KR20120039340A - Led module assembly, manufacturing apparatus and manufacturing method thereof - Google Patents

Led module assembly, manufacturing apparatus and manufacturing method thereof Download PDF

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Publication number
KR20120039340A
KR20120039340A KR1020100101002A KR20100101002A KR20120039340A KR 20120039340 A KR20120039340 A KR 20120039340A KR 1020100101002 A KR1020100101002 A KR 1020100101002A KR 20100101002 A KR20100101002 A KR 20100101002A KR 20120039340 A KR20120039340 A KR 20120039340A
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South Korea
Prior art keywords
pcb
led module
module assembly
wire
manufacturing
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KR1020100101002A
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Korean (ko)
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김종구
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(주) 넥스트엘이디
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Priority to KR1020100101002A priority Critical patent/KR20120039340A/en
Publication of KR20120039340A publication Critical patent/KR20120039340A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: An LED module assembly, a manufacturing apparatus, and a manufacturing method thereof are provided to prevent connection defects by connecting a wire through a conductive wire coupling tube. CONSTITUTION: An LED is mounted on a printed circuit board. An end part of a wire is combined with a wire coupling tube by being inserted into the wire coupling tube. The wire coupling tube is mounted on the surface of the printed circuit board using a surface mounting method. A waterproof layer(30) covers the printed circuit board. The printed circuit board which includes the wire coupling tube and the LED is mounted on the upper surface of a lower mold. A molding liquid insertion hole in which a molding liquid is inserted is formed on an upper mold.

Description

엘이디 모듈 어셈블리, 그리고 그 제조장치 및 제조방법{LED MODULE ASSEMBLY, MANUFACTURING APPARATUS AND MANUFACTURING METHOD THEREOF}LED module assembly, manufacturing apparatus and manufacturing method therefor {LED MODULE ASSEMBLY, MANUFACTURING APPARATUS AND MANUFACTURING METHOD THEREOF}

본 발명은 엘이디 모듈 어셈블리, 그리고 그 제조장치 및 제조방법에 관한 것으로, 특히 제품의 소형화가 가능한 엘이디 모듈 어셈블리, 그리고 그 제조장치 및 제조방법에 관한 것이다.
The present invention relates to an LED module assembly, a manufacturing apparatus and a manufacturing method thereof, and more particularly, to an LED module assembly capable of miniaturization of a product, and a manufacturing apparatus and a manufacturing method thereof.

엘이디(LED)는 발광소자(light-emitting diode)를 의미하며, 반도체의 p-n 접합구조를 이용하여 주입되는 소수 캐리어들의 재결합에 의하여 발광시키는 소자를 지칭한다. 현재까지 LED의 소재로는 발광 효율과 p-n 접합제작의 용이성 등으로 인하여 비소화갈륨(GaAs), 인화갈륨(GaP), 갈륨-비소-인, 갈륨-알루미늄-비소, 인화인듐(InP) 등 3B 및 5B족인 2원소 또는 3원소 화합물 반도체가 일반적으로 사용되고 있다.LED refers to a light-emitting diode, and refers to a device that emits light by recombination of minority carriers injected using a p-n junction structure of a semiconductor. To date, LED materials include 3B such as gallium arsenide (GaAs), gallium phosphide (GaP), gallium-arsenide-phosphorus, gallium-aluminum-arsenide, and indium phosphide (InP) due to light emission efficiency and ease of pn junction manufacturing. And 5 element group 2 or 3 element compound semiconductors are generally used.

엘이디는 종래의 광원과 비교하여 소형이고, 수명은 길며, 전기에너지가 빛에너지로 직접 변환하기 때문에 전력이 적게 들고 효율이 좋다. 뿐만 아니라 고속응답이므로 자동차 계기의 표시소자, 광통신용 광원 등 다양한 전자기기의 표시용 램프, 숫자표시 장치나 계산기의 카드 판독기 등에 널리 응용되고 있다.LEDs are smaller than conventional light sources, have a long lifetime, and have low power and good efficiency because electrical energy is directly converted into light energy. In addition, since it is a high-speed response, it is widely applied to display devices of automobile instruments, display lamps of various electronic devices such as optical communication light sources, numeric display devices, and card readers of calculators.

일반적으로 엘이디는 엘이디 모듈 어셈블리를 통하여 조립되어 광고판 및 각종 조명장치에서 광원으로 사용되는데, 도 1은 종래의 엘이디 모듈 어셈블리를 나타낸 단면도이고, 도 2는 도 1에 도시된 본체와 전선의 결합형태를 나타낸 평면도이다.In general, the LED is assembled through the LED module assembly is used as a light source in the billboard and various lighting devices, Figure 1 is a cross-sectional view showing a conventional LED module assembly, Figure 2 is a coupling form of the main body and the wire shown in Figure 1 It is the top view shown.

종래의 엘이디 모듈 어셈블리(200)은 내부에 수용공간이 형성된 본체(210)와, 본체(210) 내에 삽입 설치되며 표면에 엘이디(220)가 실장된 PCB(230)와, 본체(210)를 관통하면서 PCB(230)의 하부에 설치되는 전선(240), 및 본체(210)의 개방된 전면에 형성되는 마감층(250)을 포한한다.The conventional LED module assembly 200 penetrates the main body 210 having an accommodating space therein, a PCB 230 inserted into the main body 210 and mounted with an LED 220 on a surface thereof, and the main body 210. While including the wire 240 is installed on the lower portion of the PCB 230, and the finishing layer 250 is formed on the open front of the body 210.

상기 PCB(230)와 전선(240)은 PCB(230)를 본체(210)에 고정하기 위한 나사(260)를 이용해 전기적으로 접속된다. 상기 마감층(250)은 투명소재로 제작되며 본체(210)의 개방된 전면을 차단하여 본체(210) 내로 물이 스며들지 않도록 방수하게 된다.The PCB 230 and the wire 240 are electrically connected using screws 260 for fixing the PCB 230 to the main body 210. The finish layer 250 is made of a transparent material and is waterproof to block the open front of the main body 210 so that water does not penetrate into the main body 210.

그러나, 상술한 바와 같은 구성을 갖는 종래의 엘이디 모듈 어셈블리(200)에 의하면 다음과 같은 문제점들을 가진다.However, according to the conventional LED module assembly 200 having the configuration as described above has the following problems.

첫째, 본체의 바닥에 전선이 가로질러 설치되고 그 위에 PCB가 실장되므로 전체적인 엘이디 모듈 어셈블리의 두께가 두꺼워지는 문제점이 있다.First, since the wire is installed across the bottom of the body and the PCB is mounted thereon, there is a problem that the overall thickness of the LED module assembly becomes thick.

둘째, PCB와 전선이 PCB를 본체에 고정시키기 위한 나사를 통해 전기적으로 접속되므로 접촉면이 불규칙하여 접속불량이 발생하게 되는 문제점이 있다.
Secondly, since the PCB and the wire are electrically connected through screws for fixing the PCB to the main body, there is a problem in that the contact surface is irregular and connection failure occurs.

본 발명의 목적은 상술한 문제점을 해소하기 위해 안출된 것으로, 제품의 크기를 소형화하고 접속불량이 발생되지 않는 엘이디 모듈 어셈블리, 그리고 그 제조장치 및 제조방법을 제공하는데 있다.
Disclosure of Invention An object of the present invention is to provide an LED module assembly, and a manufacturing apparatus and a manufacturing method thereof, which are devised to solve the above-mentioned problems, which can reduce the size of a product and prevent connection defects.

상기 목적을 달성하기 위해 본 발명 엘이디 모듈 어셈블리는, LED가 실장된 PCB; 및 상기 PCB에 안착되어 두 전선의 단부가 삽입 체결되는 전도성의 전선 체결용 튜브;를 포함하며, 상기 전선은 상기 전선 체결용 튜브를 압착함에 의해 상기 전선 체결용 튜브에 체결된다.In order to achieve the above object, the present invention, the LED module assembly, the PCB is mounted LED; And a conductive wire fastening tube seated on the PCB so that the ends of the two wires are inserted and fastened, wherein the wire is fastened to the wire fastening tube by compressing the wire fastening tube.

본 발명 엘이디 모듈 어셈블리에 따르면, 상기 전선 체결용 튜브는 상기 PCB의 표면에 표면실장방식(SMD)에 의해 안착된다.According to the LED module assembly of the present invention, the wire fastening tube is mounted on the surface of the PCB by a surface mount method (SMD).

본 발명 엘이디 모듈 어셈블리는 상기 PCB를 감싸는 방수층을 더 포함한다.The LED module assembly of the present invention further includes a waterproof layer surrounding the PCB.

상기 LED의 상면은 상기 방수층이 형성되지 않고 외부로 노출된다.The upper surface of the LED is exposed to the outside without forming the waterproof layer.

본 발명 엘이디 모듈 어셈블리의 제조장치는, LED 및 전선체결용 튜브가 실장된 PCB가 상면에 안착되는 하부몰드; 및 상기 하부몰드의 상면에 착탈 가능하게 밀착되며, 상기 하부몰드와의 사이로 방수를 위한 몰딩액이 삽입되는 몰딩액 삽입홀이 형성된 상부몰드를 포함한다.An apparatus for manufacturing an LED module assembly of the present invention includes: a lower mold in which a PCB on which LEDs and wire fastening tubes are mounted is mounted on an upper surface thereof; And an upper mold which is in close contact with the upper surface of the lower mold, and has a molding liquid insertion hole in which a molding liquid for waterproofing is inserted between the lower mold.

상기 하부몰드의 상면에는 두 개의 PCB 삽입홈이 나란히 이격 형성되며, 상기 PCB 삽입홈 사이에는 상기 상부몰드를 통해 주입되는 몰딩액을 두 PCB 삽입홈으로 분산시키는 분산홈이 형성되고, 상기 상부몰드의 중심에 상기 몰딩액 삽입홀이 형성된다.Two PCB insertion grooves are formed side by side on the upper surface of the lower mold, a dispersion groove for dispersing the molding liquid injected through the upper mold into the two PCB insertion groove is formed between the PCB insertion groove, The molding liquid insertion hole is formed at the center.

상기 하부몰드의 PCB 삽입홈의 바닥면에는 상기 PCB를 바닥으로부터 이격시키는 이격돌기와, 상기 PCB를 상기 PCB 삽입홈 내에서 유동되지 않고 고정시키기 위한 고정돌기가 돌출 형성된다.The bottom surface of the PCB insertion groove of the lower mold is formed with a separation protrusion for separating the PCB from the bottom, and a fixing projection for fixing the PCB without flowing in the PCB insertion groove is formed.

상기 하부몰드의 양측부에는 상기 PCB 삽입홈과 연결되게 형성되어 상기 PCB에 연결되는 전선이 삽입되는 전선 삽입홈이 각각 형성된다.Wire inserting grooves are formed at both sides of the lower mold to be connected to the PCB inserting grooves to insert wires connected to the PCB.

본 발명 엘이디 모듈 어셈블리의 제조장치는 상기 하부몰드와 상부몰드 밀착시 상기 엘이디의 상면에 밀착되도록 상기 상부몰드의 저면으로부터 돌출 형성되어, 상기 상부몰드를 통해 몰딩액을 주입하여 방수층을 형성할 때, 상기 엘이디의 상면에 몰딩액이 코팅되는 것을 방지하는 코팅방지돌기를 더 포함한다.When the manufacturing apparatus of the LED module assembly of the present invention is formed to protrude from the bottom surface of the upper mold so as to be in close contact with the upper surface of the LED when the lower mold and the upper mold, when injecting a molding liquid through the upper mold to form a waterproof layer, It further comprises a coating preventing projection for preventing the molding liquid is coated on the upper surface of the LED.

본 발명 엘이디 모듈 어셈블리의 제조방법은, (a) 전도성을 갖는 전선 체결용 튜브를 PCB에 안착시키는 단계; (b) 상기 전선 체결용 튜브에 전선을 인입시키는 단계; 및 (c) 압착기를 이용해 상기 전선 체결용 튜브를 안착하여 전선을 전선 체결용 튜브에 체결하는 단계;를 포함한다.The method of manufacturing an LED module assembly of the present invention comprises the steps of: (a) mounting a conductive wire fastening tube on the PCB; (b) introducing an electric wire into the electric wire fastening tube; And (c) mounting the wire fastening tube using a crimp to fasten the wire to the wire fastening tube.

본 발명 엘이디 모듈 어셈블리의 제조방법은, (d) 하부몰드의 PCB 삽입홈에 전선 체결용 튜브 및 전선이 체결된 PCB를 안착시키고, 하부몰드의 상부에 상부몰드를 밀착시킨 후, 상기 상부몰드를 통해 몰드액을 주입하여 몰드액으로 상기 PCB를 감싸 방수층을 형성하는 단계를 더 포함한다.According to the present invention, a method of manufacturing an LED module assembly includes (d) mounting a wire fastening tube and a PCB to which a wire is fastened in a PCB insertion groove of a lower mold, and closely attaching the upper mold to an upper portion of the lower mold. Injecting the mold liquid through the step of forming a waterproof layer surrounding the PCB with a mold liquid.

본 발명 엘이디 모듈 어셈블리의 제조방법에 따르면, 상기 전선 체결용 튜브는 상기 PCB에 표면실장방식(SMD방식)으로 안착된다.
According to the method of manufacturing the LED module assembly of the present invention, the wire fastening tube is mounted on the PCB in a surface mount method (SMD method).

이와 같은 본 발명에 따른 엘이디 모듈 어셈블리, 그리고 그 제조장치 및 제조방법에 의하면 다음과 같은 효과들을 갖는다.According to the LED module assembly, and a manufacturing apparatus and a manufacturing method according to the present invention as described above has the following effects.

첫째, 전선을 PCB상에서 다른 칩들에 간섭받지 않게 구성함으로써, 전체적인 엘이디 모듈 어셈블리를 소형화할 수 있다.First, by configuring the wires so that they do not interfere with other chips on the PCB, the overall LED module assembly can be miniaturized.

둘째, 전도성을 갖는 전선체결용 튜브를 통해 전선을 연결하므로 종래에 나사를 통해 전선과 PCB를 연결하던 방식과 달리 접속불량이 발생하지 않는다.Second, since the electric wire is connected through a wire fastening tube having conductivity, a connection failure does not occur unlike the conventional method of connecting a wire and a PCB through a screw.

셋째, 접선을 연결하기 위해 납 등의 접속물질을 사용하지 않기 때문에 환경오염의 염려가 없다.
Third, there is no concern about environmental pollution because no connecting materials such as lead are used to connect the tangential lines.

도 1은 종래의 엘이디 모듈 어셈블리를 나타낸 단면도.
도 2는 도 1에 도시된 본체와 전선의 결합형태를 나타낸 평면도.
도 3은 본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리를 나타낸 사시도.
도 4는 도 3에서 방수층이 제거된 상태를 나타낸 사시도.
도 5는 도 3의 측단면도.
도 6은 본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리의 제조장치를 나타낸 사시도.
도 7은 도 6의 분해사시도.
도 8은 도 6의 상부몰드를 통해 몰드액을 주입하여 PCB 외측에 방수층을 형성하는 모습을 나타낸 단면도.
도 9는 본 발명의 바람직한 실시예에 따른 엘이디 모듈의 제조방법을 나타낸 공정도.
도 10은 가압기를 이용해 전선체결용 튜브를 압착하는 모습을 나타내는 도면.1 is a cross-sectional view showing a conventional LED module assembly.
2 is a plan view showing a coupling form of the main body and the wire shown in FIG.
Figure 3 is a perspective view of the LED module assembly according to a preferred embodiment of the present invention.
4 is a perspective view showing a state in which the waterproof layer is removed in FIG.
5 is a side cross-sectional view of FIG.
Figure 6 is a perspective view showing the manufacturing apparatus of the LED module assembly according to a preferred embodiment of the present invention.
7 is an exploded perspective view of FIG. 6;
Figure 8 is a cross-sectional view showing a state of forming a waterproof layer on the outside of the PCB by injecting the mold liquid through the upper mold of FIG.
9 is a process chart showing a manufacturing method of the LED module according to an embodiment of the present invention.
10 is a view showing a crimping the wire fastening tube using a pressurizer.

이하, 본 발명에 따른 바람직한 실시예를 첨부한 도면에 따라 상세하게 설명한다.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리를 나타낸 사시도이고, 도 4는 도 3에서 방수층이 제거된 상태를 나타낸 사시도이며, 도 5는 도 3의 측단면도이다.Figure 3 is a perspective view of the LED module assembly according to a preferred embodiment of the present invention, Figure 4 is a perspective view showing a state in which the waterproof layer is removed in Figure 3, Figure 5 is a side cross-sectional view of FIG.

본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리(1)는, PCB(10)와, 전선 체결용 튜브(20), 및 방수층(30)을 포함한다.The LED module assembly 1 according to the preferred embodiment of the present invention includes a PCB 10, a wire fastening tube 20, and a waterproof layer 30.

상기 PCB(10)는 상면에 LED(11)를 비롯한 각종 칩들이 실장되는 것으로 좌우로 길게 형성된다. 이러한 PCB(10)의 좌우 양단부에는 대각선상으로 후술할 하부몰드(110)의 고정돌기(116)에 끼워지는 고정돌기 끼움홀(10a)이 각각 형성된다. The PCB 10 is formed to have various chips including the LED 11 on the upper surface and to be formed long left and right. Fixing projection fitting holes 10a fitted to the fixing projections 116 of the lower mold 110 to be described later are formed on both left and right ends of the PCB 10, respectively.

상기 전선 체결용 튜브(20)는 PCB(10)의 상면중 전면부와 배면부의 가장자리에 각각 안착되는 것으로, 그 내부에 두 개의 전선(40)(41) 단부가 피복이 벗겨진 상태에서 삽입 체결된다. 이러한 전선 체결용 튜브(20)는 동 재질로 형성되어 PCB(10)와 전선(40)(41) 사이에서 전원이 소통되도록 이루어진다. 한편, 전선 체결용 튜브(20)는 전선이 삽입된 상태에서 압착기로 상부가 압착됨에 따라 전선(40)(41)이 견고하게 체결된다.The wire fastening tube 20 is seated at the edges of the front and rear surfaces of the upper surface of the PCB 10, respectively, and the two wires 40 and 41 end portions are inserted and fastened in a state where the coating is peeled off. . The wire fastening tube 20 is made of a copper material is made so that power is communicated between the PCB 10 and the wire 40, 41. On the other hand, the wire fastening tube 20 is the wire (40, 41) is firmly fastened as the upper portion is compressed by a crimp in the state that the wire is inserted.

상기 방수층(30)은 PCB(10)를 감싸 PCB(10)에 실장된 칩들에 물이 닿지 못하도록 하는 것으로, 후술할 하부몰드(110) 및 상부몰드(120)를 통해 형성된다.
The waterproof layer 30 wraps the PCB 10 to prevent water from coming into contact with the chips mounted on the PCB 10, and is formed through the lower mold 110 and the upper mold 120 to be described later.

도 6은 본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리의 제조장치를 나타낸 사시도이고, 도 7은 도 6의 분해사시도이며, 도 8은 도 6의 상부몰드를 통해 몰드액을 주입하여 PCB 외측에 방수층을 형성하는 모습을 나타낸 단면도이다.Figure 6 is a perspective view showing a manufacturing apparatus of the LED module assembly according to a preferred embodiment of the present invention, Figure 7 is an exploded perspective view of Figure 6, Figure 8 is injected into the mold liquid through the upper mold of Figure 6 outside the PCB It is sectional drawing which shows the state which forms a waterproof layer.

본 발명의 바람직한 실시예에 따른 엘이디 모듈 어셈블리의 제조장치(100)는, 하부몰드(110) 및 상부몰드(120)를 포함한다.The apparatus 100 for manufacturing an LED module assembly according to a preferred embodiment of the present invention includes a lower mold 110 and an upper mold 120.

상기 하부몰드(110)의 상면에는 각종 칩들이 안착된 PCB(10)가 삽입 안착되는 두 개의 PCB 삽입홈(111)이 평행하게 이격 형성된다. 두 PCB 삽입홈(111) 사이에는 상부몰드(120)를 통해 주입되는 몰딩액이 각 PCB 삽입홈(111)으로 분산되도록 하는 분산홈(112)이 형성된다. 이러한 하부몰드(110)의 상면 양측부에는 PCB 삽입홈(111)과 연결되게 형성되어 PCB(10)에 연결되는 전선(40)(41)이 삽입되는 전선 삽입홈(113)이 각각 형성된다. 상기 하부몰드(110)의 상면중 대각선상에 위치되는 두 곳에는 하부몰드(110)와 상부몰드(120)가 밀착될 때 밀착위치가 틀어지지 않도록 하는 위치설정돌부(114)가 돌출 형성된다.On the upper surface of the lower mold 110, two PCB insertion grooves 111 into which PCBs 10 on which various chips are seated are inserted and seated are formed in parallel and spaced apart. A dispersion groove 112 is formed between the two PCB insertion grooves 111 so that the molding liquid injected through the upper mold 120 is distributed to each PCB insertion groove 111. On both sides of the upper surface of the lower mold 110, the wire insertion grooves 113 are formed to be connected to the PCB insertion grooves 111 and inserted into the wires 40 and 41 connected to the PCB 10, respectively. Positioning protrusions 114 protruding from the upper surface of the lower mold 110 are positioned on a diagonal line so that the contact position is not misaligned when the lower mold 110 and the upper mold 120 are in close contact with each other.

상기 PCB 삽입홈(111)의 바닥면에는 PCB(10)를 바닥면으로부터 이격시키는 이격돌기(115)와, PCB(10)가 PCB 삽입홈(111) 내에서 유동되지 않고 고정되도록 하는 고정돌기(116)가 돌출 형성된다. 고정돌기(116)는 PCB 삽입홈(111) 내에서 대각선상에 위치되되 PCB(10)에 형성된 고정돌기 끼움홀(10a)에 대응되게 형성된다.On the bottom surface of the PCB insertion groove 111, a spaced protrusion 115 for separating the PCB 10 from the bottom surface, and a fixing protrusion for fixing the PCB 10 is not flown in the PCB insertion groove 111 ( 116 is protruded. The fixing protrusion 116 is positioned diagonally within the PCB insertion groove 111 and is formed to correspond to the fixing protrusion fitting hole 10a formed in the PCB 10.

상기 상부몰드(120)의 저면에는 하부몰드(110)의 PCB 삽입홈(111) 및 전선 삽입홈(113)에 대응되는 PCB 삽입홈(121) 및 전선 삽입홈(122)이 각각 형성된다. PCB 삽입홈(121) 내에는 하부몰드(110)와 상부몰드(120)가 밀착된 상태에서 LED(11)의 상면에 접촉되어 몰딩액이 LED(11)의 상면을 코팅되지 않도록 하는 코팅 방지돌기(123)가 돌출 형성된다. 상기 상부몰드(120)에는 하부몰드(110)의 위치설정돌부(114)와 대응되는 위치에 형성되어 위치설정돌부(114)가 삽입되는 위치설정홀(124)이 형성된다. 한편, 상부몰드(120)의 중심부에는 외부로부터 몰딩액을 주입하기 위한 몰딩액 주입홀(125)이 형성된다. 이 몰딩액 주입홀(125)은 하부몰드(110)에 형성된 분산홈(112)에 대응되게 형성된다.PCB insert grooves 121 and wire insertion grooves 122 corresponding to the PCB insertion grooves 111 and the wire insertion grooves 113 of the lower mold 110 are formed on the bottom of the upper mold 120, respectively. In the PCB insertion groove 121, the lower mold 110 and the upper mold 120 are in close contact with the upper surface of the LED 11 to prevent the coating liquid from coating the upper surface of the LED 11. 123 is formed to protrude. The upper mold 120 is formed at a position corresponding to the positioning protrusion 114 of the lower mold 110 to form a positioning hole 124 into which the positioning protrusion 114 is inserted. Meanwhile, a molding liquid injection hole 125 for injecting molding liquid from the outside is formed in the center of the upper mold 120. The molding liquid injection hole 125 is formed to correspond to the dispersion groove 112 formed in the lower mold 110.

이하에서는 상술한 바와 같이 구성된 본 발명 엘이디 모듈 어셈블리 제조장치(100)를 이용해 방수층(30)을 형성하는 과정을 살펴보기로 한다.Hereinafter, the process of forming the waterproof layer 30 using the present invention LED module assembly manufacturing apparatus 100 configured as described above will be described.

하부몰드(110)의 PCB 삽입홈(111) 및 전선 삽입홈(113)에 PCB(10) 및 전선(40)(41)을 각각 삽입한 상태에서 상부몰드(110)를 하부몰드(120)와 밀착시키게 된다. 이 때, 하부몰드(120)의 위치설정돌부(114)가 상부몰드(110)의 위치설정홀(124)에 끼워지도록 함으로써, 하부몰드(110)와 상부몰드(120)가 올바른 상태로 밀착된다.The upper mold 110 and the lower mold 120 in a state where the PCB 10 and the wire 40, 41 are inserted into the PCB insertion groove 111 and the wire insertion groove 113 of the lower mold 110, respectively. It comes in close contact. At this time, by positioning the positioning protrusion 114 of the lower mold 120 to the positioning hole 124 of the upper mold 110, the lower mold 110 and the upper mold 120 is in close contact with the correct state. .

상기와 같이 두 몰드(110)(120) 사이에 PCB(10)를 삽입하고 두 몰드(110)(120)를 밀착시킨 후, 상부몰드(120)의 몰딩액 주입홀(125)을 통해 몰딩액을 주입하면, 도 8에서 보는 바와 같이 몰딩액이 분산홈(112)을 통해 두 몰드(110)(112)에 형성된 PCB 삽입홈(111)(121)을 채우게 된다. 이 때, 몰딩액은 LED(11)의 상면을 제외한 나머지 부분을 감싸면서 코팅되어 방수층(30)을 형성하게 된다.
After inserting the PCB 10 between the two molds 110 and 120 as described above and bringing the two molds 110 and 120 into close contact with each other, the molding liquid is injected through the molding liquid injection hole 125 of the upper mold 120. When injected, as shown in FIG. 8, the molding liquid fills the PCB insertion grooves 111 and 121 formed in the two molds 110 and 112 through the dispersion grooves 112. At this time, the molding liquid is coated while covering the remaining portion except the upper surface of the LED 11 to form a waterproof layer 30.

도 9는 본 발명의 바람직한 실시예에 따른 엘이디 모듈의 제조방법을 나타낸 공정도이고, 도 10은 가압기를 이용해 전선체결용 튜브를 압착하는 모습을 나타내는 도면.9 is a process chart showing a manufacturing method of the LED module according to a preferred embodiment of the present invention, Figure 10 is a view showing a state of pressing the tube for wire fastening using a pressurizer.

본 발명의 바람직한 실시예에 따른 엘이디 모듈의 제조방법은, (a) 전선 체결용 튜브(20)를 안착시키는 단계(S10)와, (b) 전선 체결용 튜브(20)에 전선(40)(41)을 인입시키는 단계(S20)와, (c) 전선 체결용 튜브(20)를 압착시키는 단계(S30), 및 (d) 방수층(30)을 형성하는 단계(S40)를 포함한다.Method of manufacturing an LED module according to a preferred embodiment of the present invention, (a) the step of mounting the wire fastening tube 20 (S10), (b) the wire fastening tube 20 to the wire 40 ( 41, the step (S20), the (c) crimping the wire fastening tube 20 (S30), and (d) forming a waterproof layer 30 (S40).

상기 (a) 단계에서는 동으로 제작된 전선 체결용 튜브(20)를 PCB(10)의 상면 전후단부에 각각 안착시키게 된다. 이 과정에서 전선 체결용 튜브(20)는 표면실장방식(SMD방식)에 의해 PCB(10)의 상면에 안착된다. 즉, PCB(10)의 상면에 액체납을 페인팅한 후 액체납이 페인팅된 부분에 전선 체결용 튜브(20)를 안착시킨 후 고온상태인 곳을 통과시키게 되면, 전선 체결용 튜브(20)가 PCB(10)의 상면에 견고히 고정된다.In the step (a), the wire fastening tube 20 made of copper is mounted on the front and rear ends of the upper surface of the PCB 10, respectively. In this process, the wire fastening tube 20 is seated on the upper surface of the PCB 10 by a surface mounting method (SMD method). That is, after the liquid lead is painted on the upper surface of the PCB 10, the wire fastening tube 20 is seated on the portion where the liquid lead is painted, and then passed through a high temperature place. The upper surface of the PCB 10 is firmly fixed.

상기 (b) 단계에서는 전선 체결용 튜브(20)에 단부의 피복이 벗겨진 두 전선의 양단부를 각각 양쪽에서 삽입하게 된다. 이 때, 두 전선의 양단부는 서로 교차되게 삽입되는 것이 바람직하나 전선 체결용 튜브(20) 자체가 전원이 흐르기 때문에 교차되지 않아도 무방하다.In the step (b), both ends of the two wires, each of which is peeled off at the end of the wire fastening tube 20, are respectively inserted. At this time, it is preferable that both ends of the two wires are inserted to cross each other, but the wire fastening tube 20 itself may not cross because power is flowing.

상기 (c) 단계에서는 가압기(50)를 이용해 전선 체결용 튜브(20)의 상단을 압착시켜 두 전선이 전선 체결용 튜브(20)에 견고히 체결되도록 한다. 이 때, 가압기(50)는 펜치(pillers)의 형태로 형성되어 PCB(10)의 저면과 전선 체결용 튜브(20)의 상부를 가압하도록 되어 있다. 가압기(p)의 두 가압단 중 PCB(10)의 저면에 위치되는 가압단은 평면 형태이고 전선 체결용 튜브(20)의 상부를 가압하는 가압단은 요철형태로 형성된다. 그리고, 가압기(p)의 손잡이를 꽉 쥐더라도 두 가압단은 면접되지 않고 이격된다. 따라서, 가압기(p)의 두 가압단으로 PCB(10)와 전선 체결용 튜브(20)를 밀고 가압하면, PCB(10)는 변형되지 않고 전선 체결용 튜브(20)만 가압단의 형태에 맞게 요철 형태로 변형되어 전선 체결용 튜브(20) 내에 삽입된 두 전선(40)(41)을 전선 체결용 튜브(20) 내에 견고히 체결하게 된다.In the step (c) by pressing the upper end of the wire fastening tube 20 using the pressurizer 50 so that the two wires are firmly fastened to the wire fastening tube 20. At this time, the pressurizer 50 is formed in the form of pliers to pressurize the bottom of the PCB 10 and the upper portion of the wire fastening tube 20. Among the two pressing ends of the pressurizer p, the pressing end located on the bottom surface of the PCB 10 is in a planar shape, and the pressing end for pressing the upper part of the wire fastening tube 20 is formed in an uneven shape. In addition, even when the handle of the pressurizer p is gripped, the two pressurization stages are separated from each other without being interviewed. Therefore, when the PCB 10 and the wire fastening tube 20 are pushed and pressed by the two pressure ends of the pressurizer p, the PCB 10 is not deformed and only the wire fastening tube 20 is adapted to the shape of the pressure end. The two wires 40 and 41 inserted into the wire fastening tube 20 to be deformed into the uneven shape are firmly fastened into the wire fastening tube 20.

상기 (d) 단계에서는 두 몰드(110)(120) 사이에 PCB(10)를 삽입하고 두 몰드(110)(120)를 밀착시킨 후, 상부몰드(120)의 몰딩액 주입홀(125)을 통해 몰딩액을 주입하게된다. 몰딩액을 주입하면 몰딩액이 분산홈(112)을 통해 두 몰드(110)(120)에 형성된 PCB 삽입홈(111)(121) 및 전선 삽입홈(113)(122)을 채우게 된다. 이 때, 몰딩액은 LED(11)의 상면을 제외한 나머지 부분을 감싸면서 코팅되어 방수층(30)을 형성하게 된다.
In step (d), the PCB 10 is inserted between the two molds 110 and 120, the two molds 110 and 120 are brought into close contact with each other, and then the molding liquid injection hole 125 of the upper mold 120 is closed. Inject the molding liquid through. When the molding liquid is injected, the molding liquid fills the PCB insertion grooves 111 and 121 and the wire insertion grooves 113 and 122 formed in the two molds 110 and 120 through the dispersion grooves 112. At this time, the molding liquid is coated while covering the remaining portion except the upper surface of the LED 11 to form a waterproof layer 30.

이상에서 설명한 바와 같이, 본 발명에 따른 바람직한 실시예를 기초로 설명하였으나, 본 발명은 특정 실시예에 한정되는 것은 아니며, 해당분야 통상의 지식을 가진 자가 특허청구범위 내에 기재된 범주 내에서 변경할 수 있다.
As described above, the present invention has been described based on the preferred embodiments, but the present invention is not limited to the specific embodiments, and those skilled in the art may change the scope within the scope of the claims. .

1 : 엘이디 모듈 어셈블리 10 : PCB
11 : LED 20 : 전선체결용 튜브
30 : 방수층 40,41 : 전선
100 : 엘이디 모듈 어셈블리 제조장치 110 : 하부몰드
120 : 상부몰드1: LED module assembly 10: PCB
11: LED 20: Tube for wire connection
30: waterproof layer 40, 41: electric wire
100: LED module assembly manufacturing apparatus 110: lower mold
120: upper mold

Claims (12)

LED가 실장된 PCB; 및
상기 PCB에 안착되어 두 전선의 단부가 삽입 체결되는 전도성의 전선 체결용 튜브;를 포함하며,
상기 전선은 상기 전선 체결용 튜브를 압착함에 의해 상기 전선 체결용 튜브에 체결되는 것을 특징으로 하는 엘이디 모듈 어셈블리.PCB mounted with LED; And
And a conductive wire fastening tube seated on the PCB so that the ends of the two wires are inserted and fastened.
LED module assembly, characterized in that the wire is fastened to the wire fastening tube by pressing the wire fastening tube. 제 1 항에 있어서,
상기 전선 체결용 튜브는 상기 PCB의 표면에 표면실장방식(SMD)에 의해 안착되는 것을 특징으로 하는 엘이디 모듈 어셈블리.The method of claim 1,
The wire fastening tube is an LED module assembly, characterized in that seated on the surface of the PCB by a surface mount method (SMD). 제 1 항 또는 제 2 항에 있어서,
상기 PCB를 감싸는 방수층을 더 포함하는 것을 특징으로 하는 엘이디 모듈 어셈블리.The method according to claim 1 or 2,
LED module assembly further comprises a waterproof layer surrounding the PCB. 제 4 항에 있어서,
상기 LED의 상면은 상기 방수층이 형성되지 않고 외부로 노출되는 것을 특징으로 하는 엘이디 모듈 어셈블리.The method of claim 4, wherein
LED module assembly, characterized in that the upper surface of the LED is exposed to the outside without forming the waterproof layer. LED 및 전선체결용 튜브가 실장된 PCB가 상면에 안착되는 하부몰드; 및
상기 하부몰드의 상면에 착탈 가능하게 밀착되며, 상기 하부몰드와의 사이로 방수를 위한 몰딩액이 삽입되는 몰딩액 삽입홀이 형성된 상부몰드를 포함하는 엘이디 모듈 어셈블리의 제조장치.A lower mold in which a PCB on which LEDs and wire fastening tubes are mounted is mounted on an upper surface thereof; And
An apparatus for manufacturing an LED module assembly comprising an upper mold, which is in close contact with an upper surface of the lower mold, and includes a molding liquid insertion hole into which a molding liquid for waterproofing is inserted between the lower mold. 제 5 항에 있어서,
상기 하부몰드의 상면에는 복수 개의 PCB 삽입홈이 나란히 이격 형성되며, 상기 PCB 삽입홈 사이에는 상기 상부몰드를 통해 주입되는 몰딩액을 두 PCB 삽입홈으로 분산시키는 분산홈이 형성되고, 상기 상부몰드의 중심에 상기 몰딩액 삽입홀이 형성된 것을 특징으로 하는 엘이디 모듈 어셈블리의 제조장치.The method of claim 5, wherein
A plurality of PCB insertion grooves are formed side by side on the upper surface of the lower mold, a dispersion groove for dispersing the molding liquid injected through the upper mold to the two PCB insertion groove is formed between the PCB insertion groove, Apparatus for manufacturing an LED module assembly characterized in that the molding liquid insertion hole is formed in the center. 제 6 항에 있어서,
상기 하부몰드의 PCB 삽입홈의 바닥면에는 상기 PCB를 바닥으로부터 이격시키는 이격돌기와, 상기 PCB를 상기 PCB 삽입홈 내에서 유동되지 않고 고정시키기 위한 고정돌기가 돌출 형성된 것을 특징으로 하는 엘이디 모듈 어셈블리의 제조장치.The method according to claim 6,
Manufacture of an LED module assembly on the bottom surface of the PCB insertion groove of the lower mold is formed with a separation protrusion for separating the PCB from the bottom and a fixing protrusion for fixing the PCB without flowing in the PCB insertion groove. Device. 제 5 항 내지 제 7 항 중 어느 한 항에 있어서,
상기 하부몰드의 양측부에는 상기 PCB 삽입홈과 연결되게 형성되어 상기 PCB에 연결되는 전선이 삽입되는 전선 삽입홈이 각각 형성된 것을 특징으로 하는 엘이디 모듈 어셈블리의 제조장치.The method according to any one of claims 5 to 7,
The both sides of the lower mold is formed to be connected to the PCB insertion groove, the apparatus for manufacturing an LED module assembly, characterized in that each of the wire insertion groove is formed is inserted into the wire connected to the PCB. 제 8 항에 있어서,
상기 하부몰드와 상부몰드 밀착시 상기 엘이디의 상면에 밀착되도록 상기 상부몰드의 저면으로부터 돌출 형성되어, 상기 상부몰드를 통해 몰딩액을 주입하여 방수층을 형성할 때, 상기 엘이디의 상면에 몰딩액이 코팅되는 것을 방지하는 코팅방지돌기를 더 포함하는 엘이디 모듈 어셈블리의 제조장치.The method of claim 8,
When the lower mold and the upper mold is in close contact with the upper surface of the LED is formed to protrude from the bottom of the upper mold, when the molding liquid is injected through the upper mold to form a waterproof layer, the molding liquid is coated on the upper surface of the LED Apparatus for manufacturing an LED module assembly further comprising a coating preventing projection to prevent it. (a) 전도성을 갖는 전선 체결용 튜브를 PCB에 안착시키는 단계;
(b) 상기 전선 체결용 튜브에 전선을 인입시키는 단계; 및
(c) 압착기를 이용해 상기 전선 체결용 튜브를 안착하여 전선을 전선 체결용 튜브에 체결하는 단계;를 포함하는 엘이디 모듈 어셈블리의 제조방법.(a) mounting a conductive wire fastening tube on the PCB;
(b) introducing an electric wire into the electric wire fastening tube; And
(c) seating the wire fastening tube using a presser to fasten the wire to the wire fastening tube; manufacturing method of an LED module assembly comprising a. 제 10 항에 있어서,
(d) 하부몰드의 PCB 삽입홈에 전선 체결용 튜브 및 전선이 체결된 PCB를 안착시키고, 하부몰드의 상부에 상부몰드를 밀착시킨 후, 상기 상부몰드를 통해 몰드액을 주입하여 몰드액으로 상기 PCB를 감싸 방수층을 형성하는 단계를 더 포함하는 엘이디 모듈 어셈블리의 제조방법.11. The method of claim 10,
(d) the wire fastening tube and the wired PCB are seated in the lower mold PCB insertion groove, the upper mold is in close contact with the upper mold, and the mold liquid is injected through the upper mold to form the mold liquid. The method of manufacturing an LED module assembly further comprising the step of forming a waterproof layer surrounding the PCB. 제 10 항 또는 제 11 항에 있어서,
상기 전선 체결용 튜브는 상기 PCB에 표면실장방식(SMD방식)으로 안착되는 것을 특징으로 하는 엘이디 모듈 어셈블리의 제조방법.The method of claim 10 or 11,
The wire fastening tube is a method of manufacturing an LED module assembly, characterized in that seated on the PCB surface mount method (SMD method).
KR1020100101002A 2010-10-15 2010-10-15 Led module assembly, manufacturing apparatus and manufacturing method thereof KR20120039340A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210144111A (en) 2020-05-21 2021-11-30 주식회사 인터원 LED module automatic assembly device
KR20230084745A (en) 2021-12-06 2023-06-13 주식회사 인터원 Screw distribution device for LED module inline unmanned automation system
KR20230084746A (en) 2021-12-06 2023-06-13 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system
KR20240039401A (en) 2022-09-19 2024-03-26 나정훈 Double tape cutting and adhering device for LED module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210144111A (en) 2020-05-21 2021-11-30 주식회사 인터원 LED module automatic assembly device
KR20230084745A (en) 2021-12-06 2023-06-13 주식회사 인터원 Screw distribution device for LED module inline unmanned automation system
KR20230084746A (en) 2021-12-06 2023-06-13 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system
KR20240039401A (en) 2022-09-19 2024-03-26 나정훈 Double tape cutting and adhering device for LED module

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