KR20120051407A - High frequency module having surface acoustic wave device and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A high frequency module having a surface acoustic wave device capable and a manufacturing method thereof are provided to improve the shielding performance of electromagnetic waves by electrically connecting ground patterns and an electromagnetic wave shielding layer formed on a molding layer. CONSTITUTION: A radio frequency module including a surface acoustic wave device includes a substrate(10) and one or more SAW(Surface Acoustic Wave) devices(20) mounted on the substrate. The radio frequency module including the surface acoustic wave device includes an electromagnetic wave shielding layer(40) formed on a surface of a molding layer(30) and the molding layer formed on the substrate to cover the SAW device. The substrate is composed of a multilayer wiring substrate including a ceramic substrate or a PCB substrate, etc. Upper ground patterns(11) are formed on both side top portions of the substrate. An upper side of the upper ground patterns is exposed to the outside of the substrate.

Description

High frequency module having surface acoustic wave device and method for manufacturing the same

The present invention relates to a high frequency module including a surface acoustic wave device and a method of manufacturing the same. More particularly, the electromagnetic wave shielding performance is improved by allowing the ground pattern provided on the substrate and the electromagnetic shielding layer formed on the molding layer to be electrically connected to each other. A high frequency module including a surface acoustic wave device and a method of manufacturing the same.

With the development of the telecommunications industry, wireless communication products are becoming smaller, higher quality and more versatile. In accordance with this trend, miniaturization and multifunctionality are also required for components used in wireless communication products such as filters and duplexers. As an example of such a component, a surface acoustic wave (SAW) element is used.

A surface acoustic wave element is an element which converts an electrical signal and a surface acoustic wave by an interdigital transducer (IDT) made of a thin film metal provided on a piezoelectric substrate, and transmits and receives a signal.

Since such surface acoustic wave elements have characteristics such as small size, light weight, high reliability, and excellent out-of-band attenuation characteristics, they are widely used as frequency filters and resonators in the field of video equipment and mobile communication equipment.

Accordingly, in recent years, the development of a high frequency module having excellent electromagnetic shielding ability to effectively prevent the inflow and outflow of the noise signal is continuously required. One example is a high frequency module for GPS.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to improve the electromagnetic shielding performance by allowing the ground pattern provided on the substrate and the electromagnetic shielding layer formed on the molding layer to be electrically connected to each other. A high frequency module including a surface acoustic wave device and a method of manufacturing the same are provided.

The high frequency module including the surface acoustic wave device according to an embodiment of the present invention for achieving the above object, the upper ground pattern is provided on both sides, the inner ground pattern is electrically connected to the upper ground pattern through a via electrode therein A substrate provided; At least one SAW element mounted on the substrate; A molding layer formed on the substrate so as to cover the SAW element and having groove portions at both sides thereof exposing the upper ground pattern; And an electromagnetic shielding layer formed to cover the surface of the molding layer including the inside of the groove.

The groove may extend downwardly to the inside of the substrate to expose the internal ground pattern.

In addition, the groove may extend downward to the bottom of the substrate to expose both side surfaces of the substrate including the internal ground pattern.

In addition, the SAW device may include at least one of a SAW filter and a SAW duplexer.

In addition, the electromagnetic shielding layer may be made of a material containing at least one of Ag and Cu.

In addition, the electromagnetic shielding layer may be formed by at least one of a plating method, a spray method and a sputter method.

In addition, the method of manufacturing a high frequency module including a surface acoustic wave device according to an embodiment of the present invention for achieving the above object, a plurality of upper ground patterns are provided on the upper, and the upper ground pattern through a via electrode therein; Preparing a substrate having a plurality of internal ground patterns electrically connected thereto; Mounting at least one SAW device on an upper surface of the substrate; Forming a molding layer on the substrate to cover the SAW device; Removing a portion of the molding layer between the SAW elements to form a groove portion exposing the upper ground pattern; Forming an electromagnetic shielding layer on a surface of the molding layer including the inside of the groove; And cutting the resultant along a dicing line and separating the resultant into individual high frequency module units.

