chip 20 becomes incomplete, causing a failure due to short between pins.

또한 종래의 픽업 장치는 픽업시의 진공 흡착력을 항상 일정하게 유지하도록 제어하는 것이 매우 어려우므로, 픽업시의 흡착력의 불완전성으로 인한 오동작이 발생할 우려가 있다.In addition, it is very difficult to control the conventional pickup apparatus so that the vacuum suction force at the time of pickup is kept constant at all times, and there is a possibility that a malfunction occurs due to the incompleteness of the suction force at the time of pickup.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 반도체칩을 픽업하기 위해 가해지는 힘의 불완전성으로 인한 픽업 동작 자체에서의 오동작을 방지할 수 있고, 또한 반도체칩의 상면에의 접촉이 없이 픽업이 가능하여 칩 자체의 손상 및 범프의 손상이 발생되지 않는 픽업 장치를 제공하는 것이다.The present invention has been made to solve the above problems, an object of the present invention is to prevent a malfunction in the pick-up operation itself due to the imperfection of the force applied to pick up the semiconductor chip, and also It is possible to provide a pick-up device that can be picked up without contact with an upper surface such that damage of the chip itself and damage of bumps do not occur.

상기 목적을 달성하기 위한 본 발명에 따른 픽업 장치는, 내부에 상하 방향으로 관통공이 형성된 픽업헤드; 상기 픽업헤드의 하부에 부착되며, 중앙 부위에 상기 반도체칩의 측면 파지를 위해 개방된 파지부를 구비한 홀더부재; 상기 픽업헤드 내의 상기 관통공 내에 설치되고 상기 홀더부재 내측에서 상기 파지부에 인접된 부위까지 연장되며, 외력에 의해 하향 이동된 상태에서 상기 홀더부재의 내측면을 하방 가압함으로써 상기 홀더부재의 탄성 복원력에 저항하여 상기 파지부를 확관시키는 확관부재; 및 상기 반도체칩의 픽업시 상기 파지부의 확관을 위하여 상기 확관부재를 하방 가압하는 스핀들;을 포함하는 것을 특징으로 한다.Pick-up apparatus according to the present invention for achieving the above object, the pickup head formed in the through hole in the vertical direction; A holder member attached to a lower portion of the pick-up head and having a grip portion open at a central portion to hold a side of the semiconductor chip; The elastic restoring force of the holder member is installed in the through hole in the pickup head and extends from the inside of the holder member to a portion adjacent to the gripping portion, and presses the inner surface of the holder member downward while being moved downward by an external force. An expansion member for expanding the gripping portion against resistance; And a spindle configured to pressurize the expansion member downward for expansion of the gripping portion during pickup of the semiconductor chip.

상기 확관부재는 상기 관통공 내에 배치된 스프링을 포함하는 것이 바람직하다.Preferably, the expansion member includes a spring disposed in the through hole.

상기 스핀들의 하방 가압력은 상기 반도체칩의 크기에 따라 요구되는 상기 파지부의 개도에 상응하도록 조절된다. 상기 홀더부재는 한 쌍의 상기 파지부를 구비하는 것이 바람직하다.The downward pressing force of the spindle is adjusted to correspond to the opening degree of the gripping portion required according to the size of the semiconductor chip. The holder member is preferably provided with a pair of the gripping portion.

본 발명에 따르면 반도체칩의 측면이 픽업되므로, 반도체칩을 픽업하기 위해 가해지는 힘의 불완전성으로 인한 픽업 동작 자체에서의 오동작을 방지할 수 있고, 또한 반도체칩의 상면에의 접촉이 없이 픽업이 가능하여 칩 자체의 손상 및 범프의 손상이 발생되지 않는다는 장점이 있다.According to the present invention, since the side surface of the semiconductor chip is picked up, it is possible to prevent a malfunction in the pick-up operation itself due to the imperfection of the force applied to pick up the semiconductor chip, and the pickup can be performed without contacting the upper surface of the semiconductor chip. It is possible that the damage of the chip itself and bumps are not generated.

