KR20120047193A - Illuminating device using led and method for manufacturing the same - Google Patents

Abstract

PURPOSE: An LED lighting apparatus and a manufacturing method thereof are provided to freely control an irradiation region of light which is emitted from a light emitting diode by installing a flexible printed circuit board of a cubic shape on a base. CONSTITUTION: A base(20) is installed in a main body. A light emitting module(50) comprises a flexible printed circuit board(30) and a plurality of light emitting diodes(40). The flexible printed circuit board has a flat shape corresponding to a development view of a predetermined cubic shape. The light emitting diode is mounted on the flexible printed circuit board and irradiates light of a fixed wavelength. The flexible printed circuit board is installed on a base as the predetermined cubic shape in order to cover a cubic shape of the base. Adhesive is spread on the upper side of the base and the lower side of the flexible printed circuit board.

Description

LED lighting fixtures and its manufacturing method {ILLUMINATING DEVICE USING LED AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to an LED lighting apparatus and a method for manufacturing the same, and more particularly, to an LED lighting apparatus using an LED light emitting module having a structure in which a plurality of light emitting chips are mounted on a flexible circuit board, and a manufacturing method thereof.

Recently, luminaires using LEDs (Light Emitting Diodes) as light sources have been in the spotlight. This LED lighting device has a lower power consumption than a general fluorescent lamp, and can be used semi-permanently due to the characteristics of the LED, and since it does not contain harmful substances such as mercury or lead, it has an advantage of being environmentally friendly. On the other hand, since the amount of light per LED light source is insufficient compared to the general light bulb, it is required to use a plurality of LEDs mounted on the substrate as a light source to obtain a constant illuminance.

In general, an LED lighting device to which a plurality of LED light sources are applied has a structure in which the LED modules of the plurality of surface mount package structures are mounted on a substrate having a flat plate shape or a predetermined columnar shape.

Since the LED lighting device configured as described above is mounted with each of the plurality of LED modules on the substrate, the assembly labor for mounting each of the plurality of LEDs in accordance with the shape of the substrate is complicated, there is a disadvantage that the manufacturing cost is high. In addition, the LED lighting apparatus of the type mounted LED module on a flat substrate has a disadvantage that the illumination area is limited because the direct angle of the light irradiated from each LED module arranged on the same plane.

In addition, the conventional LED lighting fixture is mounted on the LED module separately packaged on the substrate, there is a disadvantage that can not efficiently dissipate heat generated in the LED module during illumination.

The present invention has been made in view of the above-described points, an LED lighting apparatus having a structure in which a light emitting chip can be extended by using an LED light emitting module having a structure mounted on a flexible circuit board, and a manufacturing method thereof. The purpose is to provide.

In order to achieve the above object, the LED lighting device according to the present invention includes a main body having a socket coupling portion; A base installed in the main body; And a light emitting module having a planar shape corresponding to a developed view of a predetermined three-dimensional shape, and a light emitting module mounted on the flexible circuit board and having a plurality of light emitting chips for irradiating light of a predetermined wavelength, wherein the flexible circuit board has a predetermined shape. It is installed on the base in a three-dimensional shape.

The base may have a three-dimensional shape in which an upper surface thereof protrudes a predetermined height or a predetermined depth is inserted, and the flexible circuit board may be installed on the base to cover the three-dimensional shape of the base.

The present invention may further include an adhesive applied to at least one of an upper surface of the base and a lower surface of the flexible circuit board facing the base, to bond the base to the light emitting module.

The base may protrude a predetermined height to a predetermined depth into any one of a cone, a truncated cone, a polygonal pyramid, and a polygonal truncated cone shape with respect to the main body.

In addition, the upper surface of the base has a planar shape, and the light emitting module further includes an installation unit extending from the flexible circuit board, and through the installation unit, the light emitting module may be installed on the base.

The base may have a planar shape corresponding to a three-dimensional development of the flexible circuit board, and the base and the flexible circuit board may be bent by forming the base in a state in which the flexible circuit board is mounted on the base. It can be formed by steric formation.

The flexible circuit board includes: a first substrate provided on the base and partitioned into a plurality of first conducting regions by a predetermined pattern; A second substrate including an electrode to which power is applied and divided into a plurality of second conducting regions by a predetermined pattern; An insulating layer interposed between the first substrate and the second substrate, the insulating layer electrically insulating the first substrate and the second substrate, wherein at least one conducting region of the plurality of first conducting regions is formed; At least one of the plurality of second conducting regions may be electrically connected through a conducting path formed through the insulating layer.