In addition, the method for manufacturing a high frequency module including a surface acoustic wave device according to another embodiment of the present invention for achieving the above object, a plurality of upper ground patterns are provided on the upper, and the upper ground pattern through a via electrode therein; Preparing a substrate having a plurality of internal ground patterns electrically connected thereto; Mounting at least one SAW device on an upper surface of the substrate; Forming a molding layer on the substrate to cover the SAW device; Removing a portion of the molding layer and the substrate between the SAW elements to form a groove portion exposing the upper ground pattern and the inner ground pattern; Forming an electromagnetic shielding layer on a surface of the molding layer including the inside of the groove; And cutting the resultant along a dicing line and separating the resultant into individual high frequency module units.

Here, in the forming of the groove portion exposing the upper ground pattern and the inner ground pattern by removing the molding layer and the portion of the substrate between the SAW device, the substrate may be removed by a partial thickness or the entire thickness. .

In addition, the dicing line may be characterized in that passing through the center of the groove portion.

As described above, according to the high frequency module including the surface acoustic wave device and the manufacturing method thereof according to the present invention, the ground pattern provided on the substrate and the electromagnetic shielding layer formed on the molding layer are electrically connected to each other to introduce the noise signal. And it is effective to effectively prevent the outflow.

Therefore, the present invention has the effect of providing a high frequency module including a surface acoustic wave device having excellent electromagnetic shielding performance.

1 is a cross-sectional view showing the structure of a high frequency module including a surface acoustic wave device according to a first embodiment of the present invention.
2 is a cross-sectional view showing the structure of a high frequency module including a surface acoustic wave device according to a second embodiment of the present invention.
3 is a cross-sectional view showing the structure of a high frequency module including a surface acoustic wave device according to a third embodiment of the present invention.
4A to 4G are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a first exemplary embodiment of the present invention.
5A to 5G are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a second exemplary embodiment of the present invention.
6A through 6E are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a third exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of a high frequency module including a surface acoustic wave device and a method of manufacturing the same. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

First, a high frequency module including a surface acoustic wave device according to a first exemplary embodiment of the present invention will be described in detail with reference to FIG. 1.

1 is a cross-sectional view showing the structure of a high frequency module including a surface acoustic wave device according to a first embodiment of the present invention.

As shown in FIG. 1, the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention includes a substrate 10 and at least one surface acoustic wave (sur +) mounted on the substrate 10. face acoustic wave (hereinafter referred to as " SAW ") device 20, a molding layer 30 formed on the substrate 10 to cover the SAW device 20, and a surface of the molding layer 30 It may be configured to include an electromagnetic shielding layer 40 formed in.

The substrate 10 may be formed of a multilayer wiring substrate such as a ceramic substrate or a PCB substrate.

Top ground patterns 11 are provided on both sides of the substrate 10. An upper surface of the upper ground pattern 11 is exposed to the outside of the substrate 10.

An inner ground pattern electrically connected to the upper ground pattern 11 through a via electrode 12 formed to penetrate a portion of the substrate 10; 13) is provided.

That is, the upper ground pattern 11 and the inner ground pattern 13 are provided on different layers, and they are electrically connected to each other by the via electrode 12 formed to pass through a portion of the substrate 10. .

In this case, although the inner ground patterns 13 are provided in two different layers in the substrate 10, the number of the inner ground patterns 13 is not limited thereto.

An electrode pattern 21 is provided on an upper surface of the substrate 10, and a SAW element 20 is mounted on the electrode pattern 21.

The SAW device 20 may include at least one of a SAW filter and a SAW duplexer.

1 illustrates a case in which one SAW element 20, for example, one SAW filter or one SAW duplexer is mounted on the substrate 10, the SAW element ( 20, both the SAW filter and the SAW duplexer may be mounted.