도 1 은 일반적인 픽업장치의 외관을 도시한 도면.
도 2 는 도 1 내의 이송헤드를 도시한 도면.
도 3 은 도 2 의 픽업헤드를 도시한 도면.
도 4 는 도 3 의 픽업헤드가 다이싱된 반도체칩을 픽업한 상태를 도시한 도면.
도 5 는 본 발명에 따른 픽업 장치의 픽업헤드를 개략적으로 도시한 도면.
도 6 은 도 5 의 픽업 장치가 픽업을 위해 구동된 상태를 도시한 도면.
도 7 및 도 8 은 각각 은 도 5 의 홀더부재의 하면과 측면을 도시한 도면.
도 9 는 도 5 의 픽업헤드가 반도체칩을 픽업하기 위해 대기 중인 상태를 도시한 도면.
도 10 은 도 9 의 픽업헤드가 반도체칩을 픽업한 상태를 도시한 도면.1 is a view showing the appearance of a typical pickup device.
FIG. 2 shows the transfer head in FIG. 1; FIG.
3 shows the pickup head of FIG. 2;
4 is a view showing a state in which the pickup head of FIG. 3 picks up a diced semiconductor chip;
5 schematically shows a pickup head of a pickup device according to the invention;
FIG. 6 is a view showing a state in which the pickup device of FIG. 5 is driven for pickup; FIG.
7 and 8 show the bottom and side surfaces of the holder member of FIG. 5, respectively.
9 illustrates a state in which the pickup head of FIG. 5 is waiting to pick up a semiconductor chip;
10 is a view showing a state in which the pickup head of FIG. 9 picks up a semiconductor chip;

이하에서는 첨부 도면을 참조하여 본 발명을 보다 구체적으로 설명한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

도 5 는 본 발명에 따른 픽업 장치의 픽업헤드를 개략적으로 도시한 도면이고, 도 6 은 도 5 의 픽업 장치가 픽업을 위해 구동된 상태를 도시한 도면이고, 도 7 및 도 8 은 각각 도 5 의 홀더부재의 하면과 측면을 도시한 도면이다. 본 발명에 따른 픽업 장치는 픽업헤드(110), 홀더부재(120), 확관부재(130), 스프링(132), 및 스핀들(140)을 포함하여 구성된다.FIG. 5 is a view schematically showing a pickup head of a pickup device according to the present invention, FIG. 6 is a view showing a state in which the pickup device of FIG. 5 is driven for pickup, and FIGS. 7 and 8 are respectively shown in FIG. Is a view showing the bottom and side of the holder member. Pick-up device according to the invention comprises a pickup head 110, holder member 120, expansion member 130, spring 132, and the spindle 140.

픽업헤드(110)는 대략 원통 형상으로 형성되며, 그 내부에 상하 방향으로 길게 형성된 관통공(112)이 관통 형성되어 있다. 이러한 픽업헤드(110)는 도 2 에 도시된 바와 같은 이송헤드에 의해 상하 방향 및 수평 방향으로 이송되면서 반도체칩의 이송 동작을 수행한다.Pick-up head 110 is formed in a substantially cylindrical shape, the through-hole 112 formed long in the vertical direction therethrough is formed through. The pickup head 110 performs the transfer operation of the semiconductor chip while being transferred in the vertical direction and the horizontal direction by the transfer head as shown in FIG.

홀더부재(120)는 픽업헤드의 하부에 부착되며, 중앙 부위에 반도체칩의 측면 파지를 위해 개방된 파지부(122)를 구비한다. 즉, 도 7 및 도 8 에 도시된 바와 같이, 홀더부재(120)는 픽업헤드(110)의 하면에 고정된 한 쌍의 마주 보는 고정부재(121)와 이 고정부재(121)들 사이에 마주보도록 배치된 한 쌍의 파지부(122)로 구성되며, 한 쌍의 파지부(122)는 일정 거리 이격되도록 배치됨으로써 그 사이에 반도체칩이 인입되어 파지되는 개방부(124)를 형성한다.The holder member 120 is attached to the lower portion of the pickup head, and has a gripping portion 122 open at the center to open the side of the semiconductor chip. That is, as shown in FIGS. 7 and 8, the holder member 120 faces between a pair of opposing fixing members 121 fixed to the bottom surface of the pickup head 110 and the fixing members 121. Comprising a pair of holding portions 122 arranged to see, the pair of holding portions 122 are arranged to be spaced apart by a predetermined distance to form an open portion 124 through which the semiconductor chip is inserted and gripped therebetween.

