KR20120038693A - Glass for display eching installation used un-loading device - Google Patents

Glass for display eching installation used un-loading device Download PDF

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Publication number
KR20120038693A
KR20120038693A KR1020100100284A KR20100100284A KR20120038693A KR 20120038693 A KR20120038693 A KR 20120038693A KR 1020100100284 A KR1020100100284 A KR 1020100100284A KR 20100100284 A KR20100100284 A KR 20100100284A KR 20120038693 A KR20120038693 A KR 20120038693A
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KR
South Korea
Prior art keywords
vacuum
glass
plate
display
present
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KR1020100100284A
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Korean (ko)
Inventor
이대천
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이대천
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Publication date
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Priority to KR1020100100284A priority Critical patent/KR20120038693A/en
Publication of KR20120038693A publication Critical patent/KR20120038693A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

PURPOSE: An apparatus for unloading a glass etching device for a display is provided to be applied to an existing etching device, thereby lowering manufacturing costs. CONSTITUTION: A suction plate(10) corresponds to a glass. The suction plate includes a plurality of vacuum holes(11). A vacuum plate(20) is coupled with a lower part of the suction plate. The vacuum plate has a vacuum part connected with the vacuum hole. A vacuum pump(30) is connected onto the vacuum plate by a pipe(31). The vacuum pump keeps a vacuum condition in the vacuum part.

Description

Unloading mechanism of glass etching apparatus for display {Glass for display eching installation used un-loading device}

The present invention relates to an unloading mechanism of an etching apparatus, and more particularly, a display which can be easily applied to an existing etching apparatus to lower a manufacturing cost, increase work speed, and improve productivity while significantly lowering a defective rate due to precise adsorption. The unloading mechanism of the glass etching apparatus for this invention is related.

In general, a display glass is called LCD, and is widely used in various electronic devices such as mobile phones, TVs, computers, and the like. Display glass is divided into TFT process, color filter process, cell process, and module process.Two processes of TFT process, color filter process, and one panel are made through cell process and cell process The panel is processed through a module process to make glass that is actually mounted on a monitor, TV or mobile phone.

For example, the display glass uses a CCFL, LED backlight, especially LED recently attracted attention can be divided into direct (back) and edge (side) depending on the position of the backlight. Various functions such as local dimming to adjust the brightness and color of the light can be implemented freely, resulting in superior image quality compared to the edge method, while the edge method is easy to slim down because the backlight unit is located on the side. There is a disadvantage in that the image quality is lower. In other words, the display glass has been implemented in the edge method slimming, but the most important image quality in the display is a disadvantage, the direct method can realize a good image quality but there is a problem that can not be slimmed.

Therefore, it is possible to solve through the slim etching process to implement a slim while adopting such a direct method. Of course, in the case of organic light emitting diodes (OLEDs), the backlight is unnecessary, so that a sufficient slimming can be realized, but the technology for slimming is an overwhelming task even for such OLEDs. Therefore, the slim etching process is being applied to the display glass.

As is well known, an etching apparatus for performing an etching process includes a loading process 2 for sequentially receiving and accommodating glass 1, a washing process 3 for firstly cleaning the glass 1, and a glass 1 Etching process (4) to etch one side of, cleaning process (5) to clean the etched glass (1), unloading process (6) to discharge the completed glass (1) is performed.

At this time, the display glass 1 is subjected to an etching apparatus to realize slimming. As described above, the glass 1 is formed of a single glass 1 in which a TFT glass and a color filter glass are combined. (1) has the characteristic that TFT glass which is one surface should not be etched. Therefore, in the related art, a process of attaching one surface of the glass 1 with a protective film or applying an acid resistant solution before carrying it into the etching apparatus was performed.

However, through the conventional work, the productivity is significantly lowered, and when the etching film is injected into the etching apparatus, the protective film is peeled off or the applied acid solution is melted, and the etching solution penetrates to one side of the TFT glass, causing a problem.

Accordingly, the present invention is to fundamentally solve the conventional problems as described above, can be easily applied to the existing etching apparatus to lower the manufacturing cost, increase the working speed to increase the productivity and significantly lower the defective rate due to precise adsorption An object of the present invention is to provide an unloading mechanism of a glass etching apparatus for a display.