The SAW filter uses an IDT (Inter Digital Transducer) electrode formed on a surface of a piezoelectric substrate, and then converts an electrical signal applied to the IDT electrode into mechanical energy of a piezoelectric body by a piezoelectric effect. It can selectively accept only the necessary frequencies and block the rest of the signal.

In addition, the SAW duplexer serves to separate transmission and reception frequencies among the signals coming from the antenna, and at the same time, may block the noise of adjacent frequencies like the SAW filter.

In addition, as illustrated in FIG. 1, the active element 22 and the passive element 24 may be further mounted on the substrate 10 in addition to the SAW element 20 such as the SAW filter and the SAW duplexer.

As an example of the active element 22, components such as a low noise amplifier (LNA), a switch, and a power amplifier (PA) may be mounted. The active element 22 may include a conductive bump disposed on a lower surface thereof. 23) may be mounted on the substrate 10.

As an example of the passive element 24, components such as a resistor, an inductor, and a capacitor may be mounted.

As described above, the SAW element 20, the active element 22, and the passive element 24 are mounted on the substrate 10 on which the SAW element 20, the active element 22, and the passive element 24 are mounted. The molding layer 30 is formed on both sides of the groove portion 31 covering the upper surface of the upper ground pattern 11 provided on both sides of the substrate 10.

The molding layer 30 may serve to protect the SAW device 20, the active device 22, and the passive device 24 mounted on the substrate 10, which may be liquid epoxy or epoxy molding (EMC). Compound) and the like.

In the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention, the groove portion 31 provided to expose the upper surface of the upper ground pattern 11 on both sides of the molding layer 30. The electromagnetic shielding layer 40 is formed on the surface of the molding layer 30 including the inside.

The electromagnetic shielding layer 40 is to prevent the effects of Electro Magnetic Interference (EMI) on the SAW device 20, and may be made of a metal material, for example, a material including at least one of Ag and Cu.

In this case, the electromagnetic shielding layer 40 may be formed by at least one of plating, spraying and sputtering.

A plurality of external electrodes 14 are formed on the bottom surface of the substrate.

According to the first embodiment of the present invention as described above, the electromagnetic shielding layer 40 not only covers the surface of the molding layer 30, but also the upper ground pattern 11 exposed to the groove 31. It is formed to cover the upper surface, it can be directly connected to the upper ground pattern (11).

As described above, according to the first exemplary embodiment of the present invention, the upper ground pattern 11 provided on the substrate 10 and the electromagnetic shielding layer 40 are directly connected to each other so that an external signal flows into the high frequency module and the internal signal of the high frequency module. There is an effect that can effectively suppress the external emission of the.

Therefore, according to the first embodiment of the present invention, it is possible to provide a high frequency module including a surface acoustic wave device having excellent electromagnetic shielding performance, and thus, it can be applied to a terminal having a GPS function for receiving a weak electric field.

Next, a high frequency module including the surface acoustic wave device according to the second embodiment of the present invention will be described in detail with reference to FIG. 2.

2 is a cross-sectional view showing the structure of a high frequency module including a surface acoustic wave device according to a second embodiment of the present invention.

As shown in FIG. 2, the high frequency module including the surface acoustic wave device according to the second embodiment of the present invention has the same configuration as that of the high frequency module according to the first embodiment of the present invention, except that the groove portion ( 31 extends downward to the inside of the substrate 10 to further expose an upper surface of the internal ground pattern 13, whereby the electromagnetic shielding layer 40 extends to the inside of the substrate 10. It differs from the first embodiment only in that it is formed to cover the surface of the molding layer 30 including the inside of the extended groove portion 31.

In the high frequency module including the surface acoustic wave device according to the second exemplary embodiment of the present invention, one side surface of the upper ground pattern 11 is formed by the groove part 31 extending downward to the inside of the substrate 10. As the upper surface of the inner ground pattern 13 is exposed, the electromagnetic shielding layer 40 may be directly connected to the exposed surface of the upper ground pattern 11 and the inner ground pattern 13.

Therefore, in the high frequency module including the surface acoustic wave device according to the second embodiment of the present invention, the same operation and effect as in the first embodiment of the present invention can be obtained, and the electromagnetic shielding layer 40 has the upper ground pattern 11. In addition, by directly connecting to the internal ground pattern 13, there is an advantage that can implement a high-frequency module with better electric wave shielding performance.

Next, a high frequency module including the surface acoustic wave device according to the third embodiment of the present invention will be described in detail with reference to FIG. 3.

3 is a cross-sectional view illustrating a structure of a high frequency module including a surface acoustic wave device according to a third exemplary embodiment of the present invention.

As shown in FIG. 3, the high frequency module including the surface acoustic wave device according to the third embodiment of the present invention has the same configuration as that of the high frequency module according to the first embodiment of the present invention. 31 extends downward to the bottom surface of the substrate 10 to further expose both sides of the substrate 10 including the internal ground pattern 13, whereby the electromagnetic shielding layer 40 is exposed to the substrate. It differs from the first embodiment only in that it is formed to cover the surface of the molding layer 30 including both sides of (10).

In the high frequency module including the surface acoustic wave device according to the third exemplary embodiment of the present invention, the upper ground pattern 11 and the inner ground pattern may be formed by the groove 31 extending downward to the bottom of the substrate 10. 13, the electromagnetic shielding layer 40 may be directly connected to exposed surfaces of the upper and inner ground patterns 11 and 13.

Therefore, the high frequency module including the surface acoustic wave device according to the third embodiment of the present invention can obtain the same operation and effect as in the first embodiment of the present invention, and the electromagnetic shielding layer 40 is applied to both sides of the substrate 10. Since the shield is formed to shield even the noise signal generated from the side of the substrate 10, there is an advantage that can implement a high frequency module with excellent electric wave shielding performance.

Hereinafter, a method of manufacturing the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4A to 4G.

4A to 4G are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a first exemplary embodiment of the present invention.

First, as shown in FIG. 4A, the substrate 10 is prepared. The substrate 10 may be formed of a ceramic substrate or a PCB substrate.

A plurality of upper ground patterns 11 having upper surfaces exposed to the outside are provided on the substrate 10, and via electrodes 12 formed in the substrate 10 to penetrate a portion of the substrate 10. A plurality of internal ground patterns 13 are electrically connected to the upper ground patterns 11 through the.

That is, the upper ground pattern 11 and the inner ground pattern 13 are provided on different layers, and they are electrically connected to each other by the via electrode 12 formed to pass through a portion of the substrate 10. .

After preparing the substrate 10 including the upper and inner ground patterns 11 and 13 and the via electrode 12, a plurality of external electrodes 14 are formed on the bottom surface of the substrate 10.

Next, as shown in FIG. 4B, at least one SAW element 20 is mounted on the upper surface of the substrate 10 via the electrode pattern 21.

The SAW device 20 may include at least one of a SAW filter and a SAW duplexer.

Then, a plurality of active elements 22, a plurality of passive elements 24 and the like are mounted on the substrate 10. As described above, components such as an LNA, a switch, and a PA may be mounted in the active element 22, and components such as a resistor, an inductor, and a capacitor may be mounted in the passive element 24.

The active element 22 and the passive element may be mounted after the SAW element 20 is mounted as described above, but may be mounted before the SAW element 20 is mounted.

Next, as shown in FIG. 4C, on the substrate 10 on which the SAW element 20, the active element 22, and the passive element 24 are mounted, the SAW element 20 and the active element ( The molding layer 30 is formed to cover 22 and the passive element 24.

The molding layer 30 may serve to protect the SAW device 20, the active device 22, the passive device 24, and the like, which may be formed of a liquid epoxy or EMC.

Next, as shown in FIG. 4D, a portion of the molding layer 30 between the SAW elements 20 is removed to form a groove 31 exposing a portion of the upper surface of the upper ground pattern 11.

Next, as shown in FIG. 4E, the electromagnetic shielding layer 40 is formed on the surface of the molding layer 30 including the inside of the groove 31.

The electromagnetic shielding layer 40 is to prevent the effects of Electro Magnetic Interference (EMI) on the SAW device 20, and may be made of a metal material, for example, a material including at least one of Ag and Cu.

In this case, the electromagnetic shielding layer 40 may be formed by at least one of plating, spraying and sputtering.

According to the manufacturing method of the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention, the molding layer 30 including the groove portion 31 through which the electromagnetic shielding layer 40 exposes the upper ground pattern 11. The electromagnetic wave shielding layer 40 and the upper ground pattern 11 may be directly connected to each other.

Therefore, according to the manufacturing method of the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention, it is possible to effectively prevent the inflow and outflow of the noise signal, thereby providing a high frequency module having excellent electromagnetic shielding performance.

Next, as shown in FIG. 4F, the resultant is cut along a dicing line D and separated into individual high frequency module units as shown in FIG. 4G.

That is, a plurality of high frequency modules can be obtained by cutting the electromagnetic shielding layer 40 and the substrate 10 using a line passing through the center of the groove 31 as the dicing line D. FIG.

As described above, according to the manufacturing method of the high frequency module including the surface acoustic wave device according to the first embodiment of the present invention, a plurality of high frequency modules can be simultaneously obtained through the cutting process, which is advantageous in mass production.

Next, a method of manufacturing a high frequency module including a surface acoustic wave device according to a second exemplary embodiment of the present invention will be described in detail with reference to FIGS. 5A to 5G.

5A to 5G are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a second exemplary embodiment of the present invention.

First, the substrate 10 is prepared as shown in FIG. 5A. A plurality of upper ground patterns 11 are provided on the substrate 10, and the upper ground is formed through the via electrode 12 formed in the substrate 10 to penetrate a portion of the substrate 10. A plurality of internal ground patterns 13 electrically connected to the pattern 11 are provided.

That is, the upper ground pattern 11 and the inner ground pattern 13 are provided on different layers, and they are electrically connected to each other by the via electrode 12 formed to pass through a portion of the substrate 10. .

After preparing the substrate 10 including the upper and inner ground patterns 11 and 13 and the via electrode 12, a plurality of external electrodes 14 are formed on the bottom surface of the substrate 10.

Next, as illustrated in FIG. 5B, one or more SAW elements 20 are mounted on the upper surface of the substrate 10 via the electrode pattern 21.

The SAW device 20 may include at least one of a SAW filter and a SAW duplexer.

Then, a plurality of active elements 22, a plurality of passive elements 24 and the like are mounted on the substrate 10. As described above, components such as an LNA, a switch, and a PA may be mounted in the active element 22, and components such as a resistor, an inductor, and a capacitor may be mounted in the passive element 24.

The active element 22 and the passive element may be mounted after the SAW element 20 is mounted as described above, but may be mounted before the SAW element 20 is mounted.

Next, as shown in FIG. 5C, on the substrate 10 on which the SAW element 20, the active element 22, and the passive element 24 are mounted, the SAW element 20 and the active element ( The molding layer 30 is formed to cover 22 and the passive element 24.

The molding layer 30 may be formed of a liquid epoxy or EMC.

Then, as shown in FIG. 5D, the molding layer 30 and the portion of the substrate 10 between the SAW elements 20 are removed to remove the upper ground pattern 11 and the inner ground pattern 13. The groove part 31 which exposes a part of is formed.

Here, in the second embodiment of the present invention, when the groove portion 31 is formed, the groove portion 31 extends to the inside of the molding layer 30 and the substrate 10 under the molding layer 30. By removing a part of the thickness of the substrate 10 together with the molding layer 30, the groove part 31 formed in the substrate 10 may have one side and an internal ground pattern of the upper ground pattern 11. Expose the top of 11).

Next, as shown in FIG. 5E, the electromagnetic shielding layer 40 is formed on the surface of the molding layer 30 including the inside of the groove 31.

The electromagnetic shielding layer 40 may be formed of a material including at least one of Ag and Cu, and may be formed by at least one of plating, spraying, and sputtering.

According to the manufacturing method of the high frequency module including the surface acoustic wave device according to the second embodiment of the present invention, the electromagnetic shielding layer 40 may be directly connected to the upper ground pattern 11 and the inner ground pattern 13. have.

Therefore, according to the manufacturing method of the high frequency module including the surface acoustic wave device according to the second embodiment of the present invention, the same operation and effect as in the first embodiment of the present invention can be obtained, and the electromagnetic shielding layer 40 has an upper ground pattern. Direct connection with the internal ground pattern 13 as well as the (11) can implement a high-frequency module with better electric wave shielding performance.

Next, as illustrated in FIG. 5F, the resultant is cut along a dicing line D and separated into individual high frequency module units as illustrated in FIG. 5G.

That is, a plurality of high frequency modules can be obtained by cutting the electromagnetic shielding layer 40 and the substrate 10 using a line passing through the center of the groove 31 as the dicing line D. FIG.

As described above, in the method of manufacturing the high frequency module including the surface acoustic wave device according to the second embodiment of the present invention, a plurality of high frequency modules can be simultaneously obtained through a cutting process cut along a dicing line as in the first embodiment. There is an advantage.

Next, a method of manufacturing a high frequency module including a surface acoustic wave device according to a third embodiment of the present invention will be described in detail with reference to FIGS. 6A to 6E.

6A through 6E are cross-sectional views sequentially illustrating a method of manufacturing a high frequency module including a surface acoustic wave device according to a third exemplary embodiment of the present invention.

First, as shown in FIG. 6A, the substrate 10 is prepared. A plurality of upper ground patterns 11 are provided on the substrate 10, and the upper ground is formed through the via electrode 12 formed in the substrate 10 to penetrate a portion of the substrate 10. A plurality of internal ground patterns 13 electrically connected to the pattern 11 are provided.

That is, the upper ground pattern 11 and the inner ground pattern 13 are provided on different layers, and they are electrically connected to each other by the via electrode 12 formed to pass through a portion of the substrate 10. .

After preparing the substrate 10 including the upper and inner ground patterns 11 and 13 and the via electrode 12, a plurality of external electrodes 14 are formed on the bottom surface of the substrate 10.

Next, as illustrated in FIG. 6B, one or more SAW elements 20 are mounted on the upper surface of the substrate 10 via the electrode pattern 21.

The SAW device 20 may include at least one of a SAW filter and a SAW duplexer.

Then, a plurality of active elements 22, a plurality of passive elements 24 and the like are mounted on the substrate 10. As described above, components such as an LNA, a switch, and a PA may be mounted in the active element 22, and components such as a resistor, an inductor, and a capacitor may be mounted in the passive element 24.

The active element 22 and the passive element may be mounted after the SAW element 20 is mounted as described above, but may be mounted before the SAW element 20 is mounted.

Next, as shown in FIG. 6C, on the substrate 10 on which the SAW element 20, the active element 22, and the passive element 24 are mounted, the SAW element 20 and the active element ( The molding layer 30 is formed to cover 22 and the passive element 24.

The molding layer 30 may be formed of a liquid epoxy or EMC.

Then, as shown in FIG. 6D, the molding layer 30 and the portion of the substrate 10 between the SAW elements 20 are removed to remove both the molding layer 30 and the substrate 10. Groove portions 31 are formed to expose one end of the upper ground pattern 11 and the inner ground pattern 13 while penetrating.

In the third embodiment of the present invention, when the groove 31 is formed, the groove 31 passes through both the molding layer 30 and the substrate 10 under the molding layer 30. By removing the entire thickness of the substrate 10 together with the molding layer 30, the groove 31 exposes one end of the upper and inner ground patterns 11 and 13.

Next, as shown in FIG. 6E, the electromagnetic shielding layer 40 is formed on the surface of the molding layer 30 including the inside of the groove 31, and then passes through the center of the groove 31. The resultant is cut using a line as a dicing line and separated into individual high frequency module units.