이때, 파지부(122)는 탄성력이 있는 재질로 제조됨으로써 외력에 의해 가압 변형시 자체 탄성력에 의한 복원력에 의해 원형으로 복원되는 특성을 갖도록 구성된다. 이와 다른 방식으로서, 파지부(122) 자체는 탄성력을 갖지 않는 재질로 제조되도록 구성하되, 판스프링(도시되지 않음)과 같은 보조적인 탄성 복원 장치에 의해 원형으로 복원되는 힘을 받도록 구성하는 것도 가능하다. 이때의 복원력은 파지부(122) 사이에 형성된 개방부(124)의 폭이 넓어지도록 외력이 가해지는 경우 다시 원형으로 좁아지도록 복원되는 힘을 의미한다.At this time, the grip portion 122 is made of a material having an elastic force is configured to have a characteristic that is restored to a circular shape by the restoring force by its own elastic force when the pressure deformation by the external force. Alternatively, the gripping portion 122 may be configured to be made of a material having no elastic force, but may be configured to receive a force restored in a circular shape by an auxiliary elastic restoring device such as a leaf spring (not shown). Do. At this time, the restoring force means a force restored to narrow again when an external force is applied to widen the width of the opening 124 formed between the holding portions 122.

확관부재(132)는 픽업헤드(110) 내의 관통공(112) 내에 설치되는 바아의 형상으로 구성되며, 확관부재(132)는 홀더부재(120)의 내측에 형성된 공간을 통해 파지부(122)에 인접된 부위까지 연장되도록 구성된다. 확관부재(132)의 하부는 도시된 바와 같이 양 측으로 갈라진 발의 형상으로 구성되어, 홀더부재(120)의 내부 공간에서 파지부(122)의 내측면에 접촉되도록 구성된다. 확관부재(132)는 후술되는 바와 같이 외력에 의해 하향 이동된 상태에서 홀더부재(120)의 내측면을 하방 가압함으로써, 홀더부재(120)의 탄성 복원력에 저항하여 파지부(122) 사이의 개방부(124) 폭을 넓혀 확관시키는 기능을 한다.The expansion member 132 is configured in the shape of a bar installed in the through hole 112 in the pickup head 110, the expansion member 132 is a holding portion 122 through a space formed inside the holder member 120 And extends to a site adjacent to. The lower portion of the expansion pipe member 132 is configured in the shape of the feet divided to both sides as shown, it is configured to contact the inner surface of the grip portion 122 in the inner space of the holder member 120. The expansion pipe member 132 downwardly presses the inner surface of the holder member 120 in a downwardly moved state by an external force, thereby resisting the elastic restoring force of the holder member 120 to open between the grip portions 122. The width of the portion 124 is widened to expand.

스핀들(140)은 관통공(112) 내에서 확관부재(130)의 상방에 배치되며, 스프링(132)은 스핀들(140)과 확관부재(130) 사이에 배치된다. 스핀들(140)은 이송헤드에 설치된 별도의 모터 등에 의하여 관통공(112) 내에서 상하 방향으로 이동 가능하도록 구동되며, 스핀들(140)의 하향 이동 상태에서는 도 6 과 같이 스핀들(140)이 스프링(132)을 가압하여 확관부재(130)를 하향 이동시키고, 이에 따라 파지부(122)의 사이가 벌어지게 되어 개방부(124)의 개방 폭이 넓어지게 된다. 또한, 스핀들(140)의 상향 이동 상태에서는 도 5 와 같이 스핀들(140)의 스프링(132)에 대한 가압력이 해제되어 확관부재(130)가 상향 이동되고, 이에 따라 파지부(122)의 사이가 좁아지게 되어 개방부(124)의 개방 폭이 좁아지게 된다.The spindle 140 is disposed above the expansion member 130 in the through hole 112, and the spring 132 is disposed between the spindle 140 and the expansion member 130. The spindle 140 is driven to move upward and downward in the through hole 112 by a separate motor or the like installed in the transfer head. In the downward movement state of the spindle 140, the spindle 140 is a spring (see FIG. 6). The expansion member 130 is moved downward by pressing the 132, and thus the gap between the gripping portions 122 is widened so that the opening width of the opening portion 124 is widened. In addition, in the upward movement state of the spindle 140, as shown in FIG. 5, the pressing force on the spring 132 of the spindle 140 is released, and the expansion member 130 is moved upward, and thus the space between the grippers 122 is increased. It becomes narrow and the opening width of the opening part 124 becomes narrow.