In order to achieve the above object, the present invention provides an unloading mechanism for an etching apparatus for etching one surface while sequentially transporting a display glass, comprising: an adsorption plate formed to correspond to the glass and having a plurality of vacuum holes; A vacuum plate coupled to a lower portion of the suction plate and having a vacuum portion communicating with the vacuum hole; And a vacuum pump connected to the pipe on the vacuum plate to maintain a vacuum state in the vacuum unit.

At this time, as an embodiment of the present invention, the adsorption plate is characterized by having an O-ring groove in which the O-ring is inserted into both sides of the vacuum hole to increase the adsorption force of the glass.

In addition, as another embodiment of the present invention, the adsorption plate is provided with one or more on top of the vacuum plate is characterized in that a plurality of glass can be etched in a large amount.

In addition, as a variant of the present invention, the vacuum pump is characterized in that to maintain the vacuum evenly in the vacuum by connecting one or more pipes to the lower or side of the vacuum plate.

On the other hand, the terms or words used in the present specification and claims are not to be construed as limiting the ordinary or dictionary meanings, the inventors should use the concept of the term in order to explain the invention in the best way. It should be interpreted as meanings and concepts corresponding to the technical idea of the present invention based on the principle that it can be properly defined. Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all of the technical ideas of the present invention, and various alternatives may be substituted at the time of the present application. It should be understood that there may be equivalents and variations.

As described in the above configuration and operation, the unloading mechanism according to the present invention is easily applied to the existing etching apparatus to lower the manufacturing cost, increase the working speed, and increase productivity, thereby effectively reducing the defect rate due to precise adsorption. To provide.

1 is a schematic view showing an etching apparatus equipped with an unloading mechanism according to the present invention.
Figure 2 is a perspective view of the unloading mechanism according to the present invention.
Figure 3 is an exploded perspective view showing the unloading mechanism in accordance with the present invention.
Figure 4 is a cross-sectional view showing the unloading mechanism according to the present invention.
5 is a state diagram used to etch the glass through the unloading mechanism according to the present invention.
Figure 6 is a block diagram showing an embodiment of the unloading mechanism according to the present invention.
7 is a configuration diagram showing a modification of the unloading mechanism according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing an etching apparatus equipped with an unloading mechanism according to the present invention, FIG. 2 is a perspective view showing an unloading mechanism according to the present invention, and FIG. 3 shows an exploded view of the unloading mechanism according to the present invention. 4 is a cross-sectional view showing the unloading mechanism according to the present invention in a cutaway view, and FIG. 5 is a state diagram of etching the glass through the unloading mechanism according to the present invention.

The present invention relates to an etching apparatus for etching a display glass (1) to one side, and includes a loading step (2), a washing step (3), an etching step (4), a washing step (5), and an unloading step (6). It relates to an unloading mechanism for etching one surface while transferring sequentially.

The adsorption plate 10 according to the present invention is formed to correspond to the glass 1 and includes a plurality of vacuum holes 11. The adsorption plate 10 is made of an iron material or a resin material excellent in corrosion resistance by the etching solution, and is formed in a size corresponding to that of the glass 1. The suction plate 10 has a plurality of perforated vacuum holes 11 at the edges thereof. The vacuum holes 11 are combined with the vacuum plate 20 to be described later to generate a vacuum. Therefore, when the glass 1 is seated on the upper side of the suction plate 10, the glass 1 is adsorbed by the vacuum generated in the vacuum hole 11. Through the adsorption plate 10, the glass 1 is guided to the cleaning step 3, the etching step 4, the washing step 5, and the unloading step 5 sequentially. In particular, the etching step 4 is performed. At the same time to play a role of preventing the etching solution is injected into one surface of the glass (1).

At this time, the adsorption plate 10 according to an embodiment of the present invention includes an O-ring groove 13 in which the O-ring 12 is inserted into both sides of the vacuum hole 11 to increase the adsorption force of the glass 1. As described above, the adsorption plate 10 adsorbs the glass 1 through the vacuum hole 11, and when the glass 1 is adsorbed in such a configuration, the vacuum is canceled through a minute gap, so that the vacuum pump ( There is a problem that needs to be operated continuously. Therefore, the O-ring grooves 13 are provided to the inside and the outside of the vacuum hole 11, respectively, and the soft O-rings 12 are inserted into the O-ring grooves 13.