The electromagnetic shielding layer 40 may be formed of a material including at least one of Ag and Cu, and may be formed by at least one of plating, spraying, and sputtering.

According to the manufacturing method of the high frequency module including the surface acoustic wave device according to the third embodiment of the present invention, the electromagnetic shielding layer 40 may be directly connected to the upper ground pattern 11 and the inner ground pattern 13. have.

Therefore, according to the manufacturing method of the high frequency module including the surface acoustic wave device according to the third embodiment of the present invention, the same operation and effect as in the second embodiment of the present invention can be obtained, and the electromagnetic wave shielding layer 40 is provided on the substrate 10. It is formed to cover the entire side of the) to shield the noise signal generated from the side of the substrate 10 there is an advantage that can implement a high-frequency module with more excellent electric wave shielding performance.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

10: Substrate
11: upper ground pattern
12: via electrode
13: internal ground pattern
14: external electrode
20: SAW element
21: electrode pattern
22: active element
23: challenge bump
24: Passive Element
30: molding layer
31: home
40: electromagnetic shielding layer
D: Dicing Line

Claims (9)

A substrate having an upper ground pattern disposed on upper sides thereof, and having an inner ground pattern electrically connected to the upper ground pattern through a via electrode therein;
At least one SAW element mounted on the substrate;
A molding layer formed on the substrate so as to cover the SAW element and having groove portions at both sides thereof exposing the upper ground pattern; And
An electromagnetic shielding layer formed to cover the surface of the molding layer including the inside of the groove;
High frequency module including a surface acoustic wave device comprising a. The method of claim 1,
The groove part extends downward to the inside of the substrate to expose the internal ground pattern, the high frequency module including a surface acoustic wave device. The method of claim 1,
And the groove portion extends downward to the bottom surface of the substrate to expose both sides of the substrate including the internal ground pattern. The method of claim 1,
The SAW device includes a surface acoustic wave device comprising at least one of a SAW filter and a SAW duplexer. The method of claim 1,
The electromagnetic wave shielding layer is a high frequency module including a surface acoustic wave device, characterized in that made of a material containing at least one of Ag and Cu. The method of claim 1,
The electromagnetic wave shielding layer is a high frequency module including a surface acoustic wave device, characterized in that formed by at least one of the plating method, spray method and sputter method. Preparing a substrate having a plurality of upper ground patterns formed thereon and having a plurality of inner ground patterns electrically connected to the upper ground patterns through via electrodes therein;
Mounting at least one SAW device on an upper surface of the substrate;
Forming a molding layer on the substrate to cover the SAW device;
Removing a portion of the molding layer between the SAW elements to form a groove portion exposing the upper ground pattern;
Forming an electromagnetic shielding layer on a surface of the molding layer including the inside of the groove; And
Cutting the resultant along a dicing line to separate the individual high frequency module units;
Method of manufacturing a high frequency module including a surface acoustic wave device comprising a. Preparing a substrate having a plurality of upper ground patterns formed thereon and having a plurality of inner ground patterns electrically connected to the upper ground patterns through via electrodes therein;
Mounting at least one SAW device on an upper surface of the substrate;
Forming a molding layer on the substrate to cover the SAW device;
Removing a portion of the molding layer and the substrate between the SAW elements to form a groove portion exposing the upper ground pattern and the inner ground pattern;
Forming an electromagnetic shielding layer on a surface of the molding layer including the inside of the groove; And
Cutting the resultant along a dicing line to separate the individual high frequency module units;
Method of manufacturing a high frequency module including a surface acoustic wave device comprising a. The method of claim 8, wherein
Removing a portion of the molding layer and the substrate between the SAW elements to form a groove portion exposing the upper ground pattern and the inner ground pattern;
The substrate is a method of manufacturing a high frequency module including a surface acoustic wave device, characterized in that removed by a portion thickness or the entire thickness.

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