Each of the plurality of light emitting chips may be mounted on at least one of an upper portion of the second conductive region and an upper portion of the insulating layer of the second substrate, and electrically connected to the plurality of second conductive regions.

The flexible circuit board may be formed in a polygonal pyramid shape having a plurality of plate surfaces, and the energization region of the first substrate may be formed to avoid boundary portions of each of the plurality of plate surfaces.

In addition, at least one of the second substrate and the insulating layer may be made of a flexible material.

The light emitting module may further include a reflective layer formed on an area other than a region in which the plurality of light emitting modules are mounted on the flexible circuit board to reflect light emitted from each of the plurality of light emitting chips.

In addition, the LED lighting apparatus according to the present invention may further include a converter for converting the input AC power into a DC power, and applying a DC power to the light emitting chip.

In addition, the LED lighting apparatus according to the present invention may be installed on the main body, and may further include a cover member for covering the base and the light emitting module.

In addition, an LED lighting device manufacturing method according to the present invention for achieving the above object comprises the steps of mounting a plurality of light emitting chips for irradiating light of a predetermined wavelength on a flexible circuit board; Cutting the flexible printed circuit board on which the light emitting chip is mounted into a planar shape corresponding to a developed view of a predetermined three-dimensional shape; And bonding the cut flexible printed circuit board in a three-dimensional shape to a main body having a socket coupling part.

In addition, the LED lighting device manufacturing method according to the present invention for achieving the above object comprises the steps of cutting the flexible circuit board into a planar shape corresponding to the development of a predetermined three-dimensional shape; Mounting a plurality of light emitting chips for irradiating light of a predetermined wavelength on the cut flexible printed circuit board; And installing the cut flexible printed circuit board in a body having a socket coupling part.

Since the LED lighting device and the manufacturing method according to the present invention configured as described above includes a structure in which a light emitting chip is mounted on a flexible circuit board, the flexible circuit board is cut to correspond to a predetermined three-dimensional shape and bonded onto a base. It is possible to lower assembly labor and manufacturing cost, and to improve heat dissipation efficiency.

In addition, by installing a three-dimensional flexible circuit board having a light emitting chip mounted thereon on a base, the advantage that the light control area of the light emitted from the light emitting chip can be freely adjusted as compared to the method in which each LED module is arranged on the same plane. have.

1 is a schematic partial cross-sectional view showing an LED lighting device according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view illustrating a flexible circuit board and a base on which a light emitting chip mounted on the LED lighting apparatus according to the first embodiment of the present invention is mounted.
3 and 4 are a plan view and a bottom view of the flexible circuit board mounted with the light emitting chip is applied to the LED lighting apparatus according to the first embodiment of the present invention.
5A to 5C are schematic perspective views showing modifications of the base of the LED lighting device according to the first embodiment of the present invention.
Figure 6 is a schematic cross-sectional view showing an example of a light emitting module of the LED lighting fixture according to the first embodiment of the present invention.
Figure 7 is a schematic cross-sectional view showing another example of the light emitting module of the LED lighting apparatus according to the first embodiment of the present invention.
8 is a schematic cross-sectional view showing still another example of the light emitting module of the LED lighting apparatus according to the first embodiment of the present invention.
Figure 9 is a schematic cross-sectional view showing the LED lighting fixture according to a second embodiment of the present invention.
10 is a perspective view showing a flexible circuit board mounted with a light emitting chip applied to the LED lighting apparatus according to the second embodiment of the present invention.
FIG. 11 is an exploded perspective view illustrating a flexible circuit board mounted with a light emitting chip applied to an LED lighting apparatus according to a third embodiment of the present invention. FIG.
12 and 13 are a plan view and a bottom view of a flexible circuit board having a light emitting chip mounted thereon, which is applied to an LED lighting apparatus according to a third embodiment of the present invention.
14 is a schematic perspective view showing a base according to a modification of the LED lighting apparatus according to the fourth embodiment of the present invention.
FIG. 15 is a cross-sectional view taken along line XV-XV of FIG. 14, showing a light emitting chip mounted on an upper portion of the base;
16 is a perspective view of main parts of the LED lighting device according to the fourth embodiment of the present invention;
17 is a schematic partial cross-sectional view showing an LED lighting device according to a fifth embodiment of the present invention.
FIG. 18 is a schematic view illustrating a folded state of a base of an LED lighting fixture and a flexible circuit board on which a light emitting chip is mounted so as to be installed on the base according to the fifth embodiment of the present invention. FIG.
19 is a flow chart showing a manufacturing process of the LED lighting fixture according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail an LED lighting device and a manufacturing method according to a preferred embodiment of the present invention.

1 is a schematic partial cross-sectional view showing an LED lighting apparatus according to a first embodiment of the present invention, Figure 2 is a flexible circuit board mounted with a light emitting chip applied to the LED lighting apparatus according to the first embodiment of the present invention; An exploded perspective view showing the base.

Referring to FIG. 1, the LED lighting apparatus according to the first embodiment of the present invention includes a main body 10, a base 20 installed on the main body 10 and having an upper surface formed in a three-dimensional shape, and the base 20. It includes a light emitting module 50 installed on. Here, the light emitting module 50 includes a flexible circuit board 30 and a plurality of light emitting chips 40 mounted on the flexible circuit board 30 and irradiating light having a predetermined wavelength.

The LED bulb according to the present invention is installed compatible with an electric socket (not shown) to which a conventional incandescent lamp or the like is coupled. To this end, the body 10 includes a socket coupling portion 11 that is coupled to the electrical socket. The main body 10 includes an installation part 13 on which the base 20 is installed. In addition, the main body 10 includes a heat dissipation unit 15 for dissipating heat generated by the light emitting module 50 to the outside. The heat dissipation part 15 is provided with a plurality of air flow openings 15a penetrating inside and outside, thereby improving heat dissipation efficiency.

The base 20 is mounted to the installation part 13 of the main body 20 and mounts the light emitting module 50 on the upper surface thereof. The base 20 has an upper surface formed in a predetermined three-dimensional shape so that the dimming area of the light irradiated from the light emitting chip 40 mounted on the flexible circuit board 30 can be set. That is, the base 20 may be formed to protrude a predetermined height with respect to the installation portion 13 or to be formed at a predetermined depth.

As the LED lighting device according to the first embodiment, as shown in Figs. 1 and 2, the base 20 having a truncated cone shape 21 is shown as an example. In this case, the developed view of the top surface three-dimensional shape of the base 20 has an arc shape (see FIG. 3 showing a flexible circuit board shape) having a predetermined angle. Here, the developed view means a view showing a state in which a three-dimensional shape is unfolded on a two-dimensional plane.

 In addition, the base 20 performs a heat sink function to dissipate heat generated when the light emitting chip 40 is driven. To this end, the base 20 may be made of a metal material such as copper having high thermal conductivity. Heat conducted through the base 20 is discharged to the outside of the LED lighting fixture through the heat dissipation unit 15.

3 and 4 are a plan view and a bottom view showing a developed state of a flexible circuit board mounted with a light emitting chip applied to the LED lighting apparatus according to the first embodiment of the present invention.

3 and 4, the flexible printed circuit board 30 has a planar shape corresponding to an exploded view of the top three-dimensional shape of the base 10. The flexible circuit board 30 is a flexible circuit board, and the board surface can be easily bent. Therefore, in installing the flexible printed circuit board 30 on the base 20, by bending the shape of the flexible printed circuit board 30 to the shape corresponding to the top surface three-dimensional shape of the base 20, as shown in FIG. The base 20 may be mounted in a state of covering a top three-dimensional shape of the base 20. Here, in order to install the flexible circuit board 30 on the base 20, the present invention may further include an adhesive 60 for bonding the base 20 and the flexible circuit board 30. As shown in FIG. 2, the adhesive 60 may be applied to at least one of the upper surface of the base 20 and the lower surface of the flexible circuit board 30 facing the same by using the spray 65. have. FIG. 2 is only an example of applying the adhesive 60, and may be modified in various ways, such as an adhesive tape, in addition to the coating method by the spray 55.

In addition to the truncated cone shape as shown in FIGS. 1 and 2, the base 20 has a cone shape 23, a polygonal truncated cone shape 25 such as a square truncated cone, and a pyramid as shown in FIGS. 5A to 5C, respectively. It may be formed in the same three-dimensional shape, such as the polygonal pyramid shape (27).

In addition, the LED lighting apparatus according to an embodiment of the present invention may further include a cover member (70 in FIG. 1). The cover member 70 is installed on the main body 10 and covers the base 31, the flexible circuit board 30, and the light emitting chip 40. The cover member 70 is made of a transparent or translucent material so that the light irradiated from the light emitting chip 40 can be irradiated to the outside.

In addition, the LED lighting device according to the first embodiment of the present invention may further include a converter (80). The converter 80 converts the input AC power into DC power and applies DC power to the light emitting chip 40. As such, when the converter 80 is built into the main body 10, there is an advantage that the present invention can be applied without a separate external converter structure when the luminaire according to the present invention is applied to an environment where AC power is applied. Therefore, the present invention can be interchangeably applied to household electric sockets to which ordinary incandescent lamps are fitted.

The plurality of light emitting chips 40 are directly mounted on the flexible circuit board 30. 2 to 4 and 6 to 8, the structure of the flexible printed circuit board 30 and the light emitting chip 40 mounted on the flexible printed circuit board 30 will be described in detail.

6 to 8 are schematic cross-sectional views showing examples of the light emitting module of the LED lighting apparatus according to the first embodiment of the present invention.

2 to 4 and 6 to 8, the flexible circuit board 30 is a portion that is installed in a three-dimensional shape on the base 20, and has a predetermined planar shape until it is installed on the base 20. Have Here, the flexible printed circuit board 30 is cut into a planar shape corresponding to the developed view of the top three-dimensional shape of the base 20. The cutting of the flexible circuit board 30 may be performed after mounting the light emitting chip 40. In addition, it is also possible to cut the flexible printed circuit board 30 in a planar shape corresponding to the development of a predetermined three-dimensional shape in the process before mounting the light emitting chip 40 on the flexible printed circuit board 30.

The flexible circuit board 30 may include first and second substrates 31 and 35 and an insulating layer 33. The first substrate 31 is provided on the base 20 and divided into a plurality of first conducting regions 31a by a predetermined pattern. The second substrate 35 includes an electrode 36 to which power is applied, and is divided into a plurality of second conducting regions 35a by a predetermined pattern.

The insulating layer 33 is interposed between the first substrate 31 and the second substrate 35 to electrically insulate the first substrate 31 and the second substrate 35. The insulating layer 33 may be formed on the first substrate 31 by curing or applying a ceramic coating or an insulating adhesive. Here, a plurality of via holes 34 are formed in the insulating layer 33 to form a conductive path between the first substrate 31 and the second substrate 35, and a conductor is filled therein.

Therefore, at least one conduction region of the plurality of first conduction regions 31a and at least one conduction region of the plurality of second conduction regions 35a are electrically connected to each other through a conduction path by a conductor in the via hole 34. Will be interconnected. For example, one conduction region of the second substrate 35 indicated by reference numeral a1 of FIG. 3 is electrically connected to two conduction regions of the first substrate 31 indicated by reference numerals a2 and a3 of FIG. 4, respectively. do.

Each of the plurality of light emitting chips 40 is mounted on the second conducting region 35a or the insulating layer 33 of the second substrate 35 and electrically connected to the plurality of second conducting regions 35a.

Therefore, the second conducting region 35a, the plurality of light emitting chips 40 and the first conducting region electrically connected to the second conducting region 35a between the two electrodes 36 of the second substrate 35. Configure the energization path through 31a).

Each of the first and second substrates 31 and 35 is formed on the insulating layer 33 so as to be divided into a plurality of conductive regions through a semiconductor patterning process or the like.

Each of the light emitting chips 41 constituting the plurality of light emitting chips 40 may be mounted on the conduction region 35a of the second substrate 35 as shown in FIG. 6, or as shown in FIG. 7. Can be mounted on 33. That is, the light emitting chip 41 may be mounted on the insulating layer 33 or the second substrate 35 by a die bonding method, and the second substrate having a predetermined pattern by bonding using the wire 43. It is electrically connected to (35).

The light emitting chip 40 irradiates light having a predetermined wavelength when power is applied through a predetermined conductive path, and may include an LED (Light Emitting Diode) or a semiconductor laser (LD). The LED lighting apparatus according to the present embodiment may include an LED light emitting chip for emitting blue light or ultraviolet light as the light emitting chip 40.