At this time, the O-ring 12 is inserted to protrude higher than the upper surface of the suction plate (10). When the glass 1 is seated on the upper portion of the suction plate 10, the lower portion of the glass 1 is in close contact with the O-ring 12 of the suction plate 10. Therefore, a space is generated between the inner O-ring 12 and the outer O-ring 12 provided with respect to the vacuum hole 11, and vacuum is generated in such a space to more strongly adsorb the edge of the glass 1, thereby etching. At the time of the step (4), the etchant can be blocked from being introduced into the adsorption surface of the glass (1).

In addition, the vacuum plate 20 according to the present invention is provided with a vacuum unit 21 coupled to the lower portion of the suction plate 10 and in communication with the vacuum hole 11. The vacuum plate 20 is made of an iron or resin material excellent in corrosion resistance by the etching solution and is coupled to the etching apparatus together with other members although not shown in the drawings. The vacuum plate 20 is provided with a vacuum portion 21 which is in communication with all of the upper surface and is coupled to the lower portion of the suction plate (10). At this time, the vacuum unit 21 is formed to correspond to the communication with the vacuum hole 11 provided in the suction plate (10). Therefore, the vacuum unit 21 provided in the vacuum plate 20 is induced to generate a vacuum in the vacuum hole 11 of the suction plate 10.

In addition, the vacuum pump 30 according to the present invention is connected to the pipe 31 on the vacuum plate 20, and maintains a vacuum state in the vacuum unit 21. The vacuum pump 30 is one of reciprocating, rotary, water seal, diffusion, and ejector. Such a vacuum pump 30 is provided in a predetermined space in the etching apparatus or interposed adjacent to the vacuum plate 20, and connected to the pipe 31 on the vacuum plate 20 to vacuum the vacuum part 21. It is responsible for maintaining the state. In addition, although not shown through drawings, it may be possible to apply an orifice method that blows air.

At this time, the pipe 31 is connected to the vacuum plate 20 is connected to the pipe or tube of the choice depending on the environment to be installed or connected by mixing. Although not shown through the drawings, such a pipe 31 may be provided with a vacuum controller for maintaining a constant pressure and a gauge for notifying the pressure to the outside. The vacuum pump 30 can be controlled manually from the operator through a valve or switch, it is possible to automatically control in accordance with the sequence set through the PLC substrate.

Figure 6 is a block diagram showing an embodiment of the unloading mechanism according to the present invention, Figure 7 is a block diagram showing a modification of the unloading mechanism according to the present invention.

As another embodiment of the present invention, the adsorption plate 10 is provided on the upper portion of the vacuum plate 20 to enable the etching of a plurality of glass (1) in a large amount. As shown in FIG. 6, the adsorption plate 10 is provided on the upper portion of the vacuum plate 20. The adsorption plate 10 is provided with a plurality of adsorption plates 10 so that a large amount of the glass 1 is loaded to allow etching. For example, to etch the glass 1 used in a small home appliance such as a mobile phone, a navigation device, an interphone, and the like, as described above, the suction plate 10 should be formed to have a size corresponding to that of the glass 1. Therefore, in order to etch such a glass (1) in large quantities at one time, a plurality of adsorption plates (10) are combined with one vacuum plate (20).

At this time, since the vacuum hole 11 of the suction plate 10 and the vacuum part 21 of the vacuum plate 20 can be communicated with each other, the vacuum part 21 of the vacuum plate 20 is correspondingly formed. Of course, it is also possible to configure the vacuum plate 20 separately for each adsorption plate 10 while having a plurality of adsorption plates 10, but a plurality of adsorption plates 10 in one vacuum plate 20 according to the simplification of equipment and cost It would be desirable to have a). In addition, according to the above described as a small glass (1) as an example, those skilled in the art will be sufficiently applicable to the large glass (1) regardless of the size.

In addition, as a modification of the present invention, the vacuum pump 30 connects one or more pipes 31 to the lower side or the side of the vacuum plate 20 to maintain the vacuum in the vacuum unit 21 evenly. The vacuum pump 30 is connected to the vacuum portion 21 of the vacuum plate 20 through the pipe 31. Since the vacuum portion 21 is all in communication with the edge of the vacuum plate 20, the vacuum plate ( 20) and the connection of the pipe 31 is very important. That is, when the pipe 31 is connected to one side, there is a problem in that the pressure of the vacuum portion 21 of the other side is a deviation occurs. Therefore, as shown in FIG. 7, one or more pipes 31 are connected to the lower portion or the side surface so that the vacuum is evenly maintained on the vacuum portion 21 of the vacuum plate 20.

