KR20120027032A - 발광 다이오드를 제조하기 위한 방법 - Google Patents
발광 다이오드를 제조하기 위한 방법 Download PDFInfo
- Publication number
- KR20120027032A KR20120027032A KR1020117031014A KR20117031014A KR20120027032A KR 20120027032 A KR20120027032 A KR 20120027032A KR 1020117031014 A KR1020117031014 A KR 1020117031014A KR 20117031014 A KR20117031014 A KR 20117031014A KR 20120027032 A KR20120027032 A KR 20120027032A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- conversion material
- manufacturing
- doped
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 78
- 238000006243 chemical reaction Methods 0.000 claims abstract description 67
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 29
- 238000007751 thermal spraying Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 64
- 230000005855 radiation Effects 0.000 claims description 18
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 18
- 150000002910 rare earth metals Chemical class 0.000 claims description 18
- 239000000975 dye Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- 238000005507 spraying Methods 0.000 claims description 15
- 239000000112 cooling gas Substances 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 claims description 2
- FMMWHPNWAFZXNH-UHFFFAOYSA-N Benz[a]pyrene Chemical compound C1=C2C3=CC=CC=C3C=C(C=C3)C2=C2C3=CC=CC2=C1 FMMWHPNWAFZXNH-UHFFFAOYSA-N 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000001000 anthraquinone dye Substances 0.000 claims description 2
- 239000000987 azo dye Substances 0.000 claims description 2
- GTDCAOYDHVNFCP-UHFFFAOYSA-N chloro(trihydroxy)silane Chemical compound O[Si](O)(O)Cl GTDCAOYDHVNFCP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002223 garnet Substances 0.000 claims description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 2
- 238000007750 plasma spraying Methods 0.000 claims description 2
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000001016 thiazine dye Substances 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- HIGRAKVNKLCVCA-UHFFFAOYSA-N alumine Chemical compound C1=CC=[Al]C=C1 HIGRAKVNKLCVCA-UHFFFAOYSA-N 0.000 description 1
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical compound C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000001018 xanthene dye Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009022682.6 | 2009-05-26 | ||
DE102009022682A DE102009022682A1 (de) | 2009-05-26 | 2009-05-26 | Verfahren zur Herstellung einer Leuchtdiode |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20120027032A true KR20120027032A (ko) | 2012-03-20 |
Family
ID=42312878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117031014A KR20120027032A (ko) | 2009-05-26 | 2010-04-08 | 발광 다이오드를 제조하기 위한 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9806237B2 (zh) |
EP (1) | EP2436046A1 (zh) |
JP (1) | JP2012528473A (zh) |
KR (1) | KR20120027032A (zh) |
CN (1) | CN102439742A (zh) |
DE (1) | DE102009022682A1 (zh) |
WO (1) | WO2010136252A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011122033A1 (de) * | 2011-12-22 | 2013-06-27 | Osram Gmbh | Aufbringen eines Leuchtstoffs auf ein optisches Element |
CN108417481B (zh) * | 2018-03-22 | 2021-02-23 | 京东方科技集团股份有限公司 | 氮化硅介电层的处理方法、薄膜晶体管和显示装置 |
Family Cites Families (38)
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DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
FR2793950A1 (fr) * | 1999-05-21 | 2000-11-24 | Thomson Plasma | Procede de fabrication de composants sur substrats de verre devant etre scelles, tels que des ecrans d'affichage plats du type panneau a plasma |
DE10010638A1 (de) | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
US6410002B2 (en) * | 2000-05-12 | 2002-06-25 | Unilever Home & Personal Care Usa Division Of Conopco, Inc. | Preparation of antiperspirant gels which obviates the use of simple glycols |
US7008559B2 (en) | 2001-06-06 | 2006-03-07 | Nomadics, Inc. | Manganese doped upconversion luminescence nanoparticles |
JP2004107727A (ja) * | 2002-09-18 | 2004-04-08 | Shimane Pref Gov | 蛍光発光皮膜の蛍光色の制御方法 |
US7592192B2 (en) * | 2004-03-05 | 2009-09-22 | Konica Minolta Holdings, Inc. | White light emitting diode (white LED) and method of manufacturing white LED |