In addition, the present invention is made of a material such as phosphors, phosphors, etc., as shown in Figure 6 and 7, the wavelength applied to the light emitting chip 41 and irradiated from the light emitting chip 41 to convert the wavelength The conversion member 39 may further include. In this case, when a blue LED or an ultraviolet LED is employed as the light emitting chip 41, white light can be irradiated by a combination of light irradiated from the LED and light having a predetermined wavelength excited by the wavelength conversion member 39. have. Here, in coating and forming the wavelength conversion member 39 on the light emitting chip 41, the light emitting chip 20 may be mounted on the insulating layer 33 or the electrode 35.

In addition, the light emitting module 50 of the LED lighting apparatus according to the present invention, as shown in Figure 8, to form a dam 138 at a predetermined height around the light emitting chip 41, the wavelength conversion into a lens shape therein The member 139 may be formed. In this case, the light emitting module 50 may illuminate white light and adjust the emission angle of the irradiated light according to the shape of the wavelength conversion member 139.

As described above, when the light emitting chip 40 is mounted on the flexible circuit board 30 in a direct manner, the thickness of the light emitting chip 40 is about 1/5 of that of the conventional method of mounting the light emitting chip on the substrate by surface mounting. I can make it slim. Accordingly, the flexible printed circuit board 30 on which the light emitting chip 40 is mounted can be freely bent to match the shape of the top surface of the base 31.

In the present embodiment, as the light emitting module 50, the chip on board (COB) method in which the light emitting chip 40 is directly mounted on the flexible circuit board 30 has been described as an example. The light emitting module applied to the LED lighting device according to the present invention is not limited thereto. For example, a configuration including a configuration in which a light emitting chip is mounted on a flexible circuit board by a surface mount method may be possible.

In addition, the light emitting module 50 may further include a reflective layer 37 formed on the second substrate 35 as shown in FIGS. 6 and 7. The reflective layer 37 is formed on a region other than the region in which the plurality of light emitting chips 40 are mounted on the second substrate 35 to reflect light emitted from each of the plurality of light emitting chips 40, thereby increasing light efficiency. Can be.

In the LED lighting device according to the embodiment of the present invention configured as described above, the light emitting chip is mounted in a state in which a plurality of light emitting chips are directly mounted on a planar flexible circuit board that is cut to correspond to the top plan view of the base. The base and the flexible circuit board can be formed by joining the mounted flexible circuit board with the adhesive in a bent state conforming to the three-dimensional shape of the base. Therefore, assembly labor and manufacturing cost can be greatly reduced.

In addition, according to the present invention, since the light emitting chip can be arranged in a three-dimensional shape based on the base, it is possible to freely adjust the dimming area of the light irradiated from the light emitting chip as compared to the method in which each LED module is arranged on the same plane.

FIG. 9 is a schematic cross-sectional view of an LED lighting apparatus according to a second embodiment of the present invention, and FIG. 10 is a flexible circuit board mounted with a light emitting chip applied to the LED lighting apparatus according to the second embodiment of the present invention. Perspective view.

Referring to the drawings, the LED lighting device according to the second embodiment of the present invention is installed on the main body 10, the main body 10, the upper surface of the base 120 is formed in a three-dimensional shape, and the light emission is installed on the base 120 Module 150. Here, the light emitting module 150 includes a flexible circuit board 130 and a plurality of light emitting chips 140 mounted on the flexible circuit board 130. The base 120 may have a top surface having a planar shape, unlike the base 20 of the LED lighting apparatus according to the first embodiment. In this case, the light emitting module 150 may further include an installation unit 135 extending from the flexible circuit board 130, and the light emitting module 150 may be flat on the base 120 through the installation unit 135. It may be installed in a three-dimensional shape on the side of the base or base 120.

FIG. 11 is an exploded perspective view illustrating a flexible circuit board on which a light emitting chip is applied, which is applied to an LED lighting device according to a third embodiment of the present invention. 12 and 13 are a plan view and a bottom view showing a developed state of a flexible circuit board on which a light emitting chip is applied, which is applied to an LED lighting apparatus according to a third embodiment of the present invention.

In comparison with the LED lighting apparatus according to the first embodiment, the LED lighting apparatus according to the third embodiment of the present invention has a base shape of a polygonal pyramid shape or a polygonal pyramid shape and fits the shape of the flexible circuit board to the base. It is distinguished by a change. As shown in 5b and FIG. 5c, the base 220 protrudes from the edge toward the center, and may be configured such that an upper surface thereof has a polygonal pyramidal shape or a polygonal pyramid shape. 5B and 5C each show a case where the base 20 has a quadrangular pyramid 25 and a quadrangular pyramid shape 27 as an example.

11 and 12, the flexible printed circuit board 230 has a planar shape corresponding to a developed view of a polygonal pyramid consisting of a plurality of plate surfaces. As shown in FIG. 11, the flexible circuit board 230 is formed of four plate surfaces 230a, 230b, 230c, and 230d when it corresponds to the development of the quadrangular pyramid shape, and the boundary portion 230e between the plate surface and the plate surface. Bent along to form a three-dimensional shape. The flexible circuit board 230 includes first and second substrates 231 and 235 and an insulating layer 233. The first substrate 231 is partitioned into a plurality of first conducting regions 231a by a predetermined pattern. Here, the energization region 231a of the first substrate 231 may be formed to avoid the boundary portion 230e of each of the plurality of plate surfaces. Accordingly, when the flexible circuit board 230 is bent to form a three-dimensional shape, the folding of the first substrate 231 may be fundamentally prevented.

Each of the second substrate 235 and the insulating layer 233 is made of a flexible material and can easily bend the plate surface. The second substrate 235 is divided into a plurality of second conducting regions 235a by a predetermined pattern.

Therefore, in installing the flexible circuit board 230 on the base 220, by bending the shape of the flexible circuit board 230 to a shape corresponding to the top surface three-dimensional shape of the base 220, as shown in FIG. The upper surface of the base 220 may be mounted in a state of covering a polygonal pyramid.

As described above, the base 220 is formed into a polygonal pyramid shape, and the flexible circuit board 230 is bent to form a top surface of the base 220 to thereby expand the dimming area to a region corresponding to the polygonal pyramid shape. The advantage is that you can.

14 is a schematic perspective view showing a base according to a modification of the LED lighting apparatus according to the fourth embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along line XV-XV of FIG. 14, in which a light emitting chip is mounted on the base. The figure shows. 16 is a perspective view of main parts of the LED lighting device according to the fourth embodiment of the present invention.

The LED lighting apparatus according to the fourth embodiment of the present invention is compared with the LED lighting apparatus according to the third embodiment in that the shape of the base 320 is changed and the manufacturing process of the LED lighting apparatus is changed. Are distinguished.

The base 320 according to the present embodiment includes a plurality of bendable plate surfaces 321. The plate surface 321 corresponds to the planar flexible circuit board 230 corresponding to the development view of the polygonal pyramid consisting of the plurality of plate surfaces 230a, 230b, 230c, and 230d described with reference to FIGS. 11 and 12. That is, the plate surface 321 of the base 320 may include four plate surfaces 321a, 321b, 321c, and 321d.

In addition, the first bent groove 323 is formed at the boundary between the plate surface and the plate surface, thereby forming a three-dimensional shape by bending along the first bent groove 323. Here, the coupling part 325 extending from each plate surface 321 of the base 320 may be further included. A fastening hole 325a is formed in the fastening part 325 and can be installed in the main body of the LED lighting apparatus by screwing through the fastening hole 325a. Here, the second bending groove 327 is formed between the fastening portion 325 and each plate surface 321, the plate surface 321 is bent with respect to the fastening portion 325 when bending the base 320 in a three-dimensional shape. You can do that.

14 illustrates that the plate surface of the base 320 is composed of four plate surfaces as an example, but this is merely exemplary and may be configured with a plurality of plate surfaces having various numbers other than four. In addition, in addition to the fastening portion 321, it is also possible to be configured to be bent at least two times in addition to the configuration that can be bent once, as shown in Figure 14, can be fastened to the main body in various ways other than screwing.

Hereinafter, when the base 320 is provided as described above, the three-dimensional shape forming process will be described.

Referring to FIG. 15, in the state where the plate surface 321 of the base 320 is developed, the flexible circuit board 230 having a shape that is developed on each plate surface 321 of the base 320 is adhesively formed.

Subsequently, by bending along the boundary portions (230e of FIG. 12) of the first and second bent grooves 320e and 322b of the base 320 and the flexible printed circuit board 230, a three-dimensional shape as shown in FIG. 16. This can be done. In this way, the assembly process is completed by mounting the base 320 and the flexible circuit board 230 in the form of a three-dimensional shape to the body of the LED lighting fixture.

As described above, the three-dimensional shape can be easily manufactured by manufacturing the three-dimensional shape by using the base 320 and the flexible circuit board 230 having the planar shape.

17 is a schematic partial cross-sectional view showing an LED lighting apparatus according to a fourth embodiment of the present invention, Figure 18 is a base of the LED lighting apparatus according to the fourth embodiment of the present invention and the light emitting module to be installed on the base A schematic drawing showing the folded state.

LED lighting apparatus according to the fourth embodiment of the present invention is compared with the LED lighting apparatus according to the first and second embodiments, the shape of the base 320 and the bending direction of the flexible circuit board 330 Are distinguished in that respect.

Referring to the drawings, the base 220 may be formed in a shape formed inlet toward the center portion from the edge. Here, the inserted shape may have a cone shape or a polygonal shape. 17 and 18 illustrate an example in which the base 220 is formed in an arc-shaped groove shape.

The flexible circuit board 230 has a planar shape corresponding to the top plan view of the base 10. The flexible circuit board 230 is a flexible circuit board, and the plate surface can be easily bent. Thus, in installing the flexible circuit board 230 on the base 220, by bending the shape of the flexible circuit board 230 to a shape corresponding to the top surface three-dimensional shape of the base 220, as shown in FIG. The cover 220 may be mounted in a state of covering the concave shape of the upper surface of the base 220.

As described above, the base 220 is formed in a concave shape, and the flexible circuit board 230 is bent to form the top surface of the base 220 so as to freely illuminate according to the top surface shape of the base 220. The advantage is that you can adjust the area. In addition, by adhering the flat flexible circuit board 230 having the light emitting chip 40 mounted thereon in accordance with the shape of the upper surface of the base, the light emitting chip for the base can be mounted, thereby making the manufacturing process compact. There is this.

3, 4 and 17, the LED lighting apparatus manufacturing method according to an embodiment of the present invention will be described in detail.

LED lighting device manufacturing method according to an embodiment of the present invention is largely made of three steps.

First, a flexible circuit board is prepared, and a plurality of light emitting chips for irradiating light of a predetermined wavelength is mounted on the flexible circuit board (S10).

As described with reference to FIGS. 3 and 4, the flexible circuit board may include a first substrate 31 partitioned into a plurality of first conducting regions 31a and an electrode 36 to which power is applied. And a second substrate 35 partitioned into the second conducting region 31b by a predetermined pattern, and an insulating layer 33 interposed between the first substrate 31 and the second substrate 35. Here, a via hole 37 is formed in the insulating layer 33, and a conductive path between the first conducting region 31a and the second conducting region 35a can be formed through the via hole 37. . Each of the plurality of light emitting chips 40 is mounted on the second conducting region 35a and / or the insulating layer 33, and is electrically connected in series and / or in parallel to the plurality of second conducting regions 35a.

Subsequently, the flexible printed circuit board 30 on which the light emitting chip 40 is mounted is cut into a planar shape corresponding to the developed view of a predetermined three-dimensional shape (S20).

The cut flexible printed circuit board is bonded to the body having a socket coupling portion in a three-dimensional shape (S30).

In the present embodiment, a plurality of light emitting chips 40 are mounted on the flexible printed circuit board 30 and then the flexible printed circuit board is cut as an example, but the present invention is not limited thereto. The flexible printed circuit board may be first cut into a shape, and then a plurality of light emitting chips may be mounted on the cut flexible printed circuit board.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

10: main body 20, 120, 220, 320: base
50: light emitting module 30, 130, 230: flexible circuit board
31, 131: first substrate 33, 133: insulating layer
35, 135: second substrate 36: electrode
40: light emitting chip 60: cover member
80: converter

Claims (20)

In the LED lighting fixture,
A main body having a socket coupling portion;
A base installed in the main body;
It includes a flexible circuit board having a planar shape corresponding to the development of a predetermined three-dimensional shape, and a light emitting module having a plurality of light emitting chips mounted on the flexible circuit board and irradiating light of a predetermined wavelength,
The flexible circuit board is an LED lighting device, characterized in that installed on the base in a predetermined three-dimensional shape. The method of claim 1,
The base has a three-dimensional shape, the upper surface of which protrudes a predetermined height or is introduced into a predetermined depth,
And the flexible circuit board is installed on the base to cover the three-dimensional shape of the base. The method of claim 2,
And an adhesive applied to at least one of an upper surface of the base and a lower surface of the flexible circuit board facing the base, and bonding an adhesive to the base and the light emitting module. The method of claim 2,
The base is an LED luminaire, characterized in that protruding a predetermined height to a predetermined depth in any one of the shape of a cone, a truncated cone, a polygonal pyramid and a polygonal truncated cone. The method of claim 1,
The base has a planar shape at its upper surface,
The light emitting module further includes an installation unit extending from the flexible circuit board.
LED luminaire, characterized in that through the installation unit, the light emitting module is installed on the base. The method of claim 1,
The base has a planar shape corresponding to the developed view of the three-dimensional shape of the flexible circuit board,
And bending the base in a state in which the flexible circuit board is mounted on the base, wherein the base and the flexible circuit board are formed in a three-dimensional form. The method of claim 1,
The flexible circuit board,
A first substrate disposed on the base and partitioned into a plurality of first conducting regions by a predetermined pattern;
A second substrate including an electrode to which power is applied and divided into a plurality of second conducting regions by a predetermined pattern;
An insulating layer interposed between the first substrate and the second substrate and electrically insulating the first substrate and the second substrate;
At least one conduction region of the plurality of first conduction regions and at least one conduction region of the plurality of second conduction regions are electrically connected through an conduction path formed through the insulating layer. Lighting fixtures. The method of claim 7, wherein
Each of the plurality of light emitting chips,
The LED lighting device is mounted on at least one of the upper portion of the second conducting region of the second substrate and the upper portion of the insulating layer, and electrically connected to the plurality of second conducting regions. The method of claim 8,
LED lighting device, characterized in that at least one of the second substrate and the insulating layer is made of a flexible material. The method of claim 7, wherein
The flexible circuit board is formed in a polygonal pyramid shape consisting of a plurality of plate surfaces,
And an electricity supply area of the first substrate is formed by avoiding a boundary portion of each of the plurality of plate surfaces. The method according to any one of claims 1 to 10,
The light emitting module,
And a reflection layer formed on a region other than a region in which the plurality of light emitting modules are mounted on the flexible circuit board and reflecting light emitted from each of the plurality of light emitting chips. The method according to any one of claims 1 to 10,
The LED lighting apparatus further comprises a converter for converting the input AC power into a DC power, and applying a DC power to the light emitting chip. The method of claim 12,
The LED lighting device is installed on the main body, further comprising a cover member for covering the base and the light emitting module. Mounting a plurality of light emitting chips for irradiating light of a predetermined wavelength on the flexible circuit board;
Cutting the flexible printed circuit board on which the light emitting chip is mounted into a planar shape corresponding to a developed view of a predetermined three-dimensional shape;
And a step of joining the cut flexible circuit board in a three-dimensional shape to a main body having a socket coupling part. Cutting the flexible circuit board into a planar shape corresponding to a developed view of a predetermined three-dimensional shape;
Mounting a plurality of light emitting chips for irradiating light of a predetermined wavelength on the cut flexible printed circuit board;
And installing the cut flexible printed circuit board in a main body having a socket coupling part. The method according to claim 14 or 15,
The flexible circuit board,
A first substrate provided on the main body and partitioned into a plurality of first conducting regions by a predetermined pattern;
A second substrate including an electrode to which power is applied and divided into a plurality of second conducting regions by a predetermined pattern;
An insulating layer interposed between the first substrate and the second substrate and electrically insulating the first substrate and the second substrate;
At least one conduction region of the plurality of first conduction regions and at least one conduction region of the plurality of second conduction regions are electrically connected through an conduction path formed through the insulating layer. Method of manufacturing lighting fixtures. The method of claim 16,
Each of the plurality of light emitting chips,
The LED lighting device manufacturing method of claim 2, wherein the second substrate is mounted on at least one of an upper portion of the second conductive region and the upper portion of the insulating layer, and is electrically connected to the plurality of second conductive regions. The method of claim 17,
The flexible circuit board is formed in a polygonal pyramid shape consisting of a plurality of plate surfaces,
And a conduction region of the first substrate is formed to avoid boundary portions of each of the plurality of plate surfaces. The method of claim 18,
At least one of the second substrate and the insulating layer is made of a flexible material. The method of claim 16,
The light emitting module,
And a reflecting layer formed on a region other than a region in which the plurality of light emitting modules are mounted on the flexible circuit board, and reflecting light emitted from each of the plurality of light emitting chips.

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