In the operation by applying the unloading mechanism of the etching apparatus to the etching apparatus using FIGS. 1 to 7, the worker first places the glass 1 on the upper side of the suction plate 10 provided in the loading process 2. Thereafter, the vacuum pump 30 is operated to generate a vacuum in the vacuum part 21 of the vacuum plate 20 to adsorb the glass 1. At this time, the portion of the glass 1 which is not etched is adsorbed on the suction plate 10. ))

Subsequently, when the adsorption is completed in the loading step (2) is transferred to the washing step (3), when the washing is completed, the etching step (4) is sequentially transferred. At this time, even if the etching liquid is injected from the upper portion of the glass 1 during the etching step 4, one surface of the glass 1 adsorbed by the adsorption plate 10 is not etched because the etching liquid is not added. Subsequently, the glass 1 on which the etching is completed is transferred to the unloading process 6 via the washing process 5. When the completed glass 1 is transferred to the unloading process 6, the vacuum pump 30 is stopped to bring the vacuum portion 21 of the vacuum plate 20 to an atmospheric pressure state.

Subsequently, the worker finishes the process by discharging the completed glass 1 and transfers it back to the loading process 2 to repeat the operation. Such an unloading mechanism can be installed regardless of the turntable type or straight reciprocating etching apparatus as shown in FIG. 1, and in addition to the etching apparatus for etching one surface of the glass 1, such as an individual stand-alone type and a test type, although not shown. Various applications are possible.

As such, the unloading mechanism of the present invention can be easily applied to an existing etching apparatus to lower the manufacturing cost, increase the working speed, and improve productivity, thereby significantly lowering the defect rate due to precise adsorption.

It is apparent to those skilled in the art that the present invention is not limited to the described embodiments, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1: glass 2: loading process
3, 5: washing process 4: etching process
6: unloading process 10: adsorption plate
11: vacuum hole 12: O-ring
13: O-Ring Groove 20: Vacuum Plate
21: vacuum unit 30: vacuum pump
31: plumbing

Claims (4)

In the unloading mechanism for an etching apparatus which etches one surface while conveying the display glass 1 sequentially:
A suction plate 10 formed to correspond to the glass 1 and having a plurality of vacuum holes 11;
A vacuum plate 20 coupled to a lower portion of the suction plate 10 and having a vacuum unit 21 communicating with the vacuum hole 11; And
The unloading mechanism of the glass etching apparatus for display, characterized in that it comprises a; vacuum pipe 30 is connected to the pipe 31 on the vacuum plate 20, to maintain a vacuum state in the vacuum portion 21; . The method of claim 1,
The adsorption plate 10 includes an O-ring groove 13 in which the O-rings 12 are inserted at both sides of the vacuum hole 11 to increase the adsorption force of the glass 1. Instrument. The adsorption plate (10) is provided on the upper portion of the vacuum plate 20, the unloading mechanism of the glass etching apparatus for a display, characterized in that a plurality of glass (1) to be etched in large quantities. The method of claim 1,
The vacuum pump 30 is unloading mechanism of the glass etching apparatus for display, characterized in that to maintain the vacuum evenly in the vacuum unit 21 by connecting one or more pipes 31 to the lower or side surface of the vacuum plate 20 .
KR1020100100284A 2010-10-14 2010-10-14 Glass for display eching installation used un-loading device KR20120038693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100100284A KR20120038693A (en) 2010-10-14 2010-10-14 Glass for display eching installation used un-loading device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100100284A KR20120038693A (en) 2010-10-14 2010-10-14 Glass for display eching installation used un-loading device

Publications (1)

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KR20120038693A true KR20120038693A (en) 2012-04-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170042355A (en) * 2014-11-03 2017-04-18 센젠 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 Low-temperature polycrystalline silicon semiconductor thin-film transistor-based goa circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170042355A (en) * 2014-11-03 2017-04-18 센젠 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 Low-temperature polycrystalline silicon semiconductor thin-film transistor-based goa circuit

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