JP2006008793A (ja) | 2004-06-24 | 2006-01-12 | Konica Minolta Holdings Inc | 蛍光体皮膜とその製造方法及びそれを用いた放射線画像変換パネル |
DE102004045947A1 (de) * | 2004-06-30 | 2006-01-19 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
DE102005017528A1 (de) * | 2004-08-27 | 2006-03-09 | Osram Opto Semiconductors Gmbh | Leuchtmittel mit vorgegebener Abstrahlcharakteristik und Primäroptikelement für ein Leuchtmittel |
KR100631845B1 (ko) | 2004-09-24 | 2006-10-09 | 삼성전기주식회사 | 에어로졸법을 이용한 형광체막 형성방법 |
DE102004060358A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
US7195944B2 (en) | 2005-01-11 | 2007-03-27 | Semileds Corporation | Systems and methods for producing white-light emitting diodes |
JP2006210588A (ja) * | 2005-01-27 | 2006-08-10 | Konica Minolta Holdings Inc | 白色発光ダイオード及び白色発光ダイオードの製造方法 |
DE102005005359B4 (de) | 2005-02-02 | 2009-05-07 | Siemens Ag | Verfahren zum Kaltgasspritzen |
JP4912598B2 (ja) | 2005-02-15 | 2012-04-11 | 株式会社フジミインコーポレーテッド | 溶射用粉末 |
DE102005020908A1 (de) * | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
JP2006303001A (ja) * | 2005-04-18 | 2006-11-02 | Konica Minolta Opto Inc | 発光ダイオード及びその製造方法 |
JP2006313829A (ja) | 2005-05-09 | 2006-11-16 | Konica Minolta Opto Inc | 白色発光ダイオード及びその製造方法 |
CN102818793A (zh) * | 2005-05-10 | 2012-12-12 | 数据跟踪Dna控股公司 | 使用发光标记物的痕量结合高分辨度地跟踪工业过程材料 |
JP2006324407A (ja) * | 2005-05-18 | 2006-11-30 | Toyoda Gosei Co Ltd | 発光装置 |
US7445340B2 (en) * | 2005-05-19 | 2008-11-04 | 3M Innovative Properties Company | Polarized, LED-based illumination source |
JP2006332502A (ja) * | 2005-05-30 | 2006-12-07 | Konica Minolta Opto Inc | 白色発光ダイオードの製造方法とそれにより造られた白色発光ダイオード |
JP2006339217A (ja) * | 2005-05-31 | 2006-12-14 | Konica Minolta Opto Inc | 発光ダイオード及びその製造方法 |
WO2007005013A1 (en) * | 2005-07-01 | 2007-01-11 | Lamina Lighting, Inc. | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
CN101448914B (zh) * | 2006-05-19 | 2012-10-03 | 三菱化学株式会社 | 含氮合金以及使用该含氮合金的荧光体制造方法 |
JP2008108952A (ja) * | 2006-10-26 | 2008-05-08 | Matsushita Electric Ind Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
DE102007010244A1 (de) | 2007-02-02 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Anordnung und Verfahren zur Erzeugung von Mischlicht |
JP4521013B2 (ja) * | 2007-05-15 | 2010-08-11 | 株式会社日立製作所 | 照明装置および該照明装置を用いた液晶表示装置 |
DE102007037875A1 (de) * | 2007-08-10 | 2009-02-12 | Osram Gesellschaft mit beschränkter Haftung | Strahlungsemittierende Vorrichtung |
DE102007041852A1 (de) * | 2007-09-03 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Hochleistungs- LED Modul |
JP5100301B2 (ja) | 2007-10-16 | 2012-12-19 | 京セラ株式会社 | 発光装置 |
JP5374857B2 (ja) * | 2007-10-23 | 2013-12-25 | 三菱化学株式会社 | 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法 |
US7989236B2 (en) * | 2007-12-27 | 2011-08-02 | Toyoda Gosei Co., Ltd. | Method of making phosphor containing glass plate, method of making light emitting device |
DE102008031786B4 (de) * | 2008-07-04 | 2012-11-08 | Osram Ag | LED-Modul mit einem Kühlkörper |
DE202009000537U1 (de) | 2009-01-14 | 2009-04-02 | Reinhausen Plasma Gmbh | Strahlgenerator zur Erzeugung eines gebündelten Plasmastrahls |
DE102011114641B4 (de) * | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
-
2009
- 2009-05-26 DE DE102009022682A patent/DE102009022682A1/de not_active Withdrawn
-
2010
- 2010-04-08 US US13/265,407 patent/US9806237B2/en not_active Expired - Fee Related
- 2010-04-08 KR KR1020117031014A patent/KR20120027032A/ko not_active Application Discontinuation
- 2010-04-08 EP EP10716511A patent/EP2436046A1/de not_active Withdrawn
- 2010-04-08 CN CN2010800222045A patent/CN102439742A/zh active Pending
- 2010-04-08 JP JP2012512271A patent/JP2012528473A/ja active Pending
- 2010-04-08 WO PCT/EP2010/054663 patent/WO2010136252A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US9806237B2 (en) | 2017-10-31 |
WO2010136252A1 (de) | 2010-12-02 |
JP2012528473A (ja) | 2012-11-12 |
US20120070926A1 (en) | 2012-03-22 |
CN102439742A (zh) | 2012-05-02 |
DE102009022682A1 (de) | 2010-12-02 |
EP2436046A1 (de) | 2012-04-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |