KR20120039287A - Light source and backlight unit having the same - Google Patents

Light source and backlight unit having the same Download PDF

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Publication number
KR20120039287A
KR20120039287A KR1020100100919A KR20100100919A KR20120039287A KR 20120039287 A KR20120039287 A KR 20120039287A KR 1020100100919 A KR1020100100919 A KR 1020100100919A KR 20100100919 A KR20100100919 A KR 20100100919A KR 20120039287 A KR20120039287 A KR 20120039287A
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KR
South Korea
Prior art keywords
light emitting
emitting device
light
lead terminal
source module
Prior art date
Application number
KR1020100100919A
Other languages
Korean (ko)
Inventor
김근영
Original Assignee
삼성엘이디 주식회사
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Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to KR1020100100919A priority Critical patent/KR20120039287A/en
Publication of KR20120039287A publication Critical patent/KR20120039287A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

PURPOSE: An optical source module and a backlight unit including the same are provided to easily use a substrate and a light emitting device package in common by mounting the light emitting device package without considering a polarity direction of a circuit wire included in the substrate. CONSTITUTION: A substrate(100) comprises a circuit wire(110) which is electrically connected to a light emitting device package. An accommodating groove is formed in the front side of a main body. The accommodating groove is opened to outside. The accommodating groove is filled with transparent sealing member(240) in order to protect a light emitting device. A lead terminal(230) is electrically connected to the circuit wire. The lead terminal comprises a first lead terminal(231) and a second lead terminal(232). The first lead terminal and the second lead terminal are electrically separated and are respectively connected to a first electrode and a second electrode.

Description

LIGHT SOURCE AND BACKLIGHT UNIT HAVING THE SAME}

The present invention relates to a light source module and a backlight unit that can be used as a light source for lighting of a display device.

Various kinds of image display apparatuses are currently used, and what constitutes the mainstream of such image display apparatuses is liquid crystal display (LCD).

LCDs are being applied to a variety of devices ranging from thin wall-mounted televisions, notebook computers, desktop computer monitors, navigation devices, PDAs, portable telephones and game machines. The liquid crystal constituting the display element of the liquid crystal display device does not emit light by itself, and merely performs a function of transmitting or blocking light according to an applied electric signal.

Therefore, in order to display information on the liquid crystal panel, a surface light emitting device, a so-called backlight unit (BLU) for illuminating the liquid crystal panel from the rear, must be separately provided in the liquid crystal display device. Such a backlight unit should increase the luminance of light and form an even surface light source to uniformly irradiate the liquid crystal panel, which is very important in terms of product quality.

The light emitting device package used as the light source module of the backlight unit uses a package having a side view type structure in which a side mounted on a substrate and a light emitting surface are vertical. At this time, the light emitting device package is mounted to be connected to the circuit pattern on the substrate in accordance with the polarity of the lead frame of the light emitting device package. In order to use the light emitting device package mounted on the left module substrate for common use of the light source module, Due to the position of the connector on the board and the polarity of the circuit pattern, the light emitting direction of the light emitting device package is reversed and cannot be applied. Therefore, the light emitting device package has to be provided in two types according to the module, and thus a problem arises in that the loss due to manufacturing equipment cost, management, and evaluation cost increases.

One of the object of the present invention is to provide a light source module and a backlight unit having the same that can be mounted regardless of the polarity of the circuit wiring provided on the substrate, and can be shared through the light emitting device package of the structure to obtain a desired light emitting direction It is.

Light source module according to an embodiment of the present invention,

A substrate having circuit wiring; And a light emitting element and a receiving groove accommodating the light emitting element, the main body being disposed on the substrate so that light emitted through the receiving groove faces a direction parallel to the substrate, and a mounting surface facing the substrate. At least one light emitting device package including a lead terminal provided along the wire and electrically connected to the circuit wiring, wherein the lead terminal includes second lead terminals respectively disposed at both ends of the mounting surface, and the second lead. The first lead terminals disposed between the terminals may be provided to have different polarities from each other.

In addition, the second lead terminals are respectively protruded and extended from both short-axis side surfaces of the main body to both end regions of the long-axis side surface as the mounting surface, and the first lead terminals are disposed at the center of the long-axis side surfaces. The first lead terminal and the second lead terminal may be electrically separated from each other and may be connected to the first electrode and the second electrode of the light emitting device.

In addition, the second lead terminal is a first lead protruding from the axial side of the main body, respectively, parallel to the rear surface of the main body, and bent vertically from the end of the first lead is extended toward the front of the main body, One end thereof may include a second lead bent vertically toward the long side of the main body in the longitudinal direction.

In addition, the second lead may be formed to be parallel to the minor axis side and the major axis side of the main body may have an overall 'L' shape.

In addition, the second lead terminal has a recess of a reflective cup structure in a central portion exposed to the receiving groove, and mounts the light emitting device therein, and the first lead terminal is located below the recess. Some exposure may be spaced apart from the lead terminal.

In addition, the first lead terminal has a recess of a reflective cup structure in a central portion exposed to the receiving groove to mount the light emitting device therein, and the second lead terminal is disposed at both sides of the recess. Some exposure may be spaced apart from the lead terminal.

In addition, the recess may be exposed to the rear surface of the main body.

In addition, the light emitting device package may be arranged on the bar-shaped substrate such that each light emitting device exposed through the receiving groove faces the same direction.

In addition, the light emitting device package may be alternately arranged on the bar-shaped substrate such that the direction of each light emitting device exposed through the receiving groove is changed by 180 degrees with the direction of the other light emitting device adjacent to each other. .

In addition, the board may include a connector for receiving power at one end thereof and may be connected to the circuit wiring in correspondence to the polarity of the connector.

On the other hand, the backlight unit according to an embodiment of the present invention,

A main body having a substrate having a circuit wiring, and a light emitting element, and a receiving groove accommodating the light emitting element, the main body being disposed on the substrate so that light emitted through the receiving groove is directed in a direction parallel to the substrate. A light source module including one or more light emitting device packages provided along a mounting surface facing the substrate and including lead terminals electrically connected to the circuit wires; A plurality of light guide plates alternately disposed with the light source module such that light emitted from the light source module is incident; And a chassis accommodating the light source module and the light guide plate, wherein the lead terminal includes second lead terminals disposed at both ends of the mounting surface, and a first lead terminal disposed between the second lead terminals. It may be provided to have a different polarity.

In addition, the light source modules disposed between the light guide plates may emit light in both directions toward each light entering surface of adjacent light guide plates.

The optical sheet may further include an optical sheet disposed on the light source module and the light guide plate to provide light.

According to one embodiment of the present invention, the light emitting device package can be mounted without considering the polarity direction of the circuit wiring provided in the substrate, so that the substrate and the light emitting device package can be shared, and the entire light source module can be shared.

In addition, it is possible to reduce the cost of equipment, manufacturing, management, and evaluation due to the common use of the substrate and the light emitting device package is excellent price competitiveness.

1 is a view schematically showing a light source module according to an embodiment of the present invention.
FIG. 2 is a view schematically illustrating a light emitting device package in the light source module illustrated in FIG. 1.
3 is a plan view schematically illustrating the light emitting device package of FIG. 2.
4 is a view schematically showing another embodiment of the light emitting device package shown in FIG. 2.
5 is a plan view schematically illustrating the light emitting device package of FIG. 4.
6 is a view schematically showing a state in which the light emitting device package is arranged in the same direction in the light source module according to an embodiment of the present invention.
FIG. 7 is a plan view schematically illustrating the light source module illustrated in FIG. 6.
8 is a view schematically illustrating a state in which light emitting device packages are alternately arranged in different directions in a light source module according to an exemplary embodiment of the present invention.
9 is a plan view schematically illustrating the light source module illustrated in FIG. 8.
10 is a view schematically showing a backlight unit according to an embodiment of the present invention.
FIG. 11 is a plan view schematically illustrating the backlight unit of FIG. 10.

Details of an embodiment of a light source module and a backlight unit having the same according to the present invention will be described with reference to the drawings.

However, embodiments of the present invention may be modified in many different forms and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

Therefore, the shape and size of the components shown in the drawings may be exaggerated for more clear description, components having substantially the same configuration and function in the drawings will use the same reference numerals.

A light source module according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.

1 is a view schematically showing a light source module according to an embodiment of the present invention, FIG. 2 is a view schematically showing a light emitting device package in the light source module shown in FIG. 1, and FIG. 3 is a light emitting device package of FIG. 2. 4 is a plan view schematically illustrating another embodiment of the light emitting device package illustrated in FIG. 2, and FIG. 5 is a plan view schematically showing the light emitting device package illustrated in FIG. 4.

6 is a view schematically showing a state in which light emitting device packages are arranged in the same direction in a light source module according to an embodiment of the present invention, and FIG. 7 is a plan view schematically showing the light source module shown in FIG. 6. 8 is a view schematically illustrating a state in which light emitting device packages are alternately arranged to face different directions in a light source module according to an embodiment of the present invention, and FIG. 9 is a schematic view of the light source module shown in FIG. 8. It is a top view showing.

1 to 9, the light source module 10 according to the embodiment of the present invention includes a substrate 100 and a plurality of light emitting device packages 200 mounted on the substrate 100. .

The substrate 100 may include a circuit wiring 110 electrically connected to the light emitting device package 200, and may have a long bar shape. The substrate 100 is a type of printed circuit board (PCB) formed of an organic resin material containing epoxy, triazine, silicon, polyimide, and other organic resin materials, or a ceramic material such as AlN, Al 2 O 3 Or, it may be formed of a metal and a metal compound as a material, for example, may include MCPCB which is a kind of metal PCB.

The board 100 includes a connector 120 for receiving power at one end and is connected to the circuit wiring 110 in correspondence with the polarity of the connector 120.

The light emitting device package 200 includes a light emitting device 210 and an accommodating groove C accommodating the light emitting device 210, wherein light L emitted through the accommodating groove is parallel to the substrate 100. The lead 220 is provided along the mounting surface facing the substrate 100 from the main body 220 disposed on the substrate 100 to face one direction, and is electrically connected to the circuit wiring 110. And terminal 230.

The structure of the light emitting device package 200 will be described in detail with reference to FIGS. 2 to 5.

As shown in the figure, the light emitting device package 200 is made of silicon or ceramic and includes a main body 220 having a rectangular parallelepiped shape. In addition, the front of the main body 220 is formed with a receiving groove (C) opened to the outside to accommodate the light emitting device 210 therein. The receiving groove C may be filled with a transparent sealing member 240 to protect the light emitting device 210, the sealing member 240 to convert the wavelength of the light emitted from the light emitting device 210. It may contain a phosphor. The light emitting device package 200 is mounted vertically on the substrate 100 through a mounting surface that is a side surface of the main body 220 such that the front surface of the receiving groove C is formed at right angles to the substrate 100. . Therefore, the light L emitted from the receiving groove C may be irradiated in a direction parallel to the substrate 100.

The lead terminal 230 provided along the mounting surface from the main body 220 toward the substrate 100 to electrically connect the light emitting device 210 and the circuit wiring 110 may have a side surface of the mounting surface. It is provided in each of the central region and both end regions of the side, and spaced apart at predetermined intervals so as to be electrically separated from each other. In this case, the lead terminals provided in the central region of the side surface have different polarities from those of the lead terminals respectively provided in the both end regions of the side surface.

Specifically, the lead terminal 230 may include a first lead terminal 231 protruding from a central region of the long axis side surface 221, which is a mounting surface of the main body, and both short side surfaces of the main body 220 ( And second lead terminals 232 protruding from each of the second and second ends 222 and bent and extended to both end regions of the long side surface 221. The first lead terminals 231 disposed between the second lead terminals 232 and the second lead terminals 232 are spaced apart from each other at predetermined intervals to be electrically separated from each other, so that the light emitting device 210 may be separated from each other. The first electrode and the second electrode shown are respectively electrically connected. For example, when the first electrode has a positive polarity, the second electrode has a negative polarity, and thus the first lead terminal connected to the first electrode and the second electrode, respectively, 231 and the second lead terminal 232 are connected with different polarities.

The second lead terminal 232 may include a first lead 232a protruding from the axial side surface 222 of the main body 220 in parallel with a rear surface of the main body 220, and the first lead 232a. It is bent vertically from the end of the extending toward the front of the body 220, one end of the second lead 232b is formed to be bent vertically toward the major axis side 221 of the main body 220 . In addition, the second lead 232b is connected to the first lead 232a to form an integrated body, and is formed to be parallel to the short axis side surface 222 and the long axis side surface 221 of the main body 220, It has a L-shaped structure.

Therefore, a side of the main body 220 in which the lead terminal 230 is provided, specifically, the first lead terminal 231 is provided to protrude, and the second lead 232b of the second lead terminal 232 is provided. ) Is mounted so that the long axis side surfaces 221 disposed at both sides of the first lead terminal 231 face the substrate 100 so that the light emitting device package 200 is perpendicular to the substrate 100. It is mounted. In this case, the second lead terminals 232 respectively provided at both end regions of the side surface have the same polarity, and the first lead terminals 231 provided at the center region have different polarities from those of the second lead terminals 232. Has Through the arrangement of the lead terminals 230 having different polarities as described above, the light emitting device according to the desired light emitting direction without considering the position of the connector 120 provided in the substrate 100 and the polarity of the circuit wiring 110 accordingly. The package 200 can be mounted to enable common use.

Meanwhile, the second lead terminal 232 protrudes from the first lead 232a protruding from one side short side direction 222 of the main body 220 to the other side short side direction 222 as shown in FIGS. 2 and 3. The first lead 232a which extends to the other first lead 232a which protrudes from both side surfaces 222 may be provided in a unitary structure in which the first leads 232a are integrally connected to each other. A recess R having a reflective cup structure is provided at the center exposed by (C), and the light emitting device 210 is mounted therein. The first lead terminal 231 is spaced apart from the second lead terminal 232 at a predetermined interval to a lower side of the recess R to be partially exposed through the receiving groove C. have. The recess R is exposed to the outside from the rear surface of the main body 220 so that the heat of the light emitting device 210 is easily discharged to the outside.

4 and 5 are views schematically showing another embodiment of the light emitting device package. As shown in FIGS. 4 and 5, the first lead terminal 231 may be provided to have a structure extending from one side major axis side 221 of the main body 220 to the other side major axis side 221. A recess R having a reflective cup structure is provided at the center exposed by the accommodation groove C, and the light emitting device 210 is mounted therein. The second lead terminal 232 is spaced apart from the first lead terminal 231 at predetermined intervals on both the left and right sides of the recess R, and is partially exposed through the receiving groove C. Can be. Similarly, the recess R is exposed to the outside from the rear surface of the main body 220 so that the heat of the light emitting device 210 is easily discharged to the outside.

The plurality of light emitting device packages 200 are predetermined on the bar-shaped substrate 100 such that each light emitting device 210 exposed through the receiving groove C faces the same direction as shown in FIGS. 6 and 7. Can be arranged at intervals. In this case, regardless of the polarity of the circuit wiring 110 according to the position of the connector 120 of the substrate 100, the light emitting device package may achieve a desired light emitting direction with respect to the left module substrate 100a and the right module substrate 100b. 200) can be mounted. As shown in FIGS. 8 and 9, the plurality of light emitting device packages 200 may have different light emitting devices 210 in which a direction of each light emitting device 210 exposed through the receiving groove C is adjacent to each other. It may be alternately arranged on the bar-shaped substrate 100 so as to be irradiated with light L in both directions is changed by 180 degrees toward the direction. Therefore, in the case of the light source module 10 according to the embodiment of the present invention, the light emitting device according to the desired light emission direction without considering the position of the connector 120 provided on the substrate 100 and the polarity of the circuit wiring 110 accordingly. Since the package 200 may be mounted, the package 200 may be used, and the light emitting direction may be arbitrarily changed.

A backlight unit according to an exemplary embodiment of the present invention will be described with reference to FIGS. 10 and 11.

FIG. 10 is a view schematically illustrating a backlight unit according to an embodiment of the present invention, and FIG. 11 is a plan view schematically illustrating the backlight unit shown in FIG. 10.

10 and 11, a backlight unit according to an embodiment of the present invention includes a light source module 10, a light guide plate 20, a chassis 30, and the light source module 10 and the light guide plate 20. It may further include an optical sheet (not shown) disposed on top to provide light.

The light source module 10 is substantially the same as the light source module 10 shown in FIGS. 1 to 9. Therefore, description thereof is omitted.

The light guide plate 20 has a rectangular parallelepiped plate structure, and the light incident surface 21 on which the light source module 10 is disposed so that light L is incident is provided along the long axis side surface of the light guide plate 20. Do.

The light guide plate 20 may be made of a transparent resin such as PMMA for smooth induction of light incident on the light incident surface 21, and a specific pattern (not shown) may be formed on a lower surface of the light guide plate 20. It may be formed to reflect the light toward the bottom of the light guide plate 20 to the top.

The chassis 30 is a frame member for accommodating and supporting the light guide plate 20 and the light source module 10 therein.

The chassis 30 has a flat bottom surface 31 and a sidewall 32 extending upwardly from an edge of the bottom surface 31 to have a box-type structure in which an upper surface (or front surface) is opened. The chassis 30 is preferably formed of a metal material in consideration of strength and heat radiation efficiency, but is not limited thereto.

In the chassis 30, a plurality of light guide plates 20 are alternately disposed with the light source module 10 so that the light L emitted from the light source module 10 is incident, and a design size and The number of the light source module 10 and the light guide plate 20 arranged according to the light distribution structure may vary.

In the light source module 10 disposed between the chassis 30 and the light guide plate 20, each light emitting device 210 of the plurality of light emitting device packages 200 covers the light incident surface 21 of the light guide plate 20. The light emitting device package 200 may be provided to have a structure arranged on the substrate 100 at predetermined intervals to face the light emitting device package 200. In addition, the light source module 10 disposed between the light guide plate 20 and the light guide plate 20 emits light so that the direction of each light emitting device 210 of the plurality of light emitting device packages 200 is changed by 180 degrees. The device package 200 may be provided in a structure in which the device package 200 is alternately arranged on the substrate 100.

The light source module 10 can reduce the distance between the light guide plates 20, which is advantageous for miniaturization, and solves the disadvantage of lowering the uniformity of brightness between the light guide plates 20. Can be obtained.

10 ........ Light source module 20 ....... Light guide plate
30 ........ Chassis 100 ...... Substrate
110 ....... Circuit wiring 120 ...... Connector
200 ....... Light emitting device package 210 ...... Light emitting device
220 ....... Main unit 230 ...... Lead terminal
240 ....... Sealing member

Claims (13)

A substrate having circuit wiring; And
A light emitting device and a receiving groove accommodating the light emitting device, the main body being disposed on the substrate such that light emitted through the receiving groove faces a direction parallel to the substrate, and a mounting surface facing the substrate from the main body; At least one light emitting device package provided along the lead terminal and electrically connected to the circuit wiring;
Wherein the lead terminal includes a second lead terminal respectively disposed at both ends of the mounting surface and a first lead terminal disposed between the second lead terminals to have different polarities from each other. module.
The method of claim 1,
The second lead terminals respectively protrude from both of the short axis side surfaces of the main body and are bent and extended to both end regions of the long axis side surface, which is the mounting surface, and the first lead terminals are arranged from the central area of the long axis side surface. Protruded and disposed between the second lead terminals,
And the first lead terminal and the second lead terminal are electrically separated from each other, and are connected to the first electrode and the second electrode of the light emitting device, respectively.
The method of claim 2,
The second lead terminal may include a first lead protruding from a axial side surface of the main body horizontally with a rear surface of the main body, and bent vertically from an end portion of the first lead to extend toward the front of the main body. The light source module, characterized in that it comprises a second lead is bent vertically toward the longitudinal side of the main body.
The method of claim 3,
The second lead is formed to be parallel to the axial side and the major axis side of the main body light source module, characterized in that the overall 'L' shape.
The method of claim 2,
The second lead terminal includes a recess having a reflective cup structure at a central portion exposed to the receiving groove, and mounts the light emitting device therein, and the first lead terminal is located below the recess. Light source module, characterized in that spaced apart and partially exposed.
The method of claim 2,
The first lead terminal includes a recess having a reflective cup structure at a central portion exposed to the receiving groove, and mounts the light emitting device therein, and the second lead terminal is disposed at both sides of the recess. Light source module, characterized in that spaced apart and partially exposed.
The method according to claim 5 or 6,
And the recess is exposed to the rear surface of the main body.
The method of claim 1,
And the plurality of light emitting device packages are arranged on the bar-shaped substrate such that each light emitting device exposed through the receiving groove faces the same direction.
The method of claim 1,
The plurality of light emitting device packages are alternately arranged on the bar-shaped substrate such that a direction of each light emitting device exposed through the receiving groove is changed by 180 degrees with a direction of another light emitting device adjacent to each other. Light source module made.
The method of claim 1,
The substrate has a connector for receiving power at one end, the light source module, characterized in that connected to the circuit wiring corresponding to the polarity of the connector.
A main body having a substrate having a circuit wiring, and a light emitting element, and a receiving groove accommodating the light emitting element, the main body being disposed on the substrate so that light emitted through the receiving groove is directed in a direction parallel to the substrate. A light source module including one or more light emitting device packages provided along a mounting surface facing the substrate and including lead terminals electrically connected to the circuit wires;
A plurality of light guide plates alternately disposed with the light source module such that light emitted from the light source module is incident; And
A chassis accommodating the light source module and the light guide plate;
The lead terminal may include a second lead terminal disposed at both ends of the mounting surface, and the first lead terminal disposed between the second lead terminals may have a polarity different from each other. unit.
The method of claim 11,
The light source module disposed between the light guide plates emits light in both directions toward each light entering surface of adjacent light guide plates.
The method of claim 11,
And a optical sheet disposed on the light source module and the light guide plate to provide light.
KR1020100100919A 2010-10-15 2010-10-15 Light source and backlight unit having the same KR20120039287A (en)

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Application Number Priority Date Filing Date Title
KR1020100100919A KR20120039287A (en) 2010-10-15 2010-10-15 Light source and backlight unit having the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853017B2 (en) 2015-06-05 2017-12-26 Lumens Co., Ltd. Light emitting device package and light emitting device package module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853017B2 (en) 2015-06-05 2017-12-26 Lumens Co., Ltd. Light emitting device package and light emitting device package module

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