KR20120041587A - Sample inspection system and method of inspection using the same - Google Patents

Abstract

PURPOSE: A sample inspecting system and sample inspecting method using the same are provided to improve the accuracy of an inspection through microscopically inspecting the sample without optical distortion by using a scanning electron inspection device. CONSTITUTION: A sample inspecting system comprises a first optical inspection device, a second optical inspection device, a scanning electron inspection device(200), and a robot arm(300). The first optical inspection device magnifies and observes a sample in macro or the meso units. The second optical inspection device is signally connected to the first optical inspection device. The second optical inspection device magnifies and observes a sample in a micro unit. The scanning electron inspection device is signally connected to the first optical inspection device and second optical inspection device. The scanning electron inspection device projects electric beams, thereby magnifying and observing the sample. The robot arm respectively transfers the sample to the first optical inspection device, the second optical inspection device, and the scanning electron inspection device.

Description

Sample Inspection System and Sample Inspection Method Using The Same {SAMPLE INSPECTION SYSTEM AND METHOD OF INSPECTION USING THE SAME}

The present invention relates to a sample inspection system and a sample inspection method using the same, and relates to a sample inspection system and a sample inspection method using the same that can improve the inspection accuracy of the sample.

In order to manufacture high-efficiency light emitting diodes, not only have high internal quantum efficiency, but also light extraction efficiency of light emitted to the outside must be improved. To this end, a plurality of irregularities having a thickness of 2 to 3 μm are generally formed on the substrate, thereby improving light extraction efficiency by using light refraction and diffuse reflection at the plurality of uneven interfaces. As the shape of the unevenness, various shapes of unevenness such as hemispherical shape or pyramid may be used.

At this time, the luminous efficiency of the light emitting diode is greatly influenced by the characteristics of the unevenness. That is, the luminous efficiency of the light emitting diode is determined by the presence or absence of defects of irregularities, the size and shape of the irregularities. Therefore, irregularities are formed on the substrate during the light emitting diode fabrication process or before the light emitting diode fabrication process, and the characteristics such as the presence or absence of defects, shape, size, etc. of the unevenness are analyzed.

In general, as an apparatus for analyzing irregularities, an optical system, which is a device capable of acquiring three-dimensional images without cutting a sample, is generally used. Optical systems include a Confocal Microscope, White Light Interferometry (WSI), Optical Phase Interferometry (PSI), Moire Measurement, Fizeau Interferometry, and the like. Here, Confocal Microscope, White Light Interferometry (WSI), Optical Phase Interferometry (PSI), and Fizeau Interferometry have a high resolution of less than 1 nm. However, it is difficult to observe the surface in the form of edge or edge where the light is severely distorted. For example, when observing a substrate on which a plurality of irregularities of 2 to 3 µm are formed on the substrate, the profile of the plurality of irregularities of the 2 to 3 µm pattern cannot be accurately known, and the kind, number, and number of defects are Sizes, etc. cannot be observed accurately. In addition, when the substrate having a sharp sharpened portion, for example, a substrate having pyramidal irregularities is inspected through an optical system, a light distortion phenomenon may occur in the sharpened portion. Thus, as shown in Fig. 5B, an image obtained by processing the image in a shape in which a partial region of the unevenness is recessed is obtained. Therefore, even if a defect occurs in the unevenness, it is difficult to accurately observe and determine the unevenness. In addition, when defects are observed in the unevenness, the unevenness forming process should be improved by using the same, and the difficulty of accurate observation and determination of the unevenness causes a problem in that the unevenness forming process cannot be improved. This may act as a cause of reducing the production yield of the light emitting diode.

One technical problem of the present invention is to provide a sample inspection system and a sample inspection method using the same that can improve the inspection accuracy of the sample.

Another technical problem of the present invention is to provide a sample inspection system capable of accurately inspecting a sample having a sharp sharpened portion and a sample inspection method using the same.

Another technical problem of the present invention is to provide an inspection system having an optical microscope and a scanning electron microscope, and a sample inspection method using the same.

The inspection system according to the present invention is connected to the first optical inspection device, the first optical inspection device for magnifying and observing the sample in macro or meso units, and the sample in micro units. A scanning electron inspection device (SEM) connected to the second optical inspection device for magnifying and observing the signal, the first optical inspection device and the second optical inspection device, and scanning and magnifying the specimen by scanning an electron beam, and the sample being first The robotic arm which transfers to an optical inspection apparatus, a 2nd optical inspection apparatus, and a scanning electron inspection apparatus each located is provided.

The scanning electronic inspection device is characterized in that the sample is processed in 3D.

A first stage corresponding to the lower side of the first optical inspection apparatus and supporting the sample; a second stage corresponding to the lower side of the second optical inspection apparatus and supporting the sample; And a supporting third stage.

And first to third horizontal moving parts for moving the first to third stages in a horizontal direction.

A first optical inspection device for magnifying and observing a sample in a macro or meso unit according to the present invention, a second optical inspection device for magnifying and observing a sample in micro units, and a scanning electron inspection device. A method of inspecting a sample using an inspection system, comprising: inspecting the entire sample using the first optical inspection device, determining whether the sample is defective, and determining whether the sample is defective, If this does not exist, the inspection of the sample is terminated, and if a defect exists in the sample, the sample is inspected using a second optical microscope according to the shape of the surface of the sample, or a scanning electron inspection device is used. Checking.

And determining the shape of the surface of the sample before inspecting the sample using a second optical inspection device or inspecting the sample using a scanning electronic inspection device.

The sample uses a plurality of irregularities formed on one side of the substrate.

When the unevenness | corrugation of the said sample is provided with a sharp part, the test | inspection using a scanning electron inspection apparatus is performed after the test | inspection using the said 1st optical inspection apparatus.

In the case where the unevenness of the sample does not have a sharp portion, the inspection using the second optical inspection apparatus is performed after the inspection using the first optical inspection apparatus, or the scanning electronic inspection apparatus after the inspection using the first optical inspection apparatus. Perform the test using.

At the time of the sample inspection using the second optical inspection device or the scanning electronic inspection device, a portion of the sample is enlarged and observed.

The second optical inspection apparatus or the scanning electronic inspection apparatus receives the position information of the defect observed by the first optical inspection apparatus, and enlarges the sample using the position information.

As described above, the inspection system according to the embodiment of the present invention includes an optical inspection device for enlarging a sample in macro units, an optical inspection device for enlarging a sample in micro units, and a scanning electron inspection device for magnifying and observing a sample by scanning an electron beam. Include. After macro inspection of the entire sample using a macro optical inspection device according to the shape of the sample, microscopic inspection of the sample using a micro optical inspection device, or macroscopic inspection of the entire sample using a macro optical inspection device, The sample is microscopically inspected using a scanning electronic inspection device.

As a result, the accuracy of determination of the presence or absence of a defect can be improved without finding a defect existing in the sample without passing. In addition, the inspection time using the micro-optic microscope and the scanning electron microscope can be magnified and observed with the micro-graph using the coordinates of defects observed through the macro-optic microscope, thereby reducing the observation time using the micro-optical microscope and the scanning electron microscope. Can be.

In addition, when inspecting the sample which has a sharp sharp part, the microscopic inspection using a scanning electron microscope does not produce the distortion of light like conventionally. Therefore, it is possible to measure with a resolution of several nanometers or less without distorting an image of a sample having sharp sharpened portions, thereby improving inspection accuracy.

1 is a block diagram illustrating an inspection system according to an embodiment of the present invention.
2 shows an optical inspection unit according to an embodiment of the invention
3 illustrates a scanning electron microscope unit according to an embodiment of the present invention.
4A is a cross-sectional view showing a first sample in which a plurality of hemispherical irregularities are formed on a substrate, and FIG. 4B is a cross-sectional view showing an enlarged image of the first sample by a second optical microscope.
5A is a cross-sectional view illustrating a second sample having a plurality of pyramidal irregularities formed on a substrate, and FIG. 5B is a cross-sectional view showing an enlarged image of the second sample by a second optical microscope, and FIG. 5C is a second view. A cross-sectional view showing an enlarged image of a sample by a scanning electron microscope
6 is a flowchart illustrating a method of inspecting first and second samples using a test unit according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 is a block diagram illustrating an inspection system according to an embodiment of the present invention. 2 is a diagram illustrating an optical inspection unit according to an embodiment of the present invention. 3 illustrates a scanning electron microscope unit according to an embodiment of the present invention.

In the inspection system according to the embodiment, the sample S is enlarged and inspected in a macro or meso unit and then inspected by being enlarged in micro units, thereby improving the inspection precision of the sample S. It is an inspection system that can be obtained. The sample S according to the embodiment uses a plurality of irregularities formed on a substrate, such as a wafer, spaced apart from each other. And the surface of the sample S means the surface of the board | substrate and the some unevenness | corrugation formed in the said board | substrate surface. Of course, the present invention is not limited thereto, and an object having various shapes may be used as the sample S.

Referring to FIG. 1, an inspection system according to an exemplary embodiment may include a first optical inspection apparatus 170 and a micro () that observe an enlarged surface of a sample S in a macro unit or a meso unit using light. an optical inspection unit 100 having a second optical inspection device 180 for enlarging and observing the sample S in micro units, a scanning electron inspection unit 200 for observing the sample S by scanning an electron beam, and It includes a robot arm 300 for transporting the sample (S). Further, the first cassette 410 on which the sample S to be inspected is loaded, the second cassette 420 on which the sample S on which a defect is observed, and the sample S on which no defect is observed, are loaded. Three cassettes 430 are included. Here, the robot arm 300, the first optical inspection device 170, the second optical inspection device 180 and the scanning electronic inspection unit 200 to test the sample (S) to be loaded on the first cassette 410 It serves to transfer to each. In addition, a role of transferring the finished sample S from the first optical inspection device 170, the second optical inspection device 180, and the scanning electronic inspection unit 200 to the second and third cassettes 430. Do it.

Referring to FIGS. 1 and 2, the optical inspection unit 100 has an inner space, and irradiates light from the upper side of the first chamber 130 and the first chamber 130 that are vacuumed, and samples the macro or meso units. The first optical inspection device 170 for enlarging and observing (S) is disposed to be spaced apart from the first optical inspection device 170 in the horizontal direction from the outside of the first chamber 130, and the sample S is micro-united. First stage 132a for supporting the sample S, the second optical inspection device 180 for enlarged observation and the first optical inspection device 170 disposed inside the first chamber 130 to support the sample S. The first chamber 130 includes a second stage 132b disposed corresponding to the lower side of the second optical inspection device 180 to support the sample S. Here, the first and second windows 131a and 131b are provided above the first chamber 130 respectively corresponding to the lower sides of the first and second optical inspection apparatuses 170 and 180, respectively. In addition, the first and second horizontal moving parts 133a and 133b for moving the first and second stages 131a and 132b in the horizontal direction, and the first and second stages 131a and 132b for lifting and lowering the first and second stages 131a and 132b. And first and second lifting portions 134a and 134b.

In the embodiment, the first chamber 130 is manufactured to have a hollow rectangular cylinder shape, but is not limited thereto and may be manufactured in various shapes. Although not shown, an entrance through which the sample S enters and exits is provided at one side of the first chamber 130, and a pressure adjusting means for adjusting a pressure inside the first chamber 130 and inside the first chamber 130. It may be provided with an exhaust means for exhausting. In addition, first and second windows 131a and 131b may be provided on the first chamber 130 to transmit light emitted from the first and second optical microscopes 110 and 120. Here, the first and second windows 131a and 131b are manufactured using a light-transmissive glass material through which light can pass.

Each of the first and second optical inspection apparatuses 170 and 180 irradiates light onto the sample S to extract image data of the sample S, respectively. And first and second readers 140 and 150 in signal communication with the first and second optical microscopes 110 and 120. The first optical inspection apparatus 170 may magnify and observe the sample S in macro or meso units, and the second optical inspection apparatus 180 may magnify and observe the sample S in micro units. The first and second optical microscopes 110 and 120 may include, for example, a confocal microscope, a white light scanning interference (WSI), a photophase interference method (PSI), a moire measurement method, and a fibrointerferometer. (Fizeau Interferometry) can be used. Of course, the present invention is not limited thereto, and the first and second optical microscopes 110 and 120 are not limited to the examples described above, and various structures and configurations that can be observed by enlarging the sample S in macro, meso or micro units. Any device that has can be used.

The first and second readers 140 and 150 are signal connected to the first and second optical microscopes 110 and 120 to collect light collected through the first and second optical microscopes 110 and 120. The sample S is read using energy.

As described above, in the embodiment, the entire sample S is macroscopically observed in macro or meso units using the first optical inspection device 170, and the sample S is continuously used by using the second optical inspection device 180. ) Is microscopically observed. At this time, when observing using the 2nd optical inspection apparatus 180, it observes by expanding the said defect using the positional information of the defect observed by the 1st optical inspection apparatus 170. FIG. That is, the position information of the defect stored in the first reading unit 140 is transmitted to the second reading unit 150, and the second optical microscope 120 enlarges and observes the sample S in micro units. . Thus, the test | inspection using the 1st optical microscope 110 and the test | inspection using the 2nd optical microscope 120 are performed continuously with respect to one sample S, and it does not find the defect which exists in the sample S, and passes a path ( It is possible to improve the accuracy of determining whether there is a defect or not without passing).

The scanning inspection unit 200 is an apparatus that scans the sample S with an electron beam and observes the sample S in micro or nano units. The scanning electron inspection unit 200 is connected to the load lock 220 and the load lock 220 having an internal space, and the scanning electron inspection device for inspecting the sample S by scanning an electron beam on the sample S ( 250). The scanning electron inspection apparatus 250 includes a second chamber 230 having an internal space, a scanning electron microscope 240 that inspects a sample S by scanning an electron beam, a part of which penetrates through the second chamber 230, A third stage 232a which is disposed under the scanning electron microscope 240 in a third reading unit 210 and a second chamber 230 connected to the scanning electron microscope 240 to support the sample S. ). In addition, a third horizontal moving unit 233a for moving the third stage 232a in the horizontal direction, and a third lifting unit 234a for raising and lowering the third stage 232a.

The scanning electron microscope 240 is disposed below the electron gun 241 for generating an electron beam, the electron gun 241, and has an optical lens provided therein and provides a moving path of the electron beam focused from the lens. 242. Here, the electron gun 241 is a means for generating an electron beam and scanning the sample S. The electron gun 241 is classified into a hot electron gun method and an electron radiation type method. In recent years, an electron radiation type method capable of observing high resolution and high efficiency is mainly used. However, the electron gun 241 may use any type of electron gun. The lens is a means for collecting the electron beam accelerated by the electron gun 241_, and a lens using electric and magnetic fields through which the electron beam may interfere is used. However, the lens may use any type of condenser lens. The optical column 242 is a means for scanning the electron beam collected from the condenser lens by the electron gun into the sample S. The optical column 242 communicates with the second chamber 230 and together with the second chamber 230 when the sample S is observed. A high vacuum environment of 10 ^-6 torr or more is created.

In addition, although not shown, the third reader 210 may amplify secondary electrons or reflected electrons generated on the surface of the sample S, convert the quantum intensity into luminance, and form an image (not shown). ), A determination unit for determining the presence or absence of a defect, a defect coordinate calculating unit for calculating the position of the defect, and a memory unit serving as a registration unit for registering the defect position.

 In addition, when observing using the scanning electron microscope 240, observation is performed using position information of defects observed through the first optical inspection apparatus 170. That is, the third reading unit 210 of the scanning electronic inspection apparatus 250 receives the position information of the defect stored in the first reading unit 140, and the scanning electron microscope 240 uses the position information of the defect. Scan the electron beam.

In the embodiment, such a scanning inspection unit 200 is used to observe a sample having irregularities having at least one sharp part. Here, the sharp part (尖銳) means a sharp pointed portion in the unevenness. That is, as shown in FIG. 5A, the sharp part corresponding to the uppermost part of the irregularities in the pyramidal irregularities is called a sharp part. The reason for observing the surface of the sample having the unevenness having the sharp part by using the scanning electron inspection unit 200 is to use the second optical microscope 120 to magnify and observe the sample S in micro units. This is because, when light is irradiated onto the sample S as described above, light distortion occurs due to the sharp sharpened portions of the unevenness. The distortion of the light results in an image having a shape in which the local area of the unevenness is recessed, as shown in FIG. 5B, instead of the actual uneven shape. Therefore, when observing the sample S in micro units using the second optical microscope 120, the state of the sample S, for example, the defect, the shape, size, and angle of the sample S are irregular. Etc cannot be observed accurately.

Therefore, in the embodiment, when inspecting the sample S including the unevenness having the sharp sharp portion, the scanning electron inspection device 240 after the observation using the first optical inspection device 170 of the optical inspection unit 100. Observe with). In the case of the scanning electron inspection device 240, as described above, since the enlarged image is obtained by scanning the electron beam, the problem of light distortion does not occur. Thus, the sample S containing the unevenness having the sharp portion can be accurately observed.

In addition, as described above, in the embodiment, the entire sample S is observed in macro or meso units using the first optical inspection device 170 to detect the presence or absence of a defect and the scanning electronic inspection device 240 is The sample S is continuously magnified and observed in micro units. As a result, the accuracy of the determination of the presence or absence of a defect can be improved without finding a defect present in the sample S without passing.

4A is a cross-sectional view showing a first sample in which a plurality of hemispherical irregularities are formed on a substrate, and FIG. 4B is a cross-sectional view showing an enlarged image of the first sample by a second optical inspection device. 5A is a cross-sectional view illustrating a second sample having a plurality of pyramidal irregularities formed on a substrate, and FIG. 5B is a cross-sectional view showing an enlarged image of the second sample by a second optical inspection device, and FIG. It is sectional drawing which shows the image which expanded the 2 sample by the scanning electron inspection apparatus. 6 is a block diagram sequentially illustrating a test method using a test system according to an exemplary embodiment of the present invention.

Hereinafter, a method of inspecting the first sample S using the inspection system according to the embodiment will be described with reference to FIGS. 1 to 6.

First, the first sample S loaded on the first cassette 410 is placed on the first stage 132a of the optical inspection unit 100 using the robot arm 300. When the first sample S is placed on the first stage 132a, the first sample S is enlarged in macro or meso units using the first optical inspection device 170 of the optical inspection unit 100. The entire surface of the first sample S1 is observed (S100) . In addition, the first reading unit 140, which is connected to the first optical microscope 110 and signaled, analyzes the image image to determine whether there is a defect (S200).

As a result of observing the entire surface of the first sample S using the first optical inspection device 170, for example, when no defect is found, the inspection of the first sample S is terminated. Although not shown, the first sample S, in which no defect is found, is unloaded from the first stage 132a by the robot arm 300 and moved to the third cassette 430.

On the other hand, when a defect is present as a result of inspecting the entire first sample S in macro or meso units using the first optical inspection device 170, the first reading unit 140 stores the position of the defect. The first sample S is magnified and observed in micro units using the second optical inspection device 180 (S310). To this end, the first sample S1 placed on the first stage 132a is first placed on the second stage 132b using the robot arm 300. And the 1st sample S2 is magnified and observed by the micro unit using the 2nd optical inspection apparatus 180. FIG. At this time, the second reading unit 150 of the second optical inspection device 180 receives the position information of the defect from the first reading unit 140, and enlarges and captures the image in micro units using the position information of the defect. When a defect is found in the plurality of regions, the defect is observed through the second optical inspection device 180 while moving the second stage 132b in the horizontal direction by using the second horizontal moving unit 133b. At this time, by observing the image processed image, the position, size, etc. of a defect can be analyzed correctly. In addition, it is possible to analyze in detail the pattern profile (prfile) of the plurality of unevenness, the shape of each unevenness, the size, height, inclination angle and the like of the unevenness. This analysis can be used to improve the process of forming irregularities on the substrate in the future.

When the analysis ends by the second optical device 180, the inspection ends. Although not shown, the second sample S in which the defect is observed is unloaded from the second stage 132b by the robot arm 300 and moved to the second cassette 420.

In the above, after the inspection of the first sample S1 using the first optical inspection device 170, the first sample S1 was magnified and observed in micro units using the second optical inspection device 180. However, the present invention is not limited thereto, and if a defect exists as a result of surface inspection of the first sample S1 using the first optical inspection apparatus 170, the first sample S1 may be micro-controlled using the scanning electronic inspection apparatus 250. Magnification can be observed in units (S320). To this end, first, the first sample S1 placed on the first stage 132a of the optical inspection unit 100 using the robot arm 300 is loaded through the load lock 210 of the scanning electronic inspection unit 200. The scanning electron inspection device 250 is transferred to the inside. After placing the first sample S1 on the third stage 232a, the electron beam is scanned on the first sample S2 through the scanning electron microscope 240. At this time, the third reading unit 210 signally connected to the scanning electron microscope 240 amplifies secondary electrons or reflected electrons generated on the surface of the first sample S1, converts the quantum intensity into luminance, and displays an image. Form. And by observing the image processed image, a defect can be observed in micro units. Thereafter, when the analysis is completed by the scanning electronic inspection apparatus 250, the inspection is terminated. Although not shown, the second sample S in which the defect is observed is unloaded from the third stage 132b by the robot arm 300 and moved to the second cassette 420.

As described above, in the exemplary embodiment, the entire first sample S is inspected in macro or meso units by using the first optical inspection device 180, and then the micro units are continuously used by using the second optical inspection device 180. The sample S is enlarged and observed. Through this, it is possible to improve the accuracy of the determination of the presence or absence of a defect in the macro or mipro unit and the micro unit in the sample S without being found without passing.

Hereinafter, a method of inspecting a second sample S by using a test system according to an embodiment will be described with reference to FIGS. 1 to 6. In this case, the content duplicated with the above-described content will be omitted or briefly described. Here, the second sample S uses a plurality of pyramidal irregularities P2 formed on the second substrate S2 such as a wafer as shown in FIGS. 5A and 6.

First, the second sample S loaded on the first cassette 410 is placed on the first stage 132a of the optical inspection unit 100 using the robot arm 300. When the second sample S is placed on the first stage 132a, the sample S is enlarged and observed in macro or meso units using the first optical microscope 110 of the optical inspection unit 100 ( S100) . At this time, an inspection is performed while the second sample S is moved in the horizontal direction by using the first horizontal moving part 133a, and the entire surface of the second sample S is observed. At this time, the first reading unit 140 that is connected in signal with the first optical microscope 110 analyzes the image image to determine the presence of a defect (S200).

As a result of observing the entire surface of the second sample S using the first optical inspection device 170, for example, when no defect is found, the inspection of the second sample S is terminated. Although not shown, the second sample S, in which no defect is found, is unloaded from the first stage 132a by the robot arm 300 and moved to the third cassette 430.

On the other hand, if a defect exists as a result of inspecting the entire second sample S in macro or meso units using the first optical inspection device 170, the first reading unit 140 stores the position of the defect. The second sample S is magnified and observed in micro units using the scanning electronic inspection unit 200 (S320). To this end, first, the second sample S2 placed on the first stage 132a of the optical inspection unit 100 using the robot arm 300 is loaded through the load lock 210 of the scanning electronic inspection unit 200. The scanning electron inspection device 250 is transferred to the inside. After placing the second sample S2 on the third stage 232a, the electron beam is scanned on the second sample S2 through the scanning electron microscope 240. At this time, the third reading unit 210 signally connected to the scanning electron microscope 240 amplifies secondary electrons or reflected electrons generated on the surface of the second sample S, converts the quantum intensity into luminance, and displays an image. Form. And by observing the image processed image, a defect can be observed in micro units.

When the analysis is finished by the scanning electronic inspection device 250, the inspection is finished. Although not shown, the second sample S in which the defect is observed is unloaded from the third stage 132b by the robot arm 300 and moved to the second cassette 420.

As described above, even if the second sample S2 has the second unevenness P2 having sharp sharpened portions in the embodiment, the scanning electronic inspection apparatus 250 is used as in the embodiment. As described above, the profile, the position, the shape, the size, and the like of the plurality of irregularities can be observed accurately. In addition, after inspecting the entire second sample S in macro or meso units using the first optical inspection device 180, the sample S in micro units using the scanning electronic inspection apparatus 250 is continuously performed. Zoom in and observe). Through this, it is possible to improve the accuracy of the determination of the presence or absence of a defect in the macro or mipro unit and the micro unit in the sample S without being found without passing.

In the embodiment, a first substrate W1 having a plurality of hemispherical irregularities P1 is formed as the first sample S1, and a plurality of pyramidal irregularities P2 are formed as the second sample S2. 2 board | substrates W2 were used as the 2nd sample S. FIG. However, the present invention is not limited thereto, and the substrate on which the irregularities of various shapes are formed may be used as the sample S.

100: optical inspection unit 110: first optical inspection device
120: second optical inspection device 200: scanning electronic inspection unit

Claims (11)

A first optical inspection device for magnifying and observing a sample in macro or meso units;
A second optical inspection device connected in signal with the first optical inspection device and configured to magnify and observe a sample in micro units;
A scanning electron inspection device (SEM) connected in signal with the first optical inspection device and the second optical inspection device and configured to magnify and observe a sample by scanning an electron beam;
And a robotic arm for transferring the sample to a location where each of the first optical inspection device, the second optical inspection device, and the scanning electronic inspection device is located. The method according to claim 1,
And the scanning electronic inspection device performs image processing of the sample in 3D. The method according to claim 1 or 2,
A first stage corresponding to the lower side of the first optical inspection apparatus and supporting the sample; a second stage corresponding to the lower side of the second optical inspection apparatus and supporting the sample; An inspection system comprising a supporting third stage. The method according to claim 3,
And first to third horizontal moving parts for moving the first to third stages in a horizontal direction. Using an inspection system having a first optical inspection device for magnifying and observing a sample in macro or meso units, a second optical inspection device for observing and magnifying a sample in micro units, and a scanning electronic inspection device In the method for inspecting the sample,
Inspecting the entire sample using the first optical inspection device;
Determining whether the sample is defective;
If it is determined that there is a defect in the sample and no defect exists, the inspection of the sample is terminated,
And if the defect is present in the sample, inspecting the sample by using a second optical microscope or by using a scanning electron inspection device according to the shape of the surface of the sample. The method according to claim 5,
And determining the shape of the surface of the sample before inspecting the sample using a second optical inspection device or inspecting the sample using a scanning electronic inspection device. The method according to claim 5,
The sample is a substrate inspection method using a plurality of irregularities formed on one side of the substrate. The method according to claim 5 to 7,
When the unevenness | corrugation of the said sample is provided with a sharp part, the board | substrate test | inspection method which performs the test | inspection using a scanning electron inspection apparatus after the test | inspection using the said 1st optical inspection apparatus. The method according to claim 5 or 7,
In the case where the unevenness of the sample does not have a sharp portion, the inspection using the second optical inspection apparatus is performed after the inspection using the first optical inspection apparatus, or the scanning electronic inspection apparatus after the inspection using the first optical inspection apparatus. The board | substrate test | inspection method which test | inspects by using. The method according to claim 5,
The substrate inspection method of enlarging and observing a partial area | region of the said sample at the time of the sample inspection using a said 2nd optical inspection apparatus or a scanning electron inspection apparatus. The method according to claim 5,
And the second optical inspection device or the scanning electronic inspection device receives position information of a defect observed by the first optical inspection device, and enlarges a sample using the location information.

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