이하에서는 도 9 및 도 10 을 참조하여 상기와 같이 구성된 본 발명에 따른 픽업 장치의 동작을 설명한다. 도 9 는 도 5 의 픽업헤드가 반도체칩을 픽업하기 위해 대기 중인 상태를 도시한 도면이고, 도 10 은 도 9 의 픽업헤드가 반도체칩을 픽업한 상태를 도시한 도면이다. (도 9 및 10 에서는 도시의 편의상 도 5 및 6 에 도시된 내부 구성, 즉 스핀들(140), 스프링(132), 확관부재(130) 등은 도시하지 않았다.)Hereinafter, the operation of the pickup apparatus according to the present invention configured as described above with reference to FIGS. 9 and 10. 9 is a view illustrating a state in which the pickup head of FIG. 5 is waiting to pick up a semiconductor chip, and FIG. 10 is a view illustrating a state in which the pickup head of FIG. 9 picks up a semiconductor chip. (In FIGS. 9 and 10, for convenience of illustration, the internal configuration shown in FIGS. 5 and 6, that is, the spindle 140, the spring 132, the expansion member 130, etc. are not shown.)

다이싱된 반도체칩(140)이 테이블(150)에 놓여진 상태에서 이송헤드(도시되지 않음)에 의해 픽업헤드(110)가 픽업할 반도체칩(110)의 상부로 이송된다. 이 상태에서는 도 5 와 같이 스핀들(140)이 상방 이동되어 있으며, 이에 따라 도 9 와 같이 홀더부재(120)의 파지부(122)가 확관되지 않은 상태가 된다.In the state where the diced semiconductor chip 140 is placed on the table 150, the pickup head 110 is transferred to the upper portion of the semiconductor chip 110 to be picked up by a transfer head (not shown). In this state, the spindle 140 is moved upward as shown in FIG. 5, and thus, the grip portion 122 of the holder member 120 is not expanded as shown in FIG. 9.

도 9 와 같은 상태에서 스핀들(140)이 스핀들(140) 구동용 모터(도시되지 않음)에 의해 하향 이동되어 스프링(132)을 하향 가압하면 확관부재(130)가 하향 이동하여 도 6 과 같이 파지부(122)가 확관된다. 이러한 상태에서 이송헤드에 의해 픽업헤드(110)가 하향 이동된 후 스핀들(140)이 상향 이동되어 스프링(132)에 대한 하향 가압력을 해제하면, 확관부재(130)는 다시 도 5 와 같이 파지부(122)의 확관력을 해제하여 도 10 에 도시된 바와 같이 반도체칩(140)의 측면이 파지부(122)에 의해 파지된다.In the state as shown in FIG. 9, when the spindle 140 moves downward by the motor for driving the spindle 140 (not shown) and presses the spring 132 downward, the expansion member 130 moves downward to wave as shown in FIG. 6. Branch 122 is expanded. In this state, when the pickup head 110 is moved downward by the transfer head and the spindle 140 is moved upward to release the downward pressing force on the spring 132, the expansion member 130 is again held as shown in FIG. 5. As shown in FIG. 10, the side of the semiconductor chip 140 is gripped by the gripper 122 by releasing the expansion force of the 122.

이러한 상태에서 이송헤드에 의해 픽업헤드(110)가 ILB 공정 장치 내의 원하는 위치로 이동되고, 이동 후 다시 스핀들(140)이 하향 이동함으로써 도 6 과 같이 파지부(122)를 확관시켜 반도체칩(140)이 원하는 위치에 놓여지도록 한다. 이와 같은 동작을 순차적으로 반복함으로써 각 반도체칩(140)이 순차적으로 ILB 공정 장치로 이송된다.In this state, the pickup head 110 is moved to a desired position in the ILB process apparatus by the transfer head, and after the movement, the spindle 140 moves downward to expand the grip portion 122 as shown in FIG. 6 to expand the semiconductor chip 140. ) To the desired position. By sequentially repeating these operations, each semiconductor chip 140 is sequentially transferred to the ILB process apparatus.

이러한 본 발명에 따르면, 반도체칩(140)의 파지시 픽업 장치가 접촉되는 부분이 반도체칩(140)의 측면이 된다. 따라서 반도체칩(140)의 상면과의 접촉이 일어나지 않으므로 반도체칩(140)에 형성된 회로 패턴의 손상이 발생하지 않게 되고, 나아가 반도체칩(140)의 상면에 부착된 범프(142)의 손상이 발생하지 않는다. 따라서 후속되는 ILB 공정 등에서의 오동작 및 불량이 방지된다.According to the present invention, a portion of the semiconductor chip 140 that the pick-up device is in contact with the side of the semiconductor chip 140. Therefore, since the contact with the upper surface of the semiconductor chip 140 does not occur, the damage of the circuit pattern formed on the semiconductor chip 140 does not occur, and further, the damage of the bump 142 attached to the upper surface of the semiconductor chip 140 occurs. I never do that. Thus, malfunctions and failures in subsequent ILB processes and the like are prevented.

또한 본 발명에 따르면 기존의 진공 흡착 방식에서 진공 흡착력의 적절한 유지를 위한 정밀 제어가 불필요하다. 즉, 픽업 장치의 픽업 동작을 확실하게 하기 위해서는 진공 흡착력이 강해야 하나, 지나치게 강할 경우에는 범프(142)의 손상 및 회로 패턴의 손상을 야기할 수 있으므로 적절한 정도로 조절되도록 흡착력의 정밀 제어가 필요하나, 본 발명에서는 진공 흡착력을 사용하지 않으므로 이러한 정밀 제어가 불필요하다는 장점이 있다.In addition, according to the present invention, precise control for proper maintenance of vacuum suction force is unnecessary in the conventional vacuum adsorption method. That is, in order to ensure the pick-up operation of the pick-up device, the vacuum suction force should be strong, but if too strong, it may cause damage of the bump 142 and damage of the circuit pattern, so precise control of the suction force is required to be adjusted to an appropriate degree. In the present invention, since the vacuum suction force is not used, there is an advantage that such precise control is unnecessary.

한편, 본 발명에서 스핀들(140)의 하방 가압력은 반도체칩(140)의 크기에 따라 요구되는 파지부(122)의 개도에 상응하도록 조절될 수 있다. 즉, 폭이 넓은 반도체칩(140)의 경우에는 파지부(122)가 더욱 넓게 벌어져야 하며, 폭이 좁은 반도체칩(140)의 경우에는 파지부(122)가 다소 좁게 벌어져야 할 것이다. 따라서 스핀들(140)의 하방 이동 거리를 스핀들 구동 모터로 제어함으로써 파지부(122)의 개도를 조절하여 반도체칩(140)의 크기에 따라 가변적으로 제어할 수 있다.Meanwhile, in the present invention, the downward pressing force of the spindle 140 may be adjusted to correspond to the opening degree of the grip portion 122 required according to the size of the semiconductor chip 140. That is, in the case of the wide semiconductor chip 140, the grip portion 122 should be more wide open, and in the case of the narrow semiconductor chip 140, the grip portion 122 should be slightly narrowed. Accordingly, by controlling the downward movement distance of the spindle 140 by the spindle driving motor, the opening degree of the gripper 122 may be adjusted to be variably controlled according to the size of the semiconductor chip 140.

또한 전술한 바와 같이 홀더부재(120)(보다 정확하게는 파지부(122))는 탄성 재질로 제조될 수 있으며 또한 비탄성 재질로 제조되는 경우에는 별도의 스프링(미도시)을 설치하여 탄성 복원력을 가할 수 있다. 비탄성 재질로 제조되는 경우에는 파지부(122) 자체가 도 7 에서 고정부재(121)들 사이에서 측방으로 이동될 수 있는 구조로 구성할 수 있다. 이 경우 고정부재(121)는 파지부(122)의 측방 이동을 안내하는 가이드의 역할을 수행할 수 있다.In addition, as described above, the holder member 120 (more precisely, the gripper 122) may be made of an elastic material, and when made of an inelastic material, an additional spring (not shown) may be installed to apply an elastic restoring force. Can be. In the case of being made of an inelastic material, the gripping portion 122 itself may be configured to have a structure that can be moved laterally between the fixing members 121 in FIG. In this case, the fixing member 121 may serve as a guide to guide the lateral movement of the gripping portion 122.

본 발명은 도면에 도시된 일실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호 범위는 첨부된 등록 청구 범위의 기술적 사상에 의해 정해져야 할 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims (4)

다이싱된 반도체칩을 이송하기 위한 픽업 장치에 있어서,
내부에 상하 방향으로 관통공이 형성된 픽업헤드;
상기 픽업헤드의 하부에 부착되며, 중앙 부위에 상기 반도체칩의 측면 파지를 위해 개방된 파지부를 구비한 홀더부재;
상기 픽업헤드 내의 상기 관통공 내에 설치되고 상기 홀더부재 내측에서 상기 파지부에 인접된 부위까지 연장되며, 외력에 의해 하향 이동된 상태에서 상기 홀더부재의 내측면을 하방 가압함으로써 상기 홀더부재의 탄성 복원력에 저항하여 상기 파지부를 확관시키는 확관부재; 및
상기 반도체칩의 픽업시 상기 파지부의 확관을 위하여 상기 확관부재를 하방 가압하는 스핀들;
을 포함하는 것을 특징으로 하는 픽업 장치.
In the pickup device for transferring the diced semiconductor chip,
A pickup head having a through hole formed therein in a vertical direction;
A holder member attached to a lower portion of the pick-up head and having a grip portion open at a central portion to hold a side of the semiconductor chip;
The elastic restoring force of the holder member is installed in the through hole in the pickup head and extends from the inside of the holder member to a portion adjacent to the holding portion, and presses the inner surface of the holder member downward in a downwardly moved state by an external force. An expansion member for expanding the gripping portion against resistance; And
A spindle configured to pressurize the expansion member downward to expand the gripping portion when the semiconductor chip is picked up;
Pickup device comprising a.
제 1 항에 있어서,
상기 확관부재는 상기 관통공 내에 배치된 스프링을 포함하는 것을 특징으로 하는 픽업 장치.
The method of claim 1,
The expansion member comprises a spring disposed in the through hole.
제 1 항 또는 제 2 항에 있어서,
상기 스핀들의 하방 가압력은 상기 반도체칩의 크기에 따라 요구되는 상기 파지부의 개도에 상응하도록 조절되는 것을 특징으로 하는 픽업 장치.
The method according to claim 1 or 2,
And a downward pressing force of the spindle is adjusted to correspond to an opening degree of the gripping portion required according to the size of the semiconductor chip.
제 1 항 또는 제 2 항에 있어서,
상기 홀더부재는 한 쌍의 상기 파지부를 구비하는 것을 특징을 하는 픽업 장치.The method according to claim 1 or 2,
The holder member is characterized in that it comprises a pair of the gripping portion.
KR1020100125481A 2010-12-09 2010-12-09 Pick-up device for transferring diced semiconductor chips KR20120064305A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110465963A (en) * 2019-08-30 2019-11-19 沈阳豪邦机械装备有限公司 A kind of multi-function robot clamp hand
KR20200054987A (en) * 2017-09-21 2020-05-20 뮐바우어 게엠베하 운트 콤파니 카게 Apparatus for aligning and optically inspecting semiconductor devices
KR20210025356A (en) * 2019-08-27 2021-03-09 세메스 주식회사 Die pickup module and die bonding apparatus including the same
KR20210025358A (en) * 2019-08-27 2021-03-09 세메스 주식회사 Die pickup module and die bonding apparatus including the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200054987A (en) * 2017-09-21 2020-05-20 뮐바우어 게엠베하 운트 콤파니 카게 Apparatus for aligning and optically inspecting semiconductor devices
CN111263976A (en) * 2017-09-21 2020-06-09 米尔鲍尔有限两合公司 Device for aligning and optically inspecting semiconductor components
CN111263976B (en) * 2017-09-21 2023-11-10 米尔鲍尔有限两合公司 Device for aligning and optically inspecting semiconductor components
KR20210025356A (en) * 2019-08-27 2021-03-09 세메스 주식회사 Die pickup module and die bonding apparatus including the same
KR20210025358A (en) * 2019-08-27 2021-03-09 세메스 주식회사 Die pickup module and die bonding apparatus including the same
CN110465963A (en) * 2019-08-30 2019-11-19 沈阳豪邦机械装备有限公司 A kind of multi-function robot clamp